Micromechanical component for sensor device, microphone device and / or microspeaker device

Abstract

The invention relates to a micromechanical component for a sensor device, a microphone device and / or a microspeaker device, comprising a cover structure (12) having an inner side (12a) of the cover structure (12), which inner side is oriented towards a sensitive surface (10a) of the micromechanical component, which inner side extends at least partially across the sensitive surface (10a) of the micromechanical component, the micromechanical component has at least one air and / or medium inlet opening (14), which is structured by the cover structure (12) and extends from an inner side (12a) of the cover structure (12) to an outer side (12b) of the cover structure (12), which outer side (12b) is oriented away from the inner side (12a) of the cover structure (12). The cover structure (12) has at least two web-like reinforcing structures (24) protruding on the inner face (12a) of the cover structure (12), which reinforcing structures are oriented parallel to one another at a distance in the range of between 50 nm and 1500 nm between two adjacent reinforcing structures (24).

Description

Technical Field

[0001] The present invention relates to a micromechanical component for a sensor device, a microphone device, and / or a micro speaker device. Similarly, the present invention relates to a method for manufacturing a micromechanical component for a sensor device, a microphone device, and / or a micro speaker device. Background Art

[0002] A micromechanical component for a sensor device is known from DE 10 2020 201 576 A1, which has at least one stator electrode, at least one actuator electrode, and a membrane spanning the electrodes, the membrane having a membrane outer side oriented away from the electrodes. In addition, a reinforcing and / or protective structure protruding on the membrane outer side is constructed on the micromechanical component, and the reinforcing and / or protective structure, for example, should ensure particle protection of the membrane outer side as a protective grid to prevent membrane contamination. Summary of the Invention

[0003] The present invention realizes a micromechanical component for a sensor device, a microphone device, and / or a micro speaker device and a method for manufacturing a micromechanical component for a sensor device, a microphone device, and / or a micro speaker device.

[0004] The present invention realizes the following micromechanical component: The micromechanical component ensures more reliable protection of the sensitive surface of the corresponding micromechanical component from environmental influences, contamination influences, and damage influences based on its corresponding covering structure having a tabular reinforcing structure. In particular, the tabular reinforcing structure of the micromechanical component according to the present invention ensures high robustness of its covering structure even when the covering structure abuts against an object. Due to the relatively small spacing between at least two tabular reinforcing structures, this robustness is additionally increased.

[0005] For this purpose, in the micromechanical component of the present invention, even a relatively sensitive sensitive surface (for example, the membrane surface used as the sensitive surface of a membrane that can warp) is hardly at risk of damage. Therefore, in a harsh environment with high impact loads, the micromechanical component according to the present invention can also be used reliably. In addition, the invention described here realizes a micromechanical component with an increased service life compared to the prior art. As will be explained more precisely below, the tabular reinforcing structure on the inner side of the covering structure of the micromechanical component according to the present invention can moreover be constructed by means of the present invention without (substantially) additional work effort. Even the construction of a relatively small spacing between at least two tabular reinforcing structures can be implemented relatively easily by using the present invention. Therefore, the use of the present invention does not / almost does not increase the manufacturing cost for the corresponding micromechanical component.

[0006] If a silicon-containing gel is conventionally used as a protective layer for a membrane surface that serves to satisfy the sensitive surface of a warpable membrane, the total mass that can be in a warping motion state is increased. For this reason, the membrane surface conventionally "protected" by the silicon-containing gel responds more strongly to the acceleration of an apparatus that constructs a warpable membrane. In contrast, in the micromechanical component according to the invention, the construction of the tabular reinforcing structure on its covering structure does not result in an increase in the total mass that can be in a warping motion state. Therefore, the acceleration of the micromechanical component according to the invention (together with the membrane surface of the warpable membrane used as the sensitive surface) does not contribute to the warping of the membrane. Therefore, the increased protection of the membrane surface of the membrane used as the sensitive surface when using the invention does not affect the detection characteristics of the membrane.

[0007] Similarly, the construction of the covering structure of the micromechanical component, which is more firmly constructed due to its tabular reinforcing structure, contributes to better protection of the partially manufactured micromechanical component during its production. Accordingly, damage to the micromechanical component according to the invention during its transportation is reliably prevented due to its covering structure (which has tabular reinforcing structures protruding on the inner side).

[0008] In an advantageous embodiment of the micromechanical component, the spacing between two adjacent reinforcing structures lies in the range between 100 nm (nanometers) and 1000 nm (nanometers). The spacing between the reinforcing structures described here advantageously contributes to increasing the firmness of the covering structure respectively constructed therewith.

[0009] Alternatively or additionally, for each of at least two tabular reinforcing structures, it is also possible to define its width oriented perpendicular to its respective maximum length, and the height by which the reinforcing structure protrudes on the inner side of the covering structure can be greater than half of the arithmetic mean of the widths of the at least two tabular reinforcing structures. This also contributes to increasing the firmness of the respective covering structure, so that even in the case where an object abuts against the covering structure, there is no / almost no concern about damage to the covering structure or damage to the sensitive surface of the micromechanical component protected thereby.

[0010] Advantageously, the sensitive surface of the micromechanical component can be the membrane surface of a warpable membrane. Therefore, the invention described here also advantageously contributes to protecting a relatively sensitive sensitive surface from contamination and damage in other cases.

[0011] For example, the warpable membrane can be formed from a first semiconductor layer, at least two tabular reinforcing structures can be formed from a second semiconductor layer, and at least one anchoring region of the covering structure (to which the at least two tabular reinforcing structures are anchored) is formed from a third semiconductor layer. As will become clear from the subsequent description, the embodiment of the micromechanical component described here can be manufactured relatively simply and inexpensively.

[0012] The implementation of corresponding manufacturing methods for sensor devices, microphone devices, and / or micro speaker devices also achieves the advantages explained above. It should be explicitly noted that the manufacturing method according to the above-explained embodiments of the micromechanical component can be extended.

[0013] In an advantageous embodiment of the manufacturing method, in order to arrange the reinforcement structure adjacent to the sensitive surface of the micromechanical component and to construct at least two tab-shaped reinforcement structures, the following sub-steps are implemented: at least partially cover the sensitive surface of the micromechanical component with at least one sacrificial layer; deposit a semiconductor layer on the at least one sacrificial layer; at least structure at least two tab-shaped reinforcement structures from the semiconductor layer by structuring at least one trench passing through the semiconductor layer between two later adjacent reinforcement structures, the trench having a trench width oriented parallel to the sensitive surface, the trench width corresponding to the respective spacing between the two later adjacent reinforcement structures; deposit a second sacrificial layer on the semiconductor layer, whereby the at least one trench is at least partially filled with the sacrificial layer material of the second sacrificial layer; and form at least one anchoring region of the reinforcement structure by exposing at least a respective sub-surface of each of the at least two tab-shaped reinforcement structures from the second sacrificial layer and depositing an additional semiconductor layer on the second sacrificial layer, and the at least two tab-shaped reinforcement structures are anchored on the at least one anchoring region. The sub-steps described here can be implemented in a cost-effective manner by means of standard semiconductor processes.

[0014] Preferably, when depositing the second sacrificial layer, cavities (66) are respectively enclosed in the at least one trench. It becomes clear from the following description that the formation of cavities in the trenches facilitates and accelerates the subsequent removal of at least the sacrificial layer material of the second sacrificial layer by means of an etching process. This ensures that the sacrificial layer material is reliably removed in the intermediate region between two adjacent reinforcement structures even when the spacing between the two adjacent reinforcement structures is relatively small.

[0015] In another advantageous embodiment of the manufacturing method, a covering structure is anchored on an additional semiconductor layer, and a warpable membrane is formed from the additional semiconductor layer, the membrane having the sensitive surface of the micromechanical component as the membrane surface, in such a way that at least one sub-surface of the additional conductor layer is exposed from at least the first sacrificial layer before depositing the semiconductor layer. By means of the anchoring of the covering structure on the additional semiconductor layer achieved in this way, the warpable region of the warpable membrane can be advantageously determined / defined by preventing the peripheral region of the additional semiconductor layer located around the membrane from warping together when the membrane warps. Description of the Drawings

[0016] Subsequently, further features and advantages of the present invention are explained with reference to the accompanying drawings. It shows:

[0017] Figure 1 A schematic illustration of a first specific embodiment of a micromechanical component;

[0018] Figure 2 a schematic illustration of a second specific embodiment of a micromechanical component; and

[0019] Figures 3A to 3F Schematic illustration of a cross section through an intermediate product for explaining an embodiment of a production method for a micromechanical component. Specific implementation method

[0020] Figure 1 A schematic illustration of a first specific embodiment of a micromechanical component is shown.

[0021] In Figure 1 The micromechanical components schematically shown in can be used as sensor devices, microphone devices and / or micro-speaker devices (at least parts thereof). Merely by way of example, Figure 1 The micromechanical component of the present invention can be used as a pressure sensor, wherein the membrane surface 10a of the warpable membrane 10 of the micromechanical component is used as a sensitive surface 10a to measure the pressure p in the external environment of the micromechanical component and a predetermined reference pressure p 0 The pressure difference between the two. However, it should be pointed out here that the configurability of the micromechanical component explained below, in particular its cover structure 12, is not limited to a specific sensor type.

[0022] The covering structure 12 is used to protect the sensitive surface 10a of the micromechanical component and has an inner side 12a oriented toward the sensitive surface 10a of the micromechanical component, which at least partially spans the sensitive surface 10a. In contrast, the outer side 12b of the covering structure 12 is oriented away from the inner side 12a and the sensitive surface 10a of the micromechanical component. In addition, the covering structure 12 is configured with at least one air and / or medium inlet opening 14 structured through the covering structure, wherein at least one air and / or medium inlet opening 14 extends from the inner side 12a of the covering structure 12 to the outer side 12b of the covering structure 12. By way of example only, Figure 1 The micromechanical component of has only one air and / or medium inlet opening 14, which extends centrally through the cover structure 12. However, it should be noted that the cover structure 12 has only one air and / or medium inlet opening 14, which extends centrally through the cover structure 12. Figure 1 The structures shown in are to be interpreted as examples only.

[0023] ​​​​For example, by means of at least one air and / or medium inlet opening 14 it is ensured that the pressure p present in the external environment of the micromechanical component is also present in the measuring volume 16 of the micromechanical component, which measuring volume is constructed between the sensitive surface 10a of the micromechanical component and the inner side 12a of the covering structure 12. The reference pressure p 0 is enclosed in a reference volume 18 which is delimited by the membrane inner side 10b of the membrane 10 directed away from the sensitive surface 10a. Furthermore, at least one actuator or sensing electrode 20 is suspended on the membrane inner side 10b of the membrane 10, which actuator or sensing electrode can be adjusted or is adjusted by means of the warping of the membrane 10 relative to at least one fixedly arranged stator electrode 22, said warping being triggered by the pressure difference between the pressure p and the reference pressure p 0 Thus, the pressure difference between the pressure p and the reference pressure p can be determined based on the evaluation of the voltage or capacitance acting between at least one actuator or sensing electrode 20 and at least one stator electrode 22. 0 between the pressure p and the reference pressure p.

[0024] As can be seen in Figure 1 the covering structure 12 has at least two tab-shaped reinforcing structures 24 protruding on the inner side 12a of the covering structure 12. The at least two tab-shaped reinforcing structures 24 of the covering structure 12 are oriented parallel to one another, wherein the spacing between two adjacent reinforcing structures 24 lies in the range between 50 nm (nanometers) and 1500 nm (nanometers). Thus, each of the reinforcing structures 24 has its maximum length in a common spatial direction, which maximum length lies in the image plane in the case of the Figure 1 micromechanical component. Possibly, at least one air and / or medium inlet opening 14 can also extend through at least one of the reinforcing structures 24.

[0025] The construction of the covering structure 12, as described here, having its at least two tab-shaped reinforcing structures 24 protruding on the inner side 12a and having a relatively small spacing of between 50 nm (nanometers) and 1500 nm (nanometers) from one another advantageously increases the robustness of the covering structure 12. Thus, the covering structure 12 constructed with the reinforcing structures 24 can better fulfill its task as a protective structure or protective layer in order to protect the sensitive surface 10a of the micromechanical component against environmental influences, against contamination and against damage. Thus, the conventional, relatively sensitive, sensitive surface 10a of the deflectable membrane 10, as drawn in Figure 1 can also more reliably carry out its function. Even a collision of an object on the outer side 12b of the covering structure 12 usually does not result in an error in the determination of the pressure p and the reference pressure p 0an incorrect measurement when there is a pressure difference between them or does not cause damage to the sensitive surface 10a. In addition, the covering structure 12 also protects the sensitive surface 10a from the presence of foreign particles in the measurement volume 16 and prevents the sensitive surface 10a from being wetted by a liquid. As according to Figure 1 It can also be seen that the advantageous configuration of the covering structure 12 having at least two tab-shaped reinforcing structures 24 on its inner side 12a does not / almost does not interfere with the detection characteristics of the membrane 10.

[0026] In addition, for each of the at least two tab-shaped reinforcing structures 24, it is also possible to define its width oriented perpendicular to its maximum length (perpendicular to Figure 1 the image plane). Preferably, the arithmetic mean value of the widths of the at least two tab-shaped reinforcing structures 24 is at least 3 times larger, especially at least 5 times larger, and particularly at least 8 times larger than the spacing between two adjacent reinforcing structures 24. Alternatively or additionally, the height by which the reinforcing structures 24 protrude on the inner side 12a of the covering structure 12 can be greater than half of the arithmetic mean value of the widths of the at least two tab-shaped reinforcing structures 24. The spacing and shape of the reinforcing structures 24 described here ensure the advantageous firmness of the covering structure 12 respectively configured therewith.

[0027] The warpable membrane 10 can be formed by a first semiconductor layer 26a (such as a polysilicon layer 26a), while the at least two tab-shaped reinforcing structures 24 can be formed by a second semiconductor layer 26b (especially a polysilicon layer 26b). Preferably possibly, at least one anchoring region 28 of the covering structure 12 (to which the at least two tab-shaped reinforcing structures 24 are anchored) is formed by a third semiconductor layer 26c (especially a polysilicon layer 26c). In addition, at least one anchoring region 30 (formed by the second semiconductor layer 26b) can protrude at the inner side 12a of the covering structure 12, and the anchoring region mechanically contacts the first semiconductor layer 26a, so that the covering structure 12 is anchored to the first semiconductor layer 26a through its at least one anchoring region 30. By means of the configuration of at least one anchoring region 30 of the covering structure 12, the surrounding region of the first semiconductor layer 26a surrounding the membrane 10 can be "fixed", so that in the case of warping of the membrane 10, an undesired co-warping movement caused by its fixation by means of at least one anchoring region 30 is prevented. Thereby, the warping behavior of the membrane 10 can be optimized by the corresponding positioning of at least one anchoring region 30.

[0028] Exemplarily, Figure 1The micromechanical component has a substrate 32, in which the substrate surface 32a is at least partially covered with at least one insulating layer 34a and 34b. The substrate 32 can in particular be a silicon substrate 32. The at least one insulating layer 34a and 34b can be, for example, a silicon dioxide layer 34a and / or a silicon-rich silicon nitride layer 34b. Deposited on the at least one insulating layer 34a and 34b is a first electrode layer 36 such as, for example, a polysilicon layer 36, from which at least one stator electrode 22 is at least constructed. Optionally, at least one reference counter electrode 38 and / or at least one conductor circuit can also be constructed from the first electrode layer 36. Deposited on a first sacrificial layer 40, in particular a silicon dioxide layer 40, which at least partially covers the structured first electrode layer 36, can be a second electrode layer 42, from which at least one actuator or sensing electrode 20 and possibly also at least one reference electrode 44 can be constructed. The second electrode layer 42 can also be a polysilicon layer 42. Deposited through a second sacrificial layer 46, such as, for example, a silicon dioxide layer 46, which at least partially covers the second electrode layer 42, can be a first semiconductor layer 26a. Between the first semiconductor layer 26a and the second semiconductor layer 26b and / or between the second semiconductor layer 26b and the third semiconductor layer 26c, at least one additional sacrificial layer 48, in particular at least one additional silicon dioxide layer 48, can be constructed. (For better clarity, only one sacrificial layer 48 is drawn in Figure 1 .) After at least partially removing the sacrificial layers 40, 46 and 48 to expose the measurement volume 16 and the reference volume 18, the membrane 10 can warp in response to the pressure difference between the pressure p and the reference pressure p 0 , such that the desired pressure measurement can be carried out with the aid of the micromechanical component.

[0029] As can be seen in Figure 1 , the third semiconductor layer 26c can also be used for depositing additional layers such as, for example, at least one insulating layer 50 and / or at least one passivation layer 52a and 52b and / or for fixing at least one conductive layer 54.

[0030] Figure 2 Schematic diagram showing a second embodiment of the micromechanical component.

[0031] In Figure 2 the micromechanical component schematically shown differs from the previously explained embodiment only in the positioning of at least one air and / or medium inlet opening 14. As can be seen in Figure 2 , it is also possible to structure a plurality of air and / or medium inlet openings 14 through the covering structure 12. Exemplarily, in Figure 2In the micromechanical component, air and / or a medium enter an opening 14 which is located on an edge region of a covering structure 12. The edge region is made unobstructed by a tab-shaped strengthening structure 24, but is surrounded by at least one anchoring region 30. Regarding Figure 2 For further features, properties and advantages of the micromechanical component, reference is made to the embodiments explained above.

[0032] In all the micromechanical components explained above, the spacing between two adjacent strengthening structures 24 can in particular be in the range between 100 nm and 1000 nm. This also helps to increase the robustness of the corresponding micromechanical component.

[0033] Figures 3A to 3F A schematic view showing a cross-section through an intermediate product is presented to explain an embodiment of a manufacturing method for a micromechanical component.

[0034] The manufacturing method explained below can be used to produce a large number of different sensor devices, microphone devices and / or micro-speaker devices. For example, as diagrammatically described in Figures 3A to 3F it is possible to carry out the method steps explained below to manufacture the micromechanical component described above (where the Figures 3A to 3F image plane is perpendicular to the Figure 1 and Figure 2 image plane). However, it should be noted that the feasibility of the manufacturing method is not limited to the production of one of the micromechanical components explained above.

[0035] By means of the method steps explained below, a capping structure 12 is arranged adjacent to the sensitive surface 10a of the later micromechanical component such that the inner side 12a of the covering structure 12, which is oriented towards the sensitive surface 10a of the micromechanical component, at least partially spans across the sensitive surface 10a. In addition, the covering structure 12 is constructed with at least two tab-shaped strengthening structures 24 which project on the inner side 12a of the covering structure 12 and are oriented parallel to one another. Advantageously, by means of the method explained here, at least two tab-shaped strengthening structures 24 are constructed with a spacing d in the range between 50 nm (nanometres) and 1500 nm (nanometres) between two adjacent strengthening structures 24 24 configured.

[0036] Merely by way of example, a covering structure 12 constructed by means of the manufacturing method explained here is arranged on a first semiconductor layer 26a from which a deflectable membrane 10 is formed, which membrane has a sensitive surface 10a of the micromechanical component as a membrane surface 10a. The first semiconductor layer 26a can be, for example, a polysilicon layer 26a. However, the feasibility of the method steps explained below is not limited to the sensitive surface 10 (which is constructed as a membrane surface 10a of a deflectable membrane 10).

[0037] In order to arrange the covering structure 12 adjacent to the sensitive surface 10a, the sensitive surface 10a of the micromechanical component is at least partially covered with at least a first sacrificial layer 48, preferably a silicon dioxide layer 48. In order to later anchor the covering structure 12 to the first semiconductor layer 26a, at least one sub-surface 30a of the first semiconductor layer 26a is exposed from at least the first sacrificial layer 48 before depositing the second semiconductor layer 26b (at least two tab-shaped reinforcing structures 24 protruding on the inner side 12a of the covering structure 12 are at least formed by the second semiconductor layer). At least one sub-surface 30a can be located at the corresponding position of at least one later anchoring region 30 of the covering structure 12. Figure 3A Shows an intermediate product.

[0038] Thereafter, the second semiconductor layer 26b is deposited on at least one first sacrificial layer 48. The second semiconductor layer 26b is preferably a polysilicon layer 26b. Then, at least two tab-shaped reinforcing structures 24 are formed at least from the second semiconductor layer 26b. This is carried out at least by structuring at least one trench 60 passing through the second semiconductor layer 26b between two later adjacent reinforcing structures 24. In order to structure at least one trench 60, an anisotropic etching step can be implemented by using an (unshown) etching mask. At least one trench 60 is structured with a trench width d oriented parallel to the sensitive surface 10a 60 , which trench width corresponds to the corresponding spacing d between two later adjacent reinforcing structures 24 24 . In particular, the trench width d of at least one trench 60 can be selected 60 such that at least two tab-shaped reinforcing structures 24 are formed with a spacing d in the range between 100 nm (nanometers) and 1000 nm (nanometers) between two adjacent reinforcing structures 24 24 . This intermediate product is described in Figure 3B .

[0039] As can be seen in Figure 3Ca and 3Cb , after structuring at least one trench 60 through the second semiconductor layer 26b, a second sacrificial layer 62, preferably a silicon dioxide layer 62, is deposited on the second semiconductor layer 26b, whereby at least one trench 60 is at least partially filled with the sacrificial layer material of the second sacrificial film 62. By means of Figure 3Ca the enlarged partial region 64, shown in Figure 3Cb , cavities 66 are respectively enclosed in at least one trench 60 when depositing the second sacrificial layer 62. The advantages of at least one enclosed cavity 66 will be discussed below.

[0040] In the embodiment described here, an anchoring region 28 of the covering structure 12 is also formed, on which at least two tab-shaped reinforcing structures 24 are anchored. For this purpose, first at least the respective sub-surfaces 68 of each of the at least two tab-shaped reinforcing structures 24 are exposed from the second sacrificial layer 62. The intermediate product constructed in this way is in Figure 3D shown.

[0041] Figure 3E shown is the intermediate product after depositing the third semiconductor layer 26c on the second sacrificial layer 62 (and accordingly on the exposed sub-surfaces 68 of the at least two tab-shaped reinforcing structures 24) and structuring at least one air and / or dielectric access opening 14 through the at least third semiconductor layer 26c. The third semiconductor layer 26c can also be a polysilicon layer 26c. The anchoring region 28 of at least the covering structure 12 is thus constituted by at least a part of the third semiconductor layer 26c.

[0042] Structuring at least one air and / or dielectric access opening 14 through the subsequent covering structure 12 such that at least one structured air and / or dielectric access opening 14 extends from the inner side 12a of the covering structure 12 to the outer side 12b of the covering structure 12 oriented away from the inner side 12a of the covering structure 12. Preferably, a part of the sacrificial layer material of the second sacrificial layer 62 is exposed by means of at least one air and / or dielectric access opening 14. Possibly, at least one (additional) etch channel 70 can also be constructed together with at least one air and / or dielectric access opening 14. In order to structure at least one air and / or dielectric access opening 14, additional anisotropic etch steps can be carried out by using an (unshown) etch mask. When all the process steps (in which particles are released and / or liquids are sprayed) have been completed, structuring of at least one air and / or dielectric access opening 14 of the covering structure 12 can be carried out relatively late in the manufacturing process of the micromechanical component. Thus, there is no need to worry that particles and / or liquids will enter into at least one air and / or dielectric access opening 14 and possibly enter into the subsequently formed measurement volume 16 through at least one air and / or dielectric access opening 14 at a later time.

[0043] After structuring at least one air and / or dielectric access opening 14, a gas-phase etching process can be carried out in order to remove at least a part of the sacrificial layer material of the sacrificial layers 48 and 62 from the measurement volume 16 (and possibly also from the not-outlined reference volume 18). As can be seen in Figure 3F the cavity 66 facilitates and accelerates the removal of at least a part of the sacrificial layer material of at least one of the sacrificial layers 48 and 62 from the measurement volume 16. Thereby, an undesired residue of the sacrificial layer in the measurement volume 16 is reliably prevented.

[0044] In Figure 3F the method steps not depicted diagrammatically, optionally, at least one hydrophobic material (e.g., a fluoropolymer) can also be deposited on at least one air and / or medium inlet opening 14, whereby it is additionally possible to prevent liquid from undesirably entering the measuring volume 16 through at least one air and / or medium inlet opening 14 coated with the hydrophobic material. If the reference chamber 18 (not shown) is also exposed during the gas-phase etching process, the desired pressure value for the reference pressure p 0 in the reference chamber 18 can then be set before the reference chamber 18 is sealed airtight and gas-tight.

[0045] Although the invention has been explained above based on a pressure sensor, its applicability is not limited to this type of sensor. For example, the invention can also be used for chemical detection sensors, the sensitive surface 10a of which responds to the absorption of the detection substance on the sensitive surface 10a with an ascertainable change in its conductive properties.

[0046] The invention can be used in smartphones, tablets, wearable devices, hearing aids, drones, robots, games, toys, calorie counting devices, motion control devices, free-fall detection devices, motion detection devices, ear detection devices, head motion detection devices, air quality detection devices, climate control devices, ground height detection devices, water level detection devices, elderly care devices, indoor navigation, position tracking, flight control, and / or altitude stabilization devices.

Claims

1. A micromechanical component for a sensor device, a microphone device and / or a microspeaker device, comprising: a covering structure (12), the covering structure having an inner side (12a) of the covering structure (12) oriented toward the sensitive surface (10a) of the micromechanical component, the inner side at least partially spanning the sensitive surface (10a) of the micromechanical component, and the covering structure having at least one air and / or medium inlet opening (14) structured through the covering structure (12), the air and / or medium inlet opening each extending from the inner side (12a) of the covering structure (12) to an outer side (12b) of the covering structure (12) oriented away from the inner side (12a) of the covering structure (12); It is characterized in that At least two web-shaped reinforcement structures (24) are provided protruding on the inner side (12a) of the cover structure (12), the reinforcement structures being arranged at a distance (d ) in the range of between 50 nm and 1500 nm between two adjacent reinforcement structures (24). 24 ) are oriented parallel to each other.

2. The micromechanical component according to claim 1, wherein: The distance (d) between two adjacent reinforcing structures (24) 24 ) is in the range between 100nm and 1000nm.

3. The micromechanical component according to claim 1 or 2, wherein: For each of the at least two web-shaped reinforcement structures (24), a width oriented perpendicularly to its respective maximum length can be defined, and a height by which the reinforcement structure (24) projects on the inner side (12a) of the covering structure (12) is greater than half an arithmetic mean of the widths of the at least two web-shaped reinforcement structures (24).

4. The micromechanical component according to claim 1, wherein: The sensitive surface (10a) of the micromechanical component is a film surface (10a) of a warpable film (10).

5. The micromechanical component according to claim 4, wherein: The warpable film (10) is formed by a first semiconductor layer (26a), the at least two web-shaped reinforcement structures (24) are formed by a second semiconductor layer (26b), and at least one anchoring region (28) of the covering structure (12) is formed by a third semiconductor layer (26c), the at least two web-shaped reinforcement structures (24) being anchored to the anchoring region.

6. A method for producing a micromechanical component for a sensor device, a microphone device and / or a microspeaker device, the method comprising the following steps: Arranging a covering structure (12) adjacent to a sensitive surface (10a) of the micromechanical component such that an inner side (12a) of the covering structure (12) oriented toward the sensitive surface (10a) of the micromechanical component at least partially spans the sensitive surface (10a) of the micromechanical component; and structuring at least one air and / or medium inlet opening (14) through the cover structure (12) so that the structured at least one air and / or medium inlet opening (14) extends from the inner side (12a) of the cover structure (12) to an outer side (12b) of the cover structure (12) directed away from the inner side (12a) of the cover structure (12); It is characterized in that Set up the following steps: At least two web-shaped reinforcement structures (24) are formed, which protrude on the inner side (12a) of the cover structure (12) and are spaced apart at a distance (d ) in the range of between 50 nm and 1500 nm between two adjacent reinforcement structures (24). 24 ) are oriented parallel to each other.

7. The manufacturing method according to claim 6, wherein: The at least two web-shaped reinforcement structures (24) are arranged at a distance (d ) between two adjacent reinforcement structures (24) in the range of 100 nm and 1000 nm. 24 )structure.

8. The manufacturing method according to claim 6 or 7, wherein: In order to arrange the covering structure (12) adjacent to the sensitive surface (10a) of the micromechanical component and to form the at least two web-shaped reinforcement structures (24), the following substeps are carried out: at least partially covering the sensitive surface (10a) of the micromechanical component with at least one first sacrificial layer (48); depositing a semiconductor layer (26b) on the at least one first sacrificial layer (48); At least two web-shaped reinforcement structures (24) are structured from the semiconductor layer (26b) by structuring at least one trench (60) through the semiconductor layer (26b) between two subsequently adjacent reinforcement structures (24), the trench having a trench width (d 1 ) oriented parallel to the sensitive surface (10a). 60 ), the groove width corresponds to the corresponding spacing (d 24 ); depositing a second sacrificial layer (62) on the semiconductor layer (26b), whereby the at least one trench (60) is at least partially filled with sacrificial layer material of the second sacrificial layer (62); and At least one anchoring region (28) of the covering structure (12) is formed by exposing at least a corresponding sub-surface of each of the at least two splice-shaped reinforcement structures (24) from the second sacrificial layer (62) and depositing a further semiconductor layer (26c) on the second sacrificial layer (62), wherein the at least two splice-shaped reinforcement structures (24) are anchored on the at least one anchoring region.

9. The manufacturing method according to claim 8, wherein: When the second sacrificial layer (62) is deposited, a cavity (66) is respectively enclosed in the at least one trench (60).

10. The manufacturing method according to claim 8 or 9, wherein: The covering structure (12) is anchored on a further semiconductor layer (26a), from which a warpable membrane (10) is formed, the warpable membrane having the sensitive surface (10a) of the micromechanical component as a membrane surface (10a), in that before the semiconductor layer (26b) is deposited, at least one subsurface (30a) of the further semiconductor layer (26a) is exposed from at least the first sacrificial layer (48).

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