Substrate lifting device and substrate processing apparatus including same

Abstract

The invention relates to a substrate lifting device and a substrate processing apparatus including the same. The substrate lifting device according to the present disclosure includes: a lifting pin that passes through a substrate supporting unit that supports a substrate in a processing space and lifts and lowers the substrate; a pin holder into which a lower portion of the lift pin is inserted; and a bellows surrounding the pin holder, in which the pin holder is formed with a guide member whose lower portion is coupled with the bolt and guides an air flow generated inside the bellows in a direction of the processing space.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0157076 filed in the Korean Intellectual Property Office on November 14, 2023 and all rights and interests arising under 35 U.S.C. 119, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The invention relates to a substrate lifting device and a substrate processing method. Background Art

[0004] In the process of manufacturing semiconductor devices, a semiconductor substrate undergoes several processes including a process of depositing a material layer, a process of etching the deposited material layer, a cleaning process, and a drying process. These processes are performed in a process chamber, which is a semiconductor manufacturing device.

[0005] The chamber is a reaction container having a sealed internal reaction area and is equipped with a chuck to fix the semiconductor substrate located inside. In this case, the chuck can be divided into a vacuum chuck using vacuum or an electrostatic chuck using electrostatic force according to the clamping method of the substrate.

[0006] The substrate is transferred into or out of the chamber by the substrate transfer device. The transfer of the substrate is carried out in a state where the substrate is lifted to be spaced apart from the chuck. For this purpose, the chuck is provided with a substrate lifting device for lifting or lowering from the chuck. Summary of the invention

[0007] Aspects of the present disclosure provide a substrate lifting apparatus and a substrate processing apparatus in which loosening of a pin holder can be minimized or prevented.

[0008] Aspects of the present disclosure are not limited to the above-mentioned aspects, and other aspects not mentioned will be clearly understood from the following description by a person of ordinary skill in the art.

[0009] According to aspects of the present disclosure, a substrate lifting device is provided, which includes: a lifting pin, which penetrates a substrate supporting unit that supports a substrate in a processing space and lifts and lowers the substrate; a pin holder, into which a lower portion of the lifting pin is inserted; and a bellows that surrounds the pin holder, wherein the pin holder is formed with a guide member, a lower portion of which is coupled to a bolt and guides an airflow generated in the bellows in the direction of the processing space.

[0010] According to another aspect of the present disclosure, a substrate processing device is provided, which includes: a chamber in which a processing space is formed; a substrate supporting unit, which is arranged in the processing space and supports the substrate; a vacuum pump, which generates a vacuum atmosphere in the processing space; and the substrate lifting device described above.

[0011] According to another aspect of the present disclosure, a substrate processing device is provided, which includes: a chamber in which a processing space for processing a substrate by plasma etching is formed, the chamber forming an entry and exit opening through which the substrate passes, and an exhaust hole through which byproducts generated in the processing space are discharged to the outside; a substrate supporting unit, which is arranged in the processing space and supports the substrate; a vacuum pump, which generates a vacuum atmosphere in the processing space; a substrate lifting device, which lifts and lowers the substrate; and a plate, which is arranged below the bottom surface of the chamber so as to be able to move up and down to lift and lower the substrate lifting device, wherein the substrate lifting device includes: a lifting pin, which penetrates the substrate supporting unit and the bottom surface of the chamber, and lifts and lowers the substrate; a pin holder, the lower portion of the lifting pin is inserted into the pin holder, supported on the plate, and includes an upper region positioned above and a lower region positioned below the upper region, a cutout groove (cutout groove) is formed in the upper region from top to bottom The pin holder is fastened to the inner lower part of the bellows by coupling the lower part with the bolt, and a concave spiral groove is provided in the lower area of ​​the pin holder, the concave spiral groove is formed along the outer peripheral surface of the pin holder to guide the airflow generated when the vacuum atmosphere is generated in the processing space or when the air in the processing space is discharged to the outside through the exhaust hole, and has a spiral shape inclined upward in the same direction as the direction in which the pin holder is assembled to the bolt.

[0012] Details of other exemplary embodiments are included in the detailed description and the accompanying drawings.

[0013] Since the substrate lifting and lowering apparatus and the substrate processing apparatus according to the present disclosure can prevent the coupling of the pin holder from becoming loose, durability can be improved and particles generated by the loosening of the bolts can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects and features of the present disclosure will become more apparent through detailed description of embodiments of the present disclosure with reference to the accompanying drawings.

[0015] Figure 1A diagram showing a semiconductor element manufacturing facility equipped with a substrate processing apparatus according to some exemplary embodiments of the present disclosure;

[0016] Figure 2 A diagram showing a substrate processing device provided with a substrate lifting device according to some exemplary embodiments of the present disclosure;

[0017] Figure 3 To show Figure 2 A graph of region A;

[0018] Figure 4 A diagram showing a state in which a substrate is lifted in a substrate processing apparatus provided with a substrate lifting apparatus according to some exemplary embodiments of the present disclosure;

[0019] Figure 5 To show Figure 4 A graph of region B;

[0020] Figure 6 is a diagram showing a pin holder of a substrate lifting and lowering device according to a first exemplary embodiment of the present disclosure;

[0021] Figure 7 is a diagram showing a pin holder of a substrate lifting and lowering device according to a second exemplary embodiment of the present disclosure; and

[0022] Figure 8 is a diagram of a pin retainer according to a comparative example. DETAILED DESCRIPTION

[0023] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Other advantages and features of the present disclosure and methods for achieving them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments to be described below, but can be implemented in various different forms, which will only be provided to make the present disclosure complete and allow those skilled in the art to fully appreciate the scope of the present disclosure, and the present disclosure will be limited by the scope of the claims. Throughout the specification, the same reference numerals represent the same components.

[0024] The terms used herein are for the purpose of describing exemplary embodiments and are not intended to limit the present disclosure. In this specification, unless otherwise expressly stated, the singular includes the plural. The components, steps, operations and / or elements mentioned by the terms "comprises" and / or "comprising" used in the present disclosure do not exclude the presence or addition of one or more other components, steps, operations and / or elements.

[0025] Figure 1A diagram illustrating a semiconductor element manufacturing facility equipped with a substrate processing apparatus according to some exemplary embodiments of the present disclosure.

[0026] refer to Figure 1 , the semiconductor element manufacturing facility 900 may include a load port module 820, an index module 910, a load lock chamber 920, a transfer chamber 930, and the substrate processing apparatus 1 of the present exemplary embodiment (as a process chamber).

[0027] The semiconductor element manufacturing facility 900 is a system for processing a plurality of substrates (e.g., wafers) through various processes such as etching processes and cleaning processes. The semiconductor element manufacturing facility 900 can be implemented as a multi-chamber type substrate processing system, which includes transfer robots 911 and 931 responsible for transferring substrates and a plurality of substrate processing devices 1, which are substrate processing modules arranged around the transfer robots.

[0028] A container 950 (eg, a Front Opening Unified Pod (FOUP)) on which a plurality of substrates are mounted is placed on the load port module 820. A plurality of such load port modules 820 may be provided in the front of the index module 910.

[0029] When a plurality of loading port modules 820 are arranged at the front of the index module 910, different articles can be installed on the container 950 installed on each loading port module 820. When, for example, three loading port modules 820 are arranged at the front of the index module 910, a wafer-type sensor (not shown) can be installed on the first container 950a on the first loading port 820a located on the left side, a substrate can be installed on the second container 950b on the second loading port 820b located on the central side, and consumables (not shown) can be installed on the third container 950c on the third loading port 820c located on the right side. However, the present exemplary embodiment is not limited thereto. The containers 950a, 950b and 950c installed on each loading port 820a, 820b and 820c can be changed as needed so that the same articles can be installed thereon.

[0030] The index module 910 is disposed between the load port module 820 and the load lock chamber 920 and is connected to transfer substrates between the container 950 on the load port module 820 and the load lock chamber 920. The index module 910 may be implemented as a front end module (FEM), but is not limited thereto.

[0031] The index module 910 may include a first transfer robot 911 responsible for transferring the substrate. Such a first transfer robot 911 may operate in an atmospheric pressure environment and may transfer the substrate between the container 950 and the load lock chamber 920.

[0032] The load lock chamber 920 may be used as a buffer between an input port and an output port on the semiconductor device manufacturing facility 900. The load lock chamber 920 may have a buffer stage therein in which a substrate temporarily waits.

[0033] A plurality of load lock chambers 920 may be provided between the index module 910 and the transfer chamber 930. In the present exemplary embodiment, for example, two load lock chambers 921 and 922, such as a first load lock chamber 921 and a second load lock chamber 922, may be provided between the index module 910 and the transfer chamber 930.

[0034] The first load lock chamber 921 and the second load lock chamber 922 may be arranged in a horizontal direction between the index module 910 and the transfer chamber 930. For example, the first load lock chamber 921 and the second load lock chamber 922 may be arranged in a mutually symmetrical single-layer structure arranged side by side in the left-right direction. Alternatively, the first load lock chamber 921 and the second load lock chamber 922 may also be arranged in a vertical direction between the index module 910 and the transfer chamber 930.

[0035] The first load lock chamber 921 may transfer the substrate from the index module 910 to the transfer chamber 930, and the second load lock chamber 922 may transfer the substrate from the transfer chamber 930 to the index module 910. However, the present exemplary embodiment is not limited thereto. The first load lock chamber 921 may also transfer the substrate from the transfer chamber 930 to the index module 910, and the second load lock chamber 922 may also transfer the substrate from the index module 910 to the transfer chamber 930.

[0036] The load lock chamber 920 may have substrates loaded or unloaded by the second transfer robot 931 of the transfer chamber 930. The load lock chamber 920 may have substrates loaded or unloaded by the first transfer robot 911 of the index module 910.

[0037] The load lock chamber 920 may maintain pressure while changing the inside thereof to a vacuum environment and an atmospheric pressure environment using a gate valve, etc. By doing so, the load lock chamber 920 may prevent the internal atmospheric pressure state of the transfer chamber 930 from changing.

[0038] Specifically, when a substrate is loaded or unloaded by the second transfer robot 931, the interior of the load lock chamber 920 may be formed in a vacuum environment that is the same as (or close to) the vacuum environment of the transfer chamber 930. In addition, when a substrate is loaded or unloaded by the first transfer robot 911 (i.e., when an unprocessed substrate is supplied from the first transfer robot 911 or a previously processed substrate is transferred to the index module 910), the interior of the load lock chamber 920 may be formed as an atmospheric pressure environment.

[0039] The transfer robot 930 transfers the substrate between the load lock chamber 920 and the substrate processing apparatus 1 . To this end, the transfer chamber 930 may include at least one second transfer robot 931 .

[0040] The second transfer robot 931 transfers an unprocessed substrate from the load lock chamber 920 to the substrate processing apparatus 1, or transfers a previously processed substrate from the substrate processing apparatus 1 to the load lock chamber 920. To this end, each side of the transfer chamber 930 may be connected to the load lock chamber 920 and a plurality of substrate processing apparatuses 1.

[0041] Meanwhile, the second transfer robot 931 may operate in a vacuum environment and may be set to rotate freely.

[0042] The substrate processing apparatus 1 may process a substrate. For example, the substrate processing apparatus 1 may be implemented as an etching chamber that processes a substrate using an etching process, and may be implemented as a plasma reaction chamber that etches a substrate using a plasma process.

[0043] A plurality of substrate processing apparatuses 1 may be disposed around the transfer chamber 930 . In this case, each substrate processing apparatus 1 may receive a substrate from the transfer chamber 930 , perform a process on the substrate, and provide the processed substrate to the transfer chamber 930 .

[0044] The substrate processing device 1 may be formed in a cylindrical shape. Such a substrate processing device 1 may have a surface made of aluminum oxide on which an anodized film is formed, and the inside thereof may be sealed. On the other hand, in the present exemplary embodiment, the substrate processing device 1 may also be formed in a shape other than a cylindrical shape.

[0045] Hereinafter, a substrate processing apparatus will be described in detail with reference to the accompanying drawings.

[0046] Figure 2 is a diagram showing a substrate processing device provided with a substrate lifting device according to some exemplary embodiments of the present disclosure, and Figure 3 To show Figure 2 Graph of area A. Figure 4is a diagram showing a state in which a substrate is lifted in a substrate processing apparatus provided with a substrate lifting apparatus according to some exemplary embodiments of the present disclosure, and Figure 5 To show Figure 4 Figure 2. Region B of the graph. In addition, Figure 6 2 is a diagram illustrating a pin holder of a substrate lifting and lowering device according to a first exemplary embodiment of the present disclosure.

[0047] First, refer to Figure 2 and Figure 4 , a substrate processing apparatus 1 according to an exemplary embodiment of the present disclosure may include a substrate elevating apparatus 10 , a chamber 20 , and a substrate supporting unit 30 .

[0048] First, the chamber 20 may form a processing space for processing the substrate W. When processing the substrate W, the processing space of the chamber 20 may generally be maintained in a vacuum atmosphere. For example, the processing space may be an etching processing space in which the substrate W is etched with plasma. An opening 21 may be formed in the side wall of the chamber 20, through which the substrate W enters and exits, and a door (not shown) may be provided in the opening 21. An exhaust hole 22 may be formed in the bottom surface 20B of the chamber 20, and a supply hole 23 may be formed in the upper portion of the chamber 20, through which a process gas from a gas supply unit 24 flows. Here, the process gas may be a process gas for processing a substrate with plasma.

[0049] The chamber 20 may be provided with a vacuum pump 25. The vacuum pump 25 may generate a vacuum atmosphere in the processing space and the inner space of the bellows 310 connected to the processing space. When the vacuum pump 25 operates to generate a vacuum atmosphere in the processing space, an air flow G1 from the inner side of the bellows 310 toward the processing space may be formed in the process of discharging air in the processing space to the outside.

[0050] For example, when the airflow G1 is generated, the coupling portion of the bolt 311B may make a click sound and the coupling portion may be loosened. In order to prevent this, according to the present exemplary embodiment, a guide member 321G may be formed, which will be described later.

[0051] The substrate supporting unit 30 may support the substrate W. The substrate supporting unit 30 may have a supporting surface supporting the substrate W. The substrate supporting unit 30 may support the substrate W and rotate the supported substrate W. For example, an electrostatic plate (not shown) may be provided inside the substrate supporting unit 30, and may be an electrostatic chuck that rotates the substrate W using an electrostatic force.

[0052] Alternatively, various modifications are possible, such as the substrate supporting unit 30 using a vacuum adsorption method to clamp the substrate W. In addition, through holes (not shown) through which the lift pins 300 penetrate may be formed in the substrate supporting unit 30 so that the height of the substrate W on the substrate supporting unit 30 can be changed.

[0053] Reference Figures 2 to 6 Therefore, the substrate lifting device 10 may lift the substrate W to the inside of the chamber 20. The substrate lifting device 10 may include a lifting pin 300 and a driver 400 that can be lifted and lowered by the plate 100.

[0054] The plate 100 is configured to change the vertical height of the lift pin 300 by changing the relative height with the chamber 20 through the driver 400. The plate 100 may support the bellows 310 and the pin holder 320. The plate 100 may be coupled to the lower end of the bellows 310.

[0055] The lift pins 300 may contact the substrate W and move the substrate W in a vertical direction. The lift pins 300 may be mounted on an upper surface of the board 100. The lift pins 300 may have a structure extending from an inner side of a pin holder 320 in an upward direction and standing on the board 100.

[0056] A plurality of lift pins 300 may be disposed on the upper surface of the board 100. The plurality of lift pins 300 may be disposed at the edge of the board 100, but is not limited thereto. The vicinity of the lift pins 300 may be isolated from the outside by the bellows 310.

[0057] The pin holder 320 as a medium connecting the bellows 310 / plate 100 and the lift pin 300 may surround the lift pin 300. As an example, the lift pin 300 may be inserted into the pin holder 320 from the top to the bottom thereof, and the lower end of the lift pin 300 may be fixed to the inner side of the pin holder 320.

[0058] For example, the pin holder 320 may include an upper region 325 positioned above and a lower region 321 positioned below the upper region 325. The upper region 325 may have a smaller diameter than the lower region 321, but is not limited thereto. A cutout groove 325H cut from top to bottom may be formed in the upper region 325 of the pin holder 320 to facilitate insertion of the lift pin 300. An expanded hole 325H1 whose cutout area is expanded at the lower end may be formed in the cutout groove 325H.

[0059] The pin holder 320 may be provided with a tab 321T at the lower end of the lower region 321. The tab 321T may have a thread corresponding to a thread of the bolt 311B formed on the inner side so as to be coupled to the bellows 310 via the bolt 311B. In addition, the guide member 321G may not be formed in the upper region 325 of the pin holder 320 but only in the lower region 321 thereof, but is not limited thereto.

[0060] The bellows 310 may surround the pin holder 320 on which the lift pins 300 are mounted. The bellows 310 may have a corrugated tube shape, but is not limited thereto. When the lift pins 300 penetrate the chamber 20 and contact the substrate W, the bellows 310 may prevent the chamber 20 penetrated by the lift pins 300 from being exposed to the outside by isolating the vicinity of the pin holder 320 to which the lift pins 300 are coupled from the outside, thereby allowing the processing space to be sealed.

[0061] In other words, the bellows 310 may be disposed on the bottom surface 20B of the chamber 20 through which the lift pins 300 penetrate, and may isolate the inside and outside of the chamber 20 so that the inside of the chamber 20 is maintained in vacuum.

[0062] The driver 400 may be, for example, an actuator, and may drive the substrate lifting device 10. As an example, the driver 400 may be implemented in a pneumatic method in which the plate 100 is lifted by supplying compressed air so that the lift pins 300 lift the substrate W, or the plate 100 is lowered by discharging compressed air, but is not limited thereto.

[0063] In the following, reference will be made to Figures 2 to 5 The operation of the substrate lifting device 10 is described.

[0064] Reference Figure 2 and Figure 3 In the case where the substrate W is processed inside the chamber 20, the substrate elevating device 10 may lower the substrate W so that the substrate W is disposed on the substrate supporting unit 30. For example, the plate 100 is lowered by the driver 400. Thus, the elevating pins 300 supported by the plate 100 may be lowered. The elevating pins 300 contacting the substrate W are lowered so as not to protrude above the substrate supporting unit 30, and thus the substrate W may be disposed on the substrate supporting unit 30.

[0065] Reference Figure 4 and Figure 5, the substrate lifting device 10 may lift the substrate W from the substrate supporting unit 30. For example, the plate 100 is lifted by the driver 400. Therefore, the lifting pins 300 supported by the plate 100 are lifted, and at this time, the lifting pins 300 protrude above the substrate supporting unit 30. When the lifting pins 300 in contact with the substrate W are lifted, the substrate W may be lifted from the substrate supporting unit 30. In addition, when the plate 100 is lifted, the bellows 578 between the plate 100 and the bottom surface 20B of the chamber 20 may be pressurized and contracted by the plate 100.

[0066] The relative heights of the plate 100 and the lift pins 300 lifted and lowered in this manner relative to the chamber 20 change. The bellows 578 is installed at the connection between the plate 100 and the lift pins 300 so that the airtightness of the connection between the plate 100 and the lift pins 300 is maintained regardless of the lifting and lowering of the plate 100 and the lift pins 300.

[0067] Hereinafter, a structure for preventing the pin holder 320 of the substrate lifting and lowering device 10 from being released will be described with reference to the accompanying drawings.

[0068] refer to Figure 6 , the pin holder 320 according to the first exemplary embodiment of the present disclosure may be formed with a guide member 321G (eg, a spiral groove 321G1 ).

[0069] The pin holder 320 may be coupled with the bolt 311B and fastened to the inner lower portion of the bellows 310 (or the upper surface of the plate 100). As an example, the bolt 311B may be fixed to the inner lower portion of the bellows 310, and may have a structure in which the pin holder 320 is fixed to the bellows 310 by rotating the pin holder 320 and coupling it to the bolt 311B.

[0070] The guide member 321G of the pin holder 320 can guide the airflow G1. As an example, the guide member 321G can guide the airflow G1 generated when the processing space is formed into a vacuum atmosphere (i.e., the air is discharged to the outside to form a vacuum atmosphere) or the air in the processing space is discharged to the outside through the exhaust hole 22.

[0071] In the process of guiding the airflow G1 by the guide member 321G, a pressing force (pressing force generated by the airflow G1) can be applied to the guide member 321G, and as a result, the pin holder 320 rotates, that is, the pin holder 320 rotates in the direction in which it is coupled with the bolt 311B, thereby preventing or reducing the loosening of the coupling with the bolt 311B. If the loosening of the bolt 311B is prevented, it is also possible to reduce particles that may be generated during the loosening of the bolt 311B.

[0072] Here, during the movement of air around the bellows 310, the pressing force generated by the airflow G1 flows toward the upper portion of the guide member 321G, and at this time, the pressing force may mean a force pushing the inner surface, one surface and / or another surface of the guide member 321G.

[0073] The guide member 321G is formed along the outer peripheral surface of the pin holder 320, and may be formed in a spiral shape that is inclined upward in the direction in which the airflow G1 is guided in the direction in which the pin holder 320 is assembled to the bolt 311B. That is, the guide member 321G may be formed in a spiral shape that is inclined upward in the same direction as the assembly direction D1 of the bolt 311B. Here, the assembly direction D1 may be a clockwise or counterclockwise direction.

[0074] For example, the guide member 321G may include a concave spiral groove 321G1 along the circumference of the pin holder 320. The spiral groove 321G1 may be formed by machining a groove in a conventional pin holder 320. Here, the bellows 310 is formed so that the inner side of the bellows 310 is in contact with or close to the outer peripheral surface of the pin holder 320 (see FIG. Figure 6 310A in, including the area of ​​the bellows 310), so that the air in the processing space can be further collected in the spiral groove 321G1, but is not limited thereto.

[0075] In this way, for example, when the airflow G1 formed between the pin holder 320 and the bellows 310 is guided along the spiral of the guide member 321G and the air flows out of the processing space, a pressurizing force can be generated in the airflow G1 by the process of forming a vacuum atmosphere while forming a pressure lower than the atmospheric pressure. As a result, since the pin holder 320 can be rotated in the direction of assembling the pin holder 320 during the process of the air flowing out along the spiral of the guide member 321G, the pin holder 320 can be prevented from being loosened from the bolt 311B.

[0076] That is to say, Figure 8 2 is a diagram showing a pin holder according to a comparative example. Figure 8 BL10 not described here is an area where the bellows is set, and when the airflow G1 is formed inside the bellows 310, the pin retainer FH10 on which the guide member 321G is not formed can be moved up and down in the vertical direction by the force generated by the airflow G1, and the protrusion T10 coupled to the bolt B10 may become loose as the screw coupling portion is loosened.

[0077] On the other hand, since the pin holder 320 according to the present disclosure can be rotated in the assembly direction D1 due to the pressing force generated by the airflow G1, loosening of the screw coupling part can be prevented or reduced in the process of guiding the airflow G1 along the guide member 321G when the airflow G1 is formed.

[0078] In the following, reference will be made to Figure 7 Modified examples of the present exemplary embodiment are described, and redundant descriptions of the same configurations performing the same functions will be omitted.

[0079] Figure 7 FIG. 1 is a diagram showing a pin holder of a substrate lifting device according to a second exemplary embodiment of the present disclosure. Figure 7 To describe and use Figures 2 to 6 Describe the differences.

[0080] refer to Figure 7 In the substrate elevating device 10 according to the second exemplary embodiment of the present disclosure, the pin holder 320 may be formed of a guide member 321G in the same or similar manner as the substrate elevating device 10 of the first exemplary embodiment.

[0081] However, the guide member 321G of the second exemplary embodiment is different in that it includes a spiral wing 321G2 that is different from the spiral groove 321G1 of the first exemplary embodiment. Unlike the spiral groove 321G1 that forms a groove structure, the wing 321G2 can extend / protrude in an outward direction along the circumference of the pin holder 320. In order to prevent the wing 321G2 from excessively increasing the load on the pin holder 320 and reducing the rotational force, the radius of the wing 321G2 can be formed to be smaller than the radius of the pin holder 320.

[0082] In the blade 321G2 of the second exemplary embodiment, since the pressure generated by the airflow G1 pushes the blade 321G2 in the spiral direction when the airflow G1 is guided by the pin retainer 320 in the same manner or a similar manner as the spiral groove 321G1 of the first exemplary embodiment, the pin retainer 320 can rotate in the direction of assembling the pin retainer 320, and thus loosening of the pin retainer 320 can be prevented or minimized.

[0083] In addition, in the bellows 310 of the second exemplary embodiment, the inner side of the bellows 310 can be formed to be in contact with or close to the edge of the blade 321G2, so that the air in the processing space can be collected and moved in the blade 321G2 without the inner side of the bellows 310 interfering with the blade 321G2.

[0084] In addition, by combining the pin retainer 320 of the first exemplary embodiment of the present disclosure and the pin retainer 320 of the second exemplary embodiment, another exemplary embodiment is possible. That is, the guide member 321G of the pin retainer 320 can be formed with a spiral groove 321G1 and a blade 321G2. For example, the blade 321G2 can be formed along the upper end of the spiral groove 321G1.

[0085] In the present exemplary embodiment, the substrate lifting device 10 is provided outside the chamber 20 and lifts the substrate W, but the exemplary embodiment is not limited thereto. As another example, the substrate lifting device 10 may lift the substrate W under the substrate supporting unit 30 provided inside the chamber 20 .

[0086] Although the exemplary embodiments of the present disclosure have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that the present disclosure can be embodied in other specific forms without changing its technical spirit or basic features. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and not restrictive.

Claims

1. A substrate lifting device, comprising: lift pins that penetrate a substrate support unit that supports a substrate in a processing space and lift and lower the substrate; a pin holder into which the lower portion of the lift pin is inserted; as well as a bellows surrounding the pin retainer, The pin holder is formed with a guide member, a lower portion of which is coupled to the bolt and guides the airflow generated in the bellows in the direction of the processing space.

2. The substrate lifting device according to claim 1, wherein: The guide member is formed along an outer peripheral surface of the pin holder and is formed in a spiral shape inclined upward in the same direction as a direction in which the pin holder is fitted to the bolt.

3. The substrate lifting device according to claim 2, wherein: The guide member includes a concave helical groove along a circumference of the pin retainer.

4. The substrate lifting device according to claim 3, wherein: The bellows is formed such that an inner side of the bellows is in contact with an outer peripheral surface of the pin holder.

5. The substrate lifting device according to claim 1, wherein: The guide member includes a helical blade extending in an outward direction along a circumference of the pin holder.

6. The substrate lifting device according to claim 5, wherein: The radius of the blade is smaller than the radius of the pin holder.

7. The substrate lifting device according to claim 5, wherein: The bellows is formed such that an inner side of the bellows contacts an edge of the blade.

8. The substrate lifting device according to claim 1, wherein: The pin holder includes an upper region positioned above and a lower region positioned below the upper region, A cutout groove is formed in the upper region of the pin holder from top to bottom to facilitate the insertion of the lifting pin, The guide member is not formed at the upper region but is formed only at the lower region.

9. The substrate lifting device according to claim 8, wherein: An expanded hole whose cutting area is expanded at the lower end is formed in the cutout groove.

10. The substrate lifting device according to claim 1, wherein: The pin holder has threads formed on an inner peripheral surface to be coupled to a bolt, and is provided with a tab positioned at a lower end.

11. The substrate lifting device according to claim 1, wherein: The pin holder is coupled to the bolt at the inner lower portion of the bellows, or the pin holder is coupled to the bolt on a plate, and the plate is provided to be movable up and down for lifting and lowering the lifting pin.

12. A substrate processing device, comprising: a chamber in which a processing space is formed; a substrate supporting unit, the substrate supporting unit being disposed in the processing space and supporting a substrate; a vacuum pump, the vacuum pump generating a vacuum atmosphere in the processing space; as well as The substrate lifting device according to claim 1.

13. The substrate processing device according to claim 12, wherein: The substrate processing device further comprises: a plate configured to be movable up and down for lifting and lowering the lifting pin and supporting the bellows and the pin holder; and An actuator raises and lowers the plate.

14. The substrate processing device according to claim 12, wherein: The chamber is formed with an opening, through which the substrate enters and exits, and an exhaust hole, through which byproducts generated in the processing space are discharged to the outside, The processing space generates a vacuum atmosphere through a vacuum pump, and When a vacuum atmosphere is generated in the processing space or an airflow is generated when air in the processing space is discharged to the outside through the exhaust hole and moves along the guide member, the pin holder rotates in the direction in which the pin holder is coupled to the bolt by the pressing force generated by the airflow.

15. The substrate processing device according to claim 12, wherein: The processing space forms an etching processing space for etching the substrate using plasma.

16. A substrate processing device, comprising: a chamber in which a processing space for processing a substrate by plasma etching is formed, an opening through which the substrate enters and exits, and an exhaust hole through which a byproduct generated in the processing space is discharged to the outside; a substrate supporting unit, the substrate supporting unit being disposed in the processing space and supporting the substrate; a vacuum pump, the vacuum pump generating a vacuum atmosphere in the processing space; a substrate lifting device, the substrate lifting device lifting and lowering the substrate; as well as a plate disposed below the bottom surface of the chamber to be movable up and down to lift and lower the substrate lifting device, Wherein, the substrate lifting device comprises: lift pins that penetrate the substrate supporting unit and a bottom surface of the chamber and lift and lower the substrate; a pin holder into which the lower portion of the lift pin is inserted, supported on the plate, and including an upper region positioned above and a lower region positioned below the upper region, a cutout groove being formed from top to bottom in the upper region to facilitate insertion of the lift pin; and a bellows surrounding the pin holder, having an inner side in contact with an outer peripheral surface of the pin holder, and supported on the plate; and The pin holder is fastened to the inner lower part of the bellows by coupling the lower part with a bolt, and a concave spiral groove is provided in the lower area of ​​the pin holder, the concave spiral groove is formed along the outer peripheral surface of the pin holder to guide the airflow generated when a vacuum atmosphere is generated in the processing space or when the air in the processing space is discharged to the outside through the exhaust hole, and has a spiral shape inclined upward in the same direction as the direction in which the pin holder is assembled to the bolt.

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