Heat dissipation module, radiator and server

Abstract

The invention relates to a heat dissipation module, a radiator and a server, the heat dissipation module comprises a condenser, the condenser is provided with a first air inlet, a liquid outlet and a second air inlet, and the first air inlet and the second air inlet are respectively arranged at two opposite ends of the heat dissipation module in a first direction; the liquid outlet is formed in the middle of the condenser and located between the first air inlet and the second air inlet. One end of the liquid flow pipeline is connected with the liquid outlet; one end of the first airflow pipeline is connected with the first air inlet, and one end of the second airflow pipeline is connected with the second air inlet; a first liquid inlet of the first heat dissipation plate is connected with the other end of the liquid flow pipeline, a second liquid inlet of the second heat dissipation plate is connected with the other end of the liquid flow pipeline, a first exhaust port of the first heat dissipation plate is connected with the other end of the first airflow pipeline, and a second exhaust port of the second heat dissipation plate is connected with the other end of the second airflow pipeline. And a second exhaust port of the second heat dissipation plate is connected with the other end of the second airflow pipeline.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation module, a radiator and a server. Background Art

[0002] With the rapid development of information technology, the demand for AI computing power is gradually increasing, so the market demand for edge AI servers is also increasing. Correspondingly, the power density of chips used for AI computing is increasing. The increase in power is also accompanied by an increase in heat generation. If electronic components work in a high temperature environment for a long time, their working performance and stability will be greatly reduced.

[0003] In traditional technology, one-way cold plate liquid cooling and phase change cold plate liquid cooling are usually used to provide heat dissipation services for chips with high heat flux density. However, the heat dissipation capacity of one-way cold plate liquid cooling is extremely limited, and it is difficult to meet the heat dissipation needs of chips with gradually increasing heat generation; and although phase change cold plate liquid cooling can meet the heat dissipation needs of high heat generation chips through the latent heat of liquid phase change, the flow resistance of the liquid is large, which affects the heat dissipation efficiency, and the gas phase is prone to blockage, increasing the internal operating pressure of the system. Summary of the invention

[0004] Based on this, it is necessary to provide a heat dissipation module to address the problems of large liquid flow resistance and high operating pressure inside the system.

[0005] In a first aspect of the present application, a heat dissipation module is provided, comprising:

[0006] A condenser, the condenser is provided with a first air inlet, a liquid outlet, and a second air inlet, the first air inlet and the second air inlet are respectively arranged at opposite ends of the first direction of the heat dissipation module, and the liquid outlet is arranged in the middle of the condenser and is located between the first air inlet and the second air inlet;

[0007] A liquid flow pipeline, one end of which is connected to the liquid outlet;

[0008] a first airflow pipeline and a second airflow pipeline, wherein one end of the first airflow pipeline is connected to the first air inlet, and one end of the second airflow pipeline is connected to the second air inlet; and

[0009] A first heat sink and a second heat sink, wherein the first liquid inlet of the first heat sink is connected to the other end of the liquid flow pipeline, the second liquid inlet of the second heat sink is connected to the other end of the liquid flow pipeline, the first exhaust port of the first heat sink is connected to the other end of the first air flow pipeline, and the second exhaust port of the second heat sink is connected to the other end of the second air flow pipeline.

[0010] The heat dissipation module of the present solution is applied to the server to cool down the chip with large heat generation. When in use, the heat dissipation module is installed on the mainboard, and the first heat dissipation plate and the second heat dissipation plate are respectively matched with the corresponding chip for heat transfer (such as direct contact or indirect contact to achieve heat transfer). During operation, the heat generated by the chip is transferred to the first heat dissipation plate and the second heat dissipation plate, so that the coolant inside the first heat dissipation plate and the second heat dissipation plate absorbs heat, heats up and vaporizes into gas, and the gas can then flow to the first air inlet and the second air inlet of the condenser through the first air flow pipeline and the second air flow pipeline respectively, and then the gas is separated through the first air inlet and the second air inlet. The gas flows into the interior of the condenser from both ends of the first direction of the condenser; the gas exchanges heat with the cooling medium inside the condenser and is cooled, so that the gas is condensed into liquid, and the liquid gathers at the liquid outlet and finally flows back to the first heat sink and the second heat sink through the liquid flow pipeline. Through the continuous cycle of the above working process, the chip can be efficiently cooled and cooled by phase change liquid cooling, and the flow path of the gas condensed into liquid in the condenser is shortened by at least half, which effectively reduces the liquid flow resistance, helps to improve the heat dissipation efficiency of the heat dissipation module, and avoids the blockage of the gas phase to ensure the normal operating pressure inside the system.

[0011] The technical solution of this application is further described below:

[0012] In one of the embodiments, the heat dissipation module further includes a first flow diverter, which is installed at the first air inlet and connected to an end of the first air flow pipeline away from the first heat dissipation plate.

[0013] In one embodiment, the heat dissipation module further includes a second flow divider, which is installed at the second air inlet and connected to an end of the second air flow pipeline away from the second heat dissipation plate.

[0014] In one embodiment, the heat dissipation module further includes a water distributor, which is installed at the liquid outlet. The liquid flow pipeline includes a first liquid flow branch pipe and a second liquid flow branch pipe, and the water distributor is connected to the first liquid flow branch pipe and the second liquid flow branch pipe.

[0015] In one embodiment, the condenser includes a condensation shell and a partition plate, wherein the partition plate is installed inside the condensation shell to divide the inner cavity of the condensation shell into a first condensation chamber and a second condensation chamber, wherein the medium flow direction in the first condensation chamber is from the first air inlet toward the liquid outlet, and the medium flow direction in the second condensation chamber is from the second air inlet toward the liquid outlet.

[0016] In one embodiment, the condenser further comprises at least two first condensation plates and at least two second condensation plates, at least two of the first condensation plates are installed in the first condensation chamber and are arranged side by side along the second direction of the heat dissipation module, and a first condensation flow channel is formed between two adjacent first condensation plates, and at least two of the second condensation plates are installed in the second condensation chamber and are arranged side by side along the second direction of the heat dissipation module, and a second condensation flow channel is formed between two adjacent second condensation plates; wherein the second direction intersects with the first direction;

[0017] Alternatively, the condenser also includes at least two first condensation plates and at least two second condensation plates, at least two of the first condensation plates are installed in the first condensation chamber and are arranged side by side along the second direction of the heat dissipation module, a first condensation channel is formed between two adjacent first condensation plates, and a first cavity is formed inside each of the first condensation plates, and a cooling medium is arranged in the first cavity; at least two of the second condensation plates are installed in the second condensation chamber and are arranged side by side along the second direction of the heat dissipation module, a second condensation channel is formed between two adjacent second condensation plates, and a second cavity is formed inside each of the second condensation plates, and a cooling medium is arranged in the second cavity; wherein the second direction intersects with the first direction.

[0018] In one of the embodiments, the first heat sink and the second heat sink each include a heat sink shell and at least two heat sink fins. An installation cavity is formed inside the heat sink shell. At least two heat sink fins are installed in the installation cavity and are arranged side by side and spaced apart along the second direction of the heat sink module. A liquid flow channel is formed between two adjacent heat sink fins.

[0019] In one embodiment, the first heat sink and the second heat sink further include a mounting assembly, the mounting assembly includes a mounting member and an elastic member, the heat sink shell is provided with a mounting through hole, the mounting member can be movably inserted into the mounting through hole, and the elastic member abuts between the heat sink shell and the mounting member.

[0020] In a second aspect of the present application, a heat sink is provided, which includes at least two heat dissipation modules as described above, and at least two of the heat dissipation modules are arranged side by side along a preset direction.

[0021] In a third aspect of the present application, a server is further provided, comprising:

[0022] Functional device modules; and

[0023] The heat sink as described above cooperates with the functional device module in heat transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 Schematic diagram of the structure of the heat dissipation module described in one embodiment of the present application.

[0027] Figure 2 This is a schematic structural diagram of a heat dissipation module according to another embodiment of the present application.

[0028] Figure 3 for Figure 1 Schematic diagram of the local enlarged structure at point A in the middle.

[0029] Figure 4 The exploded structure diagram of the first heat dissipation plate and the second heat dissipation plate of one embodiment.

[0030] Description of reference numerals:

[0031] 100, heat dissipation module; 10, condenser; 11, first air inlet; 12, liquid outlet; 13, second air inlet; 14, condensation shell; 15, partition plate; 20, liquid flow pipeline; 21, first liquid flow branch pipe; 22, second liquid flow branch pipe; 30, first air flow pipeline; 40, second air flow pipeline; 50, first heat sink; 60, second heat sink; 60a, heat dissipation shell; 60b, heat dissipation fins; 60c, mounting assembly; 61c, mounting member; 62c, elastic member; 70, first diverter; 80, second diverter; 90, water distributor; 90a, flow sensor. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0033] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0034] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0038] See also Figure 1 and Figure 2 , which are heat dissipation modules 100 shown in two different embodiments of the present application, including a condenser 10, a liquid flow pipeline 20, a first air flow pipeline 30, a second air flow pipeline 40, a first heat dissipation plate 50 and a second heat dissipation plate 60.

[0039] The condenser 10 is provided with a first air inlet 11, a liquid outlet 12 and a second air inlet 13, and the first air inlet 11 and the second air inlet 13 are respectively arranged at opposite ends of the first direction of the heat dissipation module 100, and the liquid outlet 12 is arranged in the middle of the condenser 10 and is located between the first air inlet 11 and the second air inlet 13; one end of the liquid flow pipeline 20 is connected to the liquid outlet 12; one end of the first air flow pipeline 30 is connected to the first air inlet 11, and one end of the second air flow pipeline 40 is connected to the second air inlet 13; the first liquid inlet of the first heat sink 50 is connected to the other end of the liquid flow pipeline 20, the second liquid inlet of the second heat sink 60 is connected to the other end of the liquid flow pipeline 20, the first exhaust port of the first heat sink 50 is connected to the other end of the first air flow pipeline 30, and the second exhaust port of the second heat sink 60 is connected to the other end of the second air flow pipeline 40.

[0040] The heat dissipation module 100 of the present solution is applied to a server to cool down a chip with a large heat generation. When in use, the heat dissipation module 100 is installed on a mainboard, and the first heat dissipation plate 50 and the second heat dissipation plate 60 cooperate with the corresponding chip for heat transfer (such as direct contact or indirect contact to achieve heat transfer). During operation, the heat generated by the chip is transferred to the first heat dissipation plate 50 and the second heat dissipation plate 60, so that the coolant inside the first heat dissipation plate 50 and the second heat dissipation plate 60 absorbs heat, heats up and vaporizes into gas, and the gas can then flow to the first air inlet 11 and the second air inlet 13 of the condenser 10 through the first air flow pipeline 30 and the second air flow pipeline 40 respectively, and then the gas passes through the first air inlet 11 and the second air inlet 13. The air inlet 13 flows into the interior of the condenser 10 from both ends of the first direction of the condenser 10 respectively; the gas exchanges heat with the cooling medium inside the condenser 10 and is cooled, so that the gas is condensed into liquid, and the liquid gathers at the liquid outlet 12 and finally flows back to the first heat sink 50 and the second heat sink 60 through the liquid flow pipeline 20. Through the continuous cycle of the above working process, the chip can be efficiently cooled and cooled by phase change liquid cooling, and the flow path of the gas condensed into liquid in the condenser 10 is shortened by at least half, which effectively reduces the liquid flow resistance, helps to improve the heat dissipation efficiency of the heat dissipation module 100, and avoids the blockage of the gas phase, ensuring the normal operating pressure inside the system.

[0041] It should be noted that the first direction of the heat dissipation module 100 corresponds to the length direction of the condenser 10. At this time, the first air inlet 11 and the second air inlet 13 are arranged one by one at the two ends of the length direction of the condenser 10, and the liquid outlet 12 is arranged in the middle of the condenser 10. In the process of liquefaction of gas from gas to liquid in the condenser 10, the length of the gas flowing from the first air inlet 11 to the liquid outlet 12 and from the second air inlet 13 to the liquid outlet 12 is only half of the length of the condenser 10, which greatly shortens the length of the return flow path of the coolant in the condenser 10 to reduce the liquid flow resistance.

[0042] It is also necessary to explain that the principle of condensing gas into liquid by the condenser 10 is based on the principle of heat exchange. When the high-temperature gas enters the condenser 10, the temperature of the gas gradually decreases by exchanging heat with the cooling medium (usually coolant or air, in this case, coolant, such as water). As the temperature drops, the thermal motion of the gas molecules slows down, the distance between the molecules decreases, and the gaseous substance gradually turns into liquid, completing the condensation process. Figure 1 The arrows in the figure indicate the phase change circulation flow direction of the gas and the coolant.

[0043] The second direction of the heat dissipation module 100 specifically corresponds to the width direction of the condenser 10 .

[0044] The opening sizes of the first air inlet 11 and the second air inlet 13 are smaller than the width of the condenser 10 .

[0045] Please continue reading Figure 1 and Figure 2 On the basis of the above embodiment, the heat dissipation module 100 further includes a first diverter 70 , which is installed at the first air inlet 11 and connected to an end of the first air flow pipeline 30 away from the first heat dissipation plate 50 .

[0046] Similarly, the heat dissipation module 100 further includes a second flow splitter 80 , which is installed at the second air inlet 13 and connected to an end of the second air flow pipeline 40 away from the second heat dissipation plate 60 .

[0047] By providing the first splitter 70 and the second splitter 80, a splitting and diffusion effect can be formed on the gas input into the condenser 10 through the first airflow pipeline 30 and the second airflow pipeline 40, so that the gas can be evenly distributed in the cross-sectional space of the condenser 10 as soon as it flows into the condenser 10, thereby increasing the heat exchange area of ​​the gas and improving the condensation efficiency of the gas.

[0048] Furthermore, in another embodiment, the heat dissipation module 100 further includes a water divider 90, which is installed at the liquid outlet 12, and the liquid flow pipeline 20 includes a first liquid flow branch pipe 21 and a second liquid flow branch pipe 22, and the water divider 90 is connected to the first liquid flow branch pipe 21 and the second liquid flow branch pipe 22. The water divider 90 can divide the coolant after the gas is condensed and gathered inside the water divider 90 to the first liquid flow branch pipe 21 and the second liquid flow branch pipe 22 more evenly, so as to ensure that the coolant flow rate flowing back to the first heat sink 50 and the second heat sink 60 is equal and sufficient, on the one hand, ensuring that the first heat sink 50 and the second heat sink 60 have the same cooling effect on the chip and ensure effective heat dissipation of the chip; on the other hand, ensuring that the first heat sink 50 and the second heat sink 60 are replenished with liquid in time to avoid the phenomenon of drying up and affecting the service life of the first heat sink 50, the second heat sink 60 and the chip.

[0049] Please continue reading Figure 1 In an optional embodiment, the condenser 10 includes a condensing shell 14 and a partition plate 15, and the partition plate 15 is installed inside the condensing shell 14 to divide the inner cavity of the condensing shell 14 into a first condensing chamber and a second condensing chamber. The medium flow direction in the first condensing chamber is from the first air inlet 11 to the liquid outlet 12, and the medium flow direction in the second condensing chamber is from the second air inlet 13 to the liquid outlet 12.

[0050] After being configured in this way, the partition plate 15 can prevent the liquids or gas-liquid mixed media flowing in opposite directions in the first condensation chamber and the second condensation chamber from colliding with each other and causing noise, and can ensure that the two streams of liquid formed after condensation can flow directly to the liquid outlet 12 and converge in the water separator 90, thereby improving the effectiveness of the coolant flowing in the condenser 10.

[0051] Furthermore, based on the above embodiments, the condenser 10 also includes at least two first condensation plates and at least two second condensation plates, at least two first condensation plates are installed in the first condensation chamber and are arranged side by side along the second direction of the heat dissipation module 100, and a first condensation flow channel is formed between two adjacent first condensation plates, and at least two second condensation plates are installed in the second condensation chamber and are arranged side by side along the second direction of the heat dissipation module 100, and a second condensation flow channel is formed between two adjacent second condensation plates; wherein the second direction intersects with the first direction.

[0052] After flowing into the condenser 10 from the first air inlet 11 and the second air inlet 13, the gas will be diverted to each of the first condensation channels and the second condensation channels, and then simultaneously contact and exchange heat with multiple first condensation plates and second condensation plates, thereby greatly improving the cooling efficiency and allowing the gas to condense into coolant more quickly and flow back for recycling.

[0053] It is easy to understand that the cooling medium in the condenser 10 in the above embodiment is specifically the air in the first condensation flow channel and the second condensation flow channel. The air transfers the heat of the gas to the first condensation plate and the second condensation plate, and then dissipates the heat to the external environment through the condensation shell 14.

[0054] Alternatively, as an alternative to the above embodiment, the condenser 10 also includes at least two first condensation plates and at least two second condensation plates, at least two first condensation plates are installed in the first condensation chamber and are arranged side by side along the second direction of the heat dissipation module 100, a first condensation flow channel is formed between two adjacent first condensation plates, and a first cavity is formed inside each first condensation plate, and a cooling medium is arranged in the first cavity; at least two second condensation plates are installed in the second condensation chamber and are arranged side by side along the second direction of the heat dissipation module 100, a second condensation flow channel is formed between two adjacent second condensation plates, and a second cavity is formed inside each second condensation plate, and a cooling medium is arranged in the second cavity; wherein the second direction intersects with the first direction.

[0055] The difference from the above embodiment is that the cooling medium contained in the first condensation plate and the second condensation plate performs heat exchange with the gas, thereby absorbing heat and cooling the gas, so that the gas is condensed into a coolant.

[0056] It should be noted that flow sensors 90a may be installed in the first liquid flow branch pipe 21, the second liquid flow branch pipe 22, the first air flow pipeline 30 and the second air flow pipeline 40 respectively to monitor the flow of gas and coolant, so as to detect problems such as poor flow in time.

[0057] Please continue reading Figure 3 and Figure 4 In addition, based on any of the above embodiments, the first heat sink 50 and the second heat sink 60 both include a heat sink shell 60a and at least two heat sink fins 60b, an installation cavity is formed inside the heat sink shell 60a, at least two heat sink fins 60b are installed in the installation cavity and are arranged side by side and spaced apart along the second direction of the heat sink module 100, and a liquid flow channel is formed between two adjacent heat sink fins 60b.

[0058] When in use, the heat dissipation shell 60a is directly attached to the chip to be dissipated or indirectly contacted through a heat transfer medium (such as thermal conductive glue), so that the high-temperature heat generated by the chip can be conducted to the heat dissipation shell 60a, and the heat is further conducted to the heat dissipation fins 60b to exchange heat with the coolant in the installation cavity. The coolant absorbs heat and heats up and vaporizes into gas, thereby cooling the chip; the generated high-temperature gas flows into the condenser 10 and is re-condensed into coolant, and then flows back to the heat dissipation shell 60a, thereby realizing recycling and continuous heat dissipation of the chip.

[0059] Furthermore, the first heat sink 50 and the second heat sink 60 also include a mounting assembly 60c, the mounting assembly 60c includes a mounting member 61c and an elastic member 62c, the heat sink housing 60a is provided with a mounting through hole, the mounting member 61c can be movably inserted into the mounting through hole, and the elastic member 62c abuts between the heat sink housing 60a and the mounting member 61c. Therefore, the first heat sink 50 and the second heat sink 60 can be installed on the mainboard through the mounting assembly 60c, so that the heat sink housing 60a cooperates with the chip in heat transfer.

[0060] Specifically, the mounting member 61c is passed through the mounting through hole and fixedly connected to the mainboard, and the elastic member 62c is compressed to store energy; when the first heat sink 50 and the second heat sink 60 are removed, the mounting member 61c is loosened from the mainboard, and the elastic member 62c releases the elastic force to automatically move away from the mainboard.

[0061] For example, the mounting member 61c is a threaded component such as a screw or a bolt to reduce the difficulty of installation and disassembly while ensuring the connection strength.

[0062] Preferably, there are multiple, for example four, mounting components 60c; the four mounting components 60c are arranged in a rectangular shape around the outer circumference of the heat dissipation housing 60a, thereby further improving the connection reliability by increasing the number of connection points with the mainboard.

[0063] In addition to the above, the present application also provides a server, including a functional device module and a radiator, the radiator and the functional device module cooperate in heat transfer. The radiator includes at least two heat dissipation modules 100 as described in any of the above embodiments, and at least two heat dissipation modules 100 are arranged side by side along a preset direction.

[0064] The functional device module specifically includes a mainboard and a chip, and the chip is mounted on the mainboard.

[0065] There may be a plurality of chips arranged in an array on the mainboard, so a heat sink formed by at least two heat dissipation modules 100 can simultaneously meet the heat dissipation and cooling needs of a plurality of chips.

[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A heat dissipation module, characterized in that: include: A condenser, the condenser is provided with a first air inlet, a liquid outlet, and a second air inlet, the first air inlet and the second air inlet are respectively arranged at opposite ends of the first direction of the heat dissipation module, and the liquid outlet is arranged in the middle of the condenser and is located between the first air inlet and the second air inlet; A liquid flow pipeline, one end of which is connected to the liquid outlet; a first airflow pipeline and a second airflow pipeline, wherein one end of the first airflow pipeline is connected to the first air inlet, and one end of the second airflow pipeline is connected to the second air inlet; and A first heat sink and a second heat sink, wherein the first liquid inlet of the first heat sink is connected to the other end of the liquid flow pipeline, the second liquid inlet of the second heat sink is connected to the other end of the liquid flow pipeline, the first exhaust port of the first heat sink is connected to the other end of the first air flow pipeline, and the second exhaust port of the second heat sink is connected to the other end of the second air flow pipeline.

2. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a first flow diverter, which is installed at the first air inlet and connected to an end of the first air flow pipeline away from the first heat dissipation plate.

3. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a second flow splitter, which is installed at the second air inlet and connected to an end of the second air flow pipeline away from the second heat dissipation plate.

4. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module further includes a water distributor, which is installed at the liquid outlet. The liquid flow pipeline includes a first liquid flow branch pipe and a second liquid flow branch pipe, and the water distributor is connected to the first liquid flow branch pipe and the second liquid flow branch pipe.

5. The heat dissipation module according to claim 1, characterized in that: The condenser includes a condensation shell and a partition plate, wherein the partition plate is installed inside the condensation shell to divide the inner cavity of the condensation shell into a first condensation chamber and a second condensation chamber, wherein the medium flow direction in the first condensation chamber is from the first air inlet toward the liquid outlet, and the medium flow direction in the second condensation chamber is from the second air inlet toward the liquid outlet.

6. The heat dissipation module according to claim 5, characterized in that: The condenser further comprises at least two first condensation plates and at least two second condensation plates, at least two of the first condensation plates are installed in the first condensation chamber and are arranged side by side along the second direction of the heat dissipation module, and a first condensation flow channel is formed between two adjacent first condensation plates, at least two of the second condensation plates are installed in the second condensation chamber and are arranged side by side along the second direction of the heat dissipation module, and a second condensation flow channel is formed between two adjacent second condensation plates; wherein the second direction intersects with the first direction; Alternatively, the condenser also includes at least two first condensation plates and at least two second condensation plates, at least two of the first condensation plates are installed in the first condensation chamber and are arranged side by side along the second direction of the heat dissipation module, a first condensation channel is formed between two adjacent first condensation plates, and a first cavity is formed inside each of the first condensation plates, and a cooling medium is arranged in the first cavity; at least two of the second condensation plates are installed in the second condensation chamber and are arranged side by side along the second direction of the heat dissipation module, a second condensation channel is formed between two adjacent second condensation plates, and a second cavity is formed inside each of the second condensation plates, and a cooling medium is arranged in the second cavity; wherein the second direction intersects with the first direction.

7. The heat dissipation module according to claim 1, characterized in that: The first heat sink and the second heat sink each include a heat sink shell and at least two heat sink fins. An installation cavity is formed inside the heat sink shell. At least two heat sink fins are installed in the installation cavity and are arranged side by side and spaced apart along the second direction of the heat sink module. A liquid flow channel is formed between two adjacent heat sink fins.

8. The heat dissipation module according to claim 7, characterized in that: The first heat sink and the second heat sink also include a mounting assembly, which includes a mounting piece and an elastic piece. The heat sink shell is provided with a mounting through hole, and the mounting piece can be movably inserted into the mounting through hole. The elastic piece abuts between the heat sink shell and the mounting piece.

9. A radiator, characterized in that: It comprises at least two heat dissipation modules according to any one of claims 1 to 8, and at least two of the heat dissipation modules are arranged side by side along a preset direction.

10. A server, characterized in that: include: Functional device module; as well as The heat sink as claimed in claim 9, wherein the heat sink cooperates with the functional device module in heat transfer.

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