Separation method of packaging substrate

Abstract

The invention relates to the technical field of package substrate manufacturing, and discloses a package substrate separation method, which comprises the following steps of: marking on the edge of each side of a functional layer, and forming a pre-cutting line on the surface of the functional layer; based on the pre-cutting line, partial areas of the adhesive layer and the functional layer are cut, and a pre-cutting part is formed on the surface of the substrate; on the basis of the pre-cutting part, cutting the other parts of the adhesive layer and the functional layer until the adhesive layer and the functional layer are completely removed on the surface of the substrate, so that the pre-cutting line is formed on the edge of the surface of the functional layer, partial cutting is performed according to the position of the pre-cutting line, and then the pre-cutting part is formed on the surface of the substrate; according to the separation method of the packaging substrate, the edge milling operation is omitted, dust is prevented from being generated, then the cleaning process is omitted, the whole separation process of the substrate and the functional layer can be conducted on the same production line, and the overall production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging substrate manufacturing, and in particular to a packaging substrate separation method. Background Art

[0002] The packaging substrate (SUB) can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the size of the packaged product, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization. It is a key component to ensure the reliability of chip operation and realize chip miniaturization.

[0003] In the existing manufacturing process of packaging substrates, it is necessary to attach the functional material layer to the carrier board, and then separate the functional material layer from the carrier board after manufacturing the corresponding graphics. At present, the commonly used separation method of the functional material layer and the carrier board is to first use a device to mill the carrier board to remove the edge sealing area, and then use another device to perform the pre-edge and roller separation process. Since the milling operation will generate a lot of dust, it is necessary to add a cleaning operation between the milling and separation processes. However, the three processes of milling, cleaning and separation require different workshop environments, that is, this separation process needs to be carried out in three different workshops. This separation method is prone to fragmentation problems during the processing, resulting in low line yield. At the same time, this separation method requires more equipment, materials need to be circulated back and forth, and it will cause difficulties in line layout, resulting in low overall processing efficiency. Summary of the invention

[0004] The present invention aims to solve the problems in each of the background technologies. To this end, the present invention provides a method for separating a package substrate, which can improve the overall processing efficiency and reduce the production cost.

[0005] According to a first aspect of an embodiment of the present invention, a method for separating a packaging substrate comprises a substrate and an adhesive layer and a functional layer stacked on the substrate, the method comprising: drawing lines on each side edge of the functional layer until a plurality of pre-cut lines are formed on the surface of the functional layer; based on the pre-cut lines, cutting partial areas of the adhesive layer and the functional layer to form a pre-cut portion on the surface of the substrate; based on the pre-cut portion, cutting the remaining portions of the adhesive layer and the functional layer until the adhesive layer and the functional layer are completely removed from the surface of the substrate.

[0006] It can be seen that the present application provides a method for separating a packaging substrate, which first forms a pre-cutting line on the edge of the surface of the functional layer, performs partial cutting according to the position of the pre-cutting line, and then forms a pre-cutting portion on the surface of the substrate, and finally removes the remaining adhesive layer and functional layer along the pre-cutting portion. It can be seen that the method for separating the packaging substrate of the present application eliminates the milling operation, avoids the generation of dust and thus eliminates the cleaning process, so that the entire separation process of the substrate and the functional layer can be carried out on the same production line, thereby improving the overall production efficiency.

[0007] According to another embodiment of the present invention, the step of cutting a portion of the adhesive layer and the functional layer based on the pre-cutting line to form a pre-cutting portion on the surface of the substrate specifically includes:

[0008] In a first direction perpendicular to the surface of the substrate, the adhesive layer and the functional layer are cut sequentially along the plurality of pre-cutting lines until a gap is formed between the adhesive layer and the functional layer at the pre-cutting lines;

[0009] In a second direction parallel to the surface of the substrate, the adhesive layer, the functional layer and the substrate are cut and separated in an area between a side edge of the substrate and the gap closest thereto, until a pre-cut portion is formed on the surface of the substrate.

[0010] According to another embodiment of the present invention, the step of drawing a line on each side edge of the functional layer, before forming a pre-cut line on the surface of the functional layer, further comprises: fixing the substrate by adsorption.

[0011] According to another embodiment of the present invention, before the remaining portion of the adhesive layer and the functional layer are cut based on the pre-cutting portion until the adhesive layer and the functional layer are completely removed from the substrate surface, the method further includes: adsorbing and fixing the functional layer.

[0012] According to another embodiment of the present invention, the number of the pre-cutting lines is 4.

[0013] According to another embodiment of the present invention, the distance between the pre-cutting line and the edge of the functional layer is 1-10 mm.

[0014] According to another embodiment of the present invention, the lengths of two adjacent pre-cutting lines are different, and based on the shortest pre-cutting line, partial areas of the adhesive layer and the functional layer are cut until a pre-cut portion is formed on the surface of the functional layer.

[0015] According to another embodiment of the present invention, the functional layer is a flexible material layer.

[0016] According to another embodiment of the present invention, the substrate is a glass substrate.

[0017] According to another embodiment of the present invention, when forming the pre-cutting line on the surface of the functional layer, a cutting wheel is used for scribing; and / or

[0018] When forming the pre-cut portion on the surface of the substrate, cutting is performed using a scraper; and / or

[0019] When the adhesive layer and the functional layer are completely removed from the surface of the substrate, a scraper is used for cutting.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention discloses a method for separating a packaging substrate, which includes a substrate and an adhesive layer and a functional layer stacked on the substrate. The method for separating the packaging substrate includes: drawing a line on each side edge of the functional layer to form a pre-cutting line on the surface of the functional layer; based on the pre-cutting line, cutting a partial area of ​​the adhesive layer and the functional layer to form a pre-cutting portion on the surface of the substrate; based on the pre-cutting portion, cutting the remaining adhesive layer and the functional layer until the adhesive layer and the functional layer are completely removed from the surface of the substrate. It can be seen that the present application provides a method for separating a packaging substrate, which first forms a pre-cutting line on the edge of the surface of the functional layer, and performs partial cutting according to the position of the pre-cutting line, and then forms a pre-cutting portion on the surface of the substrate, and finally removes the remaining adhesive layer and the functional layer along the pre-cutting portion. Therefore, the method for separating the packaging substrate of the present application does not need to cut off the edge of the substrate, thereby eliminating the milling operation, avoiding the generation of dust and thus eliminating the cleaning process, so that the entire separation process of the substrate and the functional layer can be carried out on the same production line, thereby improving the overall production efficiency.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings:

[0024] Figure 1 A flow chart of an embodiment of a method for separating a package substrate provided in the present application;

[0025] Figure 2 A flowchart of another embodiment of the method for separating a package substrate provided by the present application;

[0026] Figure 3A flow chart of another embodiment of the method for separating a package substrate provided in the present application;

[0027] Figure 4 A flowchart of another embodiment of the method for separating a packaging substrate provided in the present application;

[0028] Figure 5 A schematic diagram of the structure of the packaging substrate during separation provided by the present application;

[0029] Figure 6 for Figure 5 A schematic cross-sectional view of a package substrate;

[0030] Figure 7 Another structural schematic diagram of the separation process of the packaging substrate provided by the present application;

[0031] Figure 8 for Figure 7 A schematic cross-sectional view of a package substrate;

[0032] Fig. 9 Another structural schematic diagram of the separation process of the packaging substrate provided by the present application;

[0033] Fig.10 for Fig. 9 A schematic cross-sectional view of a package substrate;

[0034] The meanings of the marks in the figure are:

[0035] 100, packaging substrate; 110, substrate; 120, adhesive layer; 130, functional layer;

[0036] 131. Pre-cutting line; 132. Pre-cutting portion. DETAILED DESCRIPTION

[0037] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0038] In the description of the present invention, it is to be understood that a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In order to illustrate a method for separating a packaging substrate provided in the present application, a detailed description is given below in conjunction with the accompanying drawings in the specification and the textual description of the embodiments.

[0041] Reference below Figure 1-Figure 10 A method for separating a package substrate according to an embodiment of the present invention is described. Figure 1 As shown, the package substrate 100 includes a substrate 110 and an adhesive layer 120 and a functional layer 130 stacked on the substrate 110. The method for separating the package substrate specifically includes the following steps:

[0042] Step S100: marking each side edge of the functional layer until a plurality of pre-cut lines are formed on the surface of the functional layer;

[0043] Specifically, the functional layer has a functional layer surface and a functional layer bottom surface, wherein the functional layer surface is a side surface of the functional layer away from the substrate, and a plurality of pre-cutting lines are formed on the surface of the functional layer by drawing lines on each side edge of the functional layer surface. It can be understood that the functional layer and the substrate are connected by an adhesive layer provided at their edges, and therefore, a pre-cutting line is formed on each side edge of the functional layer surface, and the position corresponding to the pre-cutting line is the position corresponding to the adhesive layer, that is, the pre-cutting line provides a mark for subsequent cutting.

[0044] Step S200: Cutting a portion of the adhesive layer and the functional layer based on the pre-cutting line to form a pre-cut portion on the surface of the substrate;

[0045] Specifically, based on the pre-cutting line, one side edge of the functional layer can be cut, so that part of the functional layer and the adhesive layer located between the edge and the cutting line are cut, thereby cutting part of the functional layer and the adhesive layer on the side surface of the substrate close to the functional layer to form a pre-cutting portion. The pre-cutting portion provides a better starting cutting reference position for the subsequent cutting process of the remaining functional layers and adhesive layers.

[0046] Step S300: Based on the pre-cutting portion, the remaining adhesive layer and the functional layer are cut until the adhesive layer and the functional layer are completely removed from the surface of the substrate.

[0047] Specifically, the junction of the adhesive layer and the functional layer of the pre-cut part and the remaining uncut part is used as the cutting starting point. Since there is a height difference between the adhesive layer and the functional layer of the pre-cut part and the remaining uncut part, it is equivalent to forming a step on the substrate. Therefore, it is easier to find the starting point of cutting at the junction of the two steps, which is more convenient for the subsequent cutting process and improves the cutting efficiency.

[0048] It can be seen that by first forming a pre-cutting line on the edge of the surface of the functional layer, and performing partial cutting according to the position of the pre-cutting line, and then forming a pre-cutting portion on the surface of the substrate, and finally removing the remaining adhesive layer and functional layer along the pre-cutting portion, the packaging substrate separation method of the present application does not need to cut off the edge of the substrate, but only needs to cut the functional layer and the adhesive layer, thereby eliminating the milling operation, avoiding the generation of dust and then eliminating the cleaning process, so that the entire separation process of the substrate and the functional layer can be carried out on the same production line, thereby improving the overall production efficiency.

[0049] According to one embodiment of the present invention, Figure 2 As shown, step S200: based on the pre-cutting line, a part of the adhesive layer and the functional layer is cut to form a pre-cutting portion on the surface of the substrate, specifically comprising the steps of:

[0050] Step S210: cutting the adhesive layer and the functional layer in sequence along a plurality of pre-cutting lines in a first direction perpendicular to the surface of the substrate until a gap is formed between the adhesive layer and the functional layer at the pre-cutting lines;

[0051] Specifically, since the functional layer and the substrate are connected by an adhesive layer arranged at their edges, a pre-cutting line is formed on each side edge of the surface of the functional layer, and the pre-cutting line is cut along a first direction, so that the connection line between the corresponding adhesives perpendicular to the first direction is cut off, that is, the adhesive layer is cut into two parts, so that the subsequent cutting and separation process can be realized.

[0052] Step S220: in a second direction parallel to the substrate surface, the adhesive layer, the functional layer and the substrate are cut and separated in an area between a side edge of the substrate and the gap closest thereto, until a pre-cut portion is formed on the substrate surface.

[0053] Specifically, by cutting off the adhesive layer and the functional layer on one side, a pre-cut portion is formed on the substrate. The pre-cut portion can provide a starting reference point for subsequent overall cutting, making the cutting process more convenient.

[0054] It can be seen that by cutting the pre-cutting line along the first direction, the connecting line between the corresponding adhesives perpendicular to the first direction is cut off, so that the subsequent cutting and separation process can be realized. At the same time, the pre-cutting part formed by cutting along the second direction can provide a starting reference point for the subsequent overall cutting, which is more convenient for the cutting process.

[0055] According to one embodiment of the present invention, Figure 3 As shown, in step S100: marking a line on each side edge of the functional layer, before forming a pre-cut line on the surface of the functional layer, the steps further include:

[0056] S10: The substrate is adsorbed and fixed.

[0057] Specifically, the substrate is adsorbed on the bottom surface of a side of the substrate away from the functional layer, so that in the subsequent cutting process, the position of the substrate will not be shifted, thereby preventing the normal progress of the cutting process from being affected.

[0058] According to one embodiment of the present invention, Figure 4 As shown, in step S300: based on the pre-cutting portion, the remaining adhesive layer and the functional layer are cut until the adhesive layer and the functional layer are completely removed from the substrate surface, and the steps are also included:

[0059] Step S201: adsorbing and fixing the functional layer.

[0060] Specifically, the functional layer is adsorbed on a surface of the functional layer away from the substrate, so that in the subsequent cutting process, the functional layer will not be shifted in position, thereby preventing the normal progress of the cutting process from being affected.

[0061] According to one embodiment of the present invention, Figure 5 As shown, the number of pre-cutting lines 131 is 4. It can be understood that the conventional packaging substrate 100 is a quadrilateral. Therefore, the number of pre-cutting lines 131 is 4, which is the same as the number of sides of the packaging substrate 100. By providing a pre-cutting line 131 on each side of the substrate 110, the adhesive layer on each side can be cut and separated, so as to facilitate the cutting of the adhesive layer and the functional layer 130 as a whole.

[0062] It should be noted that the pre-cutting line 131 is connected to two adjacent pre-cutting lines 131 to facilitate the cutting of the adhesive layer and the functional layer 130 as a whole.

[0063] It should be noted that, in some other embodiments, the packaging substrate 100 may be other shapes, for example, the packaging substrate 100 is circular or elliptical. In this case, the number of pre-cut lines 131 may be 3 or 4, and the multiple pre-cut lines 131 are connected to each other.

[0064] It should be noted that, in some other embodiments, the packaging substrate 100 can be other shapes, for example, the packaging substrate 100 is a pentagon, a hexagon or an octagon. In this case, the number of pre-cutting lines 131 can be 3 or 4, or the number of pre-cutting lines 131 can be the same as the number of sides of the packaging substrate 100, in which case multiple pre-cutting lines 131 are connected to each other.

[0065] According to one embodiment of the present invention, Figure 5-Figure 8 As shown, the edge distance between the pre-cut line 131 and the functional layer 130 is 1-10 mm. It can be understood that the functional layer 130 and the substrate 110 are connected by arranging an adhesive layer 120 at the edges of the two layers, and the adhesive layer 120 is used to connect the two layers. At the same time, the width of the adhesive layer 120 is generally 1-10 mm. Therefore, the edge distance between the pre-cut line 131 and the functional layer 130 can be determined according to the width of the adhesive layer 120, and the edge distance between the pre-cut line 131 and the functional layer 130 is smaller than the width of the adhesive layer 120. For example, if the width of the adhesive layer 120 is 8 mm, the edge distance between the pre-cut line 131 and the functional layer 130 can be 6 mm, or, The width of the adhesive layer 120 is 6 mm, and the edge distance between the pre-cut line 131 and the functional layer 130 can be 5 mm. Alternatively, the width of the adhesive layer 120 is 5 mm, and the edge distance between the pre-cut line 131 and the functional layer 130 can be 4 mm. Alternatively, the width of the adhesive layer 120 is 4 mm, and the edge distance between the pre-cut line 131 and the functional layer 130 can be 3 mm. Alternatively, the width of the adhesive layer 120 is 3 mm, and the edge distance between the pre-cut line 131 and the functional layer 130 can be 2 mm. Alternatively, the width of the adhesive layer 120 is 2 mm, and the edge distance between the pre-cut line 131 and the functional layer 130 can be 1 mm.

[0066] According to one embodiment of the present invention, Figure 5 and Figure 7 As shown, the lengths of two adjacent pre-cutting lines 131 are different, and based on the shortest pre-cutting line 131, partial areas of the adhesive layer 120 and the functional layer 130 are cut until a pre-cutting portion 132 is formed on the surface of the functional layer 130. It can be understood that the packaging substrate 100 is usually rectangular. At this time, the lengths of two adjacent pre-cutting lines 131 are different. At this time, cutting along the shortest pre-cutting line 131 can facilitate the cutting process.

[0067] It should be noted that in some other embodiments, the lengths of all pre-cutting lines 131 are the same, and in this case, cutting can be performed along any pre-cutting line 131 .

[0068] According to one embodiment of the present invention, the functional layer 130 is a flexible material layer. It can be understood that the functional layer 130 of flexible material is easier to process and manufacture, and is also easier to perform the cutting process. At this time, there is no specific limitation on the material of the functional layer 130, as long as it is a flexible material.

[0069] According to an embodiment of the present invention, the substrate 110 is a glass substrate 110. It is understandable that the glass substrate 110 has a higher hardness, which is more convenient for processing and manufacturing the functional layer 130 and is also more convenient for the cutting process.

[0070] According to an embodiment of the present invention, when a pre-cut line 131 is formed on the surface of the functional layer 130, a cutter wheel is used for cutting and scribing; and / or, when a pre-cut portion 132 is formed on the surface of the substrate 110, a scraper is used for cutting; and / or, when the adhesive layer 120 and the functional layer 130 are completely removed from the surface of the substrate 110, a scraper is used for cutting. It is understandable that corresponding equipment can also be selected for cutting and separation according to actual usage scenarios.

[0071] The above-mentioned method for separating a packaging substrate provided in the present application is a preferred embodiment and should not be construed as limiting the scope of protection of the present application. Those skilled in the art should be aware that various improvements or substitutions may be made without departing from the concept of the present application, and all improvements or substitutions should be within the scope of protection of the present application, that is, the scope of protection of the present application should be based on the claims.

[0072] In the absence of conflict, the above embodiments and features in the embodiments may be combined with each other.

Claims

1. A method for separating a packaging substrate, characterized in that: The packaging substrate comprises a substrate and an adhesive layer and a functional layer stacked on the substrate, and the method comprises: Marking each side edge of the functional layer until a plurality of pre-cut lines are formed on the surface of the functional layer; Based on the pre-cutting line, cutting partial areas of the adhesive layer and the functional layer to form a pre-cutting portion on the surface of the substrate; Based on the pre-cut portion, the remaining portion of the adhesive layer and the functional layer are cut until the adhesive layer and the functional layer are completely removed from the surface of the substrate.

2. The method for separating a package substrate according to claim 1, wherein: The method of cutting a part of the adhesive layer and the functional layer based on the pre-cutting line to form a pre-cutting portion on the surface of the substrate specifically includes: In a first direction perpendicular to the surface of the substrate, the adhesive layer and the functional layer are cut sequentially along the plurality of pre-cutting lines until a gap is formed between the adhesive layer and the functional layer at the pre-cutting lines; In a second direction parallel to the surface of the substrate, the adhesive layer, the functional layer and the substrate are cut and separated in an area between a side edge of the substrate and the gap closest thereto, until a pre-cut portion is formed on the surface of the substrate.

3. The method for separating a package substrate according to claim 1, wherein: The step of drawing a line on each side edge of the functional layer and before forming a pre-cut line on the surface of the functional layer, further comprises: The substrate is adsorbed and fixed.

4. The method for separating a package substrate according to claim 1, wherein: Before the remaining part of the adhesive layer and the functional layer are cut based on the pre-cutting portion until the adhesive layer and the functional layer are completely removed from the substrate surface, the method further includes: The functional layer is adsorbed and fixed.

5. The method for separating a package substrate according to claim 1, wherein: The number of the pre-cut lines is 4.

6. The method for separating a package substrate according to claim 5, wherein: The distance between the pre-cutting line and the edge of the functional layer is 1-10 mm.

7. The method for separating a package substrate according to claim 5, wherein: The lengths of two adjacent pre-cutting lines are different, and based on the shortest pre-cutting line, the adhesive layer and partial areas of the functional layer are cut until a pre-cutting portion is formed on the surface of the functional layer.

8. The method for separating a package substrate according to claim 1, wherein: The functional layer is a flexible material layer.

9. The method for separating a package substrate according to claim 1, wherein: The substrate is a glass substrate.

10. The method for separating a package substrate according to claim 1, wherein: When forming the pre-cutting line on the surface of the functional layer, scribing is performed by cutting with a cutter wheel; and / or When forming the pre-cut portion on the surface of the substrate, cutting is performed using a scraper; and / or When the adhesive layer and the functional layer are completely removed from the surface of the substrate, a scraper is used for cutting.

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