Chip overturning and sorting device and overturning and sorting method

Abstract

The invention discloses a chip overturning and sorting device and method, and the device comprises a feeding platform which is provided with a feeding bearing surface, and the feeding bearing surface is used for bearing a to-be-overturned chip; the rotating disc is provided with a peripheral surface, the rotating disc can be controlled to rotate along the axis of the rotating disc, a plurality of material bearing areas are arranged on the peripheral surface of the rotating disc in the circumferential direction at equal angles, and the material bearing areas are used for bearing chips; the blanking table is provided with a blanking bearing surface, and the blanking bearing surface is used for bearing the overturned chip; and the picking structure is at least used for picking the to-be-overturned chips on the feeding bearing surface to the bearing area. According to the chip overturning and sorting device and the overturning and sorting method, the overturning efficiency of the chip can be improved, and multi-face free overturning is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor devices, and particularly relates to a chip flipping and sorting device and a flipping and sorting method. Background Art

[0002] In the mass production core link of chip finished product testing, seamless cooperation between the flipping and sorting machine and the testing machine is crucial to ensure that each packaged chip meets the performance detection. The sorting machine is a device for grading and screening products by quality or sorting according to material characteristics (such as color, texture, texture, shape, luster, density, etc.). Domestic flipping and sorting machines are divided into translation, swing arm, etc. according to the transmission method, each with its own characteristics: different in speed, compatibility, and size adaptability. When selecting a model, it is necessary to accurately connect with production requirements to maximize testing efficiency and accuracy.

[0003] However, although the sorting machines on the market can perform operations such as grading and sorting and can achieve automated operations, and even can achieve fixed flipping and sorting operations, the flipping angle is dull, the operation speed is slow, the production efficiency is extremely low, and the multi-faceted free flipping function cannot be achieved, seriously affecting the production operations of the semiconductor manufacturing industry.

[0004] The information disclosed in this background art section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip flipping and sorting device and a flipping and sorting method, which can improve the chip flipping efficiency and achieve multi-faceted free flipping.

[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the present invention is as follows:

[0007] A chip flipping and sorting device, comprising:

[0008] A loading table, having a loading bearing surface for loading the chips to be flipped;

[0009] A turntable, having an outer peripheral surface, the turntable can be controllably rotated along its own axis, and a plurality of material receiving areas are arranged at equal angles in the circumferential direction on the outer peripheral surface of the turntable for receiving chips;

[0010] An unloading table, having an unloading bearing surface for loading the flipped chips;

[0011] A picking structure, at least for picking up the chips to be flipped on the loading bearing surface to the material receiving area.

[0012] In one or more embodiments of the present invention, the pick-up structure is further used to pick up the flipped chips on the material receiving area to the unloading carrying surface.

[0013] In one or more embodiments of the present invention, the angle between adjacent material receiving areas ranges from 15° to 180°.

[0014] In one or more embodiments of the present invention, a through hole is opened in each of the material receiving areas on the turntable, each of the through holes is connected to a vacuum adsorption device, and each of the through holes can be independently evacuated to adsorb the chip.

[0015] In one or more embodiments of the present invention, the chip flipping and sorting device further comprises a lifting structure, which is arranged on the inner circumferential surface of the turntable at equal angles along the circumferential direction of the turntable, and each of the lifting structures corresponds to one of the material receiving areas.

[0016] In one or more embodiments of the present invention, the lifting structure is partially located in the through hole and can be controlled to protrude out of the outer peripheral surface of the turntable to eject the chip located on the material receiving area.

[0017] In one or more embodiments of the present invention, an elastic reset member is provided between the lifting structure and the turntable.

[0018] In one or more embodiments of the present invention, the chip flipping and sorting device also includes an ejector, which is arranged in the turntable. The ejector has an ejector portion, and the ejector portion can be controlled to act on the lifting structure at a preset angle, so that after the turntable rotates by a preset angle, the lifting structure can protrude from the outer peripheral surface of the turntable.

[0019] In one or more embodiments of the present invention, the outer circumferential surface of the turntable includes a plurality of bearing planes spliced ​​and arranged at equal angles along the circumferential direction, and each of the bearing planes is provided with a material receiving area.

[0020] In one or more embodiments of the present invention, a material receiving structure protruding from the outer circumferential surface of the turntable is provided on the material receiving area.

[0021] In one or more embodiments of the present invention, the material-carrying structure is configured to be U-shaped or quasi-U-shaped, and the material-carrying structure has a notch, and the opening direction of the notch is away from the rotation direction of the turntable.

[0022] In one or more embodiments of the present invention, the chip flipping and sorting device further includes:

[0023] a first detection structure, arranged corresponding to the circumference of the turntable, the first detection structure being used to detect the chips located on the material receiving area; and / or,

[0024] A second detection structure is provided corresponding to the loading bearing surface of the loading platform, and the second detection structure is used to detect the chip located on the loading bearing surface and guide the picking structure to move to a preset position of the loading bearing surface to pick up the chip; and / or,

[0025] The third detection structure is arranged corresponding to the material unloading bearing surface of the material unloading platform, and the third detection structure is used to guide the picking structure to move to a preset position of the material unloading bearing surface to place the chip.

[0026] In one or more embodiments of the present invention, the chip flipping and sorting device further includes:

[0027] The driving structure is connected to the turntable and controls the turntable to rotate in units of the angle between adjacent material receiving areas.

[0028] A flip sorting method of the chip flip sorting device comprises:

[0029] The picking structure picks up the chip to be flipped on the loading surface and places it on the loading area at the first position;

[0030] The turntable rotates to rotate the material receiving area at the first position to the second position, completing the chip flipping;

[0031] Transferring the flipped chip on the material receiving area at the second position to the material unloading bearing surface;

[0032] Wherein, the first position and the second position have a preset angle, and the preset angle is a multiple of the angle between adjacent material receiving areas.

[0033] Compared with the prior art, the chip flipping and sorting device and flipping and sorting method of the present invention can customize the chip flipping angle and realize multi-faceted free flipping of the chip.

[0034] The chip flipping and sorting device and flipping and sorting method of the present invention have fast flipping speed and high flipping efficiency.

[0035] The chip flipping and sorting device and flipping and sorting method of the present invention improve the surface detection, flipping accuracy and operation speed of the chip sorting process, and realize precise adjustment and rapid response of multiple degrees of freedom by strengthening drive control and optimizing mechanical structure and dynamics.

[0036] The chip flipping and sorting device and flipping and sorting method of the present invention, combined with intelligent recognition and detection technology, shorten the chip change time, enhance adaptability, and improve detection efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a schematic structural diagram of a chip flipping and sorting device in one embodiment of the present invention;

[0039] Figure 2 This is a schematic diagram of the turntable structure of a chip flipping and sorting device in one embodiment of the present invention;

[0040] Figure 3 Schematic diagram of the cross section of the turntable of the chip flipping and sorting device in one embodiment of the present invention ( Figure 2 Middle AA section);

[0041] Figure 4 It is a schematic diagram of the picking structure of the chip flipping and sorting device in one embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0043] As mentioned in the background art, the flip sorting machines currently on the market have a sluggish flipping angle, a slow operating speed, and cannot achieve multi-sided free flipping, which seriously affects the production operations of the semiconductor manufacturing industry.

[0044] Based on this, the present invention provides a chip flipping and sorting device and a chip flipping and sorting method, which can customize the chip flipping angle and realize multi-sided free flipping of the chip.

[0045] like Figure 1 As shown, a chip flipping and sorting device in an embodiment of the present invention includes a frame 200 , a loading platform 10 , a turntable 20 , an unloading platform 30 and a picking structure 40 .

[0046] The frame 200 has a work surface 201, and the loading platform 10, the turntable 20, and the unloading platform 30 are all arranged on the work surface. The picking structure 40 is arranged above the work surface. The bottom of the frame 1 is provided with casters 202.

[0047] The loading platform 10 has a loading bearing surface, and the loading bearing surface is used to bear the chip to be flipped.

[0048] It is understandable that a single chip to be flipped can be placed on the loading surface, or a wafer that has been cut (including multiple chips to be flipped) can be placed. The wafer that has been cut can be fixed and protected by a blue film or UV film or thermal release film, a mother-and-child ring or a metal ring.

[0049] A second detection structure 11 may be provided above the loading bearing surface of the loading platform 10. The second detection structure 11 is preferably a visual recognition device, such as a CCD camera. The second detection structure 11 is used to detect and locate the chip located on the loading bearing surface. When the second detection structure 11 detects that the surface defects of the chip exceed a preset range, the current chip is skipped and the next chip is detected; if it is detected that the chip has no surface defects, the picking structure 40 is guided to move to a preset position on the loading bearing surface to pick up the chip, or the loading platform 10 is guided to move to a preset position within the operating range of the picking structure 40 to facilitate the picking structure 40 to pick up the chip. In this embodiment, the loading platform 10 can be controlled to move on the working table 201 of the frame 200 to cooperate with the picking structure 40 to pick up chips without surface defects.

[0050] Optionally, if the cut wafer is fixed by a UV film, the camera light source of the second detection structure 11 may be a multi-band light source, which can realize the debonding function of the UV film.

[0051] In one embodiment, the loading bearing surface is partially hollow. A pin (not shown) may be provided inside the loading platform 10, and the shape of the pin may be determined according to the actual needs of the chip, such as a cone, a cylinder, a cube, etc. A vacuum channel may be provided on the top of the pin, and a blue film or a UV film may be adsorbed on the top of the pin during the ejection, so as to ensure that the pin separates the chip from the film during the process of lifting the chip, so as to facilitate the subsequent pickup structure 40 to pick up the chip.

[0052] If the cut wafer is fixed by a thermal release film, a heating device, such as a heating wire, is provided on the loading surface to heat the loading surface to separate the chip from the thermal release film, so as to facilitate the subsequent pickup structure 40 to pick up the chip.

[0053] like Figure 2 As shown, the turntable 20 has an outer circumferential surface 21, and a plurality of receiving areas 22 are arranged at equal angles along the circumferential direction on the outer circumferential surface 21 of the turntable 20. The receiving areas 22 are used to receive chips. The angle range α between adjacent receiving areas 22 is 15°-180° (such as Figure 3Preferably, the angle between adjacent receiving areas 22 can be divided by 360°, preferably 30°, 60°, 90°, 180°, etc. The turntable 20 is configured to be controllably rotatable along its own axis to achieve flipping of the chips on the receiving area 22.

[0054] Exemplarily, the chip flipping and sorting device includes a driving structure 100 , which is connected to the turntable 20 and controls the turntable 20 to rotate in units of an angle between adjacent receiving areas 22 .

[0055] In one embodiment, if Figure 3 As shown, in order to ensure that the chip located in the material receiving area 22 can be stably maintained on the outer peripheral surface 21 of the turntable 20 during the turning process of the turntable 20, a through hole 23 is opened in each material receiving area 22 of the turntable 20, each through hole 23 is connected to a vacuum adsorption device, and each through hole 23 can be independently evacuated to adsorb the chip. When the chip is located on the material receiving area 22, the chip can be vacuum adsorbed through the through hole 23. When each material receiving area 22 on the turntable 20 rotates to a preset position, the corresponding through hole 23 releases the chip and is received by the pickup structure 40.

[0056] In one embodiment, if Figure 2 As shown, in order to keep the chip stable when transferring it to the receiving area 22, the outer surface 21 of the turntable 20 is divided into a plurality of receiving planes 211 arranged at equal angles along the circumferential direction, and each receiving plane 211 is provided with a receiving area 22.

[0057] Furthermore, each receiving area 22 is provided with a receiving structure 221 protruding from the outer peripheral surface 21 of the turntable 20. The receiving structure 221 is configured as a U-shaped or quasi-U-shaped structure. The receiving structure 221 has a notch 2211, and the opening direction of the notch 2211 is away from the rotation direction of the turntable 20, which can provide a certain support force for the chip during the rotation of the turntable 20.

[0058] In one embodiment, if Figure 3 As shown, in order to facilitate the picking structure 40 to pick up the chip on the receiving area 22 of the turntable 20, the chip flipping and sorting device can also include a lifting structure 60. The lifting structure 60 is arranged on the inner circumferential surface of the turntable 20 at equal angles along the circumferential direction of the turntable 20, and each lifting structure 60 is arranged corresponding to a receiving area 22. The shape of the lifting structure 60 can be determined according to the actual needs of the chip, for example, it can be conical, cylindrical, square, etc. The lifting structure 60 can be partially located in the through hole 23, or the lifting structure 60 is arranged corresponding to the through hole 23.

[0059] Optionally, an elastic reset member (not shown) may be provided between the lifting structure 60 and the turntable 20. The elastic reset member is preferably a spring. The lifting structure 60 can be controlled to protrude from the outer peripheral surface 21 of the turntable 20 under the action of an external force to eject the chip located on the material receiving area 22, and can be retracted at least into the through hole 23 under the action of the elastic reset member after the external force is removed.

[0060] It is understandable that the lifting structures 60 may also be retracted into the through holes 23 after the external force is removed by other means, for example, by connecting a driving device to each lifting structure 60 .

[0061] In one embodiment, in order to provide the force for the lifting structure 60 to lift the chip, the chip flipping and sorting device further includes an ejector 70. The ejector 70 is disposed in the turntable 20, and the ejector 70 includes an end 71 and an ejector portion 72 extending radially from the end 71 along the turntable. The end 71 is fixed to the axial region of the turntable 20 through an axially extending rotating shaft, and the end 71 is fixedly connected to the rotating shaft, and the rotating shaft can be controlled to rotate to adjust the rotation angle of the ejector portion 72, so that the ejector portion 72 is limited to a preset position after rotating a preset angle, and acts on the lifting structure 60 that reaches the preset position in sequence as the turntable 20 rotates, providing the force for the lifting structure 60 to protrude from the outer peripheral surface 21 of the turntable 20.

[0062] In one embodiment, in order to enable the ejector 70 to act more smoothly on the lifting structure 60 during the rotation of the turntable 20 , the ejector 70 is preferably configured in a teardrop shape. The sharp corner of the teardrop shape is the ejector portion 72 of the ejector 70 .

[0063] A first detection structure 50 may also be disposed above the turntable 20. The first detection structure 50 is disposed corresponding to the circumference of the turntable 20, and is at least used to detect the placement position, internal cracks, etc. of the chips located on the turntable receiving area 22.

[0064] The first detection structure 50 is also preferably a visual recognition device, such as a CCD camera, etc. When the first detection structure 50 detects that the placement of the chip is incorrect, it can guide the pick-up structure 40 to re-place the chip. When the first detection structure 50 detects that the chip has internal cracks, it guides the pick-up structure 40 to pick up the chip and move it to the waste area (not shown).

[0065] The unloading platform 30 has an unloading bearing surface, and the unloading bearing surface is used to bear the flipped chips.

[0066] It is understandable that the blanking bearing surface can also bear a single chip to be flipped or multiple chips to be flipped. Multiple chips to be flipped are still fixed and protected by blue film or UV film or heat release film, mother-and-child ring or metal ring, waffle box or braiding tape and other tooling.

[0067] A third detection structure 31 may be provided above the material unloading bearing surface of the unloading platform 30. The third detection structure 31 is preferably a visual recognition device, such as a CCD camera, etc. The third detection structure 31 is used to guide the pickup structure 40 to move to a preset position on the material unloading bearing surface to place the chip, ensuring that the chips are neatly arranged, or the third detection structure 31 can be used to guide the unloading platform 30 to move to a preset position below the turntable 20 to receive the chip on the turntable 20. In this embodiment, the unloading platform 30 can be controlled to move on the work surface of the frame 200 to cooperate with the unloading of the turntable 20.

[0068] The pick-up structure 40 is at least used to pick up the chips to be flipped on the loading surface of the loading platform 10 to the loading area 22. The pick-up structure 40 can also pick up the flipped chips on the loading area 22 to the unloading surface of the unloading platform 30.

[0069] In one embodiment, the pick-up structure 40 can be a multi-axis mechanical swing arm in the prior art, and a nozzle capable of sucking the chip is provided at its movable end. The nozzle is preferably made of a flexible material, and the nozzle can be connected to an external vacuum device to suck or release the chip by vacuum suction. The multi-axis mechanical swing arm can move and rotate in the X, Y, and Z directions and around the X, Y, and Z axes to operate at multiple angles between multiple stations (loading platform, receiving area, unloading platform).

[0070] In this embodiment, reference Figure 4 As shown, the picking structure 40 may also include a suction unit 41 and a driving unit 42 , wherein the driving unit 42 is connected to the suction unit 41 and controls the movement, rotation and adsorption of the suction unit 41 .

[0071] Exemplarily, the driving unit 42 may include a lifting motor 421, a rotating motor 422, a connecting member 423, and a slider 424. The output shaft of the lifting motor 421 is directly connected to the connecting member 423, and a slider 424 is fixed to the other end of the connecting member 423. The slider 424 can move in the Z direction under the action of the lifting motor 421 and the connecting member 423. The rotating motor 422 is fixed to the slider 424 by a fixing member 425. The output shaft of the rotating motor 422 is provided with a suction unit 41, and the suction unit 41 can rotate around the Z axis under the action of the rotating motor 422. The suction unit 41 includes a suction nozzle 411 for sucking chips. The suction nozzle 411 is made of a flexible material. The suction nozzle 411 can be connected to an external vacuum device to suck or release the chip by vacuum suction.

[0072] It is understandable that the picking structure 40 is not the innovative point of the present invention and can be directly purchased from the market. Therefore, based on the detailed connection relationship between the lifting motor 421, the rotating motor 422, the connecting member 423, the slider 424, the fixing member 425, and the suction nozzle 411 in this embodiment, the present invention does not elaborate on this in detail, as long as the cooperation between these components can achieve the above-described effect.

[0073] The number of the picking structures 40 may be two, which are respectively arranged between the loading platform 10 and the turntable 20 and between the turntable 20 and the unloading platform 30 .

[0074] In the above technical solution, after the pick-up structure 40 picks up the chip on the loading platform 10, the suction unit 41 rotates a certain angle and just stays above one of the receiving areas 22 of the turntable 20 (the receiving area 22 is set to be directly above the turntable 20), and the suction unit 41 is pressed down to the receiving area 22 of the turntable 20, and the suction unit 41 stops vacuuming and instantly switches to vacuuming the turntable 20 to absorb and receive the chip. At this time, when the pick-up structure 40 leaves the flip disk 20, the turntable 20 rotates at a preset angle (the angle between adjacent receiving areas 22), and the pick-up structure 40 picks up a new chip to the next receiving area 22 directly above the turntable 20, and performs the action of placing the chip, and the above steps are repeated continuously.

[0075] When the first chip on the turntable 20 rotates to the set position, the suction unit 41 of another pickup structure 40 moves to the top of the chip and sucks the chip, and the turntable 20 releases the current chip. The pickup structure 40 absorbs the chip to the unloading table 30. It can be understood that the lifting structure 60 on the reversing disk 20 can be freely configured to eject the chip according to different chips or different needs.

[0076] In one embodiment, when the chip needs to be flipped 180°, that is, the chip needs to be turned over, after the chip is flipped to the desired flipping angle through the turntable, when the chip is located at the lowest point directly below the turntable, the chip can be unloaded without the need for a picking structure 40, and the unloading table 30 can be directly moved to the bottom of the turntable 20 to receive the flipped chip from the turntable 20.

[0077] When the unloading platform 30 moves to the bottom of the turntable 20 , the turntable 20 directly releases the flipped chip, and the chip falls directly onto the unloading bearing surface of the unloading platform 30 under the action of its own gravity.

[0078] It is understandable that the orderly arrangement of the flipped chips on the material loading surface of the material loading platform 30 can be achieved by the third detection structure 31. After the third detection mechanism 31 confirms the position of the next chip to be placed on the material loading surface of the material loading platform 30, it guides the material loading platform 30 to move so as to accurately receive the flipped chips.

[0079] The present invention also provides a flip sorting method of the chip flip sorting device, comprising:

[0080] The picking structure picks up the chip to be flipped on the loading surface and places it on the loading area at the first position;

[0081] The turntable rotates to rotate the material receiving area at the first position to the second position, completing the chip flipping;

[0082] Transferring the flipped chip on the material receiving area at the second position to the material unloading bearing surface;

[0083] Wherein, the first position and the second position have a preset angle, and the preset angle is a multiple of the angle between adjacent material receiving areas.

[0084] The pick-up structure can pick up the flipped chips on the material receiving area at the second position to the material unloading bearing surface. During the rotation of the turntable, the pick-up structure continuously picks up the chips to be flipped on the material loading bearing surface to the material receiving area rotated to the first position; and the pick-up structure continuously picks up the flipped chips on the material receiving area rotated to the second position to the material unloading bearing surface, thereby meeting the requirement of unloading the chips after flipping them to a preset angle, and realizing multi-angle free flipping.

[0085] The unloading table can also be moved to the bottom of the turntable to receive the flipped chips by relying on the gravity of the flipped chips.

[0086] During the rotation of the turntable, the first detection structure will continuously detect the chips located on the material receiving area to detect problems such as internal cracks of the chips.

[0087] Compared with the prior art, the chip flipping and sorting device and flipping and sorting method of the present invention can customize the chip flipping angle and realize multi-faceted free flipping of the chip.

[0088] The chip flipping and sorting device and flipping and sorting method of the present invention have fast flipping speed and high flipping efficiency.

[0089] The chip flipping and sorting device and flipping and sorting method of the present invention improve the surface detection, flipping accuracy and operation speed of the chip sorting process, and realize precise adjustment and rapid response of multiple degrees of freedom by strengthening drive control and optimizing mechanical structure and dynamics.

[0090] The chip flipping and sorting device and flipping and sorting method of the present invention, combined with intelligent recognition and detection technology, shorten the chip change time, enhance adaptability, and improve detection efficiency and accuracy.

[0091] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0092] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip flipping and sorting device, characterized in that: include: A loading platform, having a loading bearing surface, wherein the loading bearing surface is used to bear the chip to be flipped; A turntable has an outer circumferential surface, the turntable can be controlled to rotate along its own axis, and a plurality of receiving areas are arranged at equal angles along the circumferential direction on the outer circumferential surface of the turntable, and the receiving areas are used to receive chips; A material unloading platform, having a material unloading bearing surface, wherein the material unloading bearing surface is used to bear the flipped chip; The picking structure is at least used to pick up the chip to be flipped on the loading bearing surface to the material receiving area.

2. The chip flipping and sorting device according to claim 1, characterized in that: The angle between adjacent material receiving areas ranges from 15° to 180°.

3. The chip flipping and sorting device according to claim 1, characterized in that: A through hole is opened in each of the material receiving areas on the turntable, each of the through holes is connected to a vacuum adsorption device, and each of the through holes can be independently evacuated to adsorb the chip.

4. The chip flipping and sorting device according to claim 3, characterized in that: It also includes a lifting structure, which is arranged on the inner circumferential surface of the turntable at equal angles along the circumferential direction of the turntable, and each of the lifting structures corresponds to one of the material receiving areas.

5. The chip flipping and sorting device according to claim 4, characterized in that: The lifting structure is partially located in the through hole and can be controlled to protrude from the outer peripheral surface of the turntable to eject the chip located on the material receiving area.

6. The chip flipping and sorting device according to claim 4, characterized in that: It also includes an ejector, which is arranged in the turntable. The ejector has an ejector portion. The ejector portion can be controlled to act on the lifting structure at a preset angle, so that after the turntable rotates by a preset angle, the lifting structure can protrude from the outer circumference of the turntable.

7. The chip flipping and sorting device according to claim 1, characterized in that: The outer circumferential surface of the turntable includes a plurality of bearing planes spliced ​​and arranged at equal angles along the circumferential direction, and each of the bearing planes is provided with a material receiving area.

8. The chip flipping and sorting device according to claim 1, characterized in that: The material receiving area is provided with a material receiving structure protruding from the outer peripheral surface of the rotating disk.

9. The chip flipping and sorting device according to claim 8, characterized in that: The material-carrying structure is configured to be U-shaped or quasi-U-shaped, and has a notch, wherein the opening direction of the notch is away from the rotation direction of the turntable.

10. The chip flipping and sorting device according to claim 1, characterized in that: Also includes: A first detection structure is arranged corresponding to the circumference of the turntable, and the first detection structure is used to detect the chips located on the material receiving area; and / or, A second detection structure is provided corresponding to the loading bearing surface of the loading platform, and the second detection structure is used to detect the chip located on the loading bearing surface and guide the picking structure to move to a preset position of the loading bearing surface to pick up the chip; and / or, The third detection structure is arranged corresponding to the material unloading bearing surface of the material unloading platform, and the third detection structure is used to guide the picking structure to move to a preset position of the material unloading bearing surface to place the chip.

11. The chip flipping and sorting device according to claim 1, characterized in that: Also includes: The driving structure is connected to the turntable and controls the turntable to rotate in units of the angle between adjacent material receiving areas.

12. A chip flipping and sorting method according to any one of claims 1 to 11, characterized in that: include: The picking structure picks up the chip to be flipped on the loading surface and places it on the loading area at the first position; The turntable rotates to rotate the material receiving area at the first position to the second position, completing the chip flipping; Transferring the flipped chip on the material receiving area at the second position to the material unloading bearing surface; Wherein, the first position and the second position have a preset angle, and the preset angle is a multiple of the angle between adjacent material receiving areas.

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