Heat dissipation device

Abstract

The invention discloses a heat dissipation device, and relates to the technical field of heat exchange devices. The heat dissipation device comprises a refrigeration plate and a parallel flow heat exchanger, the first side of the refrigeration plate is arranged on the heating device, and a refrigeration working medium loaded in the refrigeration plate absorbs heat generated by the heating device and is vaporized; the parallel flow heat exchanger mounted above the refrigeration plate is provided with a heat exchange inlet and a heat exchange outlet which are communicated with the interior of the refrigeration plate, and the heat exchange outlet is lower than the heat exchange inlet, so that a vaporized refrigeration working medium enters the parallel flow heat exchanger from the heat exchange inlet to release heat and be liquefied; and the liquefied refrigeration working medium flows back to the refrigeration plate from the heat exchange outlet under the action of gravity. According to the heat dissipation device, the refrigeration working medium serves as a heat exchange medium, and the heat dissipation performance of the heat dissipation device is better; the refrigerant only depends on gravity to serve as circulating power, and the size of the heat dissipation device is smaller; interference of dust, corrosive gas, moisture and the like on the heating device is reduced, and the working performance of the heating device is more stable.

Description

Technical Field

[0001] The present application relates to the technical field of heat exchange devices, and in particular to a heat dissipation device. Background Art

[0002] In the field of thermal management of energy, electronics, and smart devices, taking charging piles as an example, as the power of charging piles gradually increases, their heat loss also becomes larger and larger. This heat must be discharged from the equipment, otherwise it will accelerate the aging of the equipment. It can be seen that the heat dissipation problem of charging piles has become a major factor restricting its development.

[0003] At present, the cooling methods of charging piles mainly include natural cooling relying on heat sinks, forced air cooling and water cooling. Due to factors such as volume, cost, and reliability, forced air cooling is the mainstream cooling method. With respect to the above cooling methods, the inventors have found that there are at least the following technical problems in the prior art:

[0004] The use of air cooling is bound to bring interference such as dust, corrosive gases, and moisture, making the working environment of the working equipment harsh and affecting the performance of the working equipment; the cooling capacity of air cooling is limited, and it is difficult to further improve the heat exchange efficiency; air cooling requires the use of compressors, fluorine pumps and other equipment to provide power, which occupies a large volume. Summary of the invention

[0005] The purpose of the present application is to provide a heat dissipation device, which uses a refrigerant as a heat exchange medium. The refrigerant relies solely on gravity as a circulation power, making the size of the heat dissipation device smaller; the refrigerant improves the heat exchange efficiency and heat equalization effect, making the heat dissipation performance of the heat dissipation device better; the refrigerant improves the heat exchange mode between the heating device and the air, reduces the interference of dust, corrosive gases, moisture, etc. on the heating device, and makes the working performance of the heating device more stable.

[0006] To achieve the above object, the present application provides a heat dissipation device, the heat dissipation device comprising:

[0007] A refrigeration plate, the first side of which is used to be arranged on the heating device, the interior of the refrigeration plate is loaded with a refrigerant, and the refrigerant is used to absorb the heat generated by the heating device and vaporize;

[0008] A parallel flow heat exchanger is installed above the refrigeration plate. The parallel flow heat exchanger is provided with a heat exchange inlet and a heat exchange outlet which are connected to the interior of the refrigeration plate, and the heat exchange outlet is lower than the heat exchange inlet, so that the vaporized refrigerant enters the parallel flow heat exchanger from the heat exchange inlet to release heat and liquefy, and the liquefied refrigerant flows back to the refrigeration plate from the heat exchange outlet under the action of gravity.

[0009] In some embodiments, a refrigerant flow channel is provided inside the refrigeration plate, the refrigerant flow channel is connected to the heat exchange outlet of the parallel flow heat exchanger in the inlet direction, and the refrigerant flow channel is connected to the heat exchange inlet of the parallel flow heat exchanger in the outlet direction.

[0010] In some embodiments, the communication position between the heat exchange outlet of the parallel flow heat exchanger and the refrigerant flow channel is arranged diagonally on the refrigeration plate with respect to the communication position between the heat exchange inlet of the parallel flow heat exchanger and the refrigerant flow channel.

[0011] In some embodiments, an inner exchange space is formed between the parallel flow heat exchanger and the second side of the refrigeration plate; and the heat dissipation device further includes a fan disposed in the inner exchange space.

[0012] In some embodiments, the fan is arranged facing the parallel flow heat exchanger, and the angle between the airflow direction generated by the fan and the plane where the parallel flow heat exchanger is located is less than or equal to 90°.

[0013] In some embodiments, the direction of the airflow generated by the fan is also parallel to the plane where the refrigeration plate is located.

[0014] In some embodiments, the cooling plate is used to cover at least a portion of the heat generating device, and the cooling plate is used to be in surface contact with the heat generating device.

[0015] In some embodiments, an angle between a plane where the parallel flow heat exchanger is located and a plane where the refrigeration plate is located is less than or equal to 90°.

[0016] In some embodiments, there are multiple parallel flow heat exchangers, and the multiple parallel flow heat exchangers are arranged at intervals on the refrigeration plate.

[0017] In some embodiments, there are multiple refrigeration plates; some of the multiple refrigeration plates are connected in parallel between the heat exchange inlet and the heat exchange outlet of the parallel flow heat exchanger, and / or some of the multiple refrigeration plates are connected in series between the heat exchange inlet and the heat exchange outlet of the parallel flow heat exchanger.

[0018] Compared with the above-mentioned background technology, the heat dissipation device provided in the present application includes a cooling plate and a parallel flow heat exchanger. The first side of the cooling plate is arranged on the heating device. The interior of the cooling plate is loaded with a refrigerant. The refrigerant absorbs the heat generated by the heating device and vaporizes. The parallel flow heat exchanger is installed above the cooling plate. The parallel flow heat exchanger is provided with a heat exchange inlet and a heat exchange outlet connected to the interior of the cooling plate, and the heat exchange outlet is lower than the heat exchange inlet, so that the vaporized refrigerant enters the parallel flow heat exchanger from the heat exchange inlet to release heat and liquefy, and the liquefied refrigerant flows back to the cooling plate from the heat exchange outlet under the action of gravity.

[0019] During the use of the heat dissipation device, because the heat dissipation device is installed with the heating device and the first side of the refrigeration plate is arranged on the heating device, when the heating device generates heat, the refrigeration plate and the refrigerant loaded therein perform heat exchange with the heating device, and the heat of the heating device enters the refrigeration plate and is absorbed by the refrigerant; based on the above-mentioned cooling process of the heating device by the refrigerant, the refrigerant accepts heat and rises in temperature, and the refrigerant undergoes a phase change inside the refrigeration plate due to heat absorption, and continues to absorb heat during the phase change process. While the refrigerant cools the heating device, the refrigerant vaporizes from liquid to gas; based on the above-mentioned phase change process of the refrigerant inside the refrigeration plate, the refrigerant vaporizes from liquid to gas flows upward from the refrigeration plate into the parallel flow heat exchanger, and the position where the refrigerant flows into the parallel flow heat exchanger is the parallel flow exchanger. The heat exchange inlet on the parallel flow heat exchanger, the refrigerant releases heat and cools down due to the parallel flow heat exchange effect of the parallel flow heat exchanger, the refrigerant undergoes phase change due to heat release in the parallel flow heat exchanger, and the refrigerant is finally liquefied from gas to liquid; based on the above phase change process of the refrigerant in the parallel flow heat exchanger, the refrigerant liquefied from gas to liquid flows downward from the parallel flow heat exchanger back to the refrigeration plate, and the position where the refrigerant flows out of the parallel flow heat exchanger is the heat exchange outlet on the parallel flow heat exchanger. Because the heat exchange outlet is lower than the heat exchange inlet, the refrigerant realizes liquid flow from the parallel flow heat exchanger to the refrigeration plate only under the action of gravity; based on the above entire process, the refrigerant, as a heat exchange medium, circulates heat absorption and heat release in the refrigeration plate and the parallel flow heat exchanger in the form of heat exchange phase change, thereby realizing the heat dissipation function of the heat dissipation device for the heat-generating component.

[0020] Combined with the above structure and process description, it can be seen that the heat dissipation device uses a refrigerant as a heat exchange medium. The refrigerant flows upward into the parallel flow heat exchanger when it is in a gaseous state, and flows downward back to the refrigeration plate when it is in a liquid state. The refrigerant relies only on gravity as a circulation power. Compared with the forced air cooling method, there is no need to use a compressor, a fluorine pump and other equipment to provide power like forced air cooling, so that the volume of the heat dissipation device is smaller; the refrigerant absorbs heat in the form of liquid in the refrigeration plate, and releases heat in the form of gas in the parallel flow heat exchanger, which improves the heat exchange efficiency and heat equalization effect of the heat dissipation device, and makes the heat dissipation performance of the heat dissipation device better; the refrigerant improves the heat exchange method between the heating device and the air. Compared with the forced air cooling method, it can also achieve and improve the heat dissipation effect of the heating device without promoting the air flow in the space where the heating device is located as the main means. The air flow environment in the space where the heating device is located is peaceful and stable, which reduces the interference of dust, corrosive gases, moisture, etc. on the heating device, and makes the working performance of the heating device more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0022] Figure 1 A front view of the heat dissipation device provided in the first embodiment of the present application;

[0023] Figure 2 A left side view of the heat dissipation device provided in the first embodiment of the present application;

[0024] Figure 3 A top view of a heat dissipation device provided in a first embodiment of the present application;

[0025] Figure 4 A front view of a heat dissipation device provided in a second embodiment of the present application;

[0026] Figure 5 A left side view of a heat dissipation device provided in a second embodiment of the present application;

[0027] Figure 6 A top view of a heat dissipation device provided in a second embodiment of the present application;

[0028] Figure 7 A left side view of a heat dissipation device provided in a third embodiment of the present application;

[0029] Figure 8 A top view of a heat dissipation device provided in a third embodiment of the present application;

[0030] Fig. 9 A schematic diagram of a parallel connection of a heat dissipation device provided in a fourth embodiment of the present application;

[0031] Fig.10 A schematic diagram of the series connection of heat dissipation devices provided in the fifth embodiment of the present application.

[0032] in:

[0033] 01. Heating device;

[0034] 10. Refrigeration plate; 20. Parallel flow heat exchanger; 30. Fan; 40. Copper tube;

[0035] 21. Heat exchange inlet; 22. Heat exchange outlet;

[0036] 101. First communication position; 102. Second communication position; 103. Inner exchange space; 104. Outer exchange space. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] The present application relates to the field of thermal management of energy, electronics, and intelligent devices, so it can be an improvement on the heat dissipation method of the charging pile power module. At present, the production and sales of new energy vehicles are growing rapidly, and the demand for charging piles is increasing. Compared with other power sources, the system heat dissipation of charging piles is much larger, and the system thermal design requirements are extremely strict. The efficiency of charging piles is generally around 95%, so 5% of it is converted into heat loss. As the power of the charging pile gradually increases, its heat loss is also increasing. This heat must be discharged from the equipment, otherwise it will accelerate the aging of the equipment. It can be seen that the heat dissipation problem of charging piles has become a major factor restricting its development. There are currently four commonly used charging pile refrigeration methods: natural cooling (mainly relying on heat sinks), forced air cooling, water cooling, and air conditioning. Due to the influence of factors such as volume, cost, and reliability, most of them are currently handled by forced air cooling. The use of air cooling is bound to bring interference such as dust, corrosive gases, and moisture, and the air cooling capacity is limited, and the temperature control and temperature averaging capabilities are poor; the use of air conditioning for heat dissipation is costly, the equipment volume is relatively large, and the air conditioner also provides cold air, and the temperature averaging capabilities of each power module are poor.

[0040] In view of the above technical problems, the present application provides a heat dissipation device. Take the accompanying drawings of the first embodiment of the heat dissipation device as an example; please refer to Figures 1 to 3 , Figure 1 This is a front view of the heat dissipation device provided in the first embodiment of the present application. Figure 2 This is a left side view of the heat dissipation device provided in the first embodiment of the present application. Figure 3 A top view of the heat dissipation device provided in the first embodiment of the present application.

[0041] like Figures 1 to 3 As shown, the heat dissipation device mainly includes a refrigeration plate 10 and a parallel flow heat exchanger 20 .

[0042] For the refrigeration plate 10, the heat sink is used to dissipate heat from power-consuming devices such as the heating device 01 shown in the figure, so the heat sink and the heating device 01 are installed together, and the first side of the refrigeration plate 10 is arranged on the heating device 01, so that the refrigeration plate 10 is located above the heating device 01. The interior of the refrigeration plate 10 is loaded with a refrigerant, which is a medium that realizes heat exchange by a phase change cycle process. The refrigerant is in a liquid state before absorbing heat, and can be vaporized and changed into a gaseous state after absorbing the heat generated by the heating device 01.

[0043] For the parallel flow heat exchanger 20, the refrigerant circulates in the refrigeration plate 10 and the parallel flow heat exchanger 20 to achieve heat exchange between the heat generated by the heating device 01 and the heat dissipation device, so the parallel flow heat exchanger 20 is connected to the refrigeration plate 10 and forms a circulation loop. The parallel flow heat exchanger 20 is connected to the inside of the refrigeration plate 10 and corresponds to the position where the refrigerant enters the parallel flow heat exchanger 20 as the heat exchange inlet 21, and the parallel flow heat exchanger 20 is connected to the inside of the refrigeration plate 10 and corresponds to the position where the refrigerant leaves the parallel flow heat exchanger 20 as the heat exchange outlet 22. The parallel flow heat exchanger 20 is installed above the refrigeration plate 10, so the heat exchange inlet 21 and the heat exchange outlet 22 are both located above the refrigeration plate 10, and the heat exchange outlet 22 is lower than the heat exchange inlet 21, so the refrigerant enters the parallel flow heat exchanger 20 upward from the heat exchange inlet 21 after being vaporized into a gaseous state, and leaves the parallel flow heat exchanger 20 downward from the heat exchange outlet 22 after releasing heat and liquefying into a liquid state in the parallel flow heat exchanger 20; the refrigerant in this process is only affected by gravity, corresponding to the refrigerant vaporized into a gaseous state rising into the parallel flow heat exchanger 20, and the refrigerant liquefied into a liquid state sinking and flowing back to the refrigeration plate 10.

[0044] During the use of the heat dissipation device, because the heat dissipation device is installed with the heating device 01, and the first side of the refrigeration plate 10 is arranged on the heating device 01, when the heating device 01 generates heat, the refrigeration plate 10 and the refrigerant loaded therein perform heat exchange with the heating device 01, and the heat of the heating device 01 enters the refrigeration plate 10 and is absorbed by the refrigerant; based on the above-mentioned cooling process of the heating device 01 by the refrigerant, the refrigerant receives heat and rises in temperature, and the refrigerant undergoes a phase change inside the refrigeration plate 10 due to heat absorption, and continues to absorb heat during the phase change process. While the refrigerant cools the heating device 01, the refrigerant vaporizes from liquid to gas; based on the above-mentioned phase change process of the refrigerant inside the refrigeration plate 10, the refrigerant vaporized from liquid to gas flows upward from the refrigeration plate 10 into the parallel flow heat exchanger 20, and the position where the refrigerant flows into the parallel flow heat exchanger 20 is the parallel flow heat exchanger. At the heat exchange inlet 21 on 20, the refrigerant releases heat and cools down due to the parallel flow heat exchange effect of the parallel flow heat exchanger 20. The refrigerant undergoes a phase change in the parallel flow heat exchanger 20 due to heat release, and the refrigerant is finally liquefied from a gaseous state to a liquid state. Based on the above phase change process of the refrigerant in the parallel flow heat exchanger 20, the refrigerant liquefied from a gaseous state flows downward from the parallel flow heat exchanger 20 back to the refrigeration plate 10, and the position where the refrigerant flows out of the parallel flow heat exchanger 20 is the heat exchange outlet 22 on the parallel flow heat exchanger 20. Because the heat exchange outlet 22 is lower than the heat exchange inlet 21, the refrigerant realizes liquid flow from the parallel flow heat exchanger 20 to the refrigeration plate 10 only under the action of gravity. Based on the above entire process, the refrigerant, as a heat exchange medium, absorbs and releases heat in a cycle in the form of heat exchange phase change in the refrigeration plate 10 and the parallel flow heat exchanger 20, thereby realizing the heat dissipation function of the heat dissipation device for the heat-generating device 01.

[0045] Combined with the above structure and process description, it can be seen that the heat dissipation device uses a refrigerant as a heat exchange medium. The refrigerant flows upward into the parallel flow heat exchanger 20 when it is in a gaseous state, and flows downward back to the refrigeration plate 10 when it is in a liquid state. The refrigerant relies only on gravity as a circulation power. Compared with the forced air cooling method, there is no need to use a compressor, a fluorine pump and other equipment to provide power like forced air cooling, so that the volume of the heat dissipation device is smaller; the refrigerant absorbs heat in the form of liquid in the refrigeration plate 10, and releases heat in the form of gas in the parallel flow heat exchanger 20. The heat exchange efficiency and heat equalization effect of the heat dissipation device are improved, and the heat dissipation performance of the heat dissipation device is better; the refrigerant improves the heat exchange mode between the heating device 01 and the air. Compared with the forced air cooling mode, the heat dissipation effect of the heating device 01 can also be achieved and improved without promoting the air flow in the space where the heating device 01 is located as the main means. The air flow environment in the space where the heating device 01 is located is peaceful and stable, which reduces the interference of dust, corrosive gases, moisture, etc. on the heating device 01, and makes the working performance of the heating device 01 more stable.

[0046] In some cases, the parallel flow heat exchanger 20 includes a header section at both ends and a parallel tube section connected between the header sections at both ends, and the refrigerant exchanges heat with the air when flowing in the parallel tube section; in addition, the heat exchange inlet 21 and the heat exchange outlet 22 of the parallel flow heat exchanger 20 can be set on the header sections at both ends.

[0047] In some embodiments, a refrigerant flow channel is provided inside the refrigeration plate 10, and the refrigerant flow channel is connected to the heat exchange outlet 22 of the parallel flow heat exchanger 20 in the inlet direction, and the refrigerant flow channel is connected to the heat exchange inlet 21 of the parallel flow heat exchanger 20 in the outlet direction.

[0048] In this embodiment, a refrigerant flow channel is provided inside the refrigeration plate 10 to provide a guiding effect on the flow of the refrigerant, so that the flow of the refrigerant along the refrigerant flow channel in the refrigeration plate 10 and the flow of the refrigerant from the heat exchange inlet 21 to the heat exchange outlet 22 in the parallel flow heat exchanger 20 form a cycle; specifically, the refrigerant enters the refrigerant flow channel from the heat exchange outlet 22 of the parallel flow heat exchanger 20, and enters the heat exchange inlet 21 of the parallel flow heat exchanger 20 when leaving the refrigerant flow channel.

[0049] There are many forms of refrigerant flow channels, including but not limited to pipeline type, channel type, hole type, etc., which should all fall within the scope of the present embodiment. By providing a refrigerant flow channel, the orderliness and uniformity of the flow of the refrigerant inside the refrigeration plate 10 can be improved, and the problems of disordered flow and dead zones of the refrigerant can be avoided, thereby improving the heat exchange uniformity and heat exchange efficiency between the refrigeration plate 10 and the refrigerant inside it as a whole and the heating device 01, thereby improving the heat dissipation performance of the heat dissipation device.

[0050] In some embodiments, take the drawings of the second embodiment of the heat dissipation device as an example; please refer to Figures 4 to 6 , Figure 4 This is a front view of the heat dissipation device provided in the second embodiment of the present application. Figure 5 This is a left side view of the heat dissipation device provided in the second embodiment of the present application. Figure 6 A top view of a heat dissipation device provided in the second embodiment of the present application.

[0051] like Figures 4 to 6 As shown, the heat exchange outlet 22 of the parallel flow heat exchanger 20 and the connecting position of the refrigerant flow channel (corresponding to Figure 6 The first communication position 101 in the parallel flow heat exchanger 20 is connected to the heat exchange inlet 21 and the coolant flow channel (corresponding to the first communication position 101 in the parallel flow heat exchanger 20) Figure 6 The second communication position 102 in the cooling plate 10 is arranged diagonally on the cooling plate 10.

[0052] In this embodiment, the first connecting position 101 and the second connecting position 102 are diagonally arranged on the refrigeration plate 10. Compared with the non-diagonal arrangement, the diagonally arranged first connecting position 101 and the second connecting position 102 have a larger span on the refrigeration plate 10. The advantage of such an arrangement is that the first connecting position 101 and the second connecting position 102 serve as the entrance and exit of the refrigerant on the refrigeration plate 10. The diagonal arrangement can dispatch more refrigerants in the refrigeration plate 10, thereby improving the heat exchange uniformity and heat exchange efficiency between the refrigeration plate 10 as a whole and the heating device 01, thereby improving the heat dissipation performance of the heat dissipation device.

[0053] In some cases, the refrigeration plate 10 is connected to the corresponding ports of the parallel flow heat exchanger 20 through the copper tube 40 at the first connecting position 101 and the second connecting position 102; in addition, the refrigeration plate 10 and the parallel flow heat exchanger 20 can also adopt other connecting methods, such as non-pipe interfaces, etc., which should also fall within the scope of the description of this embodiment.

[0054] Please continue to refer to Figures 1 to 3 In some embodiments, an inner exchange space 103 is formed between the parallel flow heat exchanger 20 and the second side of the refrigeration plate 10 , and the heat dissipation device further includes a fan 30 disposed in the inner exchange space 103 .

[0055] exist Figure 2 According to the positional relationship between the parallel flow heat exchanger 20 and the refrigeration plate 10, the space where the parallel flow heat exchanger 20 is located is divided into an inner exchange space 103 and an outer exchange space 104. The inner exchange space 103 is the portion between the parallel flow heat exchanger 20 and the second side of the refrigeration plate 10 (corresponding to Figure 2 The outer exchange space 104 is the portion other than the inner exchange space 103 (corresponding to the Figure 2 The fan 30 is arranged in the inner exchange space 103. On the one hand, the space between the parallel flow heat exchanger 20 and the refrigeration plate 10 is fully utilized. The arrangement of the fan 30 will not increase the volume of the heat dissipation device, thus saving the layout space. On the other hand, the arrangement of the fan 30 can promote the flow of airflow. The promotion of the flow of airflow mainly occurs in the inner exchange space 103 and can extend to the outer exchange space 104, thereby improving the heat exchange efficiency of the parallel flow heat exchanger 20 and improving the heat dissipation performance of the heat dissipation device.

[0056] Furthermore, the fan 30 is arranged facing the parallel flow heat exchanger 20, and the angle between the airflow direction generated by the fan 30 and the plane where the parallel flow heat exchanger 20 is located is less than or equal to 90°.

[0057] In this embodiment, by arranging the fan 30 to face the parallel flow heat exchanger 20 , the airflow blown by the fan 30 directly acts on the parallel flow heat exchanger 20 , thereby improving the heat exchange efficiency of the parallel flow heat exchanger 20 .

[0058] In addition, according to the different inclination angles of the parallel flow heat exchanger 20 relative to the refrigeration plate 10, the angle between the airflow direction generated by the fan 30 and the plane where the parallel flow heat exchanger 20 is located is less than or equal to 90°. Figures 1 to 3 In the first embodiment shown, the inclination angle of the parallel flow heat exchanger 20 relative to the refrigeration plate 10 is between 0° and 90°, and the angle between the airflow direction generated by the fan 30 and the plane where the parallel flow heat exchanger 20 is located is less than 90°; Figures 4 to 6 In the second embodiment shown, the inclination angle of the parallel flow heat exchanger 20 relative to the refrigeration plate 10 is a vertical angle, that is, 90°. At this time, the angle between the airflow direction generated by the fan 30 and the plane where the parallel flow heat exchanger 20 is located is equal to 90°.

[0059] Furthermore, the direction of the airflow generated by the fan 30 is also parallel to the plane where the refrigeration plate 10 is located.

[0060] In this embodiment, no matter which of the above embodiments is used and what the angle between the direction of the airflow generated by the fan 30 and the plane in which the parallel flow heat exchanger 20 is located, by arranging the fan 30 in the internal exchange space 103 and setting the direction of the airflow generated by the fan 30 to be parallel to the plane in which the refrigeration plate 10 is located, the heat absorbed by the refrigeration plate 10 from the heating element 01 below can also be carried away by the airflow blown by the fan 30 when it diffuses upward, which is equivalent to the fan 30 directly performing air cooling and heat dissipation on the second side of the refrigeration plate 10. Therefore, the heat dissipation device also has the performance of air cooling and heat dissipation, thereby improving the heat dissipation performance of the heat dissipation device.

[0061] In a specific embodiment, for the system control of the heat dissipation device, the control system of the present invention is relatively simple, and only needs to control the start and stop of the fan 30. The start and stop of the fan 30 can be synchronized with the start and stop of the heating device 01, or the start and stop of the fan 30 can be delayed for a period of time relative to the heating device 01.

[0062] In addition, in some embodiments, the cooling plate 10 is used to cover at least a portion of the heating device 01 , and the cooling plate 10 is used to be in surface contact with the heating device 01 .

[0063] In this embodiment, the cooling plate 10 can be in the form of completely covering the heating device 01 or partially covering the heating device 01, which will not affect the implementation of the above embodiment, and therefore should belong to the description scope of this embodiment. The cooling plate 10 and the heating device 01 perform heat exchange in the form of surface contact, thereby improving the heat exchange uniformity and heat exchange efficiency between the cooling plate 10 and the heating device 01 as a whole, and improving the heat dissipation performance of the heat dissipation device.

[0064] In some cases, the heat dissipation device is mainly used in the thermal management of the charging pile, so the heating device 01 can be a power module, and the cooling plate 10 in the above embodiment covers the surface of the power module. The cooling medium can be a refrigerant.

[0065] In a specific implementation, the angle between the plane where the parallel flow heat exchanger 20 is located and the plane where the refrigeration plate 10 is located is less than or equal to 90°.

[0066] Please continue to refer to Figures 1 to 3 ,exist Figures 1 to 3 In the first embodiment shown, the angle between the plane where the parallel flow heat exchanger 20 is located and the plane where the refrigeration plate 10 is located is less than 90°. When in use, the power module generates heat when working, and the heat enters the interior of the refrigeration plate 10 through heat conduction. The liquid refrigerant in the refrigeration plate 10 absorbs heat and vaporizes, and enters the parallel flow heat exchanger 20 under the force of gravity. The gaseous refrigerant exchanges heat with the air and liquefies in the parallel flow heat exchanger 20. Because the parallel flow heat exchanger 20 has a certain slope, the liquefied refrigerant flows to the refrigeration plate 10 for the next cycle under the action of gravity.

[0067] Please continue to refer to Figures 4 to 6 ,exist Figures 4 to 6 In the second embodiment shown, the angle between the plane where the parallel flow heat exchanger 20 is located and the plane where the refrigeration plate 10 is located is equal to 90°. In this embodiment, the parallel flow heat exchanger 20 is arranged at a vertical angle rather than a certain slope. On the basis of achieving the basic heat dissipation function, the refrigerant has the strongest circulation capacity with gravity as the circulation power, which helps to increase the speed at which the liquid refrigerant flows back to the refrigeration plate 10.

[0068] After experimental verification, the inventors found that the heat dissipation devices of the first embodiment and the second embodiment have the following advantages: the present invention uses refrigerant as the heat exchange medium to greatly improve the heat exchange efficiency and effectively reduce the size of the equipment; the present invention uses refrigerant as the heat exchange medium for good temperature control and heat equalization effects and a compact structure; the present invention does not use a compressor, a fluorine pump, etc. to provide power, and only relies on gravity as the system circulation power.

[0069] In a specific embodiment, there are multiple parallel flow heat exchangers 20 , and the multiple parallel flow heat exchangers 20 are arranged at intervals on the refrigeration plate 10 .

[0070] Please refer to Figure 7 and Figure 8 , Figure 7 This is a left side view of the heat dissipation device provided in the third embodiment of the present application. Figure 8 A top view of a heat dissipation device provided in the third embodiment of the present application.

[0071] contrast Figure 7 and Figure 5 , and contrast Figure 8 and Figure 6 , we can see that in Figure 7 and Figure 8 In the third embodiment shown, the parallel flow heat exchanger 20 is vertically mounted on the refrigeration plate 10 to facilitate the flow of liquefied refrigerant; a refrigeration plate 10 using multiple parallel flow heat exchangers 20 can effectively reduce the height of the parallel flow heat exchanger 20 and further reduce the volume of the unit. When in use, the power module generates heat during operation, and the heat enters the interior of the refrigeration plate 10 through heat conduction. The liquid refrigerant in the refrigeration plate 10 absorbs heat and vaporizes, and enters the parallel flow heat exchanger 20 under the force of gravity. The gaseous refrigerant exchanges heat and liquefies with the air in the parallel flow heat exchanger 20. Because the parallel flow heat exchanger 20 is placed vertically, the liquefied refrigerant flows to the refrigeration plate 10 under the action of gravity for the next cycle.

[0072] After experimental demonstration, the inventor found that the above-mentioned third embodiment has the following advantages: the present invention adopts refrigerant as the heat exchange medium to greatly improve the heat exchange efficiency and effectively reduce the size of the equipment; the present invention adopts refrigerant as the heat exchange medium to achieve good temperature control and heat equalization effects and a compact structure; the present invention does not use compressors, fluorine pumps, etc. to provide power, but only relies on gravity as the system circulation power; the present invention adopts multiple gravity systems to cool the power module, and has a large refrigeration capacity; the present invention adopts multiple gravity systems to reduce the length of the copper tube, reduce the resistance within the system, and is more conducive to the circulation of the gravity system.

[0073] In some embodiments, there are multiple refrigeration plates 10; some of the multiple refrigeration plates 10 are connected in parallel between the heat exchange inlet 21 and the heat exchange outlet 22 of the parallel flow heat exchanger 20, and / or, some of the multiple refrigeration plates 10 are connected in series between the heat exchange inlet 21 and the heat exchange outlet 22 of the parallel flow heat exchanger 20.

[0074] Please refer to Fig. 9 and Fig.10 , Fig. 9 A schematic diagram of the parallel connection of the heat dissipation device provided in the fourth embodiment of the present application, Fig.10 A schematic diagram of the series connection of heat dissipation devices provided in the fifth embodiment of the present application.

[0075] exist Fig. 9 In the fourth embodiment shown, a plurality of refrigeration plates 10 are connected in parallel between the heat exchange inlet 21 and the heat exchange outlet 22 of the parallel flow heat exchanger 20. Fig.10 and Fig. 9 , we can see that in Fig.10 In the fifth embodiment shown, a plurality of refrigeration plates 10 are connected in series between a heat exchange inlet 21 and a heat exchange outlet 22 of a parallel flow heat exchanger 20 .

[0076] In the fourth and fifth embodiments, each power module generates heat during operation, and the refrigerant liquid in the refrigeration plate 10 absorbs heat and vaporizes, and then enters the parallel flow heat exchanger 20 at a high position, and the gaseous refrigerant exchanges heat with the air and liquefies in the parallel flow heat exchanger 20; because the parallel flow heat exchanger 20 is installed at a high position, the liquefied refrigerant flows to the bottom of the parallel flow heat exchanger 20 under the action of gravity and enters each refrigeration plate 10 for the next cycle.

[0077] After experimental verification, the inventors found that the fourth embodiment and the fifth embodiment have the following advantages: the present invention uses refrigerant as the heat exchange medium to greatly improve the heat exchange efficiency and effectively reduce the size of the equipment; the present invention uses refrigerant as the heat exchange medium, which has good temperature control and heat equalization effects and a compact structure; the present invention does not use a compressor, a fluorine pump, etc. to provide power, and only relies on gravity as the system circulation power; the present invention uses a parallel flow heat exchanger to connect multiple refrigeration plates to cool multiple power modules at the same time, which can reduce the contact between the power modules and the air, thereby avoiding interference from dust, corrosive gases, moisture, etc.

[0078] It should be noted that many of the components mentioned in this application are universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0079] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0080] The heat dissipation device provided by the present application is introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A heat dissipation device, It is characterized in that The heat dissipation device comprises: A refrigeration plate, the first side of which is used to be arranged on the heating device, the interior of the refrigeration plate is loaded with a refrigerant, and the refrigerant is used to absorb the heat generated by the heating device and vaporize; A parallel flow heat exchanger is installed above the refrigeration plate. The parallel flow heat exchanger is provided with a heat exchange inlet and a heat exchange outlet which are connected to the interior of the refrigeration plate, and the heat exchange outlet is lower than the heat exchange inlet, so that the vaporized refrigerant enters the parallel flow heat exchanger from the heat exchange inlet to release heat and liquefy, and the liquefied refrigerant flows back to the refrigeration plate from the heat exchange outlet under the action of gravity.

2. The heat dissipation device according to claim 1, It is characterized in that A refrigerant flow channel is provided inside the refrigeration plate. The refrigerant flow channel is communicated with the heat exchange outlet of the parallel flow heat exchanger in the inlet direction, and the refrigerant flow channel is communicated with the heat exchange inlet of the parallel flow heat exchanger in the outlet direction.

3. The heat dissipation device according to claim 2, It is characterized in that The communicating position of the heat exchange outlet of the parallel flow heat exchanger and the refrigerant flow channel is arranged diagonally on the refrigeration plate with respect to the communicating position of the heat exchange inlet of the parallel flow heat exchanger and the refrigerant flow channel.

4. The heat dissipation device according to claim 1, It is characterized in that An inner exchange space is formed between the parallel flow heat exchanger and the second side of the refrigeration plate; and the heat dissipation device further includes a fan arranged in the inner exchange space.

5. The heat dissipation device according to claim 4, It is characterized in that The fan is arranged facing the parallel flow heat exchanger, and the angle between the airflow direction generated by the fan and the plane where the parallel flow heat exchanger is located is less than or equal to 90°.

6. The heat dissipation device according to claim 5, It is characterized in that The direction of the airflow generated by the fan is also parallel to the plane where the refrigeration plate is located.

7. The heat dissipation device according to claim 1, It is characterized in that The cooling plate is used to cover at least a portion of the heating device, and the cooling plate is used to be in surface contact with the heating device.

8. The heat dissipation device according to any one of claims 1 to 7, It is characterized in that The angle between the plane where the parallel flow heat exchanger is located and the plane where the refrigeration plate is located is less than or equal to 90°.

9. The heat dissipation device according to any one of claims 1 to 7, It is characterized in that There are multiple parallel flow heat exchangers, and the multiple parallel flow heat exchangers are arranged at intervals on the refrigeration plate.

10. The heat dissipation device according to any one of claims 1 to 7, It is characterized in that There are multiple refrigeration plates; some of the multiple refrigeration plates are connected in parallel between the heat exchange inlet and the heat exchange outlet of the parallel flow heat exchanger, and / or some of the multiple refrigeration plates are connected in series between the heat exchange inlet and the heat exchange outlet of the parallel flow heat exchanger.

Images