Laminating machine for semiconductor film pasting

Abstract

The invention discloses a laminating machine for semiconductor film pasting, and relates to the technical field of semiconductor film pasting, according to the laminating machine for semiconductor film pasting, a roller type transmission module is arranged between symmetrically distributed bases, and the roller type transmission module comprises a controllable traction unit and a dust removal and temperature control unit; a laminating module used for laminating is arranged at the conveying end of the roller type conveying module, and the roller type conveying module and the laminating module jointly form a conveying framework with a starting point. According to the film laminating machine, common roller film laminating is abandoned, butt joint of the upper die and the lower die is selected, damage to a film caused by mechanical friction due to contact type pressing is avoided, the negative pressure state is changed through the negative pressure pipe, non-contact type pressing operation is completed, in the film laminating process, the film can be prevented from being separated from the original position through negative pressure adsorption, and the film laminating efficiency is improved. And in cooperation with an industrial camera which is commonly used in the prior art, precise butt joint of the pasted film is completed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor film pasting, and in particular to a semiconductor film pasting machine. Background Art

[0002] Semiconductor refers to a material with conductivity between that of a conductor and an insulator at room temperature. The conductivity of semiconductor materials can be changed by doping. The concentration and polarity of impurities doped into the intrinsic semiconductor will have a great influence on the conductivity of the semiconductor. For semiconductors doped with donor impurities, the conductive carriers are mainly electrons in the conduction band, while for semiconductors doped with acceptor impurities, the conductivity is hole-type.

[0003] The existing method of applying film to semiconductors is through manual film application. The existing processing method mainly has the following problems. However, due to the increasing demand for semiconductors, the number of workers who need to transport and transfer semiconductors needs to gradually increase, increasing labor costs. As the size of semiconductors is getting smaller and smaller, they are easily lost during the transmission process, and the quality of semiconductors cannot be guaranteed. Manual film application of semiconductors one by one is inefficient, and the quality of film application cannot be guaranteed, and it is easy to make mistakes.

[0004] For example, a bonding machine for semiconductor film bonding disclosed in Chinese patent publication number CN106971970B realizes automatic transmission of semiconductors at multiple angles through a material picking device and a material moving device, thereby reducing labor costs and ensuring that the semiconductor can be smoothly transmitted. The position of the semiconductor is adjusted through a detection device and a positioning device so that the semiconductor can be aligned with the film bonding device to ensure the quality of the film bonding. The film bonding device realizes automated film bonding operations for semiconductors, thereby improving the efficiency of film bonding.

[0005] The above laminating machine completes the automated operation of laminating the semiconductor element through automated transmission, removal, docking and other related mechanisms. However, during the laminating process, the laminating machine has problems such as applying pressure through an elastic roller to gradually press the film onto the laminating surface from one end to the other end, and at the same time, there is adhesive residue in the process of squeezing out the interface bubbles, and there is pressure fluctuation of the roller during the laminating process. The reason is that the thickness of the film laminating surface of the semiconductor substrate is not completely uniform. Even if the adaptive air pressure compensation related equipment is introduced, it is difficult to avoid the mechanical friction damage to the film caused by contact lamination. Moreover, during the film roller transmission process of the above-mentioned equipment, it is difficult to adaptively adjust the film tension. Therefore, during the process of film peeling by the film stripping knife, there are various process accidents such as film stretching, tearing, wrinkling and bonding in the rear workstation area. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a semiconductor film bonding machine, which solves the problems raised in the above-mentioned background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor film laminating machine, wherein the roller transmission module is arranged between symmetrically distributed bases, the roller transmission module includes a controllable traction unit and a dust removal and temperature control unit, the transmission end of the roller transmission module is provided with a laminating module for laminating, the roller transmission module and the film laminating module together constitute a transmission structure with a starting point, the controllable traction unit includes a film rod arranged between two bases, a film piece is wound on the film rod, and the film piece is transmitted to the terminal roller 1 and the terminal roller 2 through the middle end transmission component, the terminal roller 2 is clamped to one end of an adjustable traction seat, the adjustable traction seat is fixedly connected with an adjusting shaft, a traction groove is provided on the adjustable traction seat, a traction part is abutted in the traction groove, a traction spring in a taut state is hinged on the traction part, and the other end of the traction spring is sleeved on the damping member, It should be noted that in the present application, the traction adjustment of the film during the transmission process is relatively common in the prior art, that is, by adjusting the fulcrum angle of the roller structure, the film can be kept tight during the transmission process. However, in the high-precision semiconductor film processing, the offset of the vibration of the roller mechanical movement cannot be eliminated. Therefore, in the present application, the adjustable traction seat realizes the fulcrum angle adjustment by adjusting the rotation of the rotating shaft. At the same time, the traction spring on the traction part abutting in the traction groove is always in a taut state. Because of its elastic deformation characteristics, it transmits vibration to the damping part, and realizes vibration offset in the roller transmission of the film in the process flow, thereby avoiding stretching, tearing, wrinkling and bonding of the film. Considering that the adjusting shaft rotates at multiple angles, the traction part in the traction groove has a range that needs to be moved. Therefore, after determining the final rotation angle of the adjusting shaft, the abutment of the traction part can be selected as a fixed connection with more obvious vibration transmission.

[0008] A further improvement of the technical solution of the present invention is that the terminal roller 1 is fixedly mounted on a fixed shaft, both ends of the fixed shaft are connected to the side walls of the base through fasteners, two groups of smoothing rollers are arranged at one end of the terminal roller 1 and the terminal roller 2, there is a gap between the two groups of smoothing rollers that is greater than the thickness of the film part, and crankshaft parts are symmetrically arranged at both ends of one of the smoothing rollers, and the crankshaft parts are fixedly mounted on the base.

[0009] A further improvement of the technical solution of the present invention is that the controllable traction unit also includes a middle-end roller group 1 and a middle-end roller group 2 close to the membrane rod, the middle-end roller group 1 is fixedly mounted on an adjusting frame, the adjusting frame is rotatably mounted on a suspension, the suspension is welded to a base, the middle-end roller group 2 is rotatably mounted on a supporting frame, and a hydraulic push rod is fixedly mounted on the supporting frame.

[0010] A further improvement of the technical solution of the present invention is that the dust removal and temperature control unit includes a dust removal plate rotatably installed on the suspension and close to one end of the middle-end roller group two, the dust removal plate is provided with an adjustment groove, and the dust removal plate is slidably connected with an L-shaped plate through the adjustment groove, a scraping rod is rotatably installed on the L-shaped plate, and a raised scraping end surface is provided at one end of the dust removal plate close to the middle-end roller group two, a ranging sensor is provided on the L-shaped plate, and a sticky roller is provided on one side of the film rod, and the sticky roller is in contact with the film piece.

[0011] A further improvement of the technical solution of the present invention is that the middle-end roller group 1 and the middle-end roller group 2 are both rotatably connected to the corresponding suspension and support frame, so the middle-end roller group has the function of adjusting the tension during the film transmission process, and the purpose of setting multiple groups of transmission rollers in the present application also includes multiple roller supports to reduce vibration, allowing a higher film transmission speed, and damage to a single group of roller structures does not affect the normal film lamination. Furthermore, the middle-end roller group 1 and the middle-end roller group 2 cancel the traction constraint that always exists in the spring in terms of adjustment, so they can be flexibly combined with the dust removal and temperature control unit. The dust removal and temperature control unit also includes a mounting rod, and the mounting rod is rotatably mounted on the base. A plurality of landfill slots are provided at the middle end of the mounting rod, each of which is provided with a corresponding temperature control pipe, each of which is provided with spray holes arranged in an array, one end of each of which is fixedly connected to the same transmission pipe, and the other end of the transmission pipe is connected to a blower. It should be noted that, in the process of lamination, in order to ensure that the film and the semiconductor are firmly bonded, the dust removal and temperature control unit proposed in the present application conducts the temperature of the gas and sprays it on the surface of the film. The film is attached to the mounting rod to increase the temperature of the film. The temperature of the film is controlled to be about 23°C. Accordingly, adding a temperature sensor can more accurately monitor the temperature of the film.

[0012] A further improvement of the technical solution of the present invention is that in order to avoid the presence of water vapor in the temperature gas, thereby affecting the subsequent film-sticking operation, a molecular sieve is buried in the end of the mounting rod close to the transmission tube, and pulleys are fixedly installed on the same end of the membrane rod and the mounting rod, and transmission belts are sleeved on the two pulleys, and the membrane rod is connected to a stepper motor through a coupling.

[0013] A further improvement of the technical solution of the present invention is that the film sticking module includes a base installed on a base, and magnetic slides are symmetrically arranged at the left and right ends of the base, a sliding groove is opened in the magnetic slide, and the magnetic slide is slidably connected to a magnetic block through the sliding groove, a stretching roller is inserted into the magnetic block, the film piece is wound on the stretching roller, a passive gear is keyed to the stretching roller, the passive gear is meshed with a driving gear, the driving gear is keyed to a driving shaft, the driving shaft is connected to a servo motor through a coupling, and the servo motor is installed on the magnetic slide.

[0014] A further improvement of the technical solution of the present invention is that an electric control push rod is fixedly installed in the sliding groove, and a return spring is arranged at the other end of the sliding groove, the magnetic slide seat is arranged as a permanent magnet, and one side of the magnetic slide seat is connected to an external excitation device through a wire.

[0015] A further improvement of the technical solution of the present invention is that vertical seats are symmetrically fixedly installed on both sides of the base, a telescopic rod is arranged on the top of the vertical seat, a spring is sleeved on the telescopic rod, and the other end of the telescopic rod is fixedly connected to an upper mold seat, an upper mold is connected to the lower part of the upper mold seat through a negative pressure tube, a lower mold is arranged directly below the upper mold, and an opening and closing assembly is provided on the lower mold, the opening and closing assembly includes a rotating shaft driven by a motor, and the rotating shaft is connected to an opening and closing plate, and the other end of the opening and closing plate is inserted in the recess by a magnetic limiter.

[0016] A further improvement of the technical solution of the present invention is that, in order to quickly separate the coated area from the entire film, the present application integrates the upper and lower stamping film-sticking structures used, and the upper and lower molds are respectively provided with film stripping knives, and the upper and lower film stripping knives form a semiconductor shape structure. Beneficial Effects

[0017] Compared with the prior art, the beneficial effects of the present invention are that the more common roller lamination is abandoned, the upper and lower molds are docked, the mechanical friction damage to the film caused by contact lamination is avoided, and the negative pressure state is changed by the negative pressure tube to complete the non-contact lamination operation. In addition, during the lamination process, the adsorption of negative pressure can prevent the film from being separated from the original position, and the industrial camera commonly used in the prior art is used to complete the precise docking of the film. By adjusting the fulcrum angle of the roller structure, the tension adjustment and taut state of the film during the transmission process are ensured, and the elastic deformation characteristics of the traction spring are used to achieve vibration offset during the film roller transmission in the process flow, thereby avoiding stretching, tearing, wrinkling and bonding of the film; By setting up multiple groups of transmission rollers to reduce vibration, higher film transmission speed is allowed, and damage to a single group of rollers will not affect the normal film lamination. In terms of adjustment, the traction constraints that always exist in the spring are cancelled for the mid-end roller group one and the mid-end roller group two, ensuring that the controllable traction unit can be flexibly combined with the dust removal and temperature control unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the entirety of a semiconductor film bonding machine; Figure 2 A side view of a bonding machine for semiconductor film bonding; Figure 3 A schematic diagram of a roller transport module in a semiconductor film laminating machine; Figure 4A side view of a roller transport module in a semiconductor film laminating machine; Figure 5 A schematic diagram of a controllable traction unit in a semiconductor film bonding machine; Figure 6 It is a partial schematic diagram of a controllable traction unit in a semiconductor film bonding machine; Figure 7 It is a schematic diagram of the combination of the middle-end roller group and the dust removal and temperature control unit of the semiconductor film laminating machine; Figure 8 It is a schematic diagram of the combination of the middle-end roller group and the dust removal and temperature control unit of the semiconductor film laminating machine; Fig. 9 A schematic diagram of a bonding module in a semiconductor film bonding machine; Fig.10 A side view of a bonding module in a bonding machine for semiconductor film bonding; Fig.11 This is a schematic diagram of the structure of a bonding module in a semiconductor film bonding machine from a top view.

[0019] In the figure, 1, base; 201, film rod; 202, film member; 203, terminal roller 1; 204, terminal roller 2; 205, adjustable traction seat; 206, traction part; 207, traction spring; 208, damping member; 209, fixed shaft; 210, smoothing roller; 211, crankshaft member; 212, middle end roller group 1; 213, middle end roller group 2; 214, adjustment frame; 215, suspension; 216, adjustment shaft; 217, support frame; 218, hydraulic push rod; 219, sticky roller; 301, dust removal plate; 302, L-shaped plate; 303, scraping rod; 304, raised scraping end surface; 305, distance sensor; 306, mounting rod; 307 , landfill tank; 308, temperature control pipeline; 309, spray hole; 310, transmission pipe; 311, blower; 312, pulley; 313, transmission belt; 314, stepper motor; 401, base; 402, magnetic slide; 403, magnetic block; 404, stretching roller; 405, passive gear; 406, active gear; 407, drive shaft; 408, servo motor; 409, electric control push rod; 410, reset spring; 411, wire; 412, vertical seat; 413, telescopic rod; 414, upper mold seat; 415, negative pressure tube; 416, upper mold; 417, lower mold; 418, rotating shaft; 419, opening and closing plate; 420, notch; 421, film stripping knife. DETAILED DESCRIPTION

[0020] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0021] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0022] In addition, in order to better illustrate the present application, numerous specific details are provided in the specific examples below. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, and elements well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0023] The present invention provides a semiconductor film laminating machine, comprising a roller transmission module, the roller transmission module is arranged between symmetrically distributed bases 1, the roller transmission module comprises a controllable traction unit and a dust removal and temperature control unit, a laminating module for laminating is arranged at the transmission end of the roller transmission module, and the roller transmission module and the film laminating module together constitute a transmission structure with a starting point; The controllable traction unit includes a film rod 201 arranged between two bases 1, and a film piece 202 is wound on the film rod 201. The film piece 202 is transmitted to the terminal roller 1 203 and the terminal roller 2 204 through the middle-end transmission component. The terminal roller 204 is clamped on one end of the adjustable traction seat 205. The adjustable traction seat 205 is fixedly connected with an adjustment shaft 216. A traction groove is opened on the adjustable traction seat 205, and a traction part 206 is abutted in the traction groove. A traction spring 207 in a taut state is hinged on the traction part 206, and the other end of the traction spring 207 is sleeved on the damping member 208.

[0024] It should be noted that in the present application, the traction adjustment of the film during the transmission process is more common in the prior art, that is, by adjusting the fulcrum angle of the roller structure, the film can be kept tight during the transmission process. However, in the high-precision semiconductor film processing, the deviation of the vibration of the roller mechanical movement cannot be reduced. Therefore, in the present application, the adjustable traction seat 205 adjusts the fulcrum angle by adjusting the rotation of the rotating shaft 216. At the same time, the traction spring 207 on the traction part 206 abutting in the traction groove is always in a tight state. Because of its elastic deformation characteristics, it transmits vibration to the damping member 208, and realizes vibration offset in the film roller transmission in the process flow, thereby avoiding stretching, tearing, wrinkling and adhesion of the film. Furthermore, considering that the adjustment shaft 216 can rotate at various angles, the traction portion 206 in the traction groove has a range of movement. Therefore, after determining the final rotation angle of the adjustment shaft 216, the abutment of the traction portion 206 can be selected as a fixed connection with more obvious vibration transmission.

[0025] Embodiment 1, in order to complete the structural integration of the bonding structure and the dust removal and temperature control unit, this embodiment adopts a terminal roller 1 203 fixedly installed on the fixed shaft 209, and both ends of the fixed shaft 209 are connected to the side wall of the base 1 through fasteners, and two groups of smoothing rollers 210 are arranged at one end of the terminal roller 1 203 and the terminal roller 2 204, and there is a gap between the two groups of smoothing rollers 210 that is greater than the thickness of the film member 202, and crankshaft members 211 are symmetrically arranged at both ends of one of the smoothing rollers 210, and the crankshaft member 211 is fixedly installed on the base 1.

[0026] The controllable traction unit also includes a middle-end roller group 1 212 and a middle-end roller group 213 close to the membrane rod 201. The middle-end roller group 1 212 is fixedly mounted on an adjusting frame 214, and the adjusting frame 214 is rotatably mounted on a suspension 215. The suspension 215 is welded to the base 1. The middle-end roller group 213 is rotatably mounted on a supporting frame 217, and a hydraulic push rod 218 is fixedly mounted on the supporting frame 217.

[0027] From the above, it can be known that the middle-end roller group 1 212 and the middle-end roller group 213 are both rotatably connected to the corresponding suspension 215 and the support frame 217, so the middle-end roller group has the function of adjusting the tension during the film transmission process, and the purpose of setting multiple groups of transmission rollers in the present application also includes multiple roller supports to reduce vibration, allowing a higher film transmission speed, and damage to a single group of roller structures does not affect the normal film lamination. Furthermore, the middle-end roller group 1 212 and the middle-end roller group 2 213 cancel the traction constraint that exists at all times in the spring in terms of adjustment, so they can be flexibly adjusted with dust removal and temperature control. The unit is combined, the dust removal and temperature control unit includes a dust removal plate 301 which is rotatably mounted on the suspension 215 and close to one end of the middle roller group 213, the dust removal plate 301 is provided with an adjustment groove, and the dust removal plate 301 is slidably connected with an L-shaped plate 302 through the adjustment groove, a scraping rod 303 is rotatably mounted on the L-shaped plate 302, and a raised scraping end surface 304 is provided at one end of the dust removal plate 301 close to the middle roller group 213, a distance measuring sensor 305 is provided on the L-shaped plate 302, and a sticky roller 219 is provided on one side of the film rod 201, and the sticky roller 219 is in contact with the film member 202.

[0028] Because of the structure of the L-shaped plate 302, there is a gap between the dust removal plate 301 and the scraper rod 303 to allow the film 202 to pass through. Therefore, when the film 202 passes through, the scraper rod 303 generates friction to attract the dust accumulated on the film 202, and as shown in the attached Figure 6-8As shown, the raised scraping end face 304 and the middle-end roller group 213 are close to each other, and the angle of the middle-end roller group 213 is adjustable, so the other side of the film 202 that is not in contact with the scraping rod 303 can be contacted by the raised scraping end face 304, and the scraping rod 303 and the raised scraping end face 304 are made of the same material, both of which are silicone rollers or other soft material rollers. Furthermore, because the middle-end roller group 213 and the middle-end roller group 1 212 do not add corresponding damping structures, the film is prevented from deflecting, thereby setting a distance sensor 305.

[0029] Embodiment 2, it should be noted that, in the process of lamination, in order to ensure that the film and the semiconductor are firmly attached, the dust removal and temperature control unit proposed in this application is sprayed on the surface of the film through the temperature conduction of the gas, and the film is attached to the mounting rod 306 to increase the temperature of the film. The temperature of the film is controlled to be about 23°C. Accordingly, adding a temperature sensor can more accurately complete the temperature monitoring of the film. The specific implementation is as follows: The dust removal and temperature control unit also includes a mounting rod 306, which is rotatably mounted on the base 1. A plurality of landfill slots 307 are arranged at the middle end of the mounting rod 306. Each landfill slot 307 is provided with a corresponding temperature control pipe 308. Each temperature control pipe 308 is arranged with spray holes 309 in an array. One end of each temperature control pipe 308 is fixedly connected to the same transmission pipe 310, and the other end of the transmission pipe 310 is connected to a blower 311.

[0030] In order to prevent water vapor from existing in the temperature gas, thereby affecting the subsequent film-sticking operation, a molecular sieve is buried in one end of the mounting rod 306 close to the transmission tube 310; A pulley 312 is fixedly mounted on the same end of the membrane rod 201 and the mounting rod 306 . A transmission belt 313 is sleeved on the two pulleys 312 . The membrane rod 201 is connected to a stepping motor 314 via a coupling.

[0031] Embodiment 3, the design of the specific technical scheme of film pasting in the present application is specifically as follows: the film pasting module includes a base 401 installed on the base 1, and magnetic slides 402 are symmetrically arranged at the left and right ends of the base 401, and a sliding groove is opened in the magnetic slide 402, and the magnetic slide 402 is slidably connected to a magnetic block 403 through the sliding groove, and a stretching roller 404 is inserted on the magnetic block 403, and the film piece 202 is wound on the stretching roller 404, and a passive gear 405 is key-connected on the stretching roller 404, and the passive gear 405 is meshingly connected to the active gear 406, and the active gear 406 is key-connected to a driving shaft 407, and the driving shaft 407 is connected to a servo motor 408 through a coupling, and the servo motor 408 is installed on the magnetic slide 402.

[0032] An electric control push rod 409 is fixedly installed in the sliding groove, and a return spring 410 is arranged at the other end of the sliding groove. The magnetic slide seat 402 is arranged as a permanent magnet, and one side of the magnetic slide seat 402 is connected to an external excitation device through a wire 411.

[0033] Furthermore, in the actual bonding process of the present application, due to the bonding of the film and the semiconductor, the tension of the film changes during the roller transmission process, so the entire film has wrinkles. Therefore, the terminal position of the film transmission needs to be flexibly adjusted during the coating. The magnetic block 403 is adsorbed by the magnetic slide 402 during the coating process to fix the position to avoid coating docking failure. After the coating docking is completed, the magnetic slide 402 cancels the energized adsorption state, and the electric control push rod 409 moves backward until the film is flat. The servo motor 408 drives the drive shaft 407 to rotate, and the coating in the area is wound and recovered. The electric control push rod 409 is powered off, and the reset spring 410 is reset to return to the original state.

[0034] Vertical seats 412 are symmetrically fixedly installed on both sides of the base 401, and a telescopic rod 413 is arranged on the top of the vertical seat 412. A spring is sleeved on the telescopic rod 413, and the other end of the telescopic rod 413 is fixedly connected to an upper mold seat 414. An upper mold 416 is connected to the lower part of the upper mold seat 414 through a negative pressure tube 415. A lower mold 417 is arranged directly below the upper mold 416. The lower mold 417 is provided with an opening and closing assembly, and the opening and closing assembly includes a rotating shaft 418 driven by a motor, and the rotating shaft 418 is connected to an opening and closing plate 419, and the other end of the opening and closing plate 419 is inserted into the recess 420 through a magnetic limiter.

[0035] In terms of structural control of semiconductor film, the present application abandons the more common roller laminating and chooses the docking of the upper and lower molds to avoid mechanical friction damage to the film caused by contact pressing. As a result, there are situations where bubbles are difficult to remove during the laminating process. To address this situation, the present application uses the negative pressure tube 415 to negatively adsorb the film part 202 before laminating, and changes the negative pressure state after the semiconductor and the film part 202 are laminated, and the air pressure blows the semiconductor and the film part 202 to complete the non-contact pressing operation. In addition, during the laminating process, the negative pressure adsorption can prevent the film part 202 from moving away from its original position, and cooperate with the industrial camera that is more commonly used in the prior art to complete the docking of the film.

[0036] The docking and positioning of industrial cameras includes the following specific operations: The industrial camera takes a picture of the semiconductor carrier to obtain the position information of the semiconductor. The industrial camera is a CCD camera. The CCD camera can be a prior art. The lower industrial camera takes a second picture of the upper mold 416 position to obtain the position information of the upper mold 416. By comparing the position information after the two pictures, the position difference is obtained, so as to change the position of the lower mold 417 accordingly. The preferred connection method of the lower mold 417 is to connect the corresponding shift component.

[0037] In order to quickly separate the coated area from the entire film, the present application integrates the upper and lower stamping film-sticking structures used. The upper mold 416 and the lower mold 417 are respectively provided with film stripping knives 421. The upper and lower film stripping knives 421 form the outline of the semiconductor outer structure. If the semiconductor is circular, the upper and lower film stripping knives 421 will be circular when the overall structure is closed.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor film laminating machine, comprising a roller transmission module, characterized in that: The roller transmission module is arranged between symmetrically distributed bases (1), the roller transmission module comprises a controllable traction unit and a dust removal and temperature control unit, a laminating module for laminating is arranged at the transmission end of the roller transmission module, and the roller transmission module and the laminating module together constitute a transmission structure with a starting point; The controllable traction unit comprises a film rod (201) arranged between two bases (1), a film member (202) being wound on the film rod (201), the film member (202) being transmitted to a terminal roller 1 (203) and a terminal roller 2 (204) via a middle-end transmission component, the terminal roller 2 (204) being clamped on one end of an adjustable traction seat (205), the adjustable traction seat (205) being fixedly connected to an adjustment shaft (216), a traction groove being provided on the adjustable traction seat (205), the adjustable traction seat (205) being abutted against a traction portion (206) via the traction groove, a traction spring (207) being hinged on the traction portion (206) in a tensioned state, the other end of the traction spring (207) being sleeved on a damping member (208).

2. A semiconductor film bonding machine according to claim 1, characterized in that: The terminal roller 1 (203) is fixedly mounted on a fixed shaft (209), and both ends of the fixed shaft (209) are connected to the side wall of the base (1) through fasteners. Two groups of smoothing rollers (210) are arranged at one end of the terminal roller 1 (203) and the terminal roller 2 (204), and a gap greater than the thickness of the film (202) exists between the two groups of smoothing rollers (210), and crankshafts (211) are symmetrically arranged at both ends of one of the smoothing rollers (210), and the crankshafts (211) are fixedly mounted on the base (1).

3. A semiconductor film bonding machine according to claim 2, characterized in that: The controllable traction unit further comprises a middle-end roller group 1 (212) and a middle-end roller group 2 (213) close to the membrane rod (201); the middle-end roller group 1 (212) is fixedly mounted on an adjustment frame (214); the adjustment frame (214) is rotatably mounted on a suspension frame (215); the suspension frame (215) is welded to the base (1); the middle-end roller group 2 (213) is rotatably mounted on a support frame (217); a hydraulic push rod (218) is fixedly mounted on the support frame (217).

4. A semiconductor film bonding machine according to claim 3, characterized in that: The dust removal and temperature control unit comprises a dust removal plate (301) rotatably mounted on a suspension (215) and close to one end of the middle-end rotating roller group 2 (213); an adjustment groove is provided on the dust removal plate (301), and the dust removal plate (301) is slidably connected to an L-shaped plate (302) via the adjustment groove; a scraping rod (303) is rotatably mounted on the L-shaped plate (302), and a raised scraping end surface (304) is provided at one end of the dust removal plate (301) close to the middle-end rotating roller group 2 (213); a distance measuring sensor (305) is provided on the L-shaped plate (302); and a sticking roller (219) is provided on one side of the film rod (201), and the sticking roller (219) is in contact with the film member (202).

5. The semiconductor film bonding machine according to claim 1, characterized in that: The dust removal and temperature control unit further comprises a mounting rod (306), the mounting rod (306) being rotatably mounted on the base (1), a plurality of landfill slots (307) being arranged at the middle end of the mounting rod (306), a corresponding temperature control pipe (308) being arranged in each of the landfill slots (307), spray holes (309) being arranged in an array on each of the temperature control pipes (308), one end of each of the temperature control pipes (308) being fixedly connected to the same transmission pipe (310), and the other end of the transmission pipe (310) being connected to a blower (311).

6. The semiconductor film bonding machine according to claim 5, characterized in that: A molecular sieve is embedded in one end of the mounting rod (306) close to the transmission tube (310); A pulley (312) is fixedly mounted on the same end of the membrane rod (201) and the mounting rod (306), a transmission belt (313) is sleeved on the two pulleys (312), and the membrane rod (201) is connected to a stepping motor (314) via a coupling.

7. The semiconductor film bonding machine according to claim 1, characterized in that: The film laminating module comprises a base (401) mounted on a base (1); magnetic slide seats (402) are symmetrically arranged at the left and right ends of the base (401); a sliding groove is provided in the magnetic slide seat (402); and the magnetic slide seat (402) is slidably connected to a magnetic block (403) via the sliding groove; a stretching roller (404) is plugged into the magnetic block (403); the film member (202) is wound on the stretching roller (404); a passive gear (405) is keyed to the stretching roller (404); the passive gear (405) is meshedly connected to a driving gear (406); the driving gear (406) is keyed to a driving shaft (407); the driving shaft (407) is connected to a servo motor (408) via a coupling; and the servo motor (408) is mounted on the magnetic slide seat (402).

8. The semiconductor film bonding machine according to claim 7, characterized in that: An electric control push rod (409) is fixedly installed in the sliding groove, and a return spring (410) is arranged at the other end of the sliding groove. The magnetic sliding seat (402) is arranged as a permanent magnet, and one side of the magnetic sliding seat (402) is connected to an external excitation device via a wire (411).

9. The semiconductor film bonding machine according to claim 8, characterized in that: Vertical seats (412) are symmetrically fixedly installed on both sides of the base (401), and a telescopic rod (413) is arranged on the top of the vertical seat (412). A spring is sleeved on the telescopic rod (413), and the other end of the telescopic rod (413) is fixedly connected to an upper mold seat (414). An upper mold (416) is connected to the lower part of the upper mold seat (414) through a negative pressure tube (415). A lower mold (417) is arranged directly below the upper mold (416), and the lower mold (417) is provided with an opening and closing component, and the opening and closing component includes a rotating shaft (418) driven by a motor, and the rotating shaft (418) is connected to an opening and closing plate (419), and the other end of the opening and closing plate (419) is inserted into the recess (420) through a magnetic limiter.

10. The semiconductor film bonding machine according to claim 9, characterized in that: The upper mold (416) and the lower mold (417) are respectively provided with film stripping knives (421), and the upper and lower film stripping knives (421) form a semiconductor outer shape structure.

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