Circuit board via hole processing equipment

Abstract

The invention discloses circuit board via hole processing equipment, which comprises a grinding assembly, a processing assembly, a positioning assembly and a position adjusting assembly, and is characterized in that the grinding assembly comprises a processing bottom plate, a grinding part arranged on the processing bottom plate, a positioning part arranged on the grinding part and a position adjusting part arranged on the positioning part; the machining assembly comprises a drilling positioning plate arranged on the positioning component, a driving component arranged on the drilling positioning plate and a plurality of drilling needle heads arranged on the driving component, and the drilling needle heads are arranged at equal intervals; according to the circuit board punching device, the structure is simple, punching and position movement of the circuit board are set in a unified mode, and during punching, an operator can adjust the distance between the multiple punching blocks so as to control different punching gaps.

Description

Technical Field

[0001] This invention relates to the technical field of integrated circuit manufacturing, and more particularly to a circuit board via processing equipment. Background Technology

[0002] Thick copper circuit boards are generally used to carry large currents to power related equipment. In their current-carrying circuit design, the use of through holes as current conversion crimping holes and heat dissipation holes is the most common design.

[0003] To allow vias to carry high currents, the copper thickness of the vias needs to be increased to over 40µm (typically 18-20µm). Furthermore, to allow different vias to carry different high currents and to save board space, different copper thickness requirements need to be designed on the same circuit board. For example, most vias have a copper thickness of 18-20µm, low-current-carrying heat dissipation vias have a copper thickness of 30-50µm, and high-current-carrying heat dissipation vias have a copper thickness of 60-80µm. Circuit boards with various vias and different copper thicknesses for different vias can be called multi-level copper-copper-differentiated circuit boards. Moreover, different hole diameters or relative positions between holes on the same circuit board also differ, requiring flexible adjustments during manufacturing. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the above-mentioned circuit board through-hole processing equipment, the present invention is proposed.

[0006] Therefore, the purpose of this invention is to provide a circuit board via processing equipment.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a circuit board through-hole processing equipment, comprising: a grinding assembly, including a processing base plate, a grinding component disposed on the processing base plate, a positioning component disposed on the grinding component, and a position adjustment component disposed on the positioning component; and a processing assembly, including a drilling positioning plate disposed on the positioning component, a driving component disposed on the drilling positioning plate, and a drilling needle disposed on the driving component, wherein a plurality of drilling needles are disposed and are equidistantly arranged; and a feeding assembly, wherein the feeding assembly is connected to the grinding component.

[0008] In a preferred embodiment of the circuit board through-hole processing equipment of the present invention, the grinding component includes a first grinding plate disposed on a feeding assembly, a plurality of grinding heads disposed on the first grinding plate, and a second grinding plate disposed at the rear end of the first grinding plate. The grinding heads are hinged to the first grinding plate, and the lower end of the grinding head is provided with a grinding plate. A driving cylinder is provided on the first grinding plate, and a connecting rod is provided between the plurality of grinding heads. The driving cylinder is sleeved with the connecting rod, and the rear end of the driving cylinder is hinged to the first grinding plate.

[0009] As a preferred embodiment of the circuit board through-hole processing equipment of the present invention, the positioning component includes a support frame connected to one end of the feeding component, a drilling block movably disposed on the support frame, and a drilling component disposed on the drilling block. A plurality of drilling components are provided, and the distance between each drilling component is adjustable. The drilling needle is disposed on the drilling component.

[0010] As a preferred embodiment of the circuit board through-hole processing equipment of the present invention, the drilling component includes a drilling arm rotatably connected to the drilling block and a drilling cutter head disposed at the lower end of the drilling arm. The drilling block is provided with a drilling motor for controlling the rotation of the drilling arm. A movable block is disposed at the upper end of the drilling arm, and a moving component is disposed between the movable blocks.

[0011] As a preferred embodiment of the circuit board through-hole processing equipment of the present invention, the position adjustment component includes a movable plate disposed on a support frame, a guide block disposed on the support frame, a movable block slidably connected to the guide block, a lifting block disposed within the movable block, a rotating rod rotatably connected to the lifting block, and an elastic sheet disposed within the movable block and the lifting block. The lower end of the rotating rod is rotatably connected to the movable block. The upper end of the lifting block is provided with a retaining strip, and the lower surface of the movable plate is provided with a plurality of guide strips.

[0012] As a preferred embodiment of the circuit board through-hole processing equipment of the present invention, the driving component includes a plurality of guide wheels disposed on the guide block and a driving rope wound between the plurality of guide wheels. The plurality of guide wheels are respectively disposed at the four corners of the guide block, and a driving electrode is provided on one of the guide wheels. One section of the driving rope is connected to the drilling block, and the lower end of the driving rope is connected to the moving block.

[0013] As a preferred embodiment of the circuit board through-hole processing equipment of the present invention, the moving part includes a groove formed on the punching block, a slide bar set on the punching block, and a round block set on the slide bar that cooperates with the groove. Each punching block has a through hole for the drive rope to pass through. A first semi-circular clamping plate is provided on the through hole. A second semi-circular clamping plate is hinged to the first semi-circular clamping plate. A locking buckle is provided on the second semi-circular clamping plate. After the second semi-circular clamping plate rotates, it is locked to the first semi-circular clamping plate by the locking buckle.

[0014] As a preferred embodiment of the circuit board through-hole processing equipment of the present invention, wherein: the upper end of the drilling needle is rotatably connected to the drilling block, and the drilling block is provided with a baffle that abuts against the upper end of the drilling needle.

[0015] The beneficial effects of this invention are as follows: When drilling, the operator places the circuit board on the holding slot and starts the drive motor, which drives the guide wheel to rotate forward. The forward rotation of the guide wheel will drive the drive rope to move forward. At this time, the motor starts and drives the drilling arm to swing down, so that the drilling needle on the drilling head drills holes in the circuit board. As the drive rope moves, the drive rope drives the drilling block to move, and the drilling head drills holes in the circuit board. At the same time, the drive rope also drives the moving block to move. The direction of movement of the moving block is opposite to the direction of movement of the drilling block. The locking bar on the moving block is obstructed by the inclined guide bar. The guide bar will "press down" the locking bar, thereby driving the lifting block to move downward. The downward movement of the lifting block is restricted by the rotating rod and simultaneously presses down the elastic plate. When the moving block drives the locking bar to move past the range of the guide bar, the elastic plate will lift the lifting block upward again, thus completing one round of drilling.

[0016] Then, the drive motor reverses, causing the guide wheel to reverse as well, which pulls the punch block in the opposite direction and makes the moving block move forward. When the moving block moves forward, the locking strip gets into the position between the two guide bars. Because the guide bars are inclined, the continuous movement of the locking strip will cause the moving plate to slide forward. When the locking strip is completely moved out of the range of the guide bars, the punch head also moves to the edge of the moving plate, so that it can be prepared for the next punch.

[0017] Furthermore, during the drilling process, the operator can adjust the spacing between several drilling blocks to control different drilling gaps. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the circuit board through-hole processing equipment of the present invention.

[0019] Figure 2 This is a side view of the overall structure of the circuit board through-hole processing equipment of the present invention.

[0020] Figure 3 This is a schematic diagram of the grinding component in the circuit board through-hole processing equipment of the present invention.

[0021] Figure 4 This is a schematic diagram of the punching component described in the circuit board through-hole processing equipment of the present invention.

[0022] Figure 5 This is a schematic diagram of the driving component of the circuit board through-hole processing equipment of the present invention.

[0023] Figure 6 This is a schematic diagram of the position adjustment component described in the circuit board through-hole processing equipment of the present invention.

[0024] Figure 7 This is a schematic diagram of the guide post in the circuit board through-hole processing equipment of the present invention.

[0025] Figure 8 This is a schematic diagram of the moving part described in the circuit board through-hole processing equipment of the present invention.

[0026] In the diagram, 100 is the grinding assembly; 101 is the machining base plate; 102 is the grinding component; 103 is the positioning component; 104 is the position adjustment component; 200 is the machining assembly; 201 is the drilling positioning plate; 202 is the drilling needle; 102a is the first grinding plate; 102b is the grinding head; 102c is the second grinding plate; 102d is the grinding plate; 102e is the drive cylinder; 102f is the connecting rod; 103a is the support frame; 103b is the drilling block; 300 is the drilling component; 301 is the drilling arm; 302 is the drilling cutter head; 104a... 104b, guide block; 104c, moving block; 104d, lifting block; 104e, rotating rod; 104f, elastic sheet; 304, locking strip; 305, guide strip; 400, driving component; 401, guide wheel; 402, driving rope; 403, moving part; 403a, chute; 403b, sliding strip; 403c, round block; 403d, through hole; 406, first semi-circular clamping plate; 407, second semi-circular clamping plate; 105, feeding assembly; 203, guide column; 204, guide rod; 205, frame plate. Detailed Implementation

[0027] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0030] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0031] Example 1

[0032] Reference Figure 1-8The present invention discloses a circuit board through hole processing equipment, including a grinding assembly 100. In this embodiment, the grinding assembly 100 includes a processing base plate 101, a grinding component 102 disposed on the processing base plate 101, a positioning component 103 disposed on the grinding component 102, and a position adjustment component 104 disposed on the positioning component 103. The processing base plate 101 is an integral drilling processing structure.

[0033] Furthermore, it also includes a processing component 200. In this embodiment, the processing component 200 includes a drilling positioning plate 201 disposed on the positioning component 103, a driving component 400 disposed on the drilling positioning plate 201, and a drilling needle 202 disposed on the driving component 400. A plurality of drilling needles 202 are provided and are equidistantly arranged. Furthermore, the present invention also includes a feeding assembly 105, which is connected to the grinding component 102. In this embodiment, the feeding assembly 105 includes a plurality of conveyor belts disposed on the processing base plate 101, which are used to transport the circuit board to be processed.

[0034] Furthermore, in this embodiment, the grinding component 102 includes a first grinding plate 102a disposed on the feeding assembly 105, a plurality of grinding heads 102b disposed on the first grinding plate 102a, and a second grinding plate 102c disposed on the first grinding plate 102a. The first grinding plate 102a and the second grinding plate 102c are hinged to each other. Grinding heads 102b are also disposed on the second grinding plate 102c. The first grinding plate 102a is hinged to the feeding assembly 105. An electric cylinder is disposed on the feeding assembly 105, and the end of the electric cylinder is hinged to the end of the second grinding plate 102c.

[0035] The positioning component 103 includes a support frame 103a connected to one end of the feeding component 105, a punch block 103b movably disposed on the support frame 103a, and a punching component 300 disposed on the punch block 103b. A plurality of punching components 300 are provided, and the distance between each punching component 300 is adjustable. A drilling needle 202 is disposed on the punching component 300.

[0036] The present invention also includes a moving component. In this embodiment, the moving component includes a moving plate 104a disposed on a support frame 103a, a drilling positioning plate 201 disposed on the upper end of the moving plate 104a, and the drilling positioning plate 201 and the moving plate 104a are detachably connected. A guide block 104b, a moving clip disposed in the guide block 104b for driving the moving plate 104a to move, and a positioning member disposed on the guide block 104b are also provided on the support frame 103a. The moving plate 104a is disposed along the length direction of the support frame 103a, and a transverse guide rod 204 is provided on the support frame 103a. The transverse guide rod 204 is connected to the lower end of the moving plate 104a and guides the movement of the moving plate 104a.

[0037] Furthermore, the present invention also includes a drive component disposed on the guide block 104b.

[0038] Preferably, the punching component 300 includes a punching arm 301 rotatably connected to the punching block 103b and a punching head 302 disposed at the lower end of the punching arm 301. A punching motor for controlling the rotation of the punching arm 301 is provided on the punching block 103b.

[0039] Furthermore, the guide block 104b is inclinedly disposed on the support frame 103a. In this embodiment, the movable clamp includes a movable block 104c slidably connected to the guide block 104b, a lifting block 104d disposed in the movable block 104c, a rotating rod 104e rotatably connected to the lifting block 104d, and an elastic sheet 104f disposed in the movable block 104c and the lifting block 104d. The lower end of the rotating rod 104e is rotatably connected to the movable block 104c. A clamping strip 304 is provided at the upper end of the lifting block 104d, and a plurality of guide strips 305 are provided on the lower surface of the movable plate 104a.

[0040] Preferably, the guide strips 305 are equidistantly arranged at the lower end of the moving plate 104a, and the guide strips 305 are inclined, with the inclination angle of the guide strips 305 being 90° from the inclination angle of the guide block 104b.

[0041] Furthermore, the elastic sheet 104f is symmetrically arranged at both ends inside the lifting block 104d. One end of the elastic sheet 104f is fixed to the moving block 104c, and the other end is bent and abuts against the lower surface of the lifting block 104d.

[0042] In this embodiment, the driving assembly includes a plurality of guide wheels 401 disposed on the guide block 104b and a driving rope 402 wound between the plurality of guide wheels 401, such that the driving rope 402 is wound around the rectangle of the guide block 104b. The plurality of guide wheels 401 are respectively disposed at the four corners of the guide block 104b. A driving electrode is provided on one of the guide wheels 401. One section of the driving rope 402 is connected to the punch block 103b, and the lower end of the driving rope 402 is connected to the moving block 104c.

[0043] Furthermore, a support plate 205 is provided at both ends of the guide block 104b, and the guide wheel 401 is rotatably connected to the support plate 205. The support plate 205 and the guide block 104b are connected by bolts.

[0044] Preferably, a guide post 203, a guide rod 204 slidably connected in the guide post 203, and an elastic element disposed between the guide rod 204 and the guide post 203 are provided on the side wall of the guide block 104b. In this embodiment, the elastic element is a spring, one end of which is connected to the inner wall of the guide post 203 and the other end is connected to the outer side of the guide rod 204. A rounded corner is provided at the upper end of the guide rod 204.

[0045] Furthermore, in this embodiment, the moving part 403 includes a groove 403a formed on the punched block 103b, a slide bar 403b provided on the punched block 103b, and a round block 403c provided on the slide bar 403b that cooperates with the groove 403a. Each punched block 103b has a through hole 403d for the drive rope 402 to pass through. A first semi-circular clamping plate 406 is provided on the through hole 403d. A second semi-circular clamping plate 407 is hinged to the first semi-circular clamping plate 406. A locking buckle is provided on the second semi-circular clamping plate 407. After the second semi-circular clamping plate 407 rotates, it is locked with the first semi-circular clamping plate 406 by the locking buckle.

[0046] Furthermore, the upper end of the drilling needle 202 is rotatably connected to the drilling block 103b, and a baffle plate is provided on the drilling block 103b to abut against the upper end of the drilling needle 202.

[0047] Operation process: During drilling, the operator places the circuit board on the holding slot and starts the drive motor, causing the guide wheel 401 to rotate clockwise. The clockwise rotation of the guide wheel 401 causes the drive rope 402 to move clockwise. At this time, the motor starts, driving the drilling arm 301 to swing downward, causing the drilling needle 202 on the drilling head 302 to drill holes in the circuit board. As the drive rope 402 moves, it also moves the drilling block 103b, thus drilling holes in the circuit board. Simultaneously, the drive rope 402 also moves the moving block 104c. The moving block 104c moves in the opposite direction to the drilling block 103b. The locking strip 304 on the moving block 104c is obstructed by the inclined guide strip 305. The guide strip 305 will "press down" the locking strip 304, thereby driving the lifting block 104d to move downward. The downward movement of the lifting block 104d is restricted by the rotating rod 104e, which simultaneously presses down the elastic piece 104f. After the moving block 104c drives the locking strip 304 to move past the range of the guide strip 305, the elastic piece 104f will push the lifting block 104d upward again, thus completing one round of drilling.

[0048] Then, the drive motor reverses, causing the guide wheel 401 to reverse, thereby pulling the drilling block 103b in the opposite direction and causing the moving block 104c to move forward. When the moving block 104c moves forward, the locking strip 304 is precisely engaged between the two guide strips 305. Because the guide strips 305 are inclined, the continuous movement of the locking strip 304 will cause the moving plate 104a to slide forward. When the locking strip 304 is completely moved out of the range of the guide strips 305, the drilling head 302 also moves to the edge of the moving plate 104a, so that it can be prepared for the next drilling.

[0049] Furthermore, during the drilling process, the operator can adjust the spacing between several drilling blocks 103b to control different drilling gaps.

[0050] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0051] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0052] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0053] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A circuit board via hole processing device, characterized in that: include, A grinding assembly (100) comprises a processing base plate (101), a grinding component (102) arranged on the processing base plate (101), a positioning component (103) arranged on the grinding component (102), and a position adjustment component (104) arranged on the positioning component (103); and, A processing assembly (200) comprises a drilling positioning plate (201) arranged on a positioning component (103), a driving component (400) arranged on the drilling positioning plate (201), and a drilling needle (202) arranged on the driving component (400), wherein a plurality of drilling needles (202) are arranged at equal intervals; A loading assembly (105), wherein the loading assembly (105) is connected to the grinding component (102).

2. The circuit board via hole processing equipment according to claim 1, characterized in that: The grinding component (102) comprises a first grinding plate (102a) arranged on a feeding assembly (105), a plurality of grinding heads (102b) arranged on the first grinding plate (102a), and a second grinding plate (102c) arranged at the rear end of the first grinding plate (102a); the grinding head (102b) is hinged on the first grinding plate (102a); a grinding plate (102d) is provided at the lower end of the grinding head (102b); a driving cylinder (102e) is provided on the first grinding plate (102a); connecting rods (102f) are provided between the plurality of grinding heads (102b); the driving cylinder (102e) is sleeved with the connecting rod (102f); and the rear end of the driving cylinder (102e) is hinged to the first grinding plate (102a).

3. The circuit board via hole processing equipment according to claim 1 or 2, characterized in that: The positioning component (103) comprises a support frame (103a) connected to one end of the loading component (105), a punching block (103b) movably arranged on the support frame (103a), and a punching piece (300) arranged on the punching block (103b), wherein a plurality of punching pieces (300) are arranged, and the mutual distance between each punching piece (300) is adjustable, and the drilling needle (202) is arranged on the punching piece (300).

4. The circuit board via hole processing equipment according to claim 3, characterized in that: The punching member (300) comprises a punching arm (301) rotatably connected to a punching block (103b) and a punching cutter head (302) arranged at the lower end of the punching arm (301); the punching block (103b) is provided with a punching motor for controlling the rotation of the punching arm (301); a moving block (104c) is provided at the upper end of the punching arm (301); and a moving member (403) is provided between the moving blocks (104c).

5. The circuit board via hole processing equipment according to claim 1, characterized in that: The position adjustment member (104) comprises a movable plate (104a) arranged on a support frame (103a), a guide block (104b) arranged on the support frame (103a), a movable block (104c) slidably connected to the guide block (104b), a lifting block (104d) arranged in the movable block (104c), a rotating rod (104e) rotatably connected to the lifting block (104d), and an elastic sheet (104f) arranged in the movable block (104c) and the lifting block (104d); the lower end of the rotating rod (104e) is rotatably connected to the movable block (104c), the upper end of the lifting block (104d) is provided with a clamping strip (304), and the lower surface of the movable plate (104a) is provided with a plurality of guide strips (305).

6. The circuit board via hole processing equipment according to claim 1, characterized in that: The driving component (400) comprises a plurality of guide wheels (401) arranged on the guide block (104b) and a driving rope (402) wound between the plurality of guide wheels (401), the plurality of guide wheels (401) being respectively arranged at four end corners of the guide block (104b), one of the guide wheels (401) being provided with a driving electrode, one section of the driving rope (402) being connected to the punching block (103b), and a section of the driving rope (402) being located at the lower end of the guide block (104b) being connected to the moving block (104c).

7. The circuit board via hole processing equipment according to claim 4, characterized in that: The movable member (403) comprises a slide groove (403a) provided on the punching block (103b), a slide bar (403b) arranged on the punching block (103b), and a round block (403c) arranged on the slide bar (403b) and cooperating with the slide groove (403a). Each of the punching blocks (103b) is provided with a through hole (403d) for the driving rope (402) to pass through. A first semicircular clamping plate (406) is provided on the through hole (403d). A second semicircular clamping plate (407) is hingedly connected to the first semicircular clamping plate (406). A locking buckle is provided on the second semicircular clamping plate (407). After the second semicircular clamping plate (407) is rotated, it is locked with the first semicircular clamping plate (406) by using the locking buckle.

8. The circuit board via hole processing equipment according to claim 1, characterized in that: The upper end of the drilling needle (202) is rotatably connected to the punching block (103b), and the punching block (103b) is provided with a blocking piece that abuts against the upper end of the drilling needle (202).

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