Surface-mounted device test fixture and test device

Abstract

The invention provides a surface-mounted device test fixture and a test device.The surface-mounted device test fixture comprises a heat dissipation base and at least one interconnection assembly, the heat dissipation base is used for bearing a to-be-tested device, the interconnection assembly is movably arranged on the heat dissipation base and can move in the direction close to the to-be-tested device, the number of the interconnection assembly is at least one, and the number of the interconnection assembly is at least one. The interconnect assembly includes at least two jaws. The pins of the to-be-tested device can be pressed and clamped through the interconnection assembly, so that the purpose of leading out the electrodes of the to-be-tested device is achieved, the reliability of interconnection between the surface-mounted device test fixture and the to-be-tested device is improved, and therefore the accuracy of a test result is improved; meanwhile, the to-be-tested device is arranged on the heat dissipation base, heat transferred by the to-be-tested device is absorbed through the heat dissipation base, and the heat dissipation effect is improved; and meanwhile, the interconnection assembly is movably arranged on the heat dissipation base, so that the operability of the surface-mounted device test fixture is improved, the surface-mounted device test fixture has relatively high compatibility, and the use experience of a user is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor device testing, and in particular relates to a surface-mount device testing fixture and a test device. Background Art

[0002] Semiconductor devices are one of the key core components in the power electronics industry. Device reliability testing is a vital part of device research and development and production. For example, thermal resistance testing and power cycle testing are both test items that characterize the reliability of semiconductor devices. They are very important in device screening, identification, and reliability evaluation.

[0003] At present, when surface-mount devices with no pins or short pins are subjected to reliability tests, external wires are generally required to lead out the device's own electrodes. The traditional method is to directly weld wires on the device. Due to the problems of insufficient spacing between multiple pins of the device and difficulty in bonding the wires to the device pins, manual welding is difficult. Even if the wires are successfully welded on the device pins, it is difficult to ensure that the device can meet the test requirements. For example, tests such as thermal resistance / power require that the bottom surface of the device is flat and has no protrusions after welding. At the same time, welding wires on the device will also face problems such as difficulty in disassembly. In severe cases, it may even cause damage to the device, resulting in low repeatability and efficiency of device testing. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present application is to provide a surface-mount device test fixture and a test device, which can efficiently and stably perform reliability tests on surface-mount devices.

[0005] In order to solve the above problems, the present application provides a surface mount device test fixture, comprising:

[0006] A heat dissipation base, the heat dissipation base is used to support the device under test;

[0007] An interconnection component, wherein the interconnection component is movably disposed on the heat dissipation base, and the interconnection component can move toward a direction close to the device under test;

[0008] Wherein, at least one interconnection component is provided, and the interconnection component comprises at least two clamping jaws.

[0009] Optionally, a clamping groove is formed at one end of the clamping jaw close to the device under test, and the two clamping grooves on two adjacent clamping jaws are connected to form a clamping portion, which is used to clamp the pins of the device under test.

[0010] Optionally, the surface-mount device test fixture also includes a positioning component, which is arranged on the heat dissipation base and connected to the interconnection component, and the positioning component is used to drive the interconnection component to move on the heat dissipation base along the width direction of the heat dissipation base and fix it at a preset position.

[0011] Optionally, the positioning component includes:

[0012] Two supporting plates are arranged opposite to each other along the length direction of the heat dissipation base, and the tops of the two supporting plates are provided with positioning grooves, and the positioning grooves extend along the width direction of the heat dissipation base;

[0013] A positioning rod, the end of which is slidably disposed in the positioning groove;

[0014] Wherein, the positioning groove has a plurality of predetermined positions, and the plurality of predetermined positions are connected to each other.

[0015] Optionally, the interconnection component further includes:

[0016] A clamp body connected to at least two of the clamping jaws;

[0017] A connecting piece, wherein the first end of the connecting piece is slidably connected to the positioning rod, and the second end is connected to the clamp body, and the connecting piece is used to drive the clamp body to move on the heat dissipation base along the length direction of the heat dissipation base.

[0018] Optionally, the interconnection assembly further comprises an adjusting rod, wherein the adjusting rod is disposed between the clamp body and the connecting member, wherein a first end of the adjusting rod is rotatably connected to the connecting member, and a second end of the adjusting rod is threadedly connected to the clamp body.

[0019] Optionally, the interconnection component further includes:

[0020] A fixed claw, the fixed claw is connected to the clamp body, the fixed claw is arranged on a side of the clamp body away from the clamp, a first through hole is formed at one end of the fixed claw close to the device under test, and the first through hole penetrates the fixed claw in a direction perpendicular to the device under test;

[0021] A first adjusting knob is connected to an end of the fixing claw close to the device under test, and an output end of the first adjusting knob is arranged in the first through hole and can move along the axial direction of the first through hole to press the device under test.

[0022] Optionally, the distance between at least two of the clamping jaws is adjustable.

[0023] Optionally, the at least two clamping jaws include a first clamping jaw and a second clamping jaw, the first clamping jaw is fixedly connected to the clamping body, and the second clamping jaw is slidably connected to the clamping body;

[0024] The interconnection component also includes a second adjusting knob, which is arranged on a side of the second clamping jaw away from the first clamping jaw, and the second adjusting knob is connected to an end of the clamping body away from the first clamping jaw. A second through hole is provided at an end of the clamping body away from the first clamping jaw, and the second through hole penetrates the clamping body in a direction parallel to the device under test. The output end of the second adjusting knob is arranged in the second through hole and can move along the axial direction of the second through hole to drive the second clamping jaw to move in a direction close to the first clamping jaw.

[0025] Optionally, the interconnection assembly further includes an elastic member, which is disposed between the first clamping jaw and the second clamping jaw, one end of the elastic member is connected to the first clamping jaw, and the other end of the elastic member is connected to the second clamping jaw.

[0026] Optionally, when the second clamping jaw moves toward a direction close to the first clamping jaw, the elastic member accumulates elastic potential energy under the drive of the second adjusting knob;

[0027] When the second clamping jaw moves in a direction away from the first clamping jaw, the elastic potential energy accumulated in the elastic member is released.

[0028] Optionally, the surface-mount device test fixture further includes a heat-conducting layer, and the heat-conducting layer is arranged between the device under test and the heat dissipation base.

[0029] Optionally, the surface-mount device test fixture further includes a wiring port, which is disposed on the interconnection component and is used for connecting a wire.

[0030] Another aspect of the present application provides a test device, comprising any one of the surface-mount device test fixtures described above.

[0031] Beneficial Effects

[0032] The embodiments of the present invention provide a surface-mount device test fixture and a test apparatus, wherein the surface-mount device test fixture can clamp the pins of a device under test by setting an interconnection component to achieve the purpose of leading out the electrodes of the device under test, thereby improving the reliability of the interconnection between the surface-mount device test fixture and the device under test, thereby improving the accuracy of the test result; at the same time, the device under test is set on a heat dissipation base, and the heat dissipation base absorbs the heat transferred by the device under test, so that the device under test is in a good heat dissipation environment, thereby avoiding over-temperature failure of the device under test during the test process, and improving the heat dissipation effect; at the same time, the interconnection component is movably arranged on the heat dissipation base, which improves the operability of the surface-mount device test fixture, and can complete interconnection with devices under test of different packaging categories in different test scenarios, so that the surface-mount device test fixture has higher compatibility, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a three-dimensional structural schematic diagram of a surface-mount device test fixture of an optional embodiment of the present disclosure;

[0034] Figure 2 It is a three-dimensional structural schematic diagram of a surface-mount device test fixture of another optional embodiment of the present disclosure;

[0035] Figure 3 This is a schematic diagram of the three-dimensional structure of a surface-mount device test fixture according to another optional embodiment of the present disclosure;

[0036] Figure 4 This is a schematic diagram of the three-dimensional structure of a surface-mount device test fixture according to another optional embodiment of the present disclosure;

[0037] Figure 5 for Figure 4 a side view of the illustrated embodiment;

[0038] Figure 6 It is a schematic diagram of the three-dimensional structure of an interconnection component of an optional embodiment of the present disclosure;

[0039] Figure 7 for Figure 6 Front view of the illustrated embodiment.

[0040] The reference numerals are as follows:

[0041] 1. Heat dissipation base; 2. Device under test; 3. Support plate; 4. Positioning groove; 5. Positioning rod; 6. Press clamp body; 7. Connector; 8. Adjustment rod; 9. Fixed claw; 10. First adjustment knob; 11. Second adjustment knob; 12. First clamping jaw; 13. Second clamping jaw; 14. Elastic member; 15. Heat conducting layer; 16. Wiring port. DETAILED DESCRIPTION

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0046] At present, the interconnection methods for surface-mount device testing in the relevant technology can be divided into two categories, one is the printed circuit board wiring type, and the other is the probe contact type.

[0047] Among them, the printed circuit board wiring type completes the interconnection with the contacts / pins of the device under test 2 by wiring on the printed circuit board. The printed circuit board wiring method solves the basic condition of electrical interconnection of the device under test 2, but the printed circuit board wiring method provides a poor heat dissipation environment for the device under test 2 under both thermal resistance test and power cycle test. Poor control of electrical parameters during testing can easily cause over-temperature failure of the device under test 2. At the same time, the thermal expansion coefficients of the wiring layer and the upper and lower layers of materials are quite different. Thermal mismatch is very likely to occur during power cycle testing, resulting in invalid test. Moreover, the wiring layer has a strong targeting of the device under test 2, and the adaptability of the device under test 2 is poor.

[0048] Among them, the probe contact type completes the interconnection and lead-out of the contacts / pins of the device under test 2 by punching holes / embedded electrode structures on the bottom surface. The probe contact method solves the basic conditions for the electrical interconnection of the device under test 2 and the bottom surface heat dissipation path of the test, but the punching / embedded probe method requires higher crimping and fixing conditions, and the point contact mode is prone to poor contact and low reliability. At the same time, the punching / embedded probe method has a strong targeting of the device under test 2. If not many holes are punched, only one device under test 2 can be tested. Punching too many holes is prone to heat dissipation problems, resulting in test distortion. Moreover, the punching method itself is prone to cause changes in the heat dissipation environment of the device under test 2, resulting in uneven temperature distribution on the heat dissipation surface, which is not conducive to testing.

[0049] The invention aims to provide a surface-mount device test fixture and a test device with good heat dissipation effect, strong interconnection reliability and high compatibility.

[0050] See also Figures 1 to 4 As shown, according to one aspect of an embodiment of the present application, a surface-mount device test fixture is provided, comprising: a heat sink base 1, the heat sink base 1 is used to support a device under test 2; an interconnection component, the interconnection component is movably arranged on the heat sink base 1, and the interconnection component can move in a direction close to the device under test 2; wherein, at least one interconnection component is provided, and the interconnection component includes at least two clamping claws.

[0051] The surface-mount device test fixture provided in the embodiment of the present invention can clamp the pins of the device under test 2 by setting an interconnection component to achieve the purpose of leading out the electrodes of the device under test 2, thereby improving the reliability of the interconnection between the surface-mount device test fixture and the device under test 2, thereby improving the accuracy of the test result; at the same time, the device under test 2 is arranged on the heat dissipation base 1, and the heat dissipation base 1 absorbs the heat transferred by the device under test 2, so that the device under test 2 is in a good heat dissipation environment, thereby avoiding over-temperature failure of the device under test 2 during the test process, and improving the heat dissipation effect; at the same time, the interconnection component is movably arranged on the heat dissipation base 1, which improves the operability of the surface-mount device test fixture, and can complete interconnection with the devices under test 2 of different packaging categories in different test scenarios, so that the surface-mount device test fixture has higher compatibility, thereby improving the user experience.

[0052] The device under test 2 may be a semiconductor device. In the embodiment of the present application, the device under test 2 is a surface-mount semiconductor device.

[0053] The device under test 2 is arranged on the heat dissipation base 1, and the heat dissipation base 1 can be a rectangular metal plate or a heat sink, etc., which can absorb the heat transferred by the device under test 2, and this application does not make further restrictions. By setting a heat dissipation substrate, the device under test 2 can be prevented from overheating and failing during the test, so that the device under test 2 is in a good heat dissipation environment, thereby improving the heat dissipation effect.

[0054] Specifically, in some possible implementations provided in this disclosure, see Figures 1 to 4 As shown, the surface-mount device test fixture further includes a heat-conducting layer 15 , and the heat-conducting layer 15 is arranged between the device under test 2 and the heat dissipation base 1 .

[0055] The heat conducting layer 15 may be an insulating thin layer medium with high thermal conductivity to prevent the DUT 2 from directly contacting the heat dissipation base 1 and causing a short circuit in the DUT 2 , thereby ensuring that the reliability test of the DUT 2 can be carried out normally.

[0056] The device under test 2 is provided with an interconnection component on the side facing away from the heat dissipation substrate, and the interconnection component is movably connected to the heat dissipation substrate. As an embodiment, the interconnection component is connected to the heat dissipation substrate via a ball screw structure; as another embodiment, the interconnection component is connected to the heat dissipation substrate via a slide rail structure.

[0057] Specifically, the interconnection component includes a clamping claw, and the interconnection component contacts the device under test 2 through the clamping claw to lead out the electrode of the device under test 2.

[0058] There are at least two clamps, and in the embodiment of the present application, two clamps are provided, and the two clamps are located in the same plane. As an embodiment, the device under test 2 has no pins, and the two clamps can respectively abut against the two contacts; as another embodiment, the device under test 2 has pins, and the two clamps fit together to clamp the pins of the device under test 2.

[0059] Specifically, the interconnection component can perform three-dimensional vector movement to interconnect the clamping jaws with the device under test 2. As an implementation mode, the device under test 2 has no pins, and the interconnection component moves on the heat dissipation substrate toward the direction close to the device under test 2 until the clamping jaws abut against the contacts of the device under test 2, so as to achieve the purpose of leading out the electrodes of the device under test 2; as another implementation mode, the device under test 2 has pins, and the interconnection component moves on the heat dissipation substrate toward the direction close to the device under test 2 until the clamping jaws press the pins of the device under test 2, so as to achieve the purpose of leading out the electrodes of the device under test 2.

[0060] Among them, at least one interconnection component is provided, and one, two or three interconnection components may be provided, etc., and this application does not make further limitations. It can be understood that the number of interconnection components provided can be determined according to actual conditions.

[0061] For details, see Figure 1 As shown, the three side walls of the device under test 2 are provided with pins. In this case, three interconnection components are provided, and the three interconnection components are provided in a one-to-one correspondence with the three pins to complete the electrode lead-out work of the device under test 2; see Figure 2As shown, two adjacent side walls of the device under test 2 have pins, and two interconnection components are also provided. The two interconnection components are provided in a one-to-one correspondence with the two pins to complete the electrode lead-out work of the device under test 2; see Figure 3 As shown, two side walls of the device under test 2 that are arranged opposite to each other have pins. In this case, two interconnection components are provided, and the two interconnection components are provided in a one-to-one correspondence with the two pins to complete the electrode lead-out work of the device under test 2; see Figure 4 As shown, the device under test 2 has only one pin, and in this case, one interconnection component is provided to complete the lead-out work of the device under test 2. It can be understood that when the device under test 2 has multiple pins on the same side wall, multiple clamps can be provided, and the number of clamps can be the same as the number of pins, or the number of clamps can be twice the number of pins.

[0062] Among them, in some possible implementation embodiments provided in this disclosure, see Figures 1 to 7 As shown, the surface-mount device test fixture also includes a wiring port 16, which is arranged on the interconnection component. The wiring port 16 is used to connect wires so that the device under test 2 can be electrically connected to an external device, thereby realizing reliability testing of the device under test 2.

[0063] Specifically, the connection port 16 may be a metal column, and the connection port 16 may be disposed at any position of the interconnection component to facilitate the connection of the wire, and the present application does not make any further limitation.

[0064] In some possible implementations provided in this disclosure, see Figure 6 As shown, a clamping groove is provided at one end of the clamping jaw close to the device under test 2 , and the two clamping grooves on two adjacent clamping jaws are connected to form a clamping portion, which is used to clamp the pins of the device under test 2 .

[0065] By providing a card slot at one end of the clamping jaw close to the device under test 2 and connecting the card slots on two adjacent clamping jaws, the pins of the device under test 2 can be effectively pressed and buckled, thereby improving the reliability of the interconnection between the surface-mount device test fixture and the device under test 2; at the same time, by interconnecting the two clamping jaws with the pins of the device under test 2 at the same time, the current resistance capacity of the interconnected components can be improved, thereby improving the working stability of the surface-mount device test fixture, and further improving the accuracy of the test results.

[0066] The end of the clamping jaw close to the device under test 2 is a clamping head, and the clamping head is used to clamp the pins of the device under test 2.

[0067] Wherein, a clamping groove is provided on the clamping head, and the clamping groove can be a rectangular groove.

[0068] Specifically, the clamping grooves on two adjacent clamps are arranged opposite to each other to form a clamping portion, which is used to clamp the pins of the device under test 2. The clamping portion formed between two adjacent clamping claws can effectively hold the pins of the device under test 2, thereby improving the reliability of the interconnection between the surface-mount device test fixture and the device under test 2.

[0069] In some possible embodiments provided in the present disclosure, the surface-mount device test fixture also includes a positioning component, which is arranged on the heat dissipation base 1 and connected to the interconnection component, and the positioning component is used to drive the interconnection component to move on the heat dissipation base 1 along the width direction of the heat dissipation base 1 and fix it at a preset position.

[0070] By setting a positioning component, the interconnection component can be driven to move along the X-axis direction on the heat dissipation base 1, so that the clamp on the clamping claw can move above the pin of the device under test 2, making it easier for the clamp to align with the pin of the device under test 2, thereby improving the operability of the interconnection component.

[0071] The width direction of the heat dissipation base 1 may be the X-axis direction of the heat dissipation base 1 .

[0072] The X-axis coordinate of the preset position is the same as the X-axis coordinate of the pin 2 of the device under test.

[0073] In some possible implementations provided in this disclosure, see Figures 1 to 5 As shown, the positioning assembly includes: two support plates 3 arranged opposite to each other along the length direction of the heat dissipation base 1, and the tops of the two support plates 3 are each provided with a positioning groove 4, and the positioning groove 4 extends along the width direction of the heat dissipation base 1; a positioning rod 5, and the end of the positioning rod 5 is slidably arranged in the positioning groove 4; wherein the positioning groove 4 has a plurality of predetermined positions, and the plurality of predetermined positions are connected to each other.

[0074] The support plate 3 may be a rectangular metal plate, etc., and this application does not make any further limitation.

[0075] The support plate 3 is connected to the heat dissipation base 1 , and the support plate 3 is arranged on a side of the heat dissipation base 1 close to the device under test 2 .

[0076] Specifically, in the embodiment of the present application, two support plates 3 are provided, and the two support plates 3 are arranged opposite to each other along the length direction of the heat dissipation base 1 and are perpendicular to the heat dissipation base 1 .

[0077] Among them, the positioning rod 5 is slidably set between the two support plates 3, and the interconnection component is connected to the positioning rod 5. The positioning rod 5 can move between the two support plates 3 along the length direction of the support plates 3 to drive the interconnection component to move along the width direction of the heat dissipation base 1, that is, the X-axis direction of the heat dissipation base 1.

[0078] Specifically, the tops of the two support plates 3 are each provided with a positioning groove 4, which extends along the length direction of the support plates 3, that is, the width direction of the heat dissipation base 1. Both ends of the positioning rod 5 can be slidably disposed in the positioning grooves 4 of the two support plates 3, respectively, so that the positioning rod 5 can move along the extension direction of the positioning groove 4, that is, the X-axis direction of the heat dissipation base 1.

[0079] Among them, the end of the positioning rod 5 can be cylindrical, the positioning groove 4 is roughly a continuous figure-eight shape, and there are several predetermined positions in the positioning groove 4, and the predetermined position is roughly an arc that matches the end of the positioning rod 5, so that the end of the positioning rod 5 can continuously move back and forth between several predetermined positions to adjust the position of the interconnection component in the X-axis direction of the heat dissipation base 1; at the same time, when the end of the positioning rod 5 moves to any predetermined position, the circular predetermined position can limit the end of the positioning rod 5, that is, limit the interconnection component, so that the interconnection component is fixed in the preset position, thereby improving the working stability of the surface-mounted device test fixture.

[0080] In some possible implementations provided in this disclosure, see Figure 6 As shown, the interconnection assembly also includes: a clamp body 6, which is connected to at least two clamping jaws; a connecting member 7, a first end of which is slidably connected to the positioning rod 5, and a second end of which is connected to the clamp body 6, and the connecting member 7 is used to drive the clamp body 6 to move on the heat dissipation base 1 along the length direction of the heat dissipation base 1.

[0081] By providing a connecting member 7 and making the first end of the connecting member 7 slidably connected to the positioning rod 5 and the second end connected to the clamp body 6, the connecting member 7 can drive the clamp body 6 to move along the length direction of the positioning rod 5, so as to adjust the position of the clamp body 6 on the Y-axis of the heat dissipation base 1, facilitate the alignment of the chuck with the pins of the device under test 2, and improve the operability of the interconnection component.

[0082] The Y-axis direction of the heat dissipation base 1 may be the length direction of the heat dissipation base 1 , that is, the length direction of the positioning rod 5 .

[0083] The clamp body 6 may be a main body of the interconnection assembly, and the clamp body 6 is used to connect other components such as the clamping jaws.

[0084] Specifically, the clamp body 6 is slidably connected to the positioning rod 5 via a connecting piece 7, and the connecting piece 7 can slide on the positioning rod 5 along the length direction of the positioning rod 5 to drive the clamp body 6 to move on the heat dissipation base 1 along the length direction of the heat dissipation base 1, that is, the Y-axis direction of the heat dissipation base 1, so as to achieve the purpose of adjusting the position of the clamp body 6 on the Y-axis of the heat dissipation base 1.

[0085] The connecting member 7 may be a sliding slider. In the embodiment of the present application, the connecting member 7 is sleeved on the positioning rod 5 and can slide along the length direction of the positioning rod 5.

[0086] In some possible implementations provided in this disclosure, see Figure 7 As shown, the interconnection assembly further includes an adjusting rod 8 , which is disposed between the clamp body 6 and the connecting member 7 , wherein a first end of the adjusting rod 8 is rotatably connected to the connecting member 7 , and a second end of the adjusting rod 8 is threadedly connected to the clamp body 6 .

[0087] By setting an adjusting rod 8 between the clamp body 6 and the connecting piece 7 and rotatably connecting the adjusting rod 8 to the connecting piece 7, the clamp body 6 can be rotated with the central axis of the adjusting rod 8 as the rotation center, which is convenient for the surface-mounted device test fixture to switch the interconnection scenario, so that the clamping claws on the clamp body 6 can be interconnected with the pins of the device under test 2 at different positions, thereby improving the compatibility of the surface-mounted device test fixture; at the same time, the threaded connection between the adjusting rod 8 and the clamp body 6 can control the length of the adjusting rod 8 extending into the clamp body 6, that is, control the distance between the connecting piece 7 and the clamp body 6, thereby adjusting the position of the clamp body 6 in the Z-axis direction of the heat dissipation base 1, so that the clamp head on the clamping claw can move toward the direction close to the pins of the device under test 2, thereby improving the reliability of the interconnection between the device under test 2 and the surface-mounted device test fixture.

[0088] The adjusting rod 8 may be cylindrical, etc. The adjusting rod 8 is disposed between the connecting member 7 and the clamping body 6 , with one end of the adjusting rod 8 connected to the connecting member 7 and the second end connected to the clamping body 6 .

[0089] The adjusting rod 8 is rotatably connected to the connecting member 7 .

[0090] Specifically, as one embodiment, the outer wall of the adjusting rod 8 close to the connecting member 7 has an annular flange, and the end of the connecting member 7 close to the adjusting rod 8 is provided with a groove, the groove is roughly annular, and the annular flange can be slidably arranged in the annular groove so that the adjusting rod 8 can rotate with the central axis of the adjusting rod 8 as the rotation center; as another embodiment, the end of the adjusting rod 8 close to the connecting member 7 is roughly spherical, and the end of the connecting member 7 close to the adjusting rod 8 is provided with a groove, the groove is also spherical, and the spherical end of the adjusting rod 8 can be embedded in the connecting member 7 through the spherical groove, so that the end of the adjusting rod 8 can perform three-dimensional vector tilting in the connecting member 7. In the embodiment of the present application, an annular flange is provided on the outer wall of the adjusting rod 8 near the end of the connecting member 7, and a groove is provided on the end of the connecting member 7 near the adjusting rod 8. The groove is roughly annular, and the annular flange can be slidably arranged in the annular groove, so that the adjusting rod 8 can drive the clamping body 6 to rotate with the central axis of the adjusting rod 8 as the rotation center, so that the clamping claws on the clamping body 6 can be interconnected with the pins on different directions of the device under test 2, thereby improving the compatibility of the surface-mounted device test fixture.

[0091] Among them, the adjusting rod 8 is threadedly connected to the clamp body 6, that is, the length of the adjusting rod 8 extending into the clamp body 6 is adjustable. It can be understood that when the length of the adjusting rod 8 extending into the clamp body 6 increases, the distance between the connecting member 7 and the clamp body 6 decreases; when the length of the adjusting rod 8 extending into the clamp body 6 decreases, the distance between the connecting member 7 and the clamp body 6 increases. Since the connecting member 7 is fixed at the Z-axis coordinate of the heat dissipation base 1, so that the clamp body 6 can move along the Z-axis direction of the heat dissipation base 1, it can be achieved that the chuck on the clamping jaw can clamp the pin of the device under test 2 when it moves in the direction close to the pin of the device under test 2, that is, the chuck on the clamping jaw can clamp the pin of the device under test 2 from top to bottom, thereby improving the reliability of the interconnection between the device under test 2 and the surface-mount device test fixture.

[0092] Specifically, the end of the adjusting rod 8 close to the clamping body 6 has an external thread, and the end of the clamping body 6 close to the adjusting rod 8 is provided with a thread groove, and the thread groove has an internal thread matching the external thread at the end of the adjusting rod 8, so that screwing the adjusting rod 8 can drive the clamping body 6 to move toward or away from the device under test 2, thereby adjusting the position of the clamping body 6 on the Z axis of the heat dissipation base 1.

[0093] In some possible implementations provided in this disclosure, see Figure 7As shown, the interconnection component also includes: a fixed claw 9, which is connected to the clamping body 6, and the fixed claw 9 is arranged on the side of the clamping body 6 away from the clamping claw. A first through hole is opened at one end of the fixed claw 9 close to the device under test 2, and the first through hole passes through the fixed claw 9 in a direction perpendicular to the device under test 2; a first adjusting knob 10, which is connected to one end of the fixed claw 9 close to the device under test 2, and the output end of the first adjusting knob 10 is arranged in the first through hole and can move along the axial direction of the first through hole to press the device under test 2.

[0094] The fixed claw 9 and the first adjusting knob 10 can be provided to press the device under test 2, thereby preventing the device under test 2 from drifting during the test process, improving the reliability of the interconnection between the clamp body 6 and the pins of the device under test 2, and further improving the accuracy of the test results.

[0095] The end of the fixing claw 9 close to the device under test 2 is a horizontal section, and the horizontal section is parallel to the device under test 2. The first adjustment knob 10 is connected to the horizontal section, and the first adjustment knob 10 is arranged on the side of the horizontal section away from the device under test 2.

[0096] Specifically, a first through hole is provided on the horizontal section, and the first through hole extends in a direction perpendicular to the device under test 2 to penetrate the horizontal section. The output end of the first adjusting knob 10 is disposed in the first through hole and can move along the extending direction of the first through hole, so that the output end of the first adjusting knob 10 can press the device under test 2 when it moves toward the direction close to the device under test 2, thereby preventing the device under test 2 from drifting during the test process.

[0097] The first adjusting knob 10 includes a sleeve and a threaded rod, wherein the sleeve is arranged on the side of the horizontal section away from the device under test 2, the sleeve is fixedly connected to the horizontal section, the threaded rod is arranged in the sleeve, and the sleeve is threadedly connected to the threaded rod. The end of the threaded rod close to the device under test 2 is the output end of the first adjusting knob 10, and it can be understood that the knob threaded rod can move relative to the sleeve in the direction of the horizontal section toward the device under test 2, so that the end of the threaded rod close to the device under test 2 can press the device under test 2, that is, the output end of the first adjusting knob 10 can press the device under test 2.

[0098] In some possible implementations provided in this disclosure, see Figures 1 to 7 As shown, the distance between at least two clamping jaws is adjustable.

[0099] By setting the distance between at least two clamping jaws to be adjustable, the surface-mount device test fixture can clamp pins of different sizes and different spacings, thereby improving the compatibility of the surface-mount device test fixture and thus improving the user experience.

[0100] In some possible implementations provided in this disclosure, see Figure 6 and Figure 7 As shown, at least two jaws include a first jaw 12 and a second jaw 13, the first jaw 12 is fixedly connected to the clamp body 6, and the second jaw 13 is slidably connected to the clamp body 6; the interconnection component also includes a second adjusting knob 11, the second adjusting knob 11 is arranged on the side of the second jaw 13 away from the first jaw 12, the second adjusting knob 11 is connected to the end of the clamp body 6 away from the first jaw 12, a second through hole is provided at the end of the clamp body 6 away from the first jaw 12, the second through hole passes through the clamp body 6 along a direction parallel to the device under test 2, the output end of the second adjusting knob 11 is arranged in the second through hole and can move along the axial direction of the second through hole to drive the second jaw 13 to move in the direction close to the first jaw 12.

[0101] In the embodiment of the present application, two clamping jaws are provided, and the two clamping jaws include a first clamping jaw 12 and a second clamping jaw 13 .

[0102] Specifically, the clamp body 6 is roughly door-shaped, the first clamp jaw 12 is fixedly connected to one end of the clamp body 6, and the second clamp jaw 13 is slidably arranged in the door-shaped clamp body 6 so that the distance between the first clamp jaw 12 and the second clamp jaw 13 is adjustable.

[0103] The interconnection assembly further includes a second adjusting knob 11 , which is disposed on a side of the second clamping jaw 13 away from the first clamping jaw 12 , and is used to drive the second clamping jaw 13 to move toward the first clamping jaw 12 .

[0104] Specifically, a second through hole is provided at one end of the clamp body 6 away from the first clamping jaw 12, and the second through hole extends in a direction parallel to the device under test 2. The output end of the second adjusting knob 11 is arranged in the second through hole and can move along the extension direction of the second through hole. When the output end of the second adjusting knob 11 moves toward the direction close to the first clamping jaw 12, it can drive the second clamping jaw 13 abutting against the output end of the second adjusting knob 11 to move synchronously, so that the distance between the first clamping jaw 12 and the second clamping jaw 13 is reduced. The working principle of the second adjusting knob 11 is the same as that of the first adjusting knob 10, which will not be repeated here.

[0105] In some possible implementations provided in this disclosure, see Figure 7 As shown, the interconnection assembly further includes an elastic member 14 , which is disposed between the first clamping jaw 12 and the second clamping jaw 13 , with one end of the elastic member 14 connected to the first clamping jaw 12 , and the other end connected to the second clamping jaw 13 .

[0106] By disposing an elastic member 14 between the first clamping jaw 12 and the second clamping jaw 13, the second clamping jaw 13 can be driven to move in a direction away from the first clamping jaw 12, so that the distance between the first clamping jaw 12 and the second clamping jaw 13 is increased, and the purpose of resetting the second clamping jaw 13 can be achieved.

[0107] Among them, the elastic member 14 can be a tension spring, a torsion spring, an elastic sheet, etc., and this application does not make further limitations.

[0108] The elastic member 14 is disposed between the first clamping jaw 12 and the second clamping jaw 13 , and two ends of the elastic member 14 are connected to the first clamping jaw 12 and the second clamping jaw 13 respectively.

[0109] For details, see Figure 7 As shown, when the output end of the second adjusting knob 11 moves toward the direction close to the first clamping jaw 12, it can drive the second clamping jaw 13 to move toward the direction close to the first clamping jaw 12. At this time, the distance between the first clamping jaw 12 and the second clamping jaw 13 is shortened, and the length of the elastic member 14 is shortened. The elastic member 14 accumulates elastic potential energy under the drive of the second adjusting knob 11; when the output end of the second adjusting knob 11 moves toward the direction away from the first clamping jaw 12, the elastic potential energy accumulated by the elastic member 14 is released. At this time, the elastic member 14 can drive the second clamping jaw 13 to move in the direction away from the first clamping jaw 12, so that the distance between the first clamping jaw 12 and the second clamping jaw 13 is increased, and the purpose of resetting the second clamping jaw 13 can be achieved.

[0110] Another aspect of an embodiment of the present application provides a test device, comprising any one of the surface-mount device test fixtures described above.

[0111] The embodiment of the present invention provides a surface-mount device test fixture and a test device, wherein the surface-mount device test fixture can clamp the pins of a device under test 2 by setting an interconnection component to achieve the purpose of leading out the electrodes of the device under test 2, thereby improving the reliability of the interconnection between the surface-mount device test fixture and the device under test 2, thereby improving the accuracy of the test result; at the same time, the device under test 2 is set on a heat dissipation base 1, and the heat dissipation base 1 absorbs the heat transferred by the device under test 2, so that the device under test 2 is in a good heat dissipation environment, thereby avoiding over-temperature failure of the device under test 2 during the test process, and improving the heat dissipation effect; at the same time, the interconnection component is movably arranged on the heat dissipation base 1, which improves the operability of the surface-mount device test fixture, and can complete interconnection with the devices under test 2 of different packaging categories in different test scenarios, so that the surface-mount device test fixture has higher compatibility, thereby improving the user experience.

[0112] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.

[0113] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.

Claims

1. A surface mount device test fixture, It is characterized in that include: A heat dissipation base (1), the heat dissipation base (1) being used to support a device under test (2); An interconnection component, the interconnection component being movably disposed on the heat dissipation base (1), and the interconnection component being capable of moving in a direction close to the device under test (2); Wherein, at least one interconnection component is provided, and the interconnection component comprises at least two clamping jaws.

2. The surface mount device test fixture according to claim 1, It is characterized in that A clamping groove is provided at one end of the clamping jaw close to the device under test (2), and the two clamping grooves on two adjacent clamping jaws are connected to form a clamping portion, which is used to clamp the pins of the device under test (2).

3. The surface mount device test fixture according to claim 1, It is characterized in that The surface-mount device test fixture further comprises a positioning component, which is arranged on the heat dissipation base (1) and connected to the interconnection component, and is used to drive the interconnection component to move on the heat dissipation base (1) along the width direction of the heat dissipation base (1) and to be fixed at a preset position.

4. The surface mount device test fixture according to claim 3, It is characterized in that The positioning component comprises: Two support plates (3) are arranged opposite to each other along the length direction of the heat dissipation base (1), and the tops of the two support plates (3) are each provided with a positioning groove (4), and the positioning groove (4) extends along the width direction of the heat dissipation base (1); A positioning rod (5), the end of which is slidably disposed in the positioning groove (4); Wherein, the positioning groove (4) has a plurality of predetermined positions, and the plurality of predetermined positions are connected to each other.

5. The surface mount device test fixture according to claim 4, It is characterized in that The interconnect assembly further comprises: A clamp body (6), the clamp body (6) being connected to at least two of the clamping jaws; A connecting member (7), wherein the first end of the connecting member (7) is slidably connected to the positioning rod (5), and the second end is connected to the clamp body (6), and the connecting member (7) is used to drive the clamp body (6) to move on the heat dissipation base (1) along the length direction of the heat dissipation base (1).

6. The surface mount device test fixture according to claim 5, It is characterized in that The interconnection assembly further comprises an adjusting rod (8), wherein the adjusting rod (8) is arranged between the clamp body (6) and the connecting member (7), wherein a first end of the adjusting rod (8) is rotatably connected to the connecting member (7), and a second end of the adjusting rod (8) is threadedly connected to the clamp body (6).

7. The surface mount device test fixture according to claim 5, It is characterized in that The interconnect assembly further comprises: A fixed claw (9), the fixed claw (9) being connected to the clamp body (6), the fixed claw (9) being arranged on a side of the clamp body (6) away from the clamp, and a first through hole being formed at one end of the fixed claw (9) close to the device under test (2), the first through hole penetrating the fixed claw (9) in a direction perpendicular to the device under test (2); A first adjusting knob (10), the first adjusting knob (10) being connected to an end of the fixing claw (9) close to the device under test (2), the output end of the first adjusting knob (10) being arranged in the first through hole and being movable along the axial direction of the first through hole to press the device under test (2).

8. The surface mount device test fixture according to claim 1, It is characterized in that The distance between at least two of the clamping jaws is adjustable.

9. The surface mount device test fixture according to claim 7, It is characterized in that At least two of the clamping jaws include a first clamping jaw (12) and a second clamping jaw (13), wherein the first clamping jaw (12) is fixedly connected to the clamping body (6), and the second clamping jaw (13) is slidably connected to the clamping body (6); The interconnection assembly further comprises a second adjusting knob (11), the second adjusting knob (11) being arranged on a side of the second clamping jaw (13) away from the first clamping jaw (12), the second adjusting knob (11) being connected to an end of the clamping body (6) away from the first clamping jaw (12), a second through hole being provided at an end of the clamping body (6) away from the first clamping jaw (12), the second through hole penetrating the clamping body (6) in a direction parallel to the device under test (2), an output end of the second adjusting knob (11) being arranged in the second through hole and being movable in an axial direction of the second through hole, so as to drive the second clamping jaw (13) to move in a direction close to the first clamping jaw (12).

10. The surface mount device test fixture according to claim 9, It is characterized in that The interconnection assembly further comprises an elastic member (14), wherein the elastic member (14) is arranged between the first clamping jaw (12) and the second clamping jaw (13), wherein one end of the elastic member (14) is connected to the first clamping jaw (12), and the other end is connected to the second clamping jaw (13).

11. The surface mount device test fixture according to claim 10, It is characterized in that When the second clamping jaw (13) moves in a direction close to the first clamping jaw (12), the elastic member (14) accumulates elastic potential energy under the drive of the second adjusting knob (11); When the second clamping jaw (13) moves in a direction away from the first clamping jaw (12), the elastic potential energy accumulated by the elastic member (14) is released.

12. The surface mount device test fixture according to claim 1, It is characterized in that The surface-mount device test fixture further comprises a heat-conducting layer (15), wherein the heat-conducting layer (15) is arranged between the device to be tested (2) and the heat dissipation base (1).

13. The surface mount device test fixture according to claim 1, It is characterized in that The surface-mount device test fixture further comprises a wiring port (16), wherein the wiring port (16) is arranged on the interconnection component and is used for connecting a wire.

14. A test device, It is characterized in that A surface-mount device test fixture comprising any one of claims 1-13.

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