Stable and safe wafer semiconductor clamping structure

Abstract

The utility model discloses a stable and safe wafer semiconductor clamping structure, relates to the technical field of wafer clamping, and aims to solve the problems that an existing wafer clamping structure has limitation in automatically adapting to wafers of different sizes and has insufficiency in high protection of the wafers in the clamping process. According to the technical scheme, the clamping device is characterized by comprising a supporting base, a connecting rod is fixedly connected to the end face of the supporting base, a supporting plate is fixedly connected to one end of the connecting rod, a plurality of rails are fixedly connected to the back of the supporting plate, clamping claws are slidably installed in sliding grooves of the rails, and clamping air bags are bonded to the clamping faces of the clamping claws through glue; the side surface of the clamping air bag communicates with an air guide pipe, and an air guide hose is fixedly installed at one end of the air guide pipe. And the effects of being capable of automatically adapting to the wafers of different sizes, clamping the wafers and preventing the wafers from being damaged in the clamping process are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer clamping, in particular to a stable and safe wafer semiconductor clamping structure. Background Art

[0002] Wafers are the substrate for semiconductor production. During the semiconductor processing and production process, the wafers need to be transferred on multiple processing equipment. At this time, a wafer clamping structure is needed to clamp and transfer the wafers.

[0003] Existing wafer clamping structures have limitations in automatically adapting to wafers of different sizes, and are insufficient in providing high protection for the wafers during the clamping process. Utility Model Content

[0004] The purpose of the utility model is to provide a stable and safe wafer semiconductor clamping structure that can automatically adapt to wafers of different sizes, clamp the wafers, and prevent the wafers from being damaged during the clamping process.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A stable and safe wafer semiconductor clamping structure includes a support seat, a connecting rod fixedly connected to the end face of the support seat, one end of the connecting rod fixedly connected to a support plate, a plurality of tracks fixedly connected to the back of the support plate, a clamping claw slidably installed in the slide groove of the track, a clamping airbag glued to the clamping surface of the clamping claw, an air guide tube connected to the side surface of the clamping airbag, an air guide hose fixedly installed at one end of the air guide tube, one end of the air guide hose connected to a detection seat, a mounting hole is provided on the end face of the detection seat, and an air pressure sensor is installed inside the mounting hole.

[0007] By adopting the above technical solution, it can automatically adapt to wafers of different sizes and clamp them with appropriate force, thereby ensuring stable clamping and avoiding damage to the wafers.

[0008] Furthermore, a linkage disk is rotatably installed at the middle position of the lower surface of the support plate, a through hole is provided at the central axis position of the linkage disk, the connecting rod passes through the through hole, and a plurality of linkage bars are rotatably connected at the edge position of the linkage disk, and one end of the linkage bar is rotatably connected to one end of the clamping claw.

[0009] By adopting the above technical solution, it is ensured that the linkage disk can rotate independently, and under the linkage of the linkage bar, the clamping claw can slide in the track groove.

[0010] Furthermore, a hydraulic rod is rotatably connected to the edge of the lower surface of the supporting plate, and a telescopic end of the hydraulic rod is rotatably connected to the edge of the linkage disk.

[0011] By adopting the above technical solution, the rotation of the hydraulic rod position linkage plate can be used to provide kinetic energy.

[0012] Furthermore, a supporting airbag is glued to the upper surface of the support plate.

[0013] By adopting the above technical solution, the surface of the wafer can be effectively protected.

[0014] Furthermore, a plurality of anti-slip bumps are integrally connected to the upper surface of the supporting airbag.

[0015] By adopting the above technical solution, the position movement of the wafer during the clamping process is avoided.

[0016] Furthermore, a plurality of groove structures are provided on an outer surface of one side of the clamping airbag.

[0017] By adopting the above technical solution, the clamped wafer can be effectively prevented from falling off.

[0018] In summary, the beneficial technical effects of the present invention are:

[0019] 1. When clamping the wafer, the utility model retracts the hydraulic rod and rotates the linkage disk by the hydraulic rod. Under the linkage of the linkage bar, multiple clamping claws slide synchronously, and multiple clamping claws can effectively clamp the wafer supported on the support plate. Since the clamping airbags are adhered to the clamping surfaces of the clamping claws, the clamping airbags first contact with the wafer. As the clamping claws continue to move, the edge of the wafer squeezes the clamping airbags, and the gas inside the clamping airbags flows into the interior of the detection seat along the air guide tube and the air guide hose. The air pressure value inside the detection seat increases. At this time, the air pressure sensor installed on the end face of the detection seat can sensitively detect the air pressure value inside the detection seat and transmit the pressure data to the external control system. When the set value is reached, the extension and retraction of the hydraulic rod is stopped, which can automatically adapt to the clamping operation of wafers of different sizes, while ensuring firm clamping and avoiding damage to the wafer. The overall stability, safety and practicality are effectively improved.

[0020] 2. The utility model can effectively prevent the support plate from causing damage to the surface of the wafer by sticking a supporting airbag on the supporting surface of the support plate. At the same time, the anti-slip bumps on the surface of the supporting airbag can effectively improve the position stability of the wafer on the supporting airbag, avoiding position slippage during the clamping process, and further improving the overall stability and practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1This is a first perspective view of the three-dimensional structure of the utility model;

[0022] Figure 2 This is the second perspective view of the three-dimensional structure of the utility model

[0023] In the figure: 1. Support seat; 2. Support plate; 3. Support airbag; 4. Clamping claw; 5. Clamping airbag; 6. Air guide tube; 7. Track; 8. Linkage plate; 9. Hydraulic rod; 10. Connecting rod; 11. Detection seat; 12. Air pressure sensor; 13. Air guide hose; 14. Linkage bar.

[0024] Specific real-time method

[0025] The method of the utility model is further described in detail below with reference to the accompanying drawings.

[0026] Reference Figure 1 、 Figure 2A stable and safe wafer semiconductor clamping structure includes a support base 1, a connecting rod 10 is fixedly connected to the end surface of the support base 1, one end of the connecting rod 10 is fixedly connected to the support plate 2, the back of the support plate 2 is fixedly connected to a plurality of tracks 7, a clamping claw 4 is slidably installed in the slide groove of the track 7, a clamping airbag 5 is glued to the clamping surface of the clamping claw 4, a plurality of groove structures are provided on the outer surface of one side of the clamping airbag 5, an air guide tube 6 is connected to the side surface of the clamping airbag 5, and an air guide hose 13 is fixedly installed on one end of the air guide tube 6, One end of the air guide hose 13 is connected to the detection seat 11, and a mounting hole is provided on the end surface of the detection seat 11, and an air pressure sensor 12 is installed inside the mounting hole. A linkage disk 8 is rotatably installed at the middle position of the lower surface of the support plate 2, and a through hole is provided at the central axis position of the linkage disk 8. A connecting rod 10 passes through the through hole, and a plurality of linkage bars 14 are rotatably connected at the edge position of the linkage disk 8. One end of the linkage bar 14 is rotatably connected to one end of the clamping claw 4. A hydraulic rod 9 is rotatably connected to the edge position of the lower surface of the support plate 2, and the extension of the hydraulic rod 9 The retracted end is rotatably connected to the edge of the linkage disk 8. When clamping the wafer, the hydraulic rod 9 is extended and retracted, and the linkage disk 8 is rotated by the hydraulic rod 9. Under the linkage of the linkage bar 14, multiple clamping claws 4 slide synchronously, and multiple clamping claws 4 can effectively clamp the wafer supported on the support plate 2. Since the clamping airbag 5 is adhered to the clamping surface of the clamping claw 4, the clamping airbag 5 first contacts the wafer. As the clamping claw 4 continues to move, the edge of the wafer squeezes the clamping airbag 5, and the gas inside the clamping airbag 5 follows the air guide The tube 6 and the air guide hose 13 flow into the interior of the detection seat 11, and the air pressure value inside the detection seat 11 increases. At this time, the air pressure sensor 12 installed on the end face of the detection seat 11 can sensitively detect the air pressure value inside the detection seat 11 and transmit the pressure data to the external control system. When the set value is reached, the extension and retraction of the hydraulic rod 9 is stopped. This can automatically adapt to the clamping operation of wafers of different sizes, while ensuring firm clamping, avoiding damage to the wafer, and the overall stability, safety and practicality have been effectively improved.

[0027] Referring to Figure 1, a supporting airbag 3 is glued to the upper surface of the support plate 2, and a plurality of anti-slip bumps are integrally connected to the upper surface of the supporting airbag 3. By sticking the supporting airbag 3 on the supporting surface of the support plate 2, the support plate 2 can be effectively prevented from causing damage to the surface of the wafer. At the same time, the anti-slip bumps on the surface of the supporting airbag 3 can effectively improve the position stability of the wafer on the supporting airbag 3, avoiding position slippage during the clamping process, and the overall stability and practicality are further improved.

[0028] Working principle: When in use, first install the structure at the specified position, and then turn on the external control system. At this time, normal clamping operations can be performed. When clamping the wafer, extend and retract the hydraulic rod 9, and use the hydraulic rod 9 to rotate the linkage disk 8. Under the linkage of the linkage bar 14, multiple clamping claws 4 slide synchronously, and multiple clamping claws 4 can effectively clamp the wafer supported on the support plate 2. Since the clamping airbag 5 is adhered to the clamping surface of the clamping claw 4, the clamping airbag 5 first contacts the wafer. As the clamping claw 4 continues to move, the edge of the wafer squeezes the clamping airbag 5, and the gas inside the clamping airbag 5 flows into the inspection along the air duct 6 and the air hose 13. Inside the measuring seat 11, the air pressure value inside the measuring seat 11 increases. At this time, the air pressure sensor 12 installed on the end face of the measuring seat 11 can sensitively detect the air pressure value inside the measuring seat 11 and transmit the pressure data to the external control system. When the set value is reached, the extension and retraction of the hydraulic rod 9 is stopped. This can automatically adapt to the clamping operations of wafers of different sizes. During the clamping process, the supporting airbag 3 pasted on the supporting surface of the support plate 2 can effectively prevent the support plate 2 from causing damage to the surface of the wafer. At the same time, the anti-slip bumps on the surface of the supporting airbag 3 can effectively improve the position stability of the wafer on the supporting airbag 3, and avoid position slippage during the clamping process.

[0029] The real-time examples of this specific real-time method are all preferred real-time examples of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A stable and safe wafer semiconductor clamping structure, comprising a support base (1), characterized in that: A connecting rod (10) is fixedly connected to the end surface of the support seat (1), one end of the connecting rod (10) is fixedly connected to a support plate (2), the back of the support plate (2) is fixedly connected to a plurality of tracks (7), a clamping claw (4) is slidably installed in the slide groove of the track (7), a clamping airbag (5) is glued to the clamping surface of the clamping claw (4), an air guide tube (6) is connected to the side surface of the clamping airbag (5), one end of the air guide tube (6) is fixedly installed with an air guide hose (13), one end of the air guide hose (13) is connected to a detection seat (11), a mounting hole is provided on the end surface of the detection seat (11), and an air pressure sensor (12) is installed inside the mounting hole.

2. The stable and safe wafer semiconductor clamping structure according to claim 1, characterized in that: A linkage disk (8) is rotatably mounted at the middle position of the lower surface of the support plate (2); a through hole is provided at the center axis position of the linkage disk (8); the connecting rod (10) passes through the through hole; a plurality of linkage bars (14) are rotatably connected at the edge position of the linkage disk (8); one end of the linkage bar (14) is rotatably connected to one end of the clamping claw (4).

3. The stable and safe wafer semiconductor clamping structure according to claim 2, characterized in that: A hydraulic rod (9) is rotatably connected to the edge of the lower surface of the support plate (2), and the telescopic end of the hydraulic rod (9) is rotatably connected to the edge of the linkage disk (8).

4. The stable and safe wafer semiconductor clamping structure according to claim 1, characterized in that: A supporting air bag (3) is glued to the upper surface of the support plate (2).

5. The stable and safe wafer semiconductor clamping structure according to claim 4, characterized in that: A plurality of anti-slip bumps are integrally connected to the upper surface of the supporting airbag (3).

6. The stable and safe wafer semiconductor clamping structure according to claim 1, characterized in that: A plurality of groove structures are provided on an outer surface of one side of the clamping airbag (5).

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