A positioning device for a semiconductor wafer

Abstract

The present invention belongs to the technical field of semiconductor production, and discloses a positioning device for a semiconductor wafer, including a silicon wafer and a carrying mechanism. A positioning edge is provided on the silicon wafer. The carrying mechanism includes a carrier for placing the silicon wafer, and the carrier is fixedly connected to a base. It further includes a centering mechanism and a positioning mechanism. In the present invention, after the silicon wafer is placed on the carrying mechanism, the first motor is started to center the silicon wafer. Then, the second motor is started to drive the silicon wafer to rotate through a rubber roller. As the positioning edge contacts the stop plate, the front side of the stop plate abuts against the linear side where the positioning edge is located. The above design makes the orientation of the positioning edge of each silicon wafer finally consistent, so that when subsequent devices such as a robotic arm transfer the silicon wafer to a lithography device, the silicon wafer can be directly placed at a designated position on the wafer stage, thereby reducing the time required for multiple positioning calibrations in subsequent lithography steps.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and specifically relates to a positioning device for semiconductor wafers. Background Art

[0002] After a silicon ingot undergoes grinding, polishing, and slicing, a silicon wafer, i.e., a semiconductor wafer, is formed. After the grinding of the silicon ingot is completed, a flat surface is also ground on the silicon rod so that the cut silicon wafer has a positioning edge. This positioning edge plays a role in initial positioning and calibration in subsequent lithography steps. At the same time, the positioning edge can also distinguish the type and crystal orientation of the silicon wafer. After the ground and cleaned silicon wafer is sent into the lithography equipment, the wafer stage of the lithography equipment will identify the positioning edge on the silicon wafer through a vision system, thereby controlling the movement and rotation of the wafer stage so that the lithography head can accurately perform lithography on the wafer.

[0003] However, when the existing wafer positioning equipment positions the wafer, it often only makes the center of the wafer coincide with the center of the carrier stage of the positioning mechanism, while the orientations of the positioning edges of the wafers are different. This results in the need to identify and position the wafer in subsequent lithography steps. When a large number of wafers are lithographed, these identification and positioning steps will accumulate and waste a large amount of time, thus affecting the overall production efficiency of this batch. At the same time, after long-term use, the wafer stage is still prone to problems such as mechanical wear, resulting in a decrease in positioning accuracy, thereby affecting the positioning accuracy of the lithography step. Summary of the Invention

[0004] The purpose of the present invention is to provide a positioning device for semiconductor wafers to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A positioning device for semiconductor wafers, including a silicon wafer and a bearing mechanism. A positioning edge is provided on the silicon wafer. The bearing mechanism includes a carrier stage for placing the silicon wafer. The carrier stage is fixedly connected to a base, and further includes:

[0006] A centering mechanism, the centering mechanism includes a center frame and a plurality of side frames symmetrically fixed on the side of the center frame. A first sliding groove is provided on the top surface of the side frame. A positioning mechanism is arranged in the first sliding groove of one side frame, and a first slider is slidably connected in the first sliding grooves of the remaining side frames. A lead screw is rotatably installed inside the side frame to drive the positioning mechanism and the first slider to gather and disperse;

[0007] The positioning mechanism includes a second slider slidably connected in the first chute. A second motor is embedded inside the second slider. The top surface of the second slider is fixedly connected to a first frame. The output shaft of the second motor is fixedly sleeved with a rubber roller located inside the first frame. One side of the first frame is fixedly connected to a second frame. A stop plate is rotatably installed inside the first frame. A torsion spring is arranged between the stop plate and the first frame to make the stop plate rotate towards the center of the silicon wafer. A buffer pad abutted against the front side of the stop plate is fixedly connected to the side surface of the second frame.

[0008] Preferably, the loading mechanism further includes hinge plates hinged to the side surface of the loading platform. There are multiple hinge plates. A telescopic rod is hingedly installed between the bottom surface of the hinge plate and the base. Multiple suction cups are fixedly connected to the top surface of the hinge plate.

[0009] Preferably, the loading platform is a hollow structure with an open top. A loading plate is rotatably installed on the top surface of the loading platform. Multiple through holes are formed on the top surface of the loading plate. A sliding plate is movably connected inside the loading platform. Multiple mounting columns are fixedly connected to the top surface of the sliding plate and balls are embedded at the top ends of the mounting columns. A flat hydraulic cylinder is fixedly connected to the bottom surface of the loading platform. The telescopic end of the flat hydraulic cylinder abuts against the bottom surface of the sliding plate.

[0010] Preferably, a fixed rod is fixedly connected to the top surface of the first slider. A passive roller is rotatably installed on the outer side surface of the fixed rod.

[0011] Preferably, one end of the lead screw penetrates through the side surface of the center frame and extends in. A small gear is fixedly sleeved on the circumferential surface of the lead screw extending into the center frame.

[0012] Preferably, a first motor is fixedly connected inside the center frame. The output shaft of the first motor is fixedly sleeved with a large gear. The large gear meshes with the small gear and their axes are perpendicular.

[0013] Preferably, when the first slider and the second slider slide to the point closest to the loading mechanism, the rubber roller and the passive roller are tangent to the circumferential side surface of the silicon wafer.

[0014] Preferably, when the front side of the stop plate abuts against the buffer pad, the front side of the stop plate also abuts against the positioning edge.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. In the present invention, through the setting of the centering mechanism and the positioning mechanism, after using a transfer tool such as a manipulator to place the silicon wafer on the carrier plate of the carrier mechanism, the first motor is started to drive the screw rod to rotate. At this time, the first slider and the second slider move towards the center of the carrier mechanism, so that the center of the silicon wafer and the center of the carrier mechanism are in the same vertical direction. Then the second motor is started. At this time, the second motor drives the rubber roller to rotate, and the rubber roller drives the silicon wafer to rotate. As the silicon wafer rotates, when the arc side of the silicon wafer contacts the stop plate, the stop plate will be pushed into the second frame, and at this time the silicon wafer remains in contact with the rubber roller. As the silicon wafer rotates, its positioning edge contacts the stop plate. At this time, the stop plate is driven by the torsion spring and rotates towards the center of the silicon wafer, so that the front side of the stop plate abuts against the straight side where the positioning edge is located. At the same time, because the positioning edge faces the stop plate, the rubber roller no longer contacts the silicon wafer, so that the silicon wafer is no longer driven by the rotation of the rubber roller to continue rotating. Through the setting of the above structure, not only the center of each silicon wafer placed on the carrier mechanism and the center of the carrier mechanism are on the same vertical line, but also the orientation of the final positioning edge of each silicon wafer is kept consistent, so that when subsequent devices such as robotic arms transfer the silicon wafer to the lithography equipment, the silicon wafer can be directly placed at the designated position on the wafer stage, thus reducing the time required for multiple positioning calibrations in subsequent lithography steps.

[0017] 2. Secondly, when the stop plate contacts the silicon wafer and is pushed by the silicon wafer and rotates in a direction away from the center of the silicon wafer, the torsion spring stores energy. As the silicon wafer is driven by the rubber roller to rotate, after the positioning edge of the silicon wafer starts to contact the stop plate, the torsion spring releases the energy it has stored. At this time, the stop plate is driven to rotate towards the center of the silicon wafer, so that the part of the stop plate in contact with the positioning edge pushes the silicon wafer to continue rotating. After the positioning edge and the front side of the stop plate are completely abutted, the stop plate stops the silicon wafer. Through the setting of the buffer pad, it is avoided that when the torsion spring drives the stop plate to rotate, an overshoot phenomenon occurs, resulting in the silicon wafer being squeezed by the stop plate and deformed and broken.

[0018] 3. Finally, after the silicon wafer is placed on the carrier mechanism, the bottom surface of the silicon wafer makes point contact with the ball. Thus, when the subsequent centering mechanism and positioning mechanism drive the silicon wafer to slide and rotate, the contact area between the silicon wafer and the carrier mechanism is reduced, and the probability of the bottom surface of the silicon wafer being scratched is lowered. At the same time, after the silicon wafer is positioned by the stop plate, the telescopic rod is started, so that the hinged plate rotates from the vertical state to the horizontal state. At this time, the suction cup on the top surface of the hinged plate adsorbs on the bottom surface of the silicon wafer. At the same time, the flat hydraulic cylinder retracts. At this time, the sliding plate slides downward, so that the top of the ball no longer contacts the bottom surface of the silicon wafer, thus fixing the silicon wafer on the carrier mechanism and avoiding the vibration during the process of the screw rod rotating in the reverse direction and the first slider and the second slider returning, which may cause the silicon wafer to be misaligned and the positioning of the silicon wafer to be damaged. Description of the Drawings

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of the wafer and the positioning edge of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the carrying mechanism of the present invention;

[0022] Figure 4 This is a schematic diagram of the sectional structure of the stage of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of the centering mechanism of the present invention;

[0024] Figure 6 This is a schematic diagram of the sectional structure of the center frame and the side frame of the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the positioning mechanism of the present invention when positioning the wafer;

[0026] Figure 8 This is a schematic diagram of the structure of the positioning mechanism of the present invention when the wafer is not positioned.

[0027] In the figure: 1, silicon wafer; 11, positioning edge; 2, carrying mechanism; 21, base; 22, stage; 23, hinge plate; 24, telescopic rod; 25, suction cup; 26, carrier plate; 27, through hole; 28, sliding plate; 29, ball; 210, flat hydraulic cylinder; 3, centering mechanism; 31, center frame; 32, side frame; 33, first chute; 34, first slider; 35, lead screw; 36, fixed rod; 37, passive roller; 38, pinion; 39, large gear; 310, first motor; 4, positioning mechanism; 41, second slider; 42, second motor; 43, first frame; 44, rubber roller; 45, second frame; 46, stop plate; 47, buffer pad; 48, torsion spring. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] As Figures 1 to 8 shown, the embodiment of the present invention provides a positioning device for a semiconductor wafer, including a silicon wafer 1 and a carrying mechanism 2. A positioning edge 11 is provided on the silicon wafer 1. The carrying mechanism 2 includes a stage 22 for placing the silicon wafer 1. The stage 22 is fixedly connected to the base 21, and further includes:

[0030] Centering mechanism 3, the centering mechanism 3 includes a center rest 31 and a plurality of side rests 32 symmetrically fixed on the side of the center rest 31. A first chute 33 is provided on the top surface of the side rest 32. A positioning mechanism 4 is arranged in the first chute 33 of one side rest 32, and a first slider 34 is slidably connected in the first chute 33 of the remaining side rests 32. A lead screw 35 is rotatably installed inside the side rest 32 to drive the positioning mechanism 4 and the first slider 34 to gather and disperse;

[0031] The positioning mechanism 4 includes a second slider 41 slidably connected in the first chute 33. A second motor 42 is embedded inside the second slider 41. The top surface of the second slider 41 is fixedly connected to a first frame 43. The output shaft of the second motor 42 is fixedly sleeved with a rubber roller 44 located inside the first frame 43. One side of the first frame 43 is fixedly connected to a second frame 45. A stop plate 46 is rotatably installed inside the first frame 43. A torsion spring 48 is arranged between the stop plate 46 and the first frame 43 to make the stop plate 46 rotate towards the center of the silicon wafer 1. A buffer pad 47 in contact with the front side of the stop plate 46 is fixedly connected to the side surface of the second frame 45.

[0032] In the present invention, through the setting of the centering mechanism 3 and the positioning mechanism 4, after using a transfer tool such as a manipulator to place the silicon wafer 1 on the carrier plate 26 of the carrier mechanism 2, the first motor 310 is started to drive the lead screw 35 to rotate. At this time, the first slider 34 and the second slider 41 move towards the center of the carrier mechanism 2, so that the center of the silicon wafer 1 and the center of the carrier mechanism 2 are in the same vertical direction. Then the second motor 42 is started. At this time, the second motor 42 drives the rubber roller 44 to rotate, and the rubber roller 44 drives the silicon wafer 1 to rotate. As the silicon wafer 1 rotates, when the arc side surface of the silicon wafer 1 contacts the stop plate 46, the stop plate 46 will be pushed into the second frame 45, and at this time the silicon wafer 1 remains in contact with the rubber roller 44. As the silicon wafer 1 rotates, its positioning edge 11 contacts the stop plate 46. At this time, the stop plate 46 is driven by the torsion spring 48 and rotates towards the center of the silicon wafer 1, so that the front side surface of the stop plate 46 abuts against the linear side surface where the positioning edge 11 is located. At the same time, because the positioning edge 11 faces the stop plate 46, the rubber roller 44 no longer contacts the silicon wafer 1, so that the silicon wafer 1 is no longer driven by the rotation of the rubber roller 44 to continue rotating. Through the setting of the above structure, not only the center of each silicon wafer 1 placed on the carrier mechanism 2 is on the same vertical line as the center of the carrier mechanism 2, but also the orientation of the final positioning edge 11 of each silicon wafer 1 is kept consistent, so that when subsequent devices such as a robotic arm transfer the silicon wafer 1 to a lithography device, the silicon wafer 1 can be directly placed at the designated position on the wafer stage, thereby reducing the time required for multiple positioning calibrations in subsequent lithography steps.

[0033] Secondly, when the stop plate 46 contacts the silicon wafer 1 and is pushed by the silicon wafer 1 to rotate away from the center of the silicon wafer 1, the torsion spring 48 stores energy. As the silicon wafer 1 is driven to rotate by the rubber roller 44, after the positioning edge 11 of the silicon wafer 1 starts to contact the stop plate 46, the torsion spring 48 releases the energy it has stored. At this time, the stop plate 46 is driven to rotate towards the center of the silicon wafer 1, so as to push the silicon wafer 1 to continue rotating through the part where the stop plate 46 contacts the positioning edge 11. After the positioning edge 11 is completely abutted against the front side of the stop plate 46, the stop plate 46 stops the silicon wafer 1. By means of the buffer pad 47 provided, it is avoided that when the torsion spring 48 drives the stop plate 46 to rotate, an overshoot phenomenon occurs, resulting in the silicon wafer 1 being squeezed by the stop plate 46 and deformed and cracked.

[0034] Finally, after the silicon wafer 1 is placed on the bearing mechanism 2, the bottom surface of the silicon wafer 1 makes point contact with the ball 29. Thus, when the subsequent centering mechanism 3 and positioning mechanism 4 drive the silicon wafer 1 to slide and rotate, the contact area between the silicon wafer 1 and the bearing mechanism 2 is reduced, and the probability of the bottom surface of the silicon wafer 1 being scratched is lowered. At the same time, after the silicon wafer 1 is positioned by the stop plate 46, the telescopic rod 24 is started, so that the hinged plate 23 rotates from the vertical state to the horizontal state. At this time, the suction cup 25 on the top surface of the hinged plate 23 adsorbs on the bottom surface of the silicon wafer 1. At the same time, the flat hydraulic cylinder 210 retracts. At this time, the sliding plate 28 slides downward, so that the top end of the ball 29 no longer contacts the bottom surface of the silicon wafer 1, thereby fixing the silicon wafer 1 on the bearing mechanism 2 and avoiding the vibration during the process of the lead screw 35 rotating reversely to make the first slider 34 and the second slider 41 return, and avoiding the positioning of the silicon wafer 1 being damaged.

[0035] As Figures 2 to 3 shown, the bearing mechanism 2 further includes a hinged plate 23 hinged to the side surface of the loading platform 22. There are multiple hinged plates 23. A telescopic rod 24 is hingedly installed between the bottom surface of the hinged plate 23 and the base 21. Multiple suction cups 25 are fixedly connected to the top surface of the hinged plate 23.

[0036] After the centering mechanism 3 and the positioning mechanism 4 complete the positioning of the silicon wafer 1, by driving the telescopic rod 24 to extend, the hinged plate 23 is attached to the bottom surface of the silicon wafer 1. At this time, the suction cup 25 adsorbs on the bottom surface of the silicon wafer 1, thereby fixing the silicon wafer 1 on the bearing mechanism 2, so that when the subsequent robotic arm clamps the silicon wafer 1, the silicon wafer 1 is in the specified position.

[0037] As Figure 3 and Figure 4As shown, the loading platform 22 is a hollow structure with an open top. A loading plate 26 is rotatably mounted on the top surface of the loading platform 22. A plurality of through holes 27 are provided on the top surface of the loading plate 26. A sliding plate 28 is movably connected inside the loading platform 22. A plurality of mounting columns are fixedly connected to the top surface of the sliding plate 28, and balls 29 are embedded in the top surfaces of the mounting columns. A flat hydraulic cylinder 210 is fixedly connected to the bottom surface of the loading platform 22, and the telescopic end of the flat hydraulic cylinder 210 abuts against the bottom surface of the sliding plate 28.

[0038] The top of the ball 29 is higher than the top surface of the carrier plate 26, so that after the silicon wafer 1 is placed on the carrier mechanism 2, there is multi-point contact between the silicon wafer 1 and the carrier mechanism 2, preventing the silicon wafer 1 from being scratched by particles on the top surface of the carrier plate 26 during the process of being driven to slide and rotate by the centering mechanism 3 and the positioning mechanism 4, thereby ensuring the quality of the silicon wafer 1.

[0039] like Figure 5 and Figure 6 As shown, the top surface of the first slider 34 is fixedly connected to a fixing rod 36, and a passive roller 37 is rotatably installed on the outer side of the fixing rod 36. One end of the screw rod 35 passes through the side of the center frame 31 and extends into it. The screw rod 35 extends into the circumferential surface of the center frame 31 and is fixedly sleeved with a small gear 38. The interior of the center frame 31 is fixedly connected to the first motor 310, and the output shaft of the first motor 310 is fixedly sleeved with a large gear 39. The large gear 39 and the small gear 38 are meshed with each other and the axes are perpendicular.

[0040] As the first motor 310 is started, the large gear 39 rotates and drives the screw 35 to rotate through multiple meshing small gears 38. At this time, the first slider 34 and the second slider 41 are driven by the screw 35 to move, and the silicon wafer 1 is pushed through the passive roller 37 and the rubber roller 44, thereby centering the silicon wafer 1.

[0041] When the first slider 34 and the second slider 41 slide to the closest point to the supporting mechanism 2 , the rubber roller 44 and the passive roller 37 are tangent to the circumferential side surface of the silicon wafer 1 .

[0042] When the rubber roller 44 is tangent to the circumferential side of the silicon wafer 1, when the positioning edge 11 faces the rubber roller 44, the rubber roller 44 and the silicon wafer 1 are no longer in contact. At this time, even if the rubber roller 44 rotates, it cannot drive the silicon wafer 1 to rotate, thereby ensuring that when the silicon wafer 1 is supported by the stop plate 46, it will no longer be subjected to the force exerted by the rubber roller 44, thereby preventing the silicon wafer 1 from being broken due to the force exerted by the rubber roller 44 when it is stationary.

[0043] like Figure 1 and Figure 7 As shown, when the front side of the stop plate 46 abuts against the buffer pad 47 , the front side of the stop plate 46 also abuts against the positioning edge 11 .

[0044] Working principle:

[0045] When using the device to position the silicon wafer 1, first place the silicon wafer 1 on the bearing mechanism 2. At this time, the silicon wafer 1 is supported by the balls 29. Then start the first motor 310, drive the lead screw 35 to rotate through the large gear 39 and the small gear 38, and then drive the first slider 34 and the second slider 41 to slide towards the center of the bearing mechanism 2. As the first slider 34 and the second slider 41 slide, the silicon wafer 1 is pushed by the rubber roller 44 and the passive roller 37 to be in the same vertical line with the center of the bearing mechanism 2, so that the silicon wafer 1 is centered.

[0046] After the silicon wafer 1 is centered, start the second motor 42 to drive the rubber roller 44 to rotate. At this time, the rubber roller 44 drives the silicon wafer 1 to rotate. As the silicon wafer 1 rotates, when the positioning edge 11 contacts the stop plate 46, the front side of the stop plate 46 abuts against the side where the positioning edge 11 of the silicon wafer 1 is located. At this time, the silicon wafer 1 cannot rotate. At the same time, when the positioning edge 11 faces the stop plate 46, the silicon wafer 1 no longer contacts the rubber roller 44 and thus will not be continuously driven to rotate. At this time, the orientation of the positioning edge 11 of each silicon wafer 1 placed on the bearing mechanism 2 is the same, so that the silicon wafer 1 is accurately positioned.

[0047] After the positioning of the silicon wafer 1 is completed, start the telescopic rod 24 to make the suction cup 25 on the hinge plate 23 adsorb on the bottom surface of the silicon wafer 1, so as to fix the silicon wafer 1 on the bearing mechanism 2 and avoid the vibration generated during the return process of the first slider 34 and the second slider 41 from affecting the positioning effect of the silicon wafer 1.

[0048] When the suction cup 25 adsorbs on the bottom surface of the silicon wafer 1, drive the flat hydraulic cylinder 210 to retract, so that the balls 29 sink into the through holes 27 opened on the carrier plate 26, so that the bottom surface of the silicon wafer 1 abuts against the top surface of the carrier plate 26, further ensuring the stability of the silicon wafer 1 before it is taken away.

[0049] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0050] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A positioning device for a semiconductor wafer, comprising a silicon wafer (1) and a carrying mechanism (2). A positioning edge (11) is provided on the silicon wafer (1). The carrying mechanism (2) includes a carrier table (22) for placing the silicon wafer (1), and the carrier table (22) is fixedly connected to a base (21), characterized in that, It further includes: a centering mechanism (3), the centering mechanism (3) includes a center rest (31) and a plurality of side frames (32) symmetrically fixed on the side surface of the center rest (31). A first chute (33) is formed on the top surface of the side frame (32). A positioning mechanism (4) is arranged in the first chute (33) of one side frame (32), and a first slider (34) is slidably connected in the first chute (33) of the remaining side frames (32). A lead screw (35) is rotatably installed inside the side frame (32) to drive the positioning mechanism (4) and the first slider (34) to gather and disperse; the positioning mechanism (4) includes a second slider (41) slidably connected in the first chute (33). A second motor (42) is embedded inside the second slider (41). A first frame (43) is fixedly connected to the top surface of the second slider (41). An output shaft of the second motor (42) is fixedly sleeved with a rubber roller (44) located inside the first frame (43). A second frame (45) is fixedly connected to one side of the first frame (43). A stop plate (46) is rotatably installed inside the first frame (43). A torsion spring (48) is arranged between the stop plate (46) and the first frame (43) to make the stop plate (46) rotate towards the center of the silicon wafer (1). A buffer pad (47) in contact with the front side surface of the stop plate (46) is fixedly connected to the side surface of the second frame (45).

2. The positioning device for a semiconductor wafer according to claim 1, characterized in that: The carrying mechanism (2) further includes a hinge plate (23) hinged to the side surface of the carrier table (22). A plurality of hinge plates (23) are provided. An expansion link (24) is hingedly installed between the bottom surface of the hinge plate (23) and the base (21). A plurality of suction cups (25) are fixedly connected to the top surface of the hinge plate (23).

3. The positioning device for a semiconductor wafer according to claim 2, characterized in that: The carrier table (22) is a hollow structure with an open top. A carrier plate (26) is rotatably installed on the top surface of the carrier table (22). A plurality of through holes (27) are formed on the top surface of the carrier plate (26). A sliding plate (28) is movably connected inside the carrier table (22). A plurality of mounting posts are fixedly connected to the top surface of the sliding plate (28), and balls (29) are embedded at the top ends of the mounting posts. A flat hydraulic cylinder (210) is fixedly connected to the bottom surface of the carrier table (22). An expansion end of the flat hydraulic cylinder (210) abuts against the bottom surface of the sliding plate (28).

4. The positioning device for a semiconductor wafer according to claim 3, wherein: A fixed rod (36) is fixedly connected to the top surface of the first slider (34). A driven roller (37) is rotatably installed on the outer side surface of the fixed rod (36).

5. A positioning device for a semiconductor wafer according to claim 4, characterized in that: One end of the lead screw (35) penetrates through the side surface of the center rest (31) and extends in. A small gear (38) is fixedly sleeved on the circumferential surface of the lead screw (35) extending into the center rest (31).

6. The positioning device for a semiconductor wafer according to claim 5, characterized in that: A first motor (310) is fixedly connected inside the center rest (31). An output shaft of the first motor (310) is fixedly sleeved with a large gear (39). The large gear (39) meshes with the small gear (38) and their axes are perpendicular.

7. The positioning device for a semiconductor wafer according to claim 6, characterized in that: When the first slider (34) and the second slider (41) slide to the point closest to the bearing mechanism (2), the rubber roller (44) and the passive roller (37) are tangent to the circumferential side surface of the silicon wafer (1).

8. A positioning device for a semiconductor wafer according to claim 7, characterized in that: When the front side of the stop plate (46) abuts against the buffer pad (47), the front side of the stop plate (46) also abuts against the positioning edge (11).

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