Chip dispensing and curing automatic circulation production line
By designing the chip dispensing and curing automatic flow production line, the preheating zone, high-temperature curing zone and insulation zone of the curing line and the return line, as well as the pressure components and push mechanism, the problem of the automatic rotation of the fixture and the displacement of the upper cover after the chip is cured is solved, and an efficient automatic curing production line is achieved.
Patent Information
- Application Number
- CN202510183376.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2025-05-16
AI Technical Summary
In the prior art, how to automatically rotate the fixture after the chip curing is completed to form a complete automated production line, and at the same time, the small weight upper cover may be displaced, resulting in the problem of poor curing effect.
A chip dispensing curing automatic flow production line is designed, including curing line and reflow line. The curing line consists of a combination of preheating zone, a high-temperature curing zone and an insulating zone. The first pushing mechanism and pressure application assembly are used to lock the chip in the high-temperature curing zone and apply pressure to ensure the curing effect. The return line passes through the residue cleaning area and the fixture preheating area to realize the recycling and preheating of the fixture.
The automatic rotation of the fixture after the chip is cured is achieved, forming a complete automated production line, improving the curing efficiency and effect, and avoiding the poor curing problem caused by the displacement of the upper cover.
Smart Images

Figure CN120015663A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip production, and in particular to an automatic production line for chip dispensing and curing. Background Art
[0002] During chip packaging, the magnetic core and the upper cover generally need to be fixed with glue, and the curing process of the glue directly affects the packaging effect of the chip.
[0003] The Chinese patent with publication number CN119275137A records an LED chip packaging production line and its production process, including a double-track conveyor line, wherein the double-track conveyor line is sequentially provided with a loading device for sequentially transmitting a single substrate to the double-track conveyor line along its conveying direction, a crystal fixing device for dotting silver glue at a specific position of the substrate and mounting the crystal at the dotting position of the substrate, a heating device for reflow heating and curing the solder paste, and a sealing device for protecting the LED chip by filling glue. However, the chip size in the application is relatively large, and multiple chips are arranged along the direction of the double-track conveyor line and sequentially enter the heating device for baking. In the prior art, the chip sizes are different. In order to improve the packaging efficiency of small-sized chips, multiple chips are usually placed on a fixture and then sent into the heating device together for baking. How to automatically rotate the fixture after the chip is cured to form a complete automated production line has become a technical problem that needs to be solved urgently. At the same time, the light-weight upper cover may shift during the baking process, and the pressure exerted by the light-weight upper cover on the glue is very small, resulting in poor curing effect. Summary of the invention
[0004] The technical problem to be solved by the present invention is: in order to solve the problem in the prior art of how to make the jig automatically rotate after the chip curing is completed to form a complete automated production line, and at the same time, the light-weight upper cover may shift, and the light-weight upper cover exerts very little pressure on the glue, which will lead to poor curing effect. Now a chip dispensing and curing automatic flow production line is provided.
[0005] In order to solve the above technical problems, the present invention adopts the following technical solution: a chip dispensing and curing automatic flow production line, the chip includes a magnetic core and an upper cover arranged above it, the production line is used to cure the glue between the magnetic core and the upper cover to fix the two, the production line includes:
[0006] A curing line, comprising a combined preheating zone, a high-temperature curing zone and a heat preservation zone arranged in sequence, wherein the combined preheating zone comprises a chip inlet, a fixture inlet and a first pushing mechanism for pushing the fixture and the chip thereon into the high-temperature curing zone and the heat preservation zone in sequence, wherein the heat preservation zone is provided with a chip outlet, a fixture outlet and a material taking manipulator for sucking the chip to separate the chip from the fixture, and a pressure component is provided on the pushing path of the first pushing mechanism, which is used to lock the chip above the fixture when the chip enters the high-temperature curing zone to continuously apply pressure to the chip on the fixture, and automatically separate from the fixture after entering the heat preservation zone;
[0007] And a reflow line is used to rotate and transport the jig outlet to the jig entrance, and a residual material cleaning area for removing residual chips on the jig and a jig preheating area for preheating the jig are arranged on its conveying path.
[0008] Furthermore, the pressure applying component includes:
[0009] The pressure-applying body comprises a base body covering the chip, a pressure rod slidably arranged in the base body and extending toward the chip to apply pressure to the chip, a first elastic member for applying pressure to the pressure rod, a locking hook hingedly arranged on the base body, and a second elastic member for applying pressure to the locking hook so that the locking hook is hooked with the jig;
[0010] and a transport body, comprising a clamping claw for clamping the base to carry it, and the clamping claw presses the locking hook while clamping so that the locking hook overcomes the force of the second elastic member and separates from the fixture.
[0011] Furthermore, the return line also includes:
[0012] The second pushing mechanism is used to push the jig from the automatic jig outlet into the residual material cleaning area;
[0013] A fixture manipulator, which is used to transport the fixture from the residual material cleaning area to the fixture preheating area;
[0014] The third pushing mechanism is used to push the jig from the autonomous jig preheating zone to the jig entrance;
[0015] And a fourth pushing mechanism, which is used to push the fixtures of the future autonomous tool manipulator to the third pushing mechanism in sequence.
[0016] Furthermore, the residual material cleaning area is provided with a purge assembly for blowing the chips remaining on the fixture away from the fixture and a collection box for receiving the blown-off chips.
[0017] Furthermore, the outer peripheral wall of the fixture is recessed to form a locking groove, one end of the locking hook is a hook portion embedded in the locking groove, and the other end is a clamped portion for clamping by the clamping claw;
[0018] The clamping claw comprises a supporting portion for supporting a base body and a clamping portion for clamping a clamped portion, and the base body has a supporting step for cooperating with the supporting portion.
[0019] Furthermore, a slide groove for sliding the pressure rod is formed in the base, and an elastic force adjustment block is provided at one end of the slide groove away from the chip, and one end of the first elastic member abuts against the pressure rod, and the other end abuts against the elastic force adjustment block.
[0020] Furthermore, there are partitions between the combined preheating zone, the high-temperature curing zone and the heat preservation zone.
[0021] Furthermore, the material picking robot includes a material picking base block and a plurality of suction nozzles slidably arranged in the material picking base block and extending toward the chip direction, each suction nozzle has an upper limit portion protruding from a portion above the material picking base block, and a lower limit portion protruding from a portion below the material picking base block, and a buffer elastic part is provided between the lower limit portion and the material picking base block.
[0022] Furthermore, the upper limit portion is a locking block sleeved on the outside of the nozzle, the bolt is screwed into the locking block and the head abuts against the outer peripheral wall of the nozzle;
[0023] A fixing block is fixed above the material taking base block, and the fixing block is provided with a through groove for the locking block to pass through and fix the locking block circumferentially, and the through groove is a U-shaped groove.
[0024] Furthermore, the fixture includes a carrier for carrying the chip and guide wheels arranged on both sides of the carrier.
[0025] Beneficial effects of the present invention: The present invention utilizes the reflow line to recycle the jig, and sets a residual material cleaning area on the reflow line to remove residual materials and a jig preheating area to perform preliminary heating of the jig, and then heats the jig and the chip thereon to a certain temperature through the combined preheating area and then enters the high-temperature curing area for high-temperature baking to improve the curing efficiency. At the same time, when the jig is about to enter the high-temperature curing area, the pressure component is locked above the jig to apply pressure to the chip between the two, and automatically separates from the jig after leaving the high-temperature curing area, forming a complete automated curing production line. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The present invention is further described below in conjunction with the accompanying drawings and embodiments.
[0027] Figure 1 is a three-dimensional schematic diagram of the present invention from a first viewing angle;
[0028] Figure 2 is a three-dimensional schematic diagram of a second viewing angle of the present invention;
[0029] Figure 3 is a top view of the present invention;
[0030] Figure 4 It is a structural diagram of the material taking manipulator;
[0031] Figure 5 It is a structural schematic diagram of the material taking suction nozzle;
[0032] Figure 6 It is a cross-sectional view of the material taking nozzle;
[0033] Figure 7 It is a three-dimensional schematic diagram of the production line;
[0034] Figure 8 This is a top view of the production line;
[0035] Fig. 9 It is a three-dimensional schematic diagram of the production line to remove the jig;
[0036] Fig.10 This is a top view of the production line removing the jig;
[0037] Fig.11 An overall schematic diagram of the pressure assembly;
[0038] Fig.12 is a partial schematic diagram of the pressure-applying assembly;
[0039] Fig.13 It is the main view of the pressure component;
[0040] Fig.14 is a cross-sectional view of the pressure assembly;
[0041] Fig.15 yes Fig.14 A partial enlarged view of part A;
[0042] Fig.16 It is a structural diagram of the fixture;
[0043] Fig.17 It is a structural diagram of the fixture manipulator;
[0044] In the figure:
[0045] 1. Combined preheating area; 1a. Chip entrance; 1b. Fixture entrance;
[0046] 2. High temperature curing area;
[0047] 3. Insulation area; 3a. Chip outlet; 3b. Fixture outlet;
[0048] 4. The first pushing mechanism;
[0049] 5. Material taking manipulator; 501. Material taking base block; 502. Suction nozzle; 503. Upper limit part; 504. Lower limit part; 505. Buffer elastic part; 506. Fixed block; 5061. Through slot;
[0050] 6. Residue cleaning area;
[0051] 7. Fixture preheating area;
[0052] 8. Pressure-applying body; 801. Base; 8011. Supporting step; 8012. Slide; 8013. Limiting groove; 802. Pressing rod; 803. First elastic member; 804. Lock hook; 8041. Hook; 8042. Clamping part; 805. Second elastic member; 806. Elastic force adjusting block;
[0053] 9. Carrying body; 901. Clamping claw; 9011. Supporting part; 9012. Clamping part; 902. Base; 903. Transverse driving mechanism; 904. Longitudinal driving mechanism; 905. Carrying mechanism;
[0054] 10. Second pushing mechanism;
[0055] 11. Fixture manipulator; 1101. Clamp arm;
[0056] 12. The third pushing mechanism;
[0057] 13. The fourth push mechanism;
[0058] 14. Purge assembly;
[0059] 15. Collection box;
[0060] 16. fixture; 1601. locking groove; 1602. carrier; 1603. guide wheel; 1604. clamping groove; 1605. positioning protrusion; 1606. receiving groove;
[0061] 17. Loading robot;
[0062] 18. Partition;
[0063] 19. Vehicles;
[0064] 20. Pallet. DETAILED DESCRIPTION
[0065] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention, and directions and references (e.g., up, down, left, right, etc.) may only be used to help describe the features in the drawings. Therefore, the following specific embodiments are not to be taken in a limiting sense, and the scope of the subject matter claimed is limited only by the attached claims and their equivalents.
[0066] like Figure 1-Figure 3As shown, a chip dispensing and curing automatic flow production line, the chip includes a magnetic core and an upper cover arranged on the upper cover, the production line is used to cure the glue between the magnetic core and the upper cover to fix the two, the production line is a ring structure, including a curing line and a reflow line;
[0067] The curing line includes a combined preheating zone 1, a high-temperature curing zone 2 and a heat preservation zone 3 which are arranged in sequence. The three are arranged in a straight line and are all equipped with a heating mechanism for heating them. The heating mechanism can be but is not limited to a heating rod, etc. A cover is provided on the high-temperature curing zone 2 to maintain its high-temperature environment.
[0068] The combined preheating zone 1 includes a chip entrance 1a, a fixture entrance 1b and a first pushing mechanism 4 for pushing the fixture 16 and the chip thereon into the high temperature curing zone 2 and the heat preservation zone 3 in sequence. Each fixture 16 is provided with a plurality of receiving grooves 1606 for accommodating the chip to position the chip. The chip corresponds to the receiving groove 1606 one by one. The combined preheating zone 1 is also provided with a visual detection mechanism for detecting whether the fixture 16 thereon is tilted.
[0069] After the jig 16 enters the combined preheating zone 1 from the jig entrance 1b, the loading robot 17 places the chip on the jig 16 through the chip entrance 1a to form an assembly. Multiple assemblies are arranged in a straight line. The first pushing mechanism 4 located at the front end of the combined preheating zone 1 applies pressure to the assembly adjacent to it. Multiple assemblies interact with each other and then enter the high-temperature curing zone 2 and the insulation zone 3 in turn. The temperature of the combined preheating zone 1 is lower than that of the high-temperature curing zone 2. It is used to preliminarily heat the jig 16 and the chip thereon. On the one hand, it can allow the glue to have a certain temperature basis before entering the high-temperature curing zone 2 for curing, thereby improving the curing efficiency. On the other hand, it can avoid the assembly directly entering the high-temperature curing zone 2, which causes the temperature to rise too quickly, thereby affecting the curing effect of the glue and causing damage to the chip.
[0070] The insulation zone 3 is provided with a chip outlet 3a, a fixture outlet 3b and a material taking robot 5 for sucking the chip to separate the chip from the fixture 16; the temperature of the insulation zone 3 is lower than the temperature of the high-temperature curing zone 2, and it is used to keep the fixture 16 and the chip thereon warm, so as to avoid a rapid drop in temperature of the chip after it comes out of the high-temperature curing zone 2.
[0071] A pressure component is provided on the pushing path of the first pushing mechanism 4, which is used to lock the chip above the jig 16 when the chip enters the high-temperature curing zone 2 to continuously apply pressure to the chip between the two, thereby preventing the upper cover from shifting and allowing the high-temperature curing process to proceed under a certain pressure to improve the curing effect. After entering the insulation zone 3, it automatically separates from the jig 16 and rotates back to the entrance of the high-temperature curing zone 2 to apply pressure to the chips on the next round of jigs 16.
[0072] The reflux line is used to rotate and transport the jig 16 from the jig outlet 3b to the jig inlet 1b, and a residual material cleaning area 6 for removing residual chips on the jig 16 and a jig preheating area 7 for preheating the jig 16 are provided on its transport path; during the rotation of the jig 16, the jig preheating area 7 first heats the jig 16, and the heated jig 16 enters the combined preheating area 1 and is further heated together with the chips thereon.
[0073] First, the jig 16 automatically enters the combined preheating zone 1 through the jig entrance 1b, and the loading robot 17 grabs the chip into the receiving slot 1606 of the jig 16. After the current jig 16 is full of chips, the first pushing mechanism 4 pushes the current jig 16 to move in the direction of the high-temperature curing zone 2. The jigs 16 interact with each other and move synchronously. They are preheated synchronously in the process of waiting for loading and in the process of the chip and the jig 16 moving to the high-temperature curing zone 2 after loading. When it is about to enter the high-temperature curing zone 2, the pressure component is pressed on the top of the chip and continues to press it during the entire process of high-temperature curing. After leaving the high-temperature curing zone 2, the pressure component automatically separates from the chip and rotates to the entrance of the high-temperature curing zone 2 to press the chips on the next round of jigs 16. Then the jig 16 and the chips on it move to the end of the insulation zone 3, and the material taking robot 5 takes the chip away from the chip outlet 3a. After the residual material is removed and the initial temperature is raised, the jig 16 enters the combined preheating zone 1 again and repeats the above operations to form a complete automated curing production line, thereby improving the curing efficiency.
[0074] In some examples, such as Figure 11-15 As shown, the pressure applying component includes:
[0075] The pressure-applying body 8 comprises a base 801 covering the chip, a pressure rod 802 slidably arranged in the base 801 and extending toward the chip to apply pressure to the chip, a first elastic member 803 for applying pressure to the pressure rod 802, a locking hook 804 hingedly arranged on the base 801, and a second elastic member 805 for applying pressure to the locking hook 804 so that the locking hook 804 is hooked with the fixture 16, and the fixture 16 protrudes toward the base 801 to form a positioning protrusion 1605, and the positioning protrusion 1605 can be a pin shaft, and a positioning groove for inserting the positioning protrusion 1605 to preliminarily position the two is opened on the base 801;
[0076] There are multiple pressing rods 802 and first elastic members 803, which correspond to multiple chips one by one. Each pressing rod 802 is used to press the corresponding chip so that the glue between the magnetic core and the upper cover is solidified under a certain pressure.
[0077] and a transport body 9, comprising a clamping jaw 901 for clamping a base 801 to transport it, a base 902 for mounting the clamping jaw 901, a transverse driving mechanism 903 for driving the two clamping jaws 901 to move closer to or away from each other, a longitudinal driving mechanism 904 for driving the clamping jaws 901 to move up and down, and a transporting mechanism 905 for driving the base 902 to move closer to or away from the pressure-applying body 8, wherein the clamping jaw 901 applies pressure to the locking hook 804 while clamping so that the locking hook 804 overcomes the force of the second elastic member 805 and is separated from the fixture 16;
[0078] First, the clamping jaw 901 moves the clamped pressure-applying body 8 to the top of the jig 16 at the entrance of the high-temperature curing zone 2. First, the pressure-applying body 8 and the jig 16 are initially positioned by inserting the positioning protrusion 1605 into the positioning groove. Then, the clamping jaw 901 releases the pressure-applying body 8. The second elastic member 805 resets and drives the locking hook 804 to rotate to hook the jig 16, locking the pressure-applying body 8 and the jig 16 to form a combined structure. The pressure rod 802 presses the chip under the elastic force of the first elastic member 803. Then, the combined structure formed by the jig 16 and the pressure-applying body 8 pressed thereon enters the high-temperature curing zone 2 under the push of the first pushing mechanism 4. The glue solidifies to fix the magnetic core and the upper cover. After the curing is completed The combined structure enters the insulation zone 3, and the clamping jaws 901 move to the top of the combined structure. When the clamping jaws 901 clamp the pressure-applying body 8, the clamping jaws 901 push the locking hook 804, so that the locking hook 804 overcomes the resistance of the second elastic member 805 and rotates to separate from the jig 16. At the same time, the clamping jaws 901 transport the clamped pressure-applying body 8 to the entrance of the high-temperature curing zone 2 for the next round of pressure. In this embodiment, when the conveying body 9 conveys the pressure-applying body 8 to the top of the jig 16, the clamping jaws 901 are automatically locked with the jig 16 while being released, and when the conveying body 9 conveys the pressure-applying body 8, the clamping jaws 901 are automatically unlocked with the jig 16 while clamping, thereby realizing automatic locking and unlocking.
[0079] In some examples, such as Figure 7 and Figure 8 As shown, the return line also includes:
[0080] The second pushing mechanism 10 is used to push the jig 16 from the autonomous jig outlet 3b into the residual material cleaning area 6, and its movement path is perpendicular to the pushing path of the first pushing mechanism 4;
[0081] The fixture manipulator 11 is used to transport the fixture 16 from the residual material cleaning area 6 to the fixture preheating area 7, and its movement path is parallel to the pushing path of the first pushing mechanism 4. Fig.17 As shown;
[0082] The third pushing mechanism 12 is used to push the jig 16 from the future jig preheating zone 7 to the jig entrance 1b, and its movement path is perpendicular to the pushing path of the first pushing mechanism 4;
[0083] And the fourth pushing mechanism 13 is located between the fixture robot 11 and the third pushing mechanism 12, and is used to push the fixture 16 of the future autonomous fixture robot 11 to the third pushing mechanism 12 in sequence, and its movement path is parallel to the pushing path of the first pushing mechanism 4.
[0084] In some examples, the residual material cleaning area 7 is provided with a purge assembly 14 for blowing chips remaining on the jig 16 off the jig 16 and a collection box 15 for receiving the blown-off chips. The collection box 15 is located on the blowing path of the purge assembly 14 and the side of the collection box 15 facing away from the purge assembly 14 is raised to form a blocking portion to prevent the chips from being blown out of the collection box 15.
[0085] In some examples, the outer peripheral wall of the jig 16 is recessed to form a locking groove 1601, one end of the locking hook 804 is a hook portion 8041 embedded in the locking groove 1601, and the other end is a clamped portion 8042 for clamping by the clamping claw 901, the hook portion 8041 can be rotated to be embedded in the locking groove 1601 under the elastic force of the second elastic member 805 to achieve the locking of the base 801 and the jig 16, and rotated out of the locking groove 1601 under the action of the clamping claw 901 to achieve the unlocking of the base 801 and the jig 16, and the base 801 is provided with a limiting groove 8013 for accommodating the locking hook 804 and limiting its rotation range;
[0086] The clamping jaw 901 includes a supporting portion 9011 for supporting the base 801 and a clamping portion 9012 for clamping the clamped portion 8042, and the base 801 has a supporting step 8011 for cooperating with the supporting portion 9011, and the clamped portion 8042 of the locking hook 804 extends upward from a limiting groove 8013 to cooperate with the clamping portion 9012. When the clamping jaw 901 is carried, the supporting portion 9011 cooperates with the supporting step 8011 to support the pressure-applying body 8, and at the same time the clamping portion 9012 clamps the pressed portion to allow the locking hook 804 to rotate.
[0087] In some examples, a slide groove 8012 is formed in the base 801 for the pressure rod 802 to slide, and an elastic force adjustment block 806 is provided at one end of the slide groove 8012 away from the chip, the pressure rod 802 protrudes in the direction of the elastic force adjustment block 806 to form a guide portion, the first elastic member 803 is sleeved on the guide portion, and one end of the first elastic member 803 abuts against the pressure rod 802, and the other end abuts against the elastic force adjustment block 806. By adjusting the position of the elastic force adjustment block 806, the compression amount of the first elastic member 803 can be adjusted, thereby adjusting the pressure exerted on the pressure rod 802, and the elastic force adjustment block 806 is knocked into the slide groove 8012 and has an interference fit with the slide groove 8012;
[0088] A pressure block matching the shape of the chip is fixed at the bottom of the pressure rod 802 to avoid chip tilting due to uneven pressure, and the pressure block can abut against the lower surface of the base 801 to limit the pressure rod 802 from retracting into the slide groove 8012. The pressure rod 802 has a radially protruding protrusion for limiting its sliding out of the slide groove 8012. The pressure block cooperates with the protrusion to limit the movement range of the pressure rod 802.
[0089] In some examples, such as Fig. 9 and Fig.10 As shown, the combined preheating zone 1 , the high temperature curing zone 2 and the insulation zone 3 are each provided with a partition 18 between adjacent ones to prevent the high temperature of the high temperature curing zone 2 from being directly transferred to the combined preheating zone 1 and the insulation zone 3 .
[0090] In some examples, such as Figure 4-Figure 6 As shown, the material picking robot 5 includes a material picking base block 501 and a plurality of suction nozzles 502 slidably arranged in the material picking base block 501 and extending toward the chip direction. Each suction nozzle 502 is located above the material picking base block 501 and is protruded to form an upper limit portion 503, and is located below The part protrudes to form a lower limit portion 504, the upper limit portion 503 and the lower limit portion 504 can limit the movement stroke of the suction nozzle 502, and a buffer elastic member 505 is provided between the lower limit portion 504 and the material picking base block 501. The buffer elastic member 505 can provide a buffering effect when the suction nozzle 502 picks up the chip to avoid damage to the chip, and an upper guide member, a lower guide member and a middle gasket located between the outer peripheral wall of the suction nozzle 502 and the inner peripheral wall of the material picking base block 501 are installed. The upper guide member and the lower guide member can be but are not limited to linear bearings or oil-free bushings.
[0091] In some examples, the upper limit portion 503 is a locking block sleeved on the outside of the suction nozzle 502, and the bolt is screwed into the locking block and the head thereof abuts against the outer peripheral wall of the suction nozzle 502, so that the locking block and the suction nozzle 502 can be locked, and the height of the suction nozzle 502 can be adjusted after the bolt is loosened, and the portion where the outer peripheral wall of the suction nozzle 502 abuts against the bolt is a flat structure;
[0092] The fixing block 506 is provided with a through groove 5061 for the locking block to pass through and fix the locking block circumferentially, and the through groove 5061 is a U-shaped groove;
[0093] In order to increase the speed of material collection, multiple suction nozzles 502 are arranged side by side for synchronous suction. At the same time, since the spacing between adjacent chips is small, the spacing between corresponding adjacent suction nozzles 502 is also small, so the installation space of the suction nozzle 502 is limited. In order to improve the installation and replacement efficiency of the suction nozzle 502, the suction nozzle 502 can be locked by a locking block and the height of the suction nozzle 502 can be adjusted. At the same time, the locking block and the through groove 5061 can cooperate to prevent the suction nozzle 502 from rotating.
[0094] In some examples, such as Fig.16 As shown, the jig 16 includes a carrier 1602 for carrying the chip and guide wheels 1603 arranged on both sides of the carrier 1602. The guide wheels 1603 cooperate with the tracks on the production line to convert sliding friction into rolling friction to reduce friction and avoid jamming of the jig 16 during its movement. The jig 16 begins to have a clamping groove 1604 for the clamping arm 1101 of the jig robot 11 to clamp, and the clamping groove 1604 and the locking groove 1601 are staggered with each other.
[0095] Working principle:
[0096] First, the jig 16 enters the combined preheating zone 1 through the entrance 1b, and the loading robot 17 grabs the chip into the receiving slot 1606 of the jig 16. After the current jig 16 is full of chips, the first pushing mechanism 4 pushes the current jig 16 to move toward the high-temperature curing zone 2. The jigs 16 interact with each other and move synchronously. The jigs 16 are preheated while waiting for loading and moving toward the high-temperature curing zone 2 after loading.
[0097] When the clamping jaw 901 moves the clamped pressure-applying body 8 to the top of the jig 16 at the entrance of the high-temperature curing zone 2, the pressure-applying body 8 and the jig 16 are initially positioned by inserting the positioning protrusion 1605 into the positioning groove, and then the clamping jaw 901 releases the pressure-applying body 8, and the second elastic member 805 resets to drive the locking hook 804 to rotate to hook with the jig 16, locking the pressure-applying body 8 and the jig 16 to form a combined structure, and the pressure rod 802 presses the chip under the elastic force of the first elastic member 803, and then the combined structure formed by the jig 16 and the pressure-applying body 8 pressed thereon enters the high-temperature curing zone 2 under the push of the first pushing mechanism 4, and the glue is cured to fix the magnetic core and the upper cover, the curing temperature is 150°C, and the curing time is 20 minutes;
[0098] After the curing is completed, the combined structure enters the heat preservation zone 3, and the clamping jaws 901 move to the top of the combined structure. When the clamping jaws 901 clamp the pressure-applying body 8, the clamping jaws 901 push the locking hook 804, so that the locking hook 804 overcomes the resistance of the second elastic member 805 and rotates to separate from the fixture 16. At the same time, the clamping jaws 901 transport the clamped pressure-applying component body to the entrance of the high-temperature curing zone 2 for the next round of pressure application.
[0099] Then the jig 16 and the chips thereon move to the end of the insulation zone 3, the material taking robot 5 sucks the chips into the carrier 19 on the tray 20, and after the carrier 19 is full, the tray 20 drives it to the next process, and takes away the carrier 19 after reaching the next tool, and the tray 20 refluxes, and at the same time, the second pushing mechanism 10 pushes the jig 16 at the jig outlet 3b into the residual material cleaning zone 6, and the purge component 14 blows the remaining chips on the jig 16 to the collection box 15, and then the jig robot 11 grabs the jig 16 to the jig preheating zone 7 for heating, and finally the third pushing mechanism 12 pushes the jig 16 in the jig preheating zone 7 to the jig inlet 1b to repeat the above operations.
[0100] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.
Claims
1. An automatic production line for chip dispensing and curing, wherein the chip comprises a magnetic core and an upper cover disposed above the magnetic core, and the production line is used to cure the glue between the magnetic core and the upper cover to fix the two, characterized in that: The production line includes: A curing line, comprising a combined preheating zone (1), a high temperature curing zone (2) and a heat preservation zone (3) arranged in sequence, wherein the combined preheating zone (1) comprises a chip inlet (1a), a fixture inlet (1b) and a first pushing mechanism (4) for pushing the fixture (16) and the chip thereon into the high temperature curing zone (2) and the heat preservation zone (3) in sequence, wherein the heat preservation zone (3) is provided with a chip outlet (3a), a fixture outlet (3b) and a material taking manipulator (5) for sucking the chip to separate the chip from the fixture (16), and a pressure component is provided on the pushing path of the first pushing mechanism (4), which is used to lock the chip above the fixture (16) when the chip enters the high temperature curing zone (2) so as to continuously apply pressure to the chip between the two, and automatically separate from the fixture (16) after entering the heat preservation zone (3); and a reflow line for rotating and transporting the jig (16) from the jig outlet (3b) to the jig inlet (1b), and a residual material cleaning area (6) for cleaning residual chips on the jig (16) and a jig preheating area (7) for preheating the jig (16) are provided on the reflow path.
2. According to claim 1, a chip dispensing and curing automatic flow production line is characterized by: The pressure applying component comprises: A pressure-applying body (8), comprising a base (801) covering the chip, a pressure rod (802) slidably disposed in the base (801) and extending toward the chip to apply pressure to the chip, a first elastic member (803) for applying pressure to the pressure rod (802), a locking hook (804) hingedly disposed on the base (801), and a second elastic member (805) for applying pressure to the locking hook (804) so that the locking hook (804) is hooked to the fixture (16); and a transport body (9), comprising a clamping claw (901) for clamping the base (801) to transport it, and the clamping claw (901) applies pressure to the locking hook (804) while clamping so that the locking hook (804) overcomes the force of the second elastic member (805) and is separated from the fixture (16).
3. According to claim 1, a chip dispensing and curing automatic flow production line is characterized by: The return line also includes: A second pushing mechanism (10) is used to push the jig (16) from the autonomous jig outlet (3b) into the residual material cleaning area (6); A jig robot (11) for transporting the jig (16) from the residual material cleaning area (6) to the jig preheating area (7); A third pushing mechanism (12) is used to push the jig (16) from the self-contained jig preheating zone (7) toward the jig entrance (1b); and a fourth pushing mechanism (13), which is used to push the fixture (16) of the autonomous tool manipulator (11) toward the third pushing mechanism (12) in sequence.
4. According to claim 1, a chip dispensing and curing automatic flow production line is characterized by: The residual material cleaning area (6) is provided with a purge assembly (14) for blowing the chips remaining on the jig (16) off the jig (16) and a collection box (15) for receiving the blown-off chips.
5. According to claim 2, a chip dispensing and curing automatic flow production line is characterized by: The outer wall of the jig (16) is recessed to form a locking groove (1601); one end of the locking hook (804) is a hook portion (8041) embedded in the locking groove (1601), and the other end is a clamped portion (8042) for being clamped by the clamping claw (901); The clamping jaw (901) comprises a supporting portion (9011) for supporting the base (801) and a clamping portion (9012) for clamping the clamped portion (8042), and the base (801) has a supporting step (8011) for cooperating with the supporting portion (9011).
6. The chip dispensing and curing automatic flow production line according to claim 2 is characterized by: A slide groove (8012) for the pressure rod (802) to slide is formed in the base (801), and an elastic force adjustment block (806) is provided at one end of the slide groove (8012) away from the chip, and one end of the first elastic member (803) abuts against the pressure rod (802) and the other end abuts against the elastic force adjustment block (806).
7. The chip dispensing and curing automatic flow production line according to claim 1 is characterized by: The combined preheating zone (1), the high temperature curing zone (2) and the heat preservation zone (3) are each provided with a partition (18) between adjacent ones.
8. The chip dispensing and curing automatic flow production line according to claim 1 is characterized by: The material picking robot (5) comprises a material picking base block (501) and a plurality of suction nozzles (502) slidably arranged in the material picking base block (501) and extending toward the chip direction, wherein each suction nozzle (502) is provided with an upper limit portion (503) protruding from a portion above the material picking base block (501) and a lower limit portion (504) protruding from a portion below the material picking base block (501), and a buffer elastic member (505) is provided between the lower limit portion (504) and the material picking base block (501).
9. The chip dispensing and curing automatic flow production line according to claim 8, characterized in that: The upper limit portion (503) is a locking block sleeved on the outside of the suction nozzle (502), the bolt is screwed into the locking block and the head thereof abuts against the outer peripheral wall of the suction nozzle (502); A fixing block (506) is fixed above the material taking base block (501), and the fixing block (506) is provided with a through groove (5061) for the locking block to pass through and fix the locking block circumferentially, and the through groove (5061) is a U-shaped groove.
10. The chip dispensing and curing automatic flow production line according to claim 1, characterized in that: The fixture (16) comprises a carrier (1602) for carrying a chip and guide wheels (1603) arranged on both sides of the carrier (1602).
Citation Information
Patent Citations
LED chip packaging production line and production process thereof
CN119275137A