LED lamp bead and packaging method and packaging system thereof

Abstract

The invention discloses an LED lamp bead and a packaging method and a packaging system thereof, and relates to the field of semiconductor photoelectric devices. The packaging method comprises the following steps: (1) fixing an LED chip in a bowl cup of a packaging bracket; (2) injecting a packaging adhesive into the bowl cup, and primarily curing to form a first packaging adhesive layer; (3) forming a first fluorescent layer; (4) injecting a packaging adhesive, and primarily curing to form a second packaging adhesive layer; (5) forming a second fluorescent layer; (6) injecting a packaging adhesive, and primarily curing to form a third packaging adhesive layer; (7) secondary curing; the first packaging adhesive layer and the second packaging adhesive layer are made of non-flow type bonding materials. The first fluorescent layer is composed of a plurality of first fluorescent powder particles, the second fluorescent layer is composed of a plurality of second fluorescent powder particles, and light colors generated by excitation of the first fluorescent powder particles and the second fluorescent powder particles are the same or different; wherein the temperature of primary curing is less than or equal to 95 DEG C, and the temperature of secondary curing is more than or equal to 120 DEG C. According to the invention, the color coordinate concentration ratio of the LED lamp beads can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic devices, and in particular to an LED lamp bead and a packaging method and a packaging system thereof. Background Art

[0002] Conventional LED lamp beads are composed of light-emitting chips, brackets and fluorescent glue (encapsulation glue + red powder + green powder). The encapsulation method is: (1) first mix the red powder, green powder and encapsulation glue together and dispense the glue, and the fluorescent powder particles are staggered in the bracket; (2) use the glue dispensing head to dispense glue on the bowls and cups of the entire bracket one by one; (3) high temperature curing. The defects of this packaging method are: after the encapsulation glue is dispensed, the fluorescent powder particles naturally settle and are unevenly distributed; usually the amount of green powder is large and the amount of red powder is small, and the distribution uniformity of the red powder is even worse; ultimately resulting in low concentration of mass-produced LEDs (i.e., the coordinates of the LEDs are discrete and the yield is low). Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an LED lamp bead and a packaging method thereof, which can improve the color coordinate concentration of the LED lamp bead.

[0004] Another technical problem to be solved by the present invention is to provide a packaging system for LED lamp beads, which can improve the color coordinate concentration of the LED lamp beads.

[0005] In order to solve the above problems, the present invention discloses a packaging method for LED lamp beads, which comprises:

[0006] (1) Fixing the LED chip in the bowl of the packaging bracket to obtain a first intermediate;

[0007] (2) injecting packaging glue into the bowl cup and initially curing it to form a first packaging glue layer, wherein the first packaging glue layer is a non-flowable adhesive material;

[0008] (3) forming a first fluorescent layer on the first packaging glue layer;

[0009] (4) injecting packaging glue onto the first fluorescent layer and preliminarily curing it to form a second packaging glue layer; the second packaging glue layer is a non-flowable adhesive material;

[0010] (5) forming a second fluorescent layer on the second encapsulation adhesive layer;

[0011] (6) injecting encapsulation glue onto the second fluorescent layer and preliminarily curing it to form a third encapsulation glue layer to obtain a second intermediate;

[0012] (7) secondary curing the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer in the second intermediate to obtain an encapsulation adhesive layer;

[0013] The first fluorescent layer is composed of a plurality of first fluorescent powder particles, and the second fluorescent layer is composed of a plurality of second fluorescent powder particles. The light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are the same or different;

[0014] Among them, the temperature of primary curing is ≤95°C, and the temperature of secondary curing is ≥120°C.

[0015] As an improvement of the above technical solution, step (6) includes:

[0016] (6.1) Periodically repeat steps (2) to (5);

[0017] (6.2) injecting encapsulation glue onto the topmost second fluorescent layer, and preliminarily curing it to form a third encapsulation glue layer to obtain a second intermediate;

[0018] The first phosphor particles and the second phosphor particles are excited to generate light of different colors.

[0019] As an improvement of the above technical solution, step (6) includes:

[0020] (6.1) Periodically repeating steps (2) to (3);

[0021] (6.2) Repeat steps (4) to (5) periodically.

[0022] (6.3) injecting encapsulation glue onto the top second fluorescent layer, and preliminarily curing it to form a third encapsulation glue layer to obtain a second intermediate;

[0023] The first phosphor particles and the second phosphor particles are excited to generate light of different colors.

[0024] As an improvement of the above technical solution, the second intermediate includes 4 to 5 first packaging adhesive layers and 4 to 5 second packaging adhesive layers;

[0025] The thickness of the first encapsulation adhesive layer is 20 to 50 μm, the thickness of the second encapsulation adhesive layer is 20 to 50 μm, and the thickness of the third encapsulation adhesive layer is 20 to 50 μm;

[0026] The particle size of the first phosphor particles is 1 to 25 μm, and the particle size of the second phosphor particles is 1 to 25 μm;

[0027] The thickness of the packaging glue layer is 400-600 μm.

[0028] As an improvement of the above technical solution, the LED chip is a blue LED chip, the first phosphor particles are red phosphor particles, and the second phosphor particles are green phosphor particles;

[0029] The temperature of the preliminary curing is 80-90°C and the duration is 10s-5min;

[0030] The secondary curing is performed at a temperature of 140 to 160° C. and for a duration of 2 to 5 hours.

[0031] Correspondingly, the present invention also discloses an LED lamp bead, which is obtained by packaging an LED chip through the above-mentioned LED lamp bead packaging method.

[0032] Correspondingly, the present invention also discloses a packaging system for LED lamp beads, which includes:

[0033] A die-bonding unit, used to fix the LED chip into the bowl of the packaging bracket to obtain a first intermediate;

[0034] A glue injection unit, used for injecting packaging glue into the bowl;

[0035] A preliminary curing unit is used to preliminarily cure the encapsulation glue injected by the glue injection unit to form a first encapsulation glue layer, a second encapsulation glue layer and a third encapsulation glue layer respectively, wherein the first encapsulation glue layer and the second encapsulation glue layer are non-flowable adhesive materials; the temperature of the preliminary curing is ≤95°C;

[0036] A fluorescent unit, comprising a first fluorescent unit for forming a first fluorescent layer on a first encapsulating glue layer and a second fluorescent unit for forming a second fluorescent layer on a second encapsulating glue layer; the first fluorescent layer is composed of a plurality of first fluorescent powder particles, the second fluorescent layer is composed of a plurality of second fluorescent powder particles, and the light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are the same or different;

[0037] The curing unit is used for secondary curing the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer to form an encapsulation adhesive layer in the bowl; wherein the secondary curing temperature is ≥120°C.

[0038] As an improvement of the above technical solution, it also includes:

[0039] A blocking unit, wherein the blocking unit is provided with a through hole corresponding to the bowl cup, so that the packaging glue can enter the bowl cup through the through hole;

[0040] The flipping unit is used to flip the first intermediate body provided with the first encapsulation adhesive layer and / or the second encapsulation adhesive layer to adhere the first phosphor particles to the first encapsulation adhesive layer, or to adhere the second phosphor particles to the second encapsulation adhesive layer.

[0041] As an improvement of the above technical solution, the first fluorescent unit is a box structure with air holes at the bottom, and the first intermediate body with the first packaging glue layer is detachably fixed on the top of the first fluorescent unit, and the airflow through the air holes carries the first fluorescent powder particles to the surface of the first packaging glue layer, and is bonded to form the first fluorescent layer;

[0042] The second fluorescent unit is a box structure with air holes at the bottom. The first intermediate body with a second packaging glue layer can be detachably fixed on the top of the second fluorescent unit. The airflow through the air holes carries the second phosphor particles to the surface of the second packaging glue layer and bonds them to form a second fluorescent layer.

[0043] As an improvement of the above technical solution, the glue injection unit is a box structure provided with a plurality of glue spray guns;

[0044] The first fluorescent unit and the second fluorescent unit are arranged on both sides of the glue injection unit, and a flip unit is arranged between the first fluorescent unit and the glue injection unit, and a flip unit is arranged between the second fluorescent unit and the glue injection unit.

[0045] The implementation of the present invention has the following beneficial effects:

[0046] The packaging method of the LED lamp beads in this embodiment forms a first packaging glue layer / a second packaging glue layer by preliminary curing, which is a non-flowable adhesive material, and then the first phosphor particles / the second phosphor particles are bonded thereon to form a first fluorescent layer / a second fluorescent layer. Finally, a secondary curing is performed to form a packaging glue layer. Based on this packaging method, the phosphor particles are effectively prevented from settling in the packaging glue by preliminary curing + bonding the phosphor particles, and the distribution uniformity of the first phosphor particles / the second phosphor particles is optimized, thereby improving the color coordinate concentration and the light color uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a flow chart of a method for packaging LED lamp beads in one embodiment of the present invention;

[0048] Figure 2 It is a schematic diagram of the structure of a packaging bracket and an LED chip in one embodiment of the present invention;

[0049] Figure 3 It is a structural schematic diagram of a glue injection unit and a first intermediate body in one embodiment of the present invention;

[0050] Figure 4 A schematic diagram of the structure of the fluorescent unit and the first intermediate in one embodiment of the present invention;

[0051] Figure 5 This is a schematic diagram of the structure of an LED lamp bead in another embodiment of the present invention;

[0052] Figure 6 This is a schematic diagram of the structure of an LED lamp bead in another embodiment of the present invention;

[0053] Figure 7 is a schematic diagram of the composition of an LED packaging system in one embodiment of the present invention;

[0054] In the figure, 1 is a solid crystal unit, 2 is a glue injection unit, 3 is a preliminary curing unit, 4 is a fluorescent unit, 41 is a first fluorescent unit, 42 is a second fluorescent unit, 43 is an air hole, 5 is a curing unit, 6 is a blocking unit, 61 is a through hole, 7 is a flip unit, 81 is an LED chip, 82 is a first packaging glue layer, 83 is a first fluorescent layer, 84 is a second packaging glue layer, 85 is a second fluorescent layer, 86 is a third packaging glue layer, 87 is a packaging bracket, 871 is a substrate, 872 is a plastic bracket, and 873 is a bowl. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0056] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0057] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0058] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0060] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself. In addition, the various specific processes and examples of materials provided in the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use scenarios of other materials.

[0061] See also Figure 1 An embodiment of the present invention provides a method for packaging an LED lamp bead, which comprises the following steps:

[0062] S1: Fixing the LED chip in the bowl of the packaging bracket to obtain a first intermediate;

[0063] S2: injecting encapsulation glue into the bowl and initially curing it to form a first encapsulation glue layer;

[0064] S3: forming a first fluorescent layer on the first packaging glue layer;

[0065] S4: injecting packaging glue onto the first fluorescent layer and preliminarily curing it to form a second packaging glue layer;

[0066] S5: forming a second fluorescent layer on the second encapsulation glue layer;

[0067] S6: injecting encapsulation glue onto the second fluorescent layer, and preliminarily curing it to form a third encapsulation glue layer, thereby obtaining a second intermediate;

[0068] S7: secondary curing the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer in the second intermediate to obtain an encapsulation adhesive layer;

[0069] Among them, the first encapsulation adhesive layer 82 and the second encapsulation adhesive layer 84 are both non-flowable adhesive materials, that is, they are in a non-flowable state at the working temperature (15-80°C), but maintain a certain adhesive force, and can bond powder particles (such as phosphor particles, etc.). The first fluorescent layer 83 is composed of a plurality of first phosphor particles, and the second fluorescent layer 85 is composed of a plurality of second phosphor particles. The light colors generated by the excitation of the first phosphor particles and the second phosphor particles are the same or different. The temperature of the initial curing is ≤95°C, and the temperature of the secondary curing is ≥120°C.

[0070] The packaging method of the LED lamp beads in this embodiment forms a first packaging glue layer 82 / a second packaging glue layer 84 through preliminary curing, which is a non-flowable adhesive material, and then the first phosphor particles / the second phosphor particles are bonded thereon to form a first fluorescent layer / a second fluorescent layer. Finally, a secondary curing is performed to form a packaging glue layer. Based on this packaging method, the phosphor particles are effectively prevented from settling in the packaging glue by preliminary curing + bonding the phosphor particles, and the distribution uniformity of the first phosphor particles / the second phosphor particles is optimized, thereby improving the color coordinate concentration and the light color uniformity. Specifically, based on this embodiment, the color coordinate concentration (3rd order) of traditional white light LED lamp beads can be increased from 82-85% to 86-92%.

[0071] Specifically, the first phosphor particles and the second phosphor particles are phosphors that can be excited to produce monochromatic light, such as red phosphor, green phosphor or yellow-green phosphor; the first phosphor particles and the second phosphor particles can also be a mixture of at least two phosphors, for example, a mixture of red phosphor and green phosphor, but not limited thereto. Preferably, in some embodiments, the first phosphor particles are red phosphors that can be excited to produce red light, and the second phosphor particles are green phosphors that can be excited to produce green light. By setting the first fluorescent layer 83 containing red phosphor at the bottom of the bowl 873 and setting the second fluorescent layer 85 containing green phosphor above the first fluorescent layer 83, the absorption of green light by the red phosphor can be reduced, thereby improving the brightness of the LED lamp beads.

[0072] Specifically, the particle size of the first phosphor particles and the second phosphor particles is 0.5 to 50 μm, preferably 1 to 25 μm, and more preferably 10 to 30 μm. By controlling the particle size of the first phosphor particles and the second phosphor particles, the number of layers of the first phosphor layer 83 and the second phosphor layer 85, and the thickness of the first encapsulation glue layer 82 and the second encapsulation glue layer 84, the color temperature and color rendering index of the LED lamp beads can be well controlled.

[0073] Specifically, in some embodiments, the package bracket 87 may be a common SMD bracket in the art, which may be a frame structure composed of a metal substrate 871 (such as Cu, Al, Cu / W, Cu / Mo, etc.) and a resin (such as PPA, epoxy resin, PBT, etc.), but is not limited thereto. Preferably, in some embodiments, see Figure 2 The packaging support 87 includes a substrate 871 and a plastic support 872, and a bowl 873 is provided on the top of the plastic support 872. The packaging support 87 of this structure is convenient for forming the first packaging glue layer 82 and the second packaging glue layer 84 in steps at a later stage.

[0074] Specifically, the packaging method in this embodiment can be applied to the packaging of various types of LED chips 81. For example, from the perspective of packaging structure, it can be applied to flip-chip LED chips or face-mount LED chips; from the perspective of luminous light color, it can be applied to the packaging of blue LED chips, green LED chips, red LED chips, yellow LED chips, and purple LED chips, but is not limited thereto. Preferably, in some embodiments, the LED chip 81 is a blue LED chip.

[0075] Specifically, in step S1, the LED chip 81 can be fixed in the bowl 873 of the packaging bracket 87 by gluing, welding, etc., but not limited thereto. Preferably, in some embodiments, the LED chip 81 is first bonded to the bottom of the bowl 873 by insulating glue, and then the electrodes of the LED chip 81 are electrically connected to the substrate 871 by wires.

[0076] Specifically, in some embodiments, the packaging glue is epoxy resin or silicone resin, but is not limited thereto.

[0077] Specifically, in step S2, the encapsulation glue can be dispensed into the bowl 873 by a conventional dispensing device, but is not limited thereto. Preferably, in some embodiments, see Figure 3 , the packaging glue is sprayed into the bowl cup 873 through the glue injection unit 2 (glue injection nozzle) to form a highly uniform glue layer in a short time, and then the first packaging glue layer 82 is formed through preliminary curing to improve production efficiency. Furthermore, the packaging glue can be sprayed into each bowl cup 873 through multiple parallel glue injection nozzles to further improve production efficiency.

[0078] Further, see Figure 3 In order to achieve high-speed injection of packaging glue, a blocking unit 6 is introduced between the packaging bracket 87 and the glue injection nozzle. The blocking unit 6 is a plate-like structure and has through holes 61 arranged one-to-one with the bowl cup 873, so that the packaging glue enters the bowl cup 873 through the through holes 61 without adhering to other positions.

[0079] Specifically, in step S2, the temperature of the preliminary curing is ≤95°C. Through the preliminary curing, a non-flowable adhesive material can be obtained, which is convenient for obtaining the first fluorescent layer 83 through the subsequent bonding process. At the same time, it also effectively prevents the first fluorescent powder particles from settling in the first encapsulation adhesive layer 82, and optimizes the control of the color coordinate concentration. Preferably, in some embodiments, the temperature of the preliminary curing is 80-90°C, and the duration is 10s-5min.

[0080] Specifically, in step S2, preliminary curing can be achieved by baking equipment, but is not limited thereto. Preferably, in some embodiments, preliminary curing is achieved by heating with a heating plate that is substantially the same size as the package bracket 87. The heating plate can be attached to the bottom of the package bracket 87 to simplify the process.

[0081] Specifically, in step S3, the first phosphor particles can be bonded to the first packaging glue layer 82 by a powdering process (spreading the powder by vibration or airflow), a dip coating process, a spray coating process, a vacuum adsorption process, etc. to form the first phosphor layer 83, but it is not limited thereto. Preferably, see Figure 4 In some embodiments, the first fluorescent layer 83 is formed on the first packaging glue layer 82 through the first fluorescent unit 41. Specifically, the first fluorescent unit 41 is a box structure with air holes 43 at the bottom. The first intermediate body provided with the first packaging glue layer 82 is detachably fixed on the top of the first fluorescent unit 41 (box). The airflow through the air holes 43 carries the first phosphor particles to the surface of the first packaging glue layer 82 and adheres to form the first fluorescent layer.

[0082] Preferably, in order to achieve the distribution of the first phosphor particles, in some embodiments, the first intermediate forming the first encapsulation glue layer 82 is turned over by the turning unit 7, that is, the opening of the bowl 873 faces downward.

[0083] Specifically, in step S4, the encapsulating glue can be dispensed into the bowl 873 by a conventional dispensing device, but is not limited thereto. Preferably, in some embodiments, see Figure 3, the packaging glue is sprayed into the bowl cup 873 through the glue injection unit 2 (glue injection nozzle) to form a highly uniform glue layer in a short time, and then the second packaging glue layer 84 is formed through preliminary curing to improve production efficiency. Furthermore, the packaging glue can be sprayed into each bowl cup 873 through multiple parallel glue injection nozzles to further improve production efficiency.

[0084] Further, see Figure 3 In order to achieve high-speed injection of packaging glue, a blocking unit 6 is introduced between the packaging bracket 87 and the glue injection nozzle. The blocking unit 6 is a plate-like structure and has through holes 61 arranged one-to-one with the bowl cup 873, so that the packaging glue enters the bowl cup 873 through the through holes 61 without adhering to other positions.

[0085] Specifically, in step S4, the temperature of the preliminary curing is ≤95°C. Through the preliminary curing, a non-flowable adhesive material can be obtained, which is convenient for obtaining the second fluorescent layer 85 through the subsequent bonding process. At the same time, it also effectively prevents the second fluorescent powder particles from settling in the second encapsulation adhesive layer 84, and optimizes the control of the color coordinate concentration. Preferably, in some embodiments, the temperature of the preliminary curing is 80-90°C, and the duration is 10s-5min.

[0086] Specifically, in step S4, preliminary curing can be achieved by baking equipment, but is not limited thereto. Preferably, in some embodiments, preliminary curing is achieved by heating with a heating plate that is substantially the same size as the package bracket 87. The heating plate can be attached to the bottom of the package bracket 87 to simplify the process.

[0087] Specifically, in step S5, the first and second phosphor particles can be bonded to the second encapsulation adhesive layer 84 to form the second phosphor layer 85 by a powdering process (spreading the powder by vibration or airflow), a dip coating process, a spray coating process, a vacuum adsorption process, etc., but not limited thereto. Preferably, in some embodiments, the second phosphor layer 85 is formed on the second encapsulation adhesive layer 84 by the second phosphor unit 42. Specifically, the second phosphor unit 42 is a box structure with air holes 43 at the bottom. The first intermediate body with the second encapsulation adhesive layer 84 is detachably fixed on the top of the second phosphor unit 42 (box). The airflow through the air holes 43 carries the second phosphor particles to the surface of the second encapsulation adhesive layer 84, and the second phosphor layer is bonded to form the second phosphor layer.

[0088] Preferably, in order to achieve the distribution of the second phosphor particles, in some embodiments, the first intermediate forming the second encapsulation adhesive layer 84 is turned over by the turning unit 7, that is, the opening of the bowl 873 faces downward.

[0089] Specifically, in step S6, the encapsulation glue can be dotted into the bowl cup 873 by a conventional glue dispensing device, but is not limited thereto. Preferably, in some embodiments, the encapsulation glue is sprayed into the bowl cup 873 by the glue injection unit 2 (glue injection nozzle) to form a highly uniform glue layer in a short time, and then the third encapsulation glue layer 86 is formed by preliminary curing to improve production efficiency. Furthermore, the encapsulation glue can be sprayed into each bowl cup 873 by multiple glue injection nozzles arranged in parallel to further improve production efficiency.

[0090] Specifically, in step S6, the temperature of the preliminary curing is ≤95°C, and the packaging glue can be prevented from flowing through the preliminary curing.

[0091] Specifically, in step S4, secondary curing is performed by a common baking device in the art, and the temperature of the secondary curing is ≥120° C., but not limited thereto. Preferably, in some embodiments, the temperature of the secondary curing is 140-160° C., and the duration is 2-5 hours.

[0092] Preferably, in some embodiments, step S6 comprises:

[0093] S61: Periodically repeat steps S2 to S3;

[0094] S62: Periodically repeat steps S4 to S5;

[0095] S63: injecting packaging glue onto the top second fluorescent layer, and preliminarily curing it to form a third packaging glue layer 86, thereby obtaining a second intermediate;

[0096] Specifically, based on this embodiment, the first phosphor particles and the second phosphor particles produce different colors of light when excited. More specifically, the first phosphor particles are red phosphor particles, and the second phosphor particles are green phosphor particles.

[0097] Based on this implementation, multiple first fluorescent layers 83 / second fluorescent layers 85 can be formed by multiple bonding, thereby optimizing the distribution uniformity of the fluorescent powder particles and improving the color rendering performance.

[0098] Specifically, see Figure 5 Based on this embodiment, the second intermediate may include 3 to 5 first packaging glue layers 82 (ie, 3 to 5 first fluorescent layers 83) and 3 to 5 second packaging glue layers 84 (ie, 3 to 5 second fluorescent layers 85).

[0099] Specifically, in this embodiment, the thickness of the first packaging glue layer 82 is 20-50 μm, the thickness of the second packaging glue layer 84 is 20-50 μm, and the thickness of the third packaging glue layer 86 is 20-50 μm; the thickness of the packaging glue layer is 400-600 μm.

[0100] Preferably, in some other implementations, step S6 includes:

[0101] S61: Periodically repeat steps S2 to S5;

[0102] S62: injecting packaging glue onto the top second fluorescent layer, and preliminarily curing it to form a third packaging glue layer 86, thereby obtaining a second intermediate;

[0103] Based on this embodiment, firstly, multiple first fluorescent layers 83 / second fluorescent layers 85 can be formed by multiple bonding, thereby optimizing the distribution uniformity of fluorescent powder particles and improving color rendering performance. Secondly, by using different types of first fluorescent powder particles and second fluorescent powder particles, the absorption of light can be greatly reduced and the brightness of LED lamp beads can be improved.

[0104] Specifically, based on this embodiment, the first phosphor particles and the second phosphor particles produce different colors of light when excited. More specifically, the first phosphor particles are red phosphor particles, and the second phosphor particles are green phosphor particles.

[0105] Specifically, see Figure 6 Based on this embodiment, the second intermediate may include 3 to 5 first packaging glue layers 82 (ie, 3 to 5 first fluorescent layers 83) and 3 to 5 second packaging glue layers 84 (ie, 3 to 5 second fluorescent layers 85).

[0106] Specifically, in this embodiment, the thickness of the first packaging glue layer 82 is 20-50 μm, the thickness of the second packaging glue layer 84 is 20-50 μm, and the thickness of the third packaging glue layer 86 is 20-50 μm; the thickness of the packaging glue layer is 400-600 μm.

[0107] Preferably, in some embodiments, the packaging method of the present invention further includes the steps of detection, color separation and light splitting, and taping commonly used in the art, but is not limited thereto.

[0108] Accordingly, see Figure 7In another embodiment of the present invention, a packaging system for LED lamp beads is also disclosed, which includes: a crystal bonding unit 1, a glue injection unit 2, a preliminary curing unit 3, a fluorescent unit 4 and a curing unit 5. Among them, the crystal bonding unit 1 is used to fix the LED chip 81 to the bowl cup 873 of the packaging bracket 87 to obtain a first intermediate. The glue injection unit 2 is used to inject packaging glue into the bowl cup 873. The preliminary curing unit 3 is used to preliminarily cure the packaging glue injected by the glue injection unit 2 to form a first packaging glue layer 82, a second packaging glue layer 84 and a third packaging glue layer 86 respectively. The fluorescent unit 4 includes a first fluorescent unit 41 for forming a first fluorescent layer 83 on the first packaging glue layer 82 and a second fluorescent unit 42 for forming a second fluorescent layer 85 on the second packaging glue layer 84. The curing unit 5 is used to secondary cure the first packaging glue layer 82, the second packaging glue layer 84 and the third packaging glue layer 86 to form a packaging glue layer in the bowl cup 873.

[0109] Among them, the first encapsulation adhesive layer 82 and the second encapsulation adhesive layer 84 are both non-flowable adhesive materials, that is, they are in a non-flowable state at the working temperature (15-80°C), but maintain a certain adhesive force, and can bond powder particles (such as phosphor particles, etc.). The first fluorescent layer 83 is composed of a plurality of first phosphor particles, and the second fluorescent layer 85 is composed of a plurality of second phosphor particles. The light colors generated by the excitation of the first phosphor particles and the second phosphor particles are the same or different. The temperature of the initial curing is ≤95°C, and the temperature of the secondary curing is ≥120°C.

[0110] Based on the packaging system of the LED lamp beads of this embodiment, the first packaging glue layer 82 / second packaging glue layer 84 can be formed by preliminary curing, which is a non-flowable adhesive material, and then the first phosphor particles / second phosphor particles are bonded thereon to form the first phosphor layer / second phosphor layer. Finally, the packaging glue layer is formed by secondary curing. Based on this packaging method, the phosphor particles are effectively prevented from settling in the packaging glue by preliminary curing + bonding the phosphor particles, and the distribution uniformity of the first phosphor particles / second phosphor particles is optimized, thereby improving the color coordinate concentration and the light color uniformity.

[0111] Specifically, the glue injection unit 2 can be a common glue dispensing device in the art, but is not limited thereto. Preferably, in some embodiments, the glue injection unit 2 includes a plurality of glue injection nozzles corresponding to the plastic bracket 872, and then the packaging glue is injected into each bowl 873 by one injection, which greatly improves the packaging efficiency.

[0112] Specifically, the preliminary curing unit 3 can be a common baking device in the art, but is not limited thereto. Preferably, in some embodiments, the preliminary curing unit 3 is a heating plate, which is substantially the same size as the packaging bracket 87. When in use, the heating plate can be attached to the bottom of the packaging bracket 87, thereby conveniently achieving preliminary curing.

[0113] Specifically, in some embodiments, the fluorescent unit 4 is a powder spraying device, but is not limited thereto. Preferably, in some embodiments, the first fluorescent unit 41 and the second fluorescent unit 42 are both box structures with air holes 43 at the bottom, the first intermediate body can be fixed on the top, and a plurality of air holes 43 are provided at the bottom, and the airflow through the air holes 43 carries the first fluorescent powder particles / the second fluorescent powder particles to the surface of the first encapsulation glue layer 82 / the second encapsulation glue layer 84, and forms the first fluorescent layer / the second fluorescent layer by bonding.

[0114] Specifically, the curing unit 5 is a common baking device in the art, but is not limited thereto.

[0115] Preferably, in some embodiments, the LED lamp bead packaging system further includes: a blocking unit 6, which is a plate-like structure, and a through hole 61 is provided on the blocking unit 6 corresponding to the bowl cup 873, so that the packaging glue enters the bowl cup 873 through the through hole 61. Based on this embodiment, the packaging glue can be quickly sprayed into the bowl cup 873 to form a first packaging glue layer 82, a second packaging glue layer 84, and a third packaging glue layer 86 with uniform thickness, thereby improving the packaging efficiency and the color coordinate concentration of the LED lamp bead. Specifically, the packaging efficiency of this embodiment can be improved by 20 to 35% compared with the packaging efficiency of the ordinary packaging method.

[0116] Preferably, in some embodiments, the packaging system of the LED lamp bead also includes a flipping unit 7, which is used to flip the first intermediate provided with a first packaging adhesive layer 82 and / or a second packaging adhesive layer 84 to bond the first phosphor particles to the first packaging adhesive layer 82, or to bond the second phosphor particles to the second packaging adhesive layer 84. Based on this embodiment, the distribution uniformity of the first phosphor particles / the second phosphor particles can be further optimized.

[0117] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0118] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for packaging LED lamp beads, characterized in that: include: (1) Fixing the LED chip in the bowl of the packaging bracket to obtain a first intermediate; (2) injecting packaging glue into the bowl cup and initially curing it to form a first packaging glue layer, wherein the first packaging glue layer is a non-flowable adhesive material; (3) forming a first fluorescent layer on the first packaging glue layer; (4) injecting packaging glue onto the first fluorescent layer and preliminarily curing it to form a second packaging glue layer; the second packaging glue layer is a non-flowable adhesive material; (5) forming a second fluorescent layer on the second encapsulation adhesive layer; (6) injecting encapsulation glue onto the second fluorescent layer and preliminarily curing it to form a third encapsulation glue layer to obtain a second intermediate; (7) secondary curing the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer in the second intermediate to obtain an encapsulation adhesive layer; The first fluorescent layer is composed of a plurality of first fluorescent powder particles, and the second fluorescent layer is composed of a plurality of second fluorescent powder particles. The light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are the same or different; Among them, the temperature of primary curing is ≤95°C, and the temperature of secondary curing is ≥120°C.

2. The LED lamp bead packaging method according to claim 1, characterized in that: Step (6) comprises: (6.1) Periodically repeat steps (2) to (5); (6.2) injecting encapsulation glue onto the top second fluorescent layer, and preliminarily curing it to form a third encapsulation glue layer to obtain a second intermediate; The first phosphor particles and the second phosphor particles are excited to generate light of different colors.

3. The LED lamp bead packaging method according to claim 1, characterized in that: Step (6) comprises: (6.1) Periodically repeating steps (2) to (3); (6.2) Repeat steps (4) to (5) periodically. (6.3) injecting encapsulation glue onto the top second fluorescent layer, and preliminarily curing it to form a third encapsulation glue layer to obtain a second intermediate; The first phosphor particles and the second phosphor particles are excited to generate light of different colors.

4. The LED lamp bead packaging method according to claim 2 or 3, characterized in that: The second intermediate includes 4 to 5 first packaging adhesive layers and 4 to 5 second packaging adhesive layers; The thickness of the first encapsulation adhesive layer is 20 to 50 μm, the thickness of the second encapsulation adhesive layer is 20 to 50 μm, and the thickness of the third encapsulation adhesive layer is 20 to 50 μm; The particle size of the first phosphor particles is 1 to 25 μm, and the particle size of the second phosphor particles is 1 to 25 μm; The thickness of the packaging glue layer is 400-600 μm.

5. The LED lamp bead packaging method according to claims 1 to 3, characterized in that: The LED chip is a blue LED chip, the first phosphor particles are red phosphor particles, and the second phosphor particles are green phosphor particles; The temperature of the preliminary curing is 80-90°C and the duration is 10s-5min; The secondary curing is performed at a temperature of 140 to 160° C. and for a duration of 2 to 5 hours.

6. An LED lamp bead, characterized in that: The LED chip is packaged by the LED lamp bead packaging method according to any one of claims 1 to 5.

7. A packaging system for LED lamp beads, characterized in that: include: A die-bonding unit, used to fix the LED chip into the bowl of the packaging bracket to obtain a first intermediate; A glue injection unit, used for injecting packaging glue into the bowl; A preliminary curing unit is used to preliminarily cure the encapsulation glue injected by the glue injection unit to form a first encapsulation glue layer, a second encapsulation glue layer and a third encapsulation glue layer respectively, wherein the first encapsulation glue layer and the second encapsulation glue layer are non-flowable adhesive materials; the temperature of the preliminary curing is ≤95°C; A fluorescent unit, comprising a first fluorescent unit for forming a first fluorescent layer on a first encapsulating glue layer and a second fluorescent unit for forming a second fluorescent layer on a second encapsulating glue layer; the first fluorescent layer is composed of a plurality of first fluorescent powder particles, the second fluorescent layer is composed of a plurality of second fluorescent powder particles, and the light colors generated by the excitation of the first fluorescent powder particles and the second fluorescent powder particles are the same or different; The curing unit is used for secondary curing the first encapsulation adhesive layer, the second encapsulation adhesive layer and the third encapsulation adhesive layer to form an encapsulation adhesive layer in the bowl; wherein the secondary curing temperature is ≥120°C.

8. The LED lamp bead packaging system as claimed in claim 7, characterized in that: Also includes: A blocking unit, wherein the blocking unit is provided with a through hole corresponding to the bowl cup, so that the packaging glue can enter the bowl cup through the through hole; The flipping unit is used to flip the first intermediate body provided with the first encapsulation adhesive layer and / or the second encapsulation adhesive layer to adhere the first phosphor particles to the first encapsulation adhesive layer, or to adhere the second phosphor particles to the second encapsulation adhesive layer.

9. The LED lamp bead packaging system as claimed in claim 8, characterized in that: The first fluorescent unit is a box structure with air holes at the bottom, and the first intermediate body with a first packaging glue layer is detachably fixed on the top of the first fluorescent unit, and the airflow through the air holes carries the first fluorescent powder particles to the surface of the first packaging glue layer and adheres to form the first fluorescent layer; The second fluorescent unit is a box structure with air holes at the bottom. The first intermediate body with a second packaging glue layer can be detachably fixed on the top of the second fluorescent unit. The airflow through the air holes carries the second phosphor particles to the surface of the second packaging glue layer and bonds them to form a second fluorescent layer.

10. The LED lamp bead packaging system according to claim 8, characterized in that: The glue injection unit is a box structure provided with a plurality of glue spray guns; The first fluorescent unit and the second fluorescent unit are arranged on both sides of the glue injection unit, and a flip unit is arranged between the first fluorescent unit and the glue injection unit, and a flip unit is arranged between the second fluorescent unit and the glue injection unit.

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