An acceleration sensor package assembly

Abstract

The application discloses an acceleration sensor packaging assembly and belongs to the technical field of sensor packaging, which comprises a workbench, a mounting rack is fixedly installed on the top wall of the workbench, a top plate is fixedly installed on the mounting rack, an electric telescopic rod is vertically installed on the top plate, an installation disc is fixedly installed on the output end of the electric telescopic rod, a glue injection rod is fixedly installed on the bottom wall of the installation disc, and an absorption assembly is arranged on the glue injection rod; the absorption assembly comprises a glue storage cavity formed in the glue injection rod. The buffer air bag is arranged, so that the glue injection pump can be damped, air can be sucked through the air inlet valve and the first air pipe, then the first air pipe sucks air from the communication hole through the linkage assembly and the communication assembly, at this time, the airflow can drive the substances on the top wall of the chip to flow into the linkage assembly, so that the impurities adhered to the top wall of the chip are prevented from affecting the use effect of the chip, the time-consuming rework treatment is avoided, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of sensor packaging technology, and more specifically, to an acceleration sensor packaging component. Background Technology

[0002] A velocity sensor is a sensor that can detect the acceleration of an object and is widely used in various fields, such as consumer electronics, automobiles, aerospace, and industrial automation.

[0003] To prevent accelerometers from getting damp during use, thus affecting their performance and reliability, and to prevent dust from adhering to the chip surface or entering the sensitive element, affecting the sensor's accuracy and stability, as well as to protect the sensor chip from damage caused by external mechanical shocks and vibrations, accelerometers are often packaged. Packaging also improves performance, facilitates installation and integration, enhances reliability and consistency, and meets specific application requirements. The packaging process typically involves first dicing the wafer, then mounting the sensing element, followed by wire bonding to connect the sensor chip's electrodes to external circuitry. Finally, encapsulation and curing are performed, fixing the sensor chip and leads within the package to form a complete package structure. For economic reasons, plastics are increasingly used as encapsulation materials, with epoxy resin and curing agents being the most common. These are typically black, blocky materials that require low-temperature storage and must be warmed before use. Epoxy resin is initially molten at high temperatures and then gradually hardens to form the final encapsulation. However, existing chip encapsulation equipment uses a whole-system heating method, which raises the overall ambient temperature and can damage the chip, resulting in a low yield rate. Furthermore, because the encapsulated chip shell does not completely solidify after heating, the chip surface is not smooth, affecting aesthetics. Additionally, the high temperature of the encapsulated chip hinders subsequent cutting and other processing steps, impacting production efficiency.

[0004] To address the aforementioned issues, some solutions have been proposed in the prior art. For example, Chinese invention patent CN112827752B discloses a grease injection device and chip packaging process for chip packaging. This device uses a controller to precisely control the entire production process, enabling the various systems within the device to work together seamlessly and quickly. This allows the entire chip packaging grease injection process to proceed rapidly, saving significant transfer and device downtime, and effectively improving the overall production efficiency. However, during transportation, chips inevitably accumulate a small amount of dust on their surface. If the dust is not cleaned in time, it can be packaged along with the chip, potentially affecting its performance and requiring rework, thus severely impacting production efficiency. Summary of the Invention

[0005] To address the problems existing in the prior art, the purpose of this invention is to provide an accelerometer packaging component that can improve production efficiency.

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] An accelerometer packaging assembly includes a worktable, a mounting frame fixedly mounted on the top wall of the worktable, a top plate fixedly mounted on the mounting frame, an electric telescopic rod vertically mounted on the top plate, a mounting plate fixedly mounted on the output end of the electric telescopic rod, a glue injection rod fixedly mounted on the bottom wall of the mounting plate, and an absorption component provided on the glue injection rod.

[0008] The absorption assembly includes a glue storage cavity formed on the glue injection rod, a glue injection pump installed on the glue injection rod, a glue injection tube fixedly installed on the output end of the glue injection pump, a buffer airbag installed between the mounting plate and the top plate, an air inlet valve inserted into the buffer airbag, a first air pipe installed on the input end of the air inlet valve, a transmission plate rotatably installed on the top wall of the worktable, a placement groove formed on the top wall of the transmission plate, a limit frame detachably installed in the placement groove, a positioning groove formed on the limit frame, a conveying assembly for conveying the chip into the limit frame on the mounting plate, and a linkage assembly that cooperates with the first air pipe on the glue injection rod.

[0009] Furthermore, the linkage component includes a groove formed on the injection rod, a horizontal plate slidably installed in the groove, a return spring jointly installed between the top wall of the horizontal plate and the groove, a push rod fixedly installed on the bottom wall of the horizontal plate, a collection box detachably installed on the side wall of the injection rod, and the collection box is connected to the end of the first air tube away from the air inlet valve of the buffer airbag, a control component is provided on the horizontal plate, and a communication component connected to the control component is inserted into the collection box.

[0010] Furthermore, the connecting component includes a second air pipe inserted into the collecting box, a collecting rod fixedly installed on the horizontal plate, a connecting hole communicating with the second air pipe on the collecting rod, and a vertical groove slidingly engaging with the collecting rod on the glue injection rod.

[0011] Furthermore, a filter screen that cooperates with the first air pipe is fixedly installed on the collection box, and a linkage groove communicating with the vertical groove is opened on the glue injection rod, and a scraper is slidably installed in the linkage groove.

[0012] Furthermore, the conveying assembly includes a conveying block formed on the bottom wall of the mounting plate, a storage groove formed on the conveying block, a hydraulic rod fixedly installed on the side wall of the conveying block, a pushing groove formed on the conveying block, a discharge groove formed on the bottom wall of the pushing groove, and a push plate horizontally slidably installed in the pushing groove and fixedly connected to the output end of the hydraulic rod.

[0013] Furthermore, a limiting groove is provided on the conveying block, and a U-shaped limiting plate is vertically slidably installed in the limiting groove. A first spring is installed between the limiting plate and the limiting groove, and an inclined groove is provided on the limiting plate.

[0014] Furthermore, a vertical block is fixedly installed on the bottom wall of the mounting plate, and a heat-solidifying rod that slides in cooperation with the positioning groove is uniformly fixedly installed on the bottom wall of the vertical block.

[0015] Furthermore, a groove is provided on the bottom wall of the hot solidification rod, a stop block is slidably installed in the groove, a second spring is installed between the stop block and the groove, a third air pipe is fixedly installed on the top wall of the groove, and an exhaust valve with an output end connected to the third air pipe is inserted into the buffer airbag, a first magnet is embedded in the stop block, a second magnet is embedded in the limiting frame, and the first magnet and the second magnet repel each other.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] (1) By setting up a buffer airbag, this solution can reduce the vibration of the dispensing pump and draw air through the air inlet valve and the first air pipe. Then, the first air pipe draws air from the connecting hole through the linkage component and the connecting component. At this time, the airflow can carry the material on the top wall of the chip to the linkage component together, thereby avoiding impurities from adhering to the top wall of the chip and affecting the chip's performance, which would require time to rework and thus improve production efficiency.

[0018] (2) This solution sets up a collection rod, which drives the push rod to move downward during the downward movement of the glue injection rod. During the downward movement of the push rod, it gradually contacts the top wall of the limiting frame. Then, the top wall of the limiting frame drives the push rod to move upward. During the upward movement of the push rod, the collection rod is driven to move upward through the horizontal plate. During the upward movement of the collection rod, the connecting hole is driven to move upward. After the connecting hole is connected to the second air pipe, the buffer airbag can suck air through the air inlet valve, the first air pipe, the collection box, the second air pipe, and the connecting hole. That is, as the buffer airbag is gradually stretched, the pressure inside the buffer airbag gradually decreases, which increases the suction force of the connecting hole, thereby improving the chip cleaning effect and further improving production efficiency.

[0019] This solution uses a scraper to gradually increase the pressure in the vertical groove as the collection box rod moves upward. Under this pressure, the airflow in the vertical groove flows into the connecting groove, increasing the pressure there as well. This pressure then drives the scraper to move along the connecting groove, cleaning the filter screen and preventing dust accumulation on the bottom wall. This dust accumulation would otherwise obstruct airflow and necessitate frequent filter cleaning by operators, thus improving production efficiency.

[0020] (4) This solution sets a limiting plate. During the movement of the push plate, the limiting plate is driven to move downward through the inclined groove. Then, during the downward movement of the limiting plate, it gradually disengages from the push groove. At this time, the push plate can push the chip into the discharge groove along the push groove. After the chip enters the positioning groove through the discharge groove, the hydraulic rod output end retracts and drives the push plate to reset. During the reset process of the push plate, it gradually disengages from the storage groove. Then, under the action of gravity, the chip enters the push groove. As the push plate moves, the push plate gradually disengages from the inclined groove. At this time, the first spring extends and drives the limiting plate to move upward. Then, under the action of the limiting plate, the chip can be prevented from falling into the outside through the discharge groove when it is not pushed by the push plate, which would affect the normal operation of production and further improve production efficiency.

[0021] (5) By setting a stop, the first magnet and the second magnet move away from each other during the upward movement of the mounting plate. Then the second spring extends and drives the stop to move out of the groove. At the same time, the buffer airbag is compressed during the upward movement of the mounting plate. At this time, the airflow in the buffer airbag flows into the groove through the exhaust valve and the third air pipe, and flows to the outside through the groove. This can accelerate the airflow around the positioning groove, thereby accelerating the cooling of the encapsulation liquid and further improving production efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle;

[0024] Figure 3 This is a combined diagram of the glue injection rod and the glue injection rod of the collection box of the present invention;

[0025] Figure 4 For the present invention Figure 3 Enlarged view at point B in the middle;

[0026] Figure 5 This is a cross-sectional view of the conveying block, push plate, and limiting plate of the present invention;

[0027] Figure 6 This is a combined diagram of the thermal solidification rod, the stop block, and the second spring of the present invention;

[0028] Figure 7 This is a cross-sectional view of the airbag of the present invention;

[0029] Figure 8 This is a cross-sectional view of the collecting rod of the present invention;

[0030] Figure 9 This is a diagram showing the combination of the limiting block and the second magnet of the present invention.

[0031] Explanation of the labels in the diagram:

[0032] 1. Workbench; 2. Mounting frame; 3. Top plate; 4. Electric telescopic rod; 5. Mounting plate; 6. Glue injection rod;

[0033] 7. Absorption assembly; 701. Glue storage chamber; 702. Glue injection pump; 703. Glue injection tube; 704. Buffer airbag; 705. Air inlet valve; 706. First air pipe; 707. Transmission disc; 708. Placement slot; 709. Limiting frame; 710. Positioning slot;

[0034] 8. Linkage assembly; 801. Horizontal plate; 802. Return spring; 803. Push rod; 804. Collection box; 805. Connecting assembly; 8051. Second air pipe; 8052. Collection rod; 8053. Connecting hole; 8054. Vertical groove; 806. Filter screen; 807. Scraper;

[0035] 9. Conveying assembly; 901. Conveying block; 902. Storage trough; 903. Hydraulic rod; 904. Discharge trough; 905. Push plate; 906. Limiting groove; 907. Limiting plate; 908. First spring; 909. Inclined chute;

[0036] 101. Vertical block; 102. Heat-freezing rod; 103. Stop block; 104. Second spring; 105. Third air pipe; 106. Exhaust valve; 107. First magnet; 108. Second magnet. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0038] Please see Figures 1 to 9An accelerometer packaging assembly includes a workbench 1, a mounting frame 2 fixedly mounted on the top wall of the workbench 1, a top plate 3 fixedly mounted on the mounting frame 2, an electric telescopic rod 4 vertically mounted on the top plate 3, a mounting plate 5 fixedly mounted on the output end of the electric telescopic rod 4, a glue injection rod 6 fixedly mounted on the bottom wall of the mounting plate 5, and an absorption component 7 provided on the glue injection rod 6.

[0039] The absorption component 7 includes a glue storage cavity 701 formed on the glue injection rod 6. A glue injection pump 702 is installed on the glue injection rod 6. A glue injection tube 703 is fixedly installed on the output end of the glue injection pump 702. A buffer airbag 704 is installed between the mounting plate 5 and the top plate 3. An air inlet valve 705 is inserted into the buffer airbag 704. A first air pipe 706 is installed on the input end of the air inlet valve 705. A transmission plate 707 is rotatably installed on the top wall of the workbench 1. A placement groove 708 is formed on the top wall of the transmission plate 707. A limit frame 709 is detachably installed in the placement groove 708. A positioning groove 710 is formed on the limit frame 709. A conveying component 9 for conveying the chip into the limit frame 709 is provided on the mounting plate 5. A linkage component 8 that cooperates with the first air pipe 706 is provided on the glue injection rod 6.

[0040] The linkage component 8 includes a groove formed on the injection rod 6, a horizontal plate 801 slidably installed in the groove, a return spring 802 jointly installed between the top wall of the horizontal plate 801 and the groove, a push rod 803 fixedly installed on the bottom wall of the horizontal plate 801, a collection box 804 detachably installed on the side wall of the injection rod 6, and the collection box 804 is connected to the end of the first air pipe 706 away from the air inlet valve 705 of the buffer airbag 704, a control component is provided on the horizontal plate 801, and a communication component 805 connected to the control component is inserted into the collection box 804.

[0041] The connecting component 805 includes a second air pipe 8051 inserted into the collection box 804, a collection rod 8052 fixedly installed on the horizontal plate 801, a connecting hole 8053 communicating with the second air pipe 8051 on the collection rod 8052, and a vertical groove 8054 slidably engaged with the collection rod 8052 on the glue injection rod 6.

[0042] A filter screen 806 that cooperates with the first air pipe 706 is fixedly installed on the collection box 804. A linkage groove communicating with the vertical groove 8054 is opened on the glue injection rod 6. A scraper 807 is slidably installed in the linkage groove.

[0043] In use, the user can place the limiting frame 709 into the placement slot 708, and then the conveying assembly 9 can transport the chip into the positioning slot 710. At this time, the transmission disk 707 on the worktable 1 can move the limiting frame 709 directly below the dispensing rod 6 through the placement slot 708. Then, the output end of the electric telescopic rod 4 extends and moves the mounting disk 5 downward. During the downward movement of the mounting disk 5, the dispensing rod 6 moves downward. After the dispensing rod 6 is in contact with the top wall of the limiting frame 709, the dispensing pump 702 drives the encapsulation liquid in the glue storage chamber 701 to flow to the chip through the dispensing tube 703, thereby achieving the purpose of encapsulation. At the same time... During the operation of the dispensing pump 702, the buffer airbag 704 can absorb the vibration of the dispensing pump 702, thereby improving the encapsulation effect. As the mounting plate 5 moves downward, the buffer airbag 704 is stretched. At this time, the buffer airbag 704 draws air through the air inlet valve 705 and the first air pipe 706. Then, the first air pipe 706 draws air from the connecting hole 8053 through the linkage component 8 and the connecting component 805. At this time, the airflow can carry the material on the top wall of the chip into the linkage component 8, thereby preventing impurities from adhering to the top wall of the chip and affecting the chip's performance, which would otherwise require time for rework and thus improve production efficiency.

[0044] After the buffer airbag 704 draws air through the air inlet valve 705 and the first air pipe 706, the first air pipe 706 draws air from the connecting component 805 through the collection box 804 and the second air pipe 8051. This allows dust to flow into the collection box 804, facilitating dust collection and preventing dust from adhering to other chip surfaces, further improving the chip cleaning effect. Additionally, as the dispensing rod 6 moves downwards, it drives the push rod 803 downwards. During this downward movement, the push rod 803 gradually contacts the top wall of the limiting frame 709. Then, the top wall of the limiting frame 709 drives the push rod 803 upwards. During the upward movement, the horizontal plate 801 drives the collecting rod 8052 to move upward, and the collecting rod 8052 drives the connecting hole 8053 to move upward. After the connecting hole 8053 connects with the second air pipe 8051, the buffer airbag 704 can draw air through the air inlet valve 705, the first air pipe 706, the collecting box 804, the second air pipe 8051, and the connecting hole 8053. That is, as the buffer airbag 704 is gradually stretched, the pressure inside the buffer airbag 704 gradually decreases, which increases the suction force of the connecting hole 8053, thereby improving the chip cleaning effect and further improving production efficiency.

[0045] After the dust flows into the collection box 804, the filter screen 806 prevents the dust from flowing into the buffer airbag 704 and affecting its normal operation. Simultaneously, as the rod of the collection box 804 moves upward along the vertical groove 8054, the pressure inside the vertical groove 8054 gradually increases. Under this pressure, the airflow in the vertical groove 8054 flows into the linkage groove, further increasing the pressure there. This pressure then drives the scraper 807 to move along the linkage groove. During this movement, the scraper 807 cleans the filter screen 806, preventing dust accumulation on its bottom wall and ensuring proper airflow. This avoids the need for frequent cleaning of the filter screen 806 by operators, further improving production efficiency.

[0046] After chip packaging is completed, the user can first turn off the glue pump 702, and then control the output end of the electric telescopic rod 4 to extend. At this time, the reset spring 802 extends and drives the push rod 803 to reset through the horizontal plate 801. During the reset process of the horizontal plate 801, the collecting rod 8052 is reset. During the reset process of the collecting rod 8052, the pressure in the vertical groove 8054 decreases. Then, under the action of pressure, the scraper 807 is reset, which serves to prepare for re-packaging.

[0047] like Figure 5 As shown, the conveying assembly 9 includes a conveying block 901 formed on the bottom wall of the mounting plate 5. The conveying block 901 has a storage groove 902. A hydraulic rod 903 is fixedly installed on the side wall of the conveying block 901. A pushing groove is formed on the conveying block 901. A discharge groove 904 is formed on the bottom wall of the pushing groove. A push plate 905, which is fixedly connected to the output end of the hydraulic rod 903, is horizontally slidably installed in the pushing groove.

[0048] The conveying block 901 has a limiting groove 906, and a U-shaped limiting plate 907 is vertically slidably installed in the limiting groove 906. A first spring 908 is installed between the limiting plate 907 and the limiting groove 906, and an inclined groove 909 is provided on the limiting plate 907.

[0049] By adopting the above technical solution, after the user places the limiting frame 709 into the placement slot 708, the output end of the electric telescopic rod 4 drives the conveying block 901 to move downward through the mounting plate 5, aligning the discharge slot 904 with the positioning slot 710. Then, the user can control the output end of the hydraulic rod 903 to extend. During the extension of the output end of the hydraulic rod 903, the push plate 905 is moved. During the movement of the push plate 905, the chip is moved towards the discharge slot 904 and enters the positioning slot 710 through the discharge slot 904. This eliminates the need for the user to spend time loading materials, thus improving production efficiency.

[0050] During the movement of the push plate 905, the inclined groove 909 drives the limiting plate 907 to move downward. As the limiting plate 907 moves downward, it gradually disengages from the pushing groove. At this time, the push plate 905 can push the chip into the discharge groove 904 along the pushing groove. After the chip enters the positioning groove 710 through the discharge groove 904, the output end of the hydraulic rod 903 retracts and drives the push plate 905 to reset. During the reset process, the push plate 905 gradually disengages from the storage groove 902. Then, under the action of gravity, the chip enters the pushing groove. As the push plate 905 moves, it gradually disengages from the inclined groove 909. At this time, the first spring 908 extends and drives the limiting plate 907 to move upward. Under the action of the limiting plate 907, the chip can be prevented from falling into the outside through the discharge groove 904 when it is not pushed by the push plate 905, which would affect the normal operation of production and further improve production efficiency.

[0051] like Figure 6 , Figure 7 , Figure 9 As shown, a vertical block 101 is fixedly installed on the bottom wall of the mounting plate 5, and a heat-solidifying rod 102 that slides in cooperation with the positioning groove 710 is uniformly fixedly installed on the bottom wall of the vertical block 101.

[0052] A groove is provided on the bottom wall of the thermal solidification rod 102. A stop block 103 is slidably installed in the groove. A second spring 104 is installed between the stop block 103 and the groove. A third air pipe 105 is fixedly installed on the top wall of the groove. An exhaust valve 106 with its output end connected to the third air pipe 105 is inserted into the buffer airbag 704. A first magnet 107 is embedded in the stop block 103. A second magnet 108 is embedded in the limiting frame 709. The first magnet 107 and the second magnet 108 repel each other.

[0053] By adopting the above technical solution, after the output end of the electric telescopic rod 4 retracts and drives the mounting plate 5 to reset, the transmission plate 707 can rotate 90 degrees again and drive the packaged chip to move downwards towards the thermal solidification rod 102. Then, during the downward movement of the mounting plate 5, the vertical block 101 drives the thermal solidification rod 102 to move into the positioning groove 710. When the thermal solidification rod 102 moves into the positioning groove 710, the second magnet 108 drives the stop block 103 into the groove through repulsion. At this time, the second spring 104 is compressed and has a tendency to recover. Then the thermal solidification rod 102 can... To perform thermal solidification on the packaged chip, as the mounting plate 5 moves upward, the first magnet 107 and the second magnet 108 move away from each other. Then, the second spring 104 extends and drives the stop block 103 to gradually move out of the groove. At the same time, as the mounting plate 5 moves upward, the buffer airbag 704 is compressed. At this time, the airflow in the buffer airbag 704 flows into the groove through the exhaust valve 106 and the third air pipe 105, and flows to the outside through the groove. This can accelerate the airflow around the positioning groove 710, thereby accelerating the cooling of the encapsulation liquid and further improving production efficiency.

[0054] Instructions for use: During use, the user places the limiting frame 709 into the placement slot 708. Then, the conveying assembly 9 transports the chip to the positioning slot 710. At this time, the transmission disc 707 on the worktable 1 can move the limiting frame 709 directly below the dispensing rod 6 via the placement slot 708. Then, the output end of the electric telescopic rod 4 extends and moves the mounting disc 5 downwards. During the downward movement of the mounting disc 5, the dispensing rod 6 moves downwards. Once the dispensing rod 6 is in contact with the top wall of the limiting frame 709, the dispensing pump 702 drives the encapsulation liquid in the glue storage chamber 701 to flow to the chip through the dispensing tube 703, thus achieving the encapsulation purpose. Simultaneously, during the operation of the dispensing pump 702, the buffer airbag 704 can absorb the dispensing liquid. The vibration of pump 702, through the encapsulation effect and the stretching of buffer airbag 704 during the downward movement of mounting plate 5, allows buffer airbag 704 to draw air in through air inlet valve 705 and first air pipe 706. Then, first air pipe 706 draws air from connecting hole 8053 through linkage component 8 and connecting component 805. This airflow can carry material on the top wall of the chip into linkage component 8. After buffer airbag 704 draws air in through air inlet valve 705 and first air pipe 706, first air pipe 706 draws air from connecting component 805 through collection box 804 and second air pipe 8051, thus carrying dust into collection box 804 for easy dust collection and preventing dust from adhering to other chip surfaces. This further improves the chip cleaning effect. During the downward movement of the dispensing rod 6, the push rod 803 moves downward, gradually contacting the top wall of the limiting frame 709. Then, the top wall of the limiting frame 709 drives the push rod 803 upward. During this upward movement, the horizontal plate 801 drives the collecting rod 8052 upward, and the collecting rod 8052 also drives the connecting hole 8053 upward. After the connecting hole 8053 connects with the second air pipe 8051, the buffer airbag 704 can then draw air through the air inlet valve 705, the first air pipe 706, the collecting box 804, the second air pipe 8051, and the connecting hole 8053. That is, as the buffer airbag... As the bladder 704 gradually stretches, the pressure inside the buffer bladder 704 gradually decreases, increasing the suction force of the connecting hole 8053. After the dust flows into the collection box 804, the filter screen 806 prevents the dust from flowing into the buffer bladder 704 and affecting its normal operation. At the same time, as the rod of the collection box 804 moves upward along the vertical groove 8054, the pressure inside the vertical groove 8054 gradually increases. Then, under the action of the pressure, the airflow in the vertical groove 8054 flows into the linkage groove, increasing the pressure inside the linkage groove. Then, under the action of the pressure, the scraper 807 moves along the linkage groove. During the movement of the scraper 807, the filter screen 806 can be cleaned, preventing dust accumulation on the bottom wall of the filter screen 806.After the user places the limiting frame 709 into the placement slot 708, the output end of the electric telescopic rod 4 drives the conveying block 901 downward through the mounting plate 5, aligning the discharge slot 904 with the positioning slot 710. Then, the user can control the extension of the hydraulic rod 903's output end. During the extension of the hydraulic rod 903's output end, the push plate 905 moves, and during the movement of the push plate 905, the chip moves towards the discharge slot 904 and enters the positioning slot 710 through the discharge slot 904. During the movement of the push plate 905, the limiting plate 907 moves downward through the inclined groove 909, and then... As the limiting plate 907 moves downward, it gradually disengages from the pushing groove. At this time, the push plate 905 can push the chip into the discharge groove 904 along the pushing groove. After the chip enters the positioning groove 710 through the discharge groove 904, the output end of the hydraulic rod 903 retracts and drives the push plate 905 to reset. During the reset process, the push plate 905 gradually disengages from the storage groove 902. Then, under the action of gravity, the chip enters the pushing groove. As the push plate 905 moves, it gradually disengages from the inclined groove 909. At this time, the first spring 908 extends and drives the limiting plate 907 to move upward. The positioning plate 907 prevents the chip from falling into the outside through the discharge slot 904 when it is not pushed by the push plate 905. After the output end of the electric telescopic rod 4 retracts and drives the mounting plate 5 to reset, the transmission plate 707 can rotate 90 degrees again and drive the packaged chip to move downwards towards the thermal solidification rod 102. Then, during the downward movement of the mounting plate 5, the vertical block 101 drives the thermal solidification rod 102 to move into the positioning groove 710. When the thermal solidification rod 102 moves into the positioning groove 710, the second magnet 108 drives the stop block 103 into the groove through repulsion. At this time, the second spring 104 is compressed. It exhibits a tendency to recover, and then the thermal solidification rod 102 can perform thermal solidification on the packaged chip. During the upward movement of the mounting plate 5, the first magnet 107 and the second magnet 108 move away from each other. Then, the second spring 104 extends and drives the stop block 103 to gradually move out of the groove. Simultaneously, during the upward movement of the mounting plate 5, the buffer airbag 704 is compressed. At this time, the airflow inside the buffer airbag 704 flows into the groove through the exhaust valve 106 and the third air pipe 105, and then flows to the outside through the groove, thereby accelerating the airflow around the positioning groove 710, thus accelerating the cooling of the encapsulation fluid.

[0055] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. An accelerometer packaging assembly, comprising a workbench (1), a mounting frame (2) fixedly mounted on the top wall of the workbench (1), a top plate (3) fixedly mounted on the mounting frame (2), an electric telescopic rod (4) vertically mounted on the top plate (3), a mounting plate (5) fixedly mounted on the output end of the electric telescopic rod (4), a glue injection rod (6) fixedly mounted on the bottom wall of the mounting plate (5), and an absorption component (7) provided on the glue injection rod (6); Its features are: The absorption assembly (7) includes a glue storage cavity (701) opened on the glue injection rod (6), a glue injection pump (702) is installed on the glue injection rod (6), a glue injection tube (703) is fixedly installed on the output end of the glue injection pump (702), a buffer airbag (704) is installed between the mounting plate (5) and the top plate (3), an air inlet valve (705) is inserted into the buffer airbag (704), and a first air tube (706) is installed on the input end of the air inlet valve (705). A transmission disk (707) is rotatably mounted on the top wall of the worktable (1). A placement groove (708) is provided on the top wall of the transmission disk (707). A limit frame (709) is detachably installed in the placement groove (708). A positioning groove (710) is provided on the limit frame (709). A conveying component (9) for conveying the chip into the limit frame (709) is provided on the mounting disk (5). A linkage component (8) that cooperates with the first air pipe (706) is provided on the dispensing rod (6). The linkage component (8) includes a groove on the injection rod (6), a horizontal plate (801) is slidably installed in the groove, a return spring (802) is installed between the top wall of the horizontal plate (801) and the groove, a push rod (803) is fixedly installed on the bottom wall of the horizontal plate (801), a collection box (804) is detachably installed on the side wall of the injection rod (6), and the collection box (804) is connected to the end of the first air tube (706) away from the air inlet valve (705) of the buffer airbag (704), a control component is provided on the horizontal plate (801), and a communication component (805) connected to the control component is inserted into the collection box (804). The connecting component (805) includes a second air pipe (8051) inserted into the collection box (804), a collection rod (8052) fixedly installed on the horizontal plate (801), a connecting hole (8053) communicating with the second air pipe (8051) on the collection rod (8052), and a vertical groove (8054) slidingly engaging with the collection rod (8052) on the glue injection rod (6). The collection box (804) is fixedly installed with a filter screen (806) that cooperates with the first air pipe (706). The glue injection rod (6) is provided with a linkage groove that communicates with the vertical groove (8054). A scraper (807) is slidably installed in the linkage groove. The conveying assembly (9) includes a conveying block (901) on the bottom wall of the mounting plate (5), a storage groove (902) on the conveying block (901), a hydraulic rod (903) fixedly installed on the side wall of the conveying block (901), a pushing groove on the conveying block (901), a discharge groove (904) on the bottom wall of the pushing groove, and a push plate (905) fixedly connected to the output end of the hydraulic rod (903) horizontally slidably installed in the pushing groove. The conveying block (901) has a limiting groove (906), and a U-shaped limiting plate (907) is vertically slidably installed in the limiting groove (906). A first spring (908) is installed between the limiting plate (907) and the limiting groove (906), and an inclined groove (909) is provided on the limiting plate (907).

2. The accelerometer packaging assembly according to claim 1, characterized in that: A vertical block (101) is fixedly installed on the bottom wall of the mounting plate (5), and a heat-solidifying rod (102) that slides in cooperation with the positioning groove (710) is uniformly fixedly installed on the bottom wall of the vertical block (101).

3. An accelerometer packaging assembly according to claim 2, characterized in that: The bottom wall of the heat-coagulating rod (102) is provided with a groove, and a stop block (103) is slidably installed in the groove. A second spring (104) is installed between the stop block (103) and the groove. A third air pipe (105) is fixedly installed on the top wall of the groove. An exhaust valve (106) with its output end connected to the third air pipe (105) is inserted into the buffer airbag (704). A first magnet (107) is embedded in the stop block (103). A second magnet (108) is embedded in the limiting frame (709). The first magnet (107) and the second magnet (108) repel each other.

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