Conductive elastic connecting piece and electronic equipment

Abstract

The invention provides a conductive elastic connecting piece and electronic equipment, the conductive elastic connecting piece comprises a bubble core, the bubble core comprises a porous bubble body and a conductive layer located on the porous bubble body, and nanowires are attached to the inner part and the outer surface of the porous bubble body to form the conductive layer. The LED bulb further comprises a first conductive adhesion layer, a second conductive adhesion layer, a first conductive film and a second conductive film, the first conductive adhesion layer is located on the first surface of the bulb core, the second conductive adhesion layer is located on the second surface of the bulb core, the first conductive film is stacked on the first conductive adhesion layer, and the first conductive film is used for being electrically connected with a first element. The second conductive film layer is stacked on the second conductive adhesion layer, and the second conductive film is used for being electrically connected with a second element. A low-pressure and low-PIM conductive elastomer can be formed by bonding the conductive film on the bubble body attached with the nanowire, and long-term stable low-PIM performance is achieved.

Description

Conductive elastic connector and electronic device Technical Field

[0001] The present application relates to the field of conductive connectors, and in particular to a conductive elastic connector and an electronic device. Background Art

[0002] In order to improve the working performance of electronic equipment, reduce radio frequency interference between devices, increase the isolation between devices, reduce the risk of electronic static electricity, etc. Electronic equipment usually needs to be grounded, and the devices in the electronic equipment also need to be grounded. For example, the camera module needs to be grounded to avoid interference from the radio frequency signal from the antenna. The display module also needs to be grounded to avoid electromagnetic noise affecting the normal operation of the display module. Usually, the antenna, display module or camera module is grounded through a conductive elastic connector, where the conductive elastic connector has compression and rebound characteristics, which can generate a certain pressure (rebound force) to firmly connect the devices. In addition, the conductive elastic connector is conductive and can achieve electromagnetic shielding or electrical connection.

[0003] As the functions of electronic devices become more diverse, the devices they contain also become more diverse. As the number of devices increases, the space inside the electronic devices is very limited. Therefore, a conductive elastic connector is needed to achieve electrical connection between different devices or to ground different devices.

[0004] Utility Model Content

[0005] The embodiments of the present application provide a conductive elastic connector and an electronic device. The conductive elastic connector has low harmonic characteristics, a wide operating range, and excellent reliability, and can achieve long-term stable low harmonic performance.

[0006] In the first aspect, an embodiment of the present application provides a conductive elastic connector, which is used to connect a first element and a second element. The conductive elastic connector includes a bubble core, which includes a porous bubble body and a conductive layer located on the porous bubble body. The conductive layer is a conductive layer formed by nanowires attached to the inside and outside of the porous bubble body. By forming a conductive layer of nanowires on the inside and outside of the porous bubble body, the problem of deterioration of grounding impedance caused by the breakage of the conductive layer can be reduced or avoided, so that stable low impedance can be achieved within a larger compression range, and the generation of high harmonics can be avoided. Since nanowires are used as the conductive layer, the strength of the nanowires and the bonding force with the bubble body are relatively high, which can also reduce the problem of unstable grounding impedance caused by the shedding of the conductive layer.

[0007] Furthermore, when the porous foam core is compressed, the pressure (or rebound force) slowly increases, allowing the second region to be compressed within a wider range, corresponding to a force less than the upper limit. Consequently, the third region of the conductive elastic connector has a wider compression range, meaning the conductive elastic connector has a wider operating range for simultaneously meeting both impedance and pressure requirements.

[0008] The bubble core has a first surface and a second surface arranged opposite to each other. The conductive elastic connector also includes a first conductive adhesive layer and a second conductive adhesive layer. The first conductive adhesive layer is located on the first surface of the bubble core, and the second conductive adhesive layer is located on the second surface of the bubble core.

[0009] The conductive elastic connector also includes a first conductive film and a second conductive film. The first conductive film is stacked on the first conductive adhesive layer and is used to electrically connect to the first element. The second conductive film is stacked on the second conductive adhesive layer and is used to electrically connect to the second element.

[0010] By bonding the first conductive film to the first conductive adhesive layer, the strength of the first conductive adhesive layer is strengthened, the continuity of the first conductive adhesive layer under pressure is improved, and the problem of the first conductive adhesive layer, which has a relatively small thickness, breaking or rupturing (such as breaking into granules, etc.) when the conductive elastic connector is compressed, which causes the bubble core and the first element to fall off is reduced or avoided. Correspondingly, the second conductive film can also strengthen the strength of the second conductive adhesive layer, improve the continuity of the second conductive adhesive layer under pressure, reduce or avoid the phenomenon of the bubble core and the second element falling off due to the second conductive adhesive layer being compressed and ruptured, thereby effectively improving the bonding strength between the conductive elastic connector and the first element and the second element, and improving the reliability of the conductive elastic connector. By bonding a conductive film to the bubble body with nanowires attached, a low-pressure and low-PIM conductive elastomer can be formed, achieving long-term stable low-PIM performance.

[0011] In combination with the first aspect, in one possible implementation, the thickness of the first conductive film and the second conductive film is 0.01-0.1 mm, which can effectively strengthen the adhesion layer and reduce problems such as breakage of the adhesion layer under pressure.

[0012] In combination with the first aspect, in one possible implementation, the first conductive film and the second conductive film are conductive cloth or copper foil.

[0013] In combination with the first aspect, in one possible implementation, the thickness of the first conductive adhesive layer and the second conductive adhesive layer is 2 μm-20 μm, thereby achieving good connection between the first conductive film, the second conductive film and the bubble core.

[0014] In conjunction with the first aspect, in one possible implementation, the first and second conductive adhesive layers are conductive silver paste. The first and second conductive adhesive layers, the cell core, the first and second conductive films form an integrated structure. The conductive silver paste ensures good bonding between the conductive silver paste and the conductive layer of the cell core, while also ensuring electrical conductivity between the first and second conductive films and the cell core.

[0015] In combination with the first aspect, in one possible implementation, the porous foam has a density of less than 200 kg / m 3 Low-density porous foam. The low-density porous foam can achieve 85% deformation, significantly improving the performance of the conductive elastic connector.

[0016] In conjunction with the first aspect, in one possible implementation, the porous foam has inner and outer pores, with multiple conductive layers attached to the walls of the inner and outer pores. The inner pores are located within the porous foam, while the outer pores are located on the outer surface of the foam structure. The inner pores provide support for the foam core. Furthermore, the outer pores allow for multiple conductive layers to be attached to the walls of the outer pores, ensuring conductivity on the outer surface of the foam core and achieving electrical continuity between the first and second conductive films.

[0017] In conjunction with the first aspect, in one possible implementation, the inner pores include at least one of closed pores and open pores. The conductive elastic connector structure includes both open and closed pores, which allows for both rigidity and stability while also providing flexibility and flexibility by adjusting the position or area of ​​the open pores.

[0018] In conjunction with the first aspect, in one possible implementation, the diameter of the pores of the porous foam is 30 μm to 500 μm. In this way, after the nanowires are attached to the pore walls, the compressible space and rebound force of the porous foam meet the working range requirements.

[0019] In conjunction with the first aspect, in one possible implementation, the nanowire diameter is between 10 μm and 50 nm. This allows the nanowire to be more firmly coated on the inner hole wall, preventing the nanowire from falling off under pressure and causing the generation of high harmonics. Furthermore, by setting the diameter range between 10 nm and 50 nm, a lower ground impedance can be achieved.

[0020] In conjunction with the first aspect, in one possible implementation, the ratio of the length to the diameter of the nanowire is between 1000:1 and 5000:1. This can prevent the nanowire from breaking when the conductive elastic connector is subjected to pressure, thereby ensuring that the nanowire has rigidity and stability.

[0021] In combination with the first aspect, in one possible implementation, the nanowire is at least one of nanosilver, nanocopper, carbon nanowire, and nanogold.

[0022] In combination with the first aspect, in one possible implementation method, the porous foam is a three-dimensional network structure, the network structure is attached with a multi-layer conductive layer, and the conductive layer is a multi-layer nanowire layer, which can achieve high conductivity and has a high bonding force with the porous foam. While improving the conductivity, it can also avoid the risk of short circuit caused by problems such as breakage and falling off of the conductive layer.

[0023] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a first element, a second element, and any one of the above-mentioned conductive elastic connectors.

[0024] The first conductive film of the conductive elastic connecting member is electrically connected to the first element, and the second conductive film of the conductive elastic connecting member is electrically connected to the second element.

[0025] In combination with the second aspect, in one possible implementation, the electronic device further includes a conductive adhesive, wherein the conductive adhesive is provided between the first conductive film and the first element, and the conductive adhesive is provided between the second conductive film and the second element.

[0026] In combination with the second aspect, in one possible implementation, the first component is a middle frame, and the second component is at least one of an antenna bracket, a display module, a shielding cover, or a camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a hardware architecture diagram of an electronic device provided in an embodiment of the present application;

[0028] FIG2 is a schematic diagram of a conductive elastic connector provided in an embodiment of the present application;

[0029] FIG3A is a schematic diagram of a conductive elastic connector provided in an embodiment of the present application;

[0030] FIG3B is a graph showing the relationship between compression, impedance, and pressure of a conductive elastic connector provided in an embodiment of the present application;

[0031] FIG4 is a schematic cross-sectional view of a FOF foam;

[0032] FIG5 is a schematic cross-sectional view of a conductive elastic connector provided in an embodiment of the present application;

[0033] FIG6 is an electron microscope photograph of a conductive layer on a porous bubble in a conductive elastic connector provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0035] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0036] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this embodiment, unless otherwise specified, "plurality" means two or more.

[0037] The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0038] In addition, in this application, directional terms such as "upper", "lower", "front", and "back" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, and they may change accordingly according to changes in the orientation of the components in the drawings.

[0039] It should be noted that the "electrical connection" in the embodiments of the present application should be understood in a broad sense, and may include direct physical connection, coupled connection through capacitors, conductive fabrics, or conductive adhesives (or other materials), or a combination of coupled connection and direct physical connection.

[0040] It should also be noted that the shape descriptions such as “rectangular” and “circular” in the embodiments of the present application may include approximate shapes. Taking into account actual processing errors, the approximate shapes are also within the scope of the embodiments of the present application.

[0041] The present application relates to a conductive elastic connector, an electronic device, and a method for preparing the conductive elastic connector. The following briefly describes the concepts involved in the present application:

[0042] Foam: a material obtained by foaming plastic particles, silicone particles or rubber particles. Foams include but are not limited to polyurethane (PU) foam, silicone foam, polyethylene (PE) foam, polypropylene (PP) foam, styrene-butadiene rubber foam, acrylate foam, vinyl acetate foam, vinylidene chloride foam, nitrile foam, silicone foam, acrylamide foam, natural rubber foam, polyvinyl chloride foam, polysulfide rubber foam, styrene-acrylate copolymer foam, vinyl acetate-acrylate copolymer foam, silicone-acrylate copolymer foam and modified silicone-acrylate copolymer foam.

[0043] Foaming: It is the process of producing a microporous structure in plastics, silicone or rubber. During the foaming molding process or in foaming polymer materials, a honeycomb or porous structure is formed by the addition and reaction of physical or chemical foaming agents.

[0044] Foaming agent: also known as foaming material, refers to a material that can vaporize inside plastic, silicone or rubber to produce bubbles and make it a porous substance. Foaming agents include but are not limited to azo compounds, sulfonylhydrazide compounds, nitroso compounds, sodium bicarbonate, sodium carbonate, n-pentane, n-hexane, n-heptane, petroleum ether (also known as naphtha), trichlorofluoromethane, dichlorodifluoromethane and dichlorotetrafluoroethane.

[0045] Devices: These are electronic components and small components, typically made up of several parts, that can be used across similar products. Devices include, but are not limited to, camera modules, display modules, sensors, and earpieces. Certain devices susceptible to electromagnetic interference signals (such as cameras and displays) have shielding covers that are connected to a reference ground via conductive elastic connectors to provide signal shielding.

[0046] Static electricity: Static electricity is a common phenomenon in our daily lives. It refers to the accumulation of electric charges on the surface of objects, which causes the surface to generate a higher potential. As electronic devices become more versatile, the circuits within them are getting closer and closer to the surface of the device. Static electricity on the surface of the device or on the surface of external objects can enter the device through gaps in the surface and affect the normal operation of electronic components.

[0047] Electromagnetic interference (EMI): There are two types of interference: conducted interference and radiated interference. Conducted interference refers to the coupling of a signal on an electrical network to another electrical network through a conductive medium. Radiated interference refers to the coupling of an interference source's signal to another electrical network through space. The electromagnetic interference in the embodiments of the present application refers to radiated interference. In high-speed printed circuit boards (PCBs) and system designs, high-frequency signal lines, integrated circuit pins, various connectors, etc. may become radiated interference sources with antenna characteristics, which can emit electromagnetic waves and affect the normal operation of other systems or other subsystems within the system.

[0048] Working Range: As shown in Figure 3B, the working range of the conductive elastic connector is the range of the abscissa (compression) corresponding to the third region. In this embodiment of the application, the compression range of the conductive elastic connector corresponding to the third region that meets the impedance and pressure requirements is defined as the working range of the conductive elastic connector.

[0049] As mobile phones become increasingly versatile, the frequency bands covered by their antennas are expanding, while the thickness of the entire device is shrinking. Consequently, grounding requirements in the RF field are becoming increasingly important. On the one hand, it is necessary to address antenna clutter and improve antenna performance. On the other hand, it is necessary to reduce electromagnetic interference between devices or modules, improve the device's anti-interference capabilities, and take into account EMC (electromagnetic compatibility) issues. For example, when the antenna is transmitting and receiving signals, the display screen is prone to flickering due to interference from RF signals, or the camera module is susceptible to interference from RF signals. Furthermore, ESD (electrostatic discharge) is also an issue that needs to be addressed. For example, for antennas, it is necessary to avoid the nonlinear introduction of other stray radiation to ensure the antenna's radiation performance.

[0050] To reduce RF interference between devices, increase isolation between devices, mitigate the risk of device damage caused by ESD, and improve device performance (for example, improving the performance of antennas and display modules), RF terminal devices require grounding. For example, camera modules, antenna modules, and the back cover or midframe of electronic devices require grounding.

[0051] In electronic devices such as mobile phones, televisions, monitors, notebooks, PDAs, and car navigation systems, conductive elastic connectors are usually used to ground devices that need to be grounded. Grounding includes connecting to a reference ground. It should be understood that the device includes a shielding cover or shielding case used for grounding on the electronic device.

[0052] FIG1 shows a schematic structural diagram of an electronic device including a display module, a camera module and an antenna.

[0053] The electronic device 100 may include at least one of a mobile phone, a foldable electronic device, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a wearable device, an in-vehicle device, a smart home device, or a smart city device. The embodiments of the present application do not impose any particular restrictions on the specific type of the electronic device 100.

[0054] The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) connector 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera module 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0055] It should be understood that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0056] The processor 110 may include one or more processing units, for example: the processor 110 may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units can be independent devices or integrated into one or more processors. In some embodiments, the processor may include a first processor 1101 (e.g., a collaborative processor) and a second processor 1102 (e.g., an application processor).

[0057] The processor can generate operation control signals based on instruction opcodes and timing signals to complete the control of instruction fetching and execution.

[0058] Processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in processor 110 may be a cache memory. This memory can store instructions or data that have been used or are frequently used by processor 110. When processor 110 needs to use the instruction or data, it can directly access it from this memory. This avoids duplicate accesses, reduces processor 110 latency, and thus improves system efficiency.

[0059] In some embodiments, the processor 110 may include one or more interfaces. The interface may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface. The processor 110 may be connected to a touch sensor, an audio module, a wireless communication module, a display, a camera, or other modules through at least one of the above interfaces.

[0060] It is understood that the interface connection relationship between the modules illustrated in the embodiments of the present application is merely an illustrative illustration and does not constitute a structural limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may also adopt different interface connection methods from the above embodiments, or a combination of multiple interface connection methods.

[0061] The USB connector 130 is an interface that complies with USB standard specifications and can be used to connect the electronic device 100 and peripheral devices. Specifically, it can be a Mini USB connector, a Micro USB connector, a USB Type C connector, etc. The USB connector 130 can be used to connect a charger to enable the charger to charge the electronic device 100, and can also be used to connect other electronic devices to enable data transmission between the electronic device 100 and other electronic devices. It can also be used to connect headphones to output audio stored in the electronic device through the headphones. The connector can also be used to connect other electronic devices, such as VR devices. In some embodiments, the standard specifications of the universal serial bus can be USB1.x, USB2.0, USB3.x and USB4.

[0062] The charging management module 140 is used to receive the charging input of the charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 can receive the charging input of the wired charger through the USB connector 130. In some wireless charging embodiments, the charging management module 140 can receive the wireless charging input through the wireless charging coil of the electronic device 100. While the charging management module 140 charges the battery 142, it can also power the electronic device through the power management module 141. In some embodiments, the charging management module 140 needs to be grounded. Alternatively, the charging management module 140 needs to add a shielding cover, wherein the shielding cover is grounded, so as to avoid mutual interference between the charging management module 140 and other modules (for example, antennas or radio frequency devices).

[0063] The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and provides power to the processor 110, the internal memory 121, the display 194, the camera module 193, and the wireless communication module 160. The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle count, battery health status (leakage, impedance), etc. In some other embodiments, the power management module 141 can also be set in the processor 110. In other embodiments, the power management module 141 and the charging management module 140 can also be set in the same device.

[0064] The wireless communication function of the electronic device 100 can be implemented through the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.

[0065] Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In other embodiments, the antennas can be used in conjunction with a tuning switch.

[0066] The mobile communication module 150 can provide solutions for wireless communications including 2G / 3G / 4G / 5G applied to the electronic device 100. The mobile communication module 150 may include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, and filter, amplify, and process the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modulation and demodulation processor, and convert it into electromagnetic waves for radiation through the antenna 1. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be set in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be set in the same device as at least some of the modules of the processor 110.

[0067] The modem processor may include a modulator and a demodulator. The modulator is used to modulate the low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After being processed by the baseband processor, the low-frequency baseband signal is passed to the application processor. The application processor outputs a sound signal through an audio device (not limited to the speaker 170A, the receiver 170B, etc.) or displays an image or video through the display screen 194. In some embodiments, the modem processor may be an independent device. In other embodiments, the modem processor may be independent of the processor 110 and be set in the same device as the mobile communication module 150 or other functional modules.

[0068] The wireless communication module 160 can provide wireless communication solutions for the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), Bluetooth low energy (BLE), ultra wide band (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc. The wireless communication module 160 can be one or more devices that integrate at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110. The wireless communication module 160 can also receive the signal to be sent from the processor 110, frequency modulate it, amplify it, and convert it into electromagnetic waves for radiation through the antenna 2.

[0069] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, so that electronic device 100 can communicate with a network and other electronic devices via wireless communication technology. The wireless communication technology may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology. The GNSS may include a global positioning system (GPS), a global navigation satellite system (GLONASS), a Beidou navigation satellite system (BDS), a quasi-zenith satellite system (QZSS) and / or a satellite-based augmentation system (SBAS).

[0070] In some embodiments, antenna 1 and antenna 2 need to be grounded. On the one hand, this allows the antenna to function properly, and on the other hand, it prevents the electromagnetic radiation generated by the antenna from coupling into other modules and causing interference. For example, electromagnetic radiation generated by the antenna can easily couple into a display screen or camera module, affecting the normal operation of the display screen or camera module. It should be understood that in some embodiments, antenna 1 and / or antenna 2 can be installed in an electronic device in the form of an antenna module, where the module includes an antenna and a radio frequency integrated circuit.

[0071] Electronic device 100 can implement display functions using a GPU, display screen 194, and an application processor. A GPU is a microprocessor for image processing that connects display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or modify display information.

[0072] Display screen 194 is used to display images, videos, and the like. Display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a MiniLED, a MicroLED, a Micro-oLed, or a quantum dot light-emitting diode (QLED). In some embodiments, electronic device 100 may include one or more display screens 194.

[0073] In some embodiments, the display screen 194 needs to be grounded. By grounding, the anti-interference capability of the display screen 194 can be enhanced, and noise caused by electromagnetic interference can be avoided, which may cause abnormal display of the display screen.

[0074] The electronic device 100 can realize the camera function through the camera module 193, ISP, video codec, GPU, display screen 194, application processor AP, neural network processor NPU, etc.

[0075] The camera module 193 can be used to capture color image data and depth data of the subject. The ISP can be used to process the color image data captured by the camera module 193. For example, when taking a photo, the shutter is opened, and light is transmitted through the lens to the camera's photosensitive element. The light signal is converted into an electrical signal, which is then transmitted to the ISP for processing and converted into a visible image. The ISP can also optimize parameters such as exposure and color temperature of the captured scene. In some embodiments, the ISP can be located in the camera module 193.

[0076] In some embodiments, the camera module 193 may be composed of a color camera module and a 3D sensing module.

[0077] In some embodiments, the photosensitive element of the camera of the color camera module can be a charge coupled device (CCD) or complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then transmitted to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard format such as RGB or YUV.

[0078] In some embodiments, the 3D sensing module can be a time of flight (TOF) 3D sensing module or a structured light 3D sensing module. Structured light 3D sensing is an active depth sensing technology, and its basic components may include an infrared emitter, an IR camera module, and the like. The operating principle of a structured light 3D sensing module is to first emit a specific pattern of light spots at the object being photographed, then receive the light spot pattern coding on the object's surface, compare the differences with the original projected light spot, and calculate the object's three-dimensional coordinates using triangulation principles. These three-dimensional coordinates include the distance between the electronic device 100 and the object being photographed. TOF 3D sensing can be an active depth sensing technology, and its basic components may include an infrared emitter, an IR camera module, and the like. The operating principle of a TOF 3D sensing module is to calculate the distance (i.e., depth) between the TOF 3D sensing module and the object being photographed based on the time it takes for the infrared light to return, thereby generating a 3D depth map.

[0079] Structured light 3D sensing modules can also be used in areas such as motion-sensing game consoles and industrial machine vision inspection. Time of Flight 3D sensing modules can also be used in areas such as game consoles and augmented reality (AR) / virtual reality (VR).

[0080] In other embodiments, the camera module 193 may also be composed of two or more cameras. The two or more cameras may include a color camera, which can be used to collect color image data of the object being photographed. The two or more cameras may use stereo vision technology to collect depth data of the object being photographed. Stereo vision technology is based on the principle of human eye parallax. Under natural light, two or more cameras are used to capture images of the same object from different angles, and then triangulation and other calculations are performed to obtain distance information between the electronic device 100 and the object being photographed, that is, depth information.

[0081] In some embodiments, the electronic device 100 may include one or more camera modules 193. Specifically, the electronic device 100 may include one front camera module 193 and one rear camera module 193. The front camera module 193 may generally be used to capture color image data and depth data of the photographer facing the display screen 194, while the rear camera module may be used to capture color image data and depth data of the subject (e.g., a person, scenery, etc.) facing the photographer.

[0082] In some embodiments, the CPU or GPU or NPU in the processor 110 can process the color image data and depth data collected by the camera module 193. In some embodiments, the NPU can identify the color image data collected by the camera module 193 (specifically the color camera module) through a neural network algorithm based on the skeleton point recognition technology, such as a convolutional neural network algorithm (CNN), to determine the skeleton points of the person being photographed. The CPU or GPU can also run a neural network algorithm to determine the skeleton points of the person being photographed based on the color image data. In some embodiments, the CPU or GPU or NPU can also be used to confirm the figure of the person being photographed (such as body proportions, fatness and thinness of body parts between skeleton points) based on the depth data and identified skeleton points collected by the camera module 193 (which can be a 3D sensing module), and can further determine the body beautification parameters for the person being photographed, and finally process the captured image of the person being photographed according to the body beautification parameters so that the body shape of the person being photographed in the captured image is beautified.

[0083] The digital signal processor is used to process digital signals and can also process other digital signals. For example, when the electronic device 100 is selecting a frequency point, the digital signal processor is used to perform Fourier transform on the frequency point energy.

[0084] Video codecs are used to compress or decompress digital video. Electronic device 100 may support one or more video codecs. This allows electronic device 100 to play or record videos in various encoding formats, such as Moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, and MPEG4.

[0085] The NPU is a neural network (NN) computing processor. Drawing on the structure of biological neural networks, such as the transmission patterns between neurons in the human brain, it rapidly processes input information and can continuously self-learn. The NPU can enable intelligent cognitive applications in electronic device 100, such as image recognition, face recognition, speech recognition, and text comprehension.

[0086] The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 via the external memory interface 120 to implement data storage functions. For example, files such as music and videos can be saved on the external memory card or transferred from the electronic device to the external memory card.

[0087] The internal memory 121 can be used to store computer executable program code, which includes instructions. The internal memory 121 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc. The data storage area can store data created during the use of the electronic device 100 (such as audio data, a phone book, etc.), etc. In addition, the internal memory 121 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc. The processor 110 executes various functional methods or data processing of the electronic device 100 by running instructions stored in the internal memory 121, and / or instructions stored in a memory provided in the processor.

[0088] The electronic device 100 can implement audio functions such as music playback and recording through the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the headphone jack 170D, and the application processor.

[0089] The audio module 170 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signals. The audio module 170 can also be used to encode and decode audio signals. In some embodiments, the audio module 170 can be provided in the processor 110, or some functional modules of the audio module 170 can be provided in the processor 110.

[0090] The speaker 170A, also called a "speaker," is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music or output audio signals for hands-free calls through the speaker 170A.

[0091] The receiver 170B, also called a "handset", is used to convert audio electrical signals into sound signals. When the electronic device 100 receives a call or a voice message, the user can place the receiver 170B close to the ear to hear the voice.

[0092] Microphone 170C, also known as "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can speak by putting their mouth close to the microphone 170C to input the sound signal into the microphone 170C. The electronic device 100 can be provided with at least one microphone 170C. In other embodiments, the electronic device 100 can be provided with two microphones 170C, which can not only collect sound signals but also realize noise reduction function. In other embodiments, the electronic device 100 can also be provided with three, four or more microphones 170C to collect sound signals, reduce noise, identify the source of sound, realize directional recording function, etc.

[0093] The headphone jack 170D is used to connect a wired headphone. The headphone jack 170D can be a USB connector 130 or a 3.5mm open mobile terminal platform (OMTP) standard interface or a cellular telecommunications industry association of the USA (CTIA) standard interface.

[0094] Pressure sensor 180A is used to sense pressure signals and convert them into electrical signals. In some embodiments, pressure sensor 180A can be located on display screen 194. There are many types of pressure sensors 180A, such as resistive, inductive, and capacitive. A capacitive pressure sensor can include at least two parallel plates made of conductive material. When force is applied to pressure sensor 180A, the capacitance between the electrodes changes. Electronic device 100 determines the intensity of the pressure based on this change in capacitance. When a touch operation is applied to display screen 194, electronic device 100 detects the intensity of the touch operation based on pressure sensor 180A. Electronic device 100 can also calculate the location of the touch based on the detection signal from pressure sensor 180A. In some embodiments, touch operations applied to the same touch location but with different touch intensities can correspond to different operation instructions. For example, when a touch operation with an intensity less than a first pressure threshold is applied to a short message application icon, a command to view short messages is executed. When a touch operation with an intensity greater than or equal to the first pressure threshold is applied to a short message application icon, a command to create a new short message is executed.

[0095] The gyroscope sensor 180B can be used to determine the motion posture of the electronic device 100. In some embodiments, the angular velocity of the electronic device 100 around three axes (i.e., x, y, and z axes) can be determined by the gyroscope sensor 180B. The gyroscope sensor 180B can be used for anti-shake shooting. For example, when the shutter is pressed, the gyroscope sensor 180B detects the angle of the electronic device 100 shaking, calculates the distance that the lens module needs to compensate based on the angle, controls the reverse movement of the lens to offset the shaking of the electronic device 100, and achieves anti-shake. The gyroscope sensor 180B can also be used for navigation and somatosensory game scenes.

[0096] The air pressure sensor 180C is used to measure air pressure. In some embodiments, the electronic device 100 calculates the altitude based on the air pressure value measured by the air pressure sensor 180C to assist in positioning and navigation.

[0097] The magnetic sensor 180D includes a Hall sensor. The electronic device 100 can use the magnetic sensor 180D to detect the opening and closing of the flip case. If the electronic device is a foldable device, the magnetic sensor 180D can be used to detect whether the electronic device is folded or unfolded, or the folding angle. In some embodiments, if the electronic device 100 is a flip device, the electronic device 100 can detect the opening and closing of the flip cover based on the magnetic sensor 180D. Based on the detected opening and closing status of the leather case or the flip cover, features such as automatic unlocking of the flip cover can be configured.

[0098] Accelerometer 180E can detect the magnitude of acceleration of electronic device 100 in all directions (generally three axes). It can also detect the magnitude and direction of gravity when electronic device 100 is stationary. It can also be used to identify the electronic device's posture, enabling applications such as switching between landscape and portrait modes and pedometers.

[0099] The distance sensor 180F is used to measure distance. The electronic device 100 can measure distance using infrared or laser. In some embodiments, when shooting a scene, the electronic device 100 can use the distance sensor 180F to measure distance to achieve fast focusing.

[0100] The proximity light sensor 180G may include, for example, a light emitting diode (LED) and a light detector, such as a photodiode. The light emitting diode may be an infrared light emitting diode. The electronic device 100 emits infrared light outward through the light emitting diode. The electronic device 100 uses a photodiode to detect infrared reflected light from nearby objects. When the intensity of the detected reflected light is greater than a threshold, it can be determined that there is an object near the electronic device 100. When the intensity of the detected reflected light is less than a threshold, the electronic device 100 can determine that there is no object near the electronic device 100. The electronic device 100 can use the proximity light sensor 180G to detect when the user holds the electronic device 100 close to the ear to talk, so as to automatically turn off the screen to save power. The proximity light sensor 180G can also be used in leather case mode and pocket mode to automatically unlock and lock the screen.

[0101] The ambient light sensor 180L can be used to sense the brightness of ambient light. The electronic device 100 can adaptively adjust the brightness of the display screen 194 based on the perceived ambient light brightness. The ambient light sensor 180L can also be used to automatically adjust the white balance when taking photos. The ambient light sensor 180L can also cooperate with the proximity light sensor 180G to detect whether the electronic device 100 is blocked, for example, when the electronic device is in a pocket. When it is detected that the electronic device is blocked or in a pocket, some functions (such as the touch function) can be disabled to prevent accidental operation.

[0102] The fingerprint sensor 180H is used to collect fingerprints. The electronic device 100 can use the collected fingerprint characteristics to implement fingerprint unlocking, access application locks, fingerprint photography, fingerprint call answering, etc.

[0103] Temperature sensor 180J is used to detect temperature. In some embodiments, electronic device 100 uses the temperature detected by temperature sensor 180J to implement a temperature management strategy. For example, when the temperature detected by temperature sensor 180J exceeds a threshold, electronic device 100 reduces processor performance to reduce power consumption of the electronic device for thermal protection. In other embodiments, when the temperature detected by temperature sensor 180J is below another threshold, electronic device 100 heats battery 142. In other embodiments, when the temperature is below yet another threshold, electronic device 100 may boost the output voltage of battery 142.

[0104] The touch sensor 180K is also called a "touch-sensitive device." The touch sensor 180K can be disposed on the display screen 194. The touch sensor 180K and the display screen 194 form a touch screen, also called a "touch screen." The touch sensor 180K is used to detect touch operations applied thereto or in the vicinity thereof. The touch sensor can transmit the detected touch operations to the application processor to determine the type of touch event. Visual output related to the touch operations can be provided via the display screen 194. In other embodiments, the touch sensor 180K can also be disposed on the surface of the electronic device 100, at a location different from that of the display screen 194.

[0105] The bone conduction sensor 180M can acquire vibration signals. In some embodiments, the bone conduction sensor 180M can acquire vibration signals from the vibrating bones of the human body's vocal cords. The bone conduction sensor 180M can also contact the human pulse to receive blood pressure signals. In some embodiments, the bone conduction sensor 180M can also be set in headphones to form bone conduction headphones. The audio module 170 can parse the voice signal based on the vibration signal of the vibrating bones of the vocal cords acquired by the bone conduction sensor 180M to implement the voice function. The application processor can parse the heart rate information based on the blood pressure signals acquired by the bone conduction sensor 180M to implement the heart rate detection function.

[0106] The buttons 190 may include a power button, a volume button, etc. The buttons 190 may be mechanical buttons or touch buttons. The electronic device 100 may receive key inputs and generate key signal inputs related to user settings and function control of the electronic device 100.

[0107] Motor 191 can generate vibration prompts. Motor 191 can be used for incoming call vibration prompts, and can also be used for touch vibration feedback. For example, touch operations acting on different applications (such as taking pictures, audio playback, etc.) can correspond to different vibration feedback effects. For touch operations acting on different areas of the display screen 194, motor 191 can also correspond to different vibration feedback effects. Different application scenarios (for example: time reminders, receiving messages, alarm clocks, games, etc.) can also correspond to different vibration feedback effects. The touch vibration feedback effect can also support customization.

[0108] The indicator 192 may be an indicator light, which may be used to indicate the charging status, power level changes, messages, missed calls, notifications, etc.

[0109] The SIM card interface 195 is used to connect a SIM card. The SIM card can be connected to or separated from the electronic device 100 by inserting it into or removing it from the SIM card interface 195. The electronic device 100 can support one or more SIM card interfaces. The SIM card interface 195 can support Nano SIM cards, Micro SIM cards, SIM cards, etc. Multiple cards can be inserted into the same SIM card interface 195 at the same time. The types of the multiple cards can be the same or different. The SIM card interface 195 can also be compatible with different types of SIM cards. The SIM card interface 195 can also be compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to implement functions such as calls and data communications. In some embodiments, the electronic device 100 uses an eSIM, i.e., an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

[0110] Figure 2 shows a schematic electronic device 100 that uses a conductive elastic connector for electrical connection provided by an embodiment of the present application. The electronic device 100 may include a first element 10, a conductive elastic connector A, and a second element 20, wherein a conductive elastic connector A is provided between the first element 10 and the second element 20, and the first element 10 and the second element 20 are electrically connected through the conductive elastic connector A. Specifically, the conductive elastic connector A has a first surface and a second surface that are arranged relative to each other along a first direction (for example, a height direction), the first surface is electrically connected to the first element, and the second surface is electrically connected to the second element. In some embodiments, the first element 10 can be a middle frame of an electronic device, wherein the middle frame is grounded.

[0111] In some embodiments, the second component 20 may be a display module, and the first component 10 may be a midframe of an electronic device. The display module may be connected to the midframe via a conductive elastic connector A for grounding. Specifically, the midframe is electrically connected to a first surface of the conductive elastic connector A, and the display module is electrically connected to a second surface of the conductive elastic connector A.

[0112] In other embodiments, the second component 20 may be a shielding cover, and the first component 10 may be a midframe of an electronic device, and the two may be electrically connected via a conductive elastic connector A to achieve grounding of the shielding cover. It should be understood that the shielding cover may be used to achieve grounding on the outer surface of a device (e.g., a radio frequency front-end module) disposed within the electronic device.

[0113] In some other embodiments, the second component 20 is a camera module, the second component 10 is a middle frame of an electronic device, and the camera module is electrically connected to the middle frame through a conductive elastic connector A to achieve grounding of the camera module.

[0114] In some other embodiments, the second element 20 is an antenna bracket, the second element 10 is a middle frame of an electronic device, and the antenna bracket is electrically connected to the middle frame via a conductive elastic connector A to achieve grounding.

[0115] In some embodiments, the conductive elastic connector A can also be used to achieve grounding of PCB (Printed Circuit Board), cables, etc.

[0116] Figure 3A shows a schematic cross-sectional view of a conductive elastic connector A. It should be understood that the conductive elastic connector A is a three-dimensional structure having a length, a width, and a height. In the schematic structure of the conductive elastic connector shown in Figure 3A, the conductive elastic connector includes a first contact surface (the surface connected to the first element 10) and a second contact surface (the surface connected to the second element 20) arranged opposite to each other in a first direction (e.g., the height direction H), two side surfaces (i.e., the left side and the right side, not shown in the figure) arranged opposite to each other in a second direction (e.g., the width direction W), and two side surfaces (not shown in the figure) arranged opposite to each other in a third direction (e.g., the length direction L, where the length direction L is perpendicular to the width direction W and perpendicular to the paper). In some embodiments, the shapes of the first contact surface and the second contact surface can be rectangular, circular, elliptical, trapezoidal, etc. It should be understood that the shapes of the first contact surface and the second contact surface can be different. In other words, the contact surface of the conductive elastic connector A connecting to the first element can be different from the contact surface of the conductive elastic connector A connecting to the second element. For example, conductive foam is used to connect the display screen and the middle frame to achieve grounding, and the area of ​​the first contact surface between the spring and the display screen can be smaller than the area of ​​the second contact surface between the spring and the middle frame.

[0117] The conductive elastic connector shown in FIG3A is elastic and has an initial height of h0. Upon compression, the conductive elastic connector changes height, where the change in height represents the amount of compression. For example, the conductive elastic connector may be compressed to h1. Further compression may result in a compression of h3, where h3 is greater than h1.

[0118] In this embodiment, the cross-section of the conductive elastic connector at the first contact surface (i.e., a cross-section obtained by cutting along plane HW, where plane HW is a plane defined by height direction H and width direction W) and the cross-section of the second contact surface (i.e., a cross-section obtained by cutting along plane HL, where plane HL is a plane defined by height direction H and length direction L) are both rectangular. Those skilled in the art will appreciate that, in alternative embodiments, the cross-sections of the first and second contact surfaces of the conductive elastic connector may also be other shapes, such as trapezoidal. These shapes may be appropriately configured based on the actual usage environment and requirements, and are not intended to limit the scope of protection of this application.

[0119] In Figure 3B, curve a shows the relationship between the ground impedance and compression of the conductive elastic connector A when the conductive elastic connector A is connected to a first element and a second element, where the first element is electrically connected to a reference ground. The ground impedance of the conductive elastic connector A decreases as the compression increases. To meet the requirement that the ground impedance must be less than the maximum ground impedance, the first region where the low impedance is lower than the upper impedance limit is the operational region where the impedance meets the requirement. In other words, the compression of the conductive elastic connector A must be within the first region (for example, between h1 and h2 as shown in Figure 3A) to meet the ground impedance requirement. Therefore, the compression of the conductive elastic connector A must reach a minimum compression, and a compression greater than the minimum compression is considered the compression range that meets the grounding requirement. It should be understood that h2 in Figure 3A can be infinitely close to the thickness of the conductive elastic connector A itself. In some embodiments, the upper limit ground impedance is 0.2 ohms, and a ground impedance less than 0.2 ohms is considered low impedance.

[0120] Different conductive elastic connectors A have different ground impedance vs. compression curves (curve a). For example, as compression increases, the ground impedance of the first conductive elastic connector A may decrease at a greater rate than that of the first connector B. Therefore, to reduce the ground impedance to the upper impedance limit, the minimum compression required for the first conductive elastic connector A is less than the minimum compression required for the second conductive elastic connector A. Therefore, it can be considered that the first conductive elastic connector A has a wider compression range to meet the impedance requirement. For example, if the first conductive elastic connector A and the second conductive elastic connector A both have a height of 1.5 mm, the first conductive elastic connector meets the ground impedance requirement at a compression of 0.2 mm, while the second conductive elastic connector A meets the ground impedance requirement at a compression of 0.5 mm. Therefore, the compression range for the first conductive elastic connector A to meet the impedance requirement is 0.2 mm to 1.5 mm, while the compression range for the second conductive elastic connector A to meet the impedance requirement is 0.5 mm to 1.5 mm. Therefore, the first conductive elastic connector A has a wider compression range to meet the impedance requirement.

[0121] Curve b is a curve showing the relationship between the pressure on the conductive elastic connector A (or the pressure on the first element 10 and / or the second element 20) and the amount of compression when the conductive elastic connector A is connected to the first element and the second element. It can be seen that the pressure on the conductive elastic connector A increases with the increase in the amount of compression. It should be understood that in order to meet the pressure requirements, the pressure needs to be between the lower limit force and the upper limit force. The lower limit force is the pressure value on the conductive elastic connector A when the conductive elastic connector A is in the amount of compression corresponding to the impedance requirement. The upper limit force is set to ensure that the first element and / or the second element will not be damaged due to excessive pressure. For example, in an application scenario where the display screen is grounded, due to excessive pressure, the pressure will cause film prints on the flexible display screen, affecting the aesthetics of the display screen.

[0122] In some embodiments, the grounding pressure is required to be no greater than 0.5 Newtons. Alternatively, for a common conductive elastic connector, the contact surface (first surface and second surface) with the first element and / or the second element is 2.5 mm by 2.5 mm, and the pressure generated by the conductive elastic connector at maximum compression is no greater than 0.08 MPa. It should be understood that the required upper limit pressure may vary for different grounding scenarios.

[0123] The compression range of the conductive elastic connector A that meets the pressure requirement is the second region. The pressure generated by the conductive elastic connector A needs to be greater than the minimum pressure value (the pressure value corresponding to the upper impedance limit) and less than the maximum pressure value. In other words, to meet the pressure requirement, the compression amount of the conductive elastic connector A has a range (for example, between h1 and h3, where h1 is the compression amount that meets the maximum ground impedance requirement and h3 is the compression amount corresponding to the upper pressure limit). It should be understood that for different conductive elastic connectors A, the upper pressure limit and / or lower pressure limit are different.

[0124] The area where the compression range of the conductive elastic connector A meets both the impedance and pressure requirements is the third area. The interval where the compression amounts of the first and second areas overlap is the compression range of the third area (for example, as shown in Figure 3, the compression range of the first area is h1 to h2, and the compression range of the second area is h1 to h3, where h3 is less than h2, then the compression range of the third area is h1 to h3). It should be noted that in this embodiment of the application, the compression range of the conductive elastic connector corresponding to the third area that meets the impedance and pressure requirements is defined as the operating range of the conductive elastic connector.

[0125] The wider the compression range of the third area corresponding to the conductive elastic connector A, the larger the working range of the conductive elastic connector A that meets both the impedance and pressure requirements. It can be considered that the wider the application scenario of the conductive elastic connector A, the better the grounding solution.

[0126] Usually, the grounding connection achieved through the conductive elastic connector A needs to meet the impedance requirement, that is, the grounding impedance is not greater than the maximum grounding impedance. In addition, with the complexity and thinness of the structure of electronic equipment, coupled with the diversification of functions and forms of electronic equipment, the grounding solution needs to meet not only the impedance requirement but also the pressure requirement of not greater than the maximum upper limit force. For example, in the scenario where the display module is grounded, the upper limit of the pressure that the display module can withstand is 5 Newtons, so the pressure generated by the conductive elastic connector A needs to be less than 5 Newtons, otherwise the display module will be damaged. In addition, for some scenarios, such as the scenario where a high-resolution camera is grounded, the conductive elastic connector A must not only meet the grounding requirements of low impedance and low pressure, but also the grounding requirements of low harmonics to avoid harmonic noise affecting the normal operation of the camera.

[0127] As shown in FIG4 , an electronic device can use conductive fabric wrapped foam (FOF foam for short) to connect the first component 10 and the second component 20. The FOF foam 40 has a first contact surface and a second contact surface arranged opposite to each other in the height H direction, wherein the first contact surface is electrically connected to the first component 10, and the second contact surface is electrically connected to the second component 20. It should be understood that the FOF foam 40 at least includes a foam body 403, a hot melt adhesive layer 402 covering the surface of the foam body 403, and a conductive wrapping layer 401 covering the surface of the hot melt adhesive layer 402. The wrapping layer 401 can be a conductive fabric. It should be understood that a conductive adhesive 404 can be added between the FOF foam 40 and the first component 10 and / or the second component 20 for bonding the FOF foam 40 to the first component 10 and / or the second component 20. It should be understood that due to process limitations, the minimum size of the wrapping layer 401 can only be at the micron level.

[0128] Due to the presence of the conductive wrapping layer 401 and the hot melt adhesive layer 402 with limited compression, the FOF foam cannot achieve a low working height. In addition, the FOF foam is easily broken under pressure, resulting in increased impedance.

[0129] The embodiment of the present application provides a conductive elastic connector, which uses a porous bubble body, and forms a conductive layer of nanowires on the inside and outside of the porous bubble body to form a bubble core structure. The conductive elastic connector can meet impedance requirements and pressure requirements within a wide working range. Moreover, due to the use of nanowires as the conductive layer, the conductive elastic connector has the advantage of low harmonics. Secondly, an adhesive layer and a conductive film are respectively provided on the first surface and the second surface of the bubble core. The conductive film is bonded to the adhesive layer to increase the bonding strength between the bubble core and the first element and the second element, effectively avoiding the risk of short circuit caused by the breakage or shedding of the bubble body attached with the conductive layer while improving the conductivity.

[0130] The embodiment of the present application is used on an electronic device to provide a conductive elastic connector. Due to its wide working range, it can be applied to a variety of application scenarios to achieve free connection between electronic device components or free grounding of components. For example, it can be applied to the grounding of a display module, the grounding of a camera module, and the grounding of an antenna bracket. Secondly, since the conductive elastic connector has low harmonic characteristics, electronic devices using the conductive elastic connector can avoid electromagnetic interference between components or modules, reduce ESD phenomena, and can be used for free grounding of terminal equipment, vehicle-mounted equipment, etc. In addition, the conductive elastic connector also has excellent reliability and can achieve long-term stable low harmonic performance.

[0131] Figure 5 shows a schematic cross-sectional view of a conductive elastic connector provided by an embodiment of the present application along the HW plane (a plane defined by the height H direction and the width W direction). The conductive elastic connector 30 includes a core 301, which includes a porous body 302. The porous body 302 may have multiple inner pores (not shown) and multiple outer pores 303. For example, as shown in Figure 5, the porous body 302 has multiple outer pores 303.

[0132] The conductive elastic connector 30 further includes a conductive layer 308 (see FIG6 ) located on the porous bubble 302. The conductive layer is formed by nanowires attached to the interior and exterior surfaces of the porous bubble 302. The nanowires may include, but are not limited to, at least one of carbon nanotubes, tin nanowires, copper nanowires, nickel nanowires, silver nanowires, and gold nanowires.

[0133] The nanowires can be attached to the interior and exterior surfaces of the porous body 302 by coating and / or soaking. For example, a nanowire solution and a dendritic nanowire solution can be alternately coated on the interior and exterior surfaces of the porous body 302 by coating / soaking, thereby forming a multi-layered uniform conductive layer on the porous body 302.

[0134] By forming a conductive layer of nanowires inside and outside the porous foam 302, the deterioration of ground impedance caused by the conductive layer breaking can be reduced or avoided, thereby achieving stable low impedance over a wide compression range and preventing the generation of high harmonics. Because nanowires are used as the conductive layer, their strength and bonding strength with the foam 302 are relatively high, which can also reduce the problem of unstable ground impedance caused by the conductive layer falling off.

[0135] Furthermore, when the core 301 formed by the porous foam 302 is compressed, the pressure (or rebound force) slowly increases, enabling a wider compression range for the second region corresponding to a force less than the upper limit. Therefore, the third region of the conductive elastic connector has a wider compression range, meaning that the conductive elastic connector has a wider operating range for simultaneously meeting both impedance and pressure requirements.

[0136] The porous foam 302 includes a first surface and a second surface disposed opposite each other in a first direction (e.g., a height direction). The shapes of the first surface and the second surface can be rectangular, circular, elliptical, trapezoidal, etc. It should be understood that the shapes, sizes, etc. of the first surface and the second surface can be different or the same.

[0137] The conductive elastic connector 30 also includes a first conductive adhesive layer 304 and a first conductive film 305. The first conductive adhesive layer 304 is located on the first surface of the bubble core 301, and the first conductive film 305 is stacked on the first conductive adhesive layer 304, that is, the first conductive adhesive layer 304 is located between the first conductive film 305 and the first surface of the conductive elastic connector 30. The first conductive adhesive layer 304 is used to fix the first conductive film 305 layer to the first surface of the bubble core 301.

[0138] The first conductive film 305 is used to electrically connect to the first element 10, thereby achieving electrical connection between the conductive elastic connector 30 and the first element 10. The surface of the first conductive film 305 facing away from the first conductive adhesive layer 304 can serve as the first contact surface of the conductive elastic connector 30 and connect to the first element 10.

[0139] The conductive elastic connector 30 also includes a second conductive adhesive layer 306 and a second conductive film 307. The second conductive adhesive layer 306 is located on the second surface of the bubble core 301, and the second conductive film 307 is stacked on the second conductive adhesive layer 306, that is, the second conductive adhesive layer 306 is located between the second conductive film 307 and the second surface of the conductive elastic connector 30. The second conductive adhesive layer 306 is used to fix the second conductive film 307 layer to the second surface of the bubble core 301.

[0140] The second conductive film 307 is used to electrically connect to the second element 20, thereby achieving electrical connection between the conductive elastic connector 30 and the second element 20, and further achieving electrical connection between the first element 10 and the second element 20. The surface of the second conductive film 307 facing away from the second conductive adhesive layer 306 can serve as the second contact surface of the conductive elastic connector 30, connecting to the second element 20.

[0141] The first conductive film 305 is bonded to the first conductive adhesive layer 304, reinforcing the strength of the first conductive adhesive layer 304 and improving the continuity of the first conductive adhesive layer 304 under pressure. This reduces or prevents the bubble core 301 from falling off from the first component 10 due to cracking or breaking (e.g., breaking into granules) of the first conductive adhesive layer 304 when the conductive elastic connector 30 is compressed. Accordingly, the second conductive film 307 also strengthens the strength of the second conductive adhesive layer 306, improving the continuity of the second conductive adhesive layer 306 under pressure, reducing or preventing the bubble core 301 from falling off from the second component 20 due to cracking or breaking of the second conductive adhesive layer 306 under pressure. This effectively improves the bonding strength between the conductive elastic connector 30 and the first component 10 and the second component 20, thereby enhancing the reliability of the conductive elastic connector 30. By bonding a conductive film to the bubble 302 with the nanowires attached thereto, a low-pressure, low-PIM (passive intermodulation) conductive elastomer can be formed, thereby achieving long-term, stable, low-PIM performance.

[0142] In the embodiment of the present application, the thickness of the first conductive film 305 and the second conductive film 307 is 0.01 mm to 0.1 mm. For example, the thickness of the first conductive film 305 and the second conductive film 307 can be 0.08 mm or 0.05 mm. This can effectively strengthen the adhesion layer and reduce the risk of the adhesion layer breaking under pressure.

[0143] It is understood that the thicknesses of the first conductive film 305 and the second conductive film 307 may be the same or different.

[0144] In the embodiment of the present application, the first conductive film 305 and the second conductive film 307 can be conductive cloth, copper foil, or other conductive structures with a fixed shape, but the first conductive film 305 and the second conductive film 307 cannot be conductive glue.

[0145] The conductive fabric can be nickel-plated, gold-plated, carbon-plated, or aluminum-foiled. It should be understood that conductive fabric is a fabric substrate (typically polyester) that is electroplated with a metal layer to impart metallic conductivity. For example, the nickel-plated fabric is made by electroplating nickel onto polyester fabric to impart conductivity.

[0146] In the embodiment of the present application, the thickness of the first conductive adhesive layer 304 and the second conductive adhesive layer 306 can be 2 μm to 20 μm. For example, the thickness of the first conductive adhesive layer 304 and the second conductive adhesive layer 306 can be 10 μm or 15 μm. By setting the thickness of the first conductive adhesive layer 304 and the second conductive adhesive layer 306 to 2 μm to 20 μm, a good connection between the first conductive film 305 and the second conductive film 307 and the bubble core 301 is achieved.

[0147] In the embodiment of the present application, the first conductive adhesive layer 304 and the second conductive adhesive layer 306 are conductive silver paste. For example, the conductive silver paste can be set on the first conductive film 305 and the second conductive film 307, and bonded to the bubble core 301 when the conductive silver paste is not solidified. In this way, the first conductive adhesive layer 304, the second conductive adhesive layer 306, the bubble core 301, the first conductive film 305 and the second conductive film 307 form an integral structure. The conductive silver paste ensures good bonding between the conductive silver paste and the conductive layer 308 of the bubble core 301 on the one hand, and ensures the conductive performance between the first conductive film 305 and the second conductive film 307 and the bubble core 301 on the other hand.

[0148] In the embodiment of the present application, the porous foam 302 has a density less than 200 kg / m 3 The low-density porous foam 302, for example, the density of the porous foam 302 can be 150 kg / m 3 , or 100kg / m 3 The low-density porous foam 302 can achieve a deformability of 85%, significantly improving the performance of the conductive elastic connector 30 .

[0149] The material of the porous foam 302 can be at least one of PU (ploy urethane), PP (Polypropylene), PE (polyethylene), PI (Polyimide), silicone, polypropylene (PP), styrene-butadiene rubber, acrylate, vinyl acetate, vinylidene chloride, nitrile, silicone, acrylamide, natural rubber, polyvinyl chloride, polysulfide rubber, styrene-acrylate copolymer, vinyl acetate-acrylate copolymer, silicone-acrylate copolymer and modified silicone-acrylate copolymer, and rubber.

[0150] The porous bubble body 302 may be a three-dimensional network structure, wherein FIG5 only shows a two-dimensional plane schematic network connection of the porous bubble body 302 , and the grid shape is schematic.

[0151] The porous bubble 302 may have inner holes and outer holes, wherein the inner holes are located inside the porous bubble 302 and the outer holes are located on the outer surface of the bubble 302 structure. By setting the inner holes, the bubble core 301 can be supported.

[0152] By providing the outer hole, multiple conductive layers can be provided on the hole wall of the outer hole, thereby ensuring the conductive performance of the outer surface of the bubble core 301 and achieving conduction between the first conductive film 305 and the second conductive film 307.

[0153] It can be understood that the outer holes are holes visible on the outer surface of the bubble core 301, and the inner holes may be connected to the outer holes or the outer surface of the bubble core 301, or may not be connected.

[0154] The inner hole and the outer hole can be formed by foaming. It should be understood that the inner hole and the outer hole are just schematic names and do not represent any limitation on the size, shape, etc. of the hole opened by the foam body 302.

[0155] FIG6 is an electron microscope photograph of a conductive layer on a porous foam in a conductive elastic connector provided in an embodiment of the present application.

[0156] Multiple layers of conductive layers are attached to the walls of the inner and outer pores of the porous foam. Figure 6 shows an electron microscope photograph of the conductive layer 308. As shown in Figure 6, the conductive layer 308 is formed by nanowires attached to the porous foam. The multi-layered nanowire structure of the conductive layer achieves high electrical conductivity and strong bonding with the porous foam 302. This improves electrical conductivity while also preventing risks such as short circuits caused by breakage or shedding of the conductive layer.

[0157] In the embodiment of the present application, the inner pores include at least one of closed pores and open pores. For example, the inner pores can be closed pores or open pores, or the inner pores include both closed pores and open pores. When the inner pores are open pores, the inner pores can be connected to the outer pores to form open pores, or they can be connected to the outer surface of the bubble core 301 to form outer pores.

[0158] The conductive elastic connector 30 includes both open holes and closed holes in its structure, and can have rigidity and stability while also having soft and bendable properties by adjusting the position or area of ​​the open holes.

[0159] In the embodiment of the present application, the diameter of the pores of the porous body 302 is 30 μm to 500 μm. For example, the diameter of the pores of the porous body 302 can be 100 μm or 300 μm. The diameters of the pores of the porous body 302 can be the same or different. In this way, after the nanowires adhere to the pore walls, the compressible space and rebound force of the porous body 302 meet the working range requirements.

[0160] In the embodiments of the present application, the diameter of the nanowires is between 10 nm and 50 nm. For example, the diameter of the nanowires can be 30 nm or 40 nm. Controlling the diameter of the nanowires coated on the hole wall to between 10 nm and 100 nm allows the nanowires to be more firmly coated on the hole wall of the inner hole, preventing the nanowires from falling off under pressure and causing the generation of high harmonics. In addition, by setting the diameter range between 10 nm and 50 nm, a lower ground impedance can be achieved.

[0161] The nanowires may include, but are not limited to, at least one of carbon nanotubes, tin nanowires, copper nanowires, nickel nanowires, silver nanowires, and gold nanowires. The nanowires may be attached to the inner hole wall by coating or drop-coating. This embodiment of the present application uses coating the nanowires onto the inner hole as an example for illustrative purposes.

[0162] In some embodiments, the ratio of the length to the diameter of the nanowires is between 1000:1 and 5000:1.

[0163] Setting the ratio of the length to the diameter of the nanowire between 1000:1 and 5000:1 can prevent the nanowire from breaking when the conductive elastic connector is subjected to pressure, making the nanowire rigid and stable.

[0164] In some embodiments, to enhance conductivity, prevent pressure on the bulb 302 that could cause the nanowires to fall off, and prevent the generation of high harmonics, the nanowire diameter is approximately 70 nm. It should be understood that during actual processing, the nanowire diameter and length-to-diameter ratio of the actual product may vary, but this should be within the acceptable error range.

[0165] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A conductive elastic connector, characterized in that: The conductive elastic connector is used to connect the first element and the second element, and the conductive elastic connector includes: A bubble core, the bubble core comprising a porous bubble body and a conductive layer located on the porous bubble body, the conductive layer is a conductive layer formed by nanowires attached to the inner and outer surfaces of the porous bubble body, and the bubble core has a first surface and a second surface arranged opposite to each other; a first conductive adhesive layer, the first conductive adhesive layer being located on a first surface of the bubble core; a second conductive adhesive layer, the second conductive adhesive layer being located on the second surface of the bubble core; a first conductive film, wherein the first conductive film is stacked on the first conductive adhesive layer and is used for being electrically connected to the first element; A second conductive film is stacked on the second conductive adhesive layer, and the second conductive film is used for electrically connecting to the second element.

2. The conductive elastic connector according to claim 1, characterized in that: The thickness of the first conductive film and the second conductive film is 0.01 mm-0.1 mm.

3. The conductive elastic connector according to claim 1, characterized in that: The first conductive film and the second conductive film are conductive cloth or copper foil.

4. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The thickness of the first conductive adhesive layer and the second conductive adhesive layer is 2 μm-20 μm.

5. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The first conductive adhesive layer and the second conductive adhesive layer are conductive silver paste.

6. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The porous foam has a density of less than 200 kg / m 3 Low density porous foam.

7. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The porous foam body has inner holes and outer holes, and multiple layers of the conductive layer are attached to the hole walls of the inner holes and the outer holes; The inner pores are located inside the porous bubble structure, and the outer pores are located on the outer surface of the bubble structure.

8. The conductive elastic connector according to claim 7, characterized in that: The inner pores include at least one of closed pores and open pores.

9. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The diameter of the pores of the porous foam body is 30 μm-500 μm.

10. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The diameter of the nanowire is 10nm-50nm.

11. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The ratio of the length to the diameter of the nanowire is between 1000:1 and 5000:

1.

12. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The nanowire is at least one of nanosilver, nanocopper, carbon nanowire and nanogold.

13. The conductive elastic connector according to any one of claims 1 to 3, characterized in that: The porous foam body is a three-dimensional network structure, and the network structure is attached with multiple layers of the conductive layer.

14. An electronic device, characterized in that: The electronic device comprises a first element, a second element and a conductive elastic connector according to any one of claims 1 to 13; The first conductive film of the conductive elastic connecting member is electrically connected to the first element, and the second conductive film of the conductive elastic connecting member is electrically connected to the second element.

15. The electronic device according to claim 14, characterized in that: The electronic device further includes a conductive adhesive, wherein the conductive adhesive is disposed between the first conductive film and the first element, and the conductive adhesive is disposed between the second conductive film and the second element.

16. The electronic device according to claim 14, characterized in that: The first component is a middle frame, and the second component is at least one of an antenna bracket, a display module, a shielding cover or a camera module.

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