Multi-chip eutectic heating device and use method thereof

Abstract

The present application relates to the technical field of semiconductor packaging, and in particular to a multi-chip eutectic heating device and a method of use, which includes a core structural design in which multiple components work together: it is equipped with key parts such as a visual eutectic box, a heating module, a cooling module, and a positioning device. Among them, the heating module is combined with a pulse power supply unit to achieve precise temperature control, the cooling module is rapidly cooled through multi-directional air holes, and the positioning device ensures stable clamping and precise adjustment of the workpiece. In addition, the protective atmosphere supply module creates an ideal eutectic environment, the calibration mechanism assists in high-precision positioning, and the air knife ensures clear visual inspection. The present application achieves the purpose of efficient and controllable multi-chip eutectic processing, significantly improves production efficiency and product quality, and optimizes process stability and adaptability.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and more particularly to a multi-chip eutectic heating device and a method for using the same. Background Art

[0002] In the semiconductor packaging field, eutectic soldering technology is widely used to provide high-reliability connections between chips and substrates. Traditional eutectic heating devices typically employ a single temperature control mode, melting and solidifying the solder (such as tin alloy) through continuous heating. However, with the trend toward higher integration and miniaturization of semiconductor devices, and especially the increasing demand for multi-chip packaging, current technology faces challenges in controlling the temperature of the multi-chip eutectic.

[0003] When eutecticizing multiple chips on the same socket, the eutectic temperature requirements of each chip can vary significantly. Traditional equipment typically uses a fixed temperature curve, which cannot quickly switch between heating and cooling. This results in high-temperature chips being exposed to unsuitable temperatures for extended periods, which can easily cause thermal damage to the material or solder oxidation. Continuous heating mode not only consumes a lot of energy, but also requires natural cooling after the high-temperature eutectic is complete, which prolongs the process cycle and makes it difficult to meet the needs of mass production. Summary of the Invention

[0004] In order to solve the problem of temperature control during multi-chip eutectic heating, the present application provides a multi-chip eutectic heating device and a method for using the same.

[0005] On the one hand, the present application provides a multi-chip eutectic heating device, which adopts the following technical solutions:

[0006] A multi-chip eutectic heating device includes:

[0007] eutectic platform;

[0008] A visual eutectic box is provided on the eutectic table, and a first material port and a second material port are provided on the visual eutectic box;

[0009] A heating module, comprising a heating seat and a heating plate connected to one side of the heating seat, wherein the heating seat and the heating plate are both disposed in the visual eutectic box and are disposed near the first material port, the heating seat being provided with a first card slot, the heating plate being provided with a second card slot, and the heating plate being electrically connected to a pulse power supply unit;

[0010] A cooling module includes a cooling seat and an air inlet pipe. The cooling seat is provided with multiple cooling seats along the circumference of the heating seat. The cooling seat is provided with an air inlet cavity and multiple blowing holes connected to the air inlet cavity. The blowing holes are arranged toward the heating seat. The air inlet cavities are connected to each other. Each air inlet cavity is connected to the air inlet pipe, and one end of the air inlet pipe is located outside the visible eutectic box.

[0011] A positioning device is provided on the eutectic table and is used for clamping the product.

[0012] By adopting the above technical solution, the heating module utilizes a pulsed power supply unit in conjunction with a heating plate design, enabling rapid response to varying eutectic temperature requirements, significantly improving the heating rate, reducing energy consumption, and meeting the varying eutectic temperature requirements of a wide range of chips. Compared to traditional constant heating methods, pulse control enables more precise temperature regulation in a short period of time, enhancing the heating module's response speed and accuracy. The cooling module utilizes a cold air purge system consisting of multiple cooling blocks and air inlet ducts to effectively lower the heating block temperature within a short period of time after eutectic formation of a chip, ensuring a rapid transition from high to low temperatures in preparation for the next eutectic formation. A positioning device mounted on the eutectic table securely holds the product, ensuring stability during the eutectic process and improving eutectic quality and success rate. The rational layout and coordinated operation of various components provide a highly efficient solution for simultaneous eutectic formation of multiple chips, improving production efficiency and product quality.

[0013] Optionally, the positioning device includes a positioning plate and a lifting mechanism, and one end of the positioning plate is inserted into the visible eutectic box; the positioning plate is located at one end of the visual eutectic box and gradually shrinks away from the lifting mechanism, and is used to engage with the workpiece, and the lifting mechanism is used to drive the positioning plate to rise and fall.

[0014] By employing this technical solution, the positioning device achieves precise clamping and release of the workpiece. One end of the positioning plate extends into the visible eutectic chamber and engages with the workpiece, ensuring a stable and accurate position during the eutectic process. A lifting mechanism drives the positioning plate up and down, automating the clamping process and improving operational efficiency.

[0015] Optionally, the lifting mechanism includes a lifting seat, a driving cam and a driving source, wherein the lifting seat is slidably connected to one side of the eutectic table, and one end of the lifting seat is connected to the positioning plate; the driving cam is rotatably connected to the eutectic table, the driving source is used to drive the driving cam to rotate, and the driving cam is used to push the lifting seat down;

[0016] The eutectic table is also connected to a reset member, and the reset member is used to pull the lifting seat up.

[0017] By adopting this technical solution, the drive cam rotates, moving it toward the lift seat until it abuts against it, pushing the lift seat down, thereby disengaging the positioning plate from the workpiece and releasing it. Once the drive cam disengages, the reaction force provided by the reset element causes the lift seat to automatically rise and reset, allowing the positioning plate to clamp onto the workpiece and mechanically limit its position. This design reduces the contact force between the positioning plate and the workpiece, effectively reducing mechanical damage to the workpiece while achieving high positioning repeatability and enhancing the stability and reliability of the tube seat fixation during the eutectic process.

[0018] Optionally, a protective atmosphere supply module is further included, which includes an air inlet pipe and a heating pipe that are interconnected, a heating source is provided in the heating pipe, and one end of the air inlet pipe is connected to the visual eutectic box.

[0019] By employing this technical solution, the protective atmosphere supply module provides a controlled protective gas environment within the visible eutectic chamber. The interconnected design of the air inlet and heating pipes heats the protective gas before entering the visible eutectic chamber, ensuring the appropriate gas temperature and preheating the visible eutectic chamber to avoid adverse effects on the eutectic process. This effectively improves the quality and stability of chip soldering during the eutectic process, reduces the occurrence of oxidation and other problems, and thus increases product yield.

[0020] Optionally, a heat insulation seat is provided below the heating seat, and an exhaust hole group is provided on the side wall of the visible eutectic box.

[0021] By adopting this technical solution, the thermal insulation base effectively isolates the heat generated by the heating base from conducting downward, reducing the impact on other components of the device and improving the stability of temperature control. The exhaust hole group is located on the side wall of the visible eutectic box to help quickly exhaust the internal hot air. In conjunction with the cooling module, it accelerates the cooling process, shortens process time, and improves work efficiency.

[0022] Optionally, a calibration mechanism is further included, the calibration mechanism including a laser sensor and a first visual monitor and a second visual monitor, the first visual monitor is fixed above the visual eutectic box, the second visual monitor is fixed to one side of the visual eutectic box, and the laser sensor is movably arranged above the visual eutectic box;

[0023] The eutectic table includes a first compensation mechanism and a carrier base. The visual eutectic box is arranged on the carrier base. The first compensation mechanism includes an X-axis compensation module and a Y-axis compensation module arranged above the X-axis compensation module. The first compensation mechanism is used to drive the carrier base to move in the horizontal direction.

[0024] By adopting the above-mentioned technical solution, the calibration mechanism, combined with the first and second visual monitors and laser sensors, can achieve all-round and precise detection of the tube seat position, ensuring the high accuracy of the chip placement. The first and second visual monitors capture image information from the upper and lower sides respectively, and cooperate with the movable laser sensor to further improve spatial positioning accuracy, effectively reducing the welding defect rate caused by position deviation. At the same time, the X-axis compensation module and the Y-axis compensation module in the first compensation mechanism work together to drive the carrier to perform coarse positioning on the horizontal plane, preliminarily correcting the position error of the workpiece and laying the foundation for subsequent precise positioning, thereby significantly improving the overall reliability and consistency of the eutectic process.

[0025] Optionally, the eutectic table further includes a second compensation mechanism, which is arranged between the first compensation mechanism and the carrier base; the second compensation mechanism includes a left and right swing arc table and a front and rear swing arc table arranged on the left and right swing arc table.

[0026] By adopting the above technical solution, the first compensation mechanism is responsible for coarse adjustment, completing a large range of horizontal movement of the workpiece; on this basis, the second compensation mechanism further introduces left and right swing arc tables and front and back swing arc tables, which can perform more subtle angle and position corrections, thereby significantly improving the flatness and positioning accuracy of the eutectic surface of the tube holder during the eutectic process, ensuring the reliability and consistency of multi-chip welding.

[0027] Optionally, it further includes a cooling air source and an air duct connected to the cooling air source, one end of the air duct is passed through the visible eutectic box and extends to one side of the heating plate.

[0028] By adopting the above technical solution, after the eutectic formation of a chip is completed, the air duct guides the cold medium provided by the cooling air source into the visible eutectic box and accurately delivers it to one side of the heating plate to accelerate the condensation of the solder on the eutectic surface.

[0029] Optionally, the visual eutectic box includes a box body and a window, the box body is provided with an opening at the top, and the window covers the opening of the box body;

[0030] An air knife is also fixed on the carrier base. The air knife is connected to the cooling air source, and the air outlet of the air knife faces the window.

[0031] By adopting the above technical solution, the wind knife can provide a continuous and stable dry cold medium fluid barrier to the window surface, effectively preventing the window from fogging due to temperature differences, thereby ensuring that the imaging clarity of the first visual monitor is not disturbed.

[0032] In another aspect, the present application provides a method for using a multi-chip eutectic heating device, wherein eutectic formation is performed using the multi-chip eutectic heating device, comprising the following steps:

[0033] In the first step, after the workpiece is mounted on the heating base, the positioning device is activated to clamp and fix the workpiece, and then the first compensation mechanism is used to perform a rough horizontal position adjustment operation on the workpiece;

[0034] In the second step, the actual coordinate value is captured by the calibration mechanism and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and the second compensation mechanism is used to perform further position calibration operations on the workpiece;

[0035] In the third step, the chip to be processed is transported to the eutectic surface of the workpiece. The protective atmosphere supply module fills the visible eutectic box with hot nitrogen. Then, the corresponding pulse signal parameters are set according to the characteristics of the chip to be processed, driving the heater to perform a staged temperature increase operation until the specified eutectic temperature range is reached.

[0036] The fourth step is to switch to cooling mode after reaching the predetermined eutectic temperature, and use the cooling module to purge cold nitrogen into the visible eutectic box to implement rapid cooling.

[0037] Step 5: During the cooling phase, wind knives are activated to continuously deliver dry and clean cold medium fluid toward the viewing window, forming a barrier to prevent the intrusion of external humid air and ensure that the imaging clarity of the first visual monitor is not disturbed.

[0038] Step 6: Repeat steps 3 to 5 until a specified number of chips are eutecticized on the workpiece.

[0039] By employing this technical solution, a calibration mechanism captures actual coordinate values, compares them with a standard template, and calculates deviations. Further calibration is performed using a secondary compensation mechanism, achieving micron-level positioning accuracy and significantly improving the success rate and reliability of chip soldering. The protective atmosphere supply module, filled with hot nitrogen, and pulse heating technology not only reduce the risk of oxidation but also precisely control the heating process according to the characteristics of each chip, effectively reducing energy consumption and improving heating efficiency. Rapid cooling using cold nitrogen purges allows for rapid temperature reduction, achieving significant temperature changes in a short period of time and meeting the temperature switching speed requirements for continuous eutectic multi-chip production. An air knife, activated to deliver a dry, clean, cold medium fluid to the viewing window, forms a protective barrier, preventing humidity-induced blurring of the primary visual monitor image and ensuring the accuracy of the entire system. Finally, by looping through these steps, multiple chips were successfully eutecticized on the same workpiece, significantly improving production efficiency and reducing manufacturing costs.

[0040] In summary, this application has at least one of the following beneficial effects:

[0041] 1. In this application, the synergistic effect of pulse heating and cold nitrogen cooling system is used to achieve rapid heating and cooling during the multi-chip eutectic process, solving the different eutectic temperature requirements of different chips and effectively avoiding chip damage or poor welding caused by temperature mismatch;

[0042] 2. In this application, the first compensation mechanism is used to achieve coarse positioning, and the second compensation mechanism is used to achieve fine adjustment, which improves the positioning accuracy of the eutectic surface to the micron level, ensuring the flatness of the eutectic surface of the workpiece and the reliability of chip welding;

[0043] 3. The lifting mechanism in this application is designed with a small contact force to reduce mechanical damage to the workpiece during positioning, while ensuring high repeatability and positioning accuracy, thereby improving the stability of the production process and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a schematic diagram of the overall structure of a multi-chip eutectic heating device according to Example 1 of the present application;

[0045] Figure 2 This is a schematic diagram showing the partial explosion structure of the cooling module in Example 1 of the present application;

[0046] Figure 3 This is a schematic diagram showing the partial explosion structure of the heating module in Example 1 of the present application;

[0047] Figure 4 This is a schematic structural diagram of the tube holder in Example 1 of the present application;

[0048] Figure 5 yes Figure 1 Schematic diagram of the local enlarged structure at A in the middle;

[0049] Explanation of the reference numerals: 1. eutectic table; 11. First compensation mechanism; 111. X-axis compensation module; 112. Y-axis compensation module; 12. Second compensation mechanism; 121. Left-right swing arc table; 122. Front-back swing arc table; 13. Carrier base; 14. Air duct; 15. Air knife; 16. Cooling air source; 2. Visual eutectic box; 21. Box body; 211. First material port; 213. Through port; 212. Exhaust hole group; 22. Window; 221. Second material port; 3. Heating module; 31. Heating seat; 311. First card slot; 32. Heating plate; 321. Second card slot; 33. Insulation seat; 4. Cooling Module; 41. Cooling seat; 411. Blowing hole; 412. Give way channel; 42. Air inlet pipe; 5. Positioning device; 51. Positioning plate; 52. Lifting mechanism; 521. Lifting seat; 522. Driving cam; 523. Driving source; 524. Resetting member; 6. Protective atmosphere supply module; 61. Air inlet pipe; 62. Heating tube; 7. Calibration mechanism; 71. Laser sensor; 72. First visual monitor; 73. Second visual monitor; 8. Tube seat; 81. Round block; 811. Matching notch; 82. Semi-cylinder; 83. Pin; 9. One-dimensional moving mechanism; 91. Movable seat; 92. Power source. DETAILED DESCRIPTION

[0050] The following is combined with Figure 1 —Attachment Figure 5 This application is described in further detail.

[0051] Example 1:

[0052] Reference Figure 1 and Figure 2 The embodiment of the present application provides a multi-chip eutectic heating device, comprising a eutectic table 1, a visual eutectic box 2, a heating module 3, a cooling module 4, and a positioning device 5. The eutectic table 1 carries the main components of the entire device, and the eutectic table 1 includes a connected carrier 13, a second compensation mechanism 12, and a first compensation mechanism 11 from top to bottom. The visual eutectic box 2 is fixed to the top of the carrier 13. The visual eutectic box 2 includes a box body 21 and a window 22. The box body 21 is specifically configured as a rectangular box body 21 with an open top, and the window 22 covers and is fixedly connected to the opening of the box body 21. A first material port 211 is provided on one side of the box body 21 for workpieces to enter and exit the visual eutectic box 2; a second material port 221 is provided on the window 22 for chips to enter. The first material port 211 includes a cross-connected horizontal movable bar hole and a vertical movable bar hole, and the horizontal movable bar hole and the vertical movable bar hole are perpendicular. In other embodiments, the box body 21 and the window 22 can also be made of transparent materials.

[0053] The heating module 3 is responsible for precise pulse heating of the chip; the cooling module 4 can quickly cool the eutectic area; the positioning device 5 is used to fix the workpiece to ensure that it remains stable throughout the eutectic process.

[0054] Reference Figure 2 and Figure 3 The heating module 3 includes a heating seat 31 and a heating plate 32, both of which are located inside the visible eutectic box 2; the heating seat 31 is located on one side of the first material port 211 and is fixedly connected to the inner wall of the visible eutectic box 2 by bolts. A first card slot 311 is provided on the heating seat 31 to guide the chip to be processed into position accurately. A heat insulating seat 33 is also fixed under the heating seat 31 to protect the carrier seat 13. The heating plate 32 is fixed to one side of the heating seat 31, and a second card slot 321 is provided on the heating plate 32. Figure 4 In this embodiment, the active workpiece is a tube base 8, which consists of a circular block 81, a semi-cylinder 82 fixed to one side of the circular block 81, and two pins 83 extending through and fixed to the circular block 81. The eutectic plane lies on the plane of the semi-cylinder 82. When installing the tube base 8 in the visible eutectic box 2, the tube base 8 is inserted into the visible eutectic box 2 along the first inlet 211 and snapped onto the heating base 31. At this point, the circular block 81 snaps into the first slot 311, and the semi-cylinder 82 snaps into the second slot 321. To precisely control the temperature curve, the heating plate 32 is electrically connected to a pulse power supply unit (not shown) via wires. The housing 21 has a through-hole 213, through which the wires pass out of the housing 21. The pulse power supply unit adjusts the frequency and intensity of the current as needed through pulse control, allowing the heating plate 32 to reach a higher temperature quickly, thereby effectively improving the efficiency of heat transfer. Compared to continuous heating, pulse heating can reduce energy waste and improve overall heating efficiency. The pulse heating control mode allows the heating plate 32 to work only when heating is needed, rather than continuously heating, reducing energy waste.

[0055] Reference Figure 2In this embodiment, the cooling module 4 adopts a cold nitrogen purge mechanism. The cooling module 4 includes a cooling seat 41 and an air inlet pipe 42, and multiple cooling seats 41 are arranged around the heating seat 31. In this embodiment, a cooling seat 41 is fixed on both sides and the rear end of the heating seat 31. The three cooling seats 41 include two side cooling seats and one rear end cooling seat, and the side cooling seats and the rear end cooling seats are different in size and shape. An air inlet cavity is processed in each cooling seat 41, and the three air inlet cavities are interconnected; each cooling seat 41 is provided with a blowing hole 411 on the side wall close to the heating seat 31. Each such blowing hole 411 circuit shares the same air inlet cavity network, which can ensure that the high-pressure and low-temperature gas from the external supply pipeline can be evenly distributed to the space around the target area. Each air inlet cavity is connected to an air inlet pipe 42. In this embodiment, all three air inlet pipes 42 are threadedly connected to the rear cooling seat; one air inlet pipe 42 is directly connected to the rear cooling seat's air inlet cavity, while the other two air inlet pipes 42 are indirectly connected to the air inlet cavities of the corresponding side cooling seats through the rear cooling seat's air inlet cavity. In the cooling state, to facilitate the rapid discharge of heat-absorbed nitrogen from the housing 21, exhaust hole groups 212 are also provided on the side walls of the housing 21. Specifically, there are two groups of exhaust hole groups 212, and the exhaust holes within the exhaust hole groups 212 are distributed in a rectangular array on the side walls of the housing 21.

[0056] Reference Figure 2 , a protective atmosphere supply module 6 is also specially provided on the carrier base 13. The protective atmosphere supply module 6 includes two air inlet pipes 61 and a heating pipe 62 connected in series. The air inlet pipe 61 is mainly used to introduce pure protective gas without impurities and pollution components; the heating pipe 62 is equipped with a heating source inside. In this embodiment, the heating source is specifically configured as an electric heating wire, and the electric heating wire is wound in coils inside the heating pipe 62 to maintain a constant and suitable operating temperature range. The end of the air inlet pipe 61 is also directly connected to the box body 21. In this embodiment, nitrogen is directly introduced into the heating pipe 62. Before the heating plate 32 acts, the protective atmosphere supply module 6 is used to input the heated nitrogen into the visible eutectic box 2 to provide a controlled protective gas environment for the eutectic.

[0057] Refer to Figure 1 and Figure 2, a cooling air source, an air duct 14 and an air knife 15 are also fixed on the carrier base 13. In this embodiment, the cooling air source is specifically a liquid nitrogen generation unit. The air duct 14 and the air knife 15 are both connected to the cooling air source. One end of the air duct 14 penetrates into the box body 21 and extends to the side of the heating plate 32. After the eutectic is completed, the air duct 14 guides the cold nitrogen provided by the cooling air source into the inside of the visible eutectic box 2 and accurately delivers it to the side of the heating plate 32 to accelerate the condensation of the solder on the eutectic surface of the tube seat 8. The air knife 15 is located on one side of the box body 21, and the air outlet of the air knife 15 is facing the window 22; when the cooling unit is running, the air knife 15 can provide a continuous and stable dry cold medium fluid barrier to the surface of the window 22, effectively preventing the window 22 from fogging due to temperature difference.

[0058] Reference Figure 5 The positioning device 5 includes a positioning plate 51 and a lifting mechanism 52. One end of the positioning plate 51 extends into the housing 21. The end of the positioning plate 51 that extends into the housing 21 tapers toward the viewing window 22, forming a trapezoidal shape. A mating notch 811 is defined on the circular sidewall of the tube base 8. When the positioning plate 51 slides upward under the drive of the lifting mechanism 52, the end of the positioning plate 51 engages with the mating notch 811, thereby securing the tube base 8.

[0059] Reference Figure 5 The lifting mechanism 52 includes a lifting seat 521, a driving cam 522 and a driving source 523. The lifting seat 521 is slidably connected to the side wall of the carrier base 13 through a slide rail, and one end of the lifting seat 521 is fixedly connected to the positioning plate 51. In this embodiment, the lifting seat 521 is specifically configured as an L-shaped plate. The driving cam 522 is located on one side of the lifting seat 521 and is rotatably connected to the carrier base 13; the driving source 523 is specifically a servo motor, and one end of the output shaft of the driving source 523 is fixed to the driving cam 522 to drive the driving cam 522 to rotate. A reset member 524 is also connected to the carrier base 13. The reset member 524 is specifically a tension spring, one end of which is connected to the carrier base 13 and the other end is fixed to the end of the lifting seat 521.

[0060] The driving source 523 drives the driving cam 522 to rotate, so that when the cam moves downward, the driving cam 522 pushes the bottom of the lifting seat 521 to lower the lifting seat 521; when the driving cam 522 rotates and presents an upward state, the reset member 524 pulls the lifting seat 521 upward, so that the lifting seat 521 slides back to the initial position, thereby realizing the lifting action of the positioning plate 51.

[0061] Reference Figure 1The first compensation mechanism 11 includes an X-axis compensation module 111 and a Y-axis compensation module 112. In the present embodiment, both the X-axis compensation module 111 and the Y-axis compensation module 112 use ball screw linear slide modules. The X-axis compensation module 111 is located at the bottom, and the guide rail in the Y-axis compensation module 112 is fixedly connected to the slide of the X-axis compensation module 111. The second compensation mechanism 12 includes a left and right swing arc table 121 and a front and rear swing arc table 122 fixed on the left and right swing arc table 121, and the carrier base 13 is fixed above the front and rear swing arc table 122. In the present embodiment, both the left and right swing arc table 121 and the front and rear swing arc table 122 use electric swing arc tables.

[0062] Reference Figure 1 and Figure 2 To ensure accurate operation of the first compensation mechanism 11 and the second compensation mechanism 12, an adjustment and calibration mechanism 7 is also provided. The calibration mechanism 7 comprises a laser sensor 71 and a first visual monitor 72 and a second visual monitor 73. The first visual monitor 72 is fixed above the visual eutectic box 2, while the second visual monitor 73 is fixed to the side of the visual eutectic box 2. A clearance channel 412 is also provided on the end surface of the rear cooling seat to provide a sufficient field of view for the second visual monitor 73 to monitor the tube seat 8. A one-dimensional motion mechanism 9 is fixed to one side of the eutectic table 1. The one-dimensional motion mechanism 9 comprises a movable seat 91 and a power source 92. The laser sensor 71 is fixed to the movable seat 91 and is located between the first visual monitor 72 and the visual eutectic box 2. In this embodiment, both the first and second visual monitors 72 and 73 are CCD cameras, and the power source 92 is an electric cylinder. One end of the telescopic rod of the power source 92 is directly fixed to the movable seat 91. In other embodiments, the one-dimensional motion mechanism 9 can be replaced with a two-dimensional motion mechanism or a three-dimensional motion mechanism.

[0063] Calibration mechanism 7 captures the actual coordinates of tube holder 8, compares and analyzes them with a standard template, and calculates the deviation feedback as a reference for subsequent precise positioning. First and second compensation mechanisms 11, 12 are then used to perform a two-step position calibration operation on the workpiece. This significantly improves positioning accuracy, adapts to the needs of different workstations, and ensures precise alignment of chips on the eutectic surface. The addition of calibration mechanism 7 greatly enhances the system's flexibility and accuracy, enabling precise positioning and rapid adjustment even in complex working environments, thereby better meeting diverse needs.

[0064] During actual use, a tube seat loading and unloading device (not shown in the figure) and multiple chip loading devices (not shown in the figure) can also be configured on the side of the eutectic table 1 to realize automatic loading and unloading and loading of the tube seat 8, as well as automatic loading of multiple chips.

[0065] The implementation principle of a multi-chip eutectic heating device according to an embodiment of the present application is as follows: nitrogen is introduced into the air inlet pipe 61 of the protective atmosphere supply module 6 and preheated to 150°C; the laser sensor 71 and the CCD camera are calibrated to ensure that the calibration mechanism 7 is aligned with the eutectic position. The electric heating wire in the heating tube 62 is turned on, and preheated nitrogen is continuously input into the visual eutectic box 2 to maintain the positive pressure inert environment in the visual eutectic box 2. The tube seat 8 loading and unloading device is started, and the tube seat 8 is sent into the visual eutectic box 2 through the first material port 211, so that the tube seat 8 is smoothly engaged with the heating seat 31 and the heating plate 32. The lifting mechanism 52 drives the positioning plate 51 to rise, and the end of the positioning plate 51 is engaged with the matching notch 811 of the tube seat 8 to complete the mechanical limit; the laser sensor 71 and the two CCD cameras scan the position of the tube seat 8, the first compensation mechanism 11 makes a rough adjustment, and the second compensation mechanism 12 makes a fine adjustment to ensure that the flatness of the eutectic surface on the tube seat 8 is ≤5μm.

[0066] Subsequently, the chip loading device delivers the chip into the visual eutectic box 2 through the second feed port 221 and places it on the eutectic surface of the tube holder 8. The pulse parameters are set according to the chip temperature requirements: the heating plate 32 is powered on to increase the temperature, and the pulse duty cycle is adjusted in real time to control the temperature fluctuation within ±1°C.

[0067] After eutectic formation is complete, the cooling air source releases liquid nitrogen, which is transported to the air inlet chamber of the cooling seat 41 through the air inlet pipe 42 and evenly blown toward the sides of the heating seat 31 through the air blowing holes 411; the exhaust hole group 212 discharges the nitrogen that has absorbed heat. The wind knife 15 simultaneously blows cold nitrogen onto the surface of the window 22, forming a dry airflow barrier to prevent fogging due to temperature differences. The same heating and cooling operations are performed on subsequent chips in sequence, and the pulse parameters are adjusted to adapt to different temperature requirements; after eutectic formation of each chip, the calibration mechanism 7 rescans the position of the tube seat 8, and the compensation mechanism dynamically corrects the deviation. After eutectic formation is complete, the lifting mechanism 52 is reset, and the positioning plate 51 is separated from the tube seat 8; the tube seat 8 loading and unloading device moves the finished product out of the visual eutectic box 2 through the first material port 211.

[0068] Example 2:

[0069] The present application provides a method for using a multi-chip eutectic heating device, wherein eutectic formation is performed using the multi-chip eutectic heating device in Example 1, including the following steps:

[0070] In the first step, after the workpiece is installed on the heating seat 31, the positioning device 5 is started to clamp and fix the workpiece. The actual coordinate value is captured by the first visual monitor 72 in the calibration mechanism 7 and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning. The first compensation mechanism 11 is used to complete the rough position adjustment operation of the workpiece in the horizontal direction.

[0071] In the second step, with the help of the second visual monitor 73 and laser sensor 71 in the calibration mechanism 7, the actual coordinate value is captured and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and the second compensation mechanism 12 is used to perform further position calibration operations on the workpiece.

[0072] In the third step, the chip to be processed is transported to the eutectic surface of the workpiece, and the visible eutectic box 2 is filled with hot nitrogen through the protective atmosphere supply module 6. Then, the corresponding pulse signal parameters are set according to the characteristics of the chip to be processed to drive the heating plate 32 to perform a phased heating operation until the specified eutectic temperature range is reached.

[0073] The fourth step is to switch to the cooling mode after reaching the predetermined eutectic temperature, and to purge the visible eutectic box 2 with cold nitrogen through the cooling module 4 to implement a rapid cooling action.

[0074] The fifth step is to start the wind knife 15 synchronously during the cooling stage to continuously deliver dry and clean cold medium fluid toward the viewing window 22 to form a barrier to prevent the invasion of external wet air and ensure that the imaging clarity of the first visual monitor 72 is not disturbed.

[0075] Step 6: Repeat steps 3 to 5 until a specified number of chips are eutecticized on the workpiece.

[0076] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A multi-chip eutectic heating device, characterized in that: include: Eutectic platform (1); A visual eutectic box (2) is arranged on the eutectic table (1), and a first material opening (211) and a second material opening (221) are provided on the visual eutectic box (2); an exhaust hole group (212) is provided on the side wall of the visual eutectic box (2), and the exhaust holes in the exhaust hole group (212) are distributed in a rectangular array on the side wall of the box body (21); A heating module (3) comprising a heating seat (31) and a heating plate (32) connected to one side of the heating seat (31), wherein the heating seat (31) and the heating plate (32) are both arranged in the visual eutectic box (2), and the heating seat (31) and the heating plate (32) are arranged close to the first material port (211), the heating seat (31) is provided with a first card slot (311), the heating plate (32) is provided with a second card slot (321), and the heating plate (32) is electrically connected to a pulse power supply unit; A cooling module (4) comprises a cooling seat (41) and an air inlet pipe (42), wherein a plurality of cooling seats (41) are provided along the circumference of the heating seat (31), and an air inlet cavity and a plurality of blowing holes (411) connected to the air inlet cavity are provided on the cooling seat (41), wherein the blowing holes (411) are arranged toward the heating seat (31), and the air inlet cavities are connected to each other; each air inlet cavity is connected to the air inlet pipe (42), and one end of the air inlet pipe (42) is located outside the visible eutectic box (2); A cooling seat (41) is fixed on both sides and the rear end of the heating seat (31), and the three cooling seats (41) include two side cooling seats and one rear end cooling seat; the exhaust hole groups (212) are specifically provided in two groups, one exhaust hole group (212) corresponds to one side cooling seat, and the projection of the side cooling seat on the side wall of the adjacent box (21) can cover the corresponding exhaust hole group (212); A positioning device (5) is provided on the eutectic table (1) and is used for clamping the product.

2. The multi-chip eutectic heating device according to claim 1, characterized in that: The positioning device (5) comprises a positioning plate (51) and a lifting mechanism (52), wherein one end of the positioning plate (51) is inserted into the visual eutectic box (2); the positioning plate (51) is located at one end of the visual eutectic box (2) and gradually shrinks in a direction away from the lifting mechanism (52), and is used for engaging with a workpiece, and the lifting mechanism (52) is used for driving the positioning plate (51) to move up and down.

3. The multi-chip eutectic heating device according to claim 2, characterized in that: The lifting mechanism (52) includes a lifting seat (521), a driving cam (522) and a driving source (523); the lifting seat (521) is slidably connected to one side of the eutectic table (1), and one end of the lifting seat (521) is connected to the positioning plate (51); the driving cam (522) is rotatably connected to the eutectic table (1), the driving source (523) is used to drive the driving cam (522) to rotate, and the driving cam (522) is used to push the lifting seat (521) to descend; The eutectic table (1) is further connected to a reset member (524), and the reset member (524) is used to pull the lifting seat (521) upward.

4. The multi-chip eutectic heating device according to claim 1, characterized in that: It also includes a protective atmosphere supply module (6), the protective atmosphere supply module (6) including an air inlet pipe (61) and a heating pipe (62) that are connected to each other, a heating source is provided in the heating pipe (62), and one end of the air inlet pipe (61) is connected to the visual eutectic box (2).

5. The multi-chip eutectic heating device according to claim 1, characterized in that: A heat insulation seat (33) is provided below the heating seat (31).

6. The multi-chip eutectic heating device according to claim 3, characterized in that: The device further comprises a calibration mechanism (7), wherein the calibration mechanism (7) comprises a laser sensor (71), a first visual monitor (72), and a second visual monitor (73), wherein the first visual monitor (72) is fixed above the visual eutectic box (2), the second visual monitor (73) is fixed to one side of the visual eutectic box (2), and the laser sensor (71) is movably arranged above the visual eutectic box (2); The eutectic table (1) includes a first compensation mechanism (11) and a carrier base (13); the visual eutectic box (2) is arranged on the carrier base (13); the first compensation mechanism (11) includes an X-axis compensation module (111) and a Y-axis compensation module (112) arranged above the X-axis compensation module (111); the first compensation mechanism (11) is used to drive the carrier base (13) to move in a horizontal direction.

7. The multi-chip eutectic heating device according to claim 6, characterized in that: The eutectic table (1) further includes a second compensation mechanism (12), which is arranged between the first compensation mechanism (11) and the object carrier (13); the second compensation mechanism (12) includes a left and right swing arc table (121) and a front and rear swing arc table (122) arranged on the left and right swing arc table (121).

8. The multi-chip eutectic heating device according to claim 7, characterized in that: It also includes a cooling air source (16) and an air duct (14) connected to the cooling air source (16), one end of the air duct (14) is passed through the visible eutectic box (2) and extends to one side of the heating plate (32).

9. The multi-chip eutectic heating device according to claim 8, characterized in that: The visual eutectic box (2) comprises a box body (21) and a viewing window (22); the box body (21) is provided with an opening at the top, and the viewing window (22) covers the opening of the box body (21); A wind knife (15) is also fixed on the carrier base (13), the wind knife (15) is connected to the cooling air source (16), and the air outlet of the wind knife (15) faces the window (22).

10. A method for using a multi-chip eutectic heating device, characterized in that: Eutectic heating using the multi-chip eutectic heating device according to claim 9 comprises the following steps: In the first step, after the workpiece is mounted on the heating seat (31), the positioning device (5) is activated to clamp and fix the workpiece, and then the first compensation mechanism (11) is used to perform a rough position adjustment operation of the workpiece in the horizontal direction; In the second step, the actual coordinate value is captured by the calibration mechanism (7) and compared with the standard template to calculate the deviation feedback as a reference for subsequent precise positioning, and the second compensation mechanism (12) is used to perform further position calibration operations on the workpiece; The third step is to transport the chip to be processed to the eutectic surface of the workpiece, fill the visible eutectic box (2) with hot nitrogen through the protective atmosphere supply module (6), and then set the corresponding pulse signal parameters according to the characteristics of the chip to be processed to drive the heating plate (32) to perform a staged temperature increase operation until the specified eutectic temperature range is reached; The fourth step is to switch to the cooling mode after reaching the predetermined eutectic temperature, and to purge the visible eutectic box (2) with cold nitrogen through the cooling module (4) to implement a rapid cooling action; Step 5: When in the cooling stage, the wind knife (15) is synchronously started to continuously deliver dry and clean cold medium fluid toward the window (22) to form a barrier to prevent external wet air from invading and ensure that the imaging clarity of the first visual monitor (72) is not disturbed; Step 6: Repeat steps 3 to 5 until a specified number of chips are eutecticized on the workpiece.

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