Mask plate as well as preparation method and processing equipment thereof

Abstract

The invention discloses a mask plate and a preparation method and processing equipment thereof, the mask plate comprises a base material and magnetic nanoparticles, and the magnetic nanoparticles are embedded in the base material. According to the mask plate, the production cost is effectively reduced, the mask plate is small in thickness and good in mechanical performance, RGB three-primary-color sub-pixels can be directly deposited through the mask plate, and colorized display is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of FMM evaporation, and in particular to a mask plate and a preparation method thereof, and processing equipment using the mask plate. Background Art

[0002] FMM stands for Fine Metal Mask, and its main material is metal or metal plus resin. The main function of the mask is to provide a shielding effect for evaporation, so that the material can be deposited in a fixed position.

[0003] Organic Light Emitting Diode (OLED) display technology has been widely used in mobile phones, televisions, and automotive fields due to its many advantages such as self-luminescence, wide color gamut, and flexible display. Due to the special application scenarios of VR and AR technologies, the display screen is required to have higher resolution and smaller size. In order to achieve high resolution, the existing micro-OLED technology uses white light OLED with color filter technology to achieve color display. This technology can avoid the use of FMM in the OLED evaporation section and realize color display by photolithography patterning RGB primary color filters. However, the color filter will lose about 80% of the brightness of the sub-pixel, and the existing white light OLED device adopts a tandem structure, which increases the overall voltage and power consumption of the device, and is also accompanied by some lateral leakage and other non-brightness phenomena. In order to meet the high-brightness, low-power OLED micro-display screens required by future VR and AR, the technology of directly depositing RGB primary colors using FMM will also be one of the technical routes of micro-OLED.

[0004] In the related art, the metal mask made of invar alloy is limited by the thickness of the raw materials and the processing technology, and the opening is difficult to reach the size required by the micro display. The opening size of the fine mask (FMM) can be achieved by etching technology to be less than 10um, but in the process of making the mask, semiconductor exposure, development, and etching technology are required, the process flow is complicated, the product cost is high, and the yield is low. Summary of the invention

[0005] The main purpose of the present invention is to provide a mask plate and its preparation method and processing equipment, aiming to provide a mask plate that effectively reduces production costs. The mask plate is not only thin in thickness but also has good mechanical properties. The mask plate can be used to directly deposit RGB primary color sub-pixels to achieve color display.

[0006] To achieve the above objective, the present invention provides a mask, which comprises a substrate and magnetic nanoparticles, wherein the magnetic nanoparticles are embedded in the substrate.

[0007] In one embodiment, the substrate is a composite material formed by polyimide and a polymer or compound having space.

[0008] In one embodiment, the polymer or compound having space is a siloxane compound, a carbosiloxane compound or graphene;

[0009] And / or, the magnetic nanoparticles are Fe 3 O 4 ;

[0010] And / or, the magnetic nanoparticles are uniformly distributed in the substrate.

[0011] In one embodiment, the substrate is formed with a groove having an opening at one end, and a through hole is formed on a bottom wall of the groove.

[0012] In one embodiment, the thickness of the bottom of the groove is 5um to 15um;

[0013] And / or, the width of the side of the groove is 5 mm to 10 mm;

[0014] And / or, the depth of the groove is 96% to 99% of the thickness of the substrate;

[0015] And / or, the size of the opening is 0.85 to 0.95 of the length of the substrate;

[0016] And / or, the size of the through hole is 1um to 10um;

[0017] And / or, the through holes include a plurality of through holes, and the distance between two adjacent through holes is 2.5um to 10um;

[0018] And / or, the density of the through holes is 30% to 50%.

[0019] In one embodiment, the inner wall of the groove includes a bottom wall and a side wall connected to each other, and the angle formed by the side wall and the bottom wall is 90° to 140°.

[0020] The present invention also provides a method for preparing the above-mentioned mask, the method comprising:

[0021] preparing a substrate containing magnetic nanoparticles;

[0022] A groove with an opening at one end is formed on the substrate by using laser technology, and a through hole is opened on the bottom wall of the groove.

[0023] In one embodiment, the step of preparing a substrate containing magnetic nanoparticles comprises:

[0024] Preparation of polymers or compound monomers with space;

[0025] Adding the polymer or compound monomer having space during the preparation of polyamic acid to obtain a composite solution;

[0026] Adding magnetic nanoparticles to the composite solution, stirring to react, coating the resulting solution on a glass substrate, drying, curing and dehydrating to form a thin film;

[0027] The thin film is peeled off from the glass substrate to obtain the substrate containing magnetic nanoparticles.

[0028] In one embodiment, the polymer or compound monomer having space is a siloxane compound, a carbosiloxane compound or graphene;

[0029] And / or, the step of preparing the polymer or compound monomer having space includes: using phenyltriethoxysilane and butylammonium fluoride as reactants, and adopting a hydrolysis condensation method to prepare a cage-shaped oligomeric silsesquioxane monomer.

[0030] In one embodiment, the step of adding the polymer or compound monomer having space during the preparation of polyamic acid to obtain a composite solution comprises:

[0031] Using N,N'-dimethylacetamide as a reaction medium, diaminodiphenyl ether and 3,3',4,4'-dibenzophenone tetraacid dianhydride as reactants, preparing polyamic acid through polycondensation polymerization, and adding the polymer or compound monomer having space during the reaction to obtain the composite solution;

[0032] The preparation process of the composite solution is carried out in N 2 Carried out under the protection of atmosphere.

[0033] In one embodiment, the stirring speed of the stirring reaction is 1000 r / min, the stirring reaction time is more than 24 h, and the stirring reaction step is N 2 Under the protection of the atmosphere;

[0034] And / or, the drying, curing and dehydrating step comprises: placing the glass substrate in an oven and introducing N 2 , first dry at 60°C for 30 minutes to remove the reaction medium, and then heat up and dehydrate at a stepwise program of 100°C / h, 200°C / h, and 350°C / h.

[0035] In one embodiment, the step of peeling the film from the glass substrate to obtain the substrate containing magnetic nanoparticles comprises:

[0036] soaking the glass substrate in anhydrous ethanol;

[0037] The thin film is peeled off from the glass substrate and dried at room temperature to obtain the substrate containing magnetic nanoparticles.

[0038] The present invention further provides a processing device, which includes a device body and the mask plate mentioned above, wherein the mask plate is arranged on the device body.

[0039] The mask of the technical solution of the present invention uses a composite material as a substrate. Compared with the traditional FMM material invar alloy, the composite material is prepared through a polymerization reaction so that the thickness of the mask can be thinner and the mechanical properties are good; at the same time, by embedding magnetic nanoparticles in the substrate, the mask has a magnetic function, so that the function of adsorption with the magnetic back plate of the evaporation equipment can be achieved. It can be understood that the preparation process of the mask does not use complex semiconductor technologies such as exposure and development, which reduces the production cost of the product. Not only is the production process simple, with only one layer, but the thickness can be made thinner, so it has a lighter weight, and further reduces the deformation caused by its own weight when preparing a large-sized mask. The mask can be used to directly deposit RGB primary color sub-pixels, replacing the existing white light + color filter technology to achieve color display. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0041] Figure 1 is a cross-sectional schematic diagram of a mask plate in one embodiment of the present invention;

[0042] Figure 2 is the stereochemical structure of a cage-shaped oligomeric silsesquioxane in one embodiment of the present invention;

[0043] Figure 3 3D model structure of cage-shaped oligomeric silsesquioxane in one embodiment of the present invention;

[0044] Figure 4 is the chemical molecular formula of polyimide in one embodiment of the present invention.

[0045] Description of Figure Numbers:

[0046] Label name Label name 100 Mask 31 Opening 1 Substrate 32 bottom wall 2 Magnetic Nanoparticles 33 Sidewall 3 Grooves 4 Through Hole

[0047] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0050] At the same time, the meaning of "and / or" or "and / or" appearing in the full text includes three options. Taking "A and / or B" as an example, it includes option A, or option B, or a option in which both A and B are satisfied.

[0051] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0052] FMM stands for Fine Metal Mask, and its main material is metal or metal plus resin. The main function of the mask is to provide a shielding effect for evaporation, so that the material can be deposited in a fixed position.

[0053] Organic Light Emitting Diode (OLED) display technology has been widely used in mobile phones, televisions, and automotive fields due to its many advantages such as self-luminescence, wide color gamut, and flexible display. Due to the special application scenarios of VR and AR technologies, the display screen is required to have higher resolution and smaller size. In order to achieve high resolution, the existing micro-OLED technology uses white light OLED with color filter technology to achieve color display. This technology can avoid the use of FMM in the OLED evaporation section and realize color display by photolithography patterning RGB primary color filters. However, the color filter will lose about 80% of the brightness of the sub-pixel, and the existing white light OLED device adopts a tandem structure, which increases the overall voltage and power consumption of the device, and is also accompanied by some lateral leakage and other non-brightness phenomena. In order to meet the high-brightness, low-power OLED micro-display screens required by future VR and AR, the technology of directly depositing RGB primary colors using FMM will also be one of the technical routes of micro-OLED.

[0054] In the related art, the metal mask made of invar alloy is limited by the thickness of the raw materials and the processing technology, and the opening is difficult to reach the size required by the micro display. The opening size of the fine mask (FMM) can be achieved by etching technology to be less than 10um, but in the process of making the mask, semiconductor exposure, development, and etching technology are required, the process flow is complicated, the product cost is high, and the yield is low.

[0055] Based on the above ideas and problems, the present invention proposes a mask 100. It can be understood that the mask 100 can directly deposit RGB sub-pixels, which can replace the existing white light + color filter technology to achieve color display. At the same time, the preparation process of the mask 100 does not use complex semiconductor technologies such as exposure and development, which effectively reduces the production cost of the product. Not only is the production process simple, with only one layer, but the thickness can be made thinner, so it has a lighter weight, which further reduces the deformation caused by its own weight when preparing a large-sized mask.

[0056] Please refer to Figure 1 As shown, in an embodiment of the present invention, the mask 100 includes a substrate 1 and magnetic nanoparticles 2 , and the magnetic nanoparticles 2 are embedded in the substrate 1 .

[0057] In this embodiment, the mask plate 100 is directly formed by a layer of substrate 1, and magnetic nanoparticles 2 are embedded or dispersed in the substrate 1. Optionally, the magnetic nanoparticles 2 are evenly distributed in the substrate 1. In this way, the magnetic function of the mask plate 100 can be effectively guaranteed, so that the mask plate 100 can achieve the function of adsorbing with the magnetic back plate of the evaporation equipment, and at the same time, the thickness of the mask plate 100 is uniform everywhere.

[0058] It can be understood that the substrate 1 is a composite material formed by polyimide and a polymer or compound having space. That is, the mask plate 100 uses the composite material as the substrate. Compared with the traditional FMM material invar alloy, the composite material prepared by polymerization reaction can make the thickness of the mask plate thinner and have good mechanical properties.

[0059] It should be noted that the substrate 1 is made of polyimide (such as Figure 4 As shown) and a polymer or compound with space are formed into a composite material through an organic-inorganic hybridization method, effectively modifying the polyimide, so that the substrate 1 is prepared by polymerization reaction and its thickness can reach less than 10um compared with the traditional FMM material invar alloy. Optionally, the polymer or compound with space is a siloxane compound, a carbosiloxane compound or graphene.

[0060] In the present embodiment, the polymer or compound with space is described by taking a siloxane compound (POSS) as an example, and the substrate 1 is a composite material of PI-POSS (polyimide-cage oligomeric silsesquioxane). Because POSS has a nanostructured organosilicon monomer, such as Figure 2 and Figure 3 As shown in the figure, with Si-O as the core, the organic functional groups on the periphery can enable POSS to be grafted onto the polymer PI matrix through the covalent bond of Si to obtain a composite film with good mechanical properties. At the same time, the POSS in the composite material has good spatial structural material properties, such as Figure 2 and Figure 3 As shown, the framework composed of Si-O has a regular hexahedral structure. In the process of PI-POSS hybridization, magnetic nanoparticles 2 are added to embed the magnetic nanoparticles 2 into the space of the POSS hexahedron, so that the entire PI-POSS has magnetic function. The FMM prepared by using PI-POSS also has the function of adsorbing to the magnetic back plate of the evaporation equipment. Optionally, the magnetic nanoparticles 2 are Fe 3 O 4 .

[0061] The mask plate 100 of the present invention uses a composite material as the substrate 1. Compared with the traditional FMM material invar alloy, the composite material is prepared through a polymerization reaction so that the thickness of the mask plate 100 can be thinner and the mechanical properties are good; at the same time, by embedding magnetic nanoparticles 2 in the substrate 1, the mask plate 100 has a magnetic function, so that the function of adsorption with the magnetic back plate of the evaporation equipment can be achieved. It can be understood that the preparation process of the mask plate 100 does not use complex semiconductor technologies such as exposure and development, which reduces the production cost of the product. Not only is the production process simple, with only one layer, but the thickness can be made thinner, so it has a lighter weight, and further reduces the deformation caused by its own weight when preparing a large-sized mask plate 100. The mask plate 100 can be used to directly deposit RGB three-primary color sub-pixels, replacing the existing white light + color filter technology to achieve color display.

[0062] In one embodiment, the substrate 1 is formed with a groove 3 having an opening 31 at one end, and a through hole 4 is formed on the bottom wall of the groove 3. It can be understood that Figure 1 As shown, the side of the mask 100 facing away from the opening 31 of the groove 3 is the front side, and the side of the mask 100 having the opening 31 is the back side. The groove 3 having the opening 31 is formed on the substrate 1 of the mask 100, so that the groove 3 is used to accommodate and limit the product to form a vapor deposition area, and the portion of the substrate 1 of the mask 100 located at the periphery of the opening 31 is a non-vapor deposition area, that is, the edge of the FMM.

[0063] In this embodiment, the through hole 4 on the mask plate 100 is set through the bottom wall of the groove 3. Optionally, the number of through holes 4 includes multiple, and the multiple through holes 4 are arranged at intervals. The number and size of the through holes 4 on the mask plate 100 are designed according to the requirements of the product. Optionally, the size a of the through hole 4 is 1um to 10um. The size a of the through hole 4 is related to the pixel of the product after processing. By limiting the size a of the through hole 4 to the range of 1um to 10um, the pixel of the product is effectively improved.

[0064] It can be understood that the through hole 4 can be a polygonal hole or a special-shaped hole such as a circular hole, an elliptical hole, a square hole or a triangular hole, etc., which is not limited here. In this embodiment, a circular hole is taken as an example, and the size a of the through hole 4 is the diameter of the through hole 4. The size a of the through hole 4 can be selected as 1um, 2um, 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, etc., which is not limited here.

[0065] In this embodiment, the through holes 4 on the mask plate 100 include a plurality of through holes 4, and the plurality of through holes 4 are arranged at intervals, and the spacing b between two adjacent through holes 4 is 2.5um to 10um. The spacing b between the through holes 4 is related to the pixels of the product after processing. By limiting the spacing b between the through holes 4 to the range of 2.5um to 10um, the pixels of the product are effectively improved. Optionally, the spacing b between two adjacent through holes 4 is 2.5um, 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, etc., which is not limited here.

[0066] It should be noted that the substrate 1 of the mask 100 adopts an organic-inorganic hybrid PI-POSS (polyimide-cage oligomeric silsesquioxane) composite material, which can make the thickness c of the bottom of the groove 3 of the mask 100 thinner. Optionally, the thickness c of the bottom of the groove 3 is 5um to 15um. In this embodiment, the thickness c of the bottom of the groove 3 can be selected from 5um, 6um, 7um, 8um, 9um, 10um, 11um, 12um, 13um, 14um, 15um, etc., which is not limited here.

[0067] It can be understood that by setting the thickness c of the bottom of the groove 3 to 5um to 15um, the hole depth of the through hole 4 is reduced, thereby effectively improving the evaporation effect and preventing deposition on the hole wall of the through hole 4 during the evaporation process. Figure 1 As shown, the depth e of the groove 3 is the difference between the thickness f of the substrate 1 and the thickness c of the bottom of the groove 3, that is, the ratio of the depth e of the groove 3 to the thickness f of the substrate 1 is 96% to 99%. Optionally, the ratio of the depth e of the groove 3 to the thickness f of the substrate 1 is 96%, 97%, 98%, 99%, etc., which is not limited here. Optionally, the thickness f of the substrate 1 ranges from 400um to 600um, which is not limited here.

[0068] In this embodiment, the density of the through holes 4 can be selected to be 30% to 50%. The density of the through holes 4 is the density of the through holes 4 at the bottom of the groove 3. Optionally, the density of the through holes 4 is 30%, 35%, 40%, 45%, or 50%, which is not limited here. By controlling the density of the through holes 4 within the range of 30% to 50%, the evaporation effect of the product can be ensured without affecting the structural strength of the mask 100.

[0069] In the present embodiment, the width d of the side of the groove 3 is 5 mm to 10 mm. It is understandable that the width d of the side of the groove 3 is the width of the non-evaporation area on the reverse side of the mask plate 100. Optionally, the width d of the side of the groove 3 is 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc., which is not limited here. It is understandable that the size of the opening 31 is 0.85 to 0.95 of the length of the substrate 1, that is, the ratio of the size of the opening 31 to the length of the substrate 1 is 0.85 to 0.95. The size of the opening 31 is the length of the opening 31 on the reverse side of the mask plate 100, that is, the width of the evaporation area on the reverse side of the mask plate 100, and the length of the substrate 1 is the length of the reverse side of the mask plate 100, that is, the sum of the width of the non-evaporation area on the reverse side of the mask plate 100 and the width of the evaporation area.

[0070] It can be understood that the size of the opening 31 is the length of the substrate 1 minus 2*the width d of the side of the groove 3. By controlling the size of the opening 31 within the range of 0.85 to 0.95 of the length of the substrate 1, the evaporation and accommodation of the product can be effectively achieved. Optionally, the ratio of the size of the opening 31 to the length of the substrate 1 is 0.85, 0.9, 0.95, etc., which is not limited here.

[0071] In one embodiment, if Figure 1 As shown, the inner wall of the groove 3 includes a bottom wall 32 and a side wall 33 connected to each other. It can be understood that the side wall 33 is arranged at an angle with the bottom wall 32. Optionally, the angle formed by the side wall 33 and the bottom wall 32 is 90° to 140°. By setting the opening 31 of the groove 3 as a flared structure, it is convenient to place or accommodate the product in the groove 3, and the side wall 33 provides guidance for the placement or accommodation of the product, which can be determined according to the process and the product, and is not limited here. Optionally, the angle formed by the side wall 33 and the bottom wall 32 is 90°, 100°, 110°, 120°, 130°, 135°, 140°, etc., which is not limited here.

[0072] The present invention also proposes a method for preparing the above-mentioned mask plate 100. The specific structure of the mask plate 100 refers to the aforementioned embodiment. Since the preparation method of the mask plate 100 adopts all the technical solutions of all the aforementioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the aforementioned embodiments, which will not be described one by one here.

[0073] In this embodiment, the preparation method includes:

[0074] preparing a substrate 1 containing magnetic nanoparticles 2;

[0075] By using laser technology, a groove 3 with an opening 31 at one end is formed on the substrate 1 , and a through hole 4 is opened on the bottom wall 32 of the groove 3 .

[0076] It is understandable that the substrate 1 containing the magnetic nanoparticles 2 may be a substrate 1 in which the magnetic nanoparticles 2 are embedded, or the magnetic nanoparticles 2 are dispersed in the substrate 1, so that the magnetic nanoparticles 2 and the substrate 1 are an integrally formed structure. 3 O 4 .

[0077] In this embodiment, the steps of preparing the substrate 1 containing magnetic nanoparticles 2 include:

[0078] Preparation of polymers or compound monomers with space;

[0079] In the process of preparing polyamic acid, a polymer or compound monomer having space is added to obtain a composite solution;

[0080] Adding magnetic nanoparticles 2 to the composite solution, stirring to react, and coating the resulting solution on a glass substrate, drying, curing and dehydrating to form a thin film;

[0081] The thin film is peeled off from the glass substrate to obtain the base material 1 containing the magnetic nanoparticles 2.

[0082] Optionally, the polymer or compound monomer having a space may be a siloxane compound, a carbosiloxane compound or graphene. That is, the polymer or compound monomer has a space structure, such as Figure 2 and Figure 3 As shown, the skeleton of siloxane compounds composed of Si-O has a regular hexahedral spatial structure.

[0083] In this embodiment, Figure 4 is the molecular formula of polyimide. A composite material is formed by combining a polymer or compound with space with polyimide (PI) using organic-inorganic hybridization. Specifically, a siloxane compound (POSS) is used as an example, that is, an organic-inorganic hybrid polyimide material (PI-POSS) is used, wherein the POSS group can increase the strength of the polyimide. Compared with the mask made of unmodified polyimide, the sagging amount is smaller during the process of stretching the net and using it, and the product has a longer service life.

[0084] It should be noted that the added modified POSS group has a spatial three-dimensional structure, and the POSS group is evenly distributed on the molecular chain of polyimide, similar to a uniformly distributed porous structure. During the mixing process, the magnetic nanoparticles 2 can be evenly filled into the spatial structure of the POSS group. Compared with simple physical mixing, the overall magnetic strength of the mask obtained by this method is more uniform.

[0085] In this embodiment, in the step of adding the magnetic nanoparticles 2 to the composite solution for stirring reaction, the stirring speed of the stirring reaction can be selected to be 1000 r / min, and the stirring reaction time can be selected to be more than 24 hours. At the same time, in order to ensure the smooth progress of the reaction, the stirring reaction step is performed at N 2 Carried out under the protection of atmosphere.

[0086] In one embodiment, the polymer or compound monomer with space is taken as a siloxane compound (POSS) as an example, and the steps of preparing the polymer or compound monomer with space include: using phenyltriethoxysilane and butylammonium fluoride as reactants, and using a hydrolysis condensation method to prepare a cage-shaped oligomeric silsesquioxane monomer. Figure 2 and Figure 3 As shown, the cage-shaped oligomeric silsesquioxane monomer has a spatial stereostructure.

[0087] In one embodiment, the step of adding a polymer or compound monomer having a space during the preparation of polyamic acid to obtain a composite solution includes:

[0088] Using N,N'-dimethylacetamide as a reaction medium, diaminodiphenyl ether and 3,3',4,4'-dibenzophenone tetracarboxylic dianhydride as reactants, preparing polyamic acid through polycondensation, and adding a polymer or compound monomer with space during the reaction to obtain a composite solution;

[0089] The preparation process of the composite solution was carried out in N 2 Carried out under the protection of atmosphere.

[0090] In this embodiment, polyamic acid is prepared by adding diaminodiphenyl ether and 3,3',4,4'-dibenzophenone tetracarboxylic dianhydride to the reaction medium of N,N'-dimethylacetamide through polycondensation polymerization. In the reaction process of preparing polyamic acid, a polymer or compound monomer having a space, such as a siloxane compound (POSS), is added to react to obtain a composite solution. It is understandable that in order to ensure the smooth progress of the reaction, the entire reaction process is carried out in N 2 Carried out under the protection of atmosphere.

[0091] In one embodiment, the drying, curing and dehydrating steps include: placing the glass substrate in an oven and introducing N 2 , first dry at 60°C for 30 minutes to remove the reaction medium, and then heat up and dehydrate at a stepwise program of 100°C / h, 200°C / h, and 350°C / h.

[0092] In this embodiment, the magnetic nanoparticles 2 are added to the composite solution and the solution after stirring the reaction is evenly coated on the glass substrate, and then the glass substrate coated with the solution is placed in an oven for drying, so that the composite polyimide film containing POSS is obtained. It is understandable that in order to avoid other reactions of the solution coated on the glass substrate during the drying process, N is introduced into the oven. 2 , so that the glass substrate coated with the solution is dried at 60°C, and the drying time can be selected as 30 minutes, so as to effectively remove the reaction medium in the solution to achieve preliminary solidification. Then, the solution is completely dehydrated and solidified by step-by-step program heating to form a thin film on the glass substrate. Optionally, the step-by-step program heating is performed by step-by-step heating at 100°C / h, 200°C / h, and 350°C / h.

[0093] In one embodiment, the step of peeling the thin film from the glass substrate to obtain the substrate 1 containing the magnetic nanoparticles 2 includes:

[0094] The glass substrate is immersed in anhydrous ethanol;

[0095] The thin film was peeled off from the glass substrate and dried at room temperature to obtain a substrate 1 containing magnetic nanoparticles 2.

[0096] In this embodiment, the film solidified on the glass substrate is immersed in anhydrous ethanol, so that the film can be easily peeled off, and the peeled film is dried at room temperature to completely volatilize the anhydrous ethanol, thereby obtaining a substrate 1 containing magnetic nanoparticles 2. It can be understood that the prepared substrate 1 containing magnetic nanoparticles 2 is processed by laser drilling technology to form a pattern required by the design, so as to form a mask plate 100 structure.

[0097] In this embodiment, through laser technology, laser thinning technology is first used to thin the surface of one side of the substrate 1 containing magnetic nanoparticles 2 to form a groove 3 structure with an opening 31, and then laser opening technology is continued to be used to form a through hole 4 from one side of the bottom wall 32 of the groove 3 or the other side surface of the substrate 1, so that the through hole 4 is connected to the groove 3, thereby forming a mask template 100 structure.

[0098] The present invention provides a mask plate 100 for directly depositing OLED materials for a micro display screen with high resolution and small pixel size, and provides a preparation process route of the mask plate 100. PI is used instead of invar as a substrate to reduce the limitation of the thickness of the material itself, and FMM with higher ppi and smaller pixel size can be prepared; at the same time, the strength of the PI film is enhanced by using the POSS group to reduce the deformation amount during laser opening, net stretching and use; and magnetic nanoparticles 2 are added in the preparation process of the PI-POSS composite material, so that the single-layer PI-POSS film has a magnetic effect, which is convenient for adsorption with the alignment magnet plate of the vapor deposition machine, and reduces the sagging amount of the mask.

[0099] The present invention further provides a processing device, which includes a device body and the above-mentioned mask plate 100, and the mask plate 100 is arranged on the device body. The specific structure of the mask plate 100 refers to the above-mentioned embodiment. Since the processing device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0100] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A mask, It is characterized in that The mask comprises a substrate and magnetic nanoparticles, wherein the magnetic nanoparticles are embedded in the substrate.

2. The mask according to claim 1, It is characterized in that The substrate is a composite material formed by polyimide and a polymer or compound having space.

3. The mask according to claim 2, It is characterized in that The polymer or compound having space is a siloxane compound, a carbosiloxane compound or graphene; And / or, the magnetic nanoparticles are Fe 3 O 4 ; And / or, the magnetic nanoparticles are uniformly distributed in the substrate.

4. The mask according to any one of claims 1 to 3, It is characterized in that The substrate is formed with a groove with an opening at one end, and a through hole is formed on the bottom wall of the groove.

5. The mask according to claim 4, It is characterized in that The thickness of the bottom of the groove is 5um to 15um; And / or, the width of the side of the groove is 5 mm to 10 mm; And / or, the depth of the groove is 96% to 99% of the thickness of the substrate; And / or, the size of the opening is 0.85 to 0.95 of the length of the substrate; And / or, the size of the through hole is 1um to 10um; And / or, the through holes include a plurality of through holes, and the distance between two adjacent through holes is 2.5um to 10um; And / or, the density of the through holes is 30% to 50%.

6. The mask according to claim 4, It is characterized in that The inner wall of the groove includes a bottom wall and a side wall connected to each other, and the angle formed by the side wall and the bottom wall is 90° to 140°.

7. A method for preparing a mask according to any one of claims 1 to 6, It is characterized in that The preparation method comprises: preparing a substrate containing magnetic nanoparticles; A groove with an opening at one end is formed on the substrate by using laser technology, and a through hole is opened on the bottom wall of the groove.

8. The preparation method according to claim 7, It is characterized in that The step of preparing a substrate containing magnetic nanoparticles comprises: Preparation of polymers or compound monomers with space; Adding the polymer or compound monomer having space during the preparation of polyamic acid to obtain a composite solution; Adding magnetic nanoparticles to the composite solution, stirring to react, coating the resulting solution on a glass substrate, drying, curing and dehydrating to form a thin film; The thin film is peeled off from the glass substrate to obtain the substrate containing magnetic nanoparticles.

9. The preparation method according to claim 8, It is characterized in that The polymer or compound monomer having space is a siloxane compound, a carbosiloxane compound or graphene; And / or, the step of preparing the polymer or compound monomer having space includes: using phenyltriethoxysilane and butylammonium fluoride as reactants, and adopting a hydrolysis condensation method to prepare a cage-shaped oligomeric silsesquioxane monomer.

10. The preparation method according to claim 8, It is characterized in that The step of adding the polymer or compound monomer having space during the preparation of polyamic acid to obtain a composite solution comprises: Using N,N'-dimethylacetamide as a reaction medium, diaminodiphenyl ether and 3,3',4,4'-dibenzophenone tetraacid dianhydride as reactants, preparing polyamic acid through polycondensation polymerization, and adding the polymer or compound monomer having space during the reaction to obtain the composite solution; The preparation process of the composite solution is carried out in N 2 Carried out under the protection of atmosphere.

11. The preparation method according to claim 8, It is characterized in that The stirring speed of the stirring reaction is 1000 r / min, the stirring reaction time is more than 24 hours, and the stirring reaction step is N 2 Under the protection of the atmosphere; And / or, the drying, curing and dehydrating step comprises: placing the glass substrate in an oven and introducing N 2 , first dry at 60°C for 30 minutes to remove the reaction medium, and then heat up and dehydrate at a stepwise program of 100°C / h, 200°C / h, and 350°C / h.

12. The preparation method according to claim 8, It is characterized in that The step of peeling the film from the glass substrate to obtain the substrate containing magnetic nanoparticles comprises: soaking the glass substrate in anhydrous ethanol; The thin film is peeled off from the glass substrate and dried at room temperature to obtain the substrate containing magnetic nanoparticles.

13. A processing device, It is characterized in that The processing equipment comprises an equipment body and a mask plate according to any one of claims 1 to 6, wherein the mask plate is arranged on the equipment body.

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