On-package signal transmitter and antenna structure

Abstract

An apparatus having: a circuit board (808) comprising a top surface and a bottom surface; a package (810) including a bottom surface attached relative to the top surface of the circuit board; and an antenna structure (802) attached relative to the bottom surface of the circuit board. The antenna structure extends through an opening in the circuit board.

Description

Background Art

[0001] High-frequency integrated circuits (ICs) generate millimeter-wave signals from about 76 GHz to 81 GHz, such as those used in automotive radars. In conventional IC packaging, these signals are converted to planar transmission lines on a circuit board, such as through a ball grid array. The planar transmission line carries the signal from one location on the circuit board to another, such as from a signal ball pad to an external waveguide transmitter. The external waveguide can be used to feed a three-dimensional antenna.

[0002] Examples are described that may be improved in light of the above considerations. Summary of the invention

[0003] In one example, there is an apparatus comprising: a circuit board including a top surface and a bottom surface; a package including a bottom surface attached relative to the top surface of the circuit board; and an antenna structure attached relative to the bottom surface of the circuit board. The antenna structure extends through an opening in the circuit board.

[0004] Other aspects are also described and claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 is a diagram of a circuit board 100 .

[0006] Figure 2 A cross-sectional side view of circuit board 200 is shown.

[0007] Figure 3 is a perspective view of package 310 .

[0008] Figure 4 is a diagram of a circuit board 400 .

[0009] Figure 5 is a cross-sectional side view of package 502 .

[0010] Fig. 6A and 6B 3 and 4 are a plan view and a perspective view, respectively, of a signal transmitter in the form of a slot antenna 602.

[0011] Figure 6C and 6D illustrate Fig. 6A and 6B Additional partial perspective view of selected items of slot antenna 602.

[0012] Figure 7 is a diagram of a single ridge aperture for slot antenna 700.

[0013] Fig. 8A is a cross-sectional side view of antenna structure 802, and Figure 8Bis a perspective exploded view of the antenna structure 802 .

[0014] Figure 8C illustrate Fig. 8A and 8B A plan view of a portion of the interface area between structures. DETAILED DESCRIPTION

[0015] Specific examples are described in detail below with reference to the accompanying drawings. It should be understood that these examples are not intended to be limiting, and unless otherwise indicated, no features are required for any specific example. In addition, in the following description, a first feature formed above or on a second feature may include an example in which the first feature and the second feature are formed in direct contact, as well as an example in which an additional feature is formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact.

[0016] Routing high frequency signals through planar transmission lines increases the complexity and cost of manufacturing circuit boards and often results in signal power loss. Some integrated circuits (ICs) use a direct interface between the packaged IC device and an external waveguide, rather than a planar transmission line. The direct interface should have low coupling losses and high isolation between signal channels. In addition, the direct interface should also be robust to manufacturing and assembly tolerances.

[0017] The apparatus of the present disclosure may include a direct interface between an antenna structure and one or more slot antennas on an IC package. To achieve such a direct interface, a cutout portion of a circuit board may be removed or otherwise provided to allow an extension of the antenna structure to pass through the cutout in the circuit board and protrude toward the one or more slot antennas on the IC package. Thus, when the IC package is mounted on the circuit board, the slot antenna on the package may be in direct contact with or in close proximity to the extension of the antenna structure that protrudes through the cutout of the circuit board.

[0018] This design may allow for any one or more of a smaller antenna, a smaller circuit board cutout, and fewer ball grid array (BGA) balls in the system. In some instances, the system may be any one or more of less complex, easier to manufacture, and easier to assemble due to this design. Additionally, the system may have improved frequency characteristics and lower signal loss compared to other designs. Of course, these advantages are merely examples, and no advantage is required for any particular instance.

[0019] Examples of transmitter coupling mechanisms are described below with reference to the accompanying drawings. In this regard, Figure 1 1 is a diagram of a circuit board 100, such as a printed circuit board (PCB). The circuit board 100 includes a plurality (e.g., eight) waveguide launchers 102 positioned within a BGA formed by BGA balls 104. Figure 1 In the following figures, the xy (or xyz) coordinate direction is also illustrated, where Figure 1 In the drawings, the circuit board 100 is generally along the xy plane (and may have a thickness in the z dimension, understood to extend in the direction into the image). Directional references are for relative placement purposes, but these terms are not intended to be limiting as the device may be rotated in space and thereby change the absolute reference rather than the relative reference.

[0020] Additional example details of waveguide launchers and BGAs can be found in: U.S. Patent No. 11,196,146, entitled “Grounded BGA Wave-Guiding Interface Between an On-Package Signal Launch and an External Waveguide,” issued on December 7, 2021, and U.S. Patent Application No. 18 / 091,295, entitled “Wireless System Package,” filed on December 29, 2022, each of which is incorporated by reference in its entirety.

[0021] Most of the area on the circuit board 100 is occupied by the waveguide launchers 102 and the surrounding BGA balls 104, as indicated by the dashed black perimeter outline 106. Each waveguide launcher 102 on the circuit board 100 occupies the area of ​​two by four balls 104, for a total of eight balls. A rectangular perimeter of sixteen balls 104 surrounds each waveguide launcher 102, wherein the sixteen balls 104 are arranged in a four by six rectangle, wherein the inner twelve of those balls are not provided because the area is occupied by the launcher 102 surrounded by the balls. Each of the sixteen balls 104, as well as all of the balls within the dashed black perimeter outline 106, can be grounded to provide isolation for signals transmitted or received by the corresponding waveguide launcher 102. The balls 104 outside the dashed black perimeter outline 106 can be grounded, coupled to a power supply, coupled to an analog / digital converter in a package, or used for signal transmission (e.g., general purpose or dedicated input / output).

[0022] It may be desirable to reduce the area occupied by each waveguide launcher 102 and surrounding spheres 104 on the circuit board 100. For an equivalent space corresponding to a total of twenty-four spheres, each of the waveguide launchers 102 and surrounding spheres 104 on the circuit board 100 occupies a four by six area. The present disclosure describes techniques that may be used to reduce the area of ​​each waveguide launcher 102 and surrounding spheres 104 to, for example, four by five (twenty spheres), three by six (eighteen spheres), or three by five (fifteen spheres).

[0023] Reducing this area may allow for any one or more of: a smaller size of the circuit board 100, an increase in the number of waveguide launchers on the circuit board 100, and / or the addition of other functionality to the circuit board 100. For example, a smaller waveguide with a smaller BGA footprint may free up space on the circuit board 100 for other functionality. Although the techniques described herein are described in terms of reducing area on the circuit board 100, the techniques of the present disclosure may also be used with larger area waveguide launchers (e.g., Figure 1 ) in a four-by-six arrangement as shown in FIG.

[0024] Figure 2 A cross-sectional side view of a circuit board 200, an IC package 210, and an antenna structure 220 is shown. The IC package 210 is attached to the circuit board 200 via a BGA, which includes Figure 2 2. The antenna structure 220 is a circuit board 200 that is provided with a plurality of conductive balls 230. The antenna structure 220 includes two holes 240 and 250 (or openings) extending through the circuit board 200, and each of these holes 240 and 250 is aligned with the gap between the conductive balls 230. The antenna structure 220 also includes two channels 260 and 270, each of which is aligned with the two holes 240 and 250 extending through the circuit board 200. The two channels 260 and 270 may have a first portion having a first uniform shape (e.g., cylindrical) in the z dimension and closer to the circuit board 200, while further including a second portion having a second (e.g., frustoconical) shape in the z dimension away from the circuit board 200.

[0025] As an example, IC package 210 may include a signal transmitter in the form of a transmitter antenna 280 configured to transmit (e.g., transfer) a signal through a corresponding aperture (e.g., 240) in circuit board 200 and through a corresponding channel (e.g., 260) in antenna structure 220. The transmitted signal may pass through an area in the xy plane surrounded by some of balls 230 (some of the balls are in the Figure 2 , but other balls are not shown in the x-dimension). As another example, IC package 210 may include a signal transmitter in the form of a receiver antenna 290 that is configured to transmit (e.g., receive) the signal after the signal passes through a corresponding channel (e.g., 270) in antenna structures 220, through an aperture (e.g., 250) in circuit board 200, and through the area surrounded by ball 230 in the xy plane.

[0026] Figure 3310 is a perspective view of a package 310 in which two signal transmitters are incorporated, shown as patch antennas 312 and 314. Each of the patch antennas 312 and 314 is provided by a corresponding xy plane conductive plate in a corresponding region 312A and 314A. Each of the regions 312A and 312B is surrounded by a corresponding set of four by five BGA balls 316. The corresponding conductive plates acting as patch antennas 312 and 314 are coplanar (in the xy plane) with the first metal plane 318. Therefore, the regions 312A and 314A can be openings (e.g., square or rectangular) through the first metal plane 318. In addition, each of the regions 312A and 314A can consume an area that would otherwise be filled with a two by three BGA pattern, i.e., an area that accommodates six BGA balls. Below the first metal plane 318 (in the z-dimension), signal communication feeds 320 and 322 are each coupled to a respective one of the patch antennas 312 and 314, for example, by a conductive via (not visible in the perspective view shown). For example, the signal communication feed 320 can transmit a signal through its respective z-dimension via (not shown) to the patch antenna 312 surrounded by a 4×5 BGA ball array, from which the signal can be transmitted in the z-dimension. As another example, a signal can be received by the patch antenna 314 isolated by the surrounding 4×5 BGA ball array, wherein the signal is coupled to the signal communication feed 322 through a z-dimension conductive via (not shown). The signal communication feeds 320 and 322 can be coplanar (in the xy plane) with the second metal plane 340 and can be formed during the same step as the second metal plane 340. Second metal plane 340 is substantially parallel to first metal plane 318 , and first metal plane 318 and second metal plane 340 are separated from one another, for example, by one or more (eg, dielectric) layers.

[0027] Figure 3 Also illustrated in shaded form is an antenna structure 330 through which the signals described above may pass. The antenna structure 330 includes a channel 320A positioned in the signal path of the first patch antenna 312. The antenna structure 330 also includes a channel 320B positioned in the signal path of the second patch antenna 314. In the illustrated example, each of the channels 320A and 320B has a generally H-shaped cross-section in the xy plane, forming a double-ridged waveguide in the z dimension. Figure 2 and 3 In both, a circuit board (not shown) is positioned between the package and the antenna structure, which may leave an air gap between the package and the antenna structure.

[0028] Figure 4is a diagram of a circuit board 400 including a dual-ridge aperture 402. The aperture 402 has two ridges 404 and 406 formed by portions of the circuit board 400 extending inwardly toward the center of the aperture 402 and relative to the outermost rounded rectangular perimeter of the aperture 402. Thus, the combination of the outermost rounded rectangle and the inwardly extending ridges 404 and 406 give the aperture 402 a dog-bone or dumbbell shape in the xy plane. The aperture 402 is also surrounded by fourteen balls 408 arranged in a five by four arrangement.

[0029] The aperture 402 has an outer boundary that forms a wall 410 in the z dimension, and the wall 410 may be plated or otherwise coated with copper or another conductive material 412. Each of the balls 408 may be attached to the circuit board 400 by solder, and it may be necessary to prevent the solder from contacting the conductive material 412 on the wall 410 of the aperture 402. To prevent the solder from contacting the conductive material 412, the assembly process may include applying a solder mask to the circuit board 400 between the aperture 402 and the balls 408. After applying the solder mask to the circuit board 400, the assembly process may include attaching each ball 408 to a corresponding pad on the circuit board 400 (from the solder mask). Figure 4 After balls 408 are attached to circuit board 400, the solder mask may be removed.

[0030] The area of ​​the aperture 402 in the circuit board 400 may need to be small to maintain a sufficiently large distance between the ball 408 (or BGA pad) and the conductive material 412 of the aperture 402. This distance is Figure 4 The minimum design value of D1 (solder mask distance) can impose a lower limit on the BGA perimeter around each aperture 402. The difficulty and cost of milling and drilling small apertures (especially apertures with ridge features) can impose a lower limit on the size of each aperture 402.

[0031] In addition, the cutoff frequency of the signal waveguide may be inversely proportional to the cross-sectional area of ​​the waveguide. Therefore, a reduction in the cross-sectional area of ​​the aperture 402 may increase the cutoff frequency of the waveguide, which may act as a high pass filter. If the cutoff frequency is greater than the frequency of the signal conducted by the waveguide, the waveguide may prevent the signal from passing through. It may be necessary to design the aperture to be large enough so that the cutoff frequency is well below the lowest RF frequency.

[0032] Figure 5504 (e.g., PCB) via balls 506. In some examples, IC package 502 includes a signal transmitter (e.g., a slot antenna or a patch antenna) on or associated with a bottom surface of IC package 502. Signals transmitted or received by the transmitter will pass through the area (e.g., air gap) surrounded by balls 506 and through apertures 508 in circuit board 504 and pass under the gap in balls 506. Although Figure 5 504, but the signal can also pass through the antenna structure attached to the bottom surface of the circuit board 504. In order for the signal to travel between the transmitter and the antenna structure, the signal must be Figure 5 The z-dimension passes through the gap surrounded by ball 506 and aperture 508 in circuit board 504 .

[0033] As described in further detail below, reducing the distance between the transmitter and the antenna structure can improve the performance of the sensor device. For example, direct physical coupling (or nearly direct coupling) between the transmitter and the antenna structure can improve any one or more of cost, complexity of manufacturing and assembly, and frequency characteristics of the device.

[0034] Fig. 6A and 6B are respective plan and perspective views of a signal transmitter in the form of a slot antenna 602 that may be integrated into an IC package. Figure 6C and 6D illustrate Fig. 6A and 6B Additional partial perspective views of selected items of the slot antenna 602 are provided to assist in illustrating the various layering.

[0035] Figures 6A to 6C The view of FIG. 60 includes a first plane 604, which can be considered a bottom view, for example, from an aspect positioned along the bottom of the IC package, wherein the bottom of the IC package faces the first surface of the circuit board, wherein the antenna structure is located on a second surface of the circuit board opposite the first surface, as described later in Fig. 8A The first plane 604 may be metal incorporated into the IC package, with only a portion of the package shown for purposes of describing the slot antenna 602 .

[0036] The slot antenna 602 includes a radiating aperture 606. The radiating aperture 606 is formed as a gap, opening, or other passage through the first plane 604 so that a wave signal can pass through it in the z dimension. As an example, the radiating aperture 606 can have a rectangular or square perimeter shape. The radiating structure 606 can consume an area that would otherwise be filled with a one-by-three BGA pattern, i.e., an area that accommodates three BGA balls. Thus, for Figure 3 Compared to similar ball and pitch sizes, Fig. 6AThe antenna area in the antenna is approximately fifty percent smaller. The radiating aperture 606 may be isolated by one or more structures. For example, the pattern of conductive vias 608 may be formed to substantially surround a majority of the radiating aperture 606 and extend in the z dimension. As another example, a plurality of BGA balls 610 may also surround the radiating aperture 606. However, the BGA balls 610 are Fig. 6A and 6B The through-hole 608 extends upward in the middle, while the through-hole 608 extends downward, so the layout of the BGA balls 610 on the top of the first plane 604 can completely surround the radiation aperture 606, while the through-hole 608 below the first plane 604 partially extends around the radiation aperture 606, but also forms a path 612 away from the radiation aperture 606, as further described below.

[0037] The slot antenna 602 also includes a slot radiator 614. The slot radiator 614 is a conductor in a second plane position that may be different from and possibly parallel to the first plane 604 ( Figures 6A-6C ) of the second plane 616 ( Fig.6D) are formed simultaneously. The second plane 616 may be metal and may be below the first plane 604 in the z dimension. The slot radiator 614 extends through the path 612 (and receives signal protection through the through hole 608 in the path), arrives at the area of ​​the radiating aperture 606 and leaves the area. The slot radiator 614 has a predetermined shape in the xy plane, such as a rectangle, as it extends along the path 612, and the shape is uniform (continuous and unchanging) in a first direction until the slot radiator 614 terminates at the radiator tip 614T and in the opposite direction to the xy boundary of the slot radiator 614 extending beyond the radiating aperture 606 in the xy plane. This is in contrast to other signal transmitters that may include a radiating element on one plane, a radiating patch on another plane having an area larger than the radiating element (when considered in the z dimension within the boundaries of the surrounding radiating aperture 606), and a through hole between them. Remote from the radiating aperture 606, the slot radiator 614 may be connected to an additional structure (not shown), wherein the additional structure provides a signal to be transmitted, or further receives a signal received within the radiating aperture 606 from the slot radiator 614. The radiator tip 614T provides an end located in the radiating aperture 606 in a first dimension (e.g., z dimension), wherein the tip 614T is also within the outer boundary of the radiating aperture 606 in a second and third dimension (x and y dimensions). Thus, the slot antenna 614 including the combination of the radiator tip 614T and the radiating aperture 606 can transmit or receive electromagnetic wave signals through the z dimension, and is generally defined by the xy plane perimeter of the radiating aperture 606. Finally, as part of or relative to the slot antenna 602, a third plane 618 may be included in the configuration. The third plane 618 may act as a back reflector to the cavity provided by the radiating aperture 606. In an example, the third plane 618 is a conductive surface and acts as a reflector, and the distance from the first plane 604 (and the radiating aperture 606) is one quarter of the wavelength of the wave signal to be transmitted by the slot antenna 602 in order to obtain appropriate performance from the system. Deviation from the correct distance will result in reduced performance bandwidth and reduced gain. The through hole 608 can extend to each of the first plane 604, the second plane 616, and the third plane 618. Therefore, each of these planes can have the same potential (e.g., ground).

[0038] As can be appreciated from the above, the slot antenna 602 may occupy an area of ​​approximately three balls 610. Due to the small size of the balls 610, the balls may be arranged in a three by five perimeter around the radiating aperture 606. Despite having a smaller size, the slot antenna 602 may also provide one or more of various other advantageous attributes. The slot antenna 602 may have a larger return loss bandwidth below a threshold level than a similarly sized patch antenna. By way of example only, the slot antenna 602 may have a return loss bandwidth of approximately 6.0 GHz with a return loss less than -20 dB, while the patch antenna may have a bandwidth of 2.5 GHz with a return loss less than -20 dB. The insertion loss of both types of antennas may be approximately -1 dB over the relevant bandwidth.

[0039] Figure 7 is a diagram of a single ridge aperture for slot antenna 700. Figure 7 A circuit board 702 is shown including a spine 704, and Figure 7 Also shown is an IC package 706 that includes the slot antenna 700. The slot antenna 700 is small enough to fit within a three by five BGA perimeter. Given the relationship between size and cutoff frequency, the slot antenna 700 can have a relatively low cutoff frequency. The ridges 704 can reduce this cutoff frequency to a more acceptable level.

[0040] like Figure 7 As shown in , an aperture in the circuit board 702 is surrounded by a perimeter of three by five BGA balls 708. Depending on the BGA pitch, the size of this aperture may be less than two millimeters by one millimeter. Producing an aperture of this size in the circuit board 702 by, for example, milling may be difficult and expensive, especially if the fabrication includes metal deposition in the aperture. In contrast, and as shown below, a ridgeless, single-ridged shape, or dual-ridged shape may be designed into the antenna structure rather than milling the shape into the circuit board 702. In addition, metal deposition (e.g., electroplating) may be performed on the antenna structure rather than on the circuit board.

[0041] Fig. 8A is a cross-sectional side view of antenna structure 802 including bottom planar surface 802PS, and Figure 8B 802 includes an extension 804 (eg, in the z dimension) protruding from a planar surface 802PS. Figure 8B , and in Fig. 8A The outline is usually drawn in dashed form). Figure 8B Extension 804 is depicted as being generally square or rectangular, but extension 804 may have a different shape, such as circular or oval, and / or extension 804 may have rounded corners. Figure 8B The three exploded diagram components are as follows Fig. 8A, extension 804 may extend through opening 806 in circuit board 808. Opening 806 may be formed as an aperture or cutout by removing material in a desired area or avoiding forming material in a desired area. Circuit board 808 is between IC package 810 and antenna structure 802. For example, IC package 810 may be larger than opening 806 in the x-dimension and the y-dimension and may be attached to a first surface of circuit board 808, while antenna structure 802 may be attached to a second surface of circuit board 808 opposite the first surface. IC package 810 includes one or more radiators 812 ( Fig. 8A ). Each of the radiators 812 may take a variety of forms, such as, but not limited to, the slot antenna 602 of the previous figure. The extension 804 fits through the opening 806 and extends to contact the bottom of the package 810 or is located in close proximity to the bottom (e.g., in the range of 100 μm to 200 μm). The antenna structure 802 includes one or more waveguide channels 814 or passages / openings that pass through the material forming the antenna structure 802 in a one-to-one correspondence and are aligned with each of the one or more radiators 812. Thus, in Fig. 8A In the embodiment of the present invention, each waveguide channel 814 generally provides a z-dimensional radio frequency (RF) path or electromagnetic wave coupling mechanism for signals radiated to or from the corresponding transmitter 812. Also, the cross-sectional shape of each waveguide channel 814 in the xy plane can be a rectangle with zero, one, two or more ridges. By directly coupling to the bottom surface of the IC package 810, the antenna structure 802 can eliminate any air gap between the IC package 810 and the antenna structure 802. Eliminating such an air gap can reduce leakage that may occur when a signal is transmitted between the transmitter 812 on the IC package 810 and the antenna structure 802.

[0042] Figure 8C A plan view of a portion of the interface area between antenna structure extension 804 and the bottom surface of IC package 810 is illustrated. Figure 8C As can be seen from the perspective view of FIG. 8 , each waveguide channel 814 is surrounded by a BGA contact pad 816 to which a BGA ball can be connected. However, those BGA balls are eliminated in a portion of the bottom surface of the IC package 810 so that the extension 804 can be positioned in contact with or close to the bottom surface of the IC package 810. Elsewhere, outside the boundaries of the antenna structure extension 804, a corresponding BGA ball 818 is positioned adjacent to the BGA contact pad (not visible, in each case below the BGA ball). And, from Fig. 8A and 8B ,refer to Figure 8CIt should be understood that each waveguide channel 814 is aligned with a corresponding one of the packaged transmitters 812. Also, in the illustrated example, the surrounding BGA contact pads 816 are in a four by three pattern around each waveguide channel 814. Furthermore, only a total of three BGA contact pads 816 are absent in the locations of the waveguide channels 814.

[0043] If the bottom surface of the IC package 810 has eight radiators 812, then, by way of example only, the antenna structure 802 may include a single extension 804 having eight waveguide channels 814, or the antenna structure 802 may include more than one extension 804, each of which has one or more waveguide channels 814. Also, if the antenna structure 802 has multiple extensions 804, the circuit board 808 may include a single opening 806 through which the multiple extensions fit, or alternatively, the circuit board 808 may have multiple openings that correspond one-to-one with each of the extensions of the antenna structure, for example. The antenna structure 802 having a single extension 804 and the circuit board 808 having a single opening 806 may be easier to manufacture than creating multiple extensions on the antenna structure 802 and multiple openings on the circuit board 808. In the example where the antenna structure 802 has more than one waveguide channel 814, each waveguide channel 814 may be electrically isolated from the other waveguide channels. In some examples, a waveguide channel extends laterally outward from a single protrusion to route signals to / from an antenna aperture and / or other interface.

[0044] Using openings 806 instead of waveguides built into circuit board 808 can reduce cost and complexity because the process of milling waveguides into circuit board 808 can be eliminated. Building waveguide channels into antenna structure 802 can be easier and less expensive than building waveguides into circuit board 808. In addition, Figures 8A-8C The design shown in FIG. 8 can reduce signal loss, particularly since there is no air gap between the bottom surface of package 810 and antenna structure 802 (including its extension 804 ).

[0045] In addition, the antenna structure 802 can be designed to prevent solder from bridging from the BGA pad to the waveguide channel in the antenna structure 802. For example, the antenna structure 802 may include one or more waveguide channels coated or plated with metal. During the process of attaching the IC package 810 to the other components shown, the solder will not be near these waveguide channels. In addition, after the bottom surface of the IC package 810 is soldered to the top surface of the circuit board 808, the antenna structure 802 can be attached to the bottom surface of the circuit board 808. Therefore, compared with electroplating the waveguide through the circuit board 808, there is a reduced or almost no risk that the solder will bridge between the BGA pad and the waveguide channel. In addition, there is a reduced or almost no risk that the solder mask will inadvertently enter the waveguide channel of the antenna structure 802.

[0046] The antenna structure 802 may include materials such as nylon, aluminum, polymers, or plastics, which may include deposited metals, such as copper. The deposited metal may be formed over the contours of each waveguide channel 814 using electroplating or any other means for metal deposition. In instances where the antenna structure 802 is metal, the antenna structure 802 may not include additional metal deposition and / or metal plating. Although Figures 8A-8B The waveguide channels are depicted as being generally in the z-dimension, but the channels may be routed in any direction through the antenna structure 802. Each of the waveguide channels in the antenna structure 802 may have a single ridge design (see, e.g., Figure 7 ) or a double ridge design (see e.g. Figure 4 ) to improve the frequency characteristics of the corresponding waveguide channel. The improved frequency characteristics can allow the plate opening 806 to be designed to be smaller without reducing performance.

[0047] In this specification, the term "coupled" may encompass connections, communications, or signal paths that enable a functional relationship consistent with this specification. For example, if device A generates a signal to control device B to perform an action, then: (a) in a first instance, device A is coupled to device B through a direct connection; or (b) in a second instance, device A is coupled to device B through an intermediate component C, provided that the intermediate component C does not change the functional relationship between device A and device B, so that device B is controlled by device A via the control signal generated by device A.

[0048] It should be understood that the present disclosure provides multiple exemplary embodiments, and these embodiments can be modified. Such modifications are clearly within the scope of the present disclosure. In addition, it is consistent with the present disclosure and expected by the present disclosure to apply these teachings to other environments, applications and / or purposes.

Claims

1. A device comprising: a circuit board comprising a top surface and a bottom surface; a package comprising a bottom surface attached relative to the top surface of the circuit board; as well as an antenna structure attached relative to the bottom surface of the circuit board, and Wherein the antenna structure extends through an opening in the circuit board. 2 . The apparatus of claim 1 , wherein the bottom surface of the package is coupled to the top surface of the circuit board, and the antenna structure is coupled to the bottom surface of the circuit board.

3. The device of claim 1, wherein the package includes at least one signal transmitter and the antenna structure includes at least one waveguide channel positioned for signal communication with the at least one signal transmitter. The apparatus of claim 3 , wherein the antenna structure physically contacts the package.

5. The device of claim 3, wherein the at least one waveguide channel is a metal-coated waveguide channel.

6. The device of claim 5, wherein the metal-coated waveguide channel has a rectangular cross-section with ridges.

7. The device according to claim 5, wherein the metal-coated waveguide channel is a first metal-coated waveguide channel, and Wherein the antenna structure comprises a second metal coated waveguide channel, the second metal coated waveguide channel being positioned for signal communication with an additional signal transmitter of the package.

8. The device of claim 7, wherein each of the at least one signal transmitter and the additional signal transmitter comprises a slot antenna.

9. The apparatus of claim 8, wherein the slot antenna comprises: a first plane having an orifice; as well as A radiating element is aligned in a plane parallel to and separated from the first plane, the radiating element having a tip aligned in a position in the first dimension within the boundaries of the aperture in the second and third dimensions.

10. The device of claim 9, wherein the radiating element has a uniform shape at the location and in a region extending beyond the boundary of the aperture in the second and third dimensions.

11. The device of claim 3, wherein the at least one signal transmitter comprises a slot antenna.

12. The apparatus of claim 11, wherein the slot antenna comprises: a first plane having an orifice; as well as A radiating element is aligned in a plane parallel to and separated from the first plane, the radiating element having a tip aligned in a position in the first dimension within the boundaries of the aperture in the second and third dimensions.

13. The device of claim 12, wherein the radiating element has a uniform shape at the location and in a region extending beyond the boundary of the aperture in the second and third dimensions.

14. The device of claim 1, further comprising a ball grid array (BGA) coupled to the top surface of the circuit board, wherein the bottom surface of the package is coupled to the top surface of the circuit board via the BGA.

15. The apparatus of claim 1, wherein the opening in the circuit board is a first opening, and wherein the antenna structure comprises: a first extension that protrudes through the first opening in the circuit board; and a second extension that protrudes through the second opening in the circuit board to couple to the bottom surface of the package.

16. The device of claim 1, wherein the antenna structure comprises: an extension that protrudes through the opening in the circuit board, At least two waveguide channels are provided in the extension.

17. The device according to claim 16, wherein the package comprises at least two signal transmitters, and Wherein each of the at least two waveguide channels is positioned for signal communication with a corresponding signal transmitter of the at least two signal transmitters.

18. An apparatus comprising: a circuit board comprising a surface and a cutout through the surface; an antenna structure coupled to the surface of the circuit board, and wherein the antenna structure includes an extension that protrudes through the cutout in the circuit board, and The antenna structure further includes a waveguide channel extending through the extension portion in the antenna structure.

19. The device of claim 18, further comprising a package including a bottom surface coupled to the circuit board, Wherein the bottom surface of the package is also coupled to the extension of the antenna structure.

20. The device of claim 19, wherein the package includes a slot antenna on the bottom surface of the package, wherein the slot antenna is coupled to the waveguide channel.

Images