Printed circuit board module, preparation method thereof and electronic equipment

Abstract

The invention discloses a printed circuit board module, a preparation method thereof and electronic equipment, the printed circuit board module provided by the invention comprises a printed circuit board, a chip, an electric connection part and a bonding part, and the printed circuit board comprises a welding area and a peripheral area arranged around the welding area; the chip is located on one side of the printed circuit board, and the orthographic projection of the chip on the printed circuit board covers the welding area; the electric connection part is positioned between the welding area and the chip and is used for realizing electric connection between the printed circuit board and the chip; the bonding part is arranged on the side, facing the chip, of the printed circuit board, located in the peripheral area and used for bonding and fixing the side edge of the chip and the peripheral area. According to the printed circuit board module provided by the invention, the product yield and the service life of the printed circuit board module are improved.

Description

Technical Field

[0001] The present application belongs to the field of vehicles, and in particular relates to a printed circuit board module, a preparation method thereof, and an electronic device. Background Art

[0002] With the development of automotive electronic technology, large-size chips with integrated multi-functions have appeared (chip size greater than 50mm×50mm). It is difficult to weld such chips to printed circuit boards (PCBs), which can easily lead to product defects. Summary of the invention

[0003] The embodiments of the present application provide a printed circuit board module, a method for preparing the same, and an electronic device. The printed circuit board module provided by the present application improves its own product yield and service life.

[0004] An embodiment of a first aspect of the present application provides a printed circuit board module, comprising:

[0005] A printed circuit board, the printed circuit board comprising a welding area and a peripheral area arranged around the welding area;

[0006] A chip is located on one side of the printed circuit board, and the orthographic projection of the chip on the printed circuit board covers the welding area;

[0007] An electrical connection portion, located between the welding area and the chip, for realizing electrical connection between the printed circuit board and the chip;

[0008] The bonding portion is arranged on a side of the printed circuit board facing the chip and located in the peripheral area, and is used to bond and fix the side edge of the chip to the peripheral area.

[0009] According to an implementation scheme of the first aspect of the present application, the printed circuit board includes a substrate, a copper clad, a pad and an insulating layer, the copper clad and the pad are located on one side of the substrate, and a gap is formed between the copper clad and the pad, the insulating layer is located on the side of the copper clad away from the substrate, the orthographic projection of the insulating layer on the substrate exposes the pad and exposes a portion of the substrate in an area opposite to the gap, and the orthographic projection of the adhesive portion on the substrate does not overlap with the pad.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the chip on the printed circuit board is a rectangle, and the bonding portion includes a first bonding portion, and the first bonding portion is bonded and fixed to the four vertices of the rectangle.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the bonding portion further includes a second bonding portion, the second bonding portion is spaced apart from the first bonding portion, and the second bonding portion is bonded and fixed to part of the four sides of the rectangle.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the adhesive portion includes a colloid, and the curing temperature of the adhesive portion is lower than the glass transition temperature of the printed circuit board and lower than the melting point of the electrical connection portion.

[0013] The embodiment of the second aspect of the present application further provides a method for preparing a printed circuit board module, comprising:

[0014] Providing a printed circuit board, the printed circuit board comprising a welding area and a peripheral area arranged around the welding area;

[0015] providing an electrical connection portion in the welding area;

[0016] Providing a chip, and arranging the chip on a side of the electrical connection portion away from the printed circuit board, and realizing electrical connection between the printed circuit board and the chip through the electrical connection portion;

[0017] A bonding portion is formed on a side of the printed circuit board facing the chip, the bonding portion is located in the peripheral area, and the bonding portion is bonded and fixed to the side edge of the chip and the peripheral area.

[0018] According to an implementation of the second aspect of the present application, the adhesive portion includes a colloid, and a curing temperature of the adhesive portion is lower than a glass transition temperature of the printed circuit board and lower than a melting point of the electrical connection portion.

[0019] According to any of the aforementioned embodiments of the second aspect of the present application, the electrical connection portion includes solder, a bonding portion is formed on a side of the printed circuit board facing the chip, and the bonding portion is located in the peripheral area. After the step of bonding and fixing the bonding portion to the side edge of the chip and the peripheral area, the method further includes:

[0020] The electrical connection portion is heated, and the printed circuit board and the chip are pressurized to achieve electrical connection between the printed circuit board and the chip through the electrical connection portion.

[0021] According to any of the aforementioned embodiments of the second aspect of the present application, the electrical connection portion includes solder, the bonding portion is formed on a side of the printed circuit board facing the chip, the bonding portion is located in the peripheral area, and before the step of bonding and fixing the bonding portion to the side edge of the chip and the peripheral area, the method further includes:

[0022] The electrical connection portion is heated, and the printed circuit board and the chip are pressurized to achieve electrical connection between the printed circuit board and the chip through the electrical connection portion.

[0023] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the chip on the printed circuit board is a rectangle, and the step of forming a bonding portion on a side of the printed circuit board facing the chip includes:

[0024] The bonding parts are formed at the four vertex positions of the rectangle.

[0025] An embodiment of the second aspect of the present application further provides an electronic device, comprising any one of the printed circuit board modules provided by the first aspect of the present application.

[0026] The printed circuit board module provided in the present application includes a printed circuit board, a chip, an electrical connection part and a bonding part, wherein the printed circuit board includes a welding area and a peripheral area, the welding area can be used to electrically connect with the chip, and the chip and the printed circuit board are arranged in alignment so that the chip and the welding area are in relative position to facilitate the electrical connection between the chip and the welding area. The chip and the welding area are electrically connected through the electrical connection part, and the position of the chip and the printed circuit board is relatively fixed. The bonding part is arranged on the side of the printed circuit board facing the chip, and is located in the peripheral area. The bonding part is bonded and fixed to the surface of one side of the peripheral area of ​​the printed circuit board facing the chip, and is bonded and fixed to the side edge of the chip, so that the chip and the printed circuit board are further fixed through the bonding part, which can further improve the mechanical strength of the printed circuit board and the chip as a whole, so that the printed circuit board module can further resist the stress effect on the printed circuit board module in the subsequent processing process and the use process, and improve the product yield and service life of the printed circuit board module. And the method of further enhancing the mechanical strength of the printed circuit board and the chip as a whole through the bonding part is low in cost, simple to operate, and effective, and effectively improves the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 It is a structural schematic diagram of a printed circuit board module provided in an embodiment of the present application;

[0029] Figure 2 yes Figure 1 A cross-sectional view along the middle line Q-Q';

[0030] Figure 3 It is a structural schematic diagram of a printed circuit board in a printed circuit board module provided in an embodiment of the present application;

[0031] Figure 4 yes Figure 3 Sectional view along P-P';

[0032] Figure 5 is a structural schematic diagram of another printed circuit board module provided in an embodiment of the present application;

[0033] Figure 6 It is a flow chart of a method for preparing a printed circuit board module provided in an embodiment of the present application;

[0034] Figure 7 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0035] In the attached figure:

[0036] 1-printed circuit board module; 11-printed circuit board; A1-welding area; A2-peripheral area; 111-substrate; 112-copper cladding; 113-pad; 114-insulating layer; 115-gap; C-vertex; 12-chip; 13-electrical connection; 14-bonding portion; 141-first bonding portion; 142-second bonding portion; 2-electronic device. DETAILED DESCRIPTION

[0037] The features and exemplary embodiments of various aspects of the application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the application. However, it is obvious to those skilled in the art that the application can be implemented when some details in these specific details are not needed. The following description of the embodiments is only to provide a better understanding of the application by illustrating the example of the application.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0039] In order to better understand this application, Figures 1 to 7 A printed circuit board module, a manufacturing method thereof, and an electronic device according to an embodiment of the present application are described in detail.

[0040] See also Figure 1 and Figure 2 The embodiment of the present application provides a printed circuit board assembly 1, including a printed circuit board 11, a chip 12, an electrical connection portion 13 and a bonding portion 14. The printed circuit board 11 includes a welding area A1 and a peripheral area A2 arranged around the welding area A1; the chip 12 is located on one side of the printed circuit board 11, and the orthographic projection of the chip 12 on the printed circuit board 11 covers the welding area A1; the electrical connection portion 13 is located between the welding area A1 and the chip 12, and is used to realize the electrical connection between the printed circuit board 11 and the chip 12; the bonding portion 14 is arranged on the side of the printed circuit board 11 facing the chip 12, and is located in the peripheral area A2, and is used to bond and fix the side edge of the chip 12 to the peripheral area A2.

[0041] The printed circuit board module 1 provided in the present application includes a printed circuit board 11, a chip 12, an electrical connection portion 13 and an adhesive portion 14, wherein the printed circuit board 11 includes a welding area A1 and a peripheral area A2, the welding area A1 can be used to electrically connect with the chip 12, and the chip 12 and the printed circuit board 11 are aligned so that the chip 12 and the welding area A1 are positioned relative to each other, thereby facilitating the electrical connection between the chip 12 and the welding area A1. The chip 12 and the welding area A1 are electrically connected through the electrical connection portion 13, and the positions of the chip 12 and the printed circuit board 11 are relatively fixed. The bonding portion 14 is disposed on the side of the printed circuit board 11 facing the chip 12 and is located in the peripheral area A2. The bonding portion 14 is bonded and fixed to the surface of the side facing the chip 12 in the peripheral area A2 of the printed circuit board 11, and is also bonded and fixed to the side edge of the chip 12, so that the chip 12 and the printed circuit board 11 are further fixed by the bonding portion 14, and the mechanical strength of the printed circuit board 11 and the chip 12 as a whole can be further improved, so that the printed circuit board module 1 can further resist the stress caused by the printed circuit board module 1 in the subsequent processing and use process, and improve the product yield and service life of the printed circuit board module 1. The method of further enhancing the mechanical strength of the printed circuit board 11 and the chip 12 as a whole by the bonding portion 14 is low in cost, simple to operate, and effective, and effectively improves the reliability of the product.

[0042] In the above implementation, the chip 12 may be an LGA package or a BGA package, which is not particularly limited in the present application.

[0043] In a possible implementation, Figure 3 and Figure 4As shown, the printed circuit board 11 includes a substrate 111, a copper clad 112, a pad 113 and an insulating layer 114. The copper clad 112 and the pad 113 are located on one side of the substrate 111, and a gap 115 is formed between the copper clad 112 and the pad 113. The insulating layer 114 is located on the side of the copper clad 112 away from the substrate 111. The orthographic projection of the insulating layer 114 on the substrate 111 exposes the pad 113 and exposes the portion of the substrate 111 in the area opposite to the gap 115. The orthographic projection of the adhesive portion 14 on the substrate 111 does not overlap with the pad 113.

[0044] In the above embodiment, the printed circuit board 11 includes a substrate 111, a copper clad 112, a pad 113 and an insulating layer 114, wherein the substrate plays a bearing role, and the substrate can be RF4, or any PCB substrate 111, which also includes a ceramic substrate, an aluminum substrate 111, a copper substrate, etc. The copper clad 112 and the pad 113 are located on one side of the substrate 111, and the copper clad 112 is a carrier for connecting power and signals according to the circuit principle, and can be used to form the circuits in the printed circuit board 11, etc. The copper clad 112 can be a signal line, a ground line, a power line, a balance copper, etc. The pad 113 can be used to realize the electrical connection between the printed circuit board 11 and other chips 12. The insulating layer 114 is formed on the side of the copper clad 112 away from the substrate, and is used to realize the insulation of the copper clad 112 from other structures, and can be used to protect the copper clad 112, which can reduce the wear of the copper clad 112 caused by external forces, and can avoid the problems of short circuit and corrosion after the copper clad 112 is exposed. The insulating layer 114 can be made of green oil. The pad 113 is not covered by the insulating layer 114, so it is exposed to facilitate connection with the chip 12 and the like. In order to prevent the pad 113 from being covered by the insulating layer 114, and to prevent the electrical connection portion 13 from contacting the copper clad 112 during the electrical connection process of the pad 113 to cause a short circuit, a gap 115 is formed between the copper clad 112 and the pad 113. On the one hand, the insulating layer 114 can better wrap the edge of the copper clad 112 to better protect the copper clad 112 and better insulate it to prevent short circuits and other defects; on the other hand, the insulating layer 114 can expose the substrate 111, thereby preventing the insulating layer 114 from covering the pad 113 and affecting the subsequent electrical connection of the pad 113.

[0045] The printed circuit board module 1 is subjected to other stresses during the preparation process, such as stress caused by self-deformation caused by thermal effects and mechanical stress caused by external sources, etc., and the substrate 111 of the printed circuit board 11 is a weak area at the gap 115, so that the substrate 111 of the printed circuit board 11 is prone to cracking at the gap 115, and the cracking extends along the outermost edge of the pad 113 to the inside of the substrate 111. In the printed circuit board module 1 provided by the present application, the printed circuit board 11 and the chip 12 are further fixed by the bonding part 14, so that the overall strength of the printed circuit board 11 is improved, the probability of cracking can be effectively reduced, and the extension of the cracking can be effectively suppressed after the cracking occurs, thereby improving the product yield.

[0046] Specifically, when the chip 12 is larger (greater than 50 mm×50 mm), cracking is more likely to occur. The present application can reduce the cracking of the printed circuit board 11, especially the cracking of the printed circuit board 11 connected to the large-size chip 12, thereby effectively improving the product yield of the large-size printed circuit board module 1.

[0047] In the above embodiment, the orthographic projection of the adhesive portion 14 on the printed circuit board 11 does not overlap with the pad 113, thereby reducing the probability of the adhesive portion 14 blocking the pad 113, thereby preventing the adhesive portion 14 from blocking the pad 113 and affecting the electrical connection of the pad 113.

[0048] In a possible implementation, Figure 1 As shown, the orthographic projection of the chip 12 on the printed circuit board 11 is a rectangle, and the bonding portion 14 includes a first bonding portion 141 , and the first bonding portion 141 is bonded and fixed to the four vertices C of the rectangle.

[0049] The cracks of the printed circuit board 11 are generally easy to occur at the four corners of the printed circuit board 11. The bonding portion 14 includes a first bonding portion 141. The first bonding portion 141 is bonded and fixed to the four corners C of the rectangular chip 12. That is, the fixing position of the chip 12 and the printed circuit board 11 is close to the position of the printed circuit board 11 where the cracks are easy to occur, so that the strength of the printed circuit board 11 near the crack position can be further improved to further improve the crack problem.

[0050] At the same time, the first bonding portion 141 is only provided at the four vertex corners C. On the one hand, the material of the first bonding portion 141 can be saved and the preparation process of the first bonding portion 141 can be simplified; on the other hand, the chip 12 and the printed circuit board 11 can be bonded and fixed at four positions, and the four positions are evenly distributed to achieve a more stable bonding and fixing effect.

[0051] In a possible implementation, Figure 5As shown, the bonding portion 14 further includes a second bonding portion 142 , the second bonding portion 142 is spaced apart from the first bonding portion 141 , and the second bonding portion 142 is bonded and fixed to parts of the four sides of the rectangle.

[0052] In the above embodiment, the bonding portion 14 further includes a second bonding portion 142, which is bonded and fixed to parts of the four sides of the rectangle to further enhance the overall mechanical strength of the printed circuit board module 1. At the same time, the second bonding portion 142 is spaced apart from the first bonding portion 141, which can provide a space for diffusion and displacement of the bonding portion 14, thereby reducing the control accuracy of the amount of the bonding portion 14.

[0053] In a feasible implementation, the adhesive portion 14 includes colloid, and the curing temperature of the adhesive portion 14 is lower than the glass transition temperature of the printed circuit board 11 and lower than the melting point of the electrical connection portion 13 .

[0054] Specifically, the electrical connection portion 13 may be solder.

[0055] The bonding portion 14 may include colloid, specifically red glue that cures at 125° C. for 5 minutes. Any filling glue (such as under fill glue), fixing glue, etc. having the same function as red glue may also be used, and the present application does not specifically limit this.

[0056] During the welding process, it is necessary to heat the solder between the chip 12 and the printed circuit board 11 so as to complete the welding. During the heating process, the printed circuit board 11 is easily deformed by thermal stress, so that there is a pulling effect between the chip 12 and the printed circuit board 11. Due to the high hardness of the lead-free solder, the tension cannot be relieved by the solder in the middle, so the printed circuit board 11 is prone to pit cracks. In the above embodiment, the curing temperature of the bonding portion 14 is lower than the glass transition temperature of the printed circuit board 11 and lower than the melting point of the electrical connection portion 13, so that before the solder is heated, the bonding portion 14 has been cured, and the bonding and fixing of the chip 12 and the printed circuit board 11 have been completed, thereby improving the overall mechanical strength of the printed circuit board module 1, and reducing the deformation of the printed circuit board 11. As the temperature rises or stress is applied from the outside, the bonding portion 14 can share the generated thermal stress and mechanical stress, so that the force acting on the weakest point (gap portion 115) is greatly reduced.

[0057] Specifically, the bonding portion 14 can be formed after the printed circuit board 11 and the chip 12 are aligned and in contact with the solder, and before welding, which means before the solder is heated. At this time, the overall mechanical strength can be improved, and the thermal deformation of the printed circuit board 11 during the heating process can be protected, thereby further preventing the generation of pits and cracks.

[0058] At this time, the curing temperature of the adhesive portion 14 is lower than the glass transition temperature of the printed circuit board 11 and the melting point of the solder, which can ensure that the adhesive portion 14 is cured first, so that the printed circuit board 11 and the chip 12 are fixed before the solder is heated, thereby further preventing the printed circuit board 11 from thermal deformation and causing pitting and cracking.

[0059] Specifically, the dispensing can be performed after the printed circuit board 11 and the chip 12 are aligned and in contact with the solder, and after the heating and welding, and before the welding refers to before the solder is heated. At this time, the overall mechanical strength can be improved to prevent pits and cracks from being generated during external forces, such as screwing.

[0060] At this time, the curing temperature of the adhesive portion 14 is lower than the glass transition temperature of the printed circuit board 11 and the melting point of the solder, which can ensure that the solder will not be melted again during the curing process of the glue, thereby improving the welding yield.

[0061] The present application also provides a method for preparing a printed circuit board module 1, such as Figure 6 As shown, including:

[0062] S200 , providing a printed circuit board 11 , wherein the printed circuit board 11 includes a welding area A1 and a peripheral area A2 arranged around the welding area A1 .

[0063] S400: An electrical connection portion 13 is provided in the welding area A1.

[0064] S600 , providing a chip 12 , and disposing the chip 12 on a side of the electrical connection portion 13 away from the printed circuit board 11 , and achieving electrical connection between the printed circuit board 11 and the chip 12 through the electrical connection portion 13 .

[0065] S800 , forming an adhesive portion 14 on a side of the printed circuit board 11 facing the chip 12 , the adhesive portion 14 being located in the peripheral area A2 , and the adhesive portion 14 being bonded and fixed to the side edge of the chip 12 and the peripheral area A2 .

[0066] The method for preparing the printed circuit board module 1 provided in the present application is used to realize the assembly of the printed circuit board 11 and the chip 12 , and specifically includes the electrical connection and mechanical connection between the printed circuit board 11 and the chip 12 .

[0067] In the preparation method of the printed circuit board module 1 provided in the present application, the electrical connection between the printed circuit board 11 and the chip 12 is achieved through the electrical connection part 13, and the printed circuit board 11 and the chip 12 are bonded and fixed through the bonding part 14, thereby improving the overall mechanical strength of the printed circuit board 11 and the chip 12, so that the printed circuit board module 1 can further resist the stress-induced damage to the printed circuit board module 1 during subsequent processing and use, thereby improving the product yield and service life of the printed circuit board module 1.

[0068] Specifically, the bonding portion 14 can be formed by using a glue dispensing process, which has low cost, simple operation, obvious effect, and effectively improves the reliability of the product.

[0069] In a feasible implementation, the adhesive portion 14 includes colloid, and the curing temperature of the adhesive portion 14 is lower than the glass transition temperature of the printed circuit board 11 and lower than the melting point of the electrical connection portion 13 .

[0070] In a feasible implementation manner, the electrical connection portion 13 includes solder, and before step S800, the following steps are further included:

[0071] The electrical connection portion 13 is heated, and the printed circuit board 11 and the chip 12 are pressurized, so that the printed circuit board 11 and the chip 12 are electrically connected through the electrical connection portion 13 .

[0072] In the above embodiment, the electrical connection portion 13 is heated first, that is, the chip 12 is electrically connected to the printed circuit board 11; and then the bonding portion 14 is formed. Since the curing temperature of the bonding portion 14 is lower than the melting point of the solder, it can be ensured that the solder will not be melted again during the heating and curing process of the bonding portion 14, thereby improving the welding yield.

[0073] In a feasible implementation manner, the electrical connection portion 13 includes solder, and after step S800, the following steps are further included:

[0074] The electrical connection portion 13 is heated, and the printed circuit board 11 and the chip 12 are pressurized, so that the printed circuit board 11 and the chip 12 are electrically connected through the electrical connection portion 13 .

[0075] In the above embodiment, the bonding portion 14 is formed first, and then the chip 12 is electrically connected to the printed circuit board 11. Since the curing temperature of the bonding portion 14 is lower than the glass transition temperature of the printed circuit board 11, the solder will not achieve the electrical connection effect during the heating and fixing process of the bonding portion 14, thereby ensuring that the bonding portion 14 is cured first, that is, the printed circuit board 11 and the chip 12 are fixed before the solder is heated to achieve electrical connection, and the overall mechanical properties of the printed circuit board 11 and the chip 12 are improved. In the subsequent process of heating the solder to achieve electrical connection, the printed circuit board 11 is less likely to deform at high temperature than before, thereby improving the pit cracking problem and improving the product yield.

[0076] In a feasible implementation, the orthographic projection of the chip 12 on the printed circuit board 11 is a rectangle, and the step of forming the bonding portion 14 on the side of the printed circuit board 11 facing the chip 12 includes:

[0077] Adhesive portions 14 are formed at the four corners C of the rectangle.

[0078] This simplifies the preparation process and saves materials, making the preparation method of the printed circuit board module 1 provided by the present application low in cost, simple in operation, and effective in improving the reliability of the product.

[0079] The present application also provides an electronic device 2, such as Figure 7 As shown, it includes any one of the printed circuit board modules 1 provided in the above embodiments of the present application.

[0080] Specifically, the printed circuit board module 1 may be located on a side of the electronic device 2 that is away from the light emitting surface.

[0081] Specifically, the electronic device 2 can be applied to transportation equipment such as vehicles and airplanes, and can be a vehicle-mounted display screen, etc., and this application does not make any special limitation to this.

[0082] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the application to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A printed circuit board module, characterized in that: include: A printed circuit board, the printed circuit board comprising a welding area and a peripheral area arranged around the welding area; A chip is located on one side of the printed circuit board, and the orthographic projection of the chip on the printed circuit board covers the welding area; An electrical connection portion, located between the welding area and the chip, for realizing electrical connection between the printed circuit board and the chip; The bonding portion is arranged on a side of the printed circuit board facing the chip and located in the peripheral area, and is used to bond and fix the side edge of the chip to the peripheral area.

2. The printed circuit board module according to claim 1, characterized in that: The printed circuit board includes a substrate, a copper clad, a pad and an insulating layer, wherein the copper clad and the pad are located on the same side of the substrate, and a gap is formed between the copper clad and the pad, and the insulating layer is located on a side of the copper clad away from the substrate, an orthographic projection of the insulating layer on the substrate exposes the pad and exposes a portion of the substrate in an area opposite to the gap, and an orthographic projection of the adhesive portion on the substrate does not overlap with the pad.

3. The printed circuit board module according to claim 1, characterized in that: The orthographic projection of the chip on the printed circuit board is a rectangle, and the bonding portion includes a first bonding portion, and the first bonding portion is bonded and fixed to four vertices of the rectangle.

4. The printed circuit board module according to claim 3, characterized in that: The bonding portion further includes a second bonding portion, the second bonding portion is spaced apart from the first bonding portion, and the second bonding portion is bonded and fixed to a portion of the four sides of the rectangle.

5. The printed circuit board module according to claim 1, characterized in that: The adhesive portion includes colloid, and a curing temperature of the adhesive portion is lower than a glass transition temperature of the printed circuit board and lower than a melting point of the electrical connection portion.

6. A method for preparing a printed circuit board module, characterized in that: include: Providing a printed circuit board, the printed circuit board comprising a welding area and a peripheral area arranged around the welding area; providing an electrical connection portion in the welding area; Providing a chip, and arranging the chip on a side of the electrical connection portion away from the printed circuit board, and realizing electrical connection between the printed circuit board and the chip through the electrical connection portion; A bonding portion is formed on a side of the printed circuit board facing the chip, the bonding portion is located in the peripheral area, and the bonding portion is bonded and fixed to the side edge of the chip and the peripheral area.

7. The preparation method according to claim 6, characterized in that: The adhesive portion includes colloid, and a curing temperature of the adhesive portion is lower than a glass transition temperature of the printed circuit board and lower than a melting point of the electrical connection portion.

8. The preparation method according to claim 6 or 7, characterized in that: The electrical connection portion includes solder, a bonding portion is formed on a side of the printed circuit board facing the chip, the bonding portion is located in the peripheral area, and after the step of bonding and fixing the bonding portion to the side edge of the chip and the peripheral area, the method further includes: The electrical connection portion is heated, and the printed circuit board and the chip are pressurized to achieve electrical connection between the printed circuit board and the chip through the electrical connection portion.

9. The preparation method according to claim 6 or 7, characterized in that: The electrical connection portion includes solder, a bonding portion is formed on a side of the printed circuit board facing the chip, and the bonding portion is located in the peripheral area. Before the step of bonding and fixing the bonding portion to the side edge of the chip and the peripheral area, the method further includes: The electrical connection portion is heated, and the printed circuit board and the chip are pressurized to achieve electrical connection between the printed circuit board and the chip through the electrical connection portion.

10. The preparation method according to claim 8, characterized in that: The orthographic projection of the chip on the printed circuit board is a rectangle, and the step of forming a bonding portion on a side of the printed circuit board facing the chip comprises: The bonding parts are formed at the four vertex positions of the rectangle.

11. An electronic device, characterized in that: It comprises a printed circuit board module as described in any one of claims 1 to 5.

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