Circuit board processing device and circuit board processing technology

Abstract

The invention belongs to the technical field of circuit board processing, and discloses a circuit board processing device and a circuit board processing technology. The circuit board processing device comprises a bearing assembly, a pressing piece, a processing assembly and an air pressure assembly, the bearing assembly comprises a bakelite plate, and the bakelite plate is used for bearing a circuit board; the pressing piece can tightly press the surface of the aluminum sheet, the pressing piece and the aluminum sheet jointly form a closed cavity, and a drilling tool hole is formed in the pressing piece. The machining assembly comprises a drilling tool, and the drilling tool is arranged in the drilling tool hole and can move in the direction close to or away from the circuit board and the aluminum sheet. The air pressure assembly communicates with the closed cavity and can selectively inflate the closed cavity, and the air pressure assembly is in communication connection with the processing assembly; when the drilling tool is started, the air pressure assembly inflates the closed cavity, and when the drilling tool makes contact with the aluminum sheet, the air pressure assembly stops inflating the closed cavity. By inflating the closed cavity, positive pressure is generated in the closed cavity, the aluminum sheet is prevented from upwarping, and the processing quality of the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board processing device and a circuit board processing technology. Background Art

[0002] When processing the circuit board, the circuit board is mounted on the bakelite board and the processing area is pressed with a pressing piece to press the entire circuit board and the aluminum sheet to avoid vibration during processing and affect the processing accuracy.

[0003] In actual applications, when processing circuit boards, a dust suction component is usually equipped. When the dust suction component sucks air, negative pressure will be generated in the processing area. Due to the poor rigidity of the aluminum sheet, the aluminum sheet will warp up under the negative pressure state; and when the edge of the pressing part is far away from the hole, the aluminum sheet will be squeezed by the pressing part. The upward warping of the aluminum sheet will cause the drill to contact the aluminum sheet in advance. At this time, the cutter head will start to calculate the processing depth in advance, resulting in a deviation in the processing depth of the circuit board, affecting the processing quality of the circuit board. Summary of the invention

[0004] The purpose of the present invention is to provide a circuit board processing device and a circuit board processing technology to solve the problem in the prior art that when processing a circuit board, the aluminum sheet warps up, causing the drill to contact the aluminum sheet in advance, thereby causing a deviation in the processing depth of the circuit board, affecting the processing quality of the circuit board, thereby improving the processing quality of the circuit board.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] On the one hand, a circuit board processing device is provided, which is used for processing a circuit board, wherein the surface of the circuit board is covered with an aluminum sheet, and the circuit board processing device comprises:

[0007] A bearing assembly, the bearing assembly comprising a bakelite board, the bakelite board being used to bear the circuit board;

[0008] A pressing piece, the pressing piece can press the surface of the aluminum sheet and form a closed cavity together with the aluminum sheet, and the pressing piece is provided with a drill hole;

[0009] A processing assembly, the processing assembly comprising a drill, the drill being placed in the drill hole and being able to move in a direction close to or away from the circuit board and the aluminum sheet;

[0010] A pneumatic component is connected to the closed cavity and can selectively inflate the closed cavity. The pneumatic component is in communication with the processing component. When the drill is started, the pneumatic component inflates the closed cavity. When the drill contacts the aluminum sheet, the pneumatic component stops inflating the closed cavity.

[0011] As an optional technical solution for the circuit board processing device, the drill hole corresponds to the position of the copper-clad hole of the circuit board.

[0012] As an optional technical solution for the circuit board processing device, the pneumatic component includes an air pipe and an air compressor. The air compressor is connected to the closed cavity through the air pipe to selectively inflate the closed cavity.

[0013] As an optional technical solution for the circuit board processing device, the pneumatic component also includes a solenoid valve, which is arranged in the air pipe and is communicatively connected with the processing component, and the solenoid valve can open or close the air pipe.

[0014] As an optional technical solution for the circuit board processing device, the bearing assembly further includes a pad, which is arranged between the bakelite board and the circuit board to limit the drill from contacting the bakelite board.

[0015] As an optional technical solution for the circuit board processing device, the supporting assembly also includes a positioning pin, which is arranged on the bakelite board. A first positioning hole is arranged on the circuit board, and a second positioning hole is arranged on the pad. The positioning pin can pass through the first positioning hole and the second positioning hole to position the circuit board and the pad.

[0016] As an optional technical solution for the circuit board processing device, at least two of the locating pins, the first locating holes, and the second locating holes are arranged at intervals.

[0017] As an optional technical solution for the circuit board processing device, the processing assembly also includes a main shaft and a driving member, the drill bit is detachably mounted on the main shaft, and the driving member is mounted on the main shaft and drives the drill bit to move.

[0018] As an optional technical solution for the circuit board processing device, the circuit board processing device also includes a dust suction component, which includes a dust suction pipe and a dust collector. The dust collector is connected to the closed cavity through the dust suction pipe to selectively suck out processing residues in the closed cavity.

[0019] On the other hand, a circuit board processing process is provided, which is applied to the above-mentioned circuit board processing device, comprising the following steps:

[0020] S1, placing the circuit board on the bakelite board, and using the pressing member to press the aluminum sheet;

[0021] S2, driving the drill to move in a direction close to the circuit board, and at the same time, the processing component sends a signal to the pneumatic component to start the pneumatic component to inflate air into the closed cavity;

[0022] S3, when the drill bit contacts the aluminum sheet, the processing component sends a signal to the pneumatic component, and the pneumatic component stops inflating air into the closed cavity;

[0023] S4, the drill continues to move in a direction close to the circuit board and processes the aluminum sheet and the circuit board and calculates the processing depth, and retracts the drill when a preset processing depth is reached.

[0024] Beneficial effects of the present invention:

[0025] The present application discloses a circuit board processing device and a circuit board processing process. The circuit board processing device includes a bearing component, a pressing member, a processing component and a pneumatic component. The bearing component includes a bakelite board, which is used to bear the circuit board; the pressing member can press the surface of the aluminum sheet and form a closed cavity with the aluminum sheet, and a drill hole is provided on the pressing member; the processing component includes a drill, which is placed in the drill hole and can move in a direction close to or away from the circuit board and the aluminum sheet; the pneumatic component is connected to the closed cavity and can selectively inflate the closed cavity, and the pneumatic component is connected to the processing component in communication; when the drill is started, the pneumatic component inflates the closed cavity, and when the drill contacts the aluminum sheet, the pneumatic component stops inflating the closed cavity. By inflating the closed cavity, a positive pressure is generated in the closed cavity to prevent the aluminum sheet from warping up, and when the drill contacts the aluminum sheet, the pneumatic component stops inflating the closed cavity, which facilitates the movement of the drill and improves the quality of circuit board processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0027] Figure 1 It is a structural schematic diagram of a circuit board processing device provided by an embodiment of the present invention;

[0028] Figure 2 It is a flow chart of a circuit board processing technology provided by an embodiment of the present invention.

[0029] In the figure:

[0030] 1. Circuit board; 2. Aluminum sheet;

[0031] 10. Load-bearing assembly; 11. Bakelite board; 12. Pad; 13. Positioning pin;

[0032] 20. Pressing piece;

[0033] 30. Processing components; 31. Drill; 32. Spindle;

[0034] 40. Air pressure assembly; 41. Air pipe; 42. Solenoid valve;

[0035] 51. Vacuum hose. DETAILED DESCRIPTION

[0036] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] In actual applications, when processing circuit boards, a dust suction component is usually equipped. When the dust suction component sucks air, negative pressure will be generated in the processing area. Due to the poor rigidity of the aluminum sheet, the aluminum sheet will warp up under the negative pressure state; and when the edge of the pressing part is far away from the hole, the aluminum sheet will be squeezed by the pressing part. The upward warping of the aluminum sheet will cause the drill to contact the aluminum sheet in advance. At this time, the cutter head will start to calculate the processing depth in advance, resulting in a deviation in the processing depth of the circuit board, affecting the processing quality of the circuit board.

[0041] In order to solve the above problems, this embodiment provides a circuit board processing device for processing a circuit board 1, wherein the surface of the circuit board 1 is covered with an aluminum sheet 2. Figure 1 The circuit board processing device includes a carrying component 10, a pressing member 20, a processing component 30 and an air pressure component 40.

[0042] Specifically, the bearing assembly 10 includes a bakelite board 11, and the bakelite board 11 is used to bear the circuit board 1. In this embodiment, the bearing assembly 10 also includes a pad 12, which is arranged between the bakelite board 11 and the circuit board 1 to limit the drill 31 from contacting the bakelite board 11. The pad 12 can be made of wood, plastic, metal or rubber. In this embodiment, the bearing assembly 10 also includes a positioning pin 13, which is arranged on the bakelite board 11, a first positioning hole is arranged on the circuit board 1, and a second positioning hole is arranged on the pad 12. The positioning pin 13 can pass through the first positioning hole and the second positioning hole to position the circuit board 1 and the pad 12. Specifically, at least two positioning pins 13, the first positioning hole and the second positioning hole are arranged at intervals to limit the movement of the circuit board 1. Specifically, the end of the positioning pin 13 can be set as a threaded section, the bakelite board 11 is provided with a threaded hole, and the positioning pin 13 and the bakelite board 11 can be threadedly connected. In other embodiments, the positioning pin 13 and the bakelite board 11 can be glued.

[0043] Furthermore, the pressing piece 20 can press the surface of the aluminum sheet 2 and form a closed cavity together with the aluminum sheet 2, and a drill hole is provided on the pressing piece 20; specifically, the pressing piece 20 has an opening on one side, which can be set as a hemispherical body or a square box body, and one side of the opening is buckled on the aluminum sheet 2.

[0044] Furthermore, the processing assembly 30 includes a drill 31, which is placed in the drill hole and can move in a direction close to or away from the circuit board 1 and the aluminum sheet 2; specifically, the processing assembly 30 also includes a spindle 32 and a driving member (not shown in the figure), the drill 31 is detachably arranged on the spindle 32, and the driving member is arranged on the spindle 32 and drives the drill 31 to move. The drill 31 is detachably arranged, which is convenient for replacing drills 31 of different sizes, thereby improving the versatility of the processing assembly 30. Specifically, the driving member can be a stepping motor, etc., and since the driving member and the drill 31 and other components are very mature technologies in the prior art, they are not described in detail here.

[0045] In this embodiment, taking the removal of electroplated copper in the hole of the circuit board 1 as an example, the drill hole corresponds to the position of the copper-clad hole of the circuit board 1. In other embodiments, it can also be applied to opening holes in the circuit board 1.

[0046] Further, the pneumatic assembly 40 is connected to the closed cavity and can selectively inflate the closed cavity. The pneumatic assembly 40 is connected to the processing assembly 30 for communication; when the drill 31 is started, the pneumatic assembly 40 inflates the closed cavity, and when the drill 31 contacts the aluminum sheet 2, the pneumatic assembly 40 stops inflating the closed cavity. Specifically, the pneumatic assembly 40 includes an air pipe 41 and an air compressor (not shown in the figure), and the air compressor is connected to the closed cavity through the air pipe 41 to selectively inflate the closed cavity. Specifically, a vent is provided on the pressing member 20, and the air pipe 41 is connected to the vent. It should be noted that the air compressor and air compression technology are very mature technologies in the prior art and will not be elaborated in detail here. Specifically, the pneumatic assembly 40 also includes a solenoid valve 42, which is provided on the air pipe 41 and is connected to the processing assembly 30 for communication, and the solenoid valve 42 can open or close the air pipe 41. It should be noted that the solenoid valve 42 is a very mature technology in the prior art and will not be described in detail here. By inflating air into the closed cavity, a positive pressure is generated in the closed cavity to prevent the aluminum sheet 2 from warping up. When the drill 31 contacts the aluminum sheet 2, the air is stopped from being inflated into the closed cavity, which facilitates the movement of the drill 31 and improves the processing quality of the circuit board 1.

[0047] Furthermore, the circuit board processing device also includes a dust suction component, which includes a dust suction pipe 51 and a dust collector. The dust collector is connected to the closed cavity through the dust suction pipe 51 to selectively suck out the processing residues in the closed cavity to prevent the residues (aluminum chips and copper chips) from affecting the drill 31 to identify the processing data and affect the processing accuracy of the circuit board 1.

[0048] See also Figure 2 This embodiment also provides a circuit board processing process, which is applied to a circuit board processing device and includes the following steps:

[0049] S1, placing the circuit board 1 on the bakelite board 11, and using the pressing member 20 to press the aluminum sheet 2;

[0050] S2, driving the drill 31 to move in a direction close to the circuit board 1, and at the same time, the processing component 30 sends a signal to the air pressure component 40 to start the air pressure component 40 to inflate the closed cavity;

[0051] S3, when the drill bit 31 contacts the aluminum sheet 2, the processing assembly 30 sends a signal to the air pressure assembly 40, and the air pressure assembly 40 stops inflating the closed cavity;

[0052] S4, the drill 31 continues to move in the direction close to the circuit board 1 and processes the aluminum sheet 2 and the circuit board 1 and calculates the processing depth, and retracts when reaching the preset processing depth.

[0053] Exemplarily, the pressing member 20 presses the aluminum sheet 2 (the surface of which is 0.090 mm thick paper), the thickness of the aluminum sheet 2 is 0.13 mm, plus the thickness of the paper is 0.22 mm; the spindle 32 drives the drill 31 to drill downward, and at the moment the drill 31 drills downward, the solenoid valve 42 opens, and the high-pressure gas rushes downward to press the aluminum sheet 2 flat on the board surface; the drill 31 first contacts the paper surface of the aluminum sheet 2, and when the drill 31 drills downward again and contacts the aluminum sheet 2, the drill 31 and the aluminum sheet 2 are connected to form a network, and begin to conduct electricity and transmit a signal to the solenoid valve 42, so that the solenoid valve 42 is closed; the processing component 30 records the height of this point and starts to calculate the depth; the drill 31 drills downward according to the program instructions to drill out the electroplated copper in the hole of the circuit board 1; the drill 31 retracts, and the pressing member 20 is lifted up to complete a drilling action.

[0054] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A circuit board processing device, used for processing a circuit board (1), wherein the surface of the circuit board (1) is covered with an aluminum sheet (2), characterized in that: The circuit board processing device comprises: A bearing assembly (10), the bearing assembly (10) comprising a bakelite board (11), the bakelite board (11) being used to bear the circuit board (1); A pressing piece (20), the pressing piece (20) being capable of pressing the surface of the aluminum sheet (2) and forming a closed cavity together with the aluminum sheet (2), and a drill hole being provided on the pressing piece (20); A processing assembly (30), the processing assembly (30) comprising a drill (31), the drill (31) being placed in the drill hole and being able to move in a direction approaching or moving away from the circuit board (1) and the aluminum sheet (2); A pneumatic component (40), the pneumatic component (40) is connected to the closed cavity and can selectively inflate the closed cavity, and the pneumatic component (40) is communicatively connected to the processing component (30); when the drill (31) is started, the pneumatic component (40) inflates the closed cavity, and when the drill (31) contacts the aluminum sheet (2), the pneumatic component (40) stops inflating the closed cavity.

2. The circuit board processing device according to claim 1, characterized in that: The drill hole corresponds to the position of the copper-clad hole of the circuit board (1).

3. The circuit board processing device according to claim 1, characterized in that: The air pressure component (40) comprises an air pipe (41) and an air compressor, and the air compressor is connected to the closed cavity through the air pipe (41) to selectively inflate air into the closed cavity.

4. The circuit board processing device according to claim 3, characterized in that: The pneumatic component (40) further comprises a solenoid valve (42), wherein the solenoid valve (42) is arranged on the air pipe (41) and is communicatively connected with the processing component (30), and the solenoid valve (42) can open or close the air pipe (41).

5. The circuit board processing device according to claim 1, characterized in that: The bearing assembly (10) further comprises a pad (12), wherein the pad (12) is arranged between the bakelite board (11) and the circuit board (1) to limit the drill bit (31) from contacting the bakelite board (11).

6. The circuit board processing device according to claim 5, characterized in that: The bearing assembly (10) further comprises a positioning pin (13), wherein the positioning pin (13) is arranged on the bakelite board (11), the circuit board (1) is provided with a first positioning hole, and the pad (12) is provided with a second positioning hole, and the positioning pin (13) can pass through the first positioning hole and the second positioning hole to position the circuit board (1) and the pad (12).

7. The circuit board processing device according to claim 6, characterized in that: At least two of the positioning pins (13), the first positioning holes and the second positioning holes are arranged at intervals.

8. The circuit board processing device according to claim 1, characterized in that: The processing assembly (30) further comprises a main shaft (32) and a driving member, the drill (31) is detachably arranged on the main shaft (32), and the driving member is arranged on the main shaft (32) and drives the drill (31) to move.

9. The circuit board processing device according to any one of claims 1 to 8, characterized in that: The circuit board processing device also includes a dust suction component, which includes a dust suction pipe (51) and a dust suction machine. The dust suction machine is connected to the closed cavity through the dust suction pipe (51) to selectively suck out processing residues in the closed cavity.

10. A circuit board processing technology, applied to the circuit board processing device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, placing the circuit board (1) on the bakelite board (11), and using the pressing member (20) to press the aluminum sheet (2); S2, driving the drill (31) to move in a direction close to the circuit board (1), and at the same time, the processing component (30) sends a signal to the pneumatic component (40) to start the pneumatic component (40) to inflate air into the closed cavity; S3, when the drill bit (31) contacts the aluminum sheet (2), the processing component (30) sends a signal to the air pressure component (40), and the air pressure component (40) stops inflating air into the closed cavity; S4, the drill (31) continues to move in a direction close to the circuit board (1) and processes the aluminum sheet (2) and the circuit board (1) and calculates the processing depth, and retracts when a preset processing depth is reached.

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