Packaging assembly and electronic equipment

Abstract

The embodiment of the invention provides a packaging assembly and electronic equipment, and relates to the technical field of electronic equipment. The packaging assembly of the electronic equipment is installed on a circuit board of the electronic equipment, and by arranging a heat conduction column with one end being in heat conduction with a heat dissipation device and the other end being in heat conduction with a chip, close to the circuit board, in the packaging assembly, the chip, close to the circuit board, in the packaging assembly can transmit heat to the heat dissipation device for heat dissipation through the heat conduction column. In this way, the heat dissipation efficiency of the chip close to the circuit board in the packaging assembly is high, and the heat dissipation efficiency of the whole packaging assembly can be improved.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 16, 2023, with application number 202311532597.X and application name “Packaging Components and Electronic Devices”, all contents of which are incorporated by reference in this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a packaging component and an electronic device. Background Art

[0003] Electronic devices such as mobile phones, tablet computers, and laptop computers may include a packaging component, a printed circuit board (PCB), and a heat sink. The packaging component is mounted on the circuit board and is located between the circuit board and the heat sink. The packaging component can dissipate heat through the heat sink.

[0004] Package on package (POP) is a chip packaging method that can form a package assembly including vertically distributed multi-layer chips by stacking two or more chips. In the related art, the package assembly formed by stacking can include at least two chips stacked up and down, the lower surface of the lowermost chip is used to be mounted on a circuit board, and the upper surface of the uppermost chip is used to exchange heat with a heat sink.

[0005] However, in the related art, the package assembly formed by stacking packaging has the problem of low heat dissipation efficiency, resulting in limited performance of the package assembly formed by stacking packaging. Summary of the invention

[0006] The embodiments of the present application provide a packaging component and an electronic device, which can improve the heat dissipation efficiency of the packaging component, thereby reducing the limitation on the performance of the packaging component caused by the low heat dissipation efficiency.

[0007] The first aspect of the present application provides a packaging component, including a first chip, a second chip and a heat-conducting column. The second chip is arranged on one side of the first chip in the thickness direction, and the other side of the first chip in the thickness direction is used to be connected to the first circuit board. The second chip is used to be connected to a heat sink arranged on the side of the second chip away from the first chip, so that the second chip is used to be thermally connected to the heat sink. The first chip has a first connecting portion, and the projection of the first connecting portion along the thickness direction of the first chip is located outside the projection of the second chip along the thickness direction of the first chip. One end of the heat-conducting column is connected to the first connecting portion, so that the heat-conducting column is thermally connected to the first chip, and the other end of the heat-conducting column protrudes from the surface of the first chip on the side facing the second chip, and is used to be connected to the heat sink, so that the heat-conducting column is used to be thermally connected to the heat sink.

[0008] In the packaging assembly provided in the embodiment of the present application, the thermally conductive column is connected to the heat sink to form a heat dissipation path for the first chip. The heat generated by the first chip can be transferred to the heat sink through the thermally conductive column for dissipation. Compared with the heat dissipation path in which the first chip transfers heat to the heat sink through the second chip, the thermal resistance of the thermally conductive column is lower. Compared with the first circuit board, the heat sink has a higher heat dissipation efficiency, which can make the heat dissipation efficiency of the first chip higher, which is beneficial to improving the heat dissipation efficiency of the packaging assembly, and further reducing the limitation on the performance of the packaging assembly caused by the low heat dissipation efficiency.

[0009] Specifically, the first chip includes a second circuit board and a bare chip. The bare chip is arranged on one side of the second circuit board in the thickness direction, the other side of the second circuit board in the thickness direction is used to connect with the first circuit board, and the second chip is arranged on the side of the bare chip away from the second circuit board.

[0010] In a possible embodiment, the second circuit board has a first heat conducting sheet, and the first heat conducting sheet has a first connecting portion and a second connecting portion. The projection of the first connecting portion along the thickness direction of the second circuit board is located outside the projection of the die along the thickness direction of the second circuit board. The projection of the second connecting portion along the thickness direction of the second circuit board is located inside the projection of the die along the thickness direction of the second circuit board. The heat conducting column is connected to the first heat conducting sheet so that the heat conducting column and the first heat conducting sheet are thermally conductive, and the second connecting portion is connected to the die so that the first heat conducting sheet and the die are thermally conductive. In this way, the heat generated by the die can be transferred to the heat dissipation device through the first heat conducting sheet and the heat conducting column to dissipate heat, and the heat dissipation efficiency of the die is relatively high. In addition, the heat conducting column is connected to the second circuit board, and the connection of the heat conducting column is relatively easy. In addition, the heat conducting column provided may not affect the packaging of the die, which is conducive to providing a packaging structure for protecting the die on the surface of the die.

[0011] The first heat conducting sheet may be a metal sheet formed by the metal layer of the second circuit board. For example, the first heat conducting sheet may be a copper sheet.

[0012] In a possible implementation, the side of the bare chip facing the second circuit board includes a first electrical connection area, and the projection of the first electrical connection area along the thickness direction of the second circuit board is located outside the projection of the first heat conductive sheet along the thickness direction of the second circuit board. The side of the bare chip facing the second circuit board is provided with a first power terminal and a first signal terminal, and the first power terminal and the first signal terminal are both located in the first electrical connection area, and the bare chip is electrically connected to the second circuit board through the first power terminal and the first signal terminal. A first heat conductive structure is provided between the bare chip and the second connecting portion, and the bare chip is connected to the second connecting portion through the first heat conductive structure, so that the bare chip is thermally connected to the first heat conductive sheet through the first heat conductive structure. In this way, it is convenient to electrically connect the bare chip to the second circuit board having the first heat conductive sheet, and the first heat conductive sheet has little effect on the current and signal transmission between the second circuit board and the bare chip. In addition, the first power terminal and the first signal terminal are both arranged outside the area where the bare chip overlaps with the first heat conductive sheet, which is conducive to arranging the first heat conductive sheet with a larger size and better integrity, so that the heat conduction efficiency of the first heat conductive sheet is higher.

[0013] The first power terminal is a terminal for supplying power between the bare die and the second circuit board, and the first signal terminal is a terminal for transmitting signals between the bare die and the second circuit board.

[0014] In a possible implementation, the first heat conducting sheet is made of a conductive material, the first heat conducting structure includes a first grounding terminal disposed on the side of the bare die facing the second circuit board, the projection of the first grounding terminal along the thickness direction of the second circuit board is located within the projection of the second connecting portion along the thickness direction of the second circuit board, and the bare die is electrically connected to the second connecting portion via the first grounding terminal. In this way, the first grounding terminal can be used for heat conduction between the bare die and the first heat conducting sheet, and can also be used to ground the bare die, so that the utilization rate of the terminal disposed on the bare die is higher.

[0015] In a possible implementation, the surface of the second circuit board on one side for mounting the bare chip has a first heat conductive sheet. In this way, the heat conductive column and the bare chip can be connected to the first heat conductive sheet located on the surface of the second circuit board more conveniently. In addition, the heat conduction path between the heat conductive column and the bare chip and the first heat conductive sheet located on the surface of the second circuit board is also shorter, so that the heat dissipation efficiency of the bare chip through the heat conductive column is higher.

[0016] In a possible implementation, the bare chip includes a first part and a second part, the first part includes a first core, the second part includes a second core, and the power of the first core is greater than the power of the second core. The projection of the second connecting portion along the thickness direction of the second circuit board is located within the projection of the first part along the thickness direction of the second circuit board, and the projection of the second connecting portion along the thickness direction of the second circuit board is located outside the projection of the second part along the thickness direction of the second circuit board. In this way, the first core with higher power is arranged near the second connecting portion, and the heat conduction path between the first core and the first heat conducting plate is shorter, so that a large amount of heat generated by the first core during operation can be efficiently dissipated through the first heat conducting plate and the heat conducting column, and the risk of overheating of the bare chip and the package component is relatively small.

[0017] The first core is used to run when the package component needs to run at high power consumption, and stops running when the package component does not need to run at high power consumption. When the package component does not need to run at high power consumption, the needs of the package component can be met by running the second core. For example, the first core can be a performance core of a central processing unit (CPU) or a graphics processing unit (GPU), and the performance core can also be called a large core. The second core can be an energy efficiency core of a central processing unit or a graphics processor, and the energy efficiency core can also be called a small core.

[0018] In a possible implementation, the die has a first connection portion, and the heat-conducting column is connected to the die so that the heat-conducting column and the die are thermally conductive. In this way, the heat generated by the die can be directly transferred to the heat sink through the heat-conducting column for heat dissipation, the heat conduction path between the die and the heat sink is shorter, and the heat dissipation efficiency of the die is higher.

[0019] In a possible implementation, the bare chip includes a first part and a second part, the first part includes a first core, the second part includes a second core, the power of the first core is greater than the power of the second core, and the first part has a first connection portion. In this way, the first core with greater power is arranged near the first connection portion, and the heat conduction path between the first core and the heat conduction column is shorter, so that a large amount of heat generated by the first core during operation can be efficiently dissipated through the heat conduction column, and the risk of overheating of the bare chip and the package component is reduced.

[0020] In a possible implementation, the first chip includes a second circuit board, a bare chip and a third circuit board. The bare chip is arranged on one side of the second circuit board in the thickness direction, and the other side of the second circuit board in the thickness direction is used to be connected to the first circuit board. The second chip is arranged on the side of the bare chip away from the second circuit board. The third circuit board is arranged between the bare chip and the second chip, and the side of the third circuit board facing the second chip is connected to the second chip, and the side of the third circuit board away from the second chip is connected to the second circuit board. A second heat-conducting structure is arranged between the bare chip and the third circuit board, and the bare chip is connected to the third circuit board through the second heat-conducting structure, so that the bare chip is thermally connected to the third circuit board through the second heat-conducting structure. The third circuit board has a first connecting portion, and the heat-conducting column is connected to the third circuit board, so that the heat-conducting column is thermally connected to the third circuit board. In this way, the first chip is connected to the second chip through the third circuit board, so that the interval at the connection between the first chip and the second chip can be smaller, which is convenient for connecting the first chip and the second chip. On the basis of the convenient connection between the first chip and the second chip, the heat generated by the bare chip can be transferred to the heat dissipation device through the second heat-conducting structure, the third circuit board and the heat-conducting column for heat dissipation, so that the bare chip has a higher heat dissipation efficiency.

[0021] In a possible implementation, the second heat-conducting structure includes a first pad and a second pad corresponding to the first pad. The first pad is disposed on the surface of the die away from the second circuit board, and the second pad is disposed on the surface of the third circuit board away from the second chip. The first pad is welded to the corresponding second pad by a solder disposed therebetween, and the die and the third circuit board are thermally connected through the welded first pad and second pad. In this way, the heat-conducting connection between the die and the third circuit board is relatively stable. In addition, it is also relatively convenient to achieve a heat-conducting connection between the die and the third circuit board.

[0022] In a possible implementation, the third circuit board has a second heat conducting sheet, and the first connection portion and the second heat conducting structure are both connected to the second heat conducting sheet, so that the first connection portion and the second heat conducting structure are thermally connected through the second heat conducting sheet. In this way, the heat generated by the bare chip can be transferred to the heat conducting column through the second heat conducting structure, the second heat conducting sheet and the first connection portion, so that when the bare chip is thermally connected to the heat conducting column through the second heat conducting structure and the third circuit board, the heat conduction efficiency between the bare chip and the heat conducting column is high. In addition, the arrangement positions of the first connection portion and the second heat conducting structure can be made more flexible.

[0023] In a possible implementation, at least part of the projection of the first connection portion in the thickness direction of the first chip is located within the projection of the second heat conducting sheet in the thickness direction of the first chip. In this way, the connection between the first connection portion and the second heat conducting sheet can be more convenient. In addition, the heat conduction path between the first connection portion and the second heat conducting sheet is shorter, and the heat conduction efficiency is higher.

[0024] In a possible implementation, at least part of the projection of the bare die in the thickness direction of the first chip is located within the projection of the second heat conductive sheet in the thickness direction of the first chip. In this way, it is more convenient to connect the bare die to the second heat conductive sheet through the second heat conductive structure. In addition, the heat conduction path between the bare die and the second heat conductive sheet can be shorter, and the heat conduction efficiency can be higher.

[0025] In a possible implementation, the first connection portion is disposed on a surface of the third circuit board facing the second chip, so that the heat conducting column can be connected to the first connection portion more conveniently.

[0026] In a possible embodiment, the second heat conductive sheet is located in the inner layer of the third circuit board. The first connection portion is connected to the second heat conductive sheet through a first heat conductive body embedded in the third circuit board, so that the first connection portion is thermally connected to the second heat conductive sheet through the first heat conductive body. The second heat conductive structure is connected to the second heat conductive sheet through a second heat conductive body embedded in the third circuit board, so that the second heat conductive structure is thermally connected to the second heat conductive sheet through the second heat conductive body. In this way, the second heat conductive sheet has little effect on the arrangement of structures such as terminals and pads on the surface of the third circuit board, so that the influence on the connection between the third circuit board and the second circuit board and the third circuit board and the second chip is small.

[0027] In a possible implementation, a third heat-conducting structure is provided on the surface of the third circuit board on the side facing the second chip, and the projection of the third heat-conducting structure in the thickness direction of the first chip is located within the projection of the second chip in the thickness direction of the first chip. In this way, the third heat-conducting structure fills part of the gap between the third circuit board and the second core board, which is conducive to improving the heat conduction efficiency between the third circuit board and the second chip, and further improving the efficiency of the third circuit board in heat dissipation through the second chip.

[0028] In a possible implementation, the third heat-conducting structure includes a third pad disposed on the surface of the third circuit board and a solder ball disposed on the surface of the third pad. The third circuit board is thermally connected to the solder ball disposed on the surface of the third pad through the third pad. In this way, the third pad and the solder ball disposed thereon occupy a small board area, which facilitates the arrangement of the third heat-conducting structure in the narrow space between the second chip and the third circuit board.

[0029] In a possible implementation, the first chip includes a packaging structure, and at least a portion of the bare die of the first chip is covered by the packaging structure, and the packaging structure can protect the bare die.

[0030] In a possible implementation, the heat-conducting column is arranged outside the packaging structure, so that the packaging structure is not likely to affect the heat conduction of the heat-conducting column, and the efficiency of the bare chip transferring heat to the heat dissipation device through the heat-conducting column is higher.

[0031] In a possible implementation, the side surface of one end of the heat-conducting column connected to the first connecting portion is covered by the packaging structure, so that the connection between the heat-conducting column and the first chip can be more stable.

[0032] In a possible implementation, the first chip is a logic chip or a system chip, and the second chip is a memory chip. In this way, the signal transmission paths between the logic chip or the system chip, the memory chip, and the first circuit board are all shorter, and the loss of the signals interacting between the logic chip or the system chip, the memory chip, and the first circuit board is all smaller, and the transmission rate is all faster, so that the electronic device can have better processing performance.

[0033] The second aspect of the present application provides an electronic device, comprising a first circuit board, a heat sink, and a packaging assembly in any of the above embodiments, wherein the packaging assembly is disposed between the first circuit board and the heat sink. A side of a first chip of the packaging assembly facing away from a second chip of the packaging assembly is connected to the first circuit board, and an end of a heat-conducting column of the packaging assembly facing away from the first chip and the second chip are both connected to the heat sink, so that the heat-conducting column and the second chip are both thermally conductive to the heat sink.

[0034] In a possible implementation manner of the electronic device provided in the second aspect, the electronic device further includes a shielding cover. The shielding cover is mounted on the first circuit board, and the heat dissipation device is disposed on a side of the shielding cover away from the first circuit board. An installation space is formed between the shielding cover and the first circuit board, and the first chip and the second chip are both disposed in the installation space. The shielding cover can electromagnetically shield the first chip and the second chip, and can reduce electromagnetic interference caused by components outside the shielding cover to the first chip and the second chip.

[0035] In a possible implementation of the electronic device provided in the second aspect, the shielding cover is connected to the heat sink so that the shielding cover and the heat sink are thermally connected. A heat-conducting column is arranged in the installation space, and one end of the heat-conducting column away from the first chip is connected to the shielding cover so that the heat-conducting column is connected to the heat sink through the shielding cover, so that the heat-conducting column is thermally connected to the heat sink through the shielding cover. In this way, the shielding cover has a better shielding effect on the components in the installation space. In addition, the heat-conducting column is relatively easy to assemble.

[0036] In a possible implementation of the electronic device provided in the second aspect, the shielding cover has a through hole connecting the installation space and the outside of the shielding cover, and the heat-conducting column is arranged in the through hole. In this way, the heat conduction efficiency between the heat-conducting column and the heat dissipation device is high, so that the heat dissipation efficiency of the first chip is high.

[0037] The third aspect of the present application provides an electronic device, comprising a first circuit board, a heat sink, a packaging component and a heat-conducting column. The packaging component and the heat-conducting column are both arranged between the first circuit board and the heat sink. The packaging component comprises a first chip and a second chip, the second chip is arranged on one side of the first chip in the thickness direction, the other side of the first chip in the thickness direction is connected to the first circuit board, and the side of the second chip away from the first chip is connected to the heat sink, so that the second chip is thermally conductive. The first circuit board has a third heat-conducting sheet, the third heat-conducting sheet has a third connecting portion and a fourth connecting portion, the projection of the third connecting portion along the thickness direction of the first circuit board is located outside the projection of the packaging component along the thickness direction of the first circuit board, and the projection of the fourth connecting portion along the thickness direction of the first circuit board is located inside the projection of the first chip along the thickness direction of the first circuit board. One end of the heat-conducting column is connected to the third connecting portion, so that the heat-conducting column is thermally conductive with the third heat-conducting sheet, the other end of the heat-conducting column is connected to the heat sink, so that the heat-conducting column is thermally conductive with the heat sink, and the fourth connecting portion is connected to the first chip, so that the third heat-conducting sheet is thermally conductive with the first chip.

[0038] In this way, the third heat conducting sheet, heat conducting column and heat sink form a heat dissipation path for the first chip. The heat generated by the first chip can be transferred to the heat sink through the third heat conducting sheet and heat conducting column for heat dissipation. Compared with the heat dissipation path of the first chip transferring heat to the heat sink through the second chip, the heat dissipation path formed by the third heat conducting sheet and heat conducting column has a lower thermal resistance. Compared with the first circuit board, the heat sink has a higher heat dissipation efficiency, which can make the heat dissipation efficiency of the first chip higher, which is conducive to improving the heat dissipation efficiency of the package assembly, and further reduce the limitation on the performance of the package assembly caused by the low heat dissipation efficiency. In addition, the heat conducting column is connected to the first circuit board, and the connection of the heat conducting column is relatively easy. In addition, the set heat conducting column may not affect the packaging of the package assembly.

[0039] The third heat conducting sheet may be a metal sheet formed by the metal layer of the first circuit board, for example, the third heat conducting sheet may be a copper sheet.

[0040] In a possible implementation of the electronic device provided in the third aspect, the first chip includes a second electrical connection area on one side facing the first circuit board, and the projection of the second electrical connection area along the thickness direction of the first circuit board is located outside the projection of the third heat conducting sheet along the thickness direction of the first circuit board. The first chip is provided with a second power terminal and a second signal terminal on one side facing the first circuit board, and the second power terminal and the second signal terminal are both located in the second electrical connection area, and the first chip is electrically connected to the first circuit board through the second power terminal and the second signal terminal. A fourth heat conducting structure is provided between the first chip and the fourth connection portion, and the first chip is connected to the fourth connection portion through the fourth heat conducting structure, so that the first chip is thermally connected to the third heat conducting sheet through the fourth heat conducting structure. In this way, it is convenient to electrically connect the first chip to the first circuit board having the third heat conducting sheet, and the third heat conducting sheet has little effect on the current and signal transmission between the first circuit board and the first chip. In addition, the second power terminal and the second signal terminal are both arranged outside the overlapping area of ​​the first chip and the third heat conducting sheet, which is conducive to arranging the third heat conducting sheet with a larger size and better integrity, so that the heat conduction efficiency of the third heat conducting sheet is higher.

[0041] The second power terminal is a terminal for supplying power between the first chip and the second circuit board, and the second signal terminal is a terminal for transmitting signals between the first chip and the second circuit board.

[0042] In a possible implementation of the electronic device provided in the third aspect, the third heat conducting sheet is made of a conductive material, the fourth heat conducting structure includes a second grounding terminal provided on the side of the first chip facing the first circuit board, the projection of the second grounding terminal along the thickness direction of the first circuit board is located within the projection of the fourth connection portion along the thickness direction of the first circuit board, and the first chip is electrically connected to the fourth connection portion through the second grounding terminal. In this way, the second grounding terminal can be used for heat conduction between the first chip and the third heat conducting sheet, and can also be used to ground the first chip, so that the utilization rate of the terminal provided on the first chip is higher.

[0043] In a possible implementation, the surface of the first circuit board on one side for mounting the first chip has a third heat conducting sheet. In this way, the heat conducting column and the first chip can be conveniently connected to the third heat conducting sheet located on the surface of the first circuit board. In addition, the heat conduction path between the heat conducting column and the first chip and the third heat conducting sheet located on the surface of the first circuit board is also short, so that the heat dissipation efficiency of the first chip through the heat conducting column is higher.

[0044] In a possible implementation, the first chip includes a third part and a fourth part, the third part includes a first core, the fourth part includes a second core, and the power of the first core is greater than the power of the second core. The projection of the fourth connection portion along the thickness direction of the first circuit board is located within the projection of the third part along the thickness direction of the first circuit board, and the projection of the fourth connection portion along the thickness direction of the first circuit board is located outside the projection of the fourth part along the thickness direction of the first circuit board. In this way, the first core with higher power is arranged near the fourth connection portion, and the heat conduction path between the first core and the third heat conducting plate is shorter, so that a large amount of heat generated by the first core during operation can be efficiently dissipated through the third heat conducting plate and the heat conducting column, and the risk of overheating of the first chip and the package assembly is relatively small.

[0045] In a possible implementation of the electronic device provided in the third aspect, the electronic device further includes a shielding cover. The shielding cover is mounted on the first circuit board, and the heat dissipation device is disposed on the side of the shielding cover away from the first circuit board. An installation space is formed between the shielding cover and the first circuit board, and the first chip and the second chip are both disposed in the installation space. The thermally conductive column is disposed outside the shielding cover. In this way, the shielding cover can electromagnetically shield the first chip and the second chip, and can reduce the electromagnetic interference caused by components outside the shielding cover to the first chip and the second chip. In addition, the thermally conductive column will not affect the setting of the shielding cover, and the thermally conductive column and the shielding cover are both relatively convenient to install.

[0046] In a possible implementation of the electronic device provided in the third aspect, the first chip is a logic chip or a system chip, and the second chip is a memory chip. In this way, the signal transmission paths between the logic chip or the system chip and the memory chip and the first circuit board are all short, and the loss of the signals interacting between the logic chip or the system chip and the memory chip and the first circuit board is all small, and the transmission rate is all fast, so that the electronic device can have better processing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application;

[0048] Figure 2 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0049] Figure 3 A schematic diagram of arrangement of a heat-conducting column and a second chip on a first chip of an electronic device provided in an embodiment of the present application;

[0050] Figure 4 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0051] Figure 5 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0052] Figure 6 A schematic diagram of cooperation between a first bare chip and a first heat conducting sheet of an electronic device provided in an embodiment of the present application;

[0053] Figure 7 A schematic diagram of cooperation between a first bare chip and a first heat conducting sheet of another electronic device provided in an embodiment of the present application;

[0054] Figure 8 A schematic diagram of cooperation between a first bare chip and a first heat conducting sheet of another electronic device provided in an embodiment of the present application;

[0055] Fig. 9 A schematic diagram of cooperation between a first bare chip and a first heat conducting sheet of another electronic device provided in an embodiment of the present application;

[0056] Fig.10 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0057] Fig.11 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0058] Fig.12 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0059] Fig.13 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0060] Fig.14 A process flow chart of a method for preparing an electronic device provided in an embodiment of the present application;

[0061] Fig.15 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0062] Fig.16 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0063] Fig.17 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0064] Fig.18 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0065] Fig.19 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0066] Fig. 20 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0067] Fig.21 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0068] Fig. 22 A schematic diagram of the cooperation between a first chip and a third heat conducting sheet of an electronic device provided in an embodiment of the present application;

[0069] Fig.23 A schematic diagram of cooperation between a first chip and a third heat conducting sheet of another electronic device provided in an embodiment of the present application;

[0070] Fig.24 A schematic diagram of cooperation between a first chip and a third heat conducting sheet of another electronic device provided in an embodiment of the present application;

[0071] Fig.25 A schematic diagram of cooperation between a first chip and a third heat conducting sheet of another electronic device provided in an embodiment of the present application;

[0072] Fig.26 A schematic diagram of another electronic device provided in an embodiment of the present application;

[0073] Fig. 27 A schematic diagram of a heat-conducting column provided in an embodiment of the present application;

[0074] Fig.28 A schematic diagram of another heat-conducting column provided in an embodiment of the present application;

[0075] Fig.29 A schematic diagram of another thermally conductive column provided in an embodiment of the present application.

[0076] Description of reference numerals:

[0077] 10. Packaging assembly; 20. Heat dissipation device; 30. Thermal conductive column; 31. First section; 32. Second section; 33. Third section; 34. Fourth section; 35. Fifth section; 36. Sixth section; 40. Shielding cover; 41. Through hole; 50. Thermal interface material;

[0078] 100, first circuit board; 110, third heat conducting sheet; 111, third connecting portion; 112, fourth connecting portion;

[0079] 200, first chip; 210, second circuit board; 211, first heat conducting sheet; 2111, second connection portion; 212, second electrical connection area; 213, second thermal conduction area; 220, first bare die; 221, first portion; 222, second portion; 223, first electrical connection area; 224, first core; 225, second core; 226, first thermal conduction area; 227, second thermal conduction structure; 2271, first pad; 2272, first Solder; 2273, second solder pad; 230, first packaging structure; 240, third part; 250, fourth part; 260, conductive column; 270, first connecting part; 271, second solder; 280, third circuit board; 281, second heat conductive sheet; 282, third heat conductive structure; 2821, third solder pad; 2822, solder ball; 283, first heat conductor; 284, second heat conductor; 285, fifth electrical connection terminal; 290, second filling medium;

[0080] 300, second chip; 310, fourth circuit board; 320, second bare die; 330, second packaging structure;

[0081] 400, a first filling medium;

[0082] 510, first electrical connection terminal; 511, first power supply terminal; 512, first signal terminal; 520, second electrical connection terminal; 521, second power supply terminal; 522, second signal terminal; 530, first thermal conductive structure; 531, first ground terminal; 540, fourth thermal conductive structure; 541, second ground terminal; 550, third electrical connection terminal; 560, first connection terminal; 570, second connection terminal. DETAILED DESCRIPTION

[0083] The terms used in the implementation method part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application. The implementation method of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0084] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer (portable android device, PAD), a laptop computer, a personal digital assistant (personal digital assistant, PDA), a server, a switch, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (virtual reality, VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self driving, a wireless terminal in remote medical, a wireless terminal in a smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in a smart city (smart city), a wireless terminal in a smart home (smart home), etc.

[0085] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application.

[0086] like Figure 1 As shown, in the embodiment of the present application, the electronic device may include a first circuit board 100, a packaging component 10 and a heat sink 20, the packaging component 10 is mounted on the surface of the first circuit board 100, and the heat sink 20 is arranged on the side of the packaging component 10 away from the first circuit board 100, that is, the packaging component 10 is arranged between the first circuit board 100 and the heat sink 20. The side of the packaging component 10 away from the first circuit board 100 is connected to the heat sink 20, so that the packaging component 10 and the heat sink 20 are thermally conductive, and the packaging component 10 can dissipate heat through the heat sink 20.

[0087] Exemplarily, the heat dissipation device 20 may include but is not limited to a liquid cooling plate, a heat spreader, a graphite sheet, etc.

[0088] Exemplarily, the first circuit board 100 may include but is not limited to a main board, a business board, etc. of an electronic device.

[0089] In the embodiment of the present application, the package assembly 10 includes a first chip 200 and a second chip 300. In order to reduce the board area occupied by the package assembly 10 on the first circuit board 100, the first chip 200 and the second chip 300 are stacked. The package assembly 10 can be a package assembly formed by stacking packaging, for example, the package assembly 10 can be a package assembly formed by high-band stacking packaging (Highband package on package, HBPOP).

[0090] Specifically, the second chip 300 is arranged on one side of the first chip 200 in the thickness direction, and the other side of the first chip 200 in the thickness direction is connected to the first circuit board 100. The heat dissipation device 20 is arranged on the side of the second chip 300 away from the first chip 200, and the side of the second chip 300 away from the first chip 200 is connected to the heat dissipation device 20 so that the second chip 300 is thermally conductive with the heat dissipation device 20, and the second chip 300 can dissipate heat through the heat dissipation device 20.

[0091] For example, a second electrical connection terminal 520 may be provided on a side of the first chip 200 facing away from the second chip 300 , and the first chip 200 may be fixed and electrically connected to the first circuit board 100 via the second electrical connection terminal 520 .

[0092] The second electrical connection terminal 520 may include but is not limited to a solder ball structure, a solder column structure, a pin structure, a conductive bump, etc. A plurality of second electrical connection terminals 520 distributed in an array may be disposed on a side of the first chip 200 away from the second chip 300 .

[0093] In the related art, one heat dissipation path of the first chip close to the first circuit board is to transfer the generated heat to the heat dissipation device through the second chip for heat dissipation. However, the second chip often has a large thermal resistance, so that the thermal resistance between the first chip and the heat dissipation device is large, and the efficiency of transferring the heat on the first chip to the heat dissipation device through the second chip is low, resulting in low efficiency of heat dissipation of the first chip through the second chip. Another heat dissipation path of the first chip close to the first circuit board is to transfer the generated heat to the first circuit board through the second electrical connection terminal and other structures used to connect to the first circuit board for heat dissipation. However, the heat on the first circuit board can often only be dissipated into the air of the environment where the first circuit board is located. The heat exchange efficiency between the first circuit board and the air of the environment is low, so that the efficiency of heat dissipation of the first chip through the first circuit board is also low. In summary, in the packaging assembly in the related art, the first chip close to the first circuit board has the problem of low heat dissipation efficiency, which makes the heat dissipation efficiency of the entire packaging assembly low. The low heat dissipation efficiency of the packaging assembly will limit the performance of the packaging assembly.

[0094] Based on this, in the embodiment of the present application, a heat-conducting column 30 (as shown below) is provided, one end of which is thermally connected to the heat dissipation device 20 and the other end of which is thermally connected to the first chip 200. Figure 2As shown in the figure, the heat generated by the first chip 200 can be transferred to the heat sink 20 through the thermally conductive column 30, so that the thermal resistance between the first chip 200 and the heat sink 20 can be relatively small, so that the first chip 200 can dissipate heat more efficiently through the thermally conductive column 30 and the heat sink 20, which is beneficial to improve the heat dissipation efficiency of the entire packaging component 10, thereby reducing the limitation on the performance of the packaging component 10 caused by the low heat dissipation efficiency.

[0095] In some examples, after setting the thermal conductive column 30, the first chip 200 can also be thermally connected to the first circuit board 100 through the second electrical connection terminal 520 and other connecting structures, and part of the heat on the first chip 200 can also be dissipated through the first circuit board 100 to the environment where the first circuit board 100 is located.

[0096] In some examples, after the heat-conducting pillars 30 are provided, the first chip 200 can also be thermally connected to the second chip 300 , and part of the heat on the first chip 200 can also be transferred to the heat dissipation device 20 through the second chip 300 for heat dissipation.

[0097] That is, in some examples, after the thermally conductive column 30 is set, the first chip 200 may have a heat dissipation path that transfers heat to the heat dissipation device 20 for heat dissipation through the thermally conductive column 30, a heat dissipation path that transfers heat to the heat dissipation device 20 for heat dissipation through the second chip 300, and a heat dissipation path that transfers heat to the first circuit board 100 through a connecting structure such as a second electrical connection terminal 520 connected to the first circuit board 100 to dissipate the heat to the environment where the first circuit board 100 is located.

[0098] Exemplarily, the material forming the thermal conductive pillar 30 may include one or more of the following: copper, silver, aluminum, silicon, etc.

[0099] For example, the heat-conducting column 30 may be a cylindrical structure, a square column structure, etc. The length and width of the heat-conducting column 30 may not be equal.

[0100] Figure 2 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0101] like Figure 2As shown, in some possible embodiments, the package assembly 10 may include a heat-conducting column 30, the projection of the heat-conducting column 30 along the thickness direction of the first chip 200 is located outside the projection of the second chip 300 along the thickness direction of the first chip 200. The first chip 200 has a first connecting portion 270, the projection of the first connecting portion 270 along the thickness direction of the first chip 200 is located outside the projection of the second chip 300 along the thickness direction of the first chip 200. One end of the heat-conducting column 30 is connected to the first connecting portion 270, so that the heat-conducting column 30 is thermally connected to the first chip 200, that is, one end of the heat-conducting column 30 is connected to a portion of the first chip 200 that does not overlap with the second chip 300. The other end of the heat-conducting column 30 protrudes from the surface of the first chip 200 on the side facing the second chip 300, and is connected to the heat dissipation device 20, so that the heat-conducting column 30 is used for thermal conduction with the heat dissipation device 20, so that the first chip 200 can be thermally connected to the heat dissipation device 20 through the heat-conducting column 30.

[0102] In this way, the thermally conductive column 30 is connected to the heat sink 20 to form a heat dissipation path for the first chip 200. The heat generated by the first chip 200 can be transferred to the heat sink 20 through the thermally conductive column 30 for dissipation. Compared with the heat dissipation path in which the first chip 200 transfers heat to the heat sink 20 through the second chip 300, the thermal resistance of the thermally conductive column 30 is lower. Compared with the first circuit board 100, the heat sink 20 has a higher heat dissipation efficiency, which can make the heat dissipation efficiency of the first chip 200 higher, which is beneficial to improving the heat dissipation efficiency of the packaging component 10, and further reducing the limitation on the performance of the packaging component 10 caused by the low heat dissipation efficiency.

[0103] Exemplarily, the heat conducting pillars 30 may be disposed on one side or multiple sides of the second chip 300 .

[0104] For example, the heat conducting pillars 30 may be disposed on any two sides of the second chip 300 .

[0105] Figure 3 This is a schematic diagram of the arrangement of a heat-conducting column and a second chip on a first chip of an electronic device provided in an embodiment of the present application, with reference to Figure 3 As shown, for another example, heat conducting pillars 30 may be disposed around the second chip 300 .

[0106] The positions, length, width and quantity of the heat-conducting pillars 30 disposed on the first chip 200 may be determined according to the layout of the first chip 200 and the second chip 300 .

[0107] Exemplarily, the first chip 200 may include but is not limited to a system on chip (SOC), a logic chip, a memory chip, a sensing chip, a communication chip, an energy chip, etc.

[0108] Exemplarily, the second chip 300 may include but is not limited to a system chip, a logic chip, a memory chip, a sensing chip, a communication chip, an energy chip, etc.

[0109] In some possible implementations, the first chip 200 is a logic chip or a system chip, and the second chip 300 is a memory chip.

[0110] In this way, the logic chip or the system chip is arranged between the first circuit board 100 and the memory chip, the signal transmission paths between the logic chip or the system chip and the memory chip and the first circuit board 100 are shorter, the loss of the signals interacting between the logic chip or the system chip and the memory chip and the first circuit board 100 is smaller, and the transmission rate is faster, so that the electronic device has better processing performance.

[0111] Exemplarily, the first chip 200 is a system chip, and the second chip 300 is a double data rate synchronous dynamic random access memory (DDR SDRAM).

[0112] Figure 4 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0113] like Figure 4 As shown, in the embodiment of the present application, the first chip 200 includes a second circuit board 210 and a first die 220 (die). The first die 220 is arranged on one side of the second circuit board 210 in the thickness direction, and the other side of the second circuit board 210 in the thickness direction is used to be connected to the first circuit board 100, and the second chip 300 is arranged on the side of the first die 220 away from the second circuit board 210.

[0114] By way of example, the first die 220 may be a silicon wafer.

[0115] Exemplarily, the first bare chip 220 may include one or more of the following modules: a central processing unit (CPU), a graphics processing unit (GPU), an embedded neural processor unit (NPU), a cache memory, an internet service provider (ISP) module, etc.

[0116] When the first chip 200 is fixed and electrically connected to the first circuit board 100 through the second electrical connection terminal 520, a second electrical connection terminal 520 is provided on the side of the second circuit board 210 facing away from the first bare chip 220. The second electrical connection terminal 520 fixes and electrically connects the side of the second circuit board 210 facing away from the first bare chip 220 to the first circuit board 100.

[0117] For example, the first bare die 220 mounted on the second circuit board 210 may be electrically connected to the second circuit board 210 through wires.

[0118] For example, a first electrical connection terminal 510 may be provided on a side of the first die 220 facing away from the second chip 300 , and the first die 220 may be fixed and electrically connected to the second circuit board 210 via the first electrical connection terminal 510 .

[0119] The first electrical connection terminal 510 may include but is not limited to a solder ball structure, a solder column structure, a pin structure, a conductive bump structure, etc. A plurality of first electrical connection terminals 510 distributed in an array may be disposed on a side of the first bare die 220 facing away from the second chip 300 .

[0120] In the embodiment of the present application, the first chip 200 further includes a first packaging structure 230, and at least a portion of the first bare die 220 is covered by the first packaging structure 230, so that the first packaging structure 230 can protect the first bare die 220. The second chip 300 is disposed on a side of the first packaging structure 230 away from the second circuit board 210, and the second chip 300 is connected to a side of the first packaging structure 230 away from the second circuit board 210, so that the first bare die 220 is connected to the second chip 300 through the first packaging structure 230.

[0121] The first encapsulation structure 230 is made of a non-conductive material. For example, the material forming the first encapsulation structure 230 may include one or more of the following: epoxy resin, resin, moldable polymer, etc.

[0122] For example, a third electrical connection terminal 550 may be provided on a side of the second chip 300 facing the first chip 200 , and the second chip 300 may be fixed and electrically connected to the first chip 200 via the third electrical connection terminal 550 .

[0123] The third electrical connection terminal 550 may include but is not limited to a solder ball structure, a solder column structure, a pin structure, a conductive bump structure, etc. A plurality of third electrical connection terminals 550 distributed in an array may be disposed on a side of the second chip 300 facing the first chip 200 .

[0124] Exemplarily, a conductive column 260 may be provided in the first packaging structure 230, and the projection of the conductive column 260 in the thickness direction of the first chip 200 is located outside the projection of the first bare die 220 in the thickness direction of the first chip 200. The conductive column 260 passes through the first packaging structure 230 at both ends of the first chip 200 in the thickness direction. One end of the conductive column 260 is electrically connected to the second circuit board 210, and the other end of the conductive column 260 can be electrically connected to the second chip 300 through the third electrical connection terminal 550.

[0125] Exemplarily, a first filling medium 400 is filled between the first chip 200 and the second chip 300 . The first filling medium 400 is made of a non-conductive material and is used to support the second chip 300 so that the second chip 300 can be mounted on the first chip 200 more stably.

[0126] For example, the first filling medium 400 may be formed of a thermal interface material (TIM) such as silicone grease, so as to improve the thermal conductivity between the first chip 200 and the second chip 300 .

[0127] In the embodiment of the present application, the second chip 300 includes a fourth circuit board 310, a second die 320 (die), and a second packaging structure 330. One side of the fourth circuit board 310 is connected to a side of the first chip 200 that is away from the first circuit board 100, and the second die 320 is mounted on the other side of the fourth circuit board 310, and at least a portion of the second die 320 is covered by the second packaging structure 330.

[0128] Exemplarily, the second die 320 is a silicon wafer.

[0129] When the second chip 300 is fixed and electrically connected to the first chip 200 through the third electrical connection terminal 550, the third electrical connection terminal 550 is provided on the side of the fourth circuit board 310 facing the first chip 200. The third electrical connection terminal 550 fixes and electrically connects the side of the fourth circuit board 310 facing the first chip 200 to the first chip 200.

[0130] When the first filling medium 400 is filled between the first chip 200 and the second chip 300 , the first filling medium 400 is located between the first packaging structure 230 and the fourth circuit board 310 .

[0131] For example, the second bare die 320 mounted on the fourth circuit board 310 may be electrically connected to the fourth circuit board 310 through wires.

[0132] Exemplarily, a fourth electrical connection terminal (not shown) may be provided on a side of the second die 320 facing away from the second chip 300 , and the second die 320 may be fixed and electrically connected to the fourth circuit board 310 via the fourth electrical connection terminal.

[0133] The fourth electrical connection terminal may include but is not limited to a solder ball structure, a solder column structure, a pin structure, a conductive bump structure, etc. A side of the second bare die 320 facing the fourth circuit board 310 may be provided with a plurality of fourth electrical connection terminals distributed in an array.

[0134] The second encapsulation structure 330 is made of a non-conductive material. For example, the material forming the second encapsulation structure 330 may include one or more of the following: epoxy resin, resin, moldable polymer, etc.

[0135] Exemplarily, the first encapsulation structure 230 and the second encapsulation structure 330 may be separate structures.

[0136] Exemplarily, the first encapsulation structure 230 , the second encapsulation structure 330 , and the first filling medium 400 may be an integral structure.

[0137] Exemplarily, the first encapsulation structure 230 , the second encapsulation structure 330 , and the first filling medium 400 may be formed of the same material.

[0138] Exemplarily, the second packaging structure 330 may be connected to the heat dissipation device 20 via a thermal interface material.

[0139] In some possible embodiments, the second circuit board 210 has a first heat conductive sheet 211, and the first heat conductive sheet 211 has a first connection portion 270 and a second connection portion 2111. The projection of the first connection portion 270 along the thickness direction of the second circuit board 210 is located outside the projection of the first die 220 along the thickness direction of the second circuit board 210. The projection of the second connection portion 2111 along the thickness direction of the second circuit board 210 is located inside the projection of the first die 220 along the thickness direction of the second circuit board 210. The heat conductive column 30 is connected to the first heat conductive sheet 211 so that the heat conductive column 30 is thermally connected to the first heat conductive sheet 211, and the second connection portion 2111 is connected to the first die 220 so that the first heat conductive sheet 211 is thermally connected to the first die 220, so that the first die 220 can be thermally connected to the heat dissipation device 20 through the first heat conductive sheet 211 and the heat conductive column 30.

[0140] In this way, the heat generated by the first bare die 220 can be transferred to the heat sink 20 through the first heat conductive sheet 211 and the heat conductive column 30 for heat dissipation, and the heat dissipation efficiency of the first bare die 220 is relatively high. In addition, the heat conductive column 30 is connected to the second circuit board 210, and the connection of the heat conductive column 30 is relatively easy. In addition, the heat conductive column 30 does not affect the packaging of the first bare die 220, which is conducive to the first packaging structure 230 for protecting the first bare die 220 being arranged on the surface of the first bare die 220.

[0141] Exemplarily, the material forming the first heat conductive sheet 211 may include one or more of the following: copper, silver, aluminum, etc.

[0142] Exemplarily, the second circuit board 210 may include at least one metal layer, and the first heat conductive sheet 211 may be a metal sheet formed by one of the metal layers of the second circuit board 210. For example, the first heat conductive sheet 211 may be a copper sheet.

[0143] Exemplarily, the first heat conducting sheet 211 may be a grounded metal sheet in the second circuit board 210 .

[0144] For example, the first heat conductive sheet 211 may be insulated from a grounded portion of the second circuit board 210 .

[0145] Exemplarily, the heat-conducting column 30 and the first heat-conducting sheet 211 may be connected by welding, bonding with a heat-conducting adhesive, or the like.

[0146] Exemplarily, the second connection portion 2111 and the first bare chip 220 may be connected by bonding with a thermally conductive adhesive.

[0147] In some possible implementations, the surface of the second circuit board 210 on one side for mounting the first bare chip 220 has a first heat conductive sheet 211. In other words, the first heat conductive sheet 211 is formed on the metal layer on the surface of the second circuit board 210.

[0148] In this way, the heat-conducting column 30 and the first bare chip 220 can be conveniently connected to the first heat-conducting sheet 211 located on the surface of the second circuit board 210. In addition, the heat conduction path between the heat-conducting column 30 and the first bare chip 220 and the first heat-conducting sheet 211 located on the surface of the second circuit board 210 is also short, so that the heat dissipation efficiency of the first bare chip 220 through the heat-conducting column 30 is higher.

[0149] When the second circuit board 210 includes multiple metal layers, the second circuit board 210 may have multiple first heat conductive plates 211 distributed in different metal layers, and the multiple first heat conductive plates 211 distributed in different metal layers can be thermally connected through the heat conductive structure penetrating through the via hole of the second circuit board 210.

[0150] In some examples where the second circuit board 210 includes the first heat conductive sheet 211 , a portion of the second circuit board 210 is not covered by the first packaging structure 230 , and the heat conductive pillars 30 are disposed outside the first packaging structure 230 .

[0151] In this way, the first packaging structure 230 is unlikely to affect the heat conduction of the heat-conducting pillar 30 , and the first heat-conducting sheet 211 is more efficient in transferring heat to the heat dissipation device 20 through the heat-conducting pillar 30 .

[0152] Figure 5 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0153] like Figure 5 As shown, in some examples where the second circuit board 210 includes the first heat conducting sheet 211 , the side surface of one end of the heat conducting column 30 connected to the first connecting portion 270 is covered by the first packaging structure 230 .

[0154] In this way, the connection between the heat-conducting column 30 and the first heat-conducting sheet 211 can be more stable, and the heat conduction can be more stable.

[0155] Figure 6 A schematic diagram of the cooperation between a first bare chip and a first heat conductive sheet of an electronic device provided in an embodiment of the present application.

[0156] like Figure 6 As shown, and see Figure 5 The first bare chip 220 may include a first part 221 and a second part 222, the first part 221 includes a first core 224, the second part 222 includes a second core 225, the power of the first core 224 is greater than the power of the second core 225, that is, the heat generated by the first core 224 when it is running is greater than the heat generated by the second core 225 when it is running.

[0157] It should be noted that the first core 224 is not necessarily the core with the highest power in the first die 220, and the second core is not necessarily the core with the lowest power in the first die 220. When the first die 220 includes multiple cores, the first core 224 can be any one of the cores with higher power, and the second core 225 can be any one of the cores with lower power.

[0158] Exemplarily, the first core 224 can be used to operate when the package component 10 needs to operate at high power consumption, and the first core 224 can stop operating when the package component 10 does not need to operate at high power consumption. When the package component 10 does not need to operate at high power consumption, the needs of the package component 10 can be met by running the second core 225.

[0159] Illustratively, the first portion 221 may include a plurality of first cores 224 .

[0160] Exemplarily, any first core 224 may include but is not limited to a performance core of a central processing unit or a performance core of a graphics processing unit, and the performance core may also be called a large core.

[0161] Illustratively, the second portion 222 may include a plurality of second cores 225 .

[0162] Exemplarily, any second core 225 may include, but is not limited to, an embedded neural network processor, a cache memory, a network providing module, an energy efficiency core of a central processing unit, or an energy efficiency core of a graphics processing unit, etc. The energy efficiency core may also be called a small core.

[0163] In some examples where the second circuit board 210 includes a first heat conductive sheet 211, a projection of the second connection portion 2111 along the thickness direction of the second circuit board 210 is located within a projection of the first portion 221 along the thickness direction of the second circuit board 210, and a projection of the second connection portion 2111 along the thickness direction of the second circuit board 210 is located outside a projection of the second portion 222 along the thickness direction of the second circuit board 210.

[0164] In this way, the first core 224 with higher power is arranged near the second connecting portion 2111, and the heat conduction path between the first core 224 and the first heat conductive sheet 211 is shorter, so that a large amount of heat generated when the first core 224 is running can be efficiently dissipated through the first heat conductive sheet 211 and the heat conductive column 30, and the risk of overheating of the first bare chip 220 and the packaging component 10 is relatively small.

[0165] Figure 7 A schematic diagram of the cooperation between a first bare chip and a first heat conductive sheet of another electronic device provided in an embodiment of the present application.

[0166] like Figure 7 As shown, and see Figure 5 In some possible embodiments, the side of the first bare chip 220 facing the second circuit board 210 includes a first electrical connection area 223 and a first thermal conduction area 226, the projection of the first electrical connection area 223 along the thickness direction of the second circuit board 210 is located outside the projection of the first heat conductive sheet 211 along the thickness direction of the second circuit board 210, and the projection of the first thermal conduction area 226 along the thickness direction of the second circuit board 210 is located inside the projection of the first heat conductive sheet 211 along the thickness direction of the second circuit board 210.

[0167] The plurality of first electrical connection terminals 510 disposed on the side of the first bare die 220 facing the second circuit board 210 include a first power terminal 511 and a first signal terminal 512, both of which are located in the first electrical connection region 223, that is, the first power terminal 511 and the first signal terminal 512 are not disposed in the first thermal conduction region 226. The first bare die 220 is electrically connected to the second circuit board 210 via the first power terminal 511 and the first signal terminal 512.

[0168] A first heat-conducting structure 530 is provided between the first bare chip 220 and the second connecting portion 2111, and the first bare chip 220 is connected to the second connecting portion 2111 through the first heat-conducting structure 530. Specifically, a first heat-conducting structure 530 is provided between the first thermal conduction region 226 and the second connecting portion 2111, and the first thermal conduction region 226 is connected to the second connecting portion 2111 through the first heat-conducting structure 530, so that the first bare chip 220 is thermally connected to the first heat-conducting sheet 211 through the first heat-conducting structure 530.

[0169] In this way, it is convenient to realize electrical connection between the first bare die 220 and the second circuit board 210 having the first heat conductive sheet 211, and the first heat conductive sheet 211 has little influence on the current and signal transmission between the second circuit board 210 and the first bare die 220. In addition, the first power terminal 511 and the first signal terminal 512 are both arranged outside the overlapping area between the first bare die 220 and the first heat conductive sheet 211, which is conducive to arranging the first heat conductive sheet 211 with a larger size and better integrity, so that the heat conduction efficiency of the first heat conductive sheet 211 is higher.

[0170] The first power terminal 511 is a terminal for supplying power between the first bare die 220 and the second circuit board 210 , and the first signal terminal 512 is a terminal for transmitting signals between the first bare die 220 and the second circuit board 210 .

[0171] An edge of one side of the first thermal conduction region 226 at least partially overlaps with an edge of one side of the first die 220 , that is, the first electrical connection region 223 is not disposed on at least one side of the first thermal conduction region 226 .

[0172] Exemplarily, the material forming the first heat conducting structure 530 may include one or more of the following: copper, silver, aluminum, etc.

[0173] In some examples, the first heat conducting structure 530 may include a thermal interface material filled between the first heat conducting region 226 and the second connection portion 2111 .

[0174] In some other examples, the first heat conducting structure 530 may include a thermally conductive pad sandwiched between the first thermal conductive region 226 and the second connection portion 2111 .

[0175] In other examples, the first heat conduction structure 530 may include a terminal disposed in the first heat conduction region 226, and the terminal disposed in the first heat conduction region 226 may be disabled to prevent the terminal disposed in the first heat conduction region 226 from being short-circuited due to being connected to the first heat conduction sheet 211, so that the terminal disposed in the first heat conduction region 226 may be connected to the first heat conduction sheet 211 to transfer the heat of the first die 220 to the first heat conduction sheet 211. In this way, the first die 220 and the first heat conduction sheet 211 may be thermally connected by using the terminal in the first heat conduction region 226, and the connection structure between the first die 220 and the first heat conduction sheet 211 is relatively simple.

[0176] In some possible embodiments, the first heat conductive sheet 211 is made of a conductive material, the first heat conductive structure 530 includes a first grounding terminal 531 disposed on the side of the first bare chip 220 facing the second circuit board 210, the projection of the first grounding terminal 531 along the thickness direction of the second circuit board 210 is located within the projection of the second connecting portion 2111 along the thickness direction of the second circuit board 210, and the first bare chip 220 is electrically connected to the second connecting portion 2111 through the first grounding terminal 531.

[0177] In this way, the first grounding terminal 531 can be used for heat conduction between the first bare die 220 and the first heat conducting sheet 211 , and can also be used for grounding the first bare die 220 , so that the utilization rate of the terminal provided on the first bare die 220 is higher.

[0178] For example, the first heat conducting structure 530 may be located at an edge of a side of the first die 220 that at least partially overlaps with a side of the first heat conducting region 226 .

[0179] Figure 8 A schematic diagram of the cooperation between a first bare chip and a first heat conductive sheet of another electronic device provided in an embodiment of the present application.

[0180] like Figure 8 As shown, in some examples, the first heat conductive structure 530 may not be located at the edge of the side of the first die 220 that at least partially overlaps with the side of the first thermal conductive region 226 , and the remaining terminals except the first heat conductive structure 530 may be cleared in the first thermal conductive region 226 .

[0181] Fig. 9 A schematic diagram of the cooperation between a first bare chip and a first heat conductive sheet of another electronic device provided in an embodiment of the present application.

[0182] like Fig. 9As shown, in some examples, the first die 220 is further provided with a first connection terminal 560 with a disabled current interaction function on the side facing the second circuit board 210, that is, there is no current input or output in the first connection terminal 560. The first heat-conducting structure 530 may also include a first connection terminal 560, which may connect the second connection portion 2111 to the first heat-conducting region 226, so that the first die 220 may be thermally connected to the first heat-conducting sheet 211 through the first connection terminal 560. In this way, the connection between the first die 220 and the second circuit board 210 may be more stable.

[0183] In some examples, the first connection terminal 560 and the first heat conducting sheet 211 may be spaced apart from each other to insulate the first connection terminal 560 from the first heat conducting sheet 211 .

[0184] Fig.10 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0185] like Fig.10 As shown, in some possible embodiments, the first bare chip 220 has a first connecting portion 270, and the thermally conductive column 30 is connected to the first bare chip 220. Specifically, one end of the thermally conductive column 30 is connected to a side of the first bare chip 220 that is away from the second circuit board 210, so that the thermally conductive column 30 and the first bare chip 220 are thermally conductive.

[0186] In this way, the heat generated by the first bare die 220 can be directly transferred to the heat sink 20 through the heat conductive column 30 for heat dissipation. The heat conduction path between the first bare die 220 and the heat sink 20 is shorter, and the heat dissipation efficiency of the first bare die 220 is higher.

[0187] For example, the thermally conductive pillar 30 may be connected to the first bare chip 220 by welding, bonding with a thermally conductive adhesive, or the like.

[0188] For example, the thermally conductive pillar 30 may be connected to the first die 220 via a thermal interface material.

[0189] In some examples where the first die 220 has the first connection 270 , the first portion 221 of the first die 220 has the first connection 270 .

[0190] In this way, the first core 224 with higher power is arranged near the first connecting portion 270, and the heat conduction path between the first core 224 and the heat conduction column 30 is shorter, so that a large amount of heat generated by the first core 224 during operation can be efficiently dissipated through the heat conduction column 30, and the risk of overheating of the first bare chip 220 and the packaging component 10 is relatively small.

[0191] In some examples where the first die 220 has the first connection portion 270 , a portion of the first die 220 is not covered by the first packaging structure 230 , and the thermal conductive pillar 30 is disposed outside the first packaging structure 230 .

[0192] In this way, the first packaging structure 230 is unlikely to affect the heat conduction of the thermally conductive pillars 30 , and the first bare die 220 is more efficient in transferring heat to the heat dissipation device 20 through the thermally conductive pillars 30 .

[0193] Fig.11 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0194] like Fig.11 As shown, in some examples where the first die 220 has the first connection portion 270 , the side surface of one end of the thermal conductive column 30 connected to the first connection portion 270 is covered by the first packaging structure 230 .

[0195] In this way, the connection between the thermal conductive pillar 30 and the first die 220 can be more stable.

[0196] Fig.12 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0197] like Fig.12 As shown, in some examples where the first chip 200 includes a first packaging structure 230, the first packaging structure 230 may include a first connecting portion 270, and the thermally conductive column 30 is connected to the first packaging structure 230. Specifically, one end of the thermally conductive column 30 is connected to a side of the first packaging structure 230 that is away from the second circuit board 210, so that the first bare chip 220 is thermally connected to the thermally conductive column 30 through the first packaging structure 230.

[0198] In this way, the heat-conducting pillars 30 will not affect the packaging of the first chip 200 , which is beneficial to protecting the first bare die 220 .

[0199] Fig.13 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0200] like Fig.13As shown, in some possible implementations, in order to facilitate the connection between the first chip 200 and the second chip 300, the first chip 200 further includes a third circuit board 280, which is disposed between the first bare chip 220 and the second chip 300. The side of the third circuit board 280 facing the second chip 300 is used to connect with the second chip 300, and the side of the third circuit board 280 facing away from the second chip 300 is used to connect with the second circuit board 210. A second heat conducting structure 227 is disposed between the first bare chip 220 and the third circuit board 280. 20 is connected to the third circuit board 280 through the second heat-conducting structure 227, so that the first bare chip 220 is thermally connected to the third circuit board 280 through the second heat-conducting structure 227, the third circuit board 280 has a first connecting portion 270, and the thermally conductive column 30 is connected to the third circuit board 280. Specifically, one end of the thermally conductive column 30 is connected to the side of the third circuit board 280 facing the second chip 300, so that the thermally conductive column 30 is thermally connected to the third circuit board 280, so that the first bare chip 220 is thermally connected to the thermally conductive column 30 through the second heat-conducting structure 227 and the third circuit board 280.

[0201] In this way, the first chip 200 is connected to the second chip 300 through the third circuit board 280, so that the interval between the first chip 200 and the second chip 300 can be smaller, which is convenient for connecting the first chip 200 and the second chip 300. On the basis of the convenient connection between the first chip 200 and the second chip 300, the heat generated by the first bare chip 220 can be transferred to the heat dissipation device 20 through the second heat-conducting structure 227, the third circuit board 280 and the heat-conducting column 30 for dissipation, so that the first bare chip 220 has a higher heat dissipation efficiency.

[0202] The first connection portion 270 and the second heat-conducting structure 227 may be connected via a heat conductor embedded in the third circuit board 280 , so that the first connection portion 270 and the second heat-conducting structure 227 are thermally conductive. The heat conductor may be embedded in a via hole of the third circuit board 280 .

[0203] Exemplarily, a fifth electrical connection terminal 285 may be provided on the side of the third circuit board 280 facing away from the second chip 300, and the projection of the fifth electrical connection terminal 285 in the thickness direction of the first chip 200 is located outside the projection of the first bare die 220 in the thickness direction of the first chip 200. The third circuit board 280 can be fixed and electrically connected to the second circuit board 210 through the fifth electrical connection terminal 285.

[0204] The fifth electrical connection terminal 285 may include but is not limited to a solder ball structure, a solder column structure, a pin structure, a conductive bump structure, etc. A plurality of fifth electrical connection terminals 285 distributed in an array may be disposed on a side of the third circuit board 280 away from the second chip 300 .

[0205] When the first chip 200 includes the third circuit board 280, the second chip 300 may be fixed and electrically connected to the third circuit board 280 via the third electrical connection terminal 550. Specifically, the fourth circuit board 310 may be fixed and electrically connected to the third circuit board 280 via the third electrical connection terminal 550.

[0206] When the first chip 200 includes the third circuit board 280 , the first filling medium 400 is filled between the third circuit board 280 and the second chip 300 . Specifically, the first filling medium 400 is filled between the fourth circuit board 310 and the third circuit board 280 .

[0207] When the first chip 200 includes the third circuit board 280 , the first encapsulation structure 230 is located between the second circuit board 210 and the third circuit board 280 .

[0208] Exemplarily, the heat-conducting pillar 30 and the third circuit board 280 may be connected to each other by welding, bonding with a heat-conducting adhesive, or the like.

[0209] In some examples, the second heat conductive structure 227 may include a thermal interface material filled between the first die 220 and the third circuit board 280 .

[0210] In other examples, the second heat conductive structure 227 may include a thermally conductive pad sandwiched between the first die 220 and the third circuit board 280 .

[0211] In some other examples, the second thermal conductive structure 227 may include a first solder pad 2271 and a second solder pad 2273 corresponding to the first solder pad 2271, the first solder pad 2271 is arranged on the surface of the first bare chip 220 on the side away from the second circuit board 210, the second solder pad 2273 is arranged on the surface of the third circuit board 280 on the side away from the second chip 300, the first solder pad 2271 and the corresponding second solder pad 2273 are welded by a first solder 2272 arranged therebetween, and the first bare chip 220 and the third circuit board 280 are thermally connected through the welded first solder pad 2271 and the second solder pad 2273.

[0212] In this way, the thermal connection between the first bare chip 220 and the third circuit board 280 is relatively stable. In addition, the thermal connection between the first bare chip 220 and the third circuit board 280 is also relatively convenient.

[0213] Exemplarily, the first pad 2271 may be made of a metal material, such as one or more of the following materials: copper, silver, aluminum, etc.

[0214] Exemplarily, the second pad 2273 may be made of a metal material, such as one or more of the following materials: copper, silver, aluminum, etc.

[0215] Exemplarily, the first solder 2272 may be tin, or other solder that can solder the first pad 2271 to the corresponding second pad 2273 and has good thermal conductivity.

[0216] In some examples, at least a portion of a projection of the first connection portion 270 in the thickness direction of the first chip 200 is located within a projection of the first die 220 in the thickness direction of the first chip 200 .

[0217] In this way, the second heat-conducting structure 227 is conveniently connected to the first connection part 270 through the heat conductor embedded in the third circuit board 280. In addition, the heat conduction path between the second heat-conducting structure 227 and the first connection part 270 can be shortened, which is beneficial to improving the heat conduction efficiency between the second heat-conducting structure 227 and the first connection part 270.

[0218] In some examples, the third circuit board 280 has a second heat conducting sheet 281, and the first connection portion 270 and the second heat conducting structure 227 are both connected to the second heat conducting sheet 281, so that the first connection portion 270 and the second heat conducting structure 227 are thermally connected through the second heat conducting sheet 281. At this time, the projection of the first connection portion 270 in the thickness direction of the first chip 200 can be located outside the projection of the first bare die 220 in the thickness direction of the first chip 200.

[0219] In this way, the heat generated by the first bare chip 220 can be transferred to the heat-conducting column 30 through the second heat-conducting structure 227, the second heat-conducting sheet 281 and the first connecting portion 270, so that when the first bare chip 220 is thermally connected to the heat-conducting column 30 through the second heat-conducting structure 227 and the third circuit board 280, the heat conduction efficiency between the first bare chip 220 and the heat-conducting column 30 is high. In addition, the arrangement positions of the first connecting portion 270 and the second heat-conducting structure 227 can be made more flexible.

[0220] Exemplarily, the material forming the second heat conductive sheet 281 may include one or more of the following: copper, silver, aluminum, etc.

[0221] Exemplarily, the third circuit board 280 may include at least one metal layer, and the second heat conductive sheet 281 may be a metal sheet formed by one of the metal layers of the third circuit board 280. For example, the second heat conductive sheet 281 may be a copper sheet.

[0222] Exemplarily, the second heat conductive sheet 281 may be a grounded metal sheet in the third circuit board 280 .

[0223] Illustratively, the second heat conductive sheet 281 may be insulated from a grounded portion of the third circuit board 280 .

[0224] Exemplarily, the first connection portion 270 disposed on the surface of the third circuit board 280 may be a pad structure.

[0225] Exemplarily, the first connection portion 270 is disposed on a surface of the third circuit board 280 facing the second chip 300 .

[0226] In this way, the heat conducting column 30 and the first connecting portion 270 can be connected more conveniently.

[0227] Exemplarily, at least a portion of a projection of the first connection portion 270 in the thickness direction of the first chip 200 is located within a projection of the second heat conducting sheet 281 in the thickness direction of the first chip 200 .

[0228] In this way, it is convenient to connect the first connection part 270 and the second heat conducting sheet 281. In addition, the heat conduction path between the first connection part 270 and the second heat conducting sheet 281 is shorter, and the heat conduction efficiency is higher.

[0229] Exemplarily, at least a portion of a projection of the first die 220 in the thickness direction of the first chip 200 is located within a projection of the second heat conducting sheet 281 in the thickness direction of the first chip 200 .

[0230] In this way, the first die 220 can be conveniently connected to the second heat conducting sheet 281 through the second heat conducting structure 227. In addition, the heat conduction path between the first die 220 and the second heat conducting sheet 281 can be shortened, and the heat conduction efficiency can be higher.

[0231] In some examples, the surface of the third circuit board 280 facing away from the second chip 300 has a second heat conductive sheet 281, that is, the metal layer of the surface of the third circuit board 280 facing away from the second chip 300 is formed with the second heat conductive sheet 281. The second heat conductive sheet 281 located on the surface of the third circuit board 280 facing away from the second chip 300 is connected to the first connection part 270 through a heat conductor embedded in the third circuit board 280, so that the second heat conductive sheet 281 located on the surface of the third circuit board 280 facing away from the second chip 300 is thermally conductive with the first connection part 270. The second heat conductive sheet 281 located on the surface of the third circuit board 280 facing away from the second chip 300 can extend to the second heat conductive structure 227 to be connected to the second heat conductive structure 227.

[0232] In some examples, the surface of the third circuit board 280 facing the second chip 300 has a second heat conductive sheet 281, that is, the metal layer of the surface of the third circuit board 280 facing the second chip 300 is formed with the second heat conductive sheet 281. The second heat conductive sheet 281 located on the surface of the third circuit board 280 facing the second chip 300 is connected to the second heat conductive structure 227 through a heat conductive body embedded in the third circuit board 280, so that the second heat conductive sheet 281 located on the surface of the third circuit board 280 facing the second chip 300 is thermally conductive with the second heat conductive structure 227. Specifically, when the second heat conductive structure 227 includes a second solder pad 2273, the second heat conductive sheet 281 located on the surface of the third circuit board 280 facing the second chip 300 is connected to the second solder pad 2273 through a heat conductive body embedded in the third circuit board 280, so that the second heat conductive sheet 281 located on the surface of the third circuit board 280 facing the second chip 300 is thermally conductive with the second solder pad 2273. The second heat conducting sheet 281 located on the surface of the third circuit board facing the second chip 300 may extend to the first connecting portion 270 to be connected to the first connecting portion 270 .

[0233] In some other examples, the second heat conductive sheet 281 is located in the inner layer of the third circuit board 280, that is, the second heat conductive sheet 281 is formed in the metal layer of the inner layer of the third circuit board 280. The first connection portion 270 is connected to the second heat conductive sheet 281 through the first heat conductive body 283 embedded in the third circuit board 280, so that the first connection portion 270 is thermally connected to the second heat conductive sheet 281 through the first heat conductive body 283, and the second heat conductive structure 227 is connected to the second heat conductive sheet 281 through the second heat conductive body 284 embedded in the third circuit board 280, so that the second heat conductive structure 227 is thermally connected to the second heat conductive sheet 281 through the second heat conductive body. Specifically, when the second heat conductive structure 227 includes a second solder pad 2273, the second arrangement 2273 is connected to the second heat conductive sheet 281 through the second heat conductive body 284 embedded in the third circuit board 280, so that the second solder pad 2273 is thermally connected to the second heat conductive sheet 281 through the second heat conductive body.

[0234] In this way, the second heat conductive sheet 281 has little effect on the arrangement of the terminals, pads and other structures on the surface of the third circuit board 280 , so that the connection between the third circuit board 280 and the second circuit board 210 and the third circuit board 280 and the second chip 300 is less affected.

[0235] Exemplarily, the first heat conductor 283 may be formed of a metal material, such as one or more of the following materials: copper, silver, aluminum, etc.

[0236] Exemplarily, the second heat conductor 284 may be formed of a metal material, such as one or more of the following materials: copper, silver, aluminum, etc.

[0237] The second heat-conducting plate 281 being located in the inner layer of the third circuit board 280 means that the second heat-conducting plate 281 is arranged between the structural layers on the surfaces of both sides of the third circuit board 280 in the thickness direction. That is, in the thickness direction of the third circuit board 280, both sides of the second heat-conducting plate 281 have the structural layers of the third circuit board 280.

[0238] In some examples, when the third circuit board 280 includes multiple metal layers, the third circuit board 280 may have multiple second heat conducting sheets 281 distributed in different metal layers, each of which is connected to the first connection portion 270 and the second heat conducting structure 227, so that each of the second heat conducting sheets 281 is thermally conductive with the first connection portion 270 and the second heat conducting structure 227. In this way, the heat conduction efficiency between the first connection portion 270 and the second heat conducting structure 227 can be high.

[0239] In some possible implementations, a third heat conducting structure 282 is disposed on a surface of the third circuit board 280 facing the second chip 300 , and a projection of the third heat conducting structure 282 in the thickness direction of the first chip 200 is located within a projection of the second chip in the thickness direction of the first chip 200 .

[0240] In this way, the third heat conductive structure 282 fills part of the gap between the third circuit board 280 and the second core board 300, which is beneficial to improve the heat conduction efficiency between the third circuit board 280 and the second chip 300, and further improves the efficiency of heat dissipation of the third circuit board 280 through the second chip 300.

[0241] In some examples, the third heat conducting structure 282 is spaced apart from the second chip 300. Specifically, the third heat conducting structure 282 is spaced apart from the fourth circuit board 310.

[0242] In some other examples, the third heat conducting structure 282 contacts the second chip 300 . Specifically, the third heat conducting structure 292 contacts the fourth circuit board 310 .

[0243] Exemplarily, the third heat conducting structure 282 may include a metal column formed on the surface of the third circuit board 280 .

[0244] Exemplarily, the third heat-conducting structure 282 includes a third solder pad 2821 disposed on the surface of the third circuit board 280 and a solder ball 2822 disposed on the surface of the third solder pad 2821 . The third circuit board 280 is thermally connected to the solder ball 2822 disposed on the surface of the third solder pad 2821 through the third solder pad 2821 .

[0245] In this way, the third solder pad 2821 and the solder ball 2822 arranged thereon occupy a smaller board area, which facilitates the arrangement of the third heat conducting structure 282 in the narrow space between the second chip 300 and the third circuit board 280 .

[0246] Exemplarily, a plurality of third solder pads 2821 distributed in an array may be provided on the surface of the third circuit board 280 , so that solder balls 2822 disposed on the surfaces of the plurality of third solder pads 2821 form a solder ball array.

[0247] Exemplarily, the third pad 2821 may be made of a metal material, such as one or more of the following materials: copper, silver, aluminum, etc.

[0248] Illustratively, the solder ball may be a tin ball, or a spherical structure formed by other materials with good thermal conductivity.

[0249] In some examples, a second filling medium 290 is filled between the first die 220 and the second circuit board 210 . The second filling medium 290 is made of a non-conductive material and is used to support the first die 220 so that the first die 220 can be mounted on the second circuit board 210 more stably.

[0250] Exemplarily, the second filling medium 290 may be filling glue.

[0251] Fig.14 A process flow chart of a method for preparing an electronic device provided in an embodiment of the present application.

[0252] like Fig.14 As shown, when preparing the electronic device, a first pad 2271 can be provided on the back of the first bare chip 220. The front and back of the first bare chip 220 are the surfaces on both sides of the first bare chip 220 in the thickness direction, and the front of the first bare chip 220 is used to connect with the second circuit board 210.

[0253] Exemplarily, a first electrical connection terminal 510 is disposed on the front side of the first bare chip 220 .

[0254] For example, the first pad 2271 may be disposed on the back side of the first die 220 by electroplating.

[0255] After the first solder pad 2271 is disposed on the back side of the first bare die 220 , the first bare die 220 is disposed on the second circuit board 210 , so that the front side of the first bare die 220 is fixed to the second circuit board 210 and electrically connected.

[0256] Exemplarily, the first die 220 is fixed and electrically connected to the second circuit board 210 via the first electrical connection terminal 510 , and the second filling medium 290 is filled between the first die 220 and the second circuit board 210 .

[0257] Exemplarily, a second electrical connection terminal 520 is disposed on a side of the second circuit board 210 facing away from the first bare chip 220 .

[0258] After the first bare chip 220 is disposed on the second circuit board 210 , the first solder 2272 is sprayed on the surface of the first pad 2271 .

[0259] After the first solder 2272 is sprayed on the surface of the first pad 2271, the third circuit board 280 is arranged on the side of the first bare chip 220 away from the second circuit board 210, so that the third circuit board 280 is fixed and electrically connected to the second circuit board 210, and the first pad 2271 is soldered with the corresponding second pad 2273 through the first solder 2272 sprayed on the surface, and the packaging material is injected between the second circuit board 210 and the third circuit board 280 to form the first packaging structure 230. Among them, the second pad 2273 corresponding to the first pad 2271 is arranged on the side of the third circuit board 280 facing the first bare chip 220, and the first connecting portion 270 and the third pad 2821 are arranged on the side of the third circuit board 280 away from the first bare chip 220.

[0260] Exemplarily, a fifth electrical connection terminal 285 is disposed on the surface of the third circuit board 280 , so that the third circuit board 280 is fixed and electrically connected to the second circuit board 210 via the fifth electrical connection terminal 285 .

[0261] After the third circuit board 280 is disposed on the side of the first bare chip 220 facing away from the second circuit board 210 , the side of the second circuit board 210 facing away from the first bare chip 220 is fixed to and electrically connected to the first circuit board 100 .

[0262] Exemplarily, the second circuit board 210 is fixed and electrically connected to the first circuit board 100 via the second electrical connection terminals 520 .

[0263] After the side of the second circuit board 210 facing away from the first bare chip 220 is fixed to the first circuit board 100 and electrically connected, the second solder 271 is sprayed on the surface of the first connecting portion 270 and the third pad 2821, and the solder ball 2822 is set on the surface of the third pad 2821 through the second solder 271 sprayed on the surface of the third pad 2821.

[0264] After the second solder 271 is sprayed on the surface of the first connecting part 270 and the solder ball 2822 is set on the surface of the third pad 2821, the second chip 300 and the thermal conductive column 30 are set on the side of the third circuit board 280 away from the first bare chip 220, so that the second chip 300 is fixed and electrically connected to the third circuit board 280, and the thermal conductive column 30 is soldered to the first connecting part 270 through the second solder 271 sprayed on the surface of the first connecting part 270, and the first filling medium 400 is filled between the second chip 300 and the third circuit board 280.

[0265] Exemplarily, the second chip 300 and the heat-conducting pillar 30 may be disposed on a side of the third circuit board 280 away from the first bare chip 220 by reflow soldering, and the second chip 300 and the heat-conducting pillar 30 may be welded and formed on the surface of the third circuit board 280 at one time.

[0266] After the second chip 300 and the heat-conducting column 30 are arranged on the side of the third circuit board 280 away from the first bare chip 220 , the side of the second chip 300 away from the third circuit board 280 and the end of the heat-conducting column 30 away from the third circuit board 280 are connected to the heat dissipation device 20 .

[0267] Fig.15 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0268] like Fig.15 As shown, in some possible implementations, the electronic device further includes a shielding cover 40, the shielding cover 40 is mounted on the first circuit board 100, and the heat dissipation device 20 is disposed on a side of the shielding cover 40 away from the first circuit board 100. An installation space is formed between the shielding cover 40 and the first circuit board 100, the first chip 200 and the second chip 300 are both disposed in the installation space, and the shielding cover 40 can perform electromagnetic shielding on the first chip 200 and the second chip 300, and can reduce electromagnetic interference caused by components outside the shielding cover 40 to the first chip 200 and the second chip 300.

[0269] In some examples where the electronic device also includes a shielding cover 40 , the shielding cover 40 is connected to the heat sink 20 to allow thermal conductivity between the shielding cover 40 and the heat sink 20 , so that components such as the package assembly 10 in the shielding cover 40 can dissipate heat through the shielding cover 40 .

[0270] In some examples where the electronic device also includes a shielding cover 40, the side of the second chip 300 facing away from the first circuit board 100 is connected to the shielding cover 40 so that the second chip 300 is connected to the heat sink 20 through the shielding cover 40, and the second chip 300 can be thermally connected to the heat sink 20 through the shielding cover 40.

[0271] Exemplarily, the side of the second chip 300 facing away from the first circuit board 100 can be connected to the shielding cover 40 through a thermal interface material, and the shielding cover 40 can also be connected to the heat sink 20 through a thermal interface material, so that the thermal conductivity between the second chip 300 and the heat sink 20 is better.

[0272] In some examples where the electronic device also includes a shielding cover 40, the thermally conductive column 30 is disposed in the installation space, and the end of the thermally conductive column 30 facing away from the first chip 200 is connected to the shielding cover 40, so that the thermally conductive column 30 is connected to the heat dissipation device 20 through the shielding cover 40, so that the thermally conductive column 30 is thermally conductive to the heat dissipation device 20 through the shielding cover 40.

[0273] In this way, the shielding cover 40 has a better shielding effect on the components in the installation space. In addition, the heat conducting column 30 is easier to assemble.

[0274] Exemplarily, one end of the heat conductive pillar 30 facing away from the first chip 200 may be connected to the shielding cover 40 via a thermal interface material.

[0275] Exemplarily, one end of the heat-conducting column 30 is connected to the shielding cover 40 , and the other end of the heat-conducting column 30 is connected to the first bare chip 220 .

[0276] Fig.16 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0277] like Fig.16 As shown, illustratively, one end of the heat-conducting column 30 is connected to the shielding cover 40 , and the other end of the heat-conducting column 30 is connected to the first heat-conducting sheet 211 .

[0278] Fig.17 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0279] like Fig.17 As shown, illustratively, one end of the heat-conducting column 30 is connected to the shielding cover 40, and the other end of the heat-conducting column 30 is connected to the third circuit board 280. A thermal interface material 50 is provided between the heat-conducting column 30 and the second chip 300 and the shielding cover 40. For example, the thermal interface material 50 can be a thermally conductive gel. The heat-conducting column 30 and the second chip 300 are connected to the shielding cover 40 through the thermal interface material 50.

[0280] Fig.18 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0281] like Fig.18As shown, in some examples where the electronic device also includes a shielding cover 40, the shielding cover 40 has a through hole 41 connecting the installation space with the outside of the shielding cover 40, the thermally conductive column 30 is inserted into the through hole 41, and the end of the thermally conductive column 30 facing away from the first circuit board 100 is connected to the heat dissipation device 20 outside the shielding cover 40.

[0282] In this way, the heat conduction efficiency between the heat conductive pillar 30 and the heat dissipation device 20 is high, so that the heat dissipation efficiency of the first chip 200 is high.

[0283] Exemplarily, one end of the heat conductive column 30 facing away from the first circuit board 100 may be connected to the heat dissipation device 20 via a thermal interface material.

[0284] Exemplarily, one end of the heat-conducting column 30 is connected to the heat dissipation device 20 , and the other end of the heat-conducting column 30 is connected to the first bare chip 220 .

[0285] Fig.19 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0286] like Fig.19 As shown, illustratively, one end of the heat-conducting column 30 is connected to the heat dissipation device 20 , and the other end of the heat-conducting column 30 is connected to the first heat-conducting sheet 211 .

[0287] Fig. 20 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0288] like Fig. 20 As shown, illustratively, one end of the heat-conducting column 30 is connected to the heat dissipation device 20 , and the other end of the heat-conducting column 30 is connected to the third circuit board 280 .

[0289] Fig.21 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0290] like Fig.21 As shown, in some possible embodiments, the electronic device includes a thermally conductive column 30, the thermally conductive column 30 and the packaging component 10 are split structures, the thermally conductive column 30 and the packaging component 10 are located on the same side of the first circuit board 100, and the projection of the thermally conductive column 30 along the thickness direction of the first circuit board 100 is located outside the projection of the packaging component 10 along the thickness direction of the first circuit board 100, and the thermally conductive column 30 is arranged between the first circuit board 100 and the heat dissipation device 20.

[0291] The first circuit board 100 has a third heat conducting sheet 110, and the third heat conducting sheet 110 has a third connection portion 111 and a fourth connection portion 112. The projection of the third connection portion 111 along the thickness direction of the first circuit board 100 is located outside the projection of the package component 10 along the thickness direction of the first circuit board 100, and the projection of the fourth connection portion 112 along the thickness direction of the first circuit board 100 is located inside the projection of the first chip 200 along the thickness direction of the first circuit board 100. One end of the heat conducting column 30 is connected to the third connection portion 111 so that the heat conducting column 30 is thermally connected to the third heat conducting sheet 110, and the other end of the heat conducting column 30 is connected to the heat dissipation device 20 so that the heat conducting column 30 is thermally connected to the heat dissipation device 20, and the fourth connection portion 112 is connected to the first chip 200 so that the third heat conducting sheet 110 is thermally connected to the first chip 200, so that the first chip 200 is thermally connected to the heat dissipation device 20 through the third heat conducting sheet 110 and the heat conducting column 30.

[0292] In this way, the third heat conducting sheet 110, the heat conducting column 30 and the heat sink 20 which are thermally connected form a heat dissipation path of the first chip 200. The heat generated by the first chip 200 can be transferred to the heat sink 20 through the third heat conducting sheet 110 and the heat conducting column 30 for heat dissipation. Compared with the heat dissipation path in which the first chip 200 transfers heat to the heat sink 20 through the second chip 300, the heat dissipation path formed by the third heat conducting sheet 110 and the heat conducting column 30 has a lower thermal resistance. Compared with the first circuit board 100, the heat sink 20 has a higher heat dissipation efficiency, which can make the heat dissipation efficiency of the first chip 200 higher, which is conducive to improving the heat dissipation efficiency of the package component 10, and further can reduce the limitation on the performance of the package component 10 caused by the low heat dissipation efficiency. In addition, the heat conducting column 30 is connected to the first circuit board 100, and the connection of the heat conducting column 30 is relatively easy. In addition, the set heat conducting column 30 can not affect the packaging of the package component 10.

[0293] When the first chip 200 includes a second circuit board 210 and a first bare chip 220, a projection of the fourth connection portion 112 along the thickness direction of the first circuit board 100 is located within a projection of the second circuit board 210 along the thickness direction of the first circuit board 100, and the fourth connection portion 112 is connected to the second circuit board 210, so that the first bare chip 220 is thermally connected to the third heat conductive sheet 110 through the second circuit board 210, and the heat generated by the first bare chip 220 can be transferred to the heat dissipation device 20 through the second circuit board 210, the third heat conductive sheet 110 and the heat conductive column 30.

[0294] Exemplarily, the heat-conducting pillars 30 may be disposed on one or more sides of the package assembly 10. For example, the heat-conducting pillars 30 may be disposed on any two sides of the package assembly 10, or the heat-conducting pillars 30 may be disposed on all four sides of the package assembly 10. The positions, lengths, widths, and quantities of the heat-conducting pillars 30 disposed on the first circuit board 100 may be determined according to the layout of the first circuit board 100.

[0295] Exemplarily, the material forming the third heat conductive plate 110 may include one or more of the following: copper, silver, aluminum, etc.

[0296] Exemplarily, the first circuit board 100 may include at least one metal layer, and the third heat conducting sheet 110 may be a metal sheet formed by one of the metal layers of the first circuit board 100. For example, the third heat conducting sheet 110 may be a copper sheet.

[0297] Exemplarily, the third heat conducting sheet 110 may be a grounded metal sheet of the first circuit board 100 .

[0298] Exemplarily, the third heat conductive sheet 110 may also be insulated from the grounded portion of the first circuit board 100 .

[0299] Exemplarily, the heat-conducting pillar 30 and the third heat-conducting sheet 110 may be connected by welding, bonding with a heat-conducting adhesive, or the like.

[0300] For example, the fourth connection portion 112 and the first chip 200 may be connected by bonding with a heat-conducting adhesive. Specifically, the fourth connection portion 112 and the second circuit board 210 may be bonded with a heat-conducting adhesive.

[0301] In some possible implementations, the surface of the first circuit board 100 on one side for mounting the first chip 200 has a third heat conducting sheet 110. That is, the third heat conducting sheet 110 is formed on the metal layer located on the surface of the first circuit board 100.

[0302] In this way, the heat-conducting column 30 and the first chip 200 can be conveniently connected to the third heat-conducting sheet 110 located on the surface of the first circuit board 100. In addition, the heat conduction path between the heat-conducting column 30 and the first chip 200 and the third heat-conducting sheet 110 located on the surface of the first circuit board 100 is also short, so that the heat dissipation efficiency of the first chip 200 through the heat-conducting column 30 is higher.

[0303] When the first circuit board 100 includes multiple metal layers, the first circuit board 100 may have multiple third heat-conducting plates 110 distributed in different metal layers. The multiple third heat-conducting plates 110 distributed in different metal layers can be thermally connected through the heat-conducting structure penetrating through the via hole of the first circuit board 100.

[0304] Fig. 22 A schematic diagram of the cooperation between a first chip and a third heat conducting sheet of an electronic device provided in an embodiment of the present application.

[0305] like Fig. 22 As shown, and see Fig.21The first chip 200 may include a third portion 240 and a fourth portion 250 , the third portion 240 including the first core 224 , and the fourth portion 250 including the second core 225 .

[0306] Illustratively, the third portion 240 may include a plurality of first cores 224 .

[0307] Illustratively, the fourth portion 250 may include a plurality of second cores 225 .

[0308] In some examples where the first circuit board 100 includes the third heat conductive sheet 110, the projection of the fourth connection portion 112 along the thickness direction of the first circuit board 100 is located within the projection of the third portion 240 along the thickness direction of the first circuit board 100, and the projection of the fourth connection portion 112 along the thickness direction of the first circuit board 100 is located outside the projection of the fourth portion 250 along the thickness direction of the first circuit board 100.

[0309] In this way, the first core 224 with higher power is arranged near the fourth connecting portion 112, and the heat conduction path between the first core 224 and the third heat conducting plate 110 is shorter, so that a large amount of heat generated when the first core 224 is running can be efficiently dissipated through the third heat conducting plate 110 and the heat conducting column 30, and the risk of overheating of the first chip 200 and the packaging component 10 is relatively small.

[0310] Fig.23 A schematic diagram of the cooperation between a first chip and a third heat conducting sheet of another electronic device provided in an embodiment of the present application.

[0311] like Fig.23 As shown, and see Fig.21 In some possible implementations, the side of the first chip 200 facing the first circuit board 100 includes a second electrical connection area 212 and a second thermal conduction area 213. Specifically, the side of the second circuit board 210 facing the first circuit board 100 includes the second electrical connection area 212 and the second thermal conduction area 213. The projection of the second electrical connection area 212 along the thickness direction of the first circuit board 100 is located outside the projection of the third heat conductive sheet 110 along the thickness direction of the first circuit board 100, and the projection of the second thermal conduction area 213 along the thickness direction of the first circuit board 100 is located inside the projection of the third heat conductive sheet 110 along the thickness direction of the second circuit board 210.

[0312] The plurality of second electrical connection terminals 520 disposed on the side of the first chip 200 facing the second circuit board 210 include a second power terminal 521 and a second signal terminal 522, both of which are located in the second electrical connection area 212, that is, the second power terminal 521 and the second signal terminal 522 are not disposed in the second thermal conduction area 213. The first chip 200 is electrically connected to the first circuit board 100 through the second power terminal 521 and the second signal terminal 522. Specifically, the second circuit board 210 is electrically connected to the first circuit board 100 through the second power terminal 521 and the second signal terminal 522.

[0313] A fourth heat-conducting structure 540 is provided between the first chip 200 and the fourth connecting portion 112, and the first chip 200 is connected to the fourth connecting portion 112 through the fourth heat-conducting structure 540. Specifically, a fourth heat-conducting structure 540 is provided between the second thermal conduction region 213 and the fourth connecting portion 112, and the second thermal conduction region 213 is connected to the fourth connecting portion 112 through the fourth heat-conducting structure 540, so that the second circuit board 210 is thermally conductively connected to the third heat-conducting sheet 110 through the fourth heat-conducting structure 540.

[0314] In this way, it is convenient to realize electrical connection between the first chip 200 and the first circuit board 100 having the third heat conducting sheet 110, and the third heat conducting sheet 110 has little influence on the current and signal transmission between the first circuit board 100 and the first chip 200. In addition, the second power supply terminal 521 and the second signal terminal 522 are both arranged outside the overlapping area between the first chip 200 and the third heat conducting sheet 110, which is conducive to arranging the third heat conducting sheet 110 with a larger size and better integrity, so that the heat conduction efficiency of the third heat conducting sheet 110 is higher.

[0315] The second power terminal 521 is a terminal for supplying power between the second circuit board 210 and the first circuit board 100 , and the second signal terminal 522 is a terminal for transmitting signals between the second circuit board 210 and the first circuit board 100 .

[0316] An edge of one side of the second thermal conduction region 213 at least partially overlaps with an edge of one side of the second circuit board 210 , that is, the second electrical connection region 212 is not provided on at least one side of the second thermal conduction region 213 .

[0317] Exemplarily, the material forming the fourth heat conducting structure 540 may include one or more of the following: copper, silver, aluminum, etc.

[0318] In some examples, the fourth heat conducting structure 540 may include a thermal interface material filled between the second heat conducting region 213 and the fourth connection portion 112 .

[0319] In some other examples, the fourth heat conducting structure 540 may include a heat conducting pad sandwiched between the second heat conducting region 213 and the fourth connecting portion 112 .

[0320] In some other examples, the fourth heat-conducting structure 540 may include a terminal disposed in the second heat-conducting region 213, and the terminal disposed in the second heat-conducting region 213 may be disabled to prevent the terminal disposed in the second heat-conducting region 213 from being short-circuited due to being connected to the third heat-conducting sheet 110, so that the terminal disposed in the second heat-conducting region 213 may be connected to the third heat-conducting sheet 110 to transfer the heat of the first chip 200 to the third heat-conducting sheet 110. In this way, the first chip 200 and the third heat-conducting sheet 110 may be thermally conductively connected by using the terminal in the second heat-conducting region 213, and the connection structure between the first chip 200 and the third heat-conducting sheet 110 is relatively simple.

[0321] In some possible implementations, the third heat conducting sheet 110 is made of a conductive material, and the fourth heat conducting structure 540 includes a second grounding terminal 541 disposed on a side of the first chip 200 facing the first circuit board 100. Specifically, the second grounding terminal 541 is disposed on a side of the second circuit board 210 facing the first circuit board 100. The projection of the second grounding terminal 541 along the thickness direction of the first circuit board 100 is located within the projection of the fourth connection portion 112 along the thickness direction of the first circuit board 100, and the first chip 200 is electrically connected to the fourth connection portion 112 through the second grounding terminal 541.

[0322] In this way, the second grounding terminal 541 can be used for heat conduction between the first chip 200 and the third heat conducting sheet 110 , and can also be used for grounding the first chip 200 , so that the utilization rate of the terminal provided on the first chip 200 is higher.

[0323] Exemplarily, the fourth heat conducting structure 540 may be located at an edge of a side of the first chip 200 that at least partially overlaps with a side of the second heat conducting region 213 .

[0324] Fig.24 A schematic diagram of the cooperation between a first chip and a third heat conducting sheet of another electronic device provided in an embodiment of the present application.

[0325] like Fig.24 As shown, in some examples, the fourth heat conducting structure 540 may not be located at the edge of the side of the first chip 200 that at least partially overlaps with the side of the second thermal conduction region 213 , and the remaining terminals except the fourth heat conducting structure 540 may be cleared in the second thermal conduction region 213 .

[0326] Fig.25 A schematic diagram of the cooperation between a first chip and a third heat conducting sheet of another electronic device provided in an embodiment of the present application.

[0327] like Fig.25 As shown, in some examples, the first chip 200 is further provided with a second connection terminal 570 whose current interaction function is disabled on the side facing the first circuit board 100, that is, there is no current input or output in the second connection terminal 570. The fourth heat-conducting structure 540 may also include a second connection terminal 570, which may connect the fourth connection portion 112 to the second heat-conducting region 213, so that the first chip 200 may be thermally connected to the third heat-conducting sheet 110 through the second connection terminal 570. In this way, the connection between the first chip 200 and the first circuit board 100 may be more stable.

[0328] In some examples, the second connection terminal 570 and the third heat conducting plate 110 may be spaced apart from each other to insulate the second connection terminal 570 from the third heat conducting plate 110 .

[0329] Fig.26 A schematic diagram of another electronic device provided in an embodiment of the present application.

[0330] like Fig.26 As shown, in some examples where the electronic device further includes a shielding cover 40 , the thermally conductive column 30 connected to the third thermally conductive sheet 110 can be disposed outside the shielding cover 40 , and the thermally conductive column 30 is connected to the heat dissipation device 20 outside the shielding cover 40 .

[0331] In this way, the heat-conducting column 30 will not affect the arrangement of the shielding cover 40 , and the installation of the heat-conducting column 30 and the shielding cover 40 is relatively convenient.

[0332] In some examples, the thermally conductive pillar 30 may be an integral structure.

[0333] In some examples, the heat-conducting column 30 may be a spliced ​​structure formed by splicing multiple sections. That is, the heat-conducting column 30 includes multiple heat-conducting sections spliced ​​in sequence. For example, when the side surface of one end of the heat-conducting column 30 connected to the first connecting portion 270 is covered by the first packaging structure 230, the portion of the side surface covered by the first packaging structure 230 may be a heat-conducting section, and the portion of the side surface not covered by the first packaging structure 230 may be another heat-conducting section.

[0334] Fig. 27 A schematic diagram of a heat-conducting column provided in an embodiment of the present application.

[0335] like Fig. 27As shown, the thermal conductive column 30 may include a first section 31, a second section 32 and a third section 33. The first section 31 and the second section 32 are staggered in the length direction or the width direction of the first chip 200. One end of the first section 31 is used to connect with the heat dissipation device 20 so that the first section 31 and the heat dissipation device 20 are thermally conductive. The other end of the first section 31 is connected to one end of the second section 32 through the third section 33. The other end of the second section 32 is used to connect with the first chip 200 so that the second section 32 and the first chip 200 are thermally conductive.

[0336] Thus, the staggered first section 31 and second section 32 can avoid other components in the electronic device, making the arrangement of the heat-conducting column 30 more flexible. In addition, the surface area of ​​the heat-conducting column 30 is larger, so that the heat-conducting column 30 can dissipate heat more efficiently through the surrounding environment.

[0337] Fig.28 A schematic diagram of another thermally conductive column provided in an embodiment of the present application.

[0338] like Fig.28 As shown, the heat-conducting column 30 may include a fourth section 34 and a fifth section 35, one end of the fourth section 34 is used to connect with the first chip 200 so that the fourth section 34 and the first chip 200 are thermally connected, the other end of the fourth section 34 is connected to one end of the fifth section 35, the other end of the fifth section 35 is used to connect with the heat sink 20 so that the fifth section 35 and the heat sink 20 are thermally connected, and the cross-sectional area of ​​the fifth section 35 is greater than the cross-sectional area of ​​the fourth section 34. The cross-sectional area of ​​the fifth section 35 is perpendicular to the axial direction of the fifth section 35, and the cross-sectional area of ​​the fourth section 34 is perpendicular to the axial direction of the fourth section.

[0339] In this way, the heat exchange efficiency between the heat-conducting column 30 and the heat dissipation device 20 can be higher.

[0340] Fig.29 A schematic diagram of another thermally conductive column provided in an embodiment of the present application.

[0341] like Fig.29 As shown, the heat-conducting column 30 may include a fourth section 34 and a sixth section 36, one end of the fourth section 34 is used to connect to the heat sink 20 so that the fourth section 34 and the heat sink 20 are thermally connected, the other end of the fourth section 34 is connected to one end of the sixth section 36, the other end of the sixth section 36 is used to connect to the first chip 200 so that the sixth section 36 and the first chip 200 are thermally connected, and the cross-sectional area of ​​the sixth section 36 is greater than the cross-sectional area of ​​the fourth section 34. The cross-sectional area of ​​the sixth section 36 is perpendicular to the axial direction of the sixth section 36, and the cross-sectional area of ​​the fourth section 34 is perpendicular to the axial direction of the fourth section.

[0342] In this way, the heat exchange efficiency between the heat-conducting pillar 30 and the first chip 200 can be higher.

[0343] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0344] In the embodiments of the present application, the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0345] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0346] The term "plurality" in this article refers to two or more than two. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship; in a formula, the character " / " indicates that the previous and next associated objects are in a "division" relationship.

[0347] It should be understood that the various numerical numbers involved in the embodiments of the present application are only used for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0348] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A packaging component, characterized in that: It includes a first chip, a second chip and a heat-conducting column; The second chip is arranged on one side of the first chip in the thickness direction, and the other side of the first chip in the thickness direction is used to be connected to the first circuit board, and the second chip is used to be connected to a heat sink arranged on a side of the second chip away from the first chip, so that the second chip is used to be thermally connected to the heat sink; The first chip has a first connecting portion, and a projection of the first connecting portion along the thickness direction of the first chip is located outside a projection of the second chip along the thickness direction of the first chip. One end of the thermally conductive column is connected to the first connecting portion so that the thermally conductive column is thermally connected to the first chip, and the other end of the thermally conductive column protrudes from a surface of the first chip on a side facing the second chip and is used to be connected to the heat dissipation device so that the thermally conductive column is used to be thermally connected to the heat dissipation device.

2. The packaging assembly according to claim 1, characterized in that: The first chip includes a second circuit board and a bare die; The bare die is arranged on one side of the second circuit board in the thickness direction, the other side of the second circuit board in the thickness direction is used to be connected to the first circuit board, and the second chip is arranged on a side of the bare die away from the second circuit board; The second circuit board has a first heat conducting sheet, the first heat conducting sheet has the first connecting portion and the second connecting portion, the projection of the first connecting portion along the thickness direction of the second circuit board is located outside the projection of the bare die along the thickness direction of the second circuit board, and the projection of the second connecting portion along the thickness direction of the second circuit board is located inside the projection of the bare die along the thickness direction of the second circuit board; The heat-conducting column is connected to the first heat-conducting sheet so that the heat-conducting column and the first heat-conducting sheet are thermally connected, and the second connecting portion is connected to the bare chip so that the first heat-conducting sheet and the bare chip are thermally connected.

3. The packaging assembly according to claim 2, characterized in that: The side of the bare chip facing the second circuit board includes a first electrical connection area, and a projection of the first electrical connection area along the thickness direction of the second circuit board is located outside a projection of the first heat conductive sheet along the thickness direction of the second circuit board; A first power terminal and a first signal terminal are provided on a side of the bare chip facing the second circuit board, the first power terminal and the first signal terminal are both located in the first electrical connection area, and the bare chip is electrically connected to the second circuit board through the first power terminal and the first signal terminal; A first heat-conducting structure is disposed between the bare die and the second connecting portion, and the bare die is connected to the second connecting portion via the first heat-conducting structure, so that the bare die is thermally connected to the first heat-conducting sheet via the first heat-conducting structure.

4. The packaging assembly according to claim 3, characterized in that: The first heat-conducting sheet is made of a conductive material, the first heat-conducting structure includes a first grounding terminal arranged on a side of the bare chip facing the second circuit board, a projection of the first grounding terminal along the thickness direction of the second circuit board is located within a projection of the second connecting portion along the thickness direction of the second circuit board, and the bare chip is electrically connected to the second connecting portion through the first grounding terminal.

5. The packaging assembly according to any one of claims 2 to 4, characterized in that: The first heat conductive sheet is disposed on a surface of the second circuit board on a side for mounting the bare chip.

6. The packaging assembly according to any one of claims 2 to 5, characterized in that: The die includes a first portion and a second portion, the first portion includes a first core, the second portion includes a second core, and the power of the first core is greater than the power of the second core; The projection of the second connecting portion along the thickness direction of the second circuit board is located inside the projection of the first portion along the thickness direction of the second circuit board, and the projection of the second connecting portion along the thickness direction of the second circuit board is located outside the projection of the second portion along the thickness direction of the second circuit board.

7. The packaging assembly according to claim 1, characterized in that: The first chip includes a second circuit board and a bare die; The bare die is arranged on one side of the second circuit board in the thickness direction, the other side of the second circuit board in the thickness direction is used to be connected to the first circuit board, and the second chip is arranged on a side of the bare die away from the second circuit board; The die has the first connection portion, and the heat-conducting column is connected to the die so that the heat-conducting column and the die are thermally connected.

8. The packaging assembly according to claim 7, characterized in that: The die includes a first portion and a second portion, the first portion includes a first core, the second portion includes a second core, power of the first core is greater than power of the second core, and the first portion has the first connection portion.

9. The packaging assembly according to claim 1, characterized in that: The first chip includes a second circuit board, a bare die and a third circuit board; The bare die is arranged on one side of the second circuit board in the thickness direction, the other side of the second circuit board in the thickness direction is used to be connected to the first circuit board, and the second chip is arranged on a side of the bare die away from the second circuit board; The third circuit board is disposed between the bare die and the second chip, a side of the third circuit board facing the second chip is connected to the second chip, and a side of the third circuit board facing away from the second chip is connected to the second circuit board; A second heat-conducting structure is provided between the bare chip and the third circuit board, and the bare chip is connected to the third circuit board through the second heat-conducting structure, so that the bare chip is thermally connected to the third circuit board through the second heat-conducting structure; The third circuit board has the first connecting portion, and the heat-conducting column is connected to the third circuit board so that the heat-conducting column and the third circuit board are thermally connected.

10. The packaging assembly according to claim 9, characterized in that: The second heat-conducting structure includes a first solder pad and a second solder pad arranged corresponding to the first solder pad; The first solder pad is arranged on the surface of the bare chip facing away from the second circuit board, and the second solder pad is arranged on the surface of the third circuit board facing away from the second chip. The first solder pad and the corresponding second solder pad are welded by solder arranged therebetween, and the bare chip and the third circuit board are thermally connected by the welded first solder pad and the second solder pad.

11. The packaging assembly according to claim 9 or 10, characterized in that: The third circuit board has a second heat conducting sheet, and the first connecting portion and the second heat conducting structure are both connected to the second heat conducting sheet, so that the first connecting portion and the second heat conducting structure are thermally connected through the second heat conducting sheet.

12. The packaging assembly according to claim 11, characterized in that: At least a portion of a projection of the first connecting portion in the thickness direction of the first chip is located within a projection of the second heat conducting sheet in the thickness direction of the first chip; At least a portion of a projection of the die in the thickness direction of the first chip is located within a projection of the second heat conductive sheet in the thickness direction of the first chip.

13. The packaging assembly according to claim 11 or 12, characterized in that: The first connecting portion is disposed on a surface of the third circuit board facing the second chip, and the second heat conducting sheet is located on an inner layer of the third circuit board; The first connection portion is connected to the second heat conducting sheet via a first heat conducting body embedded in the third circuit board, so that the first connection portion is thermally connected to the second heat conducting sheet via the first heat conducting body; The second heat-conducting structure is connected to the second heat-conducting sheet via a second heat-conducting body embedded in the third circuit board, so that the second heat-conducting structure is thermally connected to the second heat-conducting sheet via the second heat-conducting body.

14. The packaging assembly according to any one of claims 9 to 13, characterized in that: A third heat-conducting structure is provided on a surface of the third circuit board facing the second chip, and a projection of the third heat-conducting structure in the thickness direction of the first chip is located within a projection of the second chip in the thickness direction of the first chip.

15. The packaging assembly according to claim 14, characterized in that: The third heat-conducting structure includes a third solder pad disposed on the surface of the third circuit board and a solder ball disposed on the surface of the third solder pad; The third circuit board is thermally connected to the solder ball disposed on the surface of the third solder pad through the third solder pad.

16. The packaging assembly according to any one of claims 1 to 15, characterized in that: The first chip includes a packaging structure; At least a portion of the die of the first chip is covered by the packaging structure; The heat-conducting column is arranged outside the packaging structure.

17. The packaging assembly according to any one of claims 1 to 8, characterized in that: The first chip includes a packaging structure; At least a portion of the die of the first chip is covered by the packaging structure; The side surface of one end of the heat-conducting column connected to the first connecting portion is covered by the packaging structure.

18. The packaging assembly according to any one of claims 1 to 17, characterized in that: The first chip is a logic chip or a system chip, and the second chip is a memory chip.

19. An electronic device, characterized in that: It comprises a first circuit board, a heat dissipation device and a packaging assembly as claimed in any one of claims 1 to 18; The packaging component is arranged between the first circuit board and the heat dissipation device; The side of the first chip of the packaging assembly facing away from the second chip of the packaging assembly is connected to the first circuit board, and the end of the thermal conductive column of the packaging assembly facing away from the first chip and the second chip are both connected to the heat dissipation device, so that the thermal conductive column and the second chip are thermally connected to the heat dissipation device.

20. The electronic device according to claim 19, characterized in that: Also includes a shielding cover; The shielding cover is mounted on the first circuit board, the heat sink is disposed on a side of the shielding cover away from the first circuit board, and the shielding cover is connected to the heat sink so that the shielding cover and the heat sink are thermally conductive; An installation space is formed between the shielding cover and the first circuit board, and the first chip, the second chip and the heat-conducting column are all arranged in the installation space; One end of the heat-conducting column away from the first chip is connected to the shielding cover, so that the heat-conducting column is connected to the heat dissipation device through the shielding cover, so that the heat-conducting column is thermally conductive with the heat dissipation device through the shielding cover.

21. The electronic device according to claim 19, characterized in that: Also includes a shielding cover; The shielding cover is mounted on the first circuit board, and the heat dissipation device is arranged on a side of the shielding cover away from the first circuit board; An installation space is formed between the shielding cover and the first circuit board, and the first chip and the second chip are both arranged in the installation space; The shielding cover has a through hole connecting the installation space and the outside of the shielding cover, and the heat-conducting column is inserted into the through hole.

22. An electronic device, characterized in that: It includes a first circuit board, a heat dissipation device, a packaging component and a heat-conducting column; The packaging component and the heat-conducting column are both arranged between the first circuit board and the heat dissipation device; The packaging assembly includes a first chip and a second chip, wherein the second chip is arranged on one side of the first chip in a thickness direction, the other side of the first chip in the thickness direction is connected to the first circuit board, and the side of the second chip facing away from the first chip is connected to the heat sink, so that the second chip is thermally conductive with the heat sink; The first circuit board has a third heat conducting sheet, the third heat conducting sheet has a third connecting portion and a fourth connecting portion, the projection of the third connecting portion along the thickness direction of the first circuit board is located outside the projection of the packaging component along the thickness direction of the first circuit board, and the projection of the fourth connecting portion along the thickness direction of the first circuit board is located inside the projection of the first chip along the thickness direction of the first circuit board; One end of the thermally conductive column is connected to the third connecting portion so that the thermally conductive column and the third thermally conductive sheet are thermally connected. The other end of the thermally conductive column is connected to the heat dissipation device so that the thermally conductive column and the heat dissipation device are thermally connected. The fourth connecting portion is connected to the first chip so that the third thermally conductive sheet and the first chip are thermally connected.

23. The electronic device according to claim 22, characterized in that: The first chip includes a second electrical connection area on a side facing the first circuit board, and a projection of the second electrical connection area along the thickness direction of the first circuit board is located outside a projection of the third heat conducting sheet along the thickness direction of the first circuit board; A second power terminal and a second signal terminal are provided on a side of the first chip facing the first circuit board, the second power terminal and the second signal terminal are both located in the second electrical connection area, and the first chip is electrically connected to the first circuit board via the second power terminal and the second signal terminal; A fourth heat-conducting structure is provided between the first chip and the fourth connecting portion, and the first chip is connected to the fourth connecting portion via the fourth heat-conducting structure, so that the first chip is thermally connected to the third heat-conducting sheet via the fourth heat-conducting structure.

24. The electronic device according to claim 23, characterized in that: The third heat conducting sheet is made of a conductive material, the fourth heat conducting structure includes a second grounding terminal arranged on a side of the first chip facing the first circuit board, a projection of the second grounding terminal along the thickness direction of the first circuit board is located within a projection of the fourth connecting portion along the thickness direction of the first circuit board, and the first chip is electrically connected to the fourth connecting portion through the second grounding terminal.

25. The electronic device according to any one of claims 22 to 24, characterized in that: The surface of the first circuit board on a side for mounting the first chip has the third heat conducting sheet.

26. The electronic device according to any one of claims 22 to 25, characterized in that: The first chip includes a third part and a fourth part, the third part includes a first core, the fourth part includes a second core, and the power of the first core is greater than the power of the second core; The projection of the fourth connection portion along the thickness direction of the first circuit board is located inside the projection of the third portion along the thickness direction of the first circuit board, and the projection of the fourth connection portion along the thickness direction of the first circuit board is located outside the projection of the fourth portion along the thickness direction of the first circuit board.

27. The electronic device according to any one of claims 22 to 26, characterized in that: Also includes a shielding cover; The shielding cover is mounted on the first circuit board, and the heat dissipation device is arranged on a side of the shielding cover away from the first circuit board; An installation space is formed between the shielding cover and the first circuit board, and the first chip and the second chip are both arranged in the installation space; The heat-conducting column is arranged outside the shielding cover.

28. The electronic device according to any one of claims 22 to 27, characterized in that: The first chip is a logic chip or a system chip, and the second chip is a memory chip.

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