Method, circuit and cushion for heating

Abstract

The invention provides a method for heating. The method comprises the following steps: presetting an ideal temperature; switching on a power supply to enable the circuit to reach a first temperature; triggering the switch to enable the circuit to reach a second temperature; judging whether the second temperature is the same as the ideal temperature or not; when the second temperature is smaller than the ideal temperature, the circuit continues to heat, so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, stopping heating the circuit; the first temperature is lower than the second temperature. The second temperature and the ideal temperature are set, so that the heating process of the whole circuit is simpler and more intelligent.

Description

Technical Field

[0001] The present invention relates to the technical field of heating pads, and in particular to a heating method, a circuit and a pad thereof. Background Art

[0002] In daily life, people often encounter situations where food, clothing, or other daily necessities are cold or damp. In such cases, it is often necessary to heat or bake the food, clothing, or other daily necessities. For example, in the cold winter, milk needs to be heated, but it is very troublesome to pour the milk into a pot and heat it separately; for another example, if clothes are easily damp in cold weather, additional drying operations are required for the clothes; for another example, in colder seasons, people are eating, and as time goes on, the food can easily cool down. Based on the above application scenarios, people have come up with a heating pad to heat or dry food, clothing, or other daily necessities.

[0003] However, after market research and actual use, it was found that the existing heating pads are complicated to operate during actual use, generally have multiple gears, and cannot quickly select the desired working mode during actual use, resulting in many consumers making operating errors during actual operation and being unable to quickly heat the food, clothing, or other daily necessities to be heated, resulting in poor heating effects and poor customer experience. Summary of the invention

[0004] Based on the above technical problems, the present invention provides a method for heating, which comprises:

[0005] Preset an ideal temperature;

[0006] Turning on a power source so that the circuit reaches a first temperature;

[0007] triggering the switch to cause the circuit to reach a second temperature;

[0008] determining whether the second temperature is the same as the ideal temperature;

[0009] When the second temperature is lower than the ideal temperature, the circuit is continuously heated so that the second temperature continues to rise;

[0010] When the second temperature is greater than or equal to the ideal temperature, stopping heating the circuit;

[0011] The first temperature is lower than the second temperature.

[0012] Specifically, the step of turning on the power supply so that the circuit reaches the first temperature also includes:

[0013] Turning on the power supply so that the circuit is in a standby state;

[0014] The first switch is turned on, and a change in the resistance value of the circuit is detected to detect whether the circuit reaches a first temperature.

[0015] Specifically, the method for heating further includes:

[0016] Preset a time threshold;

[0017] calculating the heating time of the circuit, when the heating time of the circuit is greater than or equal to the time threshold;

[0018] Then the circuit is placed in the standby state or the circuit reaches the first temperature.

[0019] Specifically, the step of triggering the switch so that the circuit reaches the second temperature includes:

[0020] Turn on the second switch;

[0021] The change in the resistance value of the circuit is detected, and the actual temperature value of the circuit is detected, which is defined as the second temperature.

[0022] The present invention also provides a circuit for heating, comprising:

[0023] A power module, used to connect an external power source so that the circuit reaches a first temperature; used to trigger a switch so that the circuit reaches a second temperature;

[0024] A heating module, which is electrically connected to the power module, and the power module supplies power to the heating module so that the temperature of the heating module changes;

[0025] A processing module; used to preset an ideal temperature; and also used to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, the circuit is continued to be heated so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped;

[0026] The first temperature is less than the second temperature;

[0027] A circuit substrate, the power module and the processing module are both installed on the circuit substrate, and the power module, the processing module and the heating module are electrically connected.

[0028] Specifically, the circuit for heating further includes:

[0029] A display module, which is electrically connected to the power module and the processing module;

[0030] The display module comprises:

[0031] Indicator light unit;

[0032] A driving unit, used for driving the indicator light unit;

[0033] A display unit, wherein the indicator light unit is electrically connected to the display unit;

[0034] Wherein, the indicator light unit, the driving unit and the display unit are electrically connected.

[0035] Specifically, the processing module includes:

[0036] A storage unit, used for storing the ideal temperature;

[0037] a processing unit, configured to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, continue to heat the circuit so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, stop heating the circuit;

[0038] A temperature control unit is electrically connected to the processing unit, and is used to receive numerical values ​​of the first temperature and the second temperature.

[0039] The present invention also provides a heating pad, which adopts the heating method, and the heating pad comprises:

[0040] An operation area, the operation area comprising:

[0041] An upper shell, which is a shell-like structure with a through hole;

[0042] A lower shell, which is arranged opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form a containing space;

[0043] A circuit board installed in the accommodation space;

[0044] An operation interface, which is arranged at the through hole of the upper shell, and the operation interface is electrically connected to the circuit board;

[0045] The heating area is fixedly connected to the operating area; the heating area includes:

[0046] A cushion body, which is made of a flexible material, comprising an upper surface and a lower surface, wherein the upper surface and the lower surface are arranged opposite to each other;

[0047] A plurality of support columns, which are arranged on the lower surface and extend outward from the lower surface, and the height of the support columns is greater than the thickness of the cushion body;

[0048] A heating wire is installed on the lower surface; there are gaps between the support columns, and the heating wire is arranged in the gaps; the heating wire is electrically connected to the circuit board.

[0049] Specifically, the heating pad also includes:

[0050] A mounting groove having an opening, wherein the opening is away from the upper surface; the mounting groove is located at the gap; and the mounting groove comprises:

[0051] bottom wall;

[0052] a first side wall;

[0053] a second side wall, disposed opposite to the first side wall;

[0054] The first side wall, the bottom wall and the second side wall are connected in sequence, and the bottom wall, the first side wall and the second side wall form a groove-shaped space;

[0055] The heating wire is arranged in the groove-shaped space.

[0056] Specifically, the heating area also includes:

[0057] A first packaging layer is wrapped around the heating wire, and the heating wire and the first packaging layer are both arranged in the groove-shaped space.

[0058] The second packaging layer is arranged at the opening of the installation groove, so that the bottom wall, the first side wall, the second side wall and the second packaging layer form a closed space, and the first packaging layer and the heating wire are arranged in the closed space. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their description are used to explain the present invention and do not constitute an improper limitation of the present invention. Some specific embodiments of the present invention will be described in detail in an exemplary and non-restrictive manner with reference to the drawings. The same reference numerals in the drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale, among which:

[0060] Figure 1 The present application provides a schematic flow chart of a method for heating;

[0061] Figure 2is a flowchart of step S2 in an embodiment provided by the present application;

[0062] Figure 3 is a flowchart of step S2 in another embodiment provided by the present application;

[0063] Figure 4 is a schematic flow chart of step S3;

[0064] Figure 5 is a flowchart of step S5

[0065] Figure 6 is a flow chart of step S6,

[0066] Figure 7 is a schematic flow diagram of the method for heating;

[0067] Figure 8 A schematic diagram of a heating circuit

[0068] Fig. 9 This is a schematic diagram of another heating circuit provided by this application.

[0069] Fig.10 This is a schematic diagram of the structure of the processing module provided by this application

[0070] Fig.11 is a schematic diagram of the structure of the processing unit 032 provided in this application;

[0071] Fig.12 is a schematic diagram of the structure of the processing unit 032 provided in this application;

[0072] Fig.13 is a structural schematic diagram of a circuit for heating according to another embodiment provided by the present application;

[0073] Fig.14 It is a structural diagram of the front side of a heating pad 001 provided in the present application;

[0074] Fig.15 It is a structural schematic diagram of the back side of a heating pad 001 provided in the present application;

[0075] Fig.16 This is a schematic diagram of the disassembled structure of a heating pad 001 provided in the present application;

[0076] Fig.17 It is a cross-sectional view of a heating area 03 of a heating pad 001 provided in the present application;

[0077] Fig.18 It is a partial cross-sectional view of a heating area 03 of a heating pad 001 of the present application; Fig.19It is a partial cross-sectional view of the heating area 03 of another heating pad 001 of the present application. DETAILED DESCRIPTION

[0078] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0079] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0080] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0081] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0082] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0083] like Figure 1 As shown, Figure 1 The present application provides a flow chart of a method for heating.

[0084] It includes:

[0085] S1. Preset an ideal temperature;

[0086] S2, turning on the power supply so that the circuit reaches a first temperature;

[0087] S3, triggering the switch to make the circuit reach the second temperature;

[0088] S4, determining whether the second temperature is the same as the ideal temperature;

[0089] S5. When the second temperature is lower than the ideal temperature, the circuit is continuously heated so that the second temperature continues to rise;

[0090] S6. When the second temperature is greater than or equal to the ideal temperature, stopping heating the circuit;

[0091] The first temperature is lower than the second temperature.

[0092] It should be noted that, in the application, except for special instructions, the above-mentioned identifications such as S1, S2, S3 are only for easier understanding of the relationship between the steps of the method and for the convenience of identification in the drawing, and do not uniquely limit the order of the steps. It should be noted that the ideal temperature value can be preset before leaving the factory according to actual needs, and will not be listed one by one here, and the specific value of the ideal temperature will not be limited in this application.

[0093] In one embodiment of the present application, the step of turning on the power in step S2 to make the circuit reach the first temperature is to heat the circuit to a temperature that is lower than the second temperature before subsequently reaching the second temperature.

[0094] For example, before the operator needs to heat milk, it must first reach 30 degrees. This temperature has two functions: one is to inform the operator that the equipment has started working and can start further heating work; the second function is to preheat the items to be heated to prevent the items from being dangerous due to the rapid heating process (possibly explosion, food deterioration, burning, etc.). For example, in the cold winter, the room temperature may be 0 degrees Celsius, the first temperature is set to 40 degrees, and the second temperature is set to 100 degrees.

[0095] In another embodiment of the present application, the first temperature may be the temperature in the standby state after the power is turned on. The temperature is not set to a specific value, and may be the room temperature or the preheating temperature after preheating.

[0096] It should be noted that, in a preferred embodiment of the present application, the difference between the first temperature and the second temperature is greater than or equal to 40 degrees Celsius. For example, when the first temperature is 40 degrees Celsius, the second temperature is greater than or equal to 80 degrees Celsius; when the first temperature is 50 degrees Celsius, the second temperature is greater than or equal to 90 degrees Celsius.

[0097] In this application, by setting the second temperature and the ideal temperature, the heating process of the entire circuit is made simpler and more intelligent. During the heating process, consumers do not need to debug various working modes or various gears, and can directly use the "one-key heating" method, that is, after triggering the switch, the ideal working temperature is reached, and then the temperature is kept in a constant temperature state. This operation method does not require more operations and is not prone to mistakes.

[0098] like Figure 2 As shown, Figure 2 is a flowchart of step S2 in an embodiment provided by the present application, step S2 includes:

[0099] S21, turning on the power supply so that the circuit is in a standby state;

[0100] S22, turning on the first switch, detecting a change in the resistance value of the circuit, and detecting whether the circuit reaches a first temperature.

[0101] At this time, the step S2 includes two steps. The first step is in a standby state, and no heating process is performed at this time. The temperature of the standby state can be the same as room temperature. In the second step, the first switch is triggered, so that the entire circuit starts to heat, but the heating temperature is not high, and is in a low-temperature constant state.

[0102] The "low temperature" mentioned here is relative to the second temperature, and any temperature lower than the second temperature can be called a low temperature.

[0103] like Figure 3 As shown, Figure 3 is a flowchart of step S2 in another embodiment provided by the present application, where step S2 includes:

[0104] S021. Turn on the power supply so that the circuit reaches a first temperature.

[0105] In this embodiment, it means that after the power is turned on, the heating step is started so that the temperature of the circuit reaches the first temperature.

[0106] like Figure 4 As shown, Figure 4 is a flow chart of step S3, which includes:

[0107] S31, turn on the second switch;

[0108] S32, detecting a change in the resistance value of the circuit, and detecting an actual temperature value of the circuit, which is defined as a second temperature.

[0109] like Figure 5 As shown, Figure 5 is a flow chart of step S5, which includes:

[0110] S51, collecting the numerical value of the second temperature;

[0111] S52, converting the numerical value of the second temperature to form a second digital signal;

[0112] S53, comparing the magnitude of the second digital signal with the numerical magnitude of the ideal temperature;

[0113] S54: When the value of the second digital signal is less than the value of the ideal temperature, the circuit continues to be heated so that the second temperature continues to increase.

[0114] like Figure 6 As shown, Figure 6 is a flow chart of step S6, which includes:

[0115] S61, collecting the numerical value of the second temperature;

[0116] S62, converting the numerical value of the second temperature to form a second digital signal;

[0117] S63, comparing the magnitude of the second digital signal with the numerical magnitude of the ideal temperature;

[0118] S64: When the value of the second digital signal is greater than or equal to the value of the ideal temperature, the circuit stops heating.

[0119] like Figure 7 As shown, Figure 7 is a schematic flow chart of the method for heating, wherein the method for heating further comprises:

[0120] S01. Preset a time threshold;

[0121] S02, calculating the heating time of the circuit, when the heating time of the circuit is greater than or equal to the time threshold;

[0122] S03, putting the circuit in a standby state or making the circuit reach a first temperature.

[0123] It should be noted that the above steps are to adjust whether the circuit needs to be put into standby mode or to make the circuit reach the first temperature by identifying the change of time, so that the circuit can achieve the technical effect of energy saving and environmental protection. When the circuit is not used for a long time, the circuit can be put into standby mode or the circuit can be made to reach the first temperature to reduce the loss of electric energy.

[0124] like Figure 8 As shown, Figure 8 A schematic diagram of a heating circuit is provided, which includes:

[0125] The power module 01 is used to connect an external power source so that the circuit reaches a first temperature; and is used to trigger a switch so that the circuit reaches a second temperature;

[0126] A heating module 02, which is electrically connected to the power module 01, and the power module 01 supplies power to the heating module 02, so that the temperature of the heating module 02 changes;

[0127] Processing module 03; used to preset an ideal temperature; and also used to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, the circuit is continued to be heated so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped;

[0128] The first temperature is less than the second temperature;

[0129] The circuit substrate 04 , the power module 01 and the processing module 03 are both installed on the circuit substrate 04 , and the power module 01 , the processing module 03 and the heating module 02 are electrically connected.

[0130] like Fig. 9 As shown, Fig. 9 is a structural schematic diagram of another heating circuit provided by the present application, which includes:

[0131] The power module 01 is used to connect an external power source so that the circuit reaches a first temperature; and is used to trigger a switch so that the circuit reaches a second temperature;

[0132] A heating module 02, which is electrically connected to the power module 01, and the power module 01 supplies power to the heating module 02, so that the temperature of the heating module 02 changes;

[0133] Processing module 03; used to preset an ideal temperature; and also used to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, the circuit is continued to be heated so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped;

[0134] The first temperature is less than the second temperature;

[0135] The circuit substrate 04 , the power module 01 and the processing module 03 are both installed on the circuit substrate 04 , and the power module 01 , the processing module 03 and the heating module 02 are electrically connected.

[0136] The display module 05 is electrically connected to the power module 01 and the processing module 03; the display module 05 includes:

[0137] Indicator light unit 051;

[0138] A driving unit 052, used to drive the indicator light unit 051;

[0139] A display unit 053, wherein the indicator light unit 051 is electrically connected to the display unit 053;

[0140] The indicator light unit 051, the driving unit 052 and the display unit 053 are electrically connected.

[0141] It should be noted that, in one embodiment of the present application, the basic principle of the processing module in determining whether the second temperature is the same as the ideal temperature is as follows:

[0142] In this embodiment, a thermistor is provided, for example, NTC (Negative Temperature Coefficient), which is a thermistor phenomenon and material with a negative temperature coefficient and whose resistance decreases exponentially with increasing temperature. In this embodiment, a microcontroller unit (MCU, commonly known as a single-chip microcomputer) is also provided as a specific embodiment of the processing module 03.

[0143] It should be noted that the use of NTC or MUC does not exclude other electronic components with similar functions, especially electronic components such as temperature sensors.

[0144] The discussion is as follows: the resistance of the NTC changes with the temperature of the heating wire in the heating module. The change in the resistance of the NTC will change the voltage of the MCU detection pin, and then the signal is converted into a digital signal through the module conversion circuit, thereby forming a digital signal of the second temperature.

[0145] Then, in the process of presetting an ideal temperature, a digital signal of the preset ideal temperature is already available.

[0146] Finally, the digital signal of the second temperature and the digital signal of the ideal temperature are compared and judged.

[0147] like Fig.10 As shown, Fig.10 It is a schematic diagram of the structure of the processing module provided in this application, which includes:

[0148] Storage unit 031, used to store the ideal temperature;

[0149] The processing unit 032 is used to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, the circuit is continued to be heated so that the second temperature continues to increase; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped;

[0150] The temperature control unit 033 is electrically connected to the processing unit 032, and the temperature control unit 033 is used to receive numerical values ​​of the first temperature and the second temperature.

[0151] like Fig.11 As shown, Fig.11 032 is a schematic diagram of the structure of the processing unit 032 provided in the present application, which includes:

[0152] A collection subunit 0321 is used to collect the numerical value of the second temperature;

[0153] The conversion subunit 0322 is used to convert the numerical value of the second temperature to form a second digital signal;

[0154] A comparing subunit 0323 is used to compare the magnitude of the second digital signal with the numerical magnitude of the ideal temperature;

[0155] The heating subunit 0324 is used to continue heating the circuit when the value of the second digital signal is smaller than the value of the ideal temperature, so that the second temperature continues to rise.

[0156] like Fig.12 As shown, Fig.12 032 is a schematic diagram of the structure of the processing unit 032 provided in the present application, which includes:

[0157] A collection subunit 0321 is used to collect the numerical value of the second temperature;

[0158] The conversion subunit 0322 is used to convert the numerical value of the second temperature to form a second digital signal;

[0159] A comparing subunit 0323 is used to compare the magnitude of the second digital signal with the numerical magnitude of the ideal temperature;

[0160] The heating stop subunit 0325 is used to stop the circuit from heating when the value of the second digital signal is greater than or equal to the value of the ideal temperature.

[0161] like Fig.13 As shown, Fig.13 : is a schematic diagram of a circuit for heating according to another embodiment of the present application, which includes:

[0162] The preset time module 01 is used to preset a time threshold;

[0163] A time calculation module 02 is used to calculate the heating time of the circuit, when the heating time of the circuit is greater than or equal to the time threshold;

[0164] The state processing module 03 is used to put the circuit into a standby state or to make the circuit reach a first temperature.

[0165] It should be noted that the above steps are to adjust whether the circuit needs to be put into standby mode or to make the circuit reach the first temperature by identifying the change of time, so that the circuit can achieve the technical effect of energy saving and environmental protection. When the circuit is not used for a long time, the circuit can be put into standby mode or the circuit can be made to reach the first temperature to reduce the loss of electric energy.

[0166] like Fig.14 , Fig.15 as well as Fig.16 As shown, Fig.14 This is a structural diagram of the front side of a heating pad 001 provided in this application. Fig.15 This is a schematic diagram of the back side of a heating pad 001 provided in this application. Fig.16 This is a schematic diagram of the disassembled structure of a heating pad 001 provided in this application.

[0167] The heating pad 001 adopts any of the above-mentioned methods for heating. All the methods for heating and / or circuits for heating in this application can be applied to the heating pad 001, so they are not described here. The heating pad 001 includes an operating area 01 and a heating area 03, and the operating area 01 and the heating area 03 are fixedly connected. The fixed connection method can be screw connection, riveting, interference fit, clamping, gluing, etc.

[0168] The heating area 03 includes: a cushion body 31, which is made of a flexible material, and the cushion body 31 includes an upper surface 313 and a lower surface 311, and the upper surface 313 and the lower surface 311 are arranged opposite to each other. The upper surface 313 is a substantially flat and smooth surface, which is used to place the object to be heated. In actual application scenarios, the object to be heated can be food, clothes, milk, meat to be thawed, etc.

[0169] In the present application, the flexible material of the mat body 31 can be a rollable material such as silicone, rubber, etc., which will not be listed here one by one.

[0170] The heating area 03 also includes a plurality of support columns 33, which are arranged on the lower surface 311 and extend outward from the lower surface 311, and the height of the support columns 33 is greater than the thickness of the cushion body 31; wherein the support columns 33 and the cushion body 31 are integrated in design, and in the actual production and processing process, the support columns 33 and the cushion body 31 are generated in the mold at the same time. It should be noted that the thickness of the cushion body 31 is the shortest distance between the upper surface 313 and the lower surface 311, and the height of the support column 33 is the distance between the top of the support column 33 and the lower surface.

[0171] It should be noted that the support columns 33 are arranged in an array on the lower surface 311, and there are gaps between different support columns 33. The cross-sectional shape of the support columns 33 can be a triangle, a quadrilateral, a pentagon, a hexagon, a heptagon, an octagon, a circle, an ellipse, and various irregular shapes.

[0172] In actual use, the free end of the support column 33 is generally in contact with the desktop, that is, the mat body 31 is placed on the desktop, and then the object to be heated is placed on the upper surface 313 .

[0173] In a preferred embodiment of the present application, the height of the support column 33 is at least twice the thickness of the cushion body 31 .

[0174] The heating area 03 also includes a heating wire 35, which is installed on the lower surface 311; there are gaps between the support columns 33, and the heating wire 35 is arranged in the gaps and is arranged around the support columns 33 to form a winding state similar to an "S" shape. The heating wire 35 is also made of flexible material.

[0175] It should be noted that in the application scenario of the present application, the object to be heated is placed on the upper surface 313, and the lower surface 311 is generally placed on a desktop. Since the heating wire 35 is close to the lower surface 311, the heat of the heating wire 35 is eventually transferred to the object to be heated through the heat conduction of the cushion body 31. If the lower surface 311 to which the heating wire 35 is close is too close to the desktop, it may cause excessive temperature to damage the desktop or even cause a fire. Therefore, in the present application, a support column 33 is provided, and the height of the support column 33 is greater than the thickness of the cushion body 31. In the optimal embodiment, the height of the support column 33 is at least twice the thickness of the cushion body 31.

[0176] The operation area 01 includes an upper shell 11, which is a shell-like structure with a through hole 111. The shape of the through hole 111 is not specifically limited, and can be an ellipse, a circle, a quadrilateral, a triangle, etc., and the number of the through holes 111 is not specifically limited, and can be one relatively large through hole 111 or a plurality of through holes 111.

[0177] The operation area 01 also includes a lower shell 13, which is arranged opposite to the upper shell 11. The upper shell 11 and the lower shell 13 are fixedly connected to form a receiving space. The upper shell 11 and the lower shell 13 can be fixedly connected by snapping, screw connection, gluing, interference fit, riveting, hinge connection, etc. In this embodiment, the selected connection method is screw connection.

[0178] The operation area 01 further includes a circuit board 17, an operation interface 19, and a wiring port 14, all of which are installed in the accommodation space; the operation interface 19 is arranged at the through hole 111 of the upper shell 11, and the operation interface 19 is electrically connected to the circuit board 17. The shape of the operation interface 19 is adapted to the shape of the through hole 111.

[0179] In actual use, the connection port 14 is connected to an external power source, and then the power is input to the circuit board 17. The circuit board 17 adopts the present application, such as Figures 8 to 13 Any of the heating circuits described in the invention can perform various judgments and processes on the input current, and finally realize the following functions: heating the heating wire 35, or detecting the temperature of the heating wire 35, or controlling the heating time of the heating wire 35, etc.

[0180] like Fig.17 As shown, Fig.17 is a cross-sectional view of a heating area 03 of a heating pad 001 provided in the present application, Fig.18 It is a partial cross-sectional view of a heating area 03 of a heating pad 001 of the present application. The heating area 03 includes a mounting groove 37 with an opening, which is opened on the lower surface 311, and the opening is far away from the upper surface 313; the mounting groove 37 is located in the gap between different support columns 33; the mounting groove 37 includes a bottom wall 371, a first side wall 373 and a second side wall 375, and the second side wall 375 is arranged opposite to the first side wall 373;

[0181] The bottom wall 371 , the first side wall 373 , and the second side wall 375 are integrated into one another, and the bottom wall 371 , the first side wall 373 , and the second side wall 375 enclose a groove-shaped space 376 ; the heating wire 35 is disposed in the groove-shaped space 376 .

[0182] It should be noted that the bottom wall 371, the first side wall 373 and the second side wall 375 drawn in the drawings of the specification are only one embodiment. In other embodiments, the bottom wall 371, the first side wall 373 or the second side wall 375 may be a curved surface, a flat surface, an arc surface, a folded surface or other irregular surfaces. In other words, the shapes of the bottom wall 371, the first side wall 373 and the second side wall 375 are not specifically limited here, as long as they can enclose a groove-shaped space 376.

[0183] It should also be noted that the layout of the operating space 376 on the lower surface is not specifically limited. It can be an "S"-shaped meandering distribution, and the heating wire 35 is set in its meandering distribution trajectory; it can also be a "straight line or broken line" layout.

[0184] In the present application, the groove-shaped space 376 may be recessed between the upper surface 313 and the lower surface 311, that is, the groove-shaped space 376 is excavated in the mat body 31. At this time, the heating wire 35 is arranged in the groove-shaped space 376, and the heating wire 35 is closer to the upper surface 313, and its heating effect is better. Because the heating wire 35 is closer to the upper surface 313, the heating effect is good; the heating wire 35 is farther away from the desktop, which more effectively prevents burns and damage to the desktop.

[0185] The groove-shaped space 376 may also be convex from the lower surface 311 . In this case, both the first side wall 373 and the second side wall 375 are convex from the lower surface 311 .

[0186] The heating area 03 further includes a first encapsulation layer 38 and a second encapsulation layer 39. The first encapsulation layer 38 is wrapped around the heating wire 35, and the heating wire 35 is arranged in the groove-shaped space 376. The second encapsulation layer 39 is arranged at the opening of the mounting groove 37, so that the bottom wall 371, the first side wall 373, the second side wall 375 and the second encapsulation layer 39 form a closed space, and the first encapsulation layer 38 and the heating wire 35 are arranged in the closed space.

[0187] It should be noted that in the application scenario of the present application, the material of the first encapsulation layer 38 can be a flexible material such as silicone material, rubber material, etc.; the second encapsulation layer 39 can be a flexible material such as glue material, silicone material, rubber material, etc. Through the first encapsulation layer 38 and the second encapsulation layer 39, the local overheating in the mat body 31 is reduced, and the service life of the electronic body is improved. At the same time, through the first encapsulation layer 38 and the second encapsulation layer 39, the heating wire 35 will not produce odor after the heating wire is energized (or the odor is blocked), so that consumers have a good dining experience.

[0188] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A method for heating, characterized in that include: Preset an ideal temperature; Turning on a power source so that the circuit reaches a first temperature; triggering the switch to cause the circuit to reach a second temperature; determining whether the second temperature is the same as the ideal temperature; When the second temperature is lower than the ideal temperature, the circuit is continuously heated so that the second temperature continues to rise; When the second temperature is greater than or equal to the ideal temperature, stopping heating the circuit; The first temperature is lower than the second temperature.

2. The method for heating according to claim 1, characterized in that The step of turning on the power supply so that the circuit reaches the first temperature also includes: Turning on the power supply so that the circuit is in a standby state; The first switch is turned on to detect a change in the resistance value of the circuit and to detect whether the circuit reaches a first temperature.

3. The method for heating according to claim 2, characterized in that Also includes: Preset a time threshold; calculating the heating time of the circuit, when the heating time of the circuit is greater than or equal to the time threshold; Then the circuit is placed in the standby state or the circuit reaches the first temperature.

4. The method for heating according to claim 2, characterized in that The step of triggering the switch to make the circuit reach the second temperature comprises: Turn on the second switch; The change of the resistance value of the circuit is detected, and the actual temperature value of the circuit is detected, which is defined as the second temperature.

5. A circuit for heating, characterized in that include: A power module, used for connecting to an external power source so that the circuit reaches a first temperature; Used to trigger the switch so that the circuit reaches a second temperature; A heating module, which is electrically connected to the power module, and the power module supplies power to the heating module so that the temperature of the heating module changes; Processing module; used to preset an ideal temperature; and also used to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, the circuit is continuously heated so that the second temperature continues to rise; When the second temperature is greater than or equal to the ideal temperature, stopping heating the circuit; The first temperature is less than the second temperature; A circuit substrate, the power module and the processing module are both installed on the circuit substrate, and the power module, the processing module and the heating module are electrically connected.

6. The circuit for heating according to claim 5, characterized in that Also includes: A display module, which is electrically connected to the power module and the processing module; The display module comprises: Indicator light unit; A driving unit, used for driving the indicator light unit; A display unit, wherein the indicator light unit is electrically connected to the display unit; Wherein, the indicator light unit, the driving unit and the display unit are electrically connected.

7. The circuit for heating according to claim 5, characterized in that The processing module comprises: A storage unit, used for storing the ideal temperature; a processing unit, configured to determine whether the second temperature is the same as the ideal temperature; when the second temperature is lower than the ideal temperature, continue to heat the circuit so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, stop heating the circuit; A temperature control unit is electrically connected to the processing unit, and is used to receive numerical values ​​of the first temperature and the second temperature.

8. A mat for heating, characterized in that: It adopts the method for heating as claimed in any one of claims 1 to 4, wherein the heating pad comprises: An operation area, the operation area comprising: An upper shell, which is a shell-like structure with a through hole; A lower shell, which is arranged opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form a containing space; A circuit board installed in the accommodation space; An operation interface, which is arranged at the through hole of the upper shell, and the operation interface is electrically connected to the circuit board; The heating area is fixedly connected to the operating area; the heating area includes: A cushion body, which is made of a flexible material, comprising an upper surface and a lower surface, wherein the upper surface and the lower surface are arranged opposite to each other; A plurality of support columns, which are arranged on the lower surface and extend outward from the lower surface, and the height of the support columns is greater than the thickness of the cushion body; A heating wire is installed on the lower surface; there are gaps between the support columns, and the heating wire is arranged in the gaps; the heating wire is electrically connected to the circuit board.

9. The heating pad according to claim 8, characterized in that The heating area also includes: A mounting groove having an opening; the mounting groove is located at the gap; the mounting groove comprises: bottom wall; a first side wall; a second side wall, disposed opposite to the first side wall; The first side wall, the bottom wall and the second side wall are connected in sequence, and the bottom wall, the first side wall and the second side wall form a groove-shaped space; The heating wire is arranged in the groove-shaped space.

10. The heating pad according to claim 9, characterized in that The heating area also includes: A first packaging layer is wrapped around the heating wire, and the heating wire and the first packaging layer are both arranged in the groove-shaped space. The second packaging layer is arranged at the opening of the installation groove, so that the bottom wall, the first side wall, the second side wall and the second packaging layer form a closed space, and the first packaging layer and the heating wire are arranged in the closed space.

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