Substrate clamping structure and substrate positioning method

Abstract

The invention provides a substrate clamping structure and a substrate positioning method. The substrate clamping structure comprises a base, a cover body and at least two positioning assemblies. The base comprises an annular wall part and a bearing part. The supporting part is used for supporting a substrate. The cover body comprises an annular body and at least two extending parts. The annular body is detachably connected to the annular wall part of the base. The positioning assemblies are arranged on the extending parts and used for abutting against the substrate. Therefore, the substrate clamping structure disclosed by the invention can be used for positioning the thin substrate, and can still stably clamp the substrate when the substrate is warped, so that the condition of non-uniform coating is avoided.

Description

Technical Field

[0001] The present disclosure provides a substrate clamping structure and a substrate positioning method. Background Art

[0002] Coating technology is a method of coating a specific material on the surface of an object. It is widely used in optoelectronics, semiconductors, optics and other related fields. In the coating process of a substrate (such as a wafer), in order to make the specific material evenly cover the surface of the substrate, it is conventional to fix the substrate in a clamping mechanism and rotate it at high speed to evenly distribute the specific material on the substrate.

[0003] However, the conventional clamping mechanism fixes the substrate by clamping the periphery of the substrate. When a specific material is deposited into a thin film, the film stress may cause the edge of the substrate to warp and cause the substrate to rotate and displace, thereby causing the problem of uneven coating. Furthermore, the method of clamping the periphery of the substrate makes the conventional clamping mechanism unsuitable for fixing thin substrates with a thickness of less than or equal to 2 mm, and it is also impossible to combine with the Equipment Front End Module (EFEM) to perform the step of automatically loading the substrate.

[0004] Therefore, how to make the clamping mechanism still firmly clamp the substrate when the substrate is warped, and how to use it to position thin substrates and combine it with the front-end module of the equipment is still a demand with economic value in the current market. Summary of the invention

[0005] One embodiment of the present disclosure is to provide a substrate clamping structure, comprising a base, a cover and at least two positioning components. The base comprises an annular wall portion and a supporting portion. The supporting portion is located on one side of the annular wall portion, the supporting portion extends toward a center surrounded by the annular wall portion, and the supporting portion is used to support a substrate. The cover comprises an annular body and at least two extensions. The annular body is detachably connected to the annular wall portion of the base. Each extension extends from the annular body toward a center surrounded by the annular body. Each positioning component is disposed on each extension, and each positioning component is used to abut against the substrate.

[0006] According to the substrate clamping structure of the aforementioned embodiment, the base may further include at least two first magnetic members, each of which is disposed in the annular wall portion. The cover may further include at least two second magnetic members, each of which is disposed in the annular body, and each first magnetic member corresponds to each second magnetic member. Each first magnetic member may be magnetically connected to each second magnetic member.

[0007] According to the substrate clamping structure of the aforementioned embodiment, the base may further include at least one guide member, and the at least one guide member is disposed on the annular wall portion. The cover may further include at least one guide hole, and the at least one guide hole is penetrated through the annular body, and the at least one guide hole can provide the at least one guide member to pass through it.

[0008] According to the substrate clamping structure of the aforementioned embodiment, at least one guide member may include a tapered structure, and the tapered structure is located at an end of the at least one guide member, and the tapered structure may correspond to at least one guide hole.

[0009] According to the substrate clamping structure of the aforementioned embodiment, each extension portion may include a positioning hole, and each positioning assembly may include a positioning member and a spring. The positioning member may include a column and a top portion, the column is connected to the top portion, wherein the column is disposed in the positioning hole, and the top portion protrudes from the positioning hole and is used to abut the substrate. The spring is sleeved on the column, wherein one end of the spring abuts against the top portion, and the other end of the spring abuts against the extension portion.

[0010] According to the substrate clamping structure of the aforementioned embodiment, each positioning assembly may further include a shell, and the shell is embedded in the positioning hole. The positioning member and the spring may be disposed in the shell, and the other end of the spring may abut against the shell.

[0011] According to the substrate clamping structure of the aforementioned embodiment, each positioning component may further include a pad body, and the pad body is disposed on the abutting top portion.

[0012] According to the substrate clamping structure of the aforementioned embodiment, the number of the at least two extending portions may be four, the number of the at least two positioning components may be four, and the four extending portions may be symmetrically distributed on the cover.

[0013] Another embodiment of the present disclosure is to provide a substrate positioning method, comprising: providing a substrate clamping structure as described in the previous paragraph, and fixing the base of the substrate clamping structure on a positioning device; placing a substrate on a supporting portion; aligning a cover body with the base, and connecting the cover body to the base; and each positioning component will push against the substrate from the cover body toward the base to limit the position of the substrate.

[0014] According to the substrate positioning method of the aforementioned embodiment, the cover can be magnetically connected to the base.

[0015] Thus, the substrate clamping structure and substrate positioning method disclosed in the present invention include a positioning component in the substrate clamping structure, and the positioning component is used to abut the configuration of the substrate, so that not only the substrate clamping structure can be used to position a thin substrate, but also the substrate can be firmly clamped when the substrate warps, thereby avoiding uneven coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0017] Figure 1 is a three-dimensional schematic diagram illustrating a substrate clamping structure according to an embodiment of the present disclosure positioning a substrate;

[0018] Figure 2 It is shown Figure 1 An exploded view of a substrate clamping structure;

[0019] Figure 3 It is shown Figure 1 A cross-sectional view of the substrate clamping structure along section line 3-3;

[0020] Figure 4 It is shown Figure 1 A cross-sectional view of the substrate clamping structure along section line 4-4;

[0021] Figure 5 It is shown Figure 2 An exploded view of a positioning assembly of a substrate clamping structure;

[0022] Figure 6 It is shown Figure 1 A cross-sectional view of the substrate clamping structure along section line 6-6;

[0023] Figure 7 is a schematic diagram illustrating a measurement position of light transmittance of a coated substrate to be measured;

[0024] Figure 8 Is applied to Figure 1 A schematic diagram of the relationship between the wavelength and light transmittance of a substrate with a substrate clamping structure after coating;

[0025] Fig. 9 It is a schematic diagram of the relationship between the wavelength and the light transmittance of the substrate after coating applied to the existing clamping mechanism;

[0026] Fig.10 Is applied to Figure 1 An image of a substrate after coating with a substrate clamping structure;

[0027] Fig.11 is an image of a substrate after coating applied to an existing clamping mechanism; and

[0028] Fig.12 FIG. 4 is a flowchart illustrating a method for positioning a substrate according to another embodiment of the present disclosure.

[0029] The reference numerals are described as follows:

[0030] 100: Substrate clamping structure

[0031] 200: Base

[0032] 201: Accommodation space

[0033] 210: Ring wall

[0034] 220: Supporting part

[0035] 230: First magnetic part

[0036] 240: Guide piece

[0037] 241: Conical structure

[0038] 300: Cover

[0039] 310: Ring body

[0040] 320: Extension

[0041] 321: Positioning hole

[0042] 330: Second magnetic member

[0043] 340: Guide hole

[0044] 400: Positioning component

[0045] 410: Positioning piece

[0046] 411: Column

[0047] 412: Reach the top

[0048] 420: Spring

[0049] 430: Shell

[0050] 440: Pad body

[0051] 500: Substrate positioning method

[0052] 510, 520, 530, 540: Steps

[0053] 3-3, 4-4, 6-6: hatching

[0054] A1, A3, A4, A5, A6, A7, A8, A9, C: Measurement positions

[0055] M: Coated substrate to be measured

[0056] N: Uncoated area

[0057] S: Substrate DETAILED DESCRIPTION

[0058] The following will discuss various embodiments of the present disclosure in more detail. However, this embodiment can be an application of various inventive concepts and can be specifically implemented in various specific scopes. The specific embodiments are for illustrative purposes only and are not limited to the scope of the disclosure. In addition, in order to simplify the drawings, some conventional structures and elements will be depicted in the drawings in a simple schematic manner, and repeated elements may be represented by the same number.

[0059] Please refer to Figure 1 and Figure 2 , Figure 1 FIG. 1 is a three-dimensional schematic diagram showing a substrate S positioned by a substrate clamping structure 100 according to an embodiment of the present disclosure. Figure 2 It is shown Figure 1 An exploded view of the substrate clamping structure 100. Figure 1 and Figure 2 It can be known that the substrate clamping structure 100 includes a base 200 , a cover 300 and at least two positioning components 400 .

[0060] The base 200 includes an annular wall portion 210 and a supporting portion 220. The supporting portion 220 is located at one side of the annular wall portion 210, wherein the supporting portion 220 extends toward a center surrounded by the annular wall portion 210, and the supporting portion 220 is used to support the substrate S. Specifically, in the substrate clamping structure 100, the annular wall portion 210 is a circular ring frame, where the annular wall portion 210 has two opposite sides, wherein the supporting portion 220 is integrally connected to one side of the annular wall portion 210, and the supporting portion 220 extends toward the center surrounded by the annular wall portion 210 and protrudes from the annular wall portion 210 to define a receiving space 201 of the base 200. In this way, the substrate S can be placed on the supporting portion 220 and located in the receiving space 201, so that the substrate S can be prevented from lateral separation from the substrate clamping structure 100. Furthermore, although not shown in the figures, in other embodiments, the annular wall portion may also be a structure of different shapes to correspond to substrates of different shapes, but the present disclosure is not limited thereto.

[0061] Furthermore, the base 200 can be made of stainless steel or other suitable materials, so that the base 200 has the advantages of corrosion resistance and high temperature resistance. Preferably, the base 200 can be made of SUS304 stainless steel, which not only makes the base 200 non-magnetic and has excellent structural strength, corrosion resistance and high temperature resistance, but also facilitates the subsequent connection of the cover 300 to the base 200, but the present disclosure is not limited thereto.

[0062] The cover 300 includes an annular body 310 and at least two extensions 320. The annular body 310 is detachably connected to the annular wall portion 210 of the base 200. Each extension 320 extends from the annular body 310 toward a center surrounded by the annular body 310. In detail, the shape of the annular body 310 corresponds to the shape of the annular wall portion 210, so that the annular body 310 is correspondingly connected to the other side of the annular wall portion 210, so that the base 200 and the cover 300 can be correspondingly combined, and each extension 320 is located on a side of the annular body 310 different from the annular wall portion 210. In this way, the substrate S can be limited between the cover 300 and the base 200, and it is convenient to position the substrate S later.

[0063] Each positioning assembly 400 is disposed on each extension portion 320, and each positioning assembly 400 is used to abut against the substrate S. Specifically, Figure 1 and Figure 2 In the embodiment, the number of at least two extensions 320 is four, and the four extensions 320 are symmetrically distributed on the annular body 310 of the cover 300, and the number of at least two positioning components 400 is also four, and the positions of the four positioning components 400 cooperating with the extensions 320 are also symmetrically distributed. When the substrate S is located in the accommodating space 201 and the cover 300 is correspondingly combined with the base 200, the four positioning components 400 will evenly push against the substrate S in the direction from the cover 300 to the base 200, so that the substrate clamping structure 100 clamps the substrate S in a direction perpendicular to a surface of the substrate S (not shown in the figure), so that the substrate S will be firmly positioned on the supporting portion 220. In this way, the substrate clamping structure 100 can be used to position a thinner substrate S (for example, the thickness can be less than or equal to 2 mm), and can firmly clamp the substrate S in a manner perpendicular to the surface of the substrate S when the substrate S is warped, thereby avoiding the situation that the substrate S has uneven coating such as coating color difference. Furthermore, the number of the extension portions 320 and the positioning components 400 can be adjusted as required, and the present disclosure is not limited to the number disclosed in the drawings.

[0064] Please also refer to Figures 1 to 3 ,in Figure 3 It is shown Figure 1 The cross-sectional view of the substrate clamping structure 100 along the section line 3-3. The base 200 may further include at least two first magnetic members 230, each of which is disposed in the annular wall portion 210. The cover 300 may further include at least two second magnetic members 330, each of which is disposed in the annular body 310, each of which corresponds to each of the second magnetic members 330, and each of which may be magnetically connected to each of the second magnetic members 330. Thus, when the annular body 310 is connected to the annular wall portion 210, the second magnetic members 330 will attract each other with the first magnetic members 230, so that the cover 300 is correspondingly combined with the base 200.

[0065] In detail, Figure 2 In the embodiment, the number of the first magnetic members 230 is twelve, and the twelve first magnetic members 230 can be arranged in the annular wall portion 210 at equal distances along the circumferential direction, and the number of the second magnetic members 330 is also twelve, and the twelve second magnetic members 330 cooperate with the twelve first magnetic members 230 and are arranged in the annular body 310 at equal distances along the circumferential direction. In this way, the cover 300 can be firmly combined with the base 200, thereby improving the overall balance of the substrate clamping structure 100, but the present disclosure is not limited thereto.

[0066] For example Figure 2 and Figure 3 As shown, each first magnetic component 230 can be a screw, and each second magnetic component 330 can be a magnet, wherein the first magnetic component 230 may not protrude from the annular wall portion 210 but may be flush with the edge of the annular wall portion 210. In this way, the side of the annular wall portion 210 facing the annular body 310 can remain flat, thereby preventing the first magnetic component 230 from falling off or being damaged due to external forces such as collision during the process of the cover body 300 being combined with the base 200.

[0067] Furthermore, the first magnetic member 230 can be made of alloy steel, so that the first magnetic member 230 has the advantages of high strength and corrosion resistance. Preferably, the first magnetic member 230 can be made of SCM435 alloy steel, and the surface of the first magnetic member 230 can be plated, which will help prevent the first magnetic member 230 from rusting, thereby increasing the service life of the substrate clamping structure 100, but the present disclosure is not limited thereto.

[0068] Furthermore, the second magnetic member 330 can be disposed in the annular body 310 by magnetic force. Specifically, the cover 300 can be made of SUS440C stainless steel, so that the cover 300 has the characteristics of strong magnetism, high hardness and corrosion resistance, so that the second magnetic member 330 can be firmly adsorbed in the annular body 310, thereby effectively preventing the second magnetic member 330 from falling off.

[0069] In addition, although not shown in the figure, in other embodiments, the number of the first magnetic component and the second magnetic component can be adjusted arbitrarily according to needs, and the first magnetic component can be a magnet, the second magnetic component can be a screw, or the first magnetic component and the second magnetic component can both be magnets, but the present disclosure is not limited to this.

[0070] Please also refer to Figure 1 , Figure 2 and Figure 4 ,in Figure 4 It is shown Figure 1The base 200 may further include at least one guide member 240, and the at least one guide member 240 is disposed on the annular wall portion 210. The cover 300 may further include at least one guide hole 340, and the at least one guide hole 340 is disposed through the annular body 310, and the at least one guide hole 340 provides a corresponding insertion of the at least one guide member 240 therein.

[0071] Specifically, if Figure 2 and Figure 4 As shown, the number of guide members 240 is two, and the number of guide holes 340 is two, wherein one end of each guide member 240 protrudes out of the annular wall portion 210. In this way, when the annular body 310 is connected to the annular wall portion 210, the end of the guide member 240 protruding out of the annular wall portion 210 will correspondingly penetrate into the guide hole 340, so that the cover body 300 can be correctly positioned to the base 200, and it is beneficial for the second magnetic member 330 to be correspondingly connected to the first magnetic member 230.

[0072] Furthermore, at least one guide member 240 may include a conical structure 241, which is located at one end (not shown) of the at least one guide member 240, and the conical structure 241 corresponds to at least one guide hole 340. Thus, when the cover 300 is to be connected to the base 200, the guide member 240 will face the guide hole 340 of the cover 300 with the conical structure 241, and the guide hole 340 can be smoothly inserted into the guide hole 340 by the guidance of the conical structure 241, which is not only conducive to the corresponding connection between the second magnetic member 330 and the first magnetic member 230, but also can improve the convenience of use of the substrate clamping structure 100.

[0073] Please also refer to Figure 1 , Figure 2 , Figure 5 and Figure 6 ,in Figure 5 It is shown Figure 2 An exploded view of the positioning assembly 400 of the substrate clamping structure 100, Figure 6 It is shown Figure 1 6-6. Each extension portion 320 may include a positioning hole 321 (indicated at Figure 2 ). Each positioning assembly 400 may include a positioning member 410 , a spring 420 and a housing 430 .

[0074] like Figure 5 and Figure 6As shown, the positioning member 410 includes a column 411 and a butt-joint portion 412, wherein the column 411 is connected to the butt-joint portion 412, wherein the column 411 is disposed in the positioning hole 321, and the butt-joint portion 412 protrudes from the positioning hole 321 and is used to butt the substrate S. Specifically, in the substrate clamping structure 100, the column 411 is generally a cylindrical body, wherein one end of the column 411 is passed through the positioning hole 321, and the other end of the column 411 is integrally connected to the butt-joint portion 412, and the side of the butt-joint portion 412 away from the column 411 faces the base 200. Thus, by adjusting the position of the column 411 in the positioning hole 321, the butt-joint portion 412 can butt against the substrate S from the cover 300 toward the base 200, thereby firmly positioning the substrate S.

[0075] The housing 430 is embedded in the positioning hole 321, and the positioning member 410 and the spring 420 are disposed in the housing 430. Specifically, the spring 420 is sleeved on the column 411, wherein one end of the spring 420 abuts against the top portion 412, and the other end of the spring 420 abuts against the housing 430. Thus, the spring 420 can maintain the distance between the top portion 412 and the positioning hole 321, and the elasticity of the spring 420 can increase the force of the top portion 412 abutting against the substrate S, thereby improving the effect of the positioning assembly 400 in positioning the substrate S.

[0076] By configuring the positioning assembly 400 to include the positioning member 410, the spring 420, and the housing 430, the positioning assembly 400 can be directly embedded in the positioning hole 321 after being prepared, which is conducive to improving the assembly convenience of the substrate clamping structure 100. In addition, although not shown in the figure, in other embodiments, the positioning assembly may only include a positioning member and a spring without a housing, so that one end of the spring abuts against the top portion and the other end of the spring abuts against the extension portion, thereby reducing the cost of preparing the substrate clamping structure.

[0077] like Figure 2 , Figure 5 and Figure 6 As shown, the positioning assembly 400 may further include a pad 440, and the pad 440 is disposed on the top portion 412. In detail, the pad 440 is disposed on the side of the top portion 412 away from the column 411, so that the pad 440 will further provide friction and enable the positioning assembly 400 to resist the centrifugal force of the substrate S rotating during the coating process, thereby avoiding the coating color difference and other uneven coating caused by the rotation displacement of the substrate S. Furthermore, the configuration of the pad 440 can also provide a buffering force for the positioning member 410 to abut the substrate S, and can avoid the substrate S from being broken due to the rapid displacement of the positioning member 410. Further, the elasticity of the spring 420 can increase the separation speed of the positioning member 410 from the substrate S, which can effectively reduce the colloid residue of the pad 440 on the substrate S due to temperature changes.

[0078] Furthermore, the material of the pad body 440 may include rubber or silicone, so that the pad body 440 has high temperature resistance and excellent buffering effect. Preferably, the material of the pad body 440 may include silicone, but the present disclosure is not limited thereto. Furthermore, although not shown in the figure, in other embodiments, the pad body may also have a texture layer to increase the friction of the pad body, but the present disclosure is not limited thereto.

[0079] Please refer to Figures 7 to 9 , Figure 7 Schematic diagram showing light transmittance measurement positions A1, A3, A4, A5, A6, A7, A8, A9, and C of a coated substrate M to be measured. Figure 8 Is applied to Figure 1 Schematic diagram of the relationship between wavelength and light transmittance of a substrate with a substrate clamping structure after coating. Fig. 9 Schematic diagram of the relationship between wavelength and light transmittance of a substrate after coating applied to an existing clamping mechanism, wherein Figure 8 and Fig. 9 is in accordance with Figure 7 The measurement positions A1, A3, A4, A5, A6, A7, A8, A9, and C marked on the coated substrate M to be measured are measured and drawn after obtaining relevant values.

[0080] In detail, Figure 8 and Fig. 9 The test results in the figure are obtained by loading the substrate into the substrate clamping structure of the present disclosure and the existing clamping mechanism, coating the substrate with silicon dioxide and measuring the light transmittance at different positions within a wavelength range, so as to analyze the influence of the stability of the substrate during the coating process on the coating effect. Specifically, when the substrate is rotated due to incomplete positioning during the coating process, it is easy to cause the thickness of the coating layer at the edge of the substrate to be inconsistent, thereby causing the light transmittance to decrease and the light transmittance curve to be unstable.

[0081] like Figure 7 As shown, the coated substrate M to be measured may include nine measuring positions A1, A3, A4, A5, A6, A7, A8, A9, and C, wherein the coated substrate M to be measured is circular in shape with a diameter of 300 mm, and the measuring positions A1, A3, A4, A5, A6, A7, A8, and A9 are all located 5 mm inward from the edge of the coated substrate M to be measured and are symmetrically distributed on the coated substrate M to be measured, and the measuring position C is located at the center of the coated substrate M to be measured.

[0082] When the wavelength of the incident light is between about 910 nanometers and 940 nanometers, Figure 8 It can be seen that after the substrate is coated, the light transmittance at the measuring positions A1, A3, A4, A5, and C of the substrate positioned by the substrate clamping structure of the present disclosure is higher than Fig. 9 The light transmittance shown is within the wavelength range of 910 nm to 950 nm for the incident light. Figure 8 The changes in light transmittance at the measurement positions A1, A3, A4, A5, and C are shown in Figure 2. Fig. 9 The changes in the light transmittance at the measuring positions A1, A3, A4, A5, and C are relatively stable, indicating that the substrate clamping structure disclosed in the present disclosure can effectively prevent the substrate from rotating during the coating process, thereby causing uneven coating. Figure 8 It can be seen that the substrates positioned by the substrate clamping structure of the present disclosure have a light transmittance higher than 88% at the measuring positions A6, A7, A8, and A9 after coating, and the light transmittance curve does not decrease when the wavelength of the incident light is between about 910 nanometers and 940 nanometers. It can be seen that the substrate clamping structure of the present disclosure has an excellent substrate positioning effect.

[0083] Please refer to Fig.10 and Fig.11 , Fig.10 Is applied to Figure 1 The image of the substrate after coating. Fig.11 It is the image of the substrate after coating applied to the existing clamping mechanism. Fig.10 and Fig.11 The test results are obtained by loading the substrate into the substrate clamping structure of the present disclosure and the existing clamping mechanism respectively, coating the substrate with a multilayer film and measuring the size change of the uncoated area N, thereby analyzing the influence of the stability of the substrate during the coating process on the coating effect.

[0084] Furthermore, the coating material is coated on the substrate from the substrate clamping structure of the present disclosure and the base of the existing clamping mechanism toward the cover body, so that the edge of the coated substrate has multiple uncoated areas N. When the substrate rotates due to incomplete positioning during the coating process, the size of the uncoated area N at the edge of the substrate will be expanded circumferentially, thereby causing coating color difference at the edge of the substrate.

[0085] Depend on Fig.10 It can be seen that the size of the uncoated area N of the substrate positioned by the substrate clamping structure of the present disclosure after coating is smaller than Fig.11 The size of the uncoated area N is shown, and Fig.11 The uncoated area N in Fig.10 The uncoated area N in the figure is expanded by about 75 mm in the circumferential direction, indicating that the substrate clamping structure disclosed in the present invention can prevent the substrate from rotating due to incomplete positioning during the coating process and has an excellent substrate positioning effect.

[0086] In addition, the present disclosure further provides Figure 1 The measurement results of the amount of dust deposited on the substrate of the substrate clamping structure of the present disclosure and the substrate applied to the existing clamping mechanism after high-speed rotation are used to analyze the influence of the stability of the substrate during high-speed rotation on the wear of the substrate. Specifically, the substrate is first cleaned and the amount of dust after cleaning is measured to obtain a basic dust amount, and then the substrate is loaded into the substrate clamping structure of the present disclosure and the existing clamping mechanism respectively, and then the substrate is rotated at a high speed for three minutes, and the dust amount after cleaning is obtained by cleaning the substrate and measuring the amount of dust after cleaning. Finally, the dust amount after testing is subtracted from the basic dust amount to analyze the wear of the substrate during the test.

[0087] Please refer to Table 1, which shows the analysis results of the amount of dust deposited on the surface of the substrate after the rotation test minus the amount of dust deposited on the surface of the substrate before the rotation test, wherein the embodiment represents the application Figure 1 The substrate clamping structure is a substrate, the comparative example represents a substrate applied to an existing clamping mechanism, and the amount of dust is divided into four groups according to the diameter of the dust, namely, dust diameter greater than 2 microns, dust diameter greater than 5 microns, dust diameter greater than 10 microns and dust diameter greater than 30 microns.

[0088]

[0089] As shown in Table 1, in the groups of dust diameter greater than 2 microns, dust diameter greater than 5 microns, and dust diameter greater than 10 microns, compared with the substrate positioned by the clamping mechanism of the comparative example, the amount of dust deposited on the surface of the substrate positioned by the substrate clamping structure of the embodiment is significantly less than the amount of dust deposited on the surface of the substrate positioned by the clamping mechanism of the comparative example, indicating that the substrate clamping structure of the present disclosure can effectively prevent the rotational displacement of the substrate due to incomplete positioning during high-speed rotation, and reduce the generation of dust due to substrate wear, thereby helping to improve the yield of the substrate.

[0090] Please refer to Fig.12 , which is a flowchart of a substrate positioning method 500 according to another embodiment of the present disclosure. The substrate positioning method 500 includes step 510, step 520, step 530 and step 540.

[0091] Step 510 is to provide a substrate clamping structure and fix the base of the substrate clamping structure on a positioning device. Specifically, the substrate clamping structure provided by the substrate positioning method 500 can be Figure 1 The substrate clamping structure 100 is a substrate clamping structure 100, but is not limited thereto. The details of the substrate clamping structure 100 are described in the previous paragraph, and will not be repeated here. The subsequent elements and descriptions of the substrate clamping structure will not be labeled separately.

[0092] Step 520 is to place a substrate on the supporting portion of the substrate clamping structure. Specifically, the substrate can be placed on the supporting portion by vacuum adsorption, but the present disclosure is not limited thereto.

[0093] Step 530 is to align the cover of the substrate clamping structure with the base and connect the cover to the base. Further, the cover can be connected to the base by magnetic attraction, so that the substrate clamping structure has the advantage of being easy to disassemble and the cover can be firmly combined with the base, but the present disclosure is not limited to this.

[0094] Step 540 is for each positioning component to push against the substrate from the cover toward the base to limit the position of the substrate. In this way, the substrate clamping structure can clamp the substrate in a direction perpendicular to the surface of the substrate, which can not only be combined with the front-end module of the equipment to perform the step of automatically loading the substrate, but also achieve an excellent effect of positioning the substrate.

[0095] In summary, the advantages of the substrate clamping structure and the substrate positioning method disclosed in the present disclosure are as follows. First, the substrate clamping structure includes a positioning component, and the positioning component is used to abut the configuration of the substrate, so that the substrate clamping structure can not only be used to position a thin substrate, but also can firmly clamp the substrate when the substrate is warped, thereby avoiding the situation of uneven coating. Second, the base includes a first magnetic part, the cover body includes a second magnetic part, and the first magnetic part can be magnetically connected to the second magnetic part, so that the cover body can be firmly combined with the base, thereby improving the structural stability of the substrate clamping structure. Third, the base includes a guide member, the cover body includes a guide hole, and the guide hole provides a corresponding way for the guide member to be inserted therein, which is conducive to allowing the cover body to be correctly positioned on the base. Fourth, the configuration of each positioning component including a positioning member, a spring and a pad body can enable the substrate clamping structure to firmly position the substrate, thereby avoiding the situation of uneven coating such as coating color difference caused by rotational displacement of the substrate. Therefore, the substrate clamping structure and the substrate positioning method disclosed in the present disclosure have commercial application potential in related industries.

[0096] Although the present disclosure has been disclosed in the above implementation mode, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the following claims.

Claims

1. A substrate clamping structure, It is characterized in that Include: A base, including: a ring wall portion; and A supporting portion is located at one side of the annular wall portion, the supporting portion extends toward a center surrounded by the annular wall portion, and the supporting portion is used to support a substrate; A cover body, comprising: an annular body detachably connected to the annular wall portion of the base; and At least two extensions, each of which extends from the annular body toward a center surrounded by the annular body; and At least two positioning components are provided, each of which is disposed on each of the extending portions, and each of the positioning components is used to abut against the substrate.

2. The substrate clamping structure according to claim 1, It is characterized in that The base further includes at least two first magnetic components, each of which is disposed in the annular wall portion; and The cover further comprises at least two second magnetic members, each of which is disposed in the annular body, and each of the first magnetic members corresponds to each of the second magnetic members; Wherein, each of the first magnetic components can be magnetically connected to each of the second magnetic components.

3. The substrate clamping structure according to claim 1, It is characterized in that The base further comprises at least one guide member, and the at least one guide member is disposed on the annular wall portion; and The cover body further comprises at least one guide hole, the at least one guide hole is penetrated through the annular body, and the at least one guide hole provides the at least one guide member to pass through it.

4. The substrate clamping structure according to claim 3, It is characterized in that The at least one guide member includes a tapered structure, the tapered structure is located at one end of the at least one guide member, and the tapered structure corresponds to the at least one guide hole.

5. The substrate clamping structure according to claim 1, It is characterized in that Each of the extension portions comprises a positioning hole; and Each of the positioning components comprises: A positioning member, comprising a column and an abutting top portion, wherein the column is connected to the abutting top portion, wherein the column is disposed in the positioning hole, and the abutting top portion protrudes from the positioning hole and is used to abut the substrate; and A spring is sleeved on the column, wherein one end of the spring abuts against the top portion, and the other end of the spring abuts against the extension portion.

6. The substrate clamping structure according to claim 5, It is characterized in that Each positioning component further comprises: A housing, embedded in the positioning hole; The positioning member and the spring are arranged in the housing, and the other end of the spring abuts against the housing.

7. The substrate clamping structure according to claim 5, It is characterized in that Each positioning component further comprises: A pad body is arranged on the top of the support.

8. The substrate clamping structure according to claim 1, It is characterized in that The number of the at least two extending portions is four, the number of the at least two positioning components is four, and the plurality of extending portions are symmetrically distributed on the cover.

9. A substrate positioning method, It is characterized in that Include: Providing a substrate clamping structure according to any one of claims 1 to 8, and fixing the base of the substrate clamping structure on a positioning device; placing a substrate on the supporting portion; Align the cover with the base, and connect the cover to the base accordingly; and Each of the positioning components will abut the substrate from the cover toward the base to limit the position of the substrate.

10. The substrate positioning method according to claim 9, It is characterized in that The cover is magnetically connected to the base.

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