Display module and manufacturing method thereof

Abstract

The invention provides a display module. The display module comprises a display substrate, a bonding layer and a coil substrate. The display substrate comprises an insulating layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit, the first lamp bead and the second lamp bead are arranged on one side of the insulating layer side by side, the first circuit and the second circuit are arranged on the other side of the insulating layer side by side, the first lamp bead is electrically connected with the first circuit, and the second lamp bead is electrically connected with the second circuit. The bonding layer is arranged on the side, provided with the first circuit and the second circuit, of the display substrate, and open holes are formed in the bonding layer in a penetrating mode. The coil substrate is arranged on the side, away from the first circuit and the second circuit, of the bonding layer, the coil substrate covers the open hole to form a closed cavity in a surrounding mode, and the coil substrate comprises a coil, a magnetic insulating layer and a suspension part. The coil is arranged on the magnetic insulating layer, the suspension part is movably arranged in the closed cavity through electromagnetic induction with the coil, and then connection and disconnection of the first circuit and the second circuit are achieved. In addition, the invention further provides a manufacturing method of the display module.

Description

Technical Field

[0001] The present application relates to a display field, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] Micro-LEDs are used as the backlight source of the display screen. By increasing the number of backlight partitions and lamp beads, the contrast and brightness can be improved. More backlight partitions can achieve delicate brightness control; more lamp beads, higher brightness and more even distribution.

[0003] At present, each additional backlight partition requires independent wiring and parts, which makes the circuit board design complicated. In addition, when pursuing higher resolution, wiring density and layout become challenges, limiting the increase in the number of lamp beads. Summary of the invention

[0004] In view of this, it is necessary to provide a display module that can simplify wiring and reduce parts, while increasing the number of lamp beads and improving display performance.

[0005] In addition, it is also necessary to provide a method for manufacturing a display module.

[0006] A method for manufacturing a display module, comprising the steps of:

[0007] A display substrate is provided, which includes an insulating layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit, wherein the first lamp bead and the second lamp bead are arranged side by side on one side of the insulating layer, and the first circuit and the second circuit are arranged side by side on the other side of the insulating layer, the first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit.

[0008] An adhesive layer is disposed on one side of the display substrate where the first circuit and the second circuit are disposed. An opening is disposed through the adhesive layer, and a portion of the first circuit and a portion of the second circuit are exposed in the opening.

[0009] A coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit, the coil substrate covers the opening to enclose and form a closed cavity, the coil substrate includes a magnetic insulation layer, a coil and a suspension member, the coil is arranged on the magnetic insulation layer, the magnetic insulation layer has an external magnetic field, and the suspension member is movably arranged in the closed cavity, wherein the display module includes a first state and a second state,

[0010] In the first state, a first high-frequency current flows through the coil, the suspension element induces the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, and the first Lorentz force is greater than the gravity of the suspension element, so that the two ends of the suspension element are connected to the first circuit and the second circuit respectively, so that the first lamp bead is electrically connected to the second lamp bead.

[0011] In the second state, a second high-frequency current flows through the coil, and the second high-frequency current is smaller than the first high-frequency current. The suspension element induces the second high-frequency current and generates a second eddy current. The second eddy current forms a second Lorentz force in the external magnetic field, and the second Lorentz force is smaller than the gravity of the suspension element, so that the two ends of the suspension element are separated from the first circuit and the second circuit respectively, so that the first lamp bead is electrically disconnected from the second lamp bead.

[0012] In some embodiments, the display substrate further includes a first conductive body and a second conductive body buried in the insulating layer, the first conductive body connecting the first lamp bead and the first circuit, and the second conductive body connecting the second lamp bead and the second circuit. The manufacturing method of the display substrate includes the steps of: providing a first copper-clad substrate, the first copper-clad substrate including the insulating layer and a first copper foil layer arranged on one side of the insulating layer. Etching the first copper foil layer to form a first circuit layer, the first circuit layer including the first circuit and the second circuit. Etching the insulating layer to form a first opening and a second opening, part of the first circuit is exposed in the first opening, and part of the second opening is exposed in the second opening. The first conductive body is arranged in the first opening, and the first circuit is connected to one end of the first conductive body. The second conductive body is arranged in the second opening, and the second circuit is connected to one end of the second conductive body. The first lamp bead and the second lamp bead are arranged on the side of the insulating layer away from the first circuit layer, the first lamp bead is connected to the other end of the first conductive body, and the second lamp bead is connected to the other end of the second conductive body, to obtain the display substrate.

[0013] In some embodiments, the coil substrate further includes an active element, the active element is disposed on a side of the magnetic insulation layer away from the closed cavity, the active element is electrically connected to the coil, and the manufacturing method of the coil substrate includes the steps of: providing a second copper-clad substrate, a first carrier of the second copper-clad substrate, and a second copper foil layer disposed on one side of the first carrier. Etching the second copper foil layer to form a second circuit layer, the second circuit layer includes the coil, the coil has a coil groove, and a portion of the first carrier is exposed in the coil groove. The magnetic insulation layer is disposed on the second circuit layer, and a portion of the magnetic insulation layer is filled in the coil groove. The first carrier is removed so that the coil is exposed on one side of the magnetic insulation layer. The suspension is disposed on the coil, and the active element is disposed on a side of the magnetic insulation layer away from the suspension to obtain the coil substrate.

[0014] In some embodiments, after the step of "removing the first carrier plate" and before the step of "arranging the suspension member on the coil", the step further includes: arranging a second carrier plate on the side of the magnetic insulation layer away from the suspension member. After the step of "arranging a coil substrate on the side of the adhesive layer away from the first circuit and the second circuit", the step further includes: removing the second carrier plate so that the magnetic insulation layer is exposed. A slot is arranged on the side of the magnetic insulation layer away from the suspension member, and a portion of the coil is exposed in the slot, and the active component is arranged on the magnetic insulation layer, the active component includes a body and a pin connected to the body, and the pin is inserted into the slot to electrically connect the coil.

[0015] In some embodiments, the active component includes a control chip.

[0016] In some embodiments, the material of the suspension element is graphene.

[0017] A display module includes a display substrate, an adhesive layer and a coil substrate. The display substrate includes an insulating layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit. The first lamp bead and the second lamp bead are arranged side by side on one side of the insulating layer, and the first circuit and the second circuit are arranged side by side on the other side of the insulating layer. The first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit. The adhesive layer is arranged on the side of the display substrate where the first circuit and the second circuit are arranged. The adhesive layer is penetrated with openings, and part of the first circuit and part of the second circuit are exposed in the openings. The coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit. The coil substrate covers the openings to enclose and form a closed cavity. The coil substrate includes a coil, a magnetic insulating layer and a suspension. The coil is arranged on the magnetic insulating layer. The magnetic insulating layer has an external magnetic field. The suspension can be movably arranged in the closed cavity. The display module includes a first state and a second state.

[0018] In the first state, a first high-frequency current flows through the coil, the suspension element induces the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, and the first Lorentz force is greater than the gravity of the suspension element, so that the two ends of the suspension element are connected to the first circuit and the second circuit respectively, so that the first lamp bead is electrically connected to the second lamp bead.

[0019] In the second state, a second high-frequency current flows through the coil, and the second high-frequency current is smaller than the first high-frequency current. The suspension element induces the second high-frequency current and generates a second eddy current. The second eddy current forms a second Lorentz force in the external magnetic field, and the second Lorentz force is smaller than the gravity of the suspension element, so that the two ends of the suspension element are separated from the first circuit and the second circuit respectively, so that the first lamp bead is electrically disconnected from the second lamp bead.

[0020] In some embodiments, the coil substrate further includes an active element, the active element is disposed on a side of the magnetic insulation layer away from the closed cavity, and the active element is electrically connected to the coil.

[0021] In some embodiments, a slot is provided on the side of the magnetic insulation layer facing away from the closed cavity, and a portion of the coil is exposed in the slot. The active element includes a main body and pins connected to the main body. The main body is provided on the side of the magnetic insulation layer facing away from the closed cavity, and the pins are inserted into the slot and electrically connected to the coil.

[0022] In some embodiments, the suspension element includes a suspension body and two contacts disposed on one side of the suspension body, and the two contacts are disposed on a side of the suspension body facing away from the coil.

[0023] The manufacturing method of the display module provided in the present application realizes the connection control of the first lamp bead and the second lamp bead by limiting the suspension member in the closed cavity and controlling the position of the suspension member by electromagnetic induction and the Lorentz principle. At the same time, the coil substrate for controlling the first lamp bead and the second lamp bead is designed to be separated from the display substrate in different layers, which can not only simplify the wiring and reduce the number of parts, but also help to increase the space available for the arrangement of the first lamp bead and the second lamp bead, or increase the arrangement density of the lamp beads, thereby improving the performance of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic cross-sectional view of a first copper-clad substrate provided in one embodiment of the present application.

[0025] Figure 2 For etching Figure 1 The cross-sectional view of the first copper foil layer after forming the first circuit layer is shown.

[0026] Figure 3 for Figure 2 The schematic cross-sectional view of the insulating layer after the first opening and the second opening are provided is shown.

[0027] Figure 4 for Figure 3 The cross-sectional schematic diagram shows a first conductive body disposed in the first opening and a second conductive body disposed in the second opening.

[0028] Figure 5 for Figure 4 The cross-sectional schematic diagram of the display substrate is shown in which the first conductive body is connected to the first lamp bead and the second conductive body is connected to the second lamp bead to form.

[0029] Figure 6 A schematic cross-sectional view of a second copper clad substrate provided in one embodiment of the present application.

[0030] Figure 7 For etching Figure 6 The cross-sectional view of the second copper foil layer after forming the second circuit layer is shown.

[0031] Figure 8 for Figure 7 The cross-sectional view of the second circuit layer after the magnetic insulation layer is provided is shown.

[0032] Fig. 9 To remove Figure 8 A schematic cross-sectional view of the first carrier board is shown.

[0033] Fig.10 for Fig. 9 The cross-sectional diagram of the magnetic insulation layer after the second carrier is disposed is shown.

[0034] Fig.11 for Fig.10 The cross-sectional schematic diagram of the coil substrate intermediate body formed after the coil is provided with a suspendable body.

[0035] Fig.12 for Figure 5 The display substrate shown, Fig.11 The cross-sectional schematic diagram of the coil intermediate and the adhesive layer after lamination is shown.

[0036] Fig.13 for Fig.12 The cross-sectional view of the coil intermediate body after the second carrier plate is removed is shown.

[0037] Fig.14 for Fig.13 The cross-sectional schematic diagram of the magnetic insulation layer of the coil substrate shown is provided with grooves.

[0038] Fig.15 for Fig.14 The magnetic insulation layer is shown as a schematic cross-sectional view of an active element disposed thereon to obtain the display module in a second state.

[0039] Fig.16 for Fig.15 The shown diagram is a cross-sectional view of the display module in a first state.

[0040] Main component symbols

[0041] Display module 100

[0042] Display substrate 10

[0043] Insulation layer 11

[0044] The first opening 111

[0045] The second opening 112

[0046] The first lamp bead 12

[0047] Second lamp bead 13

[0048] First Line 14

[0049] Second Line 15

[0050] The first copper-clad substrate 16

[0051] The first copper foil layer 162

[0052] First circuit layer 17

[0053] First conductive body 18

[0054] The second conductive body 19

[0055] Adhesive layer 20

[0056] Opening 21

[0057] Closed cavity 22

[0058] Coil substrate intermediate 30

[0059] Coil 31

[0060] Suspension 32

[0061] Suspended body 321

[0062] Contact 322

[0063] Magnetic insulation layer 33

[0064] The second copper-clad substrate 34

[0065] The first carrier board 341

[0066] The first supporting layer 341a

[0067] First protective layer 341b

[0068] The second circuit layer 35

[0069] Coil slot 352

[0070] Slot 361

[0071] Second carrier board 37

[0072] Coil substrate 38

[0073] First state A

[0074] Second state B

[0075] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0076] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0077] It should be noted that when a component is considered to be “disposed on” another component, it may be directly disposed on the other component or there may be a central component at the same time.

[0078] See also Figures 1 to 15An embodiment of the present application provides a method for manufacturing a display module 100. The display module 100 can be applied to a display screen of an electronic product. The manufacturing method specifically includes:

[0079] S1: See Figures 1 to 5 A display substrate 10 is provided, and the display substrate 10 includes an insulating layer 11, a first lamp bead 12, a second lamp bead 13, a first circuit 14, and a second circuit 15. The first lamp bead 12 and the second lamp bead 13 are arranged side by side on one side of the insulating layer 11. The first circuit 14 and the second circuit 15 are arranged side by side on the other side of the insulating layer 11. The first lamp bead 12 is electrically connected to the first circuit 14, and the second lamp bead 13 is electrically connected to the second circuit 15.

[0080] In this embodiment, the manufacturing method of the display substrate 10 specifically includes the following steps:

[0081] S11: See Figure 1 A first copper clad substrate 16 is provided. The first copper clad substrate 16 is a single-sided copper clad substrate. The first copper clad substrate 16 includes the insulating layer 11 and a first copper foil layer 162 disposed on one side of the insulating layer 11.

[0082] In this embodiment, the material of the insulating layer 11 in step S1 includes at least one of polyimide (PI), liquid crystal polymer (LCP), epoxy resin (EP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyimide (PI), polyester resin (PET) and polyethylene naphthalate (PEN). Preferably, the material of the insulating layer 11 is polyimide.

[0083] S12: See Figure 2 The first copper foil layer 162 is etched to form a first circuit layer 17, wherein the first circuit layer 17 includes two first circuits 14 disposed at intervals and two second circuits 15 disposed at intervals. Adjacent first circuits 14 and second circuits 15 are electrically isolated.

[0084] In this embodiment, the first circuit layer 17 in step S2 is made by using processes such as dry film, exposure and development, and chemical etching. It can be understood that in other embodiments of the present application, the first circuit layer 17 can be made by machine tool processing, laser etching, etc.

[0085] S13: See Figure 3 A first opening 111 and a second opening 112 are formed through the insulating layer 11 . Two first circuits 14 are partially exposed from the first opening 111 . Two second circuits 15 are partially exposed from the second opening 112 .

[0086] In this embodiment, the first opening 111 and the second opening 112 are formed by dry film, exposure, development and etching. It can be understood that in other embodiments of the present application, the first opening 111 and the second opening 112 can be made by machine tool processing, laser etching and the like.

[0087] S14: See Figure 4 , a first conductive body 18 is disposed in the first opening 111, and a second conductive body 19 is disposed in the second opening 112. One end of the first conductive body 18 is connected to the first line 14. One end of the second conductive body 19 is connected to the second line 15. The first conductive body 18 and the second conductive body 19 are both solder paste. It can be understood that in other embodiments of the present application, the first conductive body 18 and the second conductive body 19 can also be conductive glue.

[0088] S15: See Figure 5 , the first lamp bead 12 and the second lamp bead 13 are arranged on the side of the insulating layer 11 away from the first circuit layer 17. The first lamp bead 12 is connected to the other end of the first conductive body 18. The second lamp bead 13 is connected to the other end of the second conductive body 19, and the display substrate 10 is obtained. That is, the first lamp bead 12 is connected to the first circuit 14 through the first conductive body 18, and the second lamp bead 13 is connected to the second circuit 15 through the second conductive body 19, which is conducive to improving the stability of the connection between the first lamp bead 12 and the second lamp bead 13 and the first conductive body 18 and the second conductive body 19 respectively. Among them, the first lamp bead 12 and the second lamp bead 13 are both micro light emitting diodes.

[0089] S2: See Fig.12, an adhesive layer 20 is provided on the side of the display substrate 10 where the first circuit layer 17 is provided. The adhesive layer 20 is provided with an opening 21, and part of the first circuit 14 and part of the second circuit 15 are exposed in the opening 21. The adhesive layer 20 includes one of epoxy glue, acrylic glue, silicone glue, and polyurethane glue. The adhesive layer 20 can achieve a stable connection with the display substrate 10 and the coil substrate intermediate 30.

[0090] S3: See Fig.12 , a coil substrate intermediate body 30 is arranged on the side of the adhesive layer 20 away from the first circuit layer 17. The coil substrate intermediate body 30 covers the opening 21 to enclose and form a closed cavity 22. The coil substrate intermediate body 30 includes a magnetic insulating layer 33, a coil 31 and a suspension member 32. The coil 31 is embedded in the magnetic insulating layer 33 and exposed in the closed cavity 22, and the suspension member 32 can be movably arranged in the closed cavity 22. The coil 31 is used to pass a high-frequency current. The magnetic insulating layer 33 is used to generate an external magnetic field. The suspension member 32 can sense the high-frequency current and generate eddy currents. According to the Lorentz Principle, the eddy currents can generate a Lorentz force acting on the suspendable member 32 in the external magnetic field. The Lorentz force and gravity act on the suspendable member 32 together and the directions of the two are opposite. Thus, by controlling the magnitude of the high-frequency current in the coil 31, the magnitude relationship between the Lorentz force and gravity can be changed, thereby controlling the position of the suspension 32 in the closed cavity 22. Specifically, the frequency of the high-frequency current is generally between hundreds of kilohertz (kHz) and several megahertz (MHz).

[0091] In this example, see Figures 6 to 11 The coil substrate intermediate body 30 in step S3 further includes a first carrier plate 341. The first carrier plate 341 is disposed on a side of the magnetic insulation layer 33 away from the closed cavity 22. The first carrier plate 341 is used to support the coil 31 and the magnetic insulation layer 33. Specifically, the manufacturing method of the coil substrate intermediate body 30 includes the steps of:

[0092] S31: See Figure 6, providing a second copper-clad substrate 34. The second copper-clad substrate 34 includes a first carrier 341 and a second copper foil layer 342 arranged on one side of the first carrier 341. The first carrier 341 includes a first bearing layer 341a and a first protective layer 341b. The first bearing layer 341a can be separated from the second copper foil layer 342, and the first protective layer 341b is used to protect the first bearing layer 341a. The first bearing layer 341a includes one of FR-4 with a release layer, an aluminum substrate, polyimide, and a polyester film. The material of the first protective layer 341b includes one of glass fiber reinforced epoxy resin, polyimide, and polytetrafluoroethylene.

[0093] S32: See Figure 7 The second copper foil layer 342 is etched to form a second circuit layer 35, wherein the second circuit layer 35 includes the coil 31. The coil 31 is substantially spiral-shaped, and has a coil groove 352, and a portion of the first bearing layer 341a is exposed in the coil groove 352.

[0094] In this embodiment, the second copper foil layer 342 is made by processes such as dry film, exposure and development, and chemical etching. It can be understood that in other embodiments of the present application, the second copper foil layer 342 can be formed by machine tool processing or laser ablation.

[0095] S33: See Figure 8 The magnetic insulation layer 33 is disposed on the second circuit layer 35, and a portion of the magnetic insulation layer 33 is filled into the coil slot 352. The magnetic insulation layer 33 is a magnetic insulation material, and specifically, the magnetic insulation layer 33 is ferrite.

[0096] S34: See Fig. 9 , remove the first carrier plate 341 so that one side of the coil 31 is exposed on one side of the magnetic insulation layer 33 .

[0097] S35: See Fig.10 , a second carrier plate 37 is arranged on the other side of the magnetic insulation layer 33, and the second carrier plate 37 includes a second bearing layer 371 and a second protective layer 372. The second bearing layer 371 is arranged between the second protective layer 372 and the magnetic insulation layer 33. The second carrier plate 37 is used to provide necessary support and stability for the coil 31, reducing the risk of damage to the coil 31 caused by the pressing process in step S3. It can be understood that in other embodiments of the present application, if the structural stability of the coil 31 itself is sufficient to resist damage such as deformation during the pressing process in the pressing step S3, step S35 can be omitted.

[0098] S35: See Fig.11 , the suspension member 32 is arranged on the exposed coil 31 to obtain the coil substrate intermediate 30. The suspension member 32 is a graphene sheet. It can be understood that in other embodiments of the present application, the suspension member 32 can be other materials that can induce high-frequency current and generate eddy current, such as copper, aluminum, ferrite, nickel-iron alloy, iron, etc.

[0099] In this embodiment, the suspension member 32 is generally in the shape of a sheet, and includes a suspension body 321 and two contacts 322 disposed on one side of the suspension body 321. The two contacts 322 are disposed on the side of the suspension body 321 facing away from the coil 31. The thickness of the suspension body 321 is 5 to 30 microns, and the thickness of the contacts 322 is 1 to 5 microns. The two contacts 322 are used to connect the first circuit 14 and the second circuit 15 respectively, thereby realizing the connection between the first circuit 14 and the second circuit 15.

[0100] In this embodiment, the manufacturing method of the display module 100 further includes the steps of:

[0101] S4: See Fig.13 , remove the second carrier plate 37, so that the side of the magnetic insulation layer 33 away from the closed cavity 22 is exposed. The magnetic insulation layer 33, the second circuit layer 35 and the suspension member 32 together form a coil substrate 38.

[0102] S5: See Fig.14 A slot 361 is provided on a side of the magnetic insulation layer 33 away from the closed cavity 22 , and a portion of the coil 31 is exposed in the slot 361 .

[0103] S6: See Fig.15 , an active component 50 is arranged on the side of the magnetic insulation layer 33 away from the closed cavity 22 to obtain the display module 100. The active component 50 includes a main body 51 and a pin 52 connected to the main body 51. The pin 52 is inserted into the slot 361 to electrically connect the coil 31. The active component 50 is used to control the magnitude of the high-frequency current in the coil 31, thereby achieving control of the position of the suspension 32. Specifically, the active component 50 includes a control chip. The control chip can achieve control of the high-frequency current in the coil 31 by adjusting the current source, pulse width modulation and other technologies.

[0104] Compared with the prior art, the manufacturing method of the display module 100 provided in the present application has the following advantages:

[0105] (i) By limiting the suspension member 32 in the closed cavity 22 and controlling the position of the suspension member 32 by electromagnetic induction and the Lorentz principle, the connection control of the first lamp bead 12 and the second lamp bead 13 on the upper layer is realized. At the same time, by designing and controlling the coil substrate 38 of the first lamp bead 12 and the second lamp bead 13 to be separated from the display substrate 10 in different layers, the wiring can be simplified and the parts can be reduced, and the space available for the arrangement of the first lamp bead 12 and the second lamp bead 13 can be increased, and the arrangement density of the lamp beads can be increased, thereby improving the performance of the display module 100.

[0106] (ii) By arranging the magnetic insulating layer 33 on the coil 31 and filling part of the magnetic insulating layer 33 into the coil groove 352 of the coil 31, the relative positions of the magnetic insulating layer 33 and the coil 31 are fixed, and the magnetic insulating layer 33 and the coil 31 are exposed at the bottom of the closed cavity 22. At the same time, the suspension member 32 is confined in the closed cavity 22, so that the suspension member 32 is not easy to deviate, which is conducive to improving the accuracy of position control of the suspension member 32.

[0107] See also Fig.15 and Fig.16 The present application also provides a display module 100 , including a display substrate 10 , an adhesive layer 20 and a coil substrate 38 .

[0108] The display substrate 10 includes a magnetic insulation layer 33, a first lamp bead 12, a second lamp bead 13, a first circuit 14, and a second circuit 15. The first lamp bead 12 and the second lamp bead 13 are arranged side by side on one side of the magnetic insulation layer 33. The first circuit 14 and the second circuit 15 are arranged side by side on the other side of the magnetic insulation layer 33. The first lamp bead 12 is electrically connected to the first circuit 14, and the second lamp bead 13 is electrically connected to the second circuit 15.

[0109] The adhesive layer 20 is disposed on a side of the display substrate 10 where the first circuit 14 and the second circuit 15 are disposed. An opening 21 is disposed through the adhesive layer 20 , and a portion of the first circuit 14 and a portion of the second circuit 15 are exposed in the opening 21 .

[0110] The coil substrate 38 is disposed on the side of the adhesive layer 20 away from the first circuit 14 and the second circuit 15. The coil substrate 38 covers the opening 21 to enclose and form a closed cavity 22. The coil substrate 38 includes a coil 31, a suspension member 32, and a magnetic insulation layer 33. The coil 31 is embedded in the magnetic insulation layer 33 and exposed in the closed cavity 22. The magnetic insulation layer 33 is used to generate an external magnetic field. The suspension member 32 is movably disposed in the closed cavity 22.

[0111] Specifically, the coil substrate 38 includes a first state A and a second state B. Fig.16 In the first state A, the coil 31 is passed through a first high-frequency current, and the suspension 32 induces the first high-frequency current to generate a first eddy current. The suspension 32 with the first eddy current generates a first Lorentz force in the external magnetic field. The direction of the first Lorentz force is opposite to the direction of the gravity on the suspension 32, and the first Lorentz force is greater than the gravity of the suspension 32, so that the suspension 32 moves toward the first circuit 14 and the second circuit 15 until the two contacts 322 of the suspension 32 are connected to the first circuit 14 and the second circuit 15 respectively. In this way, the first lamp bead 12 and the second lamp bead 13 are connected in series.

[0112] See also Fig.15 In the second state B, the coil 31 is passed with a second high-frequency current, the second high-frequency current is smaller than the second high-frequency current, the suspension 32 induces the second high-frequency current and generates a second eddy current, the suspension 32 with the second eddy current generates a second Lorentz force in the external magnetic field, the direction of the second Lorentz force is opposite to the direction of gravity on the suspension 32, and the second Lorentz force is smaller than the gravity of the suspension 32, and the suspension 32 is disconnected from the first circuit 14 and the second circuit 15 respectively. In this way, the first lamp bead 12 and the second lamp bead 13 are electrically disconnected.

[0113] See also Fig.15 and Fig.16 In this embodiment, the coil substrate 38 further includes a magnetic insulation layer 33, the coil 31 is embedded in the magnetic insulation layer 33, the active element 50 is disposed on a side of the magnetic insulation layer 33 away from the closed cavity 22, and the active element 50 is electrically connected to the coil 31. The magnetic insulation layer 33 is a magnetic insulation layer, and the magnetic insulation layer 33 can be used to provide an external magnetic field.

[0114] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present application, and are not used as limitations on the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A method for manufacturing a display module, It is characterized in that Includes steps: A display substrate is provided, the display substrate comprising an insulating layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit, the first lamp bead and the second lamp bead are arranged side by side on one side of the insulating layer, the first circuit and the second circuit are arranged side by side on the other side of the insulating layer, the first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit; An adhesive layer is provided on one side of the display substrate where the first circuit and the second circuit are provided, the adhesive layer is provided with an opening through which a part of the first circuit and a part of the second circuit are exposed; A coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit, the coil substrate covers the opening to enclose and form a closed cavity, the coil substrate includes a magnetic insulation layer, a coil and a suspension member, the coil is arranged on the magnetic insulation layer, the magnetic insulation layer has an external magnetic field, and the suspension member is movably arranged in the closed cavity, wherein the display module includes a first state and a second state, In the first state, a first high-frequency current flows through the coil, the suspension element senses the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, and the first Lorentz force is greater than the gravity of the suspension element, so that the two ends of the suspension element are connected to the first circuit and the second circuit respectively, so that the first lamp bead is electrically connected to the second lamp bead; In the second state, a second high-frequency current flows through the coil, and the second high-frequency current is smaller than the first high-frequency current. The suspension element induces the second high-frequency current and generates a second eddy current. The second eddy current forms a second Lorentz force in the external magnetic field, and the second Lorentz force is smaller than the gravity of the suspension element, so that the two ends of the suspension element are separated from the first circuit and the second circuit respectively, so that the first lamp bead is electrically disconnected from the second lamp bead.

2. The manufacturing method according to claim 1, It is characterized in that The display substrate further includes a first conductive body and a second conductive body buried in the insulating layer, the first conductive body connecting the first lamp bead and the first circuit, and the second conductive body connecting the second lamp bead and the second circuit. The manufacturing method of the display substrate includes the steps of: Providing a first copper-clad substrate, wherein the first copper-clad substrate comprises the insulating layer and a first copper foil layer disposed on one side of the insulating layer; Etching the first copper foil layer to form a first circuit layer, wherein the first circuit layer includes the first circuit and the second circuit; Etching the insulating layer to form a first opening and a second opening, wherein a portion of the first circuit is exposed in the first opening, and a portion of the second circuit is exposed in the second opening; The first conductive body is disposed in the first opening, and the first line is connected to one end of the first conductive body; A second conductive body is disposed in the second opening, and the second line is connected to one end of the second conductive body; The first lamp bead and the second lamp bead are arranged on the side of the insulating layer away from the first circuit layer, the first lamp bead is connected to the other end of the first conductive body, and the second lamp bead is connected to the other end of the second conductive body to obtain the display substrate.

3. The manufacturing method according to claim 1, It is characterized in that The coil substrate further includes an active element, which is disposed on a side of the magnetic insulation layer away from the closed cavity, and is electrically connected to the coil. The manufacturing method of the coil substrate includes the steps of: Providing a second copper-clad substrate, a first carrier board of the second copper-clad substrate and a second copper foil layer disposed on one side of the first carrier board; Etching the second copper foil layer to form a second circuit layer, wherein the second circuit layer includes the coil, the coil has a coil slot, and a portion of the first carrier board is exposed in the coil slot; The magnetic insulation layer is provided on the second circuit layer, and a part of the magnetic insulation layer is filled into the coil slot; Removing the first carrier plate so that the coil is exposed on one side of the magnetic insulation layer; The suspension element is arranged on the coil, and The active element is arranged on a side of the magnetic insulation layer away from the suspension element to obtain the coil substrate.

4. The manufacturing method according to claim 3, It is characterized in that After the step of "removing the first carrier plate" and before the step of "arranging the suspension element on the coil", the method further includes: arranging a second carrier plate on a side of the magnetic insulation layer away from the suspension element; After the step of "arranging a coil substrate on the side of the adhesive layer away from the first circuit and the second circuit", the method further includes: removing the second carrier plate so that the magnetic insulating layer is exposed; A slot is provided on a side of the magnetic insulation layer away from the suspension element, and a portion of the coil is exposed in the slot; and The active element is disposed on the magnetic insulation layer. The active element includes a body and pins connected to the body. The pins are inserted into the slots to electrically connect to the coil.

5. The manufacturing method according to claim 3, It is characterized in that The active component includes a control chip.

6. The manufacturing method according to claim 1, It is characterized in that The material of the suspension element is graphene.

7. A display module, It is characterized in that include: A display substrate, the display substrate comprising an insulating layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit, the first lamp bead and the second lamp bead are arranged side by side on one side of the insulating layer, the first circuit and the second circuit are arranged side by side on the other side of the insulating layer, the first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit; An adhesive layer, the adhesive layer being disposed on a side of the display substrate where the first circuit and the second circuit are disposed, the adhesive layer being provided with an opening through which a portion of the first circuit and a portion of the second circuit are exposed; A coil substrate, wherein the coil substrate is arranged on a side of the adhesive layer away from the first circuit and the second circuit, the coil substrate covers the opening to enclose and form a closed cavity, the coil substrate comprises a coil, a magnetic insulation layer and a suspension member, the coil is arranged on the magnetic insulation layer, the magnetic insulation layer has an external magnetic field, and the suspension member is movably arranged in the closed cavity, wherein the display module comprises a first state and a second state, In the first state, a first high-frequency current flows through the coil, the suspension element senses the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, and the first Lorentz force is greater than the gravity of the suspension element, so that the two ends of the suspension element are connected to the first circuit and the second circuit respectively, so that the first lamp bead is electrically connected to the second lamp bead; In the second state, a second high-frequency current flows through the coil, and the second high-frequency current is smaller than the first high-frequency current. The suspension element induces the second high-frequency current and generates a second eddy current. The second eddy current forms a second Lorentz force in the external magnetic field, and the second Lorentz force is smaller than the gravity of the suspension element, so that the two ends of the suspension element are separated from the first circuit and the second circuit respectively, so that the first lamp bead is electrically disconnected from the second lamp bead.

8. The display module according to claim 7, It is characterized in that The coil substrate further comprises an active element, which is arranged on a side of the magnetic insulation layer away from the closed cavity, and is electrically connected to the coil.

9. The display module according to claim 8, It is characterized in that A slot is provided on the side of the magnetic insulation layer away from the closed cavity, and part of the coil is exposed in the slot. The active component includes a main body and pins connected to the main body. The main body is provided on the side of the magnetic insulation layer away from the closed cavity, and the pins are inserted into the slot and electrically connected to the coil.

10. The display module according to claim 8, It is characterized in that The suspension element comprises a suspension body and two contacts arranged on one side of the suspension body, and the two contacts are arranged on a side of the suspension body facing away from the coil.

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