An adaptable and adjustable preheating plate for semiconductor packaging

Abstract

The present invention provides an adaptable and adjustable preheating plate for semiconductor packaging, which relates to the field of semiconductor packaging and includes: a preheating plate body, a main body mounting hole, a feeding groove, a positioning block, a protective plug, an adjusting slider, an installation protection mechanism, and a packaging adjustment mechanism; the main body mounting hole is provided on the preheating plate body; the feeding groove is provided on the outer end face of the preheating plate body; the positioning block is fixedly connected to the upper end face of the preheating plate body; the protective plug is located on the upper end face of the preheating plate body; the adjusting slider is slidably connected to the inside of the preheating plate body; the installation protection mechanism is provided on the preheating plate body; and the packaging adjustment mechanism is provided inside the preheating plate body. By installing the protective mechanism, the preheating area of ​​the frame is increased, and by using the packaging adjustment mechanism, the width of the feeding groove is accurately adjusted. This solves the problem that the frame is easily unable to be positioned or the frame is warped during arrangement, and the staff needs to make manual adjustments, which is cumbersome to operate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to an adaptable and adjustable preheating plate for semiconductor packaging. Background Art

[0002] During semiconductor production, semiconductors need to be plastic-sealed. An automatic sheet arranging machine is required for plastic sealing. The automatic sheet arranging machine is equipped with a preheating plate, which is installed on the loading rack of the automatic sheet arranging machine. The preheating plate preheats the product frame, and the loading arm structure drives the product frame to move and arrange the product frame into the preheating plate.

[0003] According to CN202410042640.2, the present invention belongs to the technical field of automatic packaging equipment, and provides a semiconductor lead frame mobile preheating mechanism and preheating method, wherein the device includes a frame assembly, a lifting cylinder, a preheating assembly, a pressure plate assembly, a manipulator assembly and a lifting plate. The present invention adopts a frame assembly, and integrates structures such as a preheating assembly, a manipulator assembly and a pressure plate assembly through a bottom plate, a side plate and a movable plate, so that the lead frame can be completed in the frame assembly during the preheating process, reducing the stroke of the manipulator assembly and avoiding heat loss; the movable plate of the present invention can be movable relative to the side plate, and when grabbing a workpiece, the movable plate can drive the manipulator assembly to move above the lead frame, and then grab the lead frame, and the entire grabbing process cycle is short, thereby improving work efficiency; the pressure plate assembly and the preheating assembly of the present invention are both provided with a heat insulation plate, which can reduce unnecessary heat exchange and further improve the heat preservation effect of the lead frame.

[0004] However, the preheating plate is generally provided with a side fixed groove structure. When the loading arm drives the product frame to arrange the slices, the loading arm will move to the inside of the side fixed groove to accurately place the product frame inside the preheating plate. Since the width of the side fixed groove is too wide, it will easily cause the loading rack to swing back and forth, and the frame may not be able to be positioned or warped when arranging the slices. Manual adjustments are required by the staff, which makes the operation cumbersome, affects work efficiency, and has a high risk of product collapse. Summary of the Invention

[0005] In view of this, the present invention provides an adaptable and adjustable preheating plate for semiconductor packaging, which has the function of adjusting the width of the loading groove, thereby adjusting the width of the loading arm entry hole, and accurately adjusting the width of the loading groove to ensure that the loading rack does not shake when placed in, and the position is fixed unchanged, thereby ensuring that the slices are accurately positioned.

[0006] The present invention provides a purpose and function of an adaptable preheating plate for adjustable semiconductor packaging, which specifically includes: a preheating plate main body, a main body mounting hole, a loading groove, a positioning block, a protective plug, an adjusting slider, an installation protection mechanism and a packaging adjustment mechanism; the main body mounting holes are provided with four groups, and the four groups of main body mounting holes are respectively opened at the four corners of the preheating plate main body; the loading grooves are provided with four groups, and the four groups of loading grooves are respectively opened on the left and right sides of the front and rear end surfaces of the preheating plate main body; the positioning blocks are provided with multiple groups, and the multiple groups of positioning blocks are respectively fixedly connected to the front and rear sides of the upper end surface of the preheating plate main body; the protective plugs are provided with two groups, and the two groups of protective plugs are respectively located on the left and right sides of the upper end surface of the preheating plate main body; the adjusting sliders are provided with multiple groups, and the multiple groups of adjusting sliders are respectively slidably connected to the inside of the outer end surface of the preheating plate main body, wherein every two groups of adjusting sliders slide on the left and right sides of the inside of the loading groove; the installation protection mechanism is provided on the preheating plate main body; the packaging adjustment mechanism is provided with two groups, and the two groups of packaging adjustment mechanisms are respectively provided on the front and rear sides of the inside of the preheating plate main body.

[0007] Furthermore, the installation protection mechanism includes: side grooves, limiting grooves and blocking grooves; the side grooves are provided in multiple groups, and the multiple groups of side grooves are respectively opened on the left and right end surfaces of the preheating plate body; the limiting grooves are provided in multiple groups, and the multiple groups of limiting grooves are respectively opened on the left and right sides of the front and rear end surfaces of the preheating plate body, and the multiple groups of limiting grooves are respectively located on the outside of the four groups of feeding grooves; the blocking grooves are provided in two groups, and the two groups and four groups of feeding grooves are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate body.

[0008] Furthermore, the installation protection mechanism also includes: photosensitive detection holes; there are two groups of photosensitive detection holes, and the two groups of photosensitive detection holes are respectively opened on the front and back sides of the middle position of the upper end surface of the preheating plate body, and the two groups of photosensitive detection holes are respectively opened in the middle position of multiple groups of positioning blocks, and the two groups of photosensitive detection holes are rectangular structures.

[0009] Furthermore, the installation protection mechanism also includes: installation grooves and protection platform edges; there are two groups of installation grooves, which are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate main body, and the two groups of protection plugs are respectively plugged into the two groups of installation grooves; there are two groups of protection platform edges, which are respectively opened on the upper end surfaces of the two groups of installation grooves, the upper sides of the two groups of protection plugs are located inside the two groups of protection platform edges, and the outer sides of the upper end surfaces of the two groups of protection plugs are fixedly connected to the inner and outer sides of the two groups of protection platform edges.

[0010] Furthermore, the installation protection mechanism also includes: installation screw holes and installation bolts; there are two groups of installation screw holes, which are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate body, and the two groups of installation screw holes are respectively located on the lower sides of the two groups of installation grooves; there are two groups of installation bolts, which are respectively threadedly connected to the inside of the two groups of installation screw holes, and the upper sides of the two groups of installation bolts are respectively located inside the two groups of installation grooves.

[0011] Furthermore, the packaging adjustment mechanism includes: an adjustment turn block and an adjustment groove; the adjustment turn block is rotatably connected to the middle position inside the outer end surface of the preheating plate body, and the adjustment turn block rotates on the outer end surface of the preheating plate body; the adjustment groove is coaxially opened on the outer end surface of the adjustment turn block, and the adjustment groove is a hexagonal structure.

[0012] Furthermore, the packaging adjustment mechanism also includes: an adjusting bevel gear and a power bevel gear; the adjusting bevel gear is coaxially fixedly connected to the rear side of the adjusting rotating block; the power bevel gear is rotatably connected to the inside and outside of the preheating plate body, and the adjusting bevel gear and the power bevel gear are meshed to form a bevel gear transmission mechanism.

[0013] Furthermore, the packaging adjustment mechanism also includes: a power shaft, a first screw and a second screw; the power shaft is rotatably connected to the inside and outside of the preheating plate body, and the power shaft and the power bevel gear are coaxially fixedly connected; there are two groups of first screws, and the two groups of first screws are coaxially fixedly connected to the left and right sides of the power shaft, and the two groups of first screws are respectively threadedly connected to the two groups of adjustment sliders; there are two groups of second screws, and the two groups of second screws are respectively coaxially fixedly connected to the left and right sides of the power shaft, and the two groups of second screws are respectively threadedly connected to the two groups of adjustment sliders, and the two groups of second screws are respectively located on the left side of the two groups of first screws, and the thread directions of the two groups of second screws are opposite to those of the two groups of first screws.

[0014] Furthermore, the packaging adjustment mechanism also includes: an adjusting friction surface; the adjusting friction surface is provided in multiple groups, and the multiple groups of adjusting friction surfaces are respectively plugged and connected to the inner end surfaces of the multiple groups of adjusting sliders, and the multiple groups of adjusting friction surfaces are respectively arc rectangular structures. Beneficial effects

[0015] The present invention adopts an installation protection mechanism to realize that the preheating plate is installed on the automatic film arrangement machine through the installation bolts. The protection plug protects the installation bolts inside the installation groove to prevent the installation bolts from being exposed to the outside, which may cause oxidation of the installation bolts and affect the connection of the installation bolts. The rectangular photosensitive detection hole is installed in the frame pad area of ​​the preheating plate. The pad area is suspended and will not affect the preheating area. The preheating area of ​​the frame is increased, and the preheating is uniform, thereby ensuring product quality.

[0016] In addition, by adopting the encapsulated adjustment mechanism, the staff can twist the adjustment block to drive the adjustment slider and the adjustment friction surface to slide, adjust the width of the loading groove, and thus adjust the width of the loading arm entry hole. The width of the loading groove can be accurately adjusted to ensure that the loading rack does not shake when it is placed, and the position is fixed, ensuring that the slices are accurately positioned, and ensuring that the loading rack can be easily positioned into the hole when it is placed without getting stuck and affecting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0018] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0019] In the attached figure:

[0020] Figure 1 2 is a schematic structural diagram of a front view of a preheating plate according to an embodiment of the present invention.

[0021] Figure 2 2 is a schematic structural diagram of a rear view of a preheating plate according to an embodiment of the present invention.

[0022] Figure 3 2 is a schematic structural diagram of a preheating plate portion of an embodiment of the present invention.

[0023] Figure 4 It is a structural diagram of the installation protection mechanism of an embodiment of the present invention.

[0024] Figure 5 It is a schematic structural diagram of the disassembly of the mounting bolts in an embodiment of the present invention.

[0025] Figure 6 It is a schematic structural diagram of the entire packaging adjustment mechanism of an embodiment of the present invention.

[0026] Figure 7 It is a structural schematic diagram of the left side of the packaging adjustment mechanism of an embodiment of the present invention.

[0027] Figure 8 It is a structural schematic diagram of the connection between the first lead screw, the second lead screw and the adjustment slider in an embodiment of the present invention.

[0028] Reference Signs List

[0029] 1. Preheating plate body; 2. Main body mounting hole; 3. Side groove; 4. Limiting groove; 5. Feeding groove; 6. Blocking groove; 7. Positioning block; 8. Photosensitive detection hole; 9. Mounting groove; 901. Protective platform edge; 10. Protective plug block; 11. Mounting screw hole; 12. Mounting bolt; 13. Adjusting turn block; 1301. Adjusting groove; 1302. Adjusting bevel gear; 14. Power shaft; 1401. Power bevel gear; 15. First lead screw; 16. Second lead screw; 17. Adjusting slider; 1701. Adjusting friction surface. DETAILED DESCRIPTION

[0030] Example 1: Please refer to Figures 1 to 5 As shown:

[0031] The present invention provides an adaptive and adjustable preheating plate for semiconductor packaging, comprising a preheating plate main body 1, a main body mounting hole 2, a feeding groove 5, a positioning block 7, a protective plug 10, an adjusting slider 17 and an installation protection mechanism; the main body mounting holes 2 are provided with four groups, and the four groups of main body mounting holes 2 are respectively opened at the four corners of the preheating plate main body 1; the feeding grooves 5 are provided with four groups, and the four groups of feeding grooves 5 are respectively opened on the left and right sides of the front and rear end surfaces of the preheating plate main body 1; a total of multiple groups of positioning blocks 7 are provided, and the multiple groups of positioning blocks 7 are respectively fixedly connected to the front and rear sides of the upper end surface of the preheating plate main body 1; a total of two groups of protective plugs 10 are provided, and the two groups of protective plugs 10 are respectively located on the left and right sides of the upper end surface of the preheating plate main body 1; a total of multiple groups of adjusting sliders 17 are provided, and the multiple groups of adjusting sliders 17 are respectively slidably connected to the inside of the outer end surface of the preheating plate main body 1, wherein every two groups of adjusting sliders 17 slide on the left and right sides of the inside of the feeding groove 5; the installation protection mechanism is provided on the preheating plate main body 1.

[0032] Among them, the installation protection mechanism includes: side grooves 3, limiting grooves 4 and blocking grooves 6; there are multiple groups of side grooves 3, and multiple groups of side grooves 3 are respectively opened on the left and right end surfaces of the preheating plate body 1; there are multiple groups of limiting grooves 4, and multiple groups of limiting grooves 4 are respectively opened on the left and right sides of the front and rear end surfaces of the preheating plate body 1, and multiple groups of limiting grooves 4 are respectively located on the outside of the four groups of loading grooves 5; there are two groups of blocking grooves 6, and the two groups of four groups of loading grooves 5 are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate body 1. During use, when the preheating plate body 1 is placed on the automatic sheet arranging machine, the side grooves 3 and the limiting grooves 4 facilitate the alignment of the preheating plate body 1 and the automatic sheet arranging machine, and the blocking grooves 6 facilitate the loading of semiconductors.

[0033] Among them, the installation protection mechanism also includes: photosensitive detection holes 8; there are two groups of photosensitive detection holes 8, and the two groups of photosensitive detection holes 8 are respectively opened on the front and rear sides of the middle position of the upper end surface of the preheating plate main body 1, and the two groups of photosensitive detection holes 8 are respectively opened in the middle position of multiple groups of positioning blocks 7. The two groups of photosensitive detection holes 8 are rectangular structures. During use, the photosensitive detection holes 8 are located in the middle position of the upper end surface of the preheating plate main body 1 and are in the pad area of ​​the preheating plate main body 1, which reduces the area occupied by the photosensitive detection holes 8 and makes the preheating of the preheating plate more uniform.

[0034] Among them, the installation protection mechanism also includes: installation grooves 9 and protection edges 901; there are two groups of installation grooves 9, and the two groups of installation grooves 9 are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate main body 1, and the two groups of protection plugs 10 are respectively plugged into the two groups of installation grooves 9; there are two groups of protection edges 901, and the two groups of protection edges 901 are respectively opened on the upper end surfaces of the two groups of installation grooves 9. The upper sides of the two groups of protection plugs 10 are located inside the two groups of protection edges 901, and the outer sides of the upper end surfaces of the two groups of protection plugs 10 are fixedly connected to the inner and outer sides of the two groups of protection edges 901. During use, the protection plugs 10 are fixed to the preheating plate main body 1 through the protection edges 901, and the protection plugs 10 are inserted into the installation grooves 9 to protect the parts inside the installation grooves 9.

[0035] Among them, the installation protection mechanism also includes: mounting screw holes 11 and mounting bolts 12; there are two groups of mounting screw holes 11, and the two groups of mounting screw holes 11 are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate main body 1, and the two groups of mounting screw holes 11 are respectively located on the lower sides of the two groups of mounting grooves 9; there are two groups of mounting bolts 12, and the two groups of mounting bolts 12 are respectively threadedly connected to the inside of the two groups of mounting screw holes 11, and the upper sides of the two groups of mounting bolts 12 are respectively located inside the two groups of mounting grooves 9. During use, the mounting bolts 12 are installed inside the automatic film arrangement machine by being installed inside the mounting screw holes 11. When the mounting bolts 12 are located inside the mounting groove 9, the protective plug 10 protects the mounting bolts 12 inside the mounting groove 9.

[0036] Specific usage and function of the first embodiment: During use of the present invention, when the preheating plate body 1 is placed on the automatic film arranging machine, the side grooves 3 and the limit grooves 4 facilitate alignment of the preheating plate body 1 and the automatic film arranging machine, and the blocking grooves 6 facilitate loading of semiconductors. The photosensitive detection hole 8 is located in the middle position of the upper end surface of the preheating plate body 1 and is in the pad area of ​​the preheating plate body 1, which reduces the area occupied by the photosensitive detection hole 8 and makes the preheating plate preheating more uniform. The protective plug 10 is fixed to the preheating plate body 1 through the protective platform edge 901. The protective plug 10 is inserted into the mounting groove 9 to protect the parts inside the mounting groove 9. The mounting bolt 12 is installed inside the automatic film arranging machine by being installed in the mounting screw hole 11. When the mounting bolt 12 is located inside the mounting groove 9, the protective plug 10 protects the mounting bolt 12 inside the mounting groove 9, thereby realizing the installation and installation protection of the preheating plate.

[0037] Example 2: Based on Example 1, please refer to Figures 6 to 8 As shown:

[0038] The present invention provides an adaptable and adjustable preheating plate for semiconductor packaging, which also includes a packaging adjustment mechanism. There are two groups of packaging adjustment mechanisms, which are respectively arranged on the front and back sides of the preheating plate body 1. The packaging adjustment mechanism includes: an adjustment rotating block 13 and an adjustment groove 1301; the adjustment rotating block 13 is rotatably connected to the middle position inside the outer end surface of the preheating plate body 1, and the adjustment rotating block 13 rotates on the outer end surface of the preheating plate body 1; the adjustment groove 1301 is coaxially opened on the outer end surface of the adjustment rotating block 13, and the adjustment groove 1301 is a hexagonal structure. During use, the staff uses a tool to insert the inside of the adjustment groove 1301, twists the tool to rotate and drive the adjustment groove 1301 to rotate, and the rotation of the adjustment groove 1301 drives the adjustment rotating block 13 to rotate.

[0039] Among them, the packaging adjustment mechanism also includes: an adjusting bevel gear 1302 and a power bevel gear 1401; the adjusting bevel gear 1302 is coaxially fixedly connected to the rear side of the adjusting rotating block 13; the power bevel gear 1401 is rotatably connected to the inner and outer sides of the preheating plate body 1, and the adjusting bevel gear 1302 and the power bevel gear 1401 are engaged to form a bevel gear transmission mechanism. During use, the adjusting rotating block 13 rotates to drive the adjusting bevel gear 1302 to rotate, and the adjusting bevel gear 1302 rotates to drive the engaged power bevel gear 1401 to rotate.

[0040] Among them, the packaging adjustment mechanism also includes: a power shaft 14, a first screw 15 and a second screw 16; the power shaft 14 is rotatably connected to the inside and outside of the preheating plate body 1, and the power shaft 14 and the power bevel gear 1401 are coaxially fixedly connected; there are two groups of first screws 15, and the two groups of first screws 15 are coaxially fixedly connected to the left and right sides of the power shaft 14, and the two groups of first screws 15 are respectively threadedly connected to the two groups of adjustment sliders 17; there are two groups of second screws 16, and the two groups of second screws 16 are coaxially fixedly connected to the left and right sides of the power shaft 14 On both sides, the two groups of second lead screws 16 are respectively threadedly connected to the two groups of adjusting sliders 17, and the two groups of second lead screws 16 are respectively located on the left side of the two groups of first lead screws 15, and the thread directions of the two groups of second lead screws 16 are respectively opposite to the two groups of first lead screws 15. During use, the power bevel gear 1401 rotates to drive the power shaft 14 to rotate, and the power shaft 14 rotates to drive the first lead screw 15 and the second lead screw 16 to rotate, and the first lead screw 15 and the second lead screw 16 rotate to drive the adjusting slider 17 to slide, and the adjusting slider 17 slides to adjust the width of the loading rack into the loading groove 5.

[0041] Among them, the packaging adjustment mechanism also includes: an adjusting friction surface 1701; there are multiple groups of adjusting friction surfaces 1701, and the multiple groups of adjusting friction surfaces 1701 are respectively plugged into the inner end surfaces of the multiple groups of adjusting sliders 17, and the multiple groups of adjusting friction surfaces 1701 are respectively arc rectangular structures. During use, the sliding of the adjusting slider 17 drives the adjusting friction surface 1701 to slide, and the adjusting friction surface 1701 slides to adjust the width of the feeding groove 5. When the feeding arm moves inside the feeding groove 5 and generates friction, the adjusting friction surface 1701 and the feeding arm rub against each other. The adjusting friction surface 1701 can be replaced and maintained, which is convenient for later maintenance and use.

[0042] Specific usage and function of the second embodiment of the present invention: During use, the staff inserts a tool into the adjusting groove 1301, twists the tool to rotate and drives the adjusting groove 1301 to rotate, the adjusting groove 1301 rotates and drives the adjusting rotating block 13 to rotate, the adjusting rotating block 13 rotates and drives the adjusting bevel gear 1302 to rotate, the adjusting bevel gear 1302 rotates and drives the meshing power bevel gear 1401 to rotate, the power bevel gear 1401 rotates and drives the power shaft 14 to rotate, the power shaft 14 rotates and drives the first screw 15 and the second screw 16 to rotate, and the first screw 15 and the second screw 16 rotate. The rotation of the lead screw 15 and the second lead screw 16 drives the adjusting slider 17 to slide, and the adjusting slider 17 slides to adjust the width of the loading rack into the loading groove 5. The sliding of the adjusting slider 17 drives the adjusting friction surface 1701 to slide, and the adjusting friction surface 1701 slides to adjust the width of the loading groove 5. When the feeding arm moves inside the loading groove 5 and generates friction, the adjusting friction surface 1701 and the feeding arm rub against each other. The adjusting friction surface 1701 can be replaced and maintained, which is convenient for later maintenance and use, thereby adjusting the width of the loading groove 5 and facilitating the feeding arm to place the semiconductor inside the preheating plate.

Claims

1. An adaptable and adjustable preheating plate for semiconductor packaging, comprising: A preheating plate body (1), a main body mounting hole (2), a feeding groove (5), a positioning block (7), a protective plug (10), an adjusting slider (17), a mounting protection mechanism and a packaging adjusting mechanism; the main body mounting hole (2) is provided with four groups, and the four groups of main body mounting holes (2) are respectively opened at the four corners of the preheating plate body (1); it is characterized in that the feeding groove (5) is provided with four groups, and the four groups of feeding grooves (5) are respectively opened on the left and right sides of the front and rear end surfaces of the preheating plate body (1); the positioning block (7) is provided with multiple groups, and the multiple groups of positioning block (7) are respectively fixedly connected to the front and rear sides of the upper end surface of the preheating plate body (1); the protective plug (10) is provided with two groups, and the two groups of protective plug (10) are respectively located on the left and right sides of the upper end surface of the preheating plate body (1); the adjusting slider (17) A total of multiple groups are provided, and the multiple groups of adjustment sliders (17) are respectively slidably connected to the inside of the outer end surface of the preheating plate body (1), wherein each two groups of adjustment sliders (17) slide respectively on the left and right sides of the inside of the feeding groove (5); the installation protection mechanism is provided on the preheating plate body (1); the packaging adjustment mechanism is provided with two groups, and the two groups of packaging adjustment mechanisms are respectively provided on the front and back sides of the inside of the preheating plate body (1); the packaging adjustment mechanism includes: an adjustment rotating block (13) and an adjustment groove (1301); the adjustment rotating block (13) is rotatably connected to the middle position inside the outer end surface of the preheating plate body (1), and the adjustment rotating block (13) rotates on the outer end surface of the preheating plate body (1); the adjustment groove (1301) is coaxially opened on the outer end surface of the adjustment rotating block (13), and the adjustment groove (1301) is a hexagonal structure.

2. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 1, characterized in that: The installation protection mechanism comprises: side grooves (3), limiting grooves (4) and blocking grooves (6); the side grooves (3) are provided in a plurality of groups, and the plurality of side grooves (3) are respectively opened on the left and right end surfaces of the preheating plate body (1); the limiting grooves (4) are provided in a plurality of groups, and the plurality of limiting grooves (4) are respectively opened on the left and right sides of the front and rear end surfaces of the preheating plate body (1), and the plurality of limiting grooves (4) are respectively located outside the four groups of feeding grooves (5); the blocking grooves (6) are provided in two groups, and the two groups and the four groups of feeding grooves (5) are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate body (1).

3. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 1, characterized in that: The installation protection mechanism further comprises: photosensitive detection holes (8); the photosensitive detection holes (8) are provided in two groups, the two groups of photosensitive detection holes (8) are respectively opened on the front and rear sides of the middle position of the upper end surface of the preheating plate body (1), the two groups of photosensitive detection holes (8) are respectively opened in the middle position of the plurality of positioning blocks (7), and the two groups of photosensitive detection holes (8) are respectively rectangular structures.

4. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 1, characterized in that: The installation protection mechanism further comprises: an installation groove (9) and a protection platform edge (901); the installation groove (9) is provided with two groups, and the two groups of installation grooves (9) are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate body (1), and the two groups of protection plugs (10) are respectively plugged and connected with the two groups of installation grooves (9); the protection platform edge (901) is provided with two groups, and the two groups of protection platform edges (901) are respectively opened on the upper end surfaces of the two groups of installation grooves (9), the upper sides of the two groups of protection plugs (10) are located inside the two groups of protection platform edges (901), and the outer sides of the upper end surfaces of the two groups of protection plugs (10) are fixedly connected to the inner and outer sides of the two groups of protection platform edges (901).

5. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 4, characterized in that: The installation protection mechanism further comprises: installation screw holes (11) and installation bolts (12); there are two groups of the installation screw holes (11), the two groups of installation screw holes (11) are respectively opened on the left and right sides of the middle position of the upper end surface of the preheating plate body (1), and the two groups of installation screw holes (11) are respectively located at the lower sides of the two groups of installation grooves (9); there are two groups of the installation bolts (12), the two groups of installation bolts (12) are respectively threadedly connected to the inside of the two groups of installation screw holes (11), and the upper sides of the two groups of installation bolts (12) are respectively located inside the two groups of installation grooves (9).

6. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 1, characterized in that: The packaging adjustment mechanism further comprises: an adjustment bevel gear (1302) and a power bevel gear (1401); the adjustment bevel gear (1302) is coaxially fixedly connected to the rear side of the adjustment rotating block (13); the power bevel gear (1401) is rotatably connected to the inside and outside of the preheating plate body (1); the adjustment bevel gear (1302) and the power bevel gear (1401) are meshed to form a bevel gear transmission mechanism.

7. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 6, characterized in that: The packaging adjustment mechanism further comprises: a power shaft (14), a first lead screw (15) and a second lead screw (16); the power shaft (14) is rotatably connected to the inner and outer sides of the preheating plate body (1), and the power shaft (14) and the power bevel gear (1401) are coaxially fixedly connected; the first lead screw (15) is provided in two groups, the two groups of first lead screws (15) are coaxially fixedly connected to the left and right sides of the power shaft (14), and the two groups of first lead screws (15) are respectively threadedly connected to the two groups of adjustment sliders (17); the second lead screw (16) is provided in two groups, the two groups of second lead screws (16) are coaxially fixedly connected to the left and right sides of the power shaft (14), and the two groups of second lead screws (16) are respectively threadedly connected to the two groups of adjustment sliders (17), and the two groups of second lead screws (16) are respectively located on the left sides of the two groups of first lead screws (15), and the thread directions of the two groups of second lead screws (16) are opposite to those of the two groups of first lead screws (15).

8. The adaptable and adjustable preheating plate for semiconductor packaging according to claim 1, characterized in that: The packaging adjustment mechanism further comprises: an adjustment friction surface (1701); the adjustment friction surface (1701) is provided in a plurality of groups, and the plurality of groups of adjustment friction surfaces (1701) are respectively plugged and connected to the inner end surfaces of the plurality of groups of adjustment sliders (17), and the plurality of groups of adjustment friction surfaces (1701) are respectively arc rectangular structures.

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