Differential power divider based on three-coil transformer

Abstract

The invention discloses a differential power divider based on a three-coil transformer. According to the differential power divider provided by the specification, a quarter-wavelength transmission line in a traditional single-end Wilkinson power divider is replaced by the three-circle transformer and the lumped capacitor, so that the chip layout size of the differential power divider is compressed to be equivalent to that of an on-chip inductor while the power distribution of differential signals is realized; and good port matching and output port isolation can be obtained. Besides, the three-ring transformer between the input port and the output port has a natural blocking effect, so that no extra blocking capacitor needs to be added when the differential power divider provided by the specification is used, and further loss reduction is realized.

Description

Technical Field

[0001] The present specification relates to the field of integrated circuit technology, and in particular to a differential power divider based on a three-coil transformer. Background Art

[0002] A power divider, also known as a power splitter, is a common electronic device in signal processing, used to divide an input signal into two or more output signals with equal or unequal power. At the same time, it can also combine multiple input signals into one output signal. Power dividers are widely used in various integrated circuit scenarios.

[0003] The Wilkinson power divider is one of the most basic RF devices in the microwave, millimeter wave and terahertz frequency bands. It can achieve in-phase signal power distribution while completing impedance matching of the input and output ports, and provide high isolation between output ports. However, traditional Wilkinson power dividers are usually based on quarter-wavelength transmission lines, so they occupy a large layout area, increase the production cost of the chip, and are not conducive to the implementation of the array system. At the same time, traditional Wilkinson power dividers can only achieve power distribution of single-ended signals. To achieve power distribution of differential signals, the layout area must be doubled based on the single-ended architecture.

[0004] Therefore, how to realize the construction of on-chip differential signal power divider with smaller area and architecture is an urgent problem to be solved. Summary of the invention

[0005] The present specification provides a differential power divider based on a three-coil transformer to at least partially solve the above-mentioned problems existing in the prior art.

[0006] This manual adopts the following technical solutions:

[0007] This specification provides a differential power divider, comprising:

[0008] A three-coil transformer, comprising a primary coil, a secondary coil and a tertiary coil formed by at least one layer of top metal, wherein the primary coil constitutes a differential input port, the secondary coil and the tertiary coil constitute a first differential output port and a second differential output port respectively, the secondary coil and the tertiary coil have the same structure, and the secondary coil and the tertiary coil have the same coupling coefficient with the primary coil;

[0009] A cross-over capacitor, comprising an input cross-over capacitor connected between the differential input ports and an output cross-over capacitor connected between the differential output ports;

[0010] The cross-over resistor comprises an output cross-over resistor connected between the differential output ports.

[0011] Optionally, the jumper capacitor includes a flat plate capacitor and / or an interdigital capacitor formed by a lower layer of metal.

[0012] Optionally, the jumper resistor includes a well resistor and / or a polysilicon resistor made of active region material.

[0013] Optionally, the primary coil has an axisymmetric property, and a center tap of the primary coil is connected to a ground plane through a metal layer and a through hole.

[0014] Optionally, a wiring structure formed by the secondary coil and the tertiary coil is symmetrical about the symmetry axis of the primary coil.

[0015] Optionally, taking the axis of symmetry of the primary coil as the central axis, the wiring structure of the secondary coil on any half of the central axis is the same as the wiring structure of the tertiary coil on the other half of the central axis.

[0016] Optionally, the secondary coil and the tertiary coil are both made of at least two materials, and the materials used to manufacture the secondary coil and the tertiary coil are the same.

[0017] Optionally, the manufacturing material used for one half of the secondary coil is the same as the manufacturing material used for the other half of the tertiary coil.

[0018] Optionally, the inductance values ​​of the primary coil, the secondary coil, and the tertiary coil, the capacitance value of the cross-over capacitor, and the resistance value of the cross-over resistor are determined by the analysis results of odd-even mode analysis of the differential power divider and the preset center operating frequency and port reference impedance.

[0019] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects:

[0020] In the differential power divider provided in the present specification, a three-coil transformer is included, including a primary coil, a secondary coil and a tertiary coil formed by at least one layer of top metal, wherein the primary coil constitutes a differential input port, the secondary coil and the tertiary coil respectively constitute a first differential output port and a second differential output port, the secondary coil and the tertiary coil have the same structure, and the secondary coil and the tertiary coil have the same coupling coefficient with the primary coil; a cross-over capacitor includes an input cross-over capacitor connected between the differential input ports and an output cross-over capacitor connected between the differential output ports; a cross-over resistor includes an output cross-over resistor connected between the differential output ports.

[0021] The differential power divider provided in this specification replaces the quarter-wavelength transmission line in the traditional single-ended Wilkinson power divider with a three-turn transformer and a lumped capacitor, and while realizing the power distribution of the differential signal, the chip layout size of the differential power divider is compressed to be equivalent to an on-chip inductor, and better port matching and output port isolation can be obtained. In addition, since the three-turn transformer between the input and output ports has a natural DC isolation effect, there is no need to add additional DC isolation capacitors when using the differential power divider provided in this specification, thereby achieving further loss reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of this specification and constitute a part of this specification. The illustrative embodiments and descriptions of this specification are used to explain this specification and do not constitute an improper limitation on this specification. In the drawings:

[0023] Figure 1 A schematic diagram of the structure of a differential power divider in this specification;

[0024] Figure 2 A bottom view of an input end and an output end of a differential power divider in this specification;

[0025] Figure 3 This is a schematic diagram of the split structure of a three-coil transformer in this specification;

[0026] Figure 4 is an original circuit diagram of a differential power divider in this specification;

[0027] Figure 5 In this manual, Figure 4 The circuit shown is a simplified circuit diagram;

[0028] Figure 6 In this manual, Figure 5 Schematic diagram of the analysis process of even-mode analysis of the equivalent circuit shown;

[0029] Figure 7 In this manual, Figure 5 Schematic diagram of the analysis process of performing odd-mode analysis on the equivalent circuit shown;

[0030] Figure 8 A schematic diagram of the design structure and parameters of a feasible differential power divider in this specification;

[0031] Fig. 9 A schematic diagram of a substrate and metal layer of a 65nm CMOS process in this specification;

[0032] Fig.10 This manual is a Figure 8Schematic diagram of performance simulation results of the differential power divider shown. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of this specification more clear, the technical solutions of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.

[0035] Figure 1 This is a schematic diagram of a differential power divider in this specification, including:

[0036] A three-coil transformer, comprising a primary coil, a secondary coil and a tertiary coil formed by at least one layer of top metal, wherein the primary coil constitutes a differential input port, the secondary coil and the tertiary coil constitute a first differential output port and a second differential output port respectively, the secondary coil and the tertiary coil have the same structure, and the secondary coil and the tertiary coil have the same coupling coefficient with the primary coil;

[0037] A cross-over capacitor, comprising an input cross-over capacitor connected between the differential input ports and an output cross-over capacitor connected between the differential output ports;

[0038] The cross-over resistor comprises an output cross-over resistor connected between the differential output ports.

[0039] The differential power divider provided in this specification is used to evenly divide a differential signal into two differential signals with the same power. Figure 1 As shown, the differential power divider provided in this specification is designed based on a three-coil transformer, and its main body is a three-coil transformer composed of a primary coil, a secondary coil and a tertiary coil. The three coils are arranged in a folded manner, but do not intersect with each other. Among them, the port of the primary coil is a differential input port, the port of the secondary coil is a first differential output port, and the port of the tertiary coil is a second differential output port. The differential input port is used to receive an input signal, and the two differential output ports are respectively used to output output signals after power distribution. At the same time, in order to ensure that the first differential output port and the second differential output port have the same output, the main structure of the secondary coil and the tertiary coil is the same, and they have the same coupling coefficient with the primary coil.

[0040] The main working principle of the differential power divider in this manual is electromagnetic induction. The primary coil, secondary coil, and tertiary coil in the three-coil transformer can actually be regarded as three inductors, which have an inductive effect on each other. Based on this, when the primary coil is connected to the output signal, the secondary coil and the tertiary coil will generate an induction signal, thereby realizing the power distribution of the input signal.

[0041] Through the above-mentioned three-coil transformer design, the differential power divider provided in this specification realizes the coupling and distribution of signals with only an area of ​​the size of a coil (the size of an inductor), so the layout of this differential power divider is very compact and occupies a very small area. At the same time, since the differential input port and the differential output port are located on opposite sides of the three-coil transformer, there is a natural DC isolation between the differential input port and the differential output port, and there is no need to add additional DC isolation capacitors like traditional power dividers, which can save layout area while further reducing losses.

[0042] In addition to the three-coil transformer as the main body, the differential power divider proposed by the present invention also has a cross-over capacitor connected between each port and a cross-over resistor connected only between the differential output ports. The function of the cross-over capacitor is to improve the matching performance and isolation between the differential input port and the differential output port, and the function of the cross-over resistor is to achieve output isolation between the first differential output port and the second differential output port.

[0043] Figure 2 The bottom view of the input and output ends of a differential power divider provided in this specification. Figure 2 As shown, there are five cross-over capacitors, three of which are respectively connected across the positive and negative poles of the three ports. Specifically, the three cross-over capacitors may be the first cross-over capacitor, the second cross-over capacitor and the third cross-over capacitor. The first cross-over capacitor is connected across the positive and negative poles of the differential input port, the second cross-over capacitor is connected across the positive and negative poles of the first differential output port, and the third cross-over capacitor is connected across the positive and negative poles of the second differential output port. The other two cross-over capacitors are respectively connected between the two positive poles and the two negative poles of the two differential output ports. Specifically, the other two cross-over capacitors may be the fourth cross-over capacitor and the fifth cross-over capacitor, wherein the fourth cross-over capacitor is connected between the positive pole of the first differential output port and the positive pole of the second differential output port, and the fifth cross-over capacitor is connected between the negative pole of the first differential output port and the negative pole of the second differential output port.

[0044] There are two jumper resistors, each of which is connected between the ports of the same polarity of the two differential output ports. Specifically, the two jumper resistors may be a first jumper resistor and a second jumper resistor, the first jumper resistor is connected between the positive electrode of the first differential output port and the positive electrode of the second differential output port, and the second jumper resistor is connected between the negative electrode of the first differential output port and the negative electrode of the second differential output port.

[0045] In the present invention, the first crossover capacitor is represented by C1, the second crossover capacitor is the same as the third crossover capacitor, represented by C2, the fourth crossover capacitor is the same as the fifth crossover capacitor, represented by C3; the first crossover resistor is the same as the second crossover resistor, represented by R iso .

[0046] Furthermore, in the differential power divider provided in this specification, the jumper capacitor can be implemented by, for example, a flat plate capacitor and / or a finger capacitor formed by a lower metal layer, and the jumper resistor can be implemented by, for example, a well resistor and / or a polysilicon resistor made of an active area material.

[0047] Figure 3 This is a schematic diagram of the split structure of a three-coil transformer provided in this manual. Figure 3 As shown, the primary coil itself forms an axisymmetric structure and has an axisymmetric property. At the same time, the center tap on the primary coil, which is arranged at the top end opposite to the differential input port, is connected to the ground plane through the metal layer and the through hole to realize the grounding of the primary coil.

[0048] On the other hand, the routing of the secondary coil itself and the routing of the tertiary coil itself do not have an axisymmetric property, but the routing structure composed of the secondary coil and the tertiary coil has an axisymmetric property, and its symmetry axis is the same as the symmetry axis of the primary coil, that is, it is symmetrical about the symmetry axis of the primary coil.

[0049] Furthermore, if Figure 3 As shown, after the primary coil, the secondary coil, and the tertiary coil are combined into a three-coil transformer, the symmetry axis of the primary coil is used as the central axis, and the entire three-coil transformer can be divided into left and right halves. Among them, the wiring structure of the secondary coil on either half of the central axis is the same as the wiring structure of the tertiary coil on the other half of the central axis. Specifically, the wiring structure of the left half of the secondary coil is the same as the wiring structure of the right half of the tertiary coil, and the wiring structure of the right half of the secondary coil is the same as the wiring structure of the left half of the tertiary coil. Through the above structure, it can be ensured that the secondary coil and the tertiary coil have exactly the same performance.

[0050] Additionally, the secondary coil and the tertiary coil are routed in a cross-routing manner, with one high and one low crossing at the central axis, thereby achieving non-conflicting routing of the three coils while ensuring balance between the secondary coil and the tertiary coil at the central axis.

[0051] In order to ensure that the differential power divider provided in this specification can achieve equal power distribution, while designing the wiring structure of the secondary coil and the tertiary coil to be symmetrical, it is also necessary to further consider the manufacturing materials of the secondary coil and the tertiary coil. Specifically, the secondary coil and the tertiary coil are both made of at least two materials, and the materials used to manufacture the secondary coil and the tertiary coil are the same.

[0052] Furthermore, when designing a three-coil transformer, the primary coil, the secondary coil and the tertiary coil can be respectively arranged on three different top metal layers, thereby increasing the design freedom of the three coils while ensuring that the routing of the three coils does not conflict.

[0053] by Figure 3 Take the three-coil transformer shown as an example, in which the secondary coil and the tertiary coil are both made of TM1 metal and TM3 metal, that is, the manufacturing materials of the secondary coil and the tertiary coil are the same. At the same time, the routing structure formed by the secondary coil and the tertiary coil has the characteristic of symmetry. The left half of the secondary coil and the right half of the tertiary coil are made of the same material, both of which are TM3 metal; the right half of the secondary coil and the left half of the tertiary coil are made of the same material, both of which are TM1 metal layers. In the above manner, the manufacturing materials used for the parts of the secondary coil and the tertiary coil that are symmetrical to each other in the routing structure are also the same, which fully ensures that the secondary coil and the tertiary coil can have the same performance, so that the power can be divided equally when applied.

[0054] However, it should be noted that in the design of the three-coil transformer provided in this specification, as long as the wiring structures of different coils do not intersect with each other, the primary coil can also be made of the same manufacturing materials as the secondary coil and the tertiary coil. For example, assuming that the wiring range of the primary coil is relatively large, surrounding the outside of the secondary coil and the tertiary coil, and there is no intersection between the primary coil and the secondary coil and the tertiary coil, then at this time, the primary coil can also be made of at least part of the materials used to make the secondary coil and the tertiary coil.

[0055] It should be noted that the instructions provided Figure 1 , Figure 2 , Figure 3 The schematic diagram of the structure of the differential power divider shown in the figure is only one of the feasible specific embodiments. In actual design, the differential power divider only needs to meet the structure described in this specification and does not need to be Figure 1 , Figure 2 , Figure 3 The structural diagrams given are exactly the same.

[0056] The above content is a detailed description of the structure of the differential power divider provided in this specification. The following description will introduce the method for determining the parameters of each component in the differential power divider.

[0057] First, in the differential power divider provided in this specification, the parameters that need to be determined include: the self-inductance L1 of the primary coil, the self-inductance L2 of the secondary coil and the tertiary coil, the same coupling coefficient k between the primary coil and the secondary coil and between the primary coil and the tertiary coil m1 , the coupling coefficient k between the secondary coil and the tertiary coil m2 , the first crossover capacitor C1, the second crossover capacitor and the third crossover capacitor C2, the fourth crossover capacitor and the fifth crossover capacitor C3; the first crossover resistor and the second crossover resistor R iso .

[0058] In the process of determining various parameters, the circuit composed of the differential power divider can be simplified first. Figure 4 The original circuit diagram of the differential power divider provided for this specification is as follows Figure 4 As shown, the self-inductance of the primary coil is L1, forming a differential input port, the self-inductance of the secondary coil is L2, forming a first differential output port, and the self-inductance of the tertiary coil is L2, forming a second differential output port. There is a first cross-over capacitor C1 between the positive and negative electrodes of the differential input port, a second cross-over capacitor C2 between the positive and negative electrodes of the first differential output port, and a third cross-over capacitor C2 between the positive and negative electrodes of the second differential output port. There is a fourth cross-over capacitor C3 and a first cross-over resistor R between the positive electrode of the first differential output port and the positive electrode of the second differential output port. iso There is a fifth cross-over capacitor C3 and a second cross-over resistor R between the negative electrode of the first differential output port and the negative electrode of the second differential output port. iso .

[0059] right Figure 4 The original circuit diagram shown is simplified to be equivalent to the inductor L A、 L M、 L B And a T-type network consisting of two ideal transformers with a voltage transformation ratio of 1:N. Figure 5 This manual provides a Figure 4 The circuit shown is a simplified circuit diagram. Figure 5 As shown in the figure, while keeping the other parts of the circuit unchanged, the part for electromagnetic induction between the three coils is replaced by a 1:N transformer. The newly introduced parameter L A、 L B、 L M The conversion relationship with some parameters that need to be determined is as follows:

[0060]

[0061]

[0062] Afterwards, Figure 5 The equivalent circuit shown is subjected to even-odd mode analysis, and the parameters of each component of the differential power divider are determined based on the analysis results. Figure 6 For Figure 5 The schematic diagram of the analysis process of even-mode analysis of the equivalent circuit shown in FIG. Figure 6 As shown in the figure, when the differential input port of the differential power divider is excited by even mode, the three-port network degenerates into a two-port network, and can be further equivalent to a coupled resonant cavity circuit composed of a magnetic coupling transformer and capacitors on both sides. The self-inductance of the inductors on both sides of the magnetic coupling transformer is represented by L AA and L BB , mutual inductance is represented by L MM , then the following formula is satisfied:

[0063] L AA =2L1

[0064] L BB =L2(1+k m2 )

[0065]

[0066] At this time, the capacitance values ​​of the capacitors on both sides of the circuit are C1 / 2 and C2 respectively. By properly designing the parameters of the components of the coupled resonant cavity, the matching from the load impedance 2R to the source impedance 4R can be achieved.

[0067] Figure 7 For Figure 5 The schematic diagram of the analysis process of odd-mode analysis of the equivalent circuit shown in the figure. Figure 7 As shown in the figure, when the differential input port of the differential power divider is subjected to odd-mode excitation, the three-port network degenerates into a single-port network, and can be further equivalent to a network consisting of an inductor 2L. B , capacitor (C2+C3) and resistor R iso The parallel resonant cavity is formed. When the following formula is met:

[0068] R iso =2R

[0069]

[0070] Then the single-port network can be at the center frequency f c The matching is achieved when the reference impedance is 2R.

[0071] When the parameters of each component are realized to complete port matching in the above two excitation modes, the differential power divider can simultaneously realize the matching of each port and the isolation of the output port.

[0072] Based on the above odd-even mode analysis, in the actual design process, after setting the center operating frequency f c After the reference impedance R of the port is obtained, the parameters L can be determined based on the analysis results of the odd-even mode analysis. AA , L BB , L MM , C1, C2, C3 and R iso The value of the differential power divider is determined based on the parameter relationship between the original circuit diagram of the differential power divider and the T-type equivalent circuit diagram, including parameters L1, L2, L3, k m1 and k m2 Finally, all the required parameters can be obtained, including L1, L2, L3, k m1 , k m2 , C1, C2, C3 and R iso The numerical value of is used to complete the final design of the differential power divider.

[0073] It is worth mentioning that in some cases, one or more capacitance values ​​of the cross-connect capacitors C1, C2, and C3 may be calculated to be 0. In this case, when designing the layout of the differential power divider, the capacitor with a capacitance value of 0 can be directly deleted at the corresponding position.

[0074] The differential power divider provided in this specification replaces the quarter-wavelength transmission line in the traditional single-ended Wilkinson power divider with a three-turn transformer and a lumped capacitor, and while realizing the power distribution of the differential signal, the chip layout size of the differential power divider is compressed to be equivalent to an on-chip inductor, and better port matching and output port isolation can be obtained. In addition, since the three-turn transformer between the input and output ports has a natural DC isolation effect, there is no need to add additional DC isolation capacitors when using the differential power divider provided in this specification, thereby achieving further loss reduction.

[0075] Figure 8 The following is a schematic diagram of the design structure and parameters of a feasible differential power divider provided in this specification. Figure 8 As shown, in this specific embodiment, the differential power divider is made based on a 65nm CMOS process, its operating frequency band is 28Ghz, and the layout area is 250×200μm 2 ,version Figure 10 Very compact. Fig. 9 Schematic diagram of the substrate and metal layers of the 65nm CMOS process, including the M1-M9 metal layers, the AP metal layer, and the silicon substrate.

[0076] Fig.10 Provided for this manual Figure 8 The performance simulation results of the differential power divider shown in FIG. include the simulation results of the port reflection coefficient and isolation as well as the simulation results of the amplitude imbalance. Fig.10 As shown, in Figure 8 In the specific embodiment given, at the operating frequency of 28Ghz of the differential power divider, the reflection coefficient of each port is less than -25dB, the port isolation is greater than 25dB, the insertion loss is less than 1.1dB, the amplitude imbalance of the two output ports is less than 0.1dB, and the phase imbalance is less than 0.2°. It can be seen that the differential power divider provided in this specification still retains good performance while achieving a significant reduction in the layout area, and has good feasibility.

[0077] For the improvement of a technology, it can be clearly distinguished whether it is a hardware improvement (for example, improvement of the circuit structure of diodes, transistors, switches, etc.) or a software improvement (improvement of the method flow). However, with the development of technology, many improvements of the method flow today can be regarded as direct improvements of the hardware circuit structure. Designers almost always obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that the improvement of a method flow cannot be implemented with a hardware entity module. For example, a programmable logic device (PLD) (such as a field programmable gate array (FPGA)) is such an integrated circuit whose logical function is determined by the user's programming of the device. Designers can "integrate" a digital system on a PLD by programming themselves, without having to ask chip manufacturers to design and make dedicated integrated circuit chips. Moreover, nowadays, instead of manually making integrated circuit chips, this kind of programming is mostly implemented by "logic compiler" software, which is similar to the software compiler used when developing and writing programs, and the original code before compilation must also be written in a specific programming language, which is called hardware description language (HDL). There is not only one HDL, but many kinds, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones are VHDL (Very-High-Speed ​​Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also know that it is only necessary to program the method flow slightly in the above-mentioned hardware description languages ​​and program it into the integrated circuit, and then it is easy to obtain the hardware circuit that implements the logic method flow.

[0078] The controller can be implemented in any appropriate manner, for example, the controller can take the form of a microprocessor or processor and a computer-readable medium storing a computer-readable program code (such as software or firmware) that can be executed by the (micro)processor, a logic gate, a switch, an application-specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller. Examples of controllers include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320. The memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art also know that in addition to implementing the controller in a purely computer-readable program code manner, the controller can be implemented in the form of a logic gate, a switch, an application-specific integrated circuit, a programmable logic controller, and an embedded microcontroller by logically programming the method steps. Therefore, this controller can be considered as a hardware component, and the devices included therein for implementing various functions can also be regarded as structures within the hardware component. Or even, the devices for implementing various functions can be regarded as both software modules for implementing the method and structures within the hardware component.

[0079] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0080] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0081] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0082] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0083] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0084] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0085] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0086] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0087] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0088] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0089] Those skilled in the art will appreciate that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0090] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0091] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0092] The above description is only an embodiment of this specification and is not intended to limit this specification. For those skilled in the art, this specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification should be included in the scope of the claims of this application.

Claims

1. A differential power divider, characterized in that: include: A three-coil transformer, comprising a primary coil, a secondary coil and a tertiary coil formed by at least one layer of top metal, wherein the primary coil constitutes a differential input port, the secondary coil and the tertiary coil constitute a first differential output port and a second differential output port respectively, the secondary coil and the tertiary coil have the same structure, and the secondary coil and the tertiary coil have the same coupling coefficient with the primary coil; A cross-over capacitor, comprising an input cross-over capacitor connected between the differential input ports and an output cross-over capacitor connected between the differential output ports; The cross-over resistor comprises an output cross-over resistor connected between the differential output ports.

2. The differential power divider according to claim 1, characterized in that: The cross-over capacitor includes a plate capacitor and / or an interdigital capacitor formed by a lower layer of metal.

3. The differential power divider according to claim 1, characterized in that: The jumper resistor includes a well resistor made of active region material and / or a polysilicon resistor.

4. The differential power divider according to claim 1, wherein: The primary coil has an axisymmetric property, and a center tap of the primary coil is connected to a ground plane through a metal layer and a through hole.

5. The differential power divider according to claim 4, characterized in that: The wiring structure formed by the secondary coil and the tertiary coil is symmetrical about the symmetry axis of the primary coil.

6. The differential power divider according to claim 5, characterized in that: Taking the axis of symmetry of the primary coil as the central axis, the wiring structure of the secondary coil on any half of the central axis is the same as the wiring structure of the tertiary coil on the other half of the central axis.

7. The differential power divider according to claim 1, characterized in that: The secondary coil and the tertiary coil are both made of at least two materials, and the materials used to manufacture the secondary coil and the tertiary coil are the same.

8. The differential power divider according to claim 7, characterized in that: The manufacturing material of one half of the secondary coil is the same as the manufacturing material of the other half of the tertiary coil.

9. The differential power divider according to claim 1, characterized in that: The inductance values ​​of the primary coil, the secondary coil, and the tertiary coil, the capacitance value of the cross-over capacitor, and the resistance value of the cross-over resistor are determined by the analysis results of odd-even mode analysis of the differential power divider and the preset center operating frequency and port reference impedance.

Images