Optical module

Abstract

The invention provides an optical module, a light emitting component comprises a laser chip array, a first lens array, a second lens array, a semiconductor cooler and a circuit adapter plate, the laser chip array is arranged along the width direction of a circuit board, and the laser chip array, the first lens array and the second lens array are arranged along the length direction of the circuit board. A first electrode column and a second electrode column of the semiconductor cooler and the circuit adapter plate are all located between the first lens array and the second lens array, the circuit adapter plate is connected with the circuit board, the first electrode column and the second electrode column, and the first light receiving component and the light emitting component are arranged in parallel in the width direction of the circuit board. In the application, the first electrode column and the second electrode column of the semiconductor cooler and the first circuit adapter plate are located between the first lens array and the second lens array, and the size of the light emitting component in the width direction of the circuit board is reduced, so that the light emitting component and the first light receiving component are arranged in parallel along the width direction of the circuit board.

Description

[0001] This application claims the priority of application number 202323147129.9 filed with the China Patent Office on November 21, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module. Background Art

[0003] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. In addition, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing. Summary of the invention

[0004] The present disclosure provides an optical module, wherein a light emitting component, a first light receiving component and a second light receiving component are arranged in parallel along a width direction of a circuit board.

[0005] In some embodiments, an optical module is provided, comprising:

[0006] Circuit boards;

[0007] A light emitting component connected to the circuit board;

[0008] A first light receiving component is arranged on the circuit board and is located on one side of the light emitting component; the first light receiving component and the light emitting component are arranged side by side along the width direction of the circuit board;

[0009] Wherein, the light emitting component comprises:

[0010] A laser chip array is arranged along the width direction of the circuit board and is used to emit optical signals;

[0011] A first lens array, located in the light emitting direction of the laser chip array, and used for collimating the optical signal emitted by the laser chip array;

[0012] A second lens array, located in the collimation direction of the first lens array;

[0013] A transmitting optical fiber array is used to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the transmitting optical fiber array are arranged along the length direction of the circuit board;

[0014] A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array; the first semiconductor refrigerator comprises:

[0015] a first electrode column;

[0016] A second electrode column and the first electrode column are both located between the first lens array and the second lens array;

[0017] The first circuit adapter board is located between the first lens array and the second lens array; one end of the first circuit adapter board is respectively connected to the first electrode column and the second electrode column, and the other end of the first circuit adapter board is connected to the circuit board.

[0018] The above technical solution has the following beneficial effects: the light emitting component is used to emit light signals, the light emitting component includes a laser chip array, a first lens array, a second lens array and a transmitting optical fiber array, the laser chip array emits light signals, the first lens array is located in the light emitting direction of the laser chip array to collimate the light signals emitted by the laser chip array, the second lens array is located in the collimation direction of the first lens array to converge the light signals collimated by the first lens array, and the transmitting optical fiber array receives the light signals converged by the second lens array. The surface of the first semiconductor refrigerator carries the laser chip array and the first lens array to keep the temperature of the laser chip array and the first lens array constant. The width of the circuit board is limited, and the length of the circuit board is relatively ample. The first electrode column and the second electrode column of the first semiconductor refrigerator are located between the first lens array and the second lens array, so that the light emitting component occupies a larger dimension in the length direction of the circuit board, and the light emitting component occupies a smaller dimension in the width direction of the circuit board. The width of the circuit board is limited, and the dimension of the circuit board width occupied by the light emitting component is reduced, so that the light emitting component and the first light receiving component can be arranged side by side along the width direction of the circuit board. One end of the first circuit adapter board is connected to the circuit board, and the other end of the first circuit adapter board is connected to the first electrode column and the second electrode column of the first semiconductor refrigerator, so as to realize the electrical connection between the circuit board and the first semiconductor refrigerator. The optical signal between the first lens array and the second lens array is collimated light, and the distance between the first lens array and the second lens can be long or short, so as to facilitate the placement of the first electrode column, the second electrode column and the first circuit adapter board of the first semiconductor refrigerator.

[0019] In some embodiments, an optical module is provided, further comprising:

[0020] A first thermistor, disposed on the first semiconductor refrigerator and located between the first lens array and the second lens array;

[0021] The first lens array includes a collimating lens having a light-transmitting surface. The top surface of the first thermistor is lower than the light-transmitting surface. The first thermistor is located between two adjacent collimating lenses of the first lens array.

[0022] The above technical solution has the following beneficial effects: the first thermistor is arranged on the first semiconductor refrigerator to determine the temperature of the first laser chip array, thereby facilitating the adjustment of the cooling or heating of the first semiconductor refrigerator. The first thermistor is located between the first lens array and the second lens array, reducing the size of the circuit board width direction occupied by the light emitting component. The first thermistor is located between two adjacent collimating lenses of the first lens array, so that the first thermistor is located between the two emission light paths, so as to avoid the first thermistor blocking the light signal from the width direction of the light module. The top surface of the first thermistor is lower than the light-transmitting surface of the collimating lens of the first lens array, so that the top surface of the first thermistor is lower than the emission light path, so as to avoid the first thermistor blocking the light signal from the height direction of the light module.

[0023] In some embodiments, an optical module is provided, comprising:

[0024] The top surface of the first circuit adapter plate, the top surface of the first electrode column, and the top surface of the second electrode column are all lower than the light-transmitting surface.

[0025] The above technical solution has the following beneficial effects: the top surface of the first circuit adapter board, the top surface of the first electrode column and the top surface of the second electrode column are all lower than the light-transmitting surface, so as to avoid the first circuit adapter board, the first electrode column and the second electrode column blocking the optical signal from the height direction of the optical module.

[0026] In some embodiments, an optical module is provided, wherein the circuit board has an embedding opening;

[0027] A side wall of the embedding opening is provided with:

[0028] A first pad;

[0029] A second soldering pad and the first soldering pad are respectively connected to the other end of the first circuit adapter board;

[0030] The other side wall of the embedding opening is connected to the one side wall of the embedding opening, and the surface is provided with:

[0031] DSP chip;

[0032] A high-frequency signal pad, one end of which is wire-bonded to the laser chip of the laser chip array to provide a high-frequency driving signal to the laser chip, and the other end of which is connected to the DSP chip;

[0033] a first bonding area, bonded to the receiving optical fiber array of the first light receiving component;

[0034] a first placement area, connected to the transimpedance amplifier chip of the first light receiving component; the first placement area is away from the embedding port relative to the first bonding area, and the transimpedance amplifier chip of the first light receiving component is connected to the DSP chip;

[0035] The first bonding area includes a plurality of gold-plated points, and there are gaps between the plurality of gold-plated points so that the circuit board between the plurality of gold-plated points is exposed; and the first placement area is away from the embedding opening relative to the high-frequency signal pad.

[0036] The above technical solution has the following beneficial effects:

[0037] The circuit board has an embedding opening, and the light emitting component is embedded in the embedding opening. A first solder pad and a second solder pad are provided on a side wall surface of the embedding opening. The first solder pad and the second solder pad are respectively connected to the other end of the first circuit adapter board, so that the first circuit adapter board is electrically connected to the circuit board. A high-frequency signal solder pad is provided on the other side wall surface of the embedding opening. The high-frequency signal solder pad is wired connected to the laser chip of the laser chip array to provide a high-frequency driving signal to the laser chip, thereby causing the laser chip to emit a light signal. The high-frequency signal solder pad is connected to the DSP chip to receive the high-frequency driving signal of the DSP chip. One side wall of the embedding opening is connected to the other side wall of the embedding opening, so that the first solder pad and the second solder pad are arranged adjacent to the high-frequency signal solder pad. A first bonding area and a first placement area are provided on the other side wall surface of the embedding opening. The first bonding area is bonded to the receiving optical fiber array of the first light receiving component, and the first placement area is bonded to the transimpedance amplifier chip of the first light receiving component. The transimpedance amplifier chip is connected to the DSP chip, so that the first light receiving component is connected to the DSP chip. The area of ​​the first bonding area and the first placement area is bonded to the light receiving chip of the first light receiving component. The first placement area is far away from the embedding opening relative to the first bonding area, so that the transimpedance amplifier chip of the first light receiving component is far away from the embedding opening relative to the receiving optical fiber array of the first light receiving component.

[0038] The first bonding area includes a plurality of gold-plated points, and there are gaps between the plurality of gold-plated points, so that the circuit board between the plurality of gold-plated points is exposed. The glue in the first bonding area contacts the gold-plated points and the circuit board between the gold-plated points, which can not only increase the contact area between the glue and the first bonding area, but also change the bonding material of the glue from the gold-plated points to the gold-plated points and the circuit board, thereby increasing the bonding force between the first bonding area and the glue.

[0039] The first placement area is far away from the embedding opening relative to the high-frequency signal pad, so that the area between the first placement area and the first bonding area is far away from the embedding opening relative to the high-frequency signal, so that the laser chip array and the optical receiving chip of the first optical receiving component are staggered in the length direction of the circuit board, which can not only reduce the signal crosstalk between the laser chip array and the optical receiving chip, but also provide sufficient wiring space for the transimpedance amplifier chip of the first optical receiving component and the second optical receiving component.

[0040] In some embodiments, an optical module is provided, further comprising:

[0041] A supporting plate is embedded in the embedding opening and includes:

[0042] A supporting plate body, the edges of which support the circuit board, and the middle of which supports the light emitting component;

[0043] The limiting support portion is used to limit the position of the circuit board on the supporting plate, and includes:

[0044] A first position-limiting support portion connected to a side wall of the embedding opening;

[0045] A second position-limiting support portion, arranged opposite to the first position-limiting support portion;

[0046] A third position-limiting support portion, one end of which is connected to the first position-limiting support portion, and the other end of which is connected to the second position-limiting support portion;

[0047] A supporting portion, used to support the circuit board, comprising:

[0048] a first support portion;

[0049] a second supporting portion, arranged opposite to the first supporting portion;

[0050] Among them, the first bonding area, and the area between the first bonding area and the first placement area are located within the first supporting portion in the projection area on the lower surface of the circuit board; the second bonding area, and the area between the second bonding area and the second placement area are located within the second supporting portion in the projection area on the lower surface of the circuit board.

[0051] The above technical solution has the following beneficial effects: the edge of the supporting plate body supports the circuit board, and the middle of the supporting plate body supports the light emitting component. The supporting plate includes a limiting support part, and the limiting support part includes a first limiting support part, a second limiting support part and a third limiting support part. The first limiting support part is connected to a side wall of the embedding port, the second limiting support part is arranged opposite to the first limiting support part, one end of the third limiting support part is connected to the first limiting support part, and the other end of the third limiting support part is connected to the second limiting support part to limit the position of the circuit board on the supporting plate. The supporting part supports the circuit board to reduce the deformation of the circuit board in the thickness direction. The projection area of ​​the first bonding area and the area between the first bonding area and the first placement area on the lower surface of the circuit board is located at the first supporting part, so that the first supporting part supports the circuit board area where the receiving optical fiber array and the light receiving chip of the first light receiving component are located, reducing the deformation of the area in the thickness direction.

[0052] In some embodiments, an optical module is provided, wherein the first circuit adapter board includes:

[0053] A first signal adapter wire, one end of which is connected to the first pad, and the other end of which is connected to the first electrode column;

[0054] A second signal adapter wire, one end of which is connected to the second pad, and the other end of which is connected to the second electrode column;

[0055] There is a gap between the first signal adapter wire and the second signal adapter wire.

[0056] The above technical solution has the following beneficial effects: the first signal adapter wire connects the first pad and the first electrode column, the second signal adapter wire connects the second pad and the second electrode column, and there is a gap between the first signal adapter wire and the second signal adapter wire to avoid crosstalk between the electrical signals on the three signal adapter wires.

[0057] In some embodiments, an optical module is provided, wherein an isolator array is disposed between the second lens array and the transmitting optical fiber array, the isolator array is used to prevent the optical signal from returning along the original path, and the isolator array includes:

[0058] Isolator;

[0059] Magnetic parts, including:

[0060] A supporting bottom plate, the upper surface of which is connected to the bottom surface of the isolator;

[0061] A supporting plate is connected to the side of the isolator.

[0062] The above technical solution has the following beneficial effects: the isolator does not have magnetism and cannot work properly. The magnetic component provides magnetism to enable the isolator to work properly. The upper surface of the bottom plate of the magnetic component is connected to the bottom surface of the isolator so that the magnetic component supports the isolator, thereby increasing the height of the isolator and facilitating the passage of the optical signal through the isolator. The supporting plate of the magnetic component is connected to the side of the isolator to provide an installation reference surface for the isolator, facilitating the installation of the isolator.

[0063] In some embodiments, an optical module is provided, comprising:

[0064] Circuit boards;

[0065] A light emitting component connected to the circuit board;

[0066] Wherein, the light emitting component comprises:

[0067] A laser chip array is arranged along the width direction of the circuit board and is used to emit optical signals;

[0068] A first lens array, located in the light emitting direction of the laser chip array, and used for collimating the optical signal emitted by the laser chip array;

[0069] A second lens array, located in the collimation direction of the first lens array;

[0070] A transmitting optical fiber array is used to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the transmitting optical fiber array are arranged along the length direction of the circuit board;

[0071] A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array; the first semiconductor refrigerator comprises:

[0072] a first electrode column;

[0073] A second electrode column and the first electrode column are both located between the first lens array and the second lens array;

[0074] The first circuit adapter board is located between the first lens array and the second lens array; one end of the first circuit adapter board is respectively connected to the first electrode column and the second electrode column, and the other end of the first circuit adapter board is connected to the circuit board.

[0075] The above technical scheme has the following beneficial effects: the light emitting component is used to emit light signals, the light emitting component includes a laser chip array, a first lens array, a second lens array and a transmitting optical fiber array, the laser chip array emits light signals, the first lens array is located in the light emitting direction of the laser chip array to collimate the light signals emitted by the laser chip array, the second lens array is located in the collimating direction of the first lens array to converge the light signals collimated by the first lens array, and the transmitting optical fiber array receives the light signals converged by the second lens array. The surface of the first semiconductor refrigerator carries the laser chip array and the first lens array to make the temperature of the laser chip array and the first lens array constant. The width of the circuit board is limited, and the length of the circuit board is relatively ample. The first electrode column and the second electrode column of the first semiconductor refrigerator are located between the first lens array and the second lens array, so that the light emitting component occupies a larger dimension in the length direction of the circuit board, and the light emitting component occupies a smaller dimension in the width direction of the circuit board. One end of the first circuit adapter board is connected to the circuit board, and the other end of the first circuit adapter board is connected to the first electrode column and the second electrode column of the first semiconductor refrigerator to realize the electrical connection between the circuit board and the first semiconductor refrigerator. The optical signal between the first lens array and the second lens array is collimated light, and the distance between the first lens array and the second lens can be long or short to facilitate the placement of the first electrode column, the second electrode column and the first circuit adapter board of the first semiconductor refrigerator.

[0076] In some embodiments, an optical module is provided, comprising:

[0077] A circuit board having an embedding opening;

[0078] A supporting plate is embedded in the embedding opening, comprising:

[0079] Limiting support part;

[0080] A light emitting component, carried on the supporting plate;

[0081] Wherein, the light emitting component comprises:

[0082] A laser chip array is arranged along the width direction of the circuit board and is used to emit optical signals;

[0083] A first lens array, located in the light emitting direction of the laser chip array, and used for collimating the optical signal emitted by the laser chip array;

[0084] A second lens array, located in the collimation direction of the first lens array;

[0085] A transmitting optical fiber array is used to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the transmitting optical fiber array are arranged along the length direction of the circuit board;

[0086] A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array;

[0087] A first circuit adapter board, located between the first lens array and the second lens array, electrically connecting the circuit board and the first semiconductor refrigerator;

[0088] Wherein, the position-limiting support portion comprises a glue-dispensing boss, on which at least two first support bosses are arranged, the at least two first support bosses support the transmitting optical fiber array, and the area between the two first support bosses is glue-dispensed.

[0089] The above technical solution has the following beneficial effects: the circuit board has an embedding opening, the supporting plate is embedded in the embedding opening, and the supporting plate supports the light emitting component. The light emitting component is used to emit light signals, and the light emitting component includes a laser chip array, a first lens array, a second lens array and a transmitting optical fiber array. The laser chip array emits light signals. The first lens array is located in the light emitting direction of the laser chip array to collimate the light signal emitted by the laser chip array. The second lens array is located in the collimation direction of the first lens array to converge the light signal collimated by the first lens array. The transmitting optical fiber array receives the light signal converged by the second lens array. The surface of the first semiconductor refrigerator carries the laser chip array and the first lens array to keep the temperature of the laser chip array and the first lens array constant. The first circuit adapter board electrically connects the circuit board with the first semiconductor refrigerator. The light signal between the first lens array and the second lens array is collimated light, and the distance between the first lens array and the second lens can be long or short to facilitate the placement of the first circuit adapter board. The support plate includes a position-limiting support portion, and the position-limiting support portion includes a glue-dispensing boss, and at least two first support bosses are arranged on the glue-dispensing boss, and the at least two first support bosses support the transmitting optical fiber array. The area of ​​the glue-dispensing boss other than the at least two first support bosses is a glue-dispensing area, and glue can be dispensed in the glue-dispensing area, and the glue in the glue-dispensing area is in contact and connected with the transmitting optical fiber array. Glue is dispensed in the area between the two first support bosses to ensure that the glue is in contact and connected with the transmitting optical fiber array, increase the thickness of the glue, and then enhance the bonding force of the glue, thereby improving the stability of the transmitting substrate and the transmitting optical fiber array. Glue is dispensed in the area between the two first support bosses to increase the thickness of the glue, and then enhance the bonding force of the glue.

[0090] In some embodiments, an optical module is provided, comprising:

[0091] A glue guiding groove is arranged around the glue dispensing boss, the glue guiding groove is recessed relative to the glue dispensing boss, and the glue guiding groove is used to guide the flow of glue.

[0092] The above technical solution has the following beneficial effects: the glue guide groove is located around the glue dispensing boss, the glue guide groove is recessed relative to the glue dispensing boss, and the glue guide groove is used to guide the flow of glue to reduce the contamination of the optical fiber end face of the emitting optical fiber array by excessive glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0093] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0094] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments;

[0095] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0096] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0097] Figure 4 is an exploded view of an optical module according to some embodiments;

[0098] Figure 5 is a diagram of the internal structure of an optical module according to some embodiments;

[0099] Figure 6 is an exploded view of the internal structure of an optical module according to some embodiments;

[0100] Fig. 7A is a structural diagram of a first light receiving component according to some embodiments;

[0101] Figure 7B is a structural diagram of a first light receiving component at another viewing angle according to some embodiments;

[0102] Figure 8 is a structural diagram of another light receiving component according to some embodiments;

[0103] Fig. 9 is a partial exploded view of the internal structure of an optical module according to some embodiments;

[0104] Fig.10 is a partial exploded view of the internal structure of another optical module according to some embodiments;

[0105] Fig.11 is a partial exploded view of the internal structure of yet another optical module according to some embodiments;

[0106] Fig.12 is an emission light path diagram of a light emitting component according to some embodiments;

[0107] Fig.13A is a structural diagram of a transmitting optical fiber array according to some embodiments;

[0108] Fig. 13B is an exploded view of a transmitting optical fiber array according to some embodiments;

[0109] Fig. 13C is a partial diagram of a transmitting optical fiber array according to some embodiments;

[0110] Fig.14A is a partial structural diagram of a light emitting component according to some embodiments;

[0111] Fig. 14B is a partial exploded view of a light emitting component according to some embodiments;

[0112] Fig.15A is a partial diagram of a light emitting component according to some embodiments;

[0113] Fig. 15B is a partial view of a light emitting component at another viewing angle according to some embodiments;

[0114] Fig.16A is a structural diagram of an isolator array according to some embodiments;

[0115] Fig. 16B is an exploded view of an isolator array according to some embodiments;

[0116] Fig.17 is a structural diagram of a support plate according to some embodiments;

[0117] Fig.18 is a structural diagram of another supporting plate according to some embodiments;

[0118] Fig.19 is a structural diagram of another supporting plate according to some embodiments;

[0119] Fig. 20 is a structural diagram of a circuit board according to some embodiments;

[0120] Fig.21A is an assembly diagram of a support plate and a circuit board according to some embodiments;

[0121] Fig.21B is a cross-sectional view of a support plate and a circuit board according to some embodiments;

[0122] Fig. 21C is an assembly diagram of a support plate and a circuit board at another viewing angle according to some embodiments;

[0123] Fig. 22 is a structural diagram of a first circuit adapter board according to some embodiments;

[0124] Fig.23 is a cross-sectional view of the internal structure of an optical module according to some embodiments. DETAILED DESCRIPTION

[0125] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure are within the scope of protection of the present disclosure.

[0126] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0127] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light and transmitted using the propagation speed of light. This light loaded with information is an optical signal. When optical signals are transmitted in optical information transmission equipment, the loss of optical power can be reduced, and long-distance transmission of optical signals can be achieved. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0128] Information processing equipment usually includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablet computers, televisions, etc. Optical information transmission equipment usually includes optical fibers and optical waveguides, etc. The signals that information processing equipment can identify and process are electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert optical signals into electrical signals.

[0129] The optical module can realize the mutual conversion between optical signals and electrical signals between the information processing device and the optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0130] Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, but not all of the information processing devices need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or optical signal output end of the optical module is called an optical port, and the electrical signal input end or electrical signal output end of the optical module is called an electrical port.

[0131] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, an optical module 200, an optical fiber 101 and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device.

[0132] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0133] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in some embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0134] The host computer 100 is configured to provide a data signal to the optical module 200 , or receive a data signal from the optical module 200 , or monitor or control the working state of the optical module 200 .

[0135] The host computer 100 includes a housing for accommodating the optical module 200 and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0136] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103.

[0137] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0138] In some embodiments, a first optical signal from a remote information processing device 1000 propagates through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000.

[0139] In some embodiments, the optical module is a tool for realizing mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding or decoding method of the information changes.

[0140] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT) or a data center server.

[0141] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the accommodating cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106;

[0142] In some embodiments, a heat sink 107 is disposed on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0143] In some embodiments, an electrical connector is disposed inside the cage 106 , and the electrical connector is configured to be connected to an electrical port of the optical module 200 .

[0144] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the cage 106 fixes the optical module 200 . The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107 .

[0145] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 establishes an electrical signal connection with the host computer 100 .

[0146] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 establishes an optical signal connection with the optical fiber 101 .

[0147] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, and the shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening, which is both an electrical port and an optical port.

[0148] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0149] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500a, etc. into the above shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the above components.

[0150] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200.

[0151] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0152] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0153] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed in the housing, and the circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LA), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.

[0154] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0155] In some embodiments, the circuit board also includes a flexible circuit board, which can be used independently or in combination with a rigid circuit board.

[0156] In some embodiments, the circuit board further includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of pins that are independent of each other. (Circuit board 300VS circuit board; reference numerals have strong indications and should be consistent with the form in the figure. If the concept has more embodiments, it is not recommended to introduce reference numerals; in the case of the attached Figure 1 It is recommended to introduce reference numerals in the embodiment consistent with the above)

[0157] In some implementations, the gold finger is disposed on a surface of one side of the circuit board 300 (eg Figure 4 In some implementations, gold fingers are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required.

[0158] In some implementations, the gold finger of the circuit board extends from the electrical port and is inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger is configured to establish an electrical connection with the host computer, and can realize electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0159] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0160] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0161] In some embodiments, the optical module includes a light emitting component 400, such as Figure 3 and Figure 4 As shown, the optical emitting component 400 is used to emit an optical signal.

[0162] In some embodiments, the optical module includes a light receiving component 500, such as Figure 3 and Figure 4 The optical receiving component 500 is used to receive an optical signal and convert the optical signal into an electrical signal.

[0163] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger.

[0164] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0165] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0166] Figure 5 The figure is a diagram of the internal structure of an optical module according to some embodiments. Figure 6 FIG. 1 is an exploded view of the internal structure of an optical module according to some embodiments. Figure 5 and Figure 6 As shown, in some embodiments, the circuit board 300 may have an embedding opening 304. The light emitting component 400 may be placed at the embedding opening 304 of the circuit board 300 so that the emitting light path of the light emitting component 400 may be flush with the upper surface of the circuit board 300.

[0167] In some embodiments, the optical module may include a support plate 900. The support plate 900 may be embedded in the embedding opening 304 of the circuit board 300. The support plate 910 may support the light emitting component 400 so that the emission light path of the light emitting component 400 may be flush with the upper surface of the circuit board 300. The material of the support plate 900 may be metal.

[0168] In some embodiments, a DSP chip 310 may be disposed on the surface of the circuit board 300. The DSP chip 310 may process the electrical signal transmitted to the optical network terminal through the gold finger, and may also process the electrical signal transmitted to the optical receiving component 500.

[0169] In some embodiments, a driving chip may be disposed on the surface of the circuit board 300. One end of the driving chip may be connected to the DSP chip 310, and the other end of the driving chip may be connected to the optical transmitting component 400, so that the driving chip 310 provides a high-frequency driving signal under the action of the electrical signal processed by the DSP chip 310, and further enables the optical transmitting component 400 to emit an optical signal under the action of the high-frequency driving signal.

[0170] In some embodiments, a driving chip may be integrated inside the DSP chip 310. The DSP chip 310 may be connected to the optical transmitting component 400 through a first signal line to provide a high-frequency driving signal to the optical transmitting component 400, and further enables the optical transmitting component 400 to emit an optical signal under the action of the high-frequency driving signal. Exemplarily, a high-frequency signal pad is disposed on the circuit board 300. The DSP chip 310 may be connected to the high-frequency signal pad through a first signal line, and the high-frequency signal pad is wire-bonded to the laser chip of the optical transmitting component 400.

[0171] In some embodiments, the optical receiving component 500 may be connected to the DSP chip 310 through a second signal line, so that the DSP chip 310 can process the high-frequency electrical signal transmitted through the second signal line by the optical receiving component 500. Exemplarily, the transimpedance amplifier chip of the optical receiving component 500 may be connected to the DSP chip 310 through a second signal line.

[0172] In some embodiments, the optical transmitting component 400 and the optical receiving component 500 are staggeredly arranged along the length direction of the circuit board 300 (that is, there is no overlapping part between the optical transmitting component 400 and the optical receiving component 500 along the width direction of the circuit board 300), and the optical receiving component 500 and the DSP chip 310 are located on the same surface of the circuit board 300. Since the size of the DSP chip 310 is relatively large, the DSP chip 310 and the optical receiving component 500 cannot be arranged side by side along the width direction of the circuit board and may be placed on the right side of the optical receiving component 500. Placing the DSP chip 310 on the right side of the optical receiving component 500 may result in a relatively long distance of the first signal line between the DSP chip 310 and the high-frequency signal pad, affecting the high-frequency performance of the optical module.

[0173] To solve this problem, in some embodiments, the optical receiving component 500 and the optical transmitting component 400 are arranged side by side along the width direction of the circuit board 300, and the DSP chip 310 moves leftward along the circuit board 300. The distance of the first signal line between the DSP chip 310 and the high-frequency signal pad becomes smaller, and further the distance between the DSP chip 310 and the optical transmitting component 400 becomes smaller, improving the high-frequency performance of the optical module.

[0174] The width of the circuit board 300 is limited. In order to arrange the light emitting component 400 and the light receiving component 500 side by side along the width direction of the circuit board, in some embodiments, the electrode columns of the semiconductor cooler array of the light emitting component 400 are arranged in the emission direction of the emission light path. The width of the circuit board 300 is limited, and the length of the circuit board 300 is relatively ample. The electrode columns of the semiconductor cooler array of the light emitting component 400 are arranged on the emission light path, so that the light emitting component 400 occupies a larger dimension in the length direction of the circuit board 300, and the dimension of the light emitting component 400 in the width 300 direction of the circuit board is smaller. The width of the circuit board 300 is limited, and the dimension of the light emitting component 400 in the width 300 direction of the circuit board is reduced, so that the light emitting component 400 and the light receiving component 500 can be arranged side by side along the width direction of the circuit board.

[0175] In some embodiments, the light receiving component 500a may include a first light receiving component 502. The first light receiving component 502 may be located at one side of the light emitting component 400. The first light receiving component 502 may be disposed on a surface of the circuit board 300. For example, the first light receiving component 502 is located on the upper surface of the circuit board 300.

[0176] The light receiving component 500a may include a second light receiving component 501. The second light receiving component 501 may be located at the other side of the light emitting component 400. The second light receiving component 501 may be disposed on a surface of the circuit board 300. For example, the second light receiving component 501 may be disposed on an upper surface of the circuit board 300.

[0177] Fig. 7A is a structural diagram of a first light receiving component according to some embodiments. Figure 7B FIG. 4 is a structural diagram of the first light receiving component according to some embodiments at another viewing angle. Fig. 7A and Figure 7B As shown, in some embodiments, the first light receiving component 502 may include a receiving optical fiber array 5021. The end surface of the receiving optical fiber array 5021 is an inclined surface, so that the optical signal in the receiving optical fiber array 5021 can be reflected downward through the end surface.

[0178] The first light receiving component 502 may include a light receiving chip 5022. The light receiving chip 5022 may be located below the receiving optical fiber array 5021 to receive the optical signal reflected from the end face of the receiving optical fiber array 5021 and convert the received optical signal into a high-frequency current signal.

[0179] The first light receiving component 502 may include a transimpedance amplifier chip 5023. The transimpedance amplifier chip 5023 may be wired to the light receiving chip 5022 to convert a high-frequency current signal into a high-frequency voltage signal. The other end of the transimpedance amplifier chip 5023 may be connected to the DSP chip 310 through a second signal line to transmit the high-frequency voltage signal to the DSP chip 310, and then transmitted to the gold finger after being processed by the DSP chip 310.

[0180] The structure of the second optical receiving component 501 may be the same as that of the first optical receiving component 502 , and also includes a receiving optical fiber array, an optical receiving chip, and a transimpedance amplifier chip.

[0181] Figure 8 FIG. 4 is a structural diagram of another light receiving component according to some embodiments. Figure 8 As shown, in some embodiments, the light receiving component 500 b may be fixed to the surface of the circuit board 300 via a supporting substrate 560 .

[0182] In some embodiments, the optical receiving component 500b may include a fiber collimator array 510, which can collimate the received optical signal. The optical receiving component 500b may include a wave splitter 520, which can split the optical signal into 8 optical signals of different wavelengths. The optical receiving component 500b may include a second focusing lens array 530, which can focus the 8 optical signals of different wavelengths to the reflector array 540. The optical receiving component 500b may include a reflector array 540, which can reflect the focused 8 optical signals of different wavelengths to the optical receiving chip array 550. The optical receiving component 500b may include an optical receiving chip array 550, which can convert the 8 optical signals of different wavelengths into 8 electrical signals.

[0183] In some embodiments, the fiber collimator array 510 may include 1 fiber collimator, 1 fiber adapter, and 1 collimating lens. 1 fiber collimator is used to collimate the received optical signal, 1 fiber adapter is used to receive the optical signal, and 1 collimating lens is used to collimate the optical signal received by the fiber adapter. 1 fiber adapter and 1 collimating lens are combined into 1 fiber collimator, and both the fiber collimator and the fiber collimator are used to collimate the received optical signal.

[0184] In some embodiments, the fiber collimator array 510 includes two fiber adapters and two collimating lenses, one fiber adapter is corresponding to one collimating lens, and one fiber adapter and one collimating lens are combined into one fiber collimating component, which is used to collimate the received optical signal.

[0185] In some embodiments, the second focusing lens array 530 may include eight focusing lenses arranged in parallel. One focusing lens can focus one optical signal into the reflector array 540 , and the second focusing lens array 530 can focus eight optical signals of different wavelengths into the reflector array 540 .

[0186] In some embodiments, the reflector array 540 may include two reflectors arranged in parallel. One reflector can reflect the focused 4-way optical signals of different wavelengths to the optical receiving chip array 550, and the reflector array 540 can reflect the focused 8-way optical signals of different wavelengths to the optical receiving chip array 550.

[0187] In some embodiments, the optical receiving chip array 550 includes 8 optical receiving chips arranged in parallel. One optical receiving chip can convert one optical signal into one electrical signal, so the optical receiving chip array 550 is used to convert 8 optical signals of different wavelengths into 8 electrical signals.

[0188] Fig. 9 FIG. 1 is a partial exploded view of the internal structure of an optical module according to some embodiments. Fig. 9 As shown, in some embodiments, the light emitting component 400a may include a laser chip array 410. The laser chip array 410 may include at least one laser chip to emit at least one optical signal; for example, the laser chip array 410 may include 4 or 8 laser chips, each of which emits one optical signal. For example, the laser chip array 410 may include 8 laser chips arranged in parallel along the width direction of the circuit board (i.e., the Y-axis direction) to emit 8 optical signals. The laser chip may be a 100G EML laser chip, and one 100G EML laser chip emits a 100G optical signal of one wavelength according to a high-frequency driving signal, so that the laser chip array 410 emits 8 100G optical signals.

[0189] In some embodiments, the laser chip array 410 may include a laser chip array 410a, and the laser chip array 410a may include four laser chips arranged in parallel along the width direction of the circuit board to emit four optical signals. The laser chip array 410 may include a laser chip array 410a, and the laser chip array 410b may include four laser chips arranged in parallel along the width direction of the circuit board to emit four optical signals. The laser chip array 410a and the laser chip array 410b may be arranged in parallel along the width direction of the circuit board.

[0190] In some embodiments, the light emitting component 400 may include a first lens array 420. The first lens array 420 may be disposed on the supporting plate 900. The first lens array 420 is a collimating lens array that can collimate the optical signal. The first lens array 420 may be located in the light emitting direction of the laser chip array 410 to collimate the optical signal emitted by the laser chip array 410.

[0191] The first lens array 420 may include at least one collimating lens to collimate at least one optical signal. For example, the first lens array 420 includes 8 collimating lenses arranged in parallel along the width direction of the circuit board (i.e., the Y-axis direction) to collimate 8 optical signals. The collimating lens has a light-transmitting surface, and the optical signal passes through the light-transmitting surface of the collimating lens.

[0192] In some embodiments, the first lens array 420 may include a first lens array 420a, and the first lens array 420a may include four collimating lenses arranged in parallel along the width direction of the circuit board to collimate four optical signals. The first lens array 420 may include a first lens array 420b, and the first lens array 420b may include four collimating lenses arranged in parallel along the width direction of the circuit board to collimate four optical signals. The first lens array 420a and the first lens array 420b may be arranged in parallel along the width direction of the circuit board.

[0193] The number of the first lens arrays 420 is the same as the number of the laser chip arrays 410, so that the laser chips of the laser chip array 410 correspond one-to-one to the collimating lenses of the first lens array 420. For example, the collimating lenses of the first lens array 420a correspond one-to-one to the laser chips of the laser chip array 410a, and the collimating lenses of the first lens array 420b correspond one-to-one to the laser chips of the laser chip array 410b.

[0194] In some embodiments, the light emitting component 400 may include a second lens array 430. The second lens array 430 may be disposed on the supporting plate 900. The second lens array 430 is a convergent lens array that can converge light signals. The second lens array 430 may be located in the collimation direction of the first lens array 420 to converge the light signals collimated by the first lens array 420.

[0195] The second lens array 430 may include at least one converging lens to converge at least one optical signal. For example, the second lens array 430 includes 8 converging lenses arranged in parallel along the width direction of the circuit board (i.e., the Y-axis direction) to converge 8 optical signals. The converging lens has a light-transmitting surface, and the optical signal converges and passes through the light-transmitting surface of the converging lens.

[0196] In some embodiments, the second lens array 430 may include a second lens array 430a, and the second lens array 430a may include 4 converging lenses arranged side by side along the width direction of the circuit board to converge 4 optical signals. The second lens array 430 may include a second lens array 430b, and the second lens array 430b may include 4 converging lenses arranged side by side along the width direction of the circuit board to converge 4 optical signals. The second lens array 430a and the second lens array 430b may be arranged side by side along the width direction of the circuit board.

[0197] The number of the second lens arrays 430 is the same as the number of the first lens arrays 420, so that the converging lenses of the second lens arrays 430 correspond one by one to the collimating lenses of the first lens arrays 420. Exemplarily, the converging lenses of the second lens array 430a correspond one by one to the collimating lenses of the first lens array 420a, and the converging lenses of the second lens array 430b correspond one by one to the collimating lenses of the first lens array 420b.

[0198] Since the optical signals between the first lens array 420 and the second lens array 430 are collimated light, the distance between the first lens array 420 and the second lens array 430 can be short or long, which is convenient for placing more components. This flexibility not only increases the tolerance of the emission optical path, making the emission optical path more tolerant to the position and angle changes of the components, but also improves the stability of the emission optical path.

[0199] In some embodiments, the optical emission component 400 may include an isolator array 440. The isolator array 440 may be disposed on the carrier board 900. The isolator array 440 may be located in the collimation direction of the first lens array 420 to prevent the optical signals from returning to the laser chip array 410 along the original path.

[0200] The isolator array 440 may include at least one isolator to prevent at least one optical signal from returning to the laser chip array 410 along the original path. Exemplarily, the isolator array 440 includes 8 isolators arranged side by side along the width direction of the circuit board (i.e., the Y-axis direction) to prevent 8 optical signals from returning to the laser chip array 410 along the original path.

[0201] The number of the isolator arrays 440 is the same as the number of the second lens arrays 430, so that the isolators of the isolator arrays 440 correspond one by one to the converging lenses of the second lens arrays 430.

[0202] In some embodiments, the light emitting component 400 may include an emitting optical fiber array 450. The emitting optical fiber array 450 may be disposed on the supporting plate 900. The emitting optical fiber array 450 may be located in the convergence direction of the second lens array 430, so that the end face of the optical fiber of the emitting optical fiber array 450 may be located at the focus of the second lens array 430, thereby enabling the optical fiber of the emitting optical fiber array 450 to receive the optical signal.

[0203] In some embodiments, the transmitting fiber array 450 may include a transmitting fiber array 451, which may be located in the convergence direction of the second lens array 430a so that the transmitting fiber array 451 can receive an optical signal. The transmitting fiber array 450 may include a transmitting fiber array 452, which may be located in the convergence direction of the second lens array 430b so that the transmitting fiber array 452 can receive an optical signal. The transmitting fiber array 451 and the transmitting fiber array 452 may be arranged side by side along the width direction of the circuit board.

[0204] In some embodiments, the isolator array 440 can be located between the second lens array 430 and the transmitting optical fiber array 450. When no other devices need to be placed between the first lens array 420 and the second lens array 430, the distance between the second lens array 430 and the first lens array 420 can be shortened. When other devices need to be placed between the first lens array 420 and the second lens array 430, space can be left to facilitate the placement of other devices.

[0205] In some embodiments, the light emitting component 400 may include a semiconductor cooler (TEC) array 460. The semiconductor cooler array 460 may be disposed on a support plate 900. A laser chip array 410 may be placed on the semiconductor cooler array 460 so that the operating temperature of the laser chip array 410 is controlled within a target temperature range. A first lens array 420 may be placed on the semiconductor cooler array 460 so that the central axis of the first lens array 420 is flush with the light outlet of the laser chip array 410.

[0206] The semiconductor refrigerator array 460 may include at least one semiconductor refrigerator. The semiconductor refrigerator may include a first electrode column and a second electrode column, and the first electrode column and the second electrode column are both connected to the output end of the driving circuit so that the driving circuit provides the semiconductor refrigerator with a working current. The driving circuit provides the semiconductor refrigerator with a working current to achieve heating or cooling of the semiconductor refrigerator, so that the temperature of the laser chip array 410 can be controlled within the target temperature range.

[0207] The MCU can be connected to the driving circuit so that the MCU can control the output current of the driving circuit, thereby realizing heating or cooling of the semiconductor refrigerator, so that the operating temperature of the laser chip array 410 can be controlled within the target temperature range.

[0208] In some embodiments, the light emitting component 400 may include a thermistor array 470. The thermistor array 470 may be placed on the semiconductor cooler array 460. The thermistor array 470 may be located around the laser chip array 410. The thermistor array 470 may be used to collect the temperature around the laser chip array 410, and identify the temperature around the laser chip array 410 as the operating temperature of the laser chip array 410, so as to monitor the operating temperature of the laser chip array 410.

[0209] Thermistor array 470 may include at least one thermistor. A thermistor is a temperature-sensitive element whose resistance value changes with temperature. Therefore, the temperature around the thermistor can be determined by the resistance value of the thermistor.

[0210] The thermistor array 470 can be connected to the MCU so that the MCU can determine the temperature around the thermistor array 470 based on the resistance value of the thermistor array 470, and then the MCU can control the output current of the driving circuit based on the temperature around the thermistor array 470, thereby achieving heating or cooling of the semiconductor refrigerator.

[0211] Fig.10 FIG. 1 is a partial exploded view of the internal structure of another optical module according to some embodiments. Fig.10 As shown, in some embodiments, the light emitting component 400b may include a laser chip array 410, which may emit light signals. The light emitting component 400b may include a first focusing lens array 480, which may converge the light signals. The light emitting component 400b may include a transmitting optical fiber array 450, which may receive the light signals converged by the first focusing lens array 480.

[0212] In some embodiments, the laser chip array 410 may include 8 laser chips arranged in parallel. For example, the laser chip is a 100G EML laser chip, and one 100G EML laser chip emits a 100G optical signal of one wavelength according to the driving current, so that the laser chip array 410 emits 8 100G optical signals.

[0213] In some embodiments, the first focusing lens array 480 may include 8 focusing lenses, the transmitting optical fiber array 450 includes 8 optical fibers, and one focusing lens corresponds to one optical fiber. For example, the first focusing lens array 480 focuses 8 100G optical signals into each optical fiber in the transmitting optical fiber array 450.

[0214] Fig.11 FIG. 1 is a partial exploded view of the internal structure of another optical module according to some embodiments. Fig.11 As shown, in some embodiments, the optical emission component 400c may include a laser chip array 410, and the laser chip array 410 may emit an optical signal. The optical emission component 400c may include a first lens array 420, and the first lens array 420 may collimate the optical signal. The optical emission component 400c may include a wavelength division multiplexer array 490, and the wavelength division multiplexer array 490 may combine 8 optical signals into 2 optical signals. The optical emission component 400c may include a second lens array 430, and the second lens array 430 may converge the optical signals. The optical emission component 400c may include a fiber optic adapter 700, and the fiber optic adapter 700 may receive the optical signal converged by the second lens array 430.

[0215] In some embodiments, the first lens array 420 includes 8 collimating lenses, the wavelength division multiplexer array 490 includes 2 wavelength division multiplexers, the second lens array 430 includes 2 focusing lenses, the fiber adapter group includes 2 fiber adapters 700, 1 fiber adapter 700 corresponds to 1 focusing lens, 1 focusing lens corresponds to 1 wavelength division multiplexer, 1 wavelength division multiplexer corresponds to 4 collimating lenses, and 1 collimating lens corresponds to 1 laser chip. The first lens array 420 collimates 8 optical signals, and the collimated 4 optical signals are combined into 1 optical signal through the wavelength division multiplexer, and the 2 optical signals are coupled to the fiber adapter group through the second lens array 430 respectively.

[0216] Fig.12 FIG. 4 is a light emission path diagram of a light emission component according to some embodiments. Fig.12 As shown, the laser chip array 410 transmits 8 optical signals, which are collimated by the first lens array 420 , and the collimated 8 optical signals are converged by the second lens array 430 , through the isolator array 440 , and converged to the transmitting optical fiber array 450 .

[0217] Fig.13A A structural diagram of a transmitting optical fiber array according to some embodiments. Fig. 13B is an exploded view of a transmitting optical fiber array according to some embodiments. Fig. 13C FIG. 4 is a partial diagram of a transmitting optical fiber array according to some embodiments. Fig.13A , Fig. 13B and Fig. 13CAs shown, in some embodiments, the first transmitting optical fiber array 451 may include a bottom plate layer 4511, optical fibers 4513, and a cover plate layer 4512, wherein the cover plate layer 4512 covers the bottom plate layer 4511 to form a second placement groove, and the second placement groove is used to place the optical fibers 4513. The material of the bottom plate layer 4511 may be glass.

[0218] In some embodiments, the bottom plate layer 4511 has a second placement groove, and the second placement groove is used to place the optical fiber 4513.

[0219] In some embodiments, the bottom plate layer 4511 has a first storage groove portion, and the cover plate layer 4512 has a second storage groove portion. The first storage groove portion and the second storage groove portion form a second storage groove, and the second storage groove is used to place the optical fiber 4513.

[0220] In some embodiments, the cover layer 4512 has a second placement groove 4515, and the second placement groove 4515 is used to place the optical fiber 4513.

[0221] In some embodiments, the length dimension of the bottom plate layer 4511 is less than or equal to the length dimension of the cover plate layer 4512 .

[0222] In some embodiments, the length dimension of the bottom plate layer 4511 is greater than the length dimension of the cover plate layer 4512. The bottom plate layer 4511 is located below the optical fibers extending from the first transmitting optical fiber array 451. The bottom plate layer 4511 provides support for the optical fibers extending from the first transmitting optical fiber array 451. The optical fibers extending from the first transmitting optical fiber array 451 are not easily bent downward, thereby reducing stress damage caused by downward bending of the optical fibers.

[0223] In order to fix the bottom plate layer 4511, the cover layer 4512 and the optical fiber 4513, in some embodiments, the first transmitting optical fiber array 451 also includes a fixing part 4514, one end of the fixing part 4514 fixes the optical fiber 4513 to the bottom plate layer 4511, and the other end of the fixing part 4514 fixes the cover layer 4512 to the bottom plate layer 4511.

[0224] In some embodiments, the fixing portion 4514 is a colloid formed after the glue is cured.

[0225] In some embodiments, the fixing portion 4514 is a structural member.

[0226] Fig.14A A partial structural diagram of a light emitting component according to some embodiments. Fig. 14B FIG. 1 is a partial exploded view of a light emitting component according to some embodiments. Fig.14A and Fig. 14BAs shown, in some embodiments, the laser chip 411 of the laser chip array 410 is fixed on the semiconductor cooler array 460 through the fourth substrate 412. The size of the fourth substrate 412 is smaller than the size of the laser chip 411, so that when there is a lot of coupling glue between the laser chip 411 and the fourth substrate 412, it can flow to the side of the fourth substrate 412, thereby preventing the coupling glue from connecting with the adjacent laser chip 411, thereby preventing the laser chip 411 from shifting.

[0227] In some embodiments, the collimating lenses 421 of the first lens array 420 are fixed to the semiconductor cooler array 460 through the fifth substrate 422. The size of the fifth substrate 422 is smaller than that of the collimating lenses 421, so that when there is more coupling glue between the fifth substrate 422 and the collimating lenses 421, it can flow to the side of the fifth substrate 422, thereby preventing the coupling glue from connecting with adjacent collimating lenses 421, thereby preventing the collimating lenses 421 from shifting.

[0228] The thermal expansion coefficients of the fifth substrate 422 and the collimating lens 421 are approximately equal or equal, so that the thermal deformation of the fifth substrate 422 and the collimating lens 421 is approximately the same or the same, reducing the stress or deformation caused by the thermal expansion difference, thereby improving the stability of the emission light path. For example, the materials of the fifth substrate 422 and the collimating lens 421 can both be glass.

[0229] In some embodiments, the semiconductor refrigerator array 460 may include a first semiconductor refrigerator 461. The laser chip array 410a and the first lens array 420a may be disposed on the first semiconductor refrigerator 461. The first semiconductor refrigerator 461 may include a first substrate 4611. The upper surface of the first substrate 4611 may be provided with a first conductive area.

[0230] In some embodiments, the first semiconductor refrigerator 461 may include a second substrate 4612. The upper surface of the second substrate 4612 may be used to place the laser chip array 410 and the first lens array 420. The lower surface of the second substrate 4612 is provided with a second conductive area. The first conductive area of ​​the second substrate 4612 and the second conductive area of ​​the first substrate 4611 may be connected through a semiconductor group 4613.

[0231] In some embodiments, the upper surface of the first substrate 4611 may be provided with a first electrode column 4615 and a second electrode column 4614. The first electrode column 4615 and the second electrode column 4614 may be arranged in parallel along the Y-axis direction. The first electrode column 4615 and the second electrode column 4614 are respectively connected to the first conductive area, and the first electrode column 4615 and the second electrode column 4614 are respectively connected to the output end of the driving circuit, so that the current of the driving circuit is supplied to the first semiconductor refrigerator 461.

[0232] The first electrode column 4615 is connected to the positive output terminal of the driving circuit, and the second electrode column 4614 is connected to the negative output terminal of the driving circuit, so that the first substrate 4611 acts as a cold plate to absorb heat, and the second substrate 4612 acts as a hot plate to release heat.

[0233] The first electrode column 4615 is connected to the negative output terminal of the driving circuit, and the second electrode column 4614 is connected to the positive output terminal of the driving circuit, so that the second substrate 4612 acts as a cold plate to absorb heat, and the first substrate 4611 acts as a hot plate to release heat.

[0234] The first electrode column 4615 of the first semiconductor refrigerator 461 and the second electrode column 4614 of the first semiconductor refrigerator 461 can be respectively arranged with the laser chip array 410 along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the first semiconductor refrigerator 461, and then reduce the width dimension of the position of the first semiconductor refrigerator 461 in the embedding port 304, thereby increasing the width dimension of the position corresponding to the first semiconductor refrigerator 461 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0235] In some embodiments, the semiconductor refrigerator array 460 may include a second semiconductor refrigerator 462. The laser chip array 410b and the first lens array 420b may be disposed on the second semiconductor refrigerator 462. The second semiconductor refrigerator 462 may include a first substrate 4621. The upper surface of the first substrate 4621 may be provided with a first conductive area.

[0236] In some embodiments, the second semiconductor refrigerator 462 may include a second substrate 4622. The upper surface of the second substrate 4622 may be used to place the laser chip array 410 and the first lens array 420. The lower surface of the second substrate 4622 is provided with a second conductive area. The first conductive area of ​​the second substrate 4622 and the second conductive area of ​​the first substrate 4621 may be connected through a semiconductor group.

[0237] In some embodiments, the upper surface of the first substrate 4621 may be provided with a first electrode column 4623 and a second electrode column 4624. The first electrode column 4623 and the second electrode column 4624 may be arranged in parallel along the Y-axis direction. The first electrode column 4623 and the second electrode column 4624 are respectively connected to the first conductive area, and the first electrode column 4623 and the second electrode column 4624 are respectively connected to the output end of the driving circuit, so that the current of the driving circuit is supplied to the second semiconductor refrigerator 462.

[0238] The first electrode column 4623 is connected to the positive output terminal of the driving circuit, and the second electrode column 4624 is connected to the negative output terminal of the driving circuit, so that the first substrate 4621 acts as a cold plate to absorb heat, and the second substrate 4622 acts as a hot plate to release heat.

[0239] The first electrode column 4623 is connected to the negative output terminal of the driving circuit, and the second electrode column 4624 is connected to the positive output terminal of the driving circuit, so that the second substrate 4622 acts as a cold plate to absorb heat, and the first substrate 4621 acts as a hot plate to release heat.

[0240] The first electrode column 4623 of the second semiconductor refrigerator 462 and the second electrode column 4624 of the second semiconductor refrigerator 462 can be respectively arranged with the laser chip array 410 along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the second semiconductor refrigerator 462, and then reduce the width dimension of the position of the second semiconductor refrigerator 462 in the embedding port 304, thereby increasing the width dimension of the position corresponding to the second semiconductor refrigerator 462 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0241] The second semiconductor refrigerator 462 can be located on one side of the first semiconductor refrigerator 461, which is not only convenient for accurately controlling the temperature of the laser chips in the laser chip array 410, so that the temperature of the laser chip array 410 is controlled within the target temperature range; it can also ensure that the deformation amount of each position of the semiconductor refrigerator array 460 is approximately the same, so that the light outlet of the laser chip array 410 coincides with the central axis of the first lens array 420, and improves the stability of the emission light path. For example, the first semiconductor refrigerator 461 and the second semiconductor refrigerator 462 can be arranged side by side along the Y-axis direction.

[0242] In some embodiments, the thermistor array 470 may include a first thermistor 472. The first thermistor 472 may be placed on the first semiconductor cooler 461 via a third substrate 474. The first thermistor 472 may be located around the laser chip array 410 to collect the operating temperature of the laser chip array 410.

[0243] The first thermistor 472 and the laser chip array 410 can be arranged along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the first semiconductor cooler 461, and then reduce the width dimension of the position where the first semiconductor cooler 461 is located in the insertion port 304, thereby increasing the width dimension of the position corresponding to the first semiconductor cooler 461 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0244] In some embodiments, the thermistor array 470 may include a second thermistor 471. The second thermistor 471 may be placed on the second semiconductor cooler 462 via a third substrate 473. The second thermistor 471 may be located around the laser chip array 410 to collect the operating temperature of the laser chip array 410.

[0245] The second thermistor 471 and the laser chip array 410 can be arranged along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the second semiconductor cooler 462, and then reduce the width dimension of the position where the second semiconductor cooler 462 is located in the insertion port 304, thereby increasing the width dimension of the position corresponding to the second semiconductor cooler 462 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0246] In some embodiments, the first thermistor 472 and the second thermistor 471 may be arranged in parallel along the Y-axis direction to facilitate accurate knowledge of the temperature of the laser chips in the laser chip array 410 .

[0247] Fig.15A is a partial diagram of a light emitting component according to some embodiments. Fig. 15B FIG. 4 is a partial view of a light emitting component according to some embodiments at another viewing angle. Fig.15A and Fig. 15B As shown, in some embodiments, the first electrode column and the second electrode column of the semiconductor cooler array 460 , and the thermistor array 470 may be located between the first lens array 420 and the second lens array 430 .

[0248] In some embodiments, a circuit adapter board array 320 is provided between the first lens array 420 and the second lens array 430. One end of the circuit adapter board array 320 can be connected to the electrode columns of the semiconductor cooler array 460 and the thermistor array 470, and one end of the circuit adapter board array 320 can be connected to the pad on the circuit board 300 to achieve electrical connection between the semiconductor cooler array 460 and the thermistor array 470 and the circuit board 300.

[0249] The circuit adapter board array 320 may include a first circuit adapter board 322. One end of the first circuit adapter board 322 may be connected to the first semiconductor cooler 461 and the first thermistor 472, and the other end of the first circuit adapter board 322 may be connected to the pad on the circuit board 300 to achieve electrical connection between the first semiconductor cooler 461 and the first thermistor 472 and the circuit board 300.

[0250] The circuit adapter board array 320 may include a second circuit adapter board 321. One end of the second circuit adapter board 321 may be connected to the second semiconductor cooler 462 and the second thermistor 471, and the other end of the second circuit adapter board 321 may be connected to the pad on the circuit board 300 to achieve electrical connection between the second semiconductor cooler 462 and the second thermistor 471 and the circuit board 300.

[0251] In some embodiments, the top surface of the circuit adapter board array 320, the top surface of the electrode columns of the semiconductor cooler array 460, and the top surface of the thermistor array 470 are all lower than the light-transmitting surface of the first lens array 420 or the light-transmitting surface of the second lens array 430 to avoid the circuit adapter board array 320, the electrode columns of the semiconductor cooler array 460, and the thermistor array 470 blocking the light signal.

[0252] In some embodiments, the first thermistor 472 or the second thermistor 471 may be located between two adjacent collimating lenses of the first lens array 420 to prevent the first thermistor 472 or the second thermistor 471 from blocking the optical signal.

[0253] In some embodiments, the converging lens 431 of the second lens array 430 can be fixed on the supporting plate 900 through the sixth substrate. The size of the sixth substrate 432 is smaller than that of the converging lens 431, so that when there is more coupling glue between the sixth substrate 432 and the converging lens 431, it can flow to the side of the sixth substrate 432, thereby preventing the coupling glue from connecting with the adjacent converging lens 431, thereby preventing the converging lens 431 from shifting.

[0254] The sixth substrate 432 and the converging lens 431 have approximately the same or equal thermal expansion coefficients, so that the sixth substrate 432 and the converging lens 431 have approximately the same or equal thermal deformation amounts, reducing stress or deformation caused by thermal expansion differences, thereby improving the stability of the emission light path. For example, the sixth substrate 432 and the converging lens 431 can both be made of glass.

[0255] In some embodiments, the first transmitting optical fiber array 451 can be fixed on the supporting plate 900 through the seventh substrate 453 to reduce the impact of the deformation of the supporting plate 900 on the first transmitting optical fiber array 451.

[0256] The size of the seventh substrate 453 is smaller than that of the first transmitting optical fiber array 451, so that when there is more coupling glue between the seventh substrate 453 and the first transmitting optical fiber array 451, it can flow to the side of the seventh substrate 453, thereby reducing the contamination of the first transmitting optical fiber array 451 by the coupling glue.

[0257] Fig.16A is a structural diagram of an isolator array according to some embodiments. Fig. 16BFIG. 1 is an exploded view of an isolator array according to some embodiments. Fig.16A and Fig. 16B As shown, in some embodiments, the isolator array 440 may include at least one isolator 441. The isolator 441 may include a first polarizer, a Faraday plate, and a second polarizer. The Faraday plate rotates in the same direction, and polarized light passing through the first polarizer cannot return to the first polarizer after Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate, and the second polarizer has a reverse isolation effect.

[0258] The Faraday plate can only work under the action of a magnetic field. When the isolator 441 is magnetic, the isolator array 440 only includes the isolator 441. When the isolator 441 is not magnetic, the isolator array 440 may include the isolator 441 and the magnetic member 442, and the magnetic member 442 may provide a magnetic field so that the Faraday plate can work normally under the magnetic field.

[0259] In some embodiments, the magnetic member 442 may include a support base plate 4421 . The bottom surface of the isolator 441 may be connected to the upper surface of the support base plate 4421 , so that the support base plate 4421 may support the isolator 441 .

[0260] The supporting base plate 4421 has a preset height to increase the height of the isolator 441 so that the optical signal can pass through the isolator 441 .

[0261] In some embodiments, the magnetic member 442 may include at least one supporting plate 4422. The side of the isolator 441 may be connected to the supporting plate 4422 to provide the isolator 441 with a mounting reference surface to facilitate the installation of the isolator 441. At least one supporting plate 4422 may be connected to the upper surface of the supporting base plate 4421 to enclose at least two third storage grooves 4423. The bottom surface of the third storage groove 4423 is the upper surface of the supporting base plate 4421, the side surface of the third storage groove 4423 is a side surface of the supporting plate 4422, the bottom surface of the isolator 441 is connected to the bottom surface of the third storage groove 4423, and the side surface of the isolator 441 is connected to the side surface of the third storage groove 4423.

[0262] Fig.17 FIG. 1 is a structural diagram of a support plate according to some embodiments. Fig.17 As shown, in some embodiments, the supporting plate 900 may include a supporting plate body 901. The edges of the supporting plate body 901 may support the circuit board 300. The middle of the supporting plate body 901 may support the light emitting component 400.

[0263] The supporting plate body 901 may have a first storage groove 902. The first storage groove 902 may be formed by an inward depression of the upper surface of the supporting plate body 901, and the semiconductor cooler array 460 may be placed in the first storage groove 902.

[0264] The height of the upper surface of the supporting plate body 901 is lower than the height of the first placement groove 902 , so that the semiconductor cooler array 460 can be placed in the first placement groove 902 .

[0265] In some embodiments, a limiting support portion 903 may be provided on the upper surface of the first end of the supporting plate body 901. The limiting support portion 903 may include a first limiting support portion 9031. The first limiting support portion 9031 may be provided along the length direction of the supporting plate 900. The first limiting support portion 9031 may limit the position of the circuit board 300 on the supporting plate 900.

[0266] The position limiting support portion 903 may include a second position limiting support portion 9032. The second position limiting support portion 9032 may be disposed along the length direction of the supporting plate 900. The second position limiting support portion 9032 may be disposed opposite to the first position limiting support portion 9031. The second position limiting support portion 9032 may limit the position of the circuit board 300 on the supporting plate 900.

[0267] The position limiting support portion 903 may include a third position limiting support portion 9033. One end of the third position limiting support portion 9033 may be connected to the first position limiting support portion 9031. The other end of the third position limiting support portion 9033 may be connected to the second position limiting support portion 9032. The third position limiting support portion 9033 has at least one receiving groove 9034. The receiving groove 9034 may receive an optical fiber of the transmitting optical fiber array 450. The receiving groove 9034 is more recessed relative to the third position limiting support portion 9033 to reduce the stress of the optical fiber on the third position limiting support portion 9033.

[0268] In some embodiments, the support plate 900 may include a support portion 904. The support portion 904 may be formed by expanding outward from the second end of the support plate body 901. The upper surface of the support portion 904 may be connected to the lower surface of the circuit board 300 to support the circuit board 300 and reduce the deformation of the circuit board 300 in the thickness direction.

[0269] In order to reduce the space occupied by the supporting plate 900 on the circuit board 300, in some embodiments, the supporting portion 904 may have a notch 4143. The presence of the notch 4143 can reduce the size of the supporting portion 904, thereby reducing the size of the supporting plate 900, thereby reducing the space size occupied by the supporting plate 900 on the circuit board 300. The presence of the notch 4143 allows the supporting portion 904 to be divided into a first supporting portion 9041 and a second supporting portion 9042.

[0270] Fig.18is a structural diagram of another support plate according to some embodiments. Fig.19 FIG. 2 is a structural diagram of another supporting plate according to some embodiments. Fig.18 and Fig.19 As shown, in some embodiments, the supporting plate 900b and the supporting plate 900c both include a supporting plate body 911, and a first storage groove 912 may be provided at the first end of the supporting plate body 911. A semiconductor cooler array may be provided in the first storage groove 912.

[0271] In some embodiments, a limiting support portion 913 may be provided at the second end of the supporting plate body 911. The limiting support portion 913 protrudes relative to the supporting plate body 911. A transmitting optical fiber array 450 or a wavelength division multiplexer array 490 may be placed on the limiting support portion 913.

[0272] In some embodiments, the position limiting support portion 913 may include a glue dispensing boss 9135. The glue dispensing boss 9135 may be located at an end of the position limiting support portion 913 away from the first storage slot 912. Glue may be dispensed on the glue dispensing boss 9135.

[0273] In some embodiments, a first supporting boss 9136 may be provided on the glue dispensing boss 9135. The transmitting optical fiber array 450 may be provided on the first supporting boss 9136. The areas of the glue dispensing boss 9135 other than the first supporting boss 9136 are all glue dispensing areas, and glue can be dispensed in the glue dispensing areas. The glue in the glue dispensing area and the first supporting boss 9136 are both in contact and connected with the transmitting optical fiber array 450, and the glue in the glue dispensing area is cured to form a colloid, which fixes the transmitting optical fiber array 450 to the limiting support portion 913. The areas of the glue dispensing boss 9135 other than the first supporting boss 9136 are all glued to increase the thickness of the glue. As the thickness of the glue increases, the strength of the glue body increases, and the bonding force of the glue is also enhanced, thereby improving the stability of the supporting plate and the transmitting optical fiber array 450 or the wavelength division multiplexer array 490, and then improving the stability of the optical path. Among them, glue dispensing refers to glue dispensing water.

[0274] In some embodiments, the thickness of the colloid can be equal to the height of the first supporting boss 9136 and also higher than the distance between the bonding surface and the transmitting optical fiber array 450, thereby increasing the adhesion of the colloid and thus improving the stability of the supporting plate and the transmitting optical fiber array 450, thereby improving the stability of the optical path.

[0275] In some embodiments, the thickness of the colloid can be greater than the height of the first supporting boss 9136, so that the colloid is also adhered to the first supporting boss 9136, thereby increasing the bonding surface of the colloid. The thickness of the colloid is greater than the height of the first supporting boss 9136, which not only increases the bonding surface of the colloid, but also increases the bonding thickness of the colloid, further enhancing the bonding force of the colloid, and further improving the stability of the support plate and the transmitting optical fiber array 450 and the stability of the optical path.

[0276] In some embodiments, at least two first supporting bosses 9136 may be provided on the glue dispensing boss 9135. At least two first supporting bosses 9136 support the transmitting optical fiber array 450, and the area between any two first supporting bosses 9136 may be glued, and after the glue is cured, a colloid is formed, and the colloid fixes the transmitting optical fiber array 450 and the limiting support portion 913. The area between any two first supporting bosses 9136 may be glued, ensuring that the glue is in contact and connected with the transmitting optical fiber array 450, increasing the thickness of the glue, and improving the stability of the supporting plate 900b or the supporting plate 900c and the transmitting optical fiber array 450.

[0277] In some embodiments, glue can be dispensed in the area between the two parallel first support bosses 9136 to ensure that the glue is in contact and connected with the transmitting optical fiber array 450, increase the thickness of the glue, and improve the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450.

[0278] In some embodiments, glue can be dispensed in the area between the first supporting bosses 9136 at both ends of the diagonal line, which can not only ensure that the glue is in contact and connected with the transmitting optical fiber array 450, thereby improving the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450; it can also allow the glue to flow around the first supporting boss 9136, thereby increasing the contact area between the glue and the transmitting optical fiber array 450, and further improving the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450.

[0279] In some embodiments, the at least two first supporting bosses 9136 may include two first supporting bosses 9136. The two first supporting bosses 9136 support the transmitting optical fiber array 450, the two first supporting bosses 9136 are arranged in parallel, the two first supporting bosses 9136 are located at both ends of a diagonal line, and the area between the two first supporting bosses 9136 is glued.

[0280] In some embodiments, the at least two first support bosses 9136 may include three first support bosses 9136. The three first support bosses 9136 support the transmitting optical fiber array 450, and two of the three first support bosses 9136 are located at both ends of a diagonal of the glue dispensing boss 9135, and the remaining first support boss 9136 is arranged in parallel with the first support boss 9136 located at one end of a diagonal, and the area between any two first support bosses 9136 can be glued. For example, the area between the two first support bosses 9136 located at both ends of a diagonal is glued; the area between the two first support bosses 9136 arranged in parallel is glued; the area between the two first support bosses 9136 located at both ends of a diagonal is glued, and the area between the two first support bosses 9136 arranged in parallel is also glued.

[0281] In some embodiments, the at least two first supporting bosses 9136 may include four first supporting bosses 9136. The four first supporting bosses 9136 support the transmitting optical fiber array 450, wherein two first supporting bosses 9136 are respectively located at two ends of a diagonal line of the glue dispensing boss 9135, and the remaining two first supporting bosses 9136 are located at two ends of another diagonal line of the glue dispensing boss 9135, and the area between any two first supporting bosses 9136 can be glued.

[0282] In some embodiments, the shape of the first supporting boss 9136 can be rectangular, square, or circular.

[0283] like Fig.19 As shown, in some embodiments, the limiting support portion 913 of the support plate 900c may include a glue guide groove 9134, which is located around the glue dispensing boss 9135. The glue guide groove 9134 is recessed relative to the glue dispensing boss 9135. The glue guide groove 9134 is used to guide the flow of glue to reduce the amount of glue that contaminates the optical fiber end face of the transmitting optical fiber array 450.

[0284] The protrusions of the glue guide groove 9134 , the glue dispensing boss 9135 and the first supporting boss 9136 are successively deepened to prevent excessive glue from contaminating the optical fiber end face of the transmitting optical fiber array 450 .

[0285] The bottom surface of the transmitting optical fiber array 450 can be in contact with the colloid on the first supporting boss 9136 and the glue dispensing boss 9135 to limit the position of the transmitting optical fiber array 450 in the upper and lower directions of the optical module. In order to further limit the position of the transmitting optical fiber array 450, in some embodiments, the limiting support portion 913 may include a first limiting plate 9133. The first limiting plate 9133 may be located between the first storage groove 912 and the glue guide groove 9134. The end of the transmitting optical fiber array 450 (the end of the transmitting optical fiber array 450 having the optical fiber end face) is in contact with the first limiting plate 9133 to limit the position of the transmitting optical fiber array 450 in the optical fiber direction (i.e., the left and right direction of the optical module).

[0286] In some embodiments, the limiting support portion 913 may include a second limiting plate 9131. The second limiting plate 9131 may be located between the glue guide groove and the edge of the support plate, that is, the second limiting plate 9131 is located at the front end of the limiting support portion 913 or the rear end of the limiting support portion 913. The side of the transmitting optical fiber array 450 is in contact with the second limiting plate 9131 to limit the position of the transmitting optical fiber array 450 in the front and rear directions of the optical module.

[0287] In some embodiments, the limiting support portion 913 may include two second limiting plates 9131, one limiting plate 9115 is located at the front end of the glue guide groove 9134 and the support plate 900b or the support plate 900c, and the other limiting plate 9115 is located at the rear end of the glue guide groove 9134 and the support plate 900b or the support plate 900c, a side surface of an emitting optical fiber array 450 is in contact with and connected to one limiting plate 9115, and a side surface of another emitting optical fiber array 450 is in contact with and connected to another limiting plate 9115.

[0288] In some embodiments, the limiting support portion 913 may include a second support boss 9132. The second support boss 9132 may be located at one end of the limiting support portion 913 close to the first placement slot 912, the first limiting plate 9133 may be located in the middle of the second support boss 9132, and the second support boss 9132 is recessed relative to the first limiting plate 9133. The isolator array may be located on the second support boss 9132.

[0289] In some embodiments, a fulcrum groove 9119 may be provided at one end of the supporting plate 900b or the supporting plate 900c away from the first storage groove 912. There may be no gap between the fulcrum groove 9119 and the edge of the supporting plate 900b or the supporting plate 900c, that is, the fulcrum groove 9119 is located at the edge area of ​​the supporting plate 900b or the supporting plate 900c. The fulcrum groove 9119 is not only located at the edge area of ​​the supporting plate 900b or the supporting plate 900c, but also located at the projection area of ​​the transmitting optical fiber array 450. There is a gap between the fulcrum groove 9119 and the transmitting optical fiber array 450. The fulcrum groove 9119 is located on the left side of the glue guide groove 9134, and the edge of the transmitting optical fiber array 450 extends to the left over the glue guide groove 9134 and the fulcrum groove 9119. The fulcrum groove 9119 is located on the left side of the glue guide groove 9134. The edge of the transmitting optical fiber array 450 extends to the left and crosses the glue guide groove 9134 and the fulcrum groove 9119. Then, the glue guide groove 9134 is away from the edge of the transmitting optical fiber array 450 relative to the fulcrum groove 9119. The glue guide groove 9134 is away from the edge of the transmitting optical fiber array 450 relative to the fulcrum groove 9119. There is a gap between the fulcrum groove 9119 and the transmitting optical fiber array 450. The fulcrum groove 9119 serves as a fulcrum to facilitate the separation of the transmitting optical fiber array 450 from the supporting plate 900b or the supporting plate 900c. When disassembling the transmitting optical fiber array 450, the disassembly tool uses the fulcrum groove 9119 as a fulcrum to pry the transmitting optical fiber array 450 off the supporting plate 900b or the supporting plate 900c.

[0290] The above is a case where the transmitting optical fiber array 450 is supported on the first supporting protrusion 9136 of the supporting plate 900b or 900c, and the wavelength division multiplexer array 490 can replace the transmitting optical fiber array 450 to be supported on the first supporting protrusion 9136 of the supporting plate 900b or 900c. Since the supporting plate 900b or 900c does not need to be changed, or the wavelength division multiplexer array 490 can be fixed on the first supporting protrusion 9136 of the supporting plate 900b or 900c by slightly modifying the supporting plate 900b or 900c, the structure of the supporting plate 900b or 900c, and the assembly of the supporting plate 900b or 900c and the wavelength division multiplexer array 490 are not described in detail.

[0291] A glue dispensing boss 9135 and a first supporting boss 9136 as shown in the supporting plate 900b may be arranged between the first limiting support portion 9031 and the second limiting support portion 9032 of the supporting plate 900a, or a glue dispensing boss 9135, a first supporting boss 9136 and a glue guide groove 9134 as shown in the supporting plate 900c may be arranged.

[0292] Fig. 20 is a structural diagram of a circuit board according to some embodiments. Fig.21AFIG. 1 is an assembly diagram of a support plate and a circuit board according to some embodiments. Fig. 20 and Fig.21A As shown, in some embodiments, the circuit board 300 may include a first circuit board 301, and the first circuit board 301 may be the other side wall of the embedding opening 304. A gold finger may be formed on one end surface of the first circuit board 301. A first bonding area 3013 may be provided on the other end surface of the first circuit board 301. The first bonding area 3013 may be bonded to the receiving optical fiber array 5021 of the first light receiving component 502.

[0293] The projection area of ​​the first bonding area 3013 on the lower surface of the circuit board 300 may be located within the first supporting portion 9041 to reduce the deformation amount of the projection area of ​​the first bonding area 3013 in the circuit board 300 in the thickness direction of the circuit board 300 .

[0294] The first bonding area 3013 may include a plurality of gold-plated points, and there are gaps between the plurality of gold-plated points, so that the surface of the circuit board 300 is exposed. In addition to the gold-plated points, the bonding surface of the first bonding area 3013 and the glue also includes the surface of the circuit board 300, so that the bonding material of the glue changes from a whole piece of gold to a part of gold and a part of the circuit board. Since the bonding force of the glue to the circuit board is greater than the bonding force of the glue to gold, the glue in the first bonding area 3013 contacts the gold-plated points and the circuit board between the gold-plated points, which can not only increase the contact area between the glue and the first bonding area and the second bonding area, but also change the bonding material of the glue from the gold-plated points to the gold-plated points and the circuit board, thereby increasing the bonding force between the first bonding area and the second bonding area and the glue, thereby increasing the bonding stability of the receiving optical fiber array 5021 of the first light receiving component and the first bonding area.

[0295] In some embodiments, the other end surface of the first circuit board 301 may be provided with a first placement area 3015. The first bonding area 3013 and the first placement area 3015 may be arranged along the X-axis direction, that is, the first placement area 3015 may be located on the right side of the first bonding area 3013. The first placement area 3015 may be bonded with the transimpedance amplifier chip 5023 of the first light receiving component 502. The area between the second bonding area 3012 and the first bonding area 3013 may be provided with the light receiving chip 5022 of the first light receiving component 502.

[0296] In some embodiments, the other end surface of the first circuit board 301 may be provided with a second bonding area 3012. The second bonding area 3012 may be arranged opposite to the first bonding area 3013. The second bonding area 3012 may be bonded to the receiving optical fiber array of the second light receiving component 501.

[0297] In some embodiments, the projection area of ​​the second bonding area 3012 on the lower surface of the circuit board 300 may be located within the second support portion 9042 to reduce the deformation of the projection area of ​​the circuit board 300 where the second bonding area 3012 is located in the thickness direction of the circuit board 300 .

[0298] The second bonding area 3012 may include a plurality of gold-plated spots, with gaps between the plurality of gold-plated spots so that the surface of the circuit board 300 is exposed.

[0299] In some embodiments, the other end surface of the first circuit board 301 may be provided with a second placement area 3014. The second bonding area 3012 and the second placement area 3014 may be arranged along the X-axis direction, that is, the second placement area 3014 may be located on the right side of the second bonding area 3012. The second placement area 3014 may be bonded to the transimpedance amplifier chip of the second light receiving component 501. The area between the second bonding area 3012 and the second placement area 3014 may be provided with a light receiving chip of the second light receiving component 501.

[0300] In some embodiments, the other end surface of the first circuit board 301 may be provided with a high-frequency signal pad 3011. The high-frequency signal pad 3011 may be located between the second bonding area 3012 and the first bonding area 3013. The high-frequency signal pad 3011 may be wire-bonded to the laser chip of the laser chip array 410 to provide a high-frequency driving signal to the laser chip. The high-frequency signal pad 3011 may be connected to the DSP chip 310 through a first signal line so that the DSP chip 310 provides a high-frequency driving signal.

[0301] In some embodiments, the first placement area 3015 can be close to the gold finger of the circuit board 300 relative to the high-frequency signal pad 3011, that is, the first placement area 3015 is located on the right side of the high-frequency signal pad 3011, so that the area between the first placement area 3015 and the first bonding area 3013 is located on the right side of the high-frequency signal pad 3011, and the laser chip array 410 and the optical receiving chip 5022 of the first optical receiving component 502 can be staggered in the X-axis direction, which can not only reduce the signal crosstalk between the laser chip array 410 and the optical receiving chip 5022, but also provide sufficient wiring space for the transimpedance amplifier chip 5023 of the first optical receiving component 502.

[0302] In some embodiments, the second placement area 3014 can be close to the gold finger of the circuit board 300 relative to the high-frequency signal pad 3011, that is, the second placement area 3014 is located on the right side of the high-frequency signal pad 3011, so that the area between the second placement area 3014 and the second bonding area 3012 is located on the right side of the high-frequency signal pad 3011, and the laser chip array 410 and the optical receiving chip 5012 of the second optical receiving component 501 can be staggered in the X-axis direction, which not only reduces the signal crosstalk between the laser chip array 410 and the optical receiving chip 5012, but also provides sufficient wiring space for the transimpedance amplifier chip of the second optical receiving component 501.

[0303] In some embodiments, the circuit board 300 may include a second circuit board 302 , and the second circuit board 302 may be a side wall of the insertion opening 304 . One end of the second circuit board 302 may be connected to the other end of the first circuit board 301 .

[0304] A first solder pad 3021 and a second solder pad 3022 are formed on one side of the upper surface of the second circuit board 302 close to the insertion opening 304 (i.e., a side wall surface of the insertion opening 304). One end of the first solder pad 3021 can be connected to one output end of the driving circuit, and one end of the second solder pad 3022 can be connected to another output end of the driving circuit, so that the driving circuit is powered through the first solder pad 3021 and the second solder pad 3022.

[0305] A third pad 3023 and a fourth pad 3024 are formed on the upper surface of the second circuit board 302 near the insertion opening 304 (i.e., a side wall surface of the insertion opening 304). One end of the third pad 3023 can be connected to the input end of the MCU, and one end of the fourth pad 3024 is connected to the ground layer of the circuit board 300.

[0306] In some embodiments, a limiting notch 3025 is formed at the other end of the second circuit board 302. One side plate of the limiting notch 3025 can be arranged corresponding to the second limiting support portion 9032 to limit the position of the second circuit board 302 and the supporting plate 900 in the Y-axis direction. The other side plate of the limiting notch 3025 can be arranged corresponding to the third limiting support portion 9033 to limit the position of the second circuit board 302 and the supporting plate 900 in the X-axis direction.

[0307] In some embodiments, the circuit board 300 may include a third circuit board 303, which may be another side wall of the insertion opening. One end of the third circuit board 303 may be connected to the other end of the first circuit board 301. The third circuit board 303 may be arranged opposite to the second circuit board 302.

[0308] On one side of the upper surface of the third circuit board 303 close to the embedding port 304 (i.e., the other side wall surface of the embedding port 304), a first pad 3031 and a second pad 3032 are formed. One end of the first pad 3031 can be connected to an output end of the driving circuit, and one end of the second pad 3032 can be connected to another output end of the driving circuit, so that the driving circuit is powered through the first pad 3031 and the second pad 3032.

[0309] On one side of the upper surface of the third circuit board 303 close to the embedding port 304, a third pad 3033 and a fourth pad 3034 are formed. One end of the third pad 3033 can be connected to the input end of the MCU, and one end of the third pad 3033 is connected to the ground layer of the circuit board 300.

[0310] In some embodiments, a limiting notch 3035 is formed at the other end of the third circuit board 303. One side plate of the limiting notch 3035 can be correspondingly arranged with the first limiting support portion 9031 to limit the positions of the third circuit board 303 and the supporting plate 900 in the Y-axis direction. The other side plate of the limiting notch 3035 can be correspondingly arranged with the third limiting support portion 9033 to limit the positions of the third circuit board 303 and the supporting plate 900 in the X-axis direction.

[0311] In some embodiments, the other end of the third circuit board 303 is not connected to the other end of the second circuit board 302, so that the circuit board 300 forms an embedding port 304 with an opening, facilitating the optical fibers of the transmitting optical fiber array 450 to pass through the opening 341 of the embedding port 304 and reducing the stress damage to the optical fibers of the transmitting optical fiber array 450.

[0312] Fig.21B It is a cross-sectional view of a supporting plate and a circuit board according to some embodiments. Fig. 21C It is an assembly diagram of a supporting plate and a circuit board from another perspective according to some embodiments. As Fig.21B and Fig. 21C shown, in some embodiments, the lower surface of the circuit board 300 can be connected to the edge of the supporting plate body 901, so that the edge of the supporting plate body 901 supports the circuit board 300. Exemplarily, the lower surface of the second circuit board 302 can be connected to the edge of the supporting plate body 901, and the lower surface of the third circuit board 303 can be connected to the edge of the supporting plate body 901.

[0313] In some embodiments, the inner wall of the second circuit board 302 can be correspondingly arranged with the second limiting support portion 9032 to facilitate limiting the positions of the second limiting support portion 9032 and the circuit board 300.

[0314] In some embodiments, the inner wall of the third circuit board 303 may be arranged corresponding to the first position limiting support portion 9031 , so as to define the position of the first position limiting support portion 9031 and the circuit board 300 .

[0315] Fig. 22 is a structural diagram of a first circuit adapter board according to some embodiments. Fig.23 FIG. 4 is a cross-sectional view of the internal structure of an optical module according to some embodiments. Fig. 22 and Fig.23 As shown, in some embodiments, the first side wall of the first circuit adapter board 322 can be arranged along the length direction of the circuit board 300. The first side wall of the first circuit adapter board 322 can be wired connected to the circuit board 300 to achieve electrical connection between the circuit board 300 and the first circuit adapter board 322.

[0316] In some embodiments, the second side wall of the first circuit adapter board 322 may be disposed along the width direction of the circuit board 300. The second side wall of the first circuit adapter board 322 is disposed adjacent to the first semiconductor cooler 461. The second side wall of the first circuit adapter board 322 may be connected to the first semiconductor cooler 461 and the first thermistor 472 to achieve electrical connection between the first circuit adapter board 322 and the first semiconductor cooler 461 and the first thermistor 472.

[0317] In some embodiments, the first circuit adapter board 322 may include a first signal adapter line 3221. One end of the first signal adapter line 3221 may be connected to the first pad 3031, and the other end of the first signal adapter line 3221 may be connected to the first electrode column 4615.

[0318] In some embodiments, the first circuit adapter board 322 may include a second signal adapter line 3222 , one end of the second signal adapter line 3222 may be connected to the second pad 3032 , and the other end of the second signal adapter line 3222 may be connected to the second electrode column 4614 .

[0319] In some embodiments, the first circuit adapter board 322 may include a third signal adapter line 3223 , one end of the third signal adapter line 3223 may be connected to the third pad 3033 , and the other end of the third signal adapter line 3223 may be connected to the first thermistor 472 .

[0320] In some embodiments, the first circuit adapter board 322 may include a fourth signal adapter line 3224 , one end of the fourth signal adapter line 3224 may be connected to the fourth pad 3034 , and the other end of the fourth signal adapter line 3224 may be connected to the third substrate 474 .

[0321] There is a gap between two adjacent signal transfer lines among the first signal transfer line 3221 , the second signal transfer line 3222 , the third signal transfer line 3223 and the fourth signal transfer line 3224 to prevent a short circuit.

[0322] Similarly, the second circuit adapter board 321 may include a first signal adapter line, a second signal adapter line, a third signal adapter line and a fourth signal adapter line. The first signal adapter line connects the first solder pad 3021 and the first electrode column 4623, the second signal adapter line connects the second solder pad 3022 and the second electrode column 4624, the third signal adapter line connects the third solder pad 3023 and the second thermistor 471, and the fourth signal adapter line connects the fourth solder pad 3024 and the third substrate 473.

[0323] like Fig.21A , Fig.21B and Fig.23 As shown, the projection area of ​​the receiving fiber array 5021 and the light receiving chip 5022 of the first light receiving component 502 on the lower surface of the circuit board 300 can be located in the first support portion 9041, so as to reduce the deformation of the projection area of ​​the receiving fiber array 5021 and the light receiving chip 5022 in the circuit board 300 in the thickness direction of the circuit board 300, so that the spacing between the receiving fiber array 5021 and the light receiving chip 5022 is maintained within a preset range, thereby reducing the scattering and attenuation during the transmission of the optical signal, thereby ensuring the responsiveness of the light receiving chip 5022. Wherein, responsiveness refers to the efficiency of the light receiving chip in converting the optical signal into an electrical signal. For example, the receiving fiber array 5021 of the first light receiving component 502 is bonded to the first bonding area 3013, and the projection area of ​​the first bonding area 3013 and the area between the first bonding area 3013 and the first placement area 3015 on the lower surface of the circuit board 300 is located in the first support portion 9041.

[0324] In some embodiments, the projection area of ​​the receiving optical fiber array 5011 and the optical receiving chip 5012 of the second optical receiving component 501 on the lower surface of the circuit board 300 can be located within the second supporting portion 9042. For example, the receiving optical fiber array 5011 of the second optical receiving component 501 is bonded to the second bonding area 3012, and the projection area of ​​the second bonding area 3012 and the area between the second bonding area 3012 and the second placement area 3014 on the lower surface of the circuit board 300 is located within the second supporting portion 9042.

[0325] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Circuit boards; A light emitting component connected to the circuit board; A first light receiving component is disposed on the circuit board and is located on one side of the light emitting component; The first light receiving component and the light emitting component are arranged side by side along the width direction of the circuit board; Wherein, the light emitting component comprises: A laser chip array is arranged along the width direction of the circuit board and is used to emit optical signals; A first lens array, located in the light emitting direction of the laser chip array, and used for collimating the optical signal emitted by the laser chip array; A second lens array, located in the collimation direction of the first lens array; A transmitting optical fiber array is used to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the transmitting optical fiber array are arranged along the length direction of the circuit board; A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array; the first semiconductor refrigerator comprises: a first electrode column; A second electrode column and the first electrode column are both located between the first lens array and the second lens array; The first circuit adapter board is located between the first lens array and the second lens array; one end of the first circuit adapter board is respectively connected to the first electrode column and the second electrode column, and the other end of the first circuit adapter board is connected to the circuit board.

2. The optical module according to claim 1, characterized in that: Also includes: A first thermistor, disposed on the first semiconductor refrigerator and located between the first lens array and the second lens array; The first lens array includes a collimating lens having a light-transmitting surface. The top surface of the first thermistor is lower than the light-transmitting surface. The first thermistor is located between two adjacent collimating lenses of the first lens array.

3. The optical module according to claim 2, characterized in that: The top surface of the first circuit adapter plate, the top surface of the first electrode column, and the top surface of the second electrode column are all lower than the light-transmitting surface.

4. The optical module according to claim 1, characterized in that: The circuit board has an embedding opening; A side wall of the embedding opening is provided with: A first pad; A second soldering pad and the first soldering pad are respectively connected to the other end of the first circuit adapter board; The other side wall of the embedding opening is connected to the one side wall of the embedding opening, and the surface is provided with: DSP chip; A high-frequency signal pad, one end of which is wire-bonded to the laser chip of the laser chip array to provide a high-frequency driving signal to the laser chip, and the other end of which is connected to the DSP chip; a first bonding area, bonded to the receiving optical fiber array of the first light receiving component; The first placement area is connected to the transimpedance amplifier chip of the first light receiving component; the first placement area is far away from the embedding port relative to the first bonding area, and the transimpedance amplifier chip of the first light receiving component is connected to the DSP chip; wherein the first bonding area includes a plurality of gold-plated points, and there are gaps between the plurality of gold-plated points so that the circuit board between the plurality of gold-plated points is exposed; the first placement area is far away from the embedding port relative to the high-frequency signal pad.

5. The optical module according to claim 4, characterized in that: Also includes: A supporting plate is embedded in the embedding opening and includes: A supporting plate body, the edges of which support the circuit board, and the middle of which supports the light emitting component; The limiting support portion is used to limit the position of the circuit board on the supporting plate, and includes: A first position-limiting support portion connected to a side wall of the embedding opening; A second position-limiting support portion, arranged opposite to the first position-limiting support portion; A third position-limiting support portion, one end of which is connected to the first position-limiting support portion, and the other end of which is connected to the second position-limiting support portion; A supporting portion, used to support the circuit board, comprising: a first support portion; a second supporting portion, arranged opposite to the first supporting portion; Among them, the first bonding area, and the area between the first bonding area and the first placement area are located within the first supporting portion in the projection area on the lower surface of the circuit board; the second bonding area, and the area between the second bonding area and the second placement area are located within the second supporting portion in the projection area on the lower surface of the circuit board.

6. The optical module according to claim 4, characterized in that: The first circuit adapter board comprises: A first signal adapter wire, one end of which is connected to the first pad, and the other end of which is connected to the first electrode column; A second signal adapter wire, one end of which is connected to the second pad, and the other end of which is connected to the second electrode column; There is a gap between the first signal adapter wire and the second signal adapter wire.

7. The optical module according to claim 1, characterized in that: An isolator array is provided between the second lens array and the transmitting optical fiber array, and the isolator array is used to prevent the optical signal from returning along the original path, and the isolator array includes: Isolator; Magnetic parts, including: A supporting bottom plate, the upper surface of which is connected to the bottom surface of the isolator; A supporting plate is connected to the side of the isolator.

8. An optical module, characterized in that: include: Circuit boards; A light emitting component connected to the circuit board; Wherein, the light emitting component comprises: A laser chip array is arranged along the width direction of the circuit board and is used to emit optical signals; A first lens array, located in the light emitting direction of the laser chip array, and used for collimating the optical signal emitted by the laser chip array; A second lens array, located in the collimation direction of the first lens array; A transmitting optical fiber array is used to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the transmitting optical fiber array are arranged along the length direction of the circuit board; A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array; the first semiconductor refrigerator comprises: a first electrode column; A second electrode column and the first electrode column are both located between the first lens array and the second lens array; The first circuit adapter board is located between the first lens array and the second lens array; one end of the first circuit adapter board is respectively connected to the first electrode column and the second electrode column, and the other end of the first circuit adapter board is connected to the circuit board.

9. An optical module, characterized in that: include: A circuit board having an embedding opening; A supporting plate is embedded in the embedding opening, comprising: Limiting support part; A light emitting component, carried on the supporting plate; Wherein, the light emitting component comprises: A laser chip array is arranged along the width direction of the circuit board and is used to emit optical signals; A first lens array, located in the light emitting direction of the laser chip array, and used for collimating the optical signal emitted by the laser chip array; A second lens array, located in the collimation direction of the first lens array; A transmitting optical fiber array is used to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the transmitting optical fiber array are arranged along the length direction of the circuit board; A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array; A first circuit adapter board, located between the first lens array and the second lens array, electrically connecting the circuit board and the first semiconductor refrigerator; Wherein, the position-limiting support portion comprises a glue-dispensing boss, on which at least two first support bosses are arranged, the at least two first support bosses support the transmitting optical fiber array, and the area between the two first support bosses is glue-dispensed.

10. The optical module according to claim 9, characterized in that: A glue guiding groove is arranged around the glue dispensing boss, the glue guiding groove is recessed relative to the glue dispensing boss, and the glue guiding groove is used to guide the flow of glue.

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