Display module and display device

Abstract

The application relates to a display module and a display device. The display module comprises a display panel, a first back plate, a second back plate and a support structure. The display panel comprises a display area, a bending area located on one side of the display area, and a binding area located on the side of the bending area away from the display area. The binding area is bent towards the side away from the light-out surface of the display module. The first back plate is located on the side of the display area away from the light-out surface. The second back plate is located on the side of the binding area facing the light-out surface and is arranged opposite to the first back plate. The support structure is located between the first back plate and the second back plate and comprises at least one conductive layer. The first filling part is filled in the first space part. The first space part is located between the first back plate, the second back plate, the support structure and the bending area. The bending area comprises at least one opening penetrating through the bending area. The first filling part comprises a conductive material. On the side surface of the bending area away from the support structure, the opening exposes the first filling part. The application can simultaneously reduce the bending radius of the bending part and improve the anti-static capability.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the continuous development of display technology, Organic Light-Emitting Diode (OLED) display devices have been widely used in various fields such as flat panel displays, flexible displays, automotive displays, and solid-state lighting due to their advantages such as wide color gamut, high contrast, energy saving, and foldability. Compared with LCD technology, OLED display panels can reduce the width of the bottom bezel of the display by bending the pads, and this has become an effective technical means to achieve a narrow bezel effect.

[0003] However, existing technologies suffer from the problem that it is difficult to simultaneously reduce the bending radius of the bend and improve the antistatic capability. Summary of the Invention

[0004] Therefore, it is necessary to provide a display module and display device that aims to solve the problem that it is difficult to simultaneously reduce the bending radius of the bending part and improve the antistatic capability in the prior art.

[0005] In a first aspect, embodiments of this application provide a display module, including:

[0006] The display panel includes a display area and a bent area located on one side of the display area, and a bonding area located on the side of the bent area away from the display area, the bonding area being bent toward the side opposite to the light-emitting surface of the display module;

[0007] The first backplate is located on the side of the display area opposite to the light-emitting surface;

[0008] The second backplate is located on the side of the bonding area facing the light-emitting surface and is disposed opposite to the first backplate;

[0009] A support structure is located between the first back plate and the second back plate, and the support structure includes at least one conductive layer.

[0010] A first filling portion fills a first space portion, the first space portion being located between the first back plate, the second back plate, the support structure, and the bending area;

[0011] The bending area includes at least one opening penetrating the bending area, and the first filling portion includes a conductive material;

[0012] On the side of the bending area away from the support structure, the opening exposes the first filling portion.

[0013] In some embodiments, the first filling portion includes a filling body and a plurality of conductive particles dispersed within the filling body.

[0014] In some embodiments, the bending area includes a first sub-bending area near the display area and a third sub-bending area near the binding area, and a second sub-bending area connecting the first sub-bending area and the third sub-bending area, wherein the bending curvature of the second sub-bending area is greater than the bending curvature of the first sub-bending area and the bending curvature of the third sub-bending area.

[0015] The density of openings in at least one of the first sub-bending region and the third sub-bending region is greater than the density of openings in the second sub-bending region.

[0016] In some embodiments, the length of the opening is less than or equal to the length of the conductive particle.

[0017] In some embodiments, the display panel includes multiple signal lines located in the bending area, and the opening is configured to avoid the signal lines.

[0018] In some embodiments, the first filling portion is connected to the end face of the conductive layer near the bending region.

[0019] In some embodiments, the support structure further includes a first sub-support structure located on the side of the conductive layer near the first back plate, and the conductive layer includes a first protrusion protruding toward the bending area relative to the first sub-support structure in a direction parallel to the plane of the first back plate.

[0020] The first filling portion is connected to at least the surface of the first protrusion near the first back plate.

[0021] In some embodiments, the support structure further includes a second sub-support structure located on the side of the conductive layer near the second back plate, and the conductive layer includes a second protrusion protruding toward the bending area relative to the second sub-support structure in a direction parallel to the plane of the first back plate.

[0022] The first filling portion is connected to at least the surface of the second protrusion near the second back plate.

[0023] In some embodiments, the material of the first filling portion includes an elastic organic material; and / or,

[0024] The material of the first filling portion extends into at least one of the openings.

[0025] Secondly, based on the same application concept, embodiments of this application also provide a display device, which includes any of the display modules provided in the first aspect.

[0026] In this embodiment, by providing a first filling portion in the first space, the first space is located between the first back plate, the second back plate, the support structure, and the bending area; the support structure is located between the first back plate and the second back plate, and the support structure includes at least one conductive layer; the bending area includes at least one opening penetrating the bending area, and the first filling portion includes conductive material; on the side of the bending area away from the support structure, the opening exposes the first filling portion; this achieves the effect of simultaneously reducing the bending radius of the bending portion and improving antistatic capability. Firstly, the opening in the bending area exposes the first filling portion, which includes conductive material and is connected to the conductive layer in the support structure. When the bending area is subjected to static electricity from sources such as the air, the static electricity can be released through the path of the opening, the first filling portion, and the conductive layer, thereby improving the antistatic capability of the bending area. Secondly, the protective adhesive material away from the support structure in the bending area can be removed (no protective adhesive material is provided), thereby reducing the bending radius and / or thickness of the bending area, and reducing the width of the lower bezel of the display module. In addition, thirdly, the first filling part is provided in the first space. When the bending area is impacted by an external force, the first filling part can buffer or resist the external impact force, avoid excessive deformation of the bending area and cause the wiring in the bending area to break, so that the first filling part can improve the mechanical strength of the bending area against external impact force. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a top view schematic diagram of the overall structure of a display module before bending in a bending area, as provided in an embodiment of this application.

[0029] Figure 2 This is a schematic diagram of a first cross-sectional structure of a display module provided in an embodiment of this application.

[0030] Figure 3 This is a schematic diagram of a second cross-sectional structure of a display module provided in an embodiment of this application.

[0031] Figure 4 This is a schematic diagram of a third cross-sectional structure of a display module provided in an embodiment of this application.

[0032] Figure 5 This is a schematic diagram of a fourth cross-sectional structure of a display module provided in an embodiment of this application.

[0033] Figure 6 This is a schematic diagram of the electrostatic discharge process of a display module provided in an embodiment of this application.

[0034] Figure 7 This is a schematic diagram of a display device provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] Display device 300; display module 200; display panel 10; first back plate 21a; second back plate 21b; support structure 30; first filling part 50; display area AA; flat display area 10A; bending area 10B; bonding area 10C; first space part 10t; substrate 11; display functional layer 12; driver chip 40; bonding terminal 101; signal line 102; optical adhesive layer 13; protective cover plate 14.

[0037] Adhesive layer 31; Buffer layer 32; Conductive layer 33; Opening 10k; Static SD1; Filler body 51; Conductive particles 52;

[0038] First sub-bending area 10B1; second sub-bending area 10B2; third sub-bending area 10B3; first sub-support structure 301; first protrusion 33t1; first sub-surface 331; second sub-support structure 302; second protrusion 33t2; second sub-surface 332. Detailed Implementation

[0039] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more intermediate elements present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intermediate elements present.

[0042] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0043] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0044] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0045] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0046] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0047] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0048] As described in the background section, existing technologies suffer from the problem of simultaneously failing to simultaneously reduce the bending radius of the bending portion and improve antistatic capabilities. A display module includes a display panel, a first back plate, and a second back plate. The display panel includes a display area and a bending area located on one side of the display area, as well as a bonding area located on the side of the bending area away from the display area. The bonding area bends towards the side opposite to the light-emitting surface of the display module. The first back plate is located on the side of the display area away from the light-emitting surface. The second back plate is located on the side of the bonding area facing the light-emitting surface and is positioned opposite to the first back plate. The inventors have discovered that in existing technologies, to protect the outer surface of the bending area away from the first and second back plates and prevent electrostatic discharge (ESD) damage from sources such as air, a protective adhesive material is required on the outer surface of the bending area away from the first and second back plates. However, the use of this protective adhesive material increases the bending radius and / or thickness of the bending area, leading to an increase in the width of the bottom bezel of the display module. Removing the protective adhesive material makes the bending area more susceptible to ESD damage from sources such as air, resulting in damage to the display module and display malfunctions.

[0049] Based on the aforementioned technical problems, the inventors discovered that by providing a first filling portion in the first spatial portion, the first spatial portion being located between the first back plate, the second back plate, the support structure, and the bending area; the support structure being located between the first back plate and the second back plate, and the support structure including at least one conductive layer; the bending area including at least one opening penetrating the bending area; and the first filling portion including a conductive material; on the side of the bending area away from the support structure, the opening exposes the first filling portion; thus, the effects of reducing the bending radius of the bending portion and improving antistatic capability can be achieved simultaneously. Firstly, the opening in the bending area exposes the first filling portion, which includes a conductive material and is connected to the conductive layer in the support structure. When the bending area is subjected to static electricity from sources such as the air, the static electricity can be released through the path of the opening, the first filling portion, and the conductive layer, thereby improving the antistatic capability of the bending area. Secondly, the protective adhesive material in the bending area away from the support structure can be removed (no protective adhesive material is provided), thereby reducing the bending radius and / or thickness of the bending area, and reducing the width of the lower bezel of the display module. In addition, thirdly, the first filling part is provided in the first space. When the bending area is impacted by an external force, the first filling part can buffer or resist the external impact force, avoid excessive deformation of the bending area and cause the wiring in the bending area to break, so that the first filling part can improve the mechanical strength of the bending area against external impact force.

[0050] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0051] Please see Figures 1 to 7 . Figure 1 This is a top view schematic diagram of the overall structure of a display module before bending in a bending area, as provided in an embodiment of this application. Figure 2 This is a schematic diagram of a first cross-sectional structure of a display module provided in an embodiment of this application. Figure 3 This is a schematic diagram of a second cross-sectional structure of a display module provided in an embodiment of this application. Figure 1 This is also a top view schematic diagram of the overall structure of a display panel provided in an embodiment of this application.

[0052] Figure 4 This is a schematic diagram of a third cross-sectional structure of a display module provided in an embodiment of this application. Figure 5 This is a schematic diagram of a fourth cross-sectional structure of a display module provided in an embodiment of this application.

[0053] Figure 6 This is a schematic diagram of the electrostatic discharge process of a display module provided in an embodiment of this application.

[0054] Figure 1 The diagram illustrates the bending area before the bend. Figures 2 to 6 The diagram illustrates the cross-sectional structure of the bending zone after bending.

[0055] This application provides a display module 200, which includes a display panel 10, a first back plate 21a, a second back plate 21b, a support structure 30, and a first filling portion 50. The display panel 10 includes a display area AA, a bending area 10B located on one side of the display area AA, and a bonding area 10C located on the side of the bending area 10B away from the display area AA. The bonding area 10C is bent toward the side away from the light-emitting surface of the display module 200. The first back plate 21a is located on the side of the display area AA away from the light-emitting surface. The second back plate 21b is located on the side of the bonding area 10C facing the light-emitting surface and is disposed opposite to the first back plate 21a. The support structure 30 is located between the first back plate 21a and the second back plate 50. Between 21b, the support structure 30 includes at least one conductive layer 33; the first filling portion 50 fills the first space portion 10t, the first space portion 10t is located between the first back plate 21a, the second back plate 21b and the support structure 30 and the bending region 10B; wherein, the bending region 10B includes at least one opening 10k penetrating the bending region 10B, and the first filling portion 50 includes a conductive material; on the side surface of the bending region 10B away from the support structure 30, the opening 10k exposes the first filling portion 50.

[0056] For example, such as Figure 2As shown, the display panel 10 may include a substrate 11 and a display functional layer 12. The display functional layer 12 may include a plurality of display pixels, and the display pixels may include light-emitting devices. The structure and display type of the display functional layer 12 are not limited here.

[0057] For example, combined Figure 1 and Figure 2 As shown, depending on whether an image is displayed in each part of the display panel 10, the display panel 10 may include a display area AA and a non-display area BB surrounding the display area AA. The bending area 10B and the binding area 10C are located in the non-display area BB. However, the structure of the display panel 10 is not limited to this. For example, the non-display area BB may partially surround the display area AA.

[0058] For example, combined Figure 1 and Figure 2 As shown, from the shape of each part of the display panel 10, the display panel 10 includes a flat display area 10A, a bent area 10B, and a bonding area 10C connected in sequence. The bent area 10B can be bent to achieve a narrow bezel. The bent area 10B is provided with multiple signal lines 102. The bonding area 10C is provided with a bonding terminal 101, which can be electrically connected to the driver chip 40 or the circuit board. The flat display area 10A is located in the display area AA.

[0059] For example, such as Figures 2 to 5 As shown, the display module 200 may further include a polarizer (the polarizer is attached to the light-emitting surface of the display panel 10) attached to the side of the display functional layer 12 away from the substrate 11, and a protective cover plate 14 (CG, Cover Glass) attached to the side of the polarizer (POL) away from the substrate 11 by an optically clear adhesive layer 13 (OCA). The material of the protective cover plate 14 can be glass or ultra-thin glass, etc., and the material of the protective cover plate 14 is not limited here. For example, the structure of the display module 200 is not limited to... Figure 2 As shown, for example, display module 200 may not include a polarizer.

[0060] For example, such as Figures 2 to 5 As shown, the side of the protective cover 14 away from the base 11 is the display area AA (or flat display area 10A) or the light-emitting surface of the display panel 10, that is, the light emitted from the display panel 10 is emitted from the protective cover 14 to the human eye.

[0061] For example, combined Figure 1 As shown, the first backplate 21a is attached to the side of the substrate 11 opposite to the display functional layer 12. The second backplate 21b is attached to the same side of the substrate 11 as the first backplate 21a.

[0062] For example, such as Figures 2 to 5 As shown, after the bending area 10B is bent, the display area AA and the bonding area 10C are set opposite to each other or opposite to each other. The first back plate 21a is located on the side of the display area AA away from the light-emitting surface; the second back plate 21b is located on the side of the bonding area 10C facing the light-emitting surface and is set opposite to the first back plate 21a.

[0063] For example, such as Figures 2 to 5 As shown, the support structure 30 is located between the first back plate 21a and the second back plate 21b. The support structure 30 includes at least one conductive layer 33. The support structure 30 may be selected from Super Clean Foam (SCF). SCF is a material composed of super clean foam and composite film, but is not limited to this. For example, the support structure 30 may include a rigid support sublayer and a conductive layer (heat dissipation layer).

[0064] For example, such as Figures 2 to 5 As shown, when the support structure 30 includes an ultra-clean foam composite film, ultra-clean foam is used as the substrate, and one or more functional films are laminated on top to achieve specific functional requirements. SCF (Superficial Clean Foam) has advantages such as high strength, corrosion resistance, wear resistance, and high temperature resistance. Specifically, the SCF composite film has high mechanical strength and tensile strength, effectively protecting the substrate surface from external impacts and wear. The SCF composite film also has good chemical corrosion resistance, resisting corrosion in acid, alkali, and salt water environments, protecting the substrate from damage. Furthermore, the SCF composite film has a smooth surface and excellent wear resistance, extending the service life of the substrate. The SCF composite film also has certain high-temperature resistance, allowing stable operation in high-temperature environments. Another advantage of SCF material is its light weight, which does not increase the load on the flexible display panel, making it suitable for applications requiring lightweight design.

[0065] For example, Figures 2 to 4 Taking the support structure 30 as an example, which includes an ultra-clean foam composite membrane, the support structure 30 includes an adhesive layer 31, a buffer layer 32 and a conductive layer 33 (heat dissipation layer). The material of the buffer layer 32 can be foam, and the material of the conductive layer 33 can be copper foil, but is not limited to these.

[0066] For example, such as Figures 2 to 5 As shown, the first filling portion 50 fills the first space portion 10t, which is located between the first back plate 21a, the second back plate 21b, the support structure 30, and the bending area 10B. The first space portion 10t can be completely or partially filled by the first filling portion 50.

[0067] For example, such as Figures 2 to 5 As shown, on the side of the bending region 10B away from the support structure 30, the opening 10k exposes the first filling part 50, and the first filling part 50 is in contact with the conductive layer 33.

[0068] For example, such as Figures 2 to 5 As shown, the bending region 10B includes at least one opening 10k that penetrates the bending region 10B and the opening 10k penetrates the substrate 11. When other insulating layers or other films are provided on the substrate 11 of the bending region 10B, the opening 10k also penetrates the other insulating layers or other films provided on the substrate 11, so that on the side surface of the bending region 10B away from the support structure 30, the opening 10k exposes the first filling portion 50.

[0069] For example, such as Figure 6 The diagram illustrates the release process of static electricity SD1. When the bending region 10B is subjected to static electricity SD1 from sources such as the air, the static electricity SD1 can be released through the path of the opening 10k, the first filling portion 50, and the conductive layer 33. Figure 6 (Arrow line within the first space section 10t).

[0070] In this embodiment, by providing a first filling portion 50 in the first space portion 10t, the first space portion 10t is located between the first back plate 21a, the second back plate 21b, the support structure 30, and the bending region 10B; the support structure 30 is located between the first back plate 21a and the second back plate 21b, and the support structure 30 includes at least one conductive layer 33; the bending region 10B includes at least one opening 10k penetrating the bending region 10B, and the first filling portion 50 includes a conductive material; on the side surface of the bending region 10B away from the support structure 30, the opening 10k exposes the first filling portion 50; thus, the effect of reducing the bending radius of the bending portion and improving the antistatic capability can be achieved. Firstly, the opening 10k of the bending area 10B exposes the first filling portion 50, which includes a conductive material. The first filling portion 50 is connected to the conductive layer 33 in the support structure 30. When the bending area 10B is subjected to static electricity from sources such as the air, the static electricity can be released through the path of the opening 10k, the first filling portion 50, and the conductive layer 33, thereby improving the antistatic capability of the bending area 10B. Secondly, the protective adhesive material of the bending area 10B away from the support structure 30 can be removed (not provided), and the surface of the bending area 10B away from the support structure 30 is exposed, thereby reducing the bending radius and / or thickness of the bending area 10B, and reducing the width of the lower bezel of the display module 200. In addition, thirdly, the first filling part 50 is disposed in the first space part 10t. When the bending area 10B is subjected to external impact, the first filling part 50 can buffer or resist the external impact force, avoid excessive deformation of the bending area 10B and cause the wiring of the bending area 10B to break, so that the first filling part 50 can improve the mechanical strength of the bending area 10B against external impact force.

[0071] In some implementations, such as Figures 2 to 5As shown, the first filling part 50 includes a filling body 51 and a plurality of conductive particles 52 dispersed within the filling body 51.

[0072] For example, such as Figures 2 to 5 As shown, the first filling part 50 includes a filling body 51 and a plurality of conductive particles 52, which can realize the conductive function of the first filling part 50 and facilitate the filling of the first filling part 50 into the first space part 10t. For example, the material of the first filling part 50 in a fluid or liquid state can be filled into the first space part 10t, and then the first filling part 50 is formed by a drying process, which has the effect of simple manufacturing process.

[0073] For example, in some other embodiments, the first filling portion 50 may be a conductive metal.

[0074] In some implementations, such as Figures 2 to 5 As shown, the bending area 10B includes a first sub-bending area 10B1 near the display area AA and a third sub-bending area 10B3 near the binding area 10C, and a second sub-bending area 10B2 connecting the first sub-bending area 10B1 and the third sub-bending area 10B3. The bending curvature of the second sub-bending area 10B2 is greater than the bending curvature of the first sub-bending area 10B1 and the bending curvature of the third sub-bending area 10B3. The density of openings 10k in at least one of the first sub-bending area 10B1 and the third sub-bending area 10B3 is greater than the density of openings 10k in the second sub-bending area 10B2.

[0075] For example, such as Figures 2 to 5 As shown, the display area AA, the first sub-bending area 10B1, the second sub-bending area 10B2, the third sub-bending area 10B3, and the binding area 10C are connected in sequence.

[0076] For example, such as Figures 2 to 5 As shown, the bending curvature of the second sub-bending region 10B2 is greater than that of the first sub-bending region 10B1 and the third sub-bending region 10B3. That is, the degree of bending of the second sub-bending region 10B2 is greater than that of the first sub-bending region 10B1 and the third sub-bending region 10B3. The stress in the second sub-bending region 10B2 is more concentrated. Setting the density of the openings 10k in at least one of the first sub-bending regions 10B1 and the third sub-bending region 10B3 to be greater than the density of the openings 10k in the second sub-bending region 10B2, that is, setting a smaller density of openings 10k in the second sub-bending region 10B2, can prevent the second sub-bending region 10B2 from being damaged by fracture or cracks.

[0077] For example, the density of openings 10k in at least one of the first sub-bending region 10B1 and the third sub-bending region 10B3 is greater than the density of openings 10k in the second sub-bending region 10B2. This could be due to a smaller number of openings 10k per unit area in the second sub-bending region 10B2, a smaller area of ​​openings 10k per unit area in the second sub-bending region 10B2, a smaller total number of openings 10k in the second sub-bending region 10B2, or a smaller total area of ​​openings 10k in the second sub-bending region 10B2.

[0078] For example, such as Figure 2 As shown, the second sub-bending area 10B2 does not have an opening 10k. For example, as... Figure 3 As shown, the second sub-bending area 10B2 is provided with an opening 10k.

[0079] In some implementations, such as Figures 2 to 5 As shown, the length of the opening 10k is less than or equal to the length of the conductive particle 52.

[0080] For example, the length of the opening 10k refers to the maximum length of the opening, and the length of the conductive particle 52 refers to the maximum length of the conductive particle 52. The length of the opening 10k is less than or equal to the length of the conductive particle 52, which can prevent the conductive particle 52 from falling through the opening 10k and avoid damage to the first filling part 50.

[0081] For example, in some other embodiments, the length of the opening 10k is greater than the length of the conductive particle 52. In this case, the material of the first filling part 50 in a fluid or liquid state can be injected into the first space 10t through the opening 10k, and then the first filling part 50 is formed by a drying process, which has the effect of simple manufacturing process.

[0082] In some implementations, such as Figure 1 As shown, the display panel 10 includes multiple signal lines 102 located in the bending area 10B, and the opening 10k is set to avoid the signal lines.

[0083] For example, such as Figure 1 As shown, the display panel 10 includes multiple signal lines 102 and / or circuits located in the bending area 10B. The opening 10k avoids the multiple signal lines and circuits located in the bending area 10B, on the one hand to prevent damage to the multiple signal lines and circuits, and on the other hand to prevent external static electricity from entering the multiple signal lines 102 and circuits.

[0084] For example, such as Figure 1 As shown, the opening 10k avoids the multiple signal lines 102 and circuits located in the bending area 10B, that is, the opening 10k is spaced apart from the multiple signal lines 102 and circuits located in the bending area 10B.

[0085] In some implementations, such as Figure 2 and Figure 3 As shown, the first filling portion 50 is connected to the end face of the conductive layer 33 near the bending region 10B.

[0086] For example, such as Figure 2 and Figure 3 As shown, the first filling part 50 is connected to the end face of the conductive layer 33 near the bending region 10B, that is, static electricity is released through the end face of the conductive layer 33 near the bending region 10B.

[0087] In some implementations, such as Figure 4 As shown, the support structure 30 also includes a first sub-support structure 301 located on the side of the conductive layer 33 near the first back plate 21a. In a direction parallel to the plane of the first back plate 21a, the conductive layer 33 includes a first protrusion 33t1 protruding toward the bending region 10B relative to the first sub-support structure 301. The first filling portion 50 is at least connected to the surface of the first protrusion 33t1 near the first back plate 21a.

[0088] For example, such as Figure 4 As shown, when the support structure 30 includes a cleanroom foam composite membrane, the first sub-support structure 301 can be a buffer layer 32. However, the support structure 30 is not limited to a cleanroom foam composite membrane.

[0089] For example, such as Figure 4 As shown, the conductive layer 33 includes a first protrusion 33t1 that protrudes toward the bending region 10B relative to the first sub-support structure 301. The surface of the first protrusion 33t1 near the first back plate 21a is a first sub-surface 331. The first filling portion 50 is at least connected to the first sub-surface 331 to release static electricity. Figure 4 It is also shown that the first filling part 50 is connected to the end face of the conductive layer 33 near the bending region 10B.

[0090] In some implementations, such as Figure 5 As shown, the support structure 30 also includes a second sub-support structure 302 located on the side of the conductive layer 33 near the second back plate 21b. In a direction parallel to the plane of the first back plate 21a, the conductive layer 33 includes a second protrusion 33t2 that protrudes toward the bending region 10B relative to the second sub-support structure 302. The first filling portion 50 is connected to at least the surface of the second protrusion 33t2 near the second back plate 21b.

[0091] For example, such as Figure 5 As shown, the support structure 30 may include an adhesive layer 31, a conductive layer 33 and a buffer layer 32 stacked in sequence, with the adhesive layer 31 located on the side of the conductive layer 33 close to the first back plate 21a.

[0092] For example, in some other embodiments, the support structure 30 includes an ultra-clean foam composite membrane. The support structure 30 includes an adhesive layer 31, a buffer layer 32 and a conductive layer 33 stacked in sequence. The adhesive layer 31 is located on the side of the buffer layer 32 near the first back plate 21a, and a second sub-support structure 302 is provided on the side of the conductive layer 33 near the second back plate 21b.

[0093] For example, the conductive layer 33 includes a second protrusion 33t2 that protrudes toward the bending region 10B relative to the second sub-support structure 302. The surface of the second protrusion 33t2 near the second back plate 21b is a second sub-surface 332. The first filling portion 50 is connected to at least the second sub-surface 332 to release static electricity. Figure 5 It is also shown that the first filling part 50 is connected to the end face of the conductive layer 33 near the bending region 10B.

[0094] In some embodiments, the material of the first filling portion 50 includes an elastic organic material; and / or, the material of the first filling portion 50 extends into at least one opening 10k.

[0095] For example, the material of the first filling part 50 includes an elastic organic material, so that the first filling part 50 can buffer external impact force, avoid the problem of the wiring in the bending area 10B breaking, and improve the mechanical strength of the bending area 10B against external impact force.

[0096] For example, the material of the first filling portion 50 extends into the opening 10k, and when the bending area 10B is subjected to static electricity from sources such as the air, the static electricity can be released more quickly through the first filling portion 50.

[0097] Please see Figure 7 , Figure 7 This is a schematic diagram of a display device provided in an embodiment of this application.

[0098] Secondly, based on the same concept, this application also provides a display device 300, which includes a display module 200 of any of the above features, or a display module 200 combining any of the above features.

[0099] For example, the display device 300 also has the beneficial effects of the display module 200 in the above embodiments. The similarities can be understood by referring to the explanation of the display module 200 above, and will not be repeated below.

[0100] For example, the display device 300 provided in the embodiments of this application can be Figure 7The mobile phone shown can also be any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet, digital camera, smart bracelet, smart glasses, vehicle display, industrial control equipment, medical display, touch interactive terminal, etc. This application embodiment does not make any special limitation in this regard.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a bent area located on one side of the display area, and a bonding area located on the side of the bent area away from the display area, the bonding area being bent toward the side opposite to the light-emitting surface of the display module; The first backplate is located on the side of the display area opposite to the light-emitting surface; The second backplate is located on the side of the bonding area facing the light-emitting surface and is disposed opposite to the first backplate; A support structure is located between the first back plate and the second back plate, and the support structure includes at least one conductive layer. A first filling portion fills a first space portion, the first space portion being located between the first back plate, the second back plate, the support structure, and the bending area; The bending area includes at least one opening penetrating the bending area, and the first filling portion includes a conductive material; On the side of the bending area away from the support structure, the opening exposes the first filling portion; the first filling portion includes a filling body and a plurality of conductive particles dispersed within the filling body, and the first filling portion is in contact with the conductive layer.

2. The display module according to claim 1, characterized in that, The bending area includes a first sub-bending area near the display area and a third sub-bending area near the binding area, as well as a second sub-bending area connecting the first sub-bending area and the third sub-bending area, wherein the bending curvature of the second sub-bending area is greater than the bending curvature of the first sub-bending area and the bending curvature of the third sub-bending area. The density of openings in at least one of the first sub-bending region and the third sub-bending region is greater than the density of openings in the second sub-bending region.

3. The display module according to claim 1, characterized in that, The length of the opening is less than or equal to the length of the conductive particle.

4. The display module according to claim 1, characterized in that, The display panel includes multiple signal lines located in the bending area, and the opening is configured to avoid the signal lines.

5. The display module according to claim 1, characterized in that, The first filling portion is connected to the end face of the conductive layer near the bending region.

6. The display module according to claim 1, characterized in that, The support structure further includes a first sub-support structure located on the side of the conductive layer near the first back plate. In a direction parallel to the plane of the first back plate, the conductive layer includes a first protrusion protruding toward the bending area relative to the first sub-support structure. The first filling portion is connected to at least the surface of the first protrusion near the first back plate.

7. The display module according to claim 1, characterized in that, The support structure further includes a second sub-support structure located on the side of the conductive layer near the second back plate. In a direction parallel to the plane of the first back plate, the conductive layer includes a second protrusion that protrudes toward the bending area relative to the second sub-support structure. The first filling portion is connected to at least the surface of the second protrusion near the second back plate.

8. The display module according to claim 1, characterized in that, The material of the first filling portion includes an elastic organic material; and / or, The material of the first filling portion extends into at least one of the openings.

9. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 8.

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