Intelligent glasses and processing technology thereof

Abstract

The invention discloses intelligent glasses and a processing technology thereof, the intelligent glasses comprise a frame body, the frame body is provided with two lens installation areas arranged at an interval and a connecting part located between the two lens installation areas, and an installation space used for accommodating electronic components is formed in the frame body; a heat dissipation flow channel is further formed in the frame body, the heat dissipation flow channel comprises a first heat dissipation section corresponding to the connecting part and a second heat dissipation section communicated with the first heat dissipation section, and the second heat dissipation section surrounds the periphery of at least one lens mounting area; the heat dissipation flow channel is filled with a two-phase heat dissipation medium, and the two-phase heat dissipation medium is subjected to phase change and flows between the first heat dissipation section and the second heat dissipation section, so that heat generated by the electronic element is dispersed into the second heat dissipation section from the first heat dissipation section. According to the technical scheme, the heat dissipation effect of the intelligent glasses is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of smart devices, and in particular to smart glasses and a processing technology thereof. Background Art

[0002] Smart glasses include VR glasses or AR glasses. Usually, the electronic components (such as chips) of smart glasses are arranged in the nose pad area between two lens frames. The heat generated during the operation of the electronic components is concentrated in the nose pad area. The existing heat dissipation solution is to attach a heat conductive plate or a heat conductive material such as graphene to the nose pad area of ​​the frame. However, heat dissipation is achieved by exchanging heat between the outer shell of the nose pad area and the outside air. However, this heat dissipation method has poor heat dissipation effect, does not utilize the entire frame for heat dissipation, and easily causes the temperature of the nose pad area of ​​the smart glasses to be too high, seriously affecting the performance and user experience of the smart glasses. Summary of the invention

[0003] The main purpose of the present invention is to provide a pair of smart glasses, aiming to improve the heat dissipation effect of the smart glasses.

[0004] To achieve the above object, the smart glasses proposed by the present invention include:

[0005] A frame body, wherein the frame body has two lens mounting areas spaced apart from each other and a connecting portion between the two lens mounting areas, and an installation space for accommodating electronic components is formed in the frame body;

[0006] A heat dissipation channel is also formed in the frame, and the heat dissipation channel includes a first heat dissipation section corresponding to the connecting portion, and a second heat dissipation section connected to the first heat dissipation section, and the second heat dissipation section surrounds the periphery of at least one of the lens mounting areas;

[0007] The heat dissipation channel is filled with a two-phase heat dissipation medium, which undergoes phase change and flows between the first heat dissipation section and the second heat dissipation section to disperse the heat generated by the electronic component from the first heat dissipation section to the second heat dissipation section.

[0008] In one embodiment of the present invention, a guide structure is formed on the inner wall surface of the heat dissipation channel, and the guide structure can guide the heat dissipation medium in a liquid state to flow from the second heat dissipation section to the first heat dissipation section.

[0009] In one embodiment of the present invention, the flow-guiding structure is further formed with a plurality of irregular sub-flow channels, and the sub-flow channels are used to increase the contact area of ​​the heat dissipation medium flowing through the second heat dissipation segment.

[0010] In one embodiment of the present invention, the second heat dissipation segment is further formed with a flow-blocking structure for preventing the heat dissipation medium in a liquid state from flowing back to the second heat dissipation segment.

[0011] In one embodiment of the present invention, a sintered layer is formed on the inner wall surface of the heat dissipation channel, and the guide structure is formed on the sintered layer;

[0012] And / or, a wire mesh layer is formed on the inner wall surface of the heat dissipation channel, and the guide structure is formed on the wire mesh layer.

[0013] In one embodiment of the present invention, the frame includes:

[0014] A main frame, the main frame having a first surface and a second surface arranged opposite to each other, the first surface being concavely provided with a mounting groove, and the second surface being concavely provided with a heat dissipation groove;

[0015] A first cover body connected to the first surface and sealing the opening of the installation groove to form the installation space;

[0016] The second cover is connected to the second surface and seals the opening of the heat dissipation slot to form the heat dissipation channel.

[0017] In one embodiment of the present invention, a sintering layer is formed on the groove wall of the heat dissipation groove and the inner surface of the second cover;

[0018] Alternatively, a wire mesh layer is formed on the groove wall of the heat dissipation groove and the inner surface of the second cover;

[0019] Alternatively, one of the groove wall of the heat dissipation groove and the inner surface of the second cover body is provided with a sintered layer, and the other is provided with a wire mesh layer.

[0020] In one embodiment of the present invention, temple mounting portions are formed at both ends of the main frame, and at least one of the temple mounting portions is also provided with a wire passing hole, the wire passing hole is connected to the mounting groove and forms a wire passing channel, and the wire passing channel is arranged around the periphery of the lens mounting area.

[0021] The present invention also proposes a processing technology for smart glasses, comprising the following steps:

[0022] A heat dissipation groove is formed on the surface of the main frame, the heat dissipation groove includes a first heat dissipation section corresponding to the connecting portion, and a second heat dissipation section connected to the first heat dissipation section, the second heat dissipation section surrounds the periphery of at least one lens mounting area;

[0023] A structural layer is formed on the surface of the heat sink by a sintering process or a wire mesh process;

[0024] A structural layer is formed on the surface of the second cover body by a sintering process or a wire mesh process;

[0025] Using the second cover to seal the opening of the heat dissipation slot to form a heat dissipation channel;

[0026] The heat dissipation groove is filled with a two-phase heat dissipation medium.

[0027] In one embodiment of the present invention, the step of sealing the opening of the heat dissipation slot with the second cover to form the heat dissipation channel further includes:

[0028] The heat dissipation channel is vacuumed.

[0029] The smart glasses of the present invention are provided with installation spaces and heat dissipation channels for accommodating electronic components in the frame, wherein the heat dissipation channel includes a first heat dissipation section corresponding to the connection portion, and a second heat dissipation section surrounding the periphery of at least one lens installation area, and the second heat dissipation section is connected to the first heat dissipation section; the heat dissipation channel is filled with a two-phase heat dissipation medium, and the two-phase heat dissipation medium undergoes a phase change and flows between the first heat dissipation section and the second heat dissipation section to disperse the heat generated by the electronic components from the first heat dissipation section to the second heat dissipation section. The technical solution of the present invention can effectively utilize the space of the frame other than the installation space for accommodating electronic components for heat dissipation, so that the effective heat dissipation area is greatly increased, effectively avoiding the situation where the temperature of a local area of ​​the smart glasses is too high, while also improving the heat dissipation effect, and improving the heat dissipation performance and user experience of the smart glasses. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0031] Figure 1 This is a schematic diagram of the structure of an embodiment of the smart glasses of the present invention;

[0032] Figure 2 for Figure 1 A schematic diagram of the structure of the smart glasses from another perspective;

[0033] Figure 3 It is a structural schematic diagram of another embodiment of the smart glasses of the present invention;

[0034] Figure 4 This is a structural schematic diagram of another embodiment of the smart glasses of the present invention;

[0035] Figure 5 A process flow chart of the smart glasses of the present invention.

[0036] Description of Figure Numbers:

[0037] Label name Label name 10 Frame 17 Lens mounting area 11 Main frame 19 Connection 1111 Mounting slot 20 Heat dissipation channel 1131 Heat sink 21 The first heat dissipation section 115 Temple mounting part 23 Second heat dissipation section 1151 Cable hole 30 Electronic components 13 First cover 40 Flexible circuit board 15 Second cover 100 Smart glasses

[0038] 10. frame; 15. second cover; 11. main frame; 17. lens mounting area; 19. connection part; 1111. mounting groove; 20. heat dissipation channel; 21. first heat dissipation section; 1113. heat dissipation groove; 23. second heat dissipation section; 115. temple mounting part; 30. electronic component; 1151. wire hole; 40. flexible circuit board; 13. first cover; 100. smart glasses;

[0039] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0044] The present invention provides a pair of smart glasses 100, which can be AR glasses, VR glasses, MR glasses, etc. Usually, the heat generated by the electronic components 30 (such as chips) in the smart glasses 100 when working is concentrated in the nose pad area. The existing heat dissipation solution is to attach a heat conductive plate or a heat conductive material such as graphene to the nose pad area of ​​the frame, but the heat dissipation effect of only relying on the heat exchange between the shell in the nose pad area and the outside air is poor, and it is also easy to cause the temperature of the smart glasses 100 in the nose pad area to be too high, which seriously affects the performance of the smart glasses 100 and the user experience.

[0045] Please refer to Figures 1 to 4 In one embodiment of the present invention, the smart glasses 100 include:

[0046] A frame 10, wherein the frame 10 has two lens mounting areas 17 spaced apart from each other, and a connecting portion 19 located between the two lens mounting areas 17, and an installation space for accommodating an electronic component 30 is formed in the frame 10;

[0047] A heat dissipation channel 20 is also formed in the frame 10, and the heat dissipation channel 20 includes a first heat dissipation section 21 corresponding to the connecting portion 19, and a second heat dissipation section 23 connected to the first heat dissipation section 21, and the second heat dissipation section 23 surrounds the outer periphery of at least one of the lens mounting areas 17;

[0048] The heat dissipation channel 20 is filled with a two-phase heat dissipation medium, which undergoes a phase change and flows between the first heat dissipation section 21 and the second heat dissipation section 23 to disperse the heat generated by the electronic components from the first heat dissipation section 21 to the second heat dissipation section 23 .

[0049] The smart glasses 100 of the present invention respectively form an installation space for accommodating the electronic components 30 and a heat dissipation channel 20 in the frame 10, wherein the heat dissipation channel 20 includes a first heat dissipation section 21 corresponding to the connection portion 19, and a second heat dissipation section 23 surrounding the outer periphery of at least one lens installation area 17, and the second heat dissipation section 23 is connected to the first heat dissipation section 21; the heat dissipation channel 20 is filled with a two-phase heat dissipation medium, and the two-phase heat dissipation medium undergoes a phase change and flows between the first heat dissipation section 21 and the second heat dissipation section 23 to disperse the heat generated by the electronic components from the first heat dissipation section 21 to the second heat dissipation section 23. In the technical solution of the present invention, the space of the frame 10 other than the installation space for accommodating the electronic components 30 can be effectively utilized for heat dissipation, so that the effective heat dissipation area is greatly increased, and the situation of excessive temperature in a local area of ​​the smart glasses 100 is effectively avoided, while the heat dissipation effect is also improved, and the heat dissipation performance and user experience of the smart glasses 100 are improved.

[0050] In one embodiment of the present invention, the second heat dissipation section 23 may be arranged around the periphery of a lens mounting area 17. That is to say, in this embodiment, the structure of one of the lens mounting areas 17 of the frame may be used for heat dissipation. Although this heat dissipation solution does not utilize the space of the entire frame, compared with the existing solution that only utilizes the connecting portion 19 corresponding to the nose pad area, the heat dissipation area of ​​the frame 10 utilized by it is larger, thereby avoiding excessive concentration of heat in the nose pad area and effectively improving the heat dissipation effect.

[0051] In another embodiment of the present invention, the second heat dissipation section 23 may be arranged around the periphery of the two lens mounting areas 17. That is to say, in this embodiment, the structure of the two lens mounting areas 17 of the frame may be used for heat dissipation. This heat dissipation solution effectively utilizes the space of the entire frame. Compared with the heat dissipation solution using the connecting portion 19 corresponding to the nose pad area and one lens mounting area 17, the heat dissipation area of ​​the frame 10 is further increased, thereby effectively avoiding excessive concentration of heat in the nose pad area and achieving a better heat dissipation effect.

[0052] In the embodiment of the present invention, the installation space for accommodating the electronic component 30 and the heat dissipation channel 20 for accommodating the two-phase heat dissipation medium are two independent spaces. For example, in a specific embodiment, the installation space and the heat dissipation channel 20 are respectively arranged on two opposite surfaces of the frame 10, which is convenient for processing the installation space and the heat dissipation channel 20, and at the same time can make the installation space larger, providing a suitable installation space for the electronic component 30; the surface area of ​​the heat dissipation channel 20 is larger, which can make the contact between the two-phase heat dissipation medium and the heat dissipation channel 20 more sufficient, thereby improving the heat dissipation effect.

[0053] In another specific embodiment, the installation space and the heat dissipation channel 20 are also arranged on a surface of the frame 10. Although this design allows the heat dissipation channel 20 to be arranged around the periphery of the installation space, this structure will make the processing of the installation space and the heat dissipation channel 20 difficult, and will also cause the installation space to be smaller.

[0054] Please refer to Figure 3 and Figure 4 In one embodiment of the present invention, the frame 10 includes:

[0055] A main frame 11, wherein the main frame 11 has a first surface and a second surface that are arranged opposite to each other, wherein the first surface is recessed with a mounting groove 1111, and the second surface is recessed with a heat dissipation groove 1131; a first cover body 13, connected to the first surface, and sealing the opening of the mounting groove 1111 to form the mounting space; a second cover body 15, connected to the second surface, and sealing the opening of the heat dissipation groove 1131 to form the heat dissipation channel.

[0056] In one embodiment of the present invention, by configuring the frame body 10 to include a main frame 11, a first cover body 13, and a second cover body 15, the mounting groove 1111 and the heat dissipation groove 1131 can be formed directly on the first surface and the second surface of the main frame 11 respectively disposed opposite to each other by a material removal process, thereby reducing the difficulty of processing and forming the mounting groove 1111 and the heat dissipation groove 1131.

[0057] It should be noted that the main frame 11 is made of metal, which has good thermal conductivity and a relatively stable structure, and will not deform even at high temperatures. In addition, the main frame 11 is made of metal, and can be subjected to secondary processing such as sintering or screen processing.

[0058] Among them, the structure formed on the inner wall surface of the heat dissipation groove 1131 through the sintering process is a sintered layer. It can be understood that the sintering process refers to the conversion of powdered materials into a dense body through high-temperature sintering. The dense body is attached to the inner wall surface of the heat dissipation groove 1131. The dense body is actually a polycrystalline material, and its microstructure is composed of crystals, glass and pores. The sintering process directly affects the grain size, pore size and grain boundary shape and distribution in the microstructure, thereby affecting the performance of the material.

[0059] The sintered layer formed by the sintering process can, due to its grain size, pore size, grain boundary shape and distribution, on the one hand increase the contact area between the heat dissipation medium and the inner wall surface of the heat dissipation groove 1131; on the other hand, it can also be formed into a guide structure to provide power for the circulation of the heat dissipation medium in the heat dissipation groove 1131, ensuring that the heat dissipation medium can achieve unidirectional circulation in the heat dissipation groove 1131, so as to bring the heat generated by the electronic component 30 from the area concentrated in the connecting portion 19 to the entire frame 10, thereby improving the heat dissipation efficiency.

[0060] It can be understood that the guide structure mainly provides guidance for the liquid heat dissipation medium, promoting the liquid heat dissipation medium to flow from the second heat dissipation section 23 to the first heat dissipation section 21, that is, from other positions of the frame 10 back to the vicinity of the installation space corresponding to the electronic component 30, so as to improve the heat dissipation efficiency.

[0061] In one embodiment, the flow-guiding structure may be a grain boundary shape formed between grains, the sub-channel may be a pore formed by the grains, etc., and the corresponding flow-blocking structure may be a structure formed between grains to prevent liquid reflux.

[0062] It should be noted that the flow-guiding structure, the flow-blocking structure and the sub-channel can all be microstructures inside the polycrystalline material of the sintered layer. The specific structure is not shown in a schematic diagram. As long as the sintered layer can guide the flow direction of the heat dissipation medium, increase the contact area of ​​the heat dissipation medium flowing through the second heat dissipation section 23, and prevent the backflow of the heat dissipation medium, any structure is acceptable.

[0063] In another embodiment, in addition to the sintering process, a wire mesh layer may be formed on the inner wall surface of the heat dissipation slot 1131 through a wire mesh process. Although the wire mesh process is different from the sintering process, the wire mesh layer finally formed can also form a guide structure for guiding the heat dissipation medium in a liquid state to flow from the second heat dissipation segment 23 to the first heat dissipation segment 21; each guide structure also forms a sub-channel for increasing the contact area of ​​the heat dissipation medium flowing through the second heat dissipation segment 23, and a flow blocking structure for preventing the heat dissipation medium in a liquid state from flowing back to the second heat dissipation segment 23 is formed in the corresponding second heat dissipation segment 23.

[0064] Furthermore, in one embodiment of the present invention, the first cover 13 and the second cover 15 are also made of metal, so that the first cover 13 and the second cover 15 can be connected to the main frame 11 by welding, ensuring the reliability and sealing of the connection between the main frame 11 and the first cover 13 and the second cover 15, especially the heat dissipation channel 20 formed between the second cover 15 and the main frame 11, which needs to ensure good sealing to avoid leakage of the heat dissipation medium. In addition, the first cover 13 and the second cover 15 are also made of metal, which is also convenient for the first cover 13 and the second cover 15 to perform secondary processing such as sintering or screen-forming on the main frame 11.

[0065] In one embodiment of the present invention, the groove wall of the heat dissipation groove 1131 and the inner surface of the second cover body 15 may be formed with a sintered layer, so that the inner wall surface of the entire heat dissipation channel 20 is formed with a guide structure, a flow blocking structure and a sub-channel structure through sintering to increase the heat dissipation effect.

[0066] In another embodiment of the present invention, the groove wall of the heat dissipation groove 1131 and the inner surface of the second cover body 15 may be formed with a wire mesh layer. In this way, the inner wall surface of the entire heat dissipation channel 20 is formed with a guide structure, a flow blocking structure and a sub-channel structure through the wire mesh, and its heat dissipation effect is similar to the heat dissipation effect when the inner wall surface of the entire heat dissipation channel 20 is a sintered layer.

[0067] In another embodiment of the present invention, a sintered layer may be provided on the groove wall of the heat dissipation groove 1131, and a wire mesh layer may be formed on the inner surface of the second cover body 15; or a wire mesh layer may be provided on the groove wall of the heat dissipation groove 1131, and a sintered layer may be formed on the inner surface of the second cover body 15. In this way, the inner wall surface of the entire heat dissipation channel 20 may form a flow-guiding structure, a flow-blocking structure and a sub-channel structure with different structures, thereby improving the heat dissipation effect.

[0068] In one embodiment of the present invention, the flow guide structure, the flow blocking structure and the sub-channel structure can be formed only on the groove wall of the heat dissipation groove 1131 through a sintering process, and the corresponding inner wall surface of the second cover body 15 is not sintered or screened. However, the heat dissipation effect of such a solution is slightly worse than the solution in which the inner wall surface of the second cover body 15 is also sintered. However, such a solution can simplify the processing technology of the frame 10.

[0069] Please refer to Figure 3 and Figure 4 In one embodiment of the present invention, temple mounting portions 115 are formed at both ends of the main frame 11, and at least one of the temple mounting portions 115 is also provided with a wire passing hole 1151, and the wire passing hole 1151 is connected to the mounting groove 1111 to form a wire passing channel, and the wire passing channel is arranged around the periphery of the lens mounting area 17.

[0070] In the technical solution of one embodiment of the present invention, temple mounting parts 115 are also provided at both ends of the main frame 11 to facilitate the connection between the main frame 11 and the temples. It can be understood that the temples and the temple mounting parts 115 can be connected by plugging, hinged connection, etc., and the connection method between the temples and the temple mounting parts 115 is not limited here. The temple mounting parts 115 are also formed with wire holes 1151 to facilitate the electrical connection of the power supply or controller set on the temples with the electronic components 30 through cables. It can be understood that the number of wiring holes can be only one, which is set at one end of the main frame 11; the number of wiring holes can also be two, and the two wiring holes are respectively set at both ends of the main frame 11. In this embodiment, the electronic components 30 are connected through a flexible circuit board 40, and the flexible circuit board 40 is distributed in the mounting groove 1111. Before the mounting groove 1111 processes the corresponding connection part 19 area, it also corresponds to the outer periphery of the two lens mounting areas 17. In this way, the mounting groove 1111 can provide a space for the flexible circuit board 40, so that the space on the main frame 11 can be reasonably used. In addition, the mounting groove 1111 and the heat dissipation groove 1131 are respectively arranged on two opposite surfaces of the main frame 11, so that the heat in the mounting groove 1111 can be quickly transferred to the heat dissipation groove 1131, and the temperature can be quickly reduced through the heat dissipation medium, further improving the heat dissipation effect.

[0071] Reference Figure 5 The present invention also proposes a processing technology of smart glasses 100, comprising the following steps:

[0072] S10: A heat dissipation groove 1131 is formed on the surface of the main frame 11, and the heat dissipation groove 1131 includes a first heat dissipation section 21 corresponding to the connecting portion 19, and a second heat dissipation section 23 connected to the first heat dissipation section 21, and the second heat dissipation section 23 surrounds the outer periphery of at least one lens mounting area 17;

[0073] S20: forming a structural layer on the surface of the heat dissipation slot 1131 by a sintering process or a screen process;

[0074] S30: forming a structural layer on the surface of the second cover body 15 by a sintering process or a screen process;

[0075] S40: sealing the opening of the heat dissipation slot 1131 with the second cover 15 to form a heat dissipation channel;

[0076] S50: The heat dissipation groove 1131 is filled with a two-phase heat dissipation medium.

[0077] In one embodiment of the present invention, the frame 10 is made of metal, and a heat dissipation groove 1131 is formed on one surface of the frame 10 by removing material, wherein the heat dissipation groove 1131 includes a first heat dissipation segment 21 corresponding to the connecting portion 19, and a second heat dissipation segment 23 surrounding the periphery of at least one lens mounting area 17, and the second heat dissipation segment 23 is connected to the first heat dissipation segment 21.

[0078] The frame 10 is then subjected to secondary processing, which may be performed by a sintering process or a wire mesh process, so that a sintered layer or a wire mesh layer is formed on the surface of the heat dissipation slot 1131, wherein the structural layer formed by the sintering or wire mesh process includes a flow guide structure, a sub-channel, and a flow blocking structure.

[0079] Similarly, the shape of the second cover body 15 is compatible with the shape of the main frame 11, and the material of the second cover body 15 is also metal. The second cover body 15 can also adopt a sintering process or a wire mesh process to form a structural layer on its surface with the same surface structure or function as the heat dissipation groove 1131. When the second cover body 15 seals the opening of the heat dissipation groove 1131 and forms a heat dissipation channel 20, the inner wall surface of the entire heat dissipation channel 20 is formed with a guide structure, a sub-channel and a flow-blocking structure, etc., which can promote the unidirectional circulation flow of the heat dissipation medium in the heat dissipation channel 20 to ensure that the heat dissipation medium can disperse the heat generated by the electronic component 30 from the connection part 19 area to the entire frame, effectively utilizing the space of the entire frame 10 for heat dissipation, avoiding excessive concentration of heat in the nose pad area, and effectively improving the heat dissipation effect.

[0080] It should be noted that the steps of sintering or screen-processing the frame 10 and the second cover 15 can be performed simultaneously without any order, as long as the inner wall surface of the heat dissipation channel 20 can meet the requirements of guiding and blocking the heat dissipation medium and increasing the contact area.

[0081] In one embodiment of the present invention, when the second cover 15 is used to seal the opening of the heat dissipation slot 1131, the second cover 15 can be connected to the main frame 11 by welding, wherein the welding includes traditional brazing and laser welding, etc., which is not limited here.

[0082] In one embodiment, the first cover body 13 and the main frame 11 may be connected by welding, or the first cover body 13 may be connected to the main frame 11 by snap-fitting or interference fit, which is not limited here.

[0083] In one embodiment of the present invention, in the step of sealing the opening of the heat dissipation slot 1131 with the second cover 15 to form the heat dissipation channel, it also includes: vacuumizing the heat dissipation channel. In one embodiment of the present invention, the second cover 15 is connected to the frame 10 by welding, and the opening of the heat dissipation slot 1131 is sealed to form the heat dissipation channel at the same time of welding. At this time, air is also formed in the heat dissipation channel 20 formed. At this time, the heat dissipation channel is vacuumized, and the vacuumization can remove the air in the heat dissipation channel 20. At the same time, the sealing of the heat dissipation channel 20 can also be detected, so as to avoid the leakage of the heat dissipation medium after the heat dissipation medium is filled.

[0084] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A kind of smart glasses, It is characterized in that include: A frame body, wherein the frame body has two lens mounting areas spaced apart from each other and a connecting portion between the two lens mounting areas, and an installation space for accommodating electronic components is formed in the frame body; A heat dissipation channel is also formed in the frame, and the heat dissipation channel includes a first heat dissipation section corresponding to the connecting portion, and a second heat dissipation section connected to the first heat dissipation section, and the second heat dissipation section surrounds the periphery of at least one of the lens mounting areas; The heat dissipation channel is filled with a two-phase heat dissipation medium, which undergoes phase change and flows between the first heat dissipation section and the second heat dissipation section to disperse the heat generated by the electronic component from the first heat dissipation section to the second heat dissipation section.

2. The smart glasses as claimed in claim 1, It is characterized in that The inner wall surface of the heat dissipation channel is formed with a flow guiding structure, and the flow guiding structure can guide the heat dissipation medium in a liquid state to flow from the second heat dissipation section to the first heat dissipation section.

3. The smart glasses as claimed in claim 2, It is characterized in that The flow-guiding structure is further formed with a plurality of irregular sub-flow channels, and the sub-flow channels are used to increase the contact area of ​​the heat dissipation medium flowing through the second heat dissipation section.

4. The smart glasses as claimed in claim 2, It is characterized in that The second heat dissipation section is also formed with a flow blocking structure for preventing the heat dissipation medium in a liquid state from flowing back to the second heat dissipation section.

5. The smart glasses as claimed in claim 2, It is characterized in that A sintered layer is formed on the inner wall surface of the heat dissipation channel, and the flow guide structure is formed on the sintered layer; And / or, a wire mesh layer is formed on the inner wall surface of the heat dissipation channel, and the guide structure is formed on the wire mesh layer.

6. The smart glasses as claimed in claim 2, It is characterized in that The frame comprises: A main frame, the main frame having a first surface and a second surface arranged opposite to each other, the first surface being concavely provided with a mounting groove, and the second surface being concavely provided with a heat dissipation groove; A first cover body connected to the first surface and sealing the opening of the installation groove to form the installation space; The second cover is connected to the second surface and seals the opening of the heat dissipation slot to form the heat dissipation channel.

7. The smart glasses as claimed in claim 6, It is characterized in that A sintered layer is formed on the groove wall of the heat dissipation groove and the inner surface of the second cover; Alternatively, a wire mesh layer is formed on the groove wall of the heat dissipation groove and the inner surface of the second cover; Alternatively, one of the groove wall of the heat dissipation groove and the inner surface of the second cover body is provided with a sintered layer, and the other is provided with a wire mesh layer.

8. The smart glasses as claimed in claim 6, It is characterized in that Temple mounting parts are formed at both ends of the main frame, and at least one of the temple mounting parts is also provided with a wire passing hole, which is connected to the mounting groove to form a wire passing channel, and the wire passing channel is arranged around the periphery of the lens mounting area.

9. A processing technology for smart glasses, It is characterized in that The following steps are involved: A heat dissipation groove is formed on the surface of the main frame, the heat dissipation groove includes a first heat dissipation section corresponding to the connecting portion, and a second heat dissipation section connected to the first heat dissipation section, the second heat dissipation section surrounds the periphery of at least one lens mounting area; A structural layer is formed on the surface of the heat sink by a sintering process or a wire mesh process; A structural layer is formed on the surface of the second cover body by a sintering process or a wire mesh process; Using the second cover to seal the opening of the heat dissipation slot to form a heat dissipation channel; The heat dissipation groove is filled with a two-phase heat dissipation medium.

10. The processing technology of the smart glasses as claimed in claim 9, It is characterized in that The step of sealing the opening of the heat dissipation slot with the second cover to form the heat dissipation channel further includes: The heat dissipation channel is vacuumed.

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