Optical fingerprint module with conductive fabric structure and manufacturing method

Abstract

The invention discloses an optical fingerprint module with a conductive fabric structure and a manufacturing method, and relates to the field of optical fingerprint modules, the module comprises a flexible circuit board, the flexible circuit board comprises a main body part, a connection section and a plugging end, the front surface of the main body part is provided with a fingerprint sensor and at least one light emitting diode, and the connection section is connected with the plugging end. A first reinforcing plate and a second reinforcing plate are respectively arranged on the back surfaces of the main body part and the plugging end, conductive cloth with an integral internal shrinkage structure is adhered to the back surface of the flexible circuit board, and two ends of the conductive cloth are respectively and electrically connected with the first reinforcing plate and the second reinforcing plate; floating potential and interference signals possibly occurring in a circuit are effectively reduced, voltage and current are stabilized, electromagnetic interference is suppressed, fingerprint signals can be stably recognized in a complex use environment, shaking and falling of a module at the installation position are avoided, the precision and stability of optical fingerprint recognition are remarkably improved, and the application range of the optical fingerprint recognition module is widened. And the conductive cloth realizes automatic film pasting, so that the labor cost and the working intensity are reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of optical fingerprint modules, and in particular to an optical fingerprint module with a conductive cloth structure and a manufacturing method thereof. Background Art

[0002] With the rapid development of mobile devices, smart homes, security monitoring and other fields, fingerprint recognition technology has become one of the important means of identity authentication. As a common fingerprint recognition technology, the optical fingerprint recognition module works by capturing fingerprint images through optical sensors and processing the images through algorithms to identify the user's identity. Optical fingerprint recognition modules are widely used in smart phones, laptops, access control systems, financial payments and other fields.

[0003] Patent application number CN201821861281.X discloses an optical fingerprint module, which includes a flexible circuit board, wherein the first frame, the fingerprint sensor and the at least one light-emitting diode are arranged on the upper surface of one end of the flexible circuit board, and a connector is arranged at the other end of the flexible circuit board. Patent application number CN201610308438.5 discloses a terminal device, including: a fingerprint recognition module, an FPC, and a mainboard; the fingerprint recognition module patch is on one side of the FPC; the other side of the FPC is pasted on a reinforcing sheet layer; the reinforcing sheet layer is fixed on the mainboard, and the reinforcing sheet layer is used to reinforce the FPC, and the reinforcing sheet layer is also used to shield the devices on the mainboard. The reinforcing sheet layer is used to support the FPC first and to shield the devices on the mainboard second.

[0004] However, the existing reinforcement plates are mostly nickel-plated SUS 316L steel sheets or copper-leaking reinforcement plates. Such reinforcement plates have poor grounding effect in complex environments, and there is a risk of electrostatic injury. Affected by floating potential and interference signals, the optical fingerprint module is unstable in recognition during actual application, resulting in reduced fingerprint recognition accuracy. Therefore, the present invention discloses an optical fingerprint module with a conductive cloth structure and a manufacturing method to solve the above problems. Summary of the invention

[0005] Based on this, it is necessary to provide an optical fingerprint module with a conductive cloth structure and a manufacturing method to address the above-mentioned technical problems. The conductive cloth with an integrated retracted structure is bonded to the back of the flexible circuit board, which can effectively reduce the floating potential and interference signals that may appear in the circuit, stabilize the voltage and current, and suppress electromagnetic interference. It can better identify fingerprint signals in complex usage environments and avoid jitter and falling of the module at the installation position, which significantly improves the accuracy and stability of optical fingerprint recognition. The overall structure is simple, the manufacturing cost is low, and it has good market application prospects. The conductive cloth realizes automatic film sticking of the equipment, reduces labor costs and work intensity, and improves production efficiency.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions: An optical fingerprint module with a conductive cloth structure comprises a flexible circuit board, wherein the flexible circuit board comprises a main body, a connecting section and a plug-in end, the main body is electrically connected to the plug-in end through the connecting section, a fingerprint sensor and at least one light-emitting diode are installed on the front of the main body, a connector is installed on the front of the plug-in end, a first reinforcement plate and a second reinforcement plate are respectively provided on the backs of the main body and the plug-in end, a conductive cloth with an inward-retracted structure is attached to the back of the flexible circuit board, and both ends of the conductive cloth are respectively electrically connected to the first reinforcement plate and the second reinforcement plate.

[0007] As a preferred embodiment of the optical fingerprint module with a conductive cloth structure provided by the present invention, the outer contour of the conductive cloth is consistent with the outer contour of the flexible circuit board and the outer dimensions of the conductive cloth are not larger than the outer dimensions of the flexible circuit board.

[0008] As a preferred embodiment of the optical fingerprint module with a conductive cloth structure provided by the present invention, adhesive layers are provided on the front and back sides of the conductive cloth, and exposed areas are provided at both ends of one surface of the conductive cloth, and the exposed areas are electrically connected to the first reinforcement plate and the second reinforcement plate.

[0009] As a preferred implementation of the optical fingerprint module with a conductive cloth structure provided by the present invention, the exposed area is provided with conductive glue.

[0010] As a preferred embodiment of the optical fingerprint module with double-sided gold fingers provided by the present invention, it also includes a shell, which is fixed on the flexible circuit board and the fingerprint sensor and the light-emitting diode are both located in the shell. The shell is located on the raised part above the fingerprint sensor, and the raised part is provided with a lens.

[0011] As a preferred embodiment of the optical fingerprint module with double-sided gold fingers provided by the present invention, it also includes a transparent cover, which covers the outer side of the raised portion and is bonded and fixed to the shell through an adhesive layer.

[0012] As a preferred embodiment of the optical fingerprint module with double-sided gold fingers provided by the present invention, the transparent cover is provided with diagonally arranged positioning grooves, and the housing is provided with positioning columns matching the positioning grooves.

[0013] A method for manufacturing an optical fingerprint module with a conductive fabric structure comprises the following steps: Bonding a first reinforcing plate and a second reinforcing plate to the reverse side of the flexible circuit board; A conductive cloth roll is provided. After the conductive cloth roll is unwound, it moves along the material discharging direction. The film laminating device laminates the conductive cloth in the roll onto the reverse side of the flexible circuit board, and makes the two ends of the conductive cloth bonded to the first reinforcement plate and the second reinforcement plate respectively. Assemble the fingerprint sensor, LED and connector on the front side of the flexible circuit board.

[0014] As a preferred embodiment of the manufacturing method of the optical fingerprint module with a conductive cloth structure provided by the present invention, the conductive cloth roll includes a barrel, a PET film is wound on the barrel, at least two rows of conductive cloth arranged at equal intervals are distributed on the inner side of the winding of the PET film, the conductive cloth is pasted on the PET film, and after unwinding, the film pasting equipment takes out the conductive cloth from the PET film.

[0015] As a preferred embodiment of the method for manufacturing the optical fingerprint module with a conductive cloth structure provided by the present invention, signal sensing holes are provided on one side of the PET film, and the signal sensing holes correspond one-to-one to the conductive cloth on the PET film along the discharge direction.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The optical fingerprint module with a conductive cloth structure provided by the present invention adopts a conductive cloth with an integral retracted structure to be attached to the back of a flexible circuit board. After being connected to an external circuit, the conductive cloth grounds the ground wires of the main body and the connector through external contacts, effectively reducing the floating potential and interference signals that may appear in the circuit, stabilizing the voltage and current, and suppressing electromagnetic interference. At the same time, the main body and the plug-in end of the flexible circuit board are fixed together, which can better stably identify fingerprint signals in a complex use environment, avoid jitter and falling off of the module at the installation position, significantly improve the accuracy and stability of optical fingerprint recognition, and has a simple overall structure, low manufacturing cost, and good market application prospects. The manufacturing method of the optical fingerprint module with a conductive cloth structure provided by the present invention comprises laying the conductive cloth in a coil, and after unwinding along the discharge direction, the film laminating equipment can laminate the conductive cloth on a flexible circuit board, thereby realizing automatic film laminating of the equipment, reducing labor costs and work intensity, and improving production efficiency. Furthermore, the conductive cloth is arranged in multiple rows, which can reduce material costs and the number of times of loading in the automatic production process, and improve the effective utilization rate of the material roll. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the scheme of the present invention, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A three-dimensional schematic diagram of the overall structure of an optical fingerprint module with a conductive fabric structure provided by the present invention; Figure 2 A schematic diagram of the exploded structure of the optical fingerprint module with a conductive fabric structure provided by the present invention; Figure 3 for Figure 2 Another perspective structural diagram of; Figure 4 A schematic diagram of the decomposition of the flexible circuit board and the conductive cloth in the optical fingerprint module with the conductive cloth structure provided by the present invention; Figure 5 for Figure 4 Another perspective structural diagram of; Figure 6 A schematic diagram of the planar structure of the conductive cloth in the optical fingerprint module with the conductive cloth structure provided by the present invention; Figure 7 A schematic diagram of the side structure of the conductive cloth in the optical fingerprint module with the conductive cloth structure provided by the present invention; Figure 8 A schematic diagram of the use of an optical fingerprint module with a conductive fabric structure provided by the present invention; Fig. 9 A schematic diagram of the conductive cloth roll structure in the method for manufacturing an optical fingerprint module with a conductive cloth structure provided by the present invention.

[0019] The markings in the figure are as follows: 1. Flexible circuit board; 101. Main body; 102. Connecting section; 103. Plug-in end; 2. Light-emitting diode; 3. Fingerprint sensor; 4. Connector; 5. First reinforcement plate; 6. Second reinforcement plate; 7. Conductive cloth; 701. Adhesive layer; 702. Exposure area; 703. Conductive adhesive; 8. Shell; 9. Raised part; 10. Lens; 11. Transparent cover; 12. Adhesive layer; 13. Positioning groove; 14. Positioning column; 15. Cylinder; 16. PET film; 17. Signal sensing hole. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0021] As described in the background technology, the existing reinforcement plates are mostly nickel-plated SUS 316L steel sheets or copper-leaked structure reinforcement plates. This type of reinforcement plate has an unsatisfactory grounding effect in a complex environment and poses a risk of electrostatic injury. Affected by floating potential and interference signals, the optical fingerprint module has unstable recognition during actual application, resulting in reduced fingerprint recognition accuracy.

[0022] In order to solve this technical problem, the present invention provides an optical fingerprint module with a conductive cloth structure, which is applied to the field of optical fingerprint modules.

[0023] Specifically, please refer to Figure 1-8 The optical fingerprint module with a conductive cloth structure includes a flexible circuit board 1, the flexible circuit board 1 includes a main body 101, a connecting section 102 and a plug-in end 103, the main body 101 is electrically connected to the plug-in end 103 through the connecting section 102, a fingerprint sensor 3 and at least one light-emitting diode 2 are installed on the front of the main body 101, a connector 4 is installed on the front of the plug-in end 103, a first reinforcement plate 5 and a second reinforcement plate 6 are respectively provided on the back of the main body 101 and the plug-in end 103, a conductive cloth 7 with a retracted structure is attached to the back of the flexible circuit board 1, and both ends of the conductive cloth 7 are electrically connected to the first reinforcement plate 5 and the second reinforcement plate 6 respectively.

[0024] The optical fingerprint module with a conductive cloth structure provided by the present invention adopts a conductive cloth 7 with an integrated retracted structure to be attached to the back of the flexible circuit board 1. After being connected to the external circuit, the conductive cloth 7 grounds the ground wires at the main body 101 and the connector 4 through external contacts, effectively reducing the floating potential and interference signals that may appear in the circuit, stabilizing the voltage and current, and suppressing electromagnetic interference. At the same time, the main body 101 and the plug-in terminal 103 of the flexible circuit board 1 are fixed together, which can better stably identify fingerprint signals in complex usage environments, avoid jitter and falling off of the module at the installation position, significantly improve the accuracy and stability of optical fingerprint recognition, and the overall structure is simple, the manufacturing cost is low, and it has a good market application prospect.

[0025] In order to achieve the above technical effects, the present invention provides a method for manufacturing an optical fingerprint module with a conductive cloth 7 structure, which is applied to the field of optical fingerprint module preparation.

[0026] The manufacturing method of the optical fingerprint module with a conductive cloth structure comprises the following steps: Bonding a first reinforcing plate 5 and a second reinforcing plate 6 on the reverse side of the flexible circuit board 1; like Fig. 9 As shown, a conductive cloth 7 roll is provided. After the conductive cloth 7 roll is unwound, it moves along the material discharging direction. The film laminating device laminates the conductive cloth 7 in the roll onto the reverse side of the flexible circuit board 1, and makes the two ends of the conductive cloth 7 adhere to the first reinforcing plate 5 and the second reinforcing plate 6 respectively. The fingerprint sensor 3 , the light emitting diode 2 and the connector 4 are assembled on the front side of the flexible circuit board 1 .

[0027] The manufacturing method of the optical fingerprint module with a conductive cloth structure provided by the present invention lays the conductive cloth 7 in the roll material, and after unwinding along the discharge direction, the film laminating equipment can adhere the conductive cloth 7 to the flexible circuit board 1, so as to realize automatic film laminating of the equipment, reduce labor costs and work intensity, and improve production efficiency. In addition, the conductive cloth 7 is arranged in multiple rows, which can reduce material costs and the number of loading times in the automatic production process, and improve the effective utilization rate of the material roll.

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0029] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] Embodiment 1 Please refer to Figure 1-8, an optical fingerprint module with a conductive cloth structure is provided, which includes a flexible circuit board 1, the flexible circuit board 1 has a built-in circuit layer, the flexible circuit board 1 includes a main body 101, a connecting section 102 and a plug-in end 103, the main body 101 is electrically connected to the plug-in end 103 through the connecting section 102, a fingerprint sensor 3 and at least one light-emitting diode 2 are installed on the front of the main body 101, in this example, there are three light-emitting diodes 2, a connector 4 is installed on the front of the plug-in end 103, and a first reinforcement plate 5 and a second reinforcement plate 6 are respectively provided on the back of the main body 101 and the plug-in end 103, and the first reinforcement plate 5 and the second reinforcement plate 6 are nickel-plated SUS 316L steel sheet, the back of the main body 101 and the plug end 103 are provided with ground wire copper leakage areas, which are respectively used to electrically connect with the first reinforcement plate 5 and the second reinforcement plate 6, so as to achieve the purpose of grounding. The connector 4 is provided with a grounding part. After the connector 4 is connected to the external circuit, the grounding part is electrically connected to the ground of the external circuit to achieve the purpose of grounding, and a conductive cloth 7 with a shrinking structure is attached to the back of the flexible circuit board 1. The two ends of the conductive cloth 7 are respectively electrically connected to the first reinforcement plate 5 and the second reinforcement plate 6. The conductive cloth 7 is used to electrically connect the two reinforcement plates together, so that the module ground line is fully grounded, effectively reducing the floating potential and interference signals that may appear in the circuit, stabilizing the voltage and current, and suppressing electromagnetic interference. It can better enable the optical fingerprint recognition device to stably recognize fingerprint signals in a complex use environment and avoid the module from shaking and falling off at the installation position. The conductive cloth 7 adopts an integrated shrinking structure, so that the conductive cloth 7 can automatically shrink when it contacts the surface of the flexible circuit board 1, ensuring that the conductive cloth 7 is closely attached to the surface of the flexible circuit board 1, improving the conductive performance and suppressing the effect of electromagnetic interference. In this example, the structure of the conductive cloth 7 includes a stacked base layer, a conductive layer, an electromagnetic shielding layer, a shrinkage layer and a protective layer, wherein the base layer is made of a polyimide film with a thickness of 10 to 20 microns; the conductive layer is made of a silver or copper film with a thickness of 5 to 10 microns; the electromagnetic shielding layer is made of an aluminum-magnesium alloy or a nickel-iron alloy material with a thickness of 8 to 15 microns; the shrinkage layer is made of a conductive carbon nanotube or graphene material with a thickness of 5 to 8 microns; the protective layer is made of a polyurethane or a fluorinated polymer film with a thickness of 3 to 5 microns, and the shrinkage layer has the characteristic of self-shrinkage, and can automatically shrink when in contact with the surface of the flexible circuit board 1 to form a close contact, thereby effectively suppressing external electromagnetic interference and preventing interference signals from affecting the flexible circuit board 1.

[0032] The outer contour of the conductive cloth 7 is consistent with that of the flexible circuit board 1 and the outer dimensions of the conductive cloth 7 are not larger than those of the flexible circuit board 1 . Meanwhile, the conductive cloth 7 adopts an inwardly contracted structure design to avoid affecting the outer dimensions of the module.

[0033] The front and back sides of the conductive cloth 7 are provided with an adhesive layer 701, and both ends of one surface of the conductive cloth 7 are provided with an exposed area 702, the exposed area is electrically connected to the first reinforcement plate 5 and the second reinforcement plate 6, and the exposed area is provided with a conductive adhesive 703, which is bonded to the reinforcement plate to facilitate the conduction of static electricity.

[0034] Embodiment 2 The optical fingerprint module with a conductive fabric structure and the manufacturing method provided in Example 1 are further optimized. Figure 2 , 3 As shown, specifically, a shell 8 is provided on the front of the main body 101 of the flexible circuit board 1. The shell 8 is an injection molding structure. The shell 8 is fixedly connected to the first reinforcement plate 5 by rivets passing through the main body 101, so that the shell 8 is fixed on the main body 101 of the flexible circuit board 1. The fingerprint sensor 3 and the light-emitting diode 2 are both located in the shell 8. The shell 8 is located on the raised portion 9 above the fingerprint sensor 3. The raised portion 9 is an open cylindrical shell. A lens 10 is provided in the raised portion 9. The lens 10 is clamped or bonded to the inner wall of the raised portion 9. The lens 10 is a spherical lens 10. The lens 10 focuses the light reflected from the finger surface onto the optical sensor. Since the texture structure on the finger surface is small, the focal length of the lens 10 needs to be very precise to ensure that the image sensor can capture clear fingerprint details.

[0035] A transparent cover 11 is also bonded and fixed to the top surface of the housing 8 by means of an adhesive layer 12. The transparent cover 11 covers the outer side of the raised portion 9. The adhesive layer 12 is a hot melt adhesive. The transparent cover 11 protects the lens 10 from dust pollution. The portion of the transparent cover 11 located directly above the lens 10 is a high-transmittance film. The transparent cover 11 is provided with diagonally arranged positioning grooves 13, and the housing 8 is provided with positioning columns 14 matching the positioning grooves 13, so as to achieve the positioning of the transparent cover 11.

[0036] Embodiment 3 This embodiment provides a method for manufacturing the optical fingerprint module with a conductive fabric structure in the first embodiment, which comprises the following steps: A first reinforcing plate 5 and a second reinforcing plate 6 are bonded to the reverse side of the flexible circuit board 1. The flexible circuit board 1 is produced and prepared by a conventional method and cut into a size that meets the design. The two reinforcing plates are bonded and fixed to the flexible circuit board 1 by an adhesive layer. This step is an existing conventional preparation link. A conductive cloth 7 roll is provided. After the conductive cloth 7 roll is unwound, it moves along the material discharging direction. The film laminating device laminates the conductive cloth 7 in the roll to the reverse side of the flexible circuit board 1, and makes the two ends of the conductive cloth 7 adhere to the first reinforcing plate 5 and the second reinforcing plate 6 respectively. The roll is unwound by the unwinding mechanism, so that the free end of the roll moves along the material discharging direction. The conductive cloth 7 is laminated to the reverse side of the flexible circuit board 1 by the automatic film laminating device. The fingerprint sensor 3 , the light emitting diode 2 and the connector 4 are assembled on the front side of the flexible circuit board 1 .

[0037] like Fig. 9 As shown, the above-mentioned conductive cloth 7 roll material includes a barrel 15, a PET film 16 is wound on the barrel 15, and two rows of conductive cloth 7 arranged at equal intervals are distributed on the inner side of the winding of the PET film 16. The conductive cloth 7 is pasted on the PET film 16. After unwinding, the film pasting device takes out the conductive cloth 7 from the PET film 16, and the winding type, one surface of the conductive cloth 7 is bonded to the inner side of the outer PET film 16, and the other surface of the conductive cloth 7 is bonded to the outer side of the inner PET film 16, and the bonding force between the conductive cloth 7 and the outer side of the PET film 16 is smaller than that between the conductive cloth 7 and the inner side of the PET film 16 The conductive cloth 7 can be laid flat on the upper surface of the unfolded surface of the PET film 16 when unwinding, and the automatic film pasting equipment pastes the conductive cloth 7 and the flexible circuit board 1 together. At the same time, a signal sensing hole 17 is provided on one side of the PET film 16. The signal sensing hole 17 corresponds one to one with the conductive cloth 7 on the PET film 16 along the discharge direction. The design of the signal sensing hole 17 achieves precise positioning, realizes the automatic film pasting function of the equipment, and arranges the conductive cloth 7 in multiple rows on the material belt, which reduces the material cost and the number of times of loading in the automatic production process, and provides effective utilization of personnel.

[0038] The working principle of the optical fingerprint module with a conductive cloth structure and the manufacturing method provided by the present invention is as follows: the conductive cloth 7 with an integrated retracted structure is attached to the back of the flexible circuit board 1. After being connected to the external circuit, the conductive cloth 7 grounds the ground wires at the main body 101 and the connector 4 through external contacts, effectively reducing the floating potential and interference signals that may appear in the circuit, stabilizing the voltage and current, and suppressing electromagnetic interference. At the same time, the main body 101 and the plug-in terminal 103 of the flexible circuit board 1 are fixed together, which can better stably identify fingerprint signals in a complex use environment, avoid jitter and fall off of the module at the installation position, and significantly improve the accuracy and stability of optical fingerprint recognition. The overall structure is simple, the manufacturing cost is low, and it has a good market application prospect. The conductive cloth 7 is laid in the roll material, and after unwinding along the discharge direction, the film-sticking equipment can stick the conductive cloth 7 on the flexible circuit board 1 to realize automatic film sticking of the equipment, reduce labor costs and work intensity, and improve production efficiency. The conductive cloth 7 is arranged in multiple rows, which can reduce material costs and the number of times of loading in the automatic production process, and improve the effective utilization rate of the roll.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. An optical fingerprint module with a conductive cloth structure, comprising a flexible circuit board, the flexible circuit board comprising a main body, a connecting section and a plug-in end, the main body being electrically connected to the plug-in end through the connecting section, a fingerprint sensor and at least one light-emitting diode being installed on the front of the main body, and a connector being installed on the front of the plug-in end, characterized in that: The back of the main body and the plug-in end are respectively provided with a first reinforcement plate and a second reinforcement plate, and the back of the flexible circuit board is attached with a conductive cloth with an inward-retracted structure, and the two ends of the conductive cloth are respectively electrically connected to the first reinforcement plate and the second reinforcement plate.

2. The optical fingerprint module with a conductive fabric structure according to claim 1, characterized in that: The outer contour of the conductive cloth is consistent with the outer contour of the flexible circuit board, and the outer dimensions of the conductive cloth are not greater than the outer dimensions of the flexible circuit board.

3. The optical fingerprint module with a conductive fabric structure according to claim 1, characterized in that: The front and back surfaces of the conductive cloth are both provided with adhesive layers, and both ends of one surface of the conductive cloth are provided with exposed areas, and the exposed areas are electrically connected to the first reinforcement plate and the second reinforcement plate.

4. The optical fingerprint module with a conductive fabric structure according to claim 3, characterized in that: The exposed area is provided with conductive glue.

5. The optical fingerprint module with a conductive fabric structure according to claim 1, characterized in that: It also includes a shell, which is fixed on the flexible circuit board and the fingerprint sensor and the light-emitting diode are both located in the shell. The shell is located on the raised part above the fingerprint sensor, and the raised part is provided with a lens.

6. The optical fingerprint module with a conductive fabric structure according to claim 5, characterized in that: It also includes a transparent cover, which covers the outer side of the raised part and is bonded and fixed to the shell through an adhesive layer.

7. The optical fingerprint module with a conductive fabric structure according to claim 6, characterized in that: The transparent cover is provided with diagonally arranged positioning grooves, and the shell is provided with positioning columns matching the positioning grooves.

8. A method for manufacturing an optical fingerprint module with a conductive fabric structure according to any one of claims 1 to 7, characterized in that: The steps include: S1, bonding a first reinforcing plate and a second reinforcing plate on the reverse side of the flexible circuit board; S2, providing a conductive cloth roll, after the conductive cloth roll is unwound, it moves along the material discharging direction, and the film laminating equipment laminates the conductive cloth in the roll on the reverse side of the flexible circuit board, and makes the two ends of the conductive cloth bonded to the first reinforcing plate and the second reinforcing plate respectively; S3. Assemble the fingerprint sensor, light emitting diode and connector on the front side of the flexible circuit board.

9. The method for manufacturing an optical fingerprint module with a conductive fabric structure according to claim 8, characterized in that: The conductive cloth roll comprises a barrel, a PET film is wound on the barrel, at least two rows of conductive cloth arranged at equal intervals are distributed on the inner side of the winding of the PET film, the conductive cloth is pasted on the PET film, and after unwinding, the film pasting equipment takes out the conductive cloth from the PET film.

10. The method for manufacturing an optical fingerprint module with a conductive fabric structure according to claim 9, characterized in that: One side of the PET film is provided with a signal sensing hole, and the signal sensing hole corresponds one-to-one with the conductive cloth on the PET film along the discharge direction.

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