Integrated manufacturing method for ultrathin flexible light-emitting vehicle logo

Abstract

The invention relates to the technical field of automobile part manufacturing, in particular to an ultrathin flexible light-emitting automobile logo integrated manufacturing method which comprises the following steps that S1, a polycarbonate (PC) mask is formed through injection molding; s2, PET printing and pressing of the decorative layer are carried out; s3, mini LED light source integration is carried out; s4, assembling the heat dissipation base; step S5, back glue fitting and packaging; the automobile logo has the advantages that the total thickness of the automobile logo is controlled within 3.5 mm, the automobile logo is adaptive to the design of an ultrathin automobile body, efficient heat dissipation is achieved, the redundant adhesive film bonding step is omitted, the process is simplified, the yield is improved, an integrated heat dissipation channel is adopted, the metal base is combined with the PI flexible substrate, and the working temperature of an LED is reduced to 45 DEG C from 65 DEG C (the environment temperature is 25 DEG C); the LED working temperature is effectively reduced, the flexible substrate is supported, the method is suitable for installation of a curved-surface vehicle body with the curvature radius larger than or equal to 50 mm, and the application scene is expanded.

Description

Technical Field

[0001] The present invention relates to the technical field of automobile parts manufacturing, and in particular to a method for manufacturing an ultra-thin luminous vehicle logo based on a multi-layer composite structure and a miniLED light source. Background Art

[0002] As an important part of the car, the traditional luminous car logo currently has the following technical defects: 1. Thickness: Traditional LED car logos use a hard substrate and an independent heat dissipation structure, with a total thickness of usually ≥7mm, which is difficult to meet the requirements of lightweight and streamlined car body design; 2. Complex process: It needs to be assembled through multiple layers of film bonding, mechanical fixation and independent heat dissipation modules, with low yield and high cost; 3. Poor heat dissipation performance: The dense arrangement of LEDs can easily lead to local high temperatures (usually the operating temperature is ≥65°C under specific working conditions), affecting the life of the light source; 4. Insufficient flexibility and adaptability: The car logo cannot fit the curved car body with a curvature radius of <100mm, and the application scenarios are limited.

[0003] Technical content

[0004] In view of this, the purpose of the present invention is to provide an integrated manufacturing method for an ultra-thin flexible luminous vehicle logo, which is suitable for new energy vehicles, high-end automobile brand logos and personalized vehicle logo customization, so as to overcome the shortcomings of the above-mentioned prior art.

[0005] The present invention provides an integrated manufacturing method for an ultra-thin flexible luminous vehicle logo, comprising the following steps:

[0006] Step S1: injection molding a polycarbonate (PC) mask;

[0007] Step S11: using polycarbonate material to injection mold the mask, the mask body thickness is 1 mm, and the side wall thickness is 0.5±0.05 mm;

[0008] Step S12: pre-carve the outline of the vehicle logo pattern on the back of the mask body for subsequent filling of the decorative layer;

[0009] Step S2: PET printing and lamination of the decorative layer;

[0010] Step S21: Printing a car logo pattern on the surface of a 0.6±0.1 mm thick PET (polyethylene terephthalate film);

[0011] Step S22: seamlessly combining the PET film and the PC mask by hot pressing;

[0012] Step S3: mini LED light source integration;

[0013] Step S31: welding a mini LED wafer array on a 0.15±0.05 mm thick PI (polyimide) flexible substrate;

[0014] Step S32: Cover with a 0.25 mm UV curing sealant layer (UV curing is a technology that uses ultraviolet rays (UV) to trigger a photochemical reaction to rapidly cure the material) to achieve IP67 waterproof and mechanical protection;

[0015] Step S4: assembling the heat dissipation base;

[0016] Step S41: using a 1±0.05 mm thick aluminum alloy base with embedded micro heat sink fins;

[0017] Step S42: Fixing the PI flexible substrate and the aluminum alloy base by laser welding to form an integrated heat dissipation channel;

[0018] Step S5: adhesive bonding and packaging;

[0019] Step S51: Paste a 0.4±0.05 mm thick 3M VHB double-sided adhesive film (polyacrylate viscoelastic) on the back of the aluminum alloy base;

[0020] Step S52: The total thickness after overall packaging is ≤3.5mm, and supports direct pasting on curved car bodies. The total thickness after overall packaging refers to the thickness from the uppermost mask body to the lowermost 3M VHB double-sided adhesive film.

[0021] As a preferred embodiment of the present invention, the side wall thickness of the mask body in step S1 is 0.5 mm.

[0022] As a preferred embodiment of the present invention, the thickness of the PET film in step S2 is 0.6 mm.

[0023] As a preferred embodiment of the present invention, the thickness of the PI flexible substrate in step S2 is 0.15 mm.

[0024] As a preferred embodiment of the present invention, the pitch of the mini LED wafer array in step S3 is ≤0.5 mm.

[0025] As a preferred embodiment of the present invention, the UV curing sealant layer in step S31 has a covering thickness of 0.25 mm.

[0026] As a preferred embodiment of the present invention, the thickness of the aluminum alloy base in step S41 is 1 mm.

[0027] As a preferred embodiment of the present invention, the heat sink fins in step S41 have a height of 0.3 mm and a spacing of 0.8 mm.

[0028] As a preferred embodiment of the present invention, the thickness of the 3M VHB double-sided adhesive film in step S41 is 0.4 mm.

[0029] The advantages of the present invention are:

[0030] 1. The method of the present invention can control the total thickness of the vehicle logo within 3.5 mm, which is suitable for ultra-thin vehicle body design.

[0031] 2. The method of the present invention achieves efficient heat dissipation. By eliminating redundant adhesive film bonding steps, the process is simplified and the yield is improved. That is, three adhesive film bonding processes are eliminated, the yield is increased by 25%, and the production cost is reduced by 20%.

[0032] 3. The method of the present invention adopts an integrated heat dissipation channel, and by combining the metal base with the PI flexible substrate, the LED operating temperature is reduced from 65°C to 45°C (ambient temperature 25°C), thereby effectively reducing the LED operating temperature.

[0033] 4. The method of the present invention supports flexible substrates and is suitable for installation on curved vehicle bodies with a curvature radius of ≥50 mm, thus expanding application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is an exploded view of the overall structure of an integrated manufacturing method for an ultra-thin flexible luminous vehicle logo according to the present invention.

[0035] Figure 2 The present invention is a process flow chart of an integrated manufacturing method for an ultra-thin flexible luminous vehicle logo.

[0036] Figure 3 This is a schematic diagram of the aluminum alloy base micro-heat dissipation fin structure of an integrated manufacturing method for an ultra-thin flexible luminous vehicle logo of the present invention.

[0037] Figure 4 A top view of an ultra-thin flexible luminous vehicle logo according to an integrated manufacturing method of an ultra-thin flexible luminous vehicle logo of the present invention.

[0038] Figure 5 A schematic diagram of an ultra-thin flexible luminous vehicle logo according to an integrated manufacturing method of an ultra-thin flexible luminous vehicle logo of the present invention.

[0039] Figure numerals: mask 1, PET film 2, PI flexible substrate 3, mini LED wafer array 4, UV curing sealing layer 5, aluminum alloy base 6, 3M VHB double-sided adhesive film 7. DETAILED DESCRIPTION

[0040] See also Figure 1-5 This embodiment provides an integrated manufacturing method for an ultra-thin flexible luminous vehicle logo, which specifically includes the following steps:

[0041] Step S1: injection molding a polycarbonate (PC) mask;

[0042] Step S11: using polycarbonate material to injection mold the mask 1, the main body thickness of the mask 1 is 1 mm, and the side wall thickness is 0.5 mm;

[0043] Step S12: pre-engraving the outline of the vehicle logo pattern on the back of the mask 1 body for subsequent filling of the decorative layer;

[0044] Step S2: PET printing and lamination of the decorative layer;

[0045] Step S21: Printing a car logo pattern on the surface of the 0.6 mm thick PET film 2;

[0046] Step S22: seamlessly combining the PET film 2 and the PC mask 1 by hot pressing;

[0047] Step S3: mini LED light source integration;

[0048] Step S31: welding the mini LED wafer array 4 on the 0.15 mm thick PI flexible substrate 3;

[0049] Step S32: Cover with a 0.25 mm UV curing sealant layer 5 to achieve IP67 waterproof and mechanical protection;

[0050] Step S4: assembling the heat dissipation base;

[0051] Step S41: using a 1 mm thick aluminum alloy base 6 with embedded micro heat sink fins;

[0052] Step S42: Fix the PI flexible substrate 3 and the aluminum alloy base 6 by laser welding to form an integrated heat dissipation channel;

[0053] Step S5: adhesive bonding and packaging;

[0054] Step S51: Paste a 0.4 mm thick 3M VHB double-sided adhesive film 7 on the back of the aluminum alloy base 6;

[0055] Step S52: The total thickness after overall packaging is ≤3.5 mm, and supports direct pasting on curved car bodies, wherein the total thickness after overall packaging refers to the thickness from the uppermost mask 1 body to the lowermost 3M VHB double-sided adhesive film 7.

Claims

1. A method for manufacturing an ultra-thin flexible luminous vehicle logo, characterized in that: The following steps are involved: Step S1: injection molding a polycarbonate (PC) mask; Step S11: using polycarbonate material to injection mold the mask, the mask body thickness is 1 mm, and the side wall thickness is 0.5±0.05 mm; Step S12: pre-carve the outline of the vehicle logo pattern on the back of the mask body for subsequent filling of the decorative layer; Step S2: PET printing and lamination of the decorative layer; Step S21: Printing a car logo pattern on the surface of a 0.6±0.1 mm thick PET film; Step S22: seamlessly combining the PET film and the PC mask by hot pressing; Step S3: mini LED light source integration; Step S31: welding a mini LED wafer array on a 0.15±0.05 mm thick PI flexible substrate; Step S32: Cover with a 0.25 mm UV curing sealant layer to achieve IP67 waterproof and mechanical protection; Step S4: assembling the heat dissipation base; Step S41: using a 1±0.05 mm thick aluminum alloy base with embedded micro heat sink fins; Step S42: Fixing the PI flexible substrate and the aluminum alloy base by laser welding to form an integrated heat dissipation channel; Step S5: adhesive bonding and packaging; Step S51: Paste a 0.4±0.05 mm thick 3M VHB double-sided adhesive film on the back of the aluminum alloy base; Step S52: The total thickness after overall packaging is ≤3.5mm, and supports direct pasting on curved car bodies. The total thickness after overall packaging refers to the thickness from the uppermost mask body to the lowermost 3M VHB double-sided adhesive film.

2. The method for manufacturing an ultra-thin flexible luminous vehicle logo according to claim 1, characterized in that: The thickness of the side wall of the mask body in step S1 is 0.5 mm.

3. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The thickness of the PET film in step S2 is 0.6 mm.

4. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The thickness of the PI flexible substrate in step S2 is 0.15 mm.

5. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The pitch of the mini LED wafer array in step S3 is ≤0.5 mm.

6. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The UV curing sealant layer in step S31 has a coverage thickness of 0.25 mm.

7. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The thickness of the aluminum alloy base in step S41 is 1 mm.

8. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The heat dissipation fins in step S41 have a height of 0.3 mm and a spacing of 0.8 mm.

9. The method for manufacturing an ultra-thin flexible luminous vehicle logo in an integrated manner according to claim 1, characterized in that: The thickness of the 3M VHB double-sided adhesive film in step S41 is 0.4 mm.

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