Electroplating device and electroplating method for non-circular substrate

Abstract

The invention discloses an electroplating device for a non-circular substrate, which comprises a central electrode area which is circular, the size of the central electrode area is an inscribed circle of the non-circular substrate, a central electrode is arranged in the central electrode area, and the central electrode area is filled with the central electrode; the peripheral electrode area is arranged around the central electrode area, the peripheral size of the peripheral electrode area is the excircle of the non-circular substrate, a peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of blocky electrodes and fills the peripheral electrode area; the power supply module comprises a plurality of power supplies and is used for supplying power to the central electrode and the peripheral electrodes; and the control module is used for detecting the rotating position of the substrate, calculating the current magnitude required by each current block electrode and feeding back the current magnitude to the power supply module to adjust the current magnitude.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to an electroplating process in semiconductor manufacturing technology. Background Art

[0002] Most traditional substrates are round, while chips are mostly square. Forming a square chip on a round substrate will lead to waste of substrate corner area due to shape mismatch. Therefore, the area utilization rate of producing square chips on a round substrate is not high, which also affects the chip production efficiency to a certain extent.

[0003] With the increasing popularity of panel-level packaging and changes in substrate materials, the application of square substrates is increasing. The square substrate is more compatible with the shape of the chip. On a substrate of the same area, a square substrate can accommodate more chips than a circular substrate. The edge area of ​​the square substrate can also be used to arrange chips. Therefore, the area utilization rate of the square substrate is improved, and the production efficiency of the chip is also improved.

[0004] When electroplating a square substrate, a vertical electroplating method is generally used. The existing vertical electroplating generally clamps the substrate to a special fixture, and immerses the substrate and the fixture into multiple different plating tanks one by one. During electroplating, the current is output to the fixture, and then transmitted to the substrate surface through the metal clamping point of the fixture, so that the copper ions in the chemical solution are attached to the surface to complete the electroplating. The square substrate after this vertical electroplating cannot achieve the same effect as the circular substrate, such as poor surface flatness, and COP (Crystal Originated Particles) defects will be more obvious. In addition, during the vertical electroplating process, the substrate and the fixture are switched between different plating tanks together, which cannot avoid the problem of cross-contamination of the plating solution, and will also affect the stability of the chemical solution and the coating. At the same time, vertical electroplating cannot effectively adjust the upper and lower differences in the electroplating effect of the square substrate.

[0005] Furthermore, directly using the existing electroplating equipment to perform horizontal electroplating on the square substrate will cause the edge to be too thick. Figure 1A-1B , Figure 2A-2B As shown, the electrode 1 of the existing electroplating device is mostly circular or annular. When the electroplating process is performed on a square substrate or a rectangular substrate, the substrate cannot cover all the electrode areas because the shape does not match the electrode. During the rotation of the square substrate w, the central area 101 of the electrode 1 will always be covered by the substrate w. However, only part of the electrode area of ​​the edge area of ​​the electrode 1 is covered by the substrate w at the same time, thereby forming a situation where the edge of the substrate w cuts the electric field, which will cause uneven electroplating and greatly increase the height of the copper column at the edge of the substrate. Summary of the invention

[0006] The object of the present invention is to provide an electroplating device and an electroplating method for a non-circular substrate.

[0007] To achieve the above-mentioned object and other related objects, the present invention provides an electroplating device for a non-circular substrate, comprising:

[0008] A central electrode region is circular and has a size equal to an inscribed circle of the non-circular substrate, wherein a central electrode is arranged in the central electrode region and the central electrode fills the central electrode region;

[0009] A peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is the circumscribed circle of the non-circular substrate, and peripheral electrodes are arranged in the peripheral electrode area, and the peripheral electrodes are multiple block electrodes filling the peripheral electrode area;

[0010] A power module, comprising a plurality of power supplies, for supplying power to the central electrode and the peripheral electrodes;

[0011] The control module is used to detect the rotation position of the substrate, calculate the current required by each block electrode and notify the power module to adjust the current.

[0012] Preferably, the current required by the block electrode is Wherein, S' is the area of ​​the block electrode covered by the substrate, S is the area of ​​the block electrode, and I is the current supplied by the power module to the central electrode area.

[0013] Preferably, there are multiple peripheral electrode areas, and the multiple peripheral electrode areas are concentric rings.

[0014] Preferably, the block electrode is obtained by dividing the peripheral electrode into N equal parts, wherein N is a multiple of 4.

[0015] Preferably, the control module includes an angle sensor and a projection simulator, the angle sensor is used to track the rotation angle of the substrate, and the projection simulator simulates the current position of each vertex of the substrate according to the rotation angle of the substrate to determine the projection area of ​​the substrate in the peripheral electrode area, and further calculates the area of ​​each block electrode covered by the substrate.

[0016] Preferably, the control module includes an angle sensor and a controller, the angle sensor is used to track the rotation of the substrate to identify the angle of rotation of the substrate, and the controller presets the current size that needs to be adjusted for each corresponding block electrode according to the angle interval of substrate rotation. When the angle sensor identifies that the substrate rotates at each angle interval, the controller feeds back to the power supply module according to the preset current size to adjust the corresponding current.

[0017] Preferably, each block electrode is powered by a corresponding one of the plurality of power supplies.

[0018] Preferably, the non-circular substrate is square.

[0019] Preferably, every two centrosymmetrical block electrodes form a group, so as to obtain a plurality of electrode groups, and each electrode group is powered by a power supply.

[0020] Preferably, the non-circular substrate is square.

[0021] Preferably, the number of power supplies provided in each peripheral electrode region is the maximum number of block electrodes that can be covered by any corner of the substrate in each peripheral electrode region.

[0022] The present invention also provides an electroplating method for a non-circular substrate, characterized by comprising:

[0023] Dividing the electrode area, including dividing the electrode area into a central electrode area and a peripheral electrode area, the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, the central electrode fills the central electrode area, and the peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, the peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area;

[0024] Tracking the rotational position of the substrate;

[0025] Calculate the required current of each block electrode according to the effective area of ​​each block electrode covered by the substrate;

[0026] The current required by each block electrode is adjusted and supplied to the corresponding block electrode.

[0027] The present invention also provides an electroplating method for a non-circular substrate, characterized by comprising:

[0028] Dividing the electrode area, including dividing the electrode area into a central electrode area and a peripheral electrode area, the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, the central electrode fills the central electrode area, and the peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, the peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area;

[0029] The current parameters required for each block electrode corresponding to each rotation angle interval of the preset substrate;

[0030] Tracking the rotational position of the substrate;

[0031] When the substrate rotates at each angular interval, the current is adjusted according to the preset power supply parameters and supplied to the corresponding block electrodes.

[0032] As described above, the electroplating device and method provided by the present invention divides the electrode into a central electrode area and a peripheral electrode area, and sets a plurality of small electrode blocks in the peripheral electrode area to fill the peripheral electrode area. By obtaining the change in the area covered by each small electrode block during the rotation of the substrate, the current supplied to each small electrode block is adjusted, which can solve the problem of uneven electroplating of non-circular substrates using existing electroplating devices and excessively high edge copper pillars. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1A Shown is a schematic diagram of an existing electroplating device performing an electroplating process on a square substrate;

[0034] Figure 1B The schematic diagram shown is a square substrate after being rotated at a certain angle on an existing electroplating device;

[0035] Figure 2A Shown is a schematic diagram of an existing electroplating device performing an electroplating process on a rectangular substrate;

[0036] Figure 2B The figure shows a schematic diagram of a rectangular substrate after being rotated at a certain angle on a conventional electroplating device;

[0037] Figure 3A FIG. 1 is a schematic diagram showing a peripheral electrode of a non-circular substrate electroplating device divided into four equal parts according to an embodiment of the present invention;

[0038] Figure 3B It is a schematic diagram showing the periphery electrode of a non-circular substrate electroplating device divided into eight equal parts according to an embodiment of the present invention;

[0039] Figure 3C It is a schematic diagram showing sixteen equal parts of the peripheral electrode of a non-circular substrate electroplating device according to an embodiment of the present invention;

[0040] Figure 4 It is a schematic diagram of a power supply control of a non-circular substrate electroplating device according to an embodiment of the present invention;

[0041] Figure 5A The figure shows the change in the area of ​​the square substrate w covering the peripheral electrode region during the rotation process;

[0042] Figure 5B The figure shows the change in the area of ​​the rectangular substrate w covering the peripheral electrode area during the rotation process;

[0043] Fig. 6AIt is a schematic diagram of power supply control of a rectangular substrate electroplating device according to an embodiment of the present invention;

[0044] Figure 6B Shown is a schematic diagram of power supply control for a square substrate electroplating device according to an embodiment of the present invention;

[0045] Figures 7A-7E Schematic diagram of the area variation of the peripheral electrodes covered by the square substrate electroplating device according to one embodiment of the present invention, which are divided into eight, twelve, sixteen, twenty and twenty-four parts respectively;

[0046] Figure 8 Shown is a table showing the minimum number of power supplies corresponding to different numbers of partitions of electrodes around a square substrate;

[0047] Fig. 9 Shown is a schematic table of the current required for each block electrode corresponding to different numbers of partitions of the electrodes around the square substrate;

[0048] Fig.10 FIG. 4 is a flow chart of a method for electroplating a non-circular substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0049] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0050] It should be noted that the illustrations provided in this embodiment are only schematic illustrations of the basic concept of the present invention. Although the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation can be changed arbitrarily, and the component layout form may also be more complicated. In addition, the parts with the same reference numerals in multiple drawings represent the same or equivalent parts or components.

[0051] Figures 3A-3CSchematic diagrams of various specific implementations of an electroplating device for a non-circular substrate according to an embodiment of the present invention are disclosed. The non-circular substrate in the present invention can be a regular shape such as a square, a triangle, a rhombus, etc. The current mainstream non-circular substrate is a square substrate, that is, a square and a rectangular substrate. Therefore, the present invention focuses on the square substrate as an example. The electroplating device for the non-circular substrate includes a central electrode area 101 and a peripheral electrode area 102. The central electrode area 101 is circular, and the size of the central electrode area 101 is the inscribed circle of the non-circular substrate w. A central electrode is set in the central electrode area 101, and the central electrode fills the central electrode area 101. Because the central electrode fills the entire central electrode area, in this article and the accompanying drawings, the figure mark 101 represents both the central electrode area and the central electrode. The central electrode can be a single circular electrode, and the single circular electrode alone fills the central electrode area 101. The central electrode can also be a combination of multiple small electrodes filling the central electrode area 101.

[0052] The peripheral electrode area 102 is arranged around the central electrode area 101, and the outer peripheral size of the peripheral electrode area 102 is the circumscribed circle of the non-circular substrate. A peripheral electrode is arranged in the peripheral electrode area 102, and the peripheral electrode fills the peripheral electrode area 102. There are several peripheral electrode areas, and the peripheral electrode areas are in concentric rings. The peripheral electrode areas are sequentially arranged outward from the central electrode area 101, and the size of the outermost peripheral electrode area is the circumscribed circle of the non-circular substrate. Because the peripheral electrode fills the entire peripheral electrode area, in this article and the accompanying drawings, the figure mark 102 represents both the peripheral electrode area and the peripheral electrode. Figures 3A-3C As shown, two peripheral electrode regions, a first peripheral electrode region 121 and a second peripheral electrode region 122, are sequentially arranged around the central electrode region 101. In the illustrated embodiment, the widths of the two peripheral electrode regions are equal, and in other embodiments, the widths of the plurality of peripheral electrode regions may be unequal.

[0053] The peripheral electrode is composed of a plurality of block electrodes 1021 and fills the peripheral electrode area 102. The plurality of block electrodes 1021 can be obtained by dividing the peripheral electrode of the peripheral electrode area 102 into N equal parts, where N is a multiple of 4, such as four equal parts, eight equal parts, and sixteen equal parts, corresponding to Figure 3A , 3B , 3C. The electrode bisectors of multiple peripheral electrode regions 102 may overlap, such as Figure 3A , 3B , the electrode bisectors of the plurality of electrode regions 102 may also be staggered, such as Figure 3C The block electrode 1021 is preferably obtained by dividing the peripheral electrodes into eight or sixteen equal parts. This implementation method facilitates the precise control of each block electrode, and the computing power required to control each block electrode separately will not be too large.

[0054] The electroplating device for a non-circular substrate provided in this embodiment further includes a power module 103 and a control module 104. The power module 103 includes a plurality of separate power sources, such as Figure 4 Each block electrode 1021 is provided with a corresponding power supply to supply power. When the control module 104 calculates the current I' required by each block electrode 1021 and provides it to the power module 103, the corresponding power module 103 adjusts the current and supplies it to the block electrode 1021.

[0055] Figure 5A , 5B Schematic diagrams of the changes in the coverage area when a square substrate and a rectangular substrate are rotated on the electroplating device of the present invention. The dotted line in the figure shows the substrate at the first position. It can be seen that the area covered by the substrate w on the peripheral electrode area at this time. The solid line in the figure shows that the substrate w reaches the second position after rotating a certain angle. The stripe filling part is the area covered by the substrate w on the peripheral electrode area at the second position. Since the central electrode 101 is the inscribed circle of the square substrate w, the central electrode 101 is always covered by the substrate w and does not change due to the rotation of the substrate w. The peripheral electrode area 102 is only covered by the four corners of the substrate w. It can be seen that at different times, due to the rotation of the substrate w, the area covered by the substrate w of the same block electrode 1021 is different. Therefore, it is necessary to determine the area S' covered by the substrate w of each block electrode 1021 and adjust the amount of current supplied to each block substrate 1021.

[0056] Back to Figure 4As shown, in order to realize the above process, the control module 104 includes an angle sensor 141 and a projection simulator 142. Any angle of the substrate w is taken as the reference vertex angle, the initial position of the reference vertex angle is 0°, and the angle differences between the other three vertex angles and the reference vertex angle are 90 degrees, 180 degrees and 270 degrees. The angle sensor 141 is arranged in the electroplating chamber to track the rotation angle of the reference vertex angle of the substrate w. According to the rotation angle of the substrate w determined by the angle sensor 141, the angle of the reference vertex angle of the substrate w can be determined and the angles of the other three vertex angles can be calculated accordingly. The projection simulator 142 obtains the rotation angle of the substrate w from the angle sensor 141, determines the position of each vertex angle according to the rotation angle of the substrate w, and after determining the position of each vertex angle, connects each vertex angle to simulate the projection area covered by the substrate in the peripheral electrode area, and further obtains the area covered by each block electrode 1021. In one embodiment, the projection simulator 142 is built-in software in hardware such as a processor and a controller. The control module 104 calculates the current required for each block electrode 1021 according to the area covered by each block electrode 1021 and then feeds it back to the power module 103 for adjustment. Specifically, since the central electrode 101 is always covered by the substrate w during the process, the current supplied to the central electrode 101 by the current device 103 is constant during the entire process, which is denoted as I. After the control module 104 calculates the area S' covered by the substrate w for each block electrode 1021, the current required for each block electrode 1021 can be calculated. Wherein, S is the total area of ​​the block electrodes. The power supply corresponding to each block electrode 1021 adjusts the current size according to the calculated required current. The control module 104 can monitor the rotation angle of the substrate w in real time to adjust the current size required for each block electrode in real time, or it can be set to calculate and adjust the current size required for each block electrode through the above steps every time the substrate w rotates an angle interval.

[0057] Fig. 6A FIG. 1 is a schematic diagram of a second configuration of a power module of an electroplating device when the substrate is rectangular. In the second configuration, the non-circular substrate w is rectangular. Figure 5B When the substrate w is rectangular, the area covered by the substrate w is the same for every two centrally symmetrical block electrodes 1021 in the same peripheral electrode region 102. Therefore, every two centrally symmetrical block electrodes 1021 in the same peripheral electrode region 102 form an electrode group, and the current required by the block electrodes 1021 in each electrode group is the same, which can be controlled by one power supply, such as Fig. 6ATherefore, compared with the first configuration of the power module, the power supply can be reduced by half. When the substrate w is square, since the area covered by the substrate w for each two axially symmetrical block electrodes 1021 in the same peripheral electrode area 102 is the same, this configuration of the power module can also be applied.

[0058] Figure 6B FIG. 1 is a schematic diagram of a third configuration of the power module of the electroplating device when the substrate is square. In the third configuration, when the non-circular substrate w is square, in order to save the amount of power used by the power module 103, the block electrodes 1021 are first grouped according to the number of peripheral electrode areas, such as Figure 6B In the embodiment, there are two peripheral electrode areas, which are divided into a first peripheral electrode area group and a second peripheral electrode area group. The minimum number of power supplies set in each group can be set according to the maximum number of block electrodes 1021 that can be covered by any corner of the substrate w in each peripheral electrode area 102. Figure 8 The diagram shows the minimum number of power sources that can be set in the first peripheral electrode region 121 and the second peripheral electrode region 122 respectively under different commonly used equal division methods of the peripheral electrode region 102 . Figures 7A-7E Schematic diagrams of the number of block electrodes covered on the peripheral electrode area of ​​the square substrate in eight, twelve, sixteen, twenty, and twenty-four equal parts. Figure 7B For example, each peripheral electrode area is divided into twelve equal parts to obtain 12 block electrodes in the first peripheral electrode area 121 and 12 block electrodes in the second peripheral electrode area 122. The maximum number of block electrodes covered by any corner of the substrate w in the first peripheral electrode area 121 is 2, and the maximum number of block electrodes covered in the second peripheral electrode area 122 is 3. Therefore, the power module 103 of the twelve-divided peripheral electrode area can use at least 5 power supplies, 2 for the first peripheral electrode area 121, 3 for the second peripheral electrode area 122, and Figure 8 There are the same number of tables shown.

[0059] The electroplating device for non-circular substrates of the present invention can also be set to control the current flow rate in a non-real-time manner, but to adjust the current once every time the substrate rotates a certain angle α. Set the interval angle α, and calculate the area covered by each block electrode when the substrate w rotates α, 2α...nα...90° within the range of 0°-90°. Calculate the current required for each block electrode based on the area covered by each block electrode and record it in Fig. 9 In this embodiment, the control module 104 includes an angle sensor 141 and a controller. Fig. 9The data in is preset in the controller, and the controller is configured so that every time the substrate w rotates an interval angle α, the power module adjusts the corresponding power current of each block electrode. During the process, the angle sensor 141 monitors the rotation angle of the substrate w in real time. When the substrate w rotates 0, α, 2α...nα...90°, the angle sensor 141 feeds back to the controller, and the controller transmits the signal to the power module according to the preset current size, and controls the power module to adjust the current to the corresponding value. When the substrate w rotates to 90°, the angle is reset, and the rotation angle of the substrate w is calculated cyclically and the corresponding current is adjusted.

[0060] The present invention also discloses a method for electroplating a non-circular substrate, which can also be understood as the working process of the electroplating device for the non-circular substrate. Fig.10 Flow chart of a method for electroplating a non-circular substrate according to an embodiment of the present invention, the method for electroplating a non-circular substrate comprises the following steps:

[0061] S1: Divide the electrode area.

[0062] The electrode area is divided into a central electrode area and a peripheral electrode area. The central electrode area is circular, and the size of the central electrode area is the inscribed circle of the non-circular substrate. The central electrode is arranged in the central electrode area, and the central electrode fills the central electrode area. The peripheral electrode area surrounds the central electrode area, and the outer circumference size of the peripheral electrode area is the circumscribed circle of the non-circular substrate. The peripheral electrode area is annular and consists of a plurality of block electrodes equally divided by annular shapes.

[0063] S2: Track the rotational position of the substrate.

[0064] S3: Calculate the current required for the block electrode according to the effective area of ​​the block electrode covered by the substrate.

[0065] Since the current I supplied to the central electrode remains constant, the area S' of each block electrode covered by the substrate is calculated according to the rotation position of the substrate, and the current I' required for each block electrode is further obtained. Where S' is the area of ​​the block electrode currently covered by the substrate, S is the total area of ​​the block electrode, and I is the current supplied to the central electrode.

[0066] S4: adjusting the current supplied by the power supply to the bulk electrode according to the calculated current required by the bulk electrode.

[0067] In this method, the current required by each block electrode can be calculated in real time and the current can be adjusted in real time. An angle interval can also be preset, and S2 will perform S3 and S4 every time the substrate rotates an angle interval.

[0068] The present invention also discloses a method for electroplating a non-circular substrate, comprising:

[0069] S1: Divide the electrode area;

[0070] S2: the current parameters required for each block electrode corresponding to each rotation angle interval of the preset substrate;

[0071] S3: Tracking the rotation position of the substrate;

[0072] S4: When the substrate rotates by an angle interval, the current is adjusted according to the preset power supply parameters and supplied to the corresponding block electrode.

[0073] It should be noted that the above-mentioned multiple embodiments can be combined with each other to form a new solution under the condition that the technical solution logic is accurate, that is, certain features, structures or characteristics in one or more embodiments of the present application can be appropriately combined. The new solution will not be described in detail here.

[0074] The present invention has specifically and fully disclosed the relevant technology through the above-mentioned implementation mode and related drawings, so that those skilled in the art can implement it accordingly. The above-mentioned embodiments are only used to illustrate the present invention, not to limit the present invention. The scope of rights of the present invention should be defined by the claims of the present invention. As for the change of the number of elements described in this article or the replacement of equivalent elements, etc., they should still fall within the scope of rights of the present invention.

[0075] At the same time, the present invention uses specific words to describe the embodiments of the present invention. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present invention. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different places in this specification does not necessarily refer to the same embodiment.

[0076] Similarly, it should be noted that in order to simplify the description of the present invention and thus facilitate the understanding of one or more embodiments of the invention, in the above description of the embodiments of the invention, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the subject matter of the invention requires more features than those mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

Claims

1. An electroplating device for a non-circular substrate, It is characterized in that include: A central electrode region is circular and has a size equal to an inscribed circle of the non-circular substrate, wherein a central electrode is arranged in the central electrode region and the central electrode fills the central electrode region; A peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is the circumscribed circle of the non-circular substrate, and peripheral electrodes are arranged in the peripheral electrode area, and the peripheral electrodes are multiple block electrodes filling the peripheral electrode area; A power module, comprising a plurality of power supplies, for supplying power to the central electrode and the peripheral electrodes; The control module is used to detect the rotation position of the substrate, calculate the current required by each block electrode and notify the power module to adjust the current.

2. The electroplating device for a non-circular substrate according to claim 1, It is characterized in that The current required by the block electrode is Wherein, S' is the area of ​​the block electrode covered by the substrate, S is the area of ​​the block electrode, and I is the current supplied by the power module to the central electrode area.

3. The electroplating device for a non-circular substrate according to claim 2, It is characterized in that There are multiple peripheral electrode areas, and the multiple peripheral electrode areas are concentric rings.

4. The electroplating device for a non-circular substrate according to claim 3, It is characterized in that The block electrode is obtained by dividing the peripheral electrode into N equal parts, where N is a multiple of 4.

5. The electroplating device for a non-circular substrate according to claim 2, It is characterized in that The control module includes an angle sensor and a projection simulator. The angle sensor is used to track the rotation angle of the substrate. The projection simulator simulates the current position of each vertex of the substrate according to the rotation angle of the substrate to determine the projection area of ​​the substrate in the peripheral electrode area, and further calculates the area of ​​each block electrode covered by the substrate.

6. The electroplating device for a non-circular substrate according to claim 2, It is characterized in that The control module includes an angle sensor and a controller. The angle sensor is used to track the rotation of the substrate to identify the angle of rotation of the substrate. The controller presets the current size that needs to be adjusted for each corresponding block electrode according to the angle interval of substrate rotation. When the angle sensor recognizes that the substrate rotates at each angle interval, the controller feeds back to the power supply module according to the preset current size to adjust the corresponding current.

7. The electroplating device for a non-circular substrate according to claim 4, It is characterized in that Each block electrode is powered by a corresponding one of the plurality of power supplies.

8. The electroplating device for a non-circular substrate according to claim 4, It is characterized in that The non-circular substrate is square.

9. The electroplating device for a non-circular substrate according to claim 8, It is characterized in that Every two centrally symmetrical block electrodes form a group, so as to obtain a plurality of electrode groups, and each electrode group is powered by a power supply.

10. The electroplating device for a non-circular substrate according to claim 4, It is characterized in that The non-circular substrate is square.

11. The electroplating device for a non-circular substrate according to claim 10, It is characterized in that The number of power supplies provided in each peripheral electrode region is the maximum number of block electrodes that can be covered by any corner of the substrate in each peripheral electrode region.

12. A method for electroplating a non-circular substrate, It is characterized in that include: Dividing the electrode area, including dividing the electrode area into a central electrode area and a peripheral electrode area, the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, the central electrode fills the central electrode area, and the peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, the peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area; Tracking the rotational position of the substrate; Calculate the required current of each block electrode according to the effective area of ​​each block electrode covered by the substrate; The current required by each block electrode is adjusted and supplied to the corresponding block electrode.

13. A method for electroplating a non-circular substrate, It is characterized in that include: Dividing the electrode area, including dividing the electrode area into a central electrode area and a peripheral electrode area, the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, the central electrode fills the central electrode area, and the peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, the peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area; The current parameters required for each block electrode corresponding to each rotation angle interval of the preset substrate; Tracking the rotational position of the substrate; When the substrate rotates at each angular interval, the current is adjusted according to the preset power supply parameters and supplied to the corresponding block electrodes.

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