Structure and method for inductors with windings of different widths

Abstract

The present disclosure provides structures and methods for inductors having windings of different widths. A structure may include an inductor including a plurality of windings surrounding a magnetic core. Each winding has a first segment within the first wiring layer, the first segment coupled to a second segment within the second wiring layer. The plurality of windings includes a first width in the same direction as the length of the magnetic core and a second width in the same direction as the length of the magnetic core. The second width is greater than the first width.

Description

Technical Field

[0001] The present disclosure provides a structure and method for an inductor with windings of different widths. Background Art

[0002] Integrating soft magnetic materials (i.e., materials that can be magnetized or demagnetized at relatively low energy levels) into integrated circuits (ICs) can be beneficial for improving device performance, particularly in inductors, transformers, and / or other components that operate using magnetic fields. However, components featuring soft magnetic materials are limited in the maximum current that can be achieved in a device due to saturation of the magnetic flux generated by the magnetic field within the soft magnetic material. That is, when the magnetic field strength in an inductor is too high, the current may not be able to increase above a certain maximum value, resulting in an inductor that is functionally indistinguishable from other embodiments that rely on air gaps and / or other open spaces as magnetic field dielectrics. Hybrid device structures that combine soft magnetic materials with empty space can provide higher saturation currents, but undesirably limit the magnetic flux density. Summary of the invention

[0003] The illustrative aspects of the present disclosure are designed to solve the problems described herein and / or other problems not discussed.

[0004] An embodiment of the present disclosure provides a structure including: an inductor, comprising a plurality of windings surrounding a magnetic core, each winding having a first segment within a first wiring layer, the first segment being coupled to a second segment within a second wiring layer, wherein the plurality of windings include: a first winding having a first width along a direction same as the length of the magnetic core; and a second winding having a second width along a direction same as the length of the magnetic core, wherein the second width is greater than the first width.

[0005] Other embodiments of the present disclosure provide a structure comprising: a magnetic core extending a length above a substrate and within a pair of wiring layers of a device; and an inductor above the substrate and comprising a plurality of windings coupled together in series around the magnetic core, each winding having a first segment within a first wiring layer, the first segment coupled to a second segment within a second wiring layer, the first segment and the second segment defining a substantially V-shape, wherein the plurality of windings comprise: a first winding having a first width along a direction identical to the length of the magnetic core; and a second winding having a second width along a direction identical to the length of the magnetic core, wherein the second width is greater than the first width.

[0006] Additional embodiments of the present disclosure provide a method, comprising: providing an inductor, the inductor comprising a plurality of windings surrounding a magnetic core, each winding having a first segment within a first wiring layer, the first segment being coupled to a second segment within a second wiring layer, wherein the plurality of windings comprise: a first winding having a first width along a direction identical to the length of the magnetic core; and a second winding having a second width along a direction identical to the length of the magnetic core, wherein the second width is greater than the first width; and transmitting current through the inductor to induce magnetic flux within the magnetic core, wherein a flux density of the magnetic core in a first portion within the first winding is greater than a flux density of the magnetic core in a second portion within the second winding.

[0007] Two or more aspects described in this disclosure, including aspects described in this Summary, may be combined to form implementations not specifically described herein.

[0008] The details of one or more implementations are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] These and other features of the present disclosure will be more readily understood from the following detailed description of various aspects of the present disclosure taken in conjunction with the accompanying drawings which illustrate various embodiments of the present disclosure, in which:

[0010] Figure 1 A perspective view showing a structure according to an embodiment of the present disclosure.

[0011] Figure 2 A plan view showing a structure according to an embodiment of the present disclosure.

[0012] Figure 3 A side view of the length direction of a structure according to an embodiment of the present disclosure is shown.

[0013] Figure 4 A plan view of a plurality of inductor segments according to an embodiment of the present disclosure is shown.

[0014] Figure 5 A cross-sectional view of a magnetic core and an inductor in two wiring levels of a device according to an embodiment of the present disclosure is shown.

[0015] Figure 6 A cross-sectional view in the width direction of a structure according to an embodiment of the present disclosure is shown.

[0016] Figure 7 A plan view of a structure with annotated magnetic field regions during use according to the method of the present disclosure is shown.

[0017] It should be noted that the drawings of the present disclosure are not necessarily drawn to scale. The drawings are intended only to depict typical aspects of the present disclosure and therefore should not be considered to limit the scope of the present disclosure. In the drawings, similar reference numerals represent similar elements between the drawings. DETAILED DESCRIPTION

[0018] In the following description, reference is made to the accompanying drawings which form a part of the specification and in which are shown by way of illustration specific exemplary embodiments in which the present teachings may be practiced. The description of these embodiments is detailed enough to enable those skilled in the art to practice the present teachings, and it should be understood that other embodiments may be used and changes may be made without departing from the scope of the present teachings. Therefore, the following description is illustrative only.

[0019] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" or "above" another element, it may be directly on the other element or there may be intervening elements. In contrast, when an element is referred to as being "directly on" or "directly above" another element, there are no intervening elements. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element or there may be intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0020] References in the specification to "one embodiment" or "an embodiment" of the present disclosure and other variations thereof mean that the specific features, structures, characteristics, etc. described in conjunction with the embodiment are included in at least one embodiment of the present disclosure. Therefore, the phrases "in one embodiment" or "in an embodiment" and any other variations appearing throughout the specification do not necessarily refer to the same embodiment. It should be understood that, for example, the use of any of " / ", "and / or", and "at least one of" in the case of "A / B", "A and / or B", and "at least one of A and B" is intended to include selecting only the first listed option (A), or only the second listed option (B), or both options (A and B) at the same time. As other examples, in the case of "A, B, and / or C" and "at least one of A, B, and C," these phrases are intended to include selecting only the first listed option (A), or only the second listed option (B), or only the third listed option (C), or only the first and second listed options (A and B), or only the first and third listed options (A and C), or only the second and third listed options (B and C), or all three options (A, B, and C). This scenario can be extended to many of the listed items, as will be apparent to one of ordinary skill in the art.

[0021] The present disclosure provides a structure and method for an inductor having windings of different widths. The structure may include an inductor including a plurality of windings around a magnetic core. Each winding has a first segment within a first wiring layer, the first segment being coupled to a second segment within a second wiring layer. The plurality of windings include: a first winding having a first width in a direction identical to the length of the magnetic core; and a second winding having a second width in a direction identical to the length of the magnetic core. The second width is greater than the first width. Current is transmitted through the inductor to induce magnetic flux in the magnetic core. The different widths of the first winding and the second winding cause the flux density in the magnetic core to be greater in the first winding than in the second winding. Among other benefits, the structure of the present disclosure distributes the flux density across a longer span of the magnetic core, thereby providing a higher saturation current.

[0022] Figure 1 A perspective view of an inductor 100 is provided and Figure 2 A plan view of the inductor 100 in the XY plane is provided. Figure 1 and 2 , embodiments of the present disclosure provide an inductor 100 that can be integrated into an IC structure and / or various other micro-electric devices. The inductor 100 can surround a magnetic core 102, which can include any solid magnetic core material that can be magnetized by the principles of inductance. The magnetic core 102 can be formed of one or more "soft magnetic materials", that is, currently known or later developed substances that can exhibit a magnetic field in response to a relatively low amount of induced current in a conductor. Examples of materials suitable for use in the magnetic core 102 include, but are not limited to: cobalt-zirconium-tantalum alloys, iron-silicon alloys, nickel-iron alloys, ferrous (i.e., iron-based) materials such as "electronic iron", steel and soft ferrites, amorphous and nanocrystalline alloys, etc. The magnetic core 102 is shown by example as being generally rectangular and nearly planar (i.e., having a negligible depth relative to the length and width), but it is understood that the magnetic core 102 can have any of a variety of other shapes (e.g., cylindrical geometry, prismatic geometry, etc.).

[0023] Inductor 100 may include a loop of conductive material (e.g., copper (Cu), aluminum (Al), and / or other materials suitable for use as conductive wire) configured to generate a magnetic field to oppose increases and decreases in current across the span of inductor 100. As discussed herein, inductor 100 may be subdivided into a plurality of individual windings (also referred to as “turns”) that collectively define a conductive loop within inductor 100. In various two-dimensional views of inductor 100 (e.g., Figure 2 plan view), it is emphasized that each winding can be oriented to extend into and out of the paper to define multiple loops of conductive material, even if this is not directly visible from some viewing angles.

[0024] Reference together Figure 2 and 3 ,in Figure 3 A side view of an inductor 100 is provided that includes a plurality of windings (e.g., a first winding 104, a transition winding 107, a second winding 106, and a third winding 109) around a magnetic core 102. Each of the individual windings within the inductor 100 may include a conductive material (e.g., copper (Cu), aluminum (Al), and / or other conductors discussed herein) and may include a set of generally planar segments (e.g., segments 104a, 104b, 106a, 106b, 107a, 107b, 106a, 106b, 107a, 107b, 109a, 109b) that span the width of the magnetic core 102 (i.e., the span of the magnetic core 102 along the Y-axis). Each of the individual segments that define each winding 104, 106, 107, 109 of the inductor 100 may be located within a respective routing layer of an IC structure (e.g., as described elsewhere herein with respect to FIG. 1 ). Figure 5 102). The segments within each winding can be connected together and / or connected to adjacent windings via vertical interconnects 108 that span at least a portion of the depth of the magnetic core 102 (i.e., the span of the magnetic core 102 along the Z-axis). In further implementations, it should be understood that any or all of the segments of the inductor 100 can be structurally continuous, yet distinguishable from each other based on relative size. The non-interconnected portions of the inductor 100 are isolated from each other by one or more insulating materials (e.g., the ILD layers 112, 116 discussed herein). Each winding 104, 106, 107, 109 and its segments can be interconnected by vertical interconnects 108 so that the inductor 100 can direct current from one end (and the terminals coupled thereto) to the other end.

[0025] The first winding 104 of the inductor 100 can have a first width W1 along the length of the magnetic core 102. The first width W1 can be measured in particular along the X-axis and can be measured in a direction parallel to the lengthwise span of the magnetic core 102 along the X-axis. The first width W1 can be, for example, between about 70,000 nanometers (nm) and 90,000 nm, and the gap G1 between adjacent first windings 104 can be between about 5,000 nm and 15,000 nm. Each first winding 104 can have a substantially uniform first width W1 and substantially uniform gaps G1 therebetween. The inductor 100 can also have a second winding 106, each second winding 106 having a second width W2 along the X-axis (i.e., parallel to the length of the magnetic core 102). As shown, the second width W2 is greater than the first width W1 and can be between about 150,000 nm and about 200,000 nm. The second windings 106 may also have substantially uniform gaps G2 between them, and each gap G2 between adjacent second windings 106 may be substantially uniform (e.g., between about 5,000 nm and 15,000 nm). The pitch of each winding 104, 106 (i.e., the sum of the width of one winding and the gap between that winding and the next winding) may thus vary across the entire inductor 100, with the first winding 104 having a smaller pitch than the second winding 106. In embodiments where the gaps G1, G2 are not uniform, the first windings 104 may each have the same first pitch and the second windings 106 may each have the same second pitch that is greater than the first pitch.

[0026] The second winding 106 can be closer to the center C of the magnetic core 102 (e.g., as shown, the center along the length direction of the X axis) than any of the first windings 104. During operation, the greater width of the second winding 106 can produce a lower magnetic flux density within the magnetic core 102 than the magnetic flux density produced by the first winding 104. During operation, the lower magnetic flux density near the center C within the magnetic core 102 can desirably reduce the peak magnetic field strength by about twenty-five percent and thus more evenly distribute the magnetic flux through the magnetic core 102. These benefits can be achieved without changing the current transmitted through the inductor 100. Relative to Figure 7 The operational details and resulting technical benefits are discussed in more detail.

[0027] As shown, the inductor 100 includes one or more transition windings 107 between the first winding(s) 104 and the second winding(s) 106. The transition windings 107 may have a non-uniform width such that a portion of the transition winding 107 closer to the first winding 104 may have a smaller width than a portion of the transition winding 107 closer to the second winding 106. The transition winding 107 may maintain the same size gap G1 or G2 as the first winding 104 and the second winding 106, and thus the presence of the transition winding 107 does not necessarily affect the uniformity of the gaps G1, G2 within the inductor 100 (or the uniform pitch of each set of windings 104, 106, if used).

[0028] The inductor 100 may also include a set of third windings 109, each of which may be sized to have a first width W1 along the length of the magnetic core 102 (or alternatively, a first pitch of the first winding 104). The second winding 106 may be located between the first winding 104 and the third winding 109 along the length of the magnetic core 102. The third winding 109 may be subdivided into segments 109a, 109b, which are coupled together by vertical interconnects 108 in a manner similar to the first winding 104 and the second winding 106. One or more additional transition windings 107 may be located between the second winding 106 and the third winding 109. The density of the magnetic field generated by the second winding 106 in the magnetic core 102 may be less than the density of the magnetic field generated by the first winding 104 and the third winding 109. By including the second winding 106 between the first winding 104 and the third winding 109, the magnetic field density may be more evenly distributed and the magnetic field density near the center C of the magnetic core 102 is less prone to undesirable increases. In turn, the inductor 100 can accommodate higher currents before reaching its saturation state.

[0029] refer to Figure 4 , the segments 104a, 104b, 106a, 106b, 107a, 107b, 106a, 106b, 107a, 107b, 109a, 109b in different wiring layers may be arranged in a generally V-shape. That is, the first segment 104a, 106a, 107a, 109a of a given winding (shown in dashed lines to indicate different horizontal planes) may have a first orientation (e.g., Figure 4 The upper left to lower right orientation shown) and the second segments 104b, 106b, 107b, 109b can have a second orientation (e.g., as shown Figure 4 Thus, each segment 104a, 104b, 106a, 106b, 107a, 107b, 106a, 106b, 107a, 107b, 109a, 109b may be substantially the same in size or shape, but oriented differently to provide the desired shape of the inductor 100. Although in Figure 4 A generally V-shaped is shown in the figure to provide an example. It should be understood that segments 104a, 104b, 106a, 106b, 107a, 107b, 106a, 106b, 107a, 107b, 109a, 109b can be non-linear or even non-curved, and in further implementations, shapes other than the generally V-shaped are also possible.

[0030] Figure 5 A cross-sectional view of an inductor 100 structurally integrated into other components of a device is provided. The inductor 100 can be above a substrate 110, for example, above one or more semiconductor materials. The substrate 110 can include, but is not limited to, silicon, germanium, silicon germanium, silicon carbide, or any other common IC semiconductor or packaging substrate. Strain can be applied to part or all of the semiconductor substrate 110. The substrate 110 is shown as a bulk semiconductor layer, but this is not required in all embodiments. The substrate 110 can include various devices (e.g., transistors, capacitors, diodes, etc.) located thereon at other positions not shown. A first interlayer dielectric (ILD) layer 112 can be on the substrate 110. The first ILD layer 112 can include any currently known or later developed insulating material suitable for separating the various layers of the device from each other, for example, also suitable for use as trench isolation (TI) for electrically separating regions of active semiconductor material or any material used within trench isolation (TI). Such materials can include, but are not limited to: silicon nitride (Si 3 N 4 ), silicon dioxide (SiO 2 ), fluorinated silicon dioxide (FSG), silicon carbon oxide hydride (SiCOH), porous SiCOH, borophosphosilicate glass (BPSG), silsesquioxane, carbon-doped (C) oxides containing silicon (Si), carbon (C), oxygen (O), and / or hydrogen (H) atoms (i.e., organosilicates), thermosetting polyarylethers, spin-on polymer materials containing silicon and carbon, near-frictionless carbon (NFC), or layers thereof. However implemented, the first ILD layer 112 can vertically separate the active material of the inductor 100 from other active materials on or within the substrate 110 and / or other active or conductive components formed in the various metal wiring layers in the device. The inductor 100 can be formed on the first ILD layer 112, for example, by removing a portion of the first ILD layer 112 material to a desired amount (e.g., by etching or other currently known or later developed processing techniques), and forming the inductor 100 and the magnetic core 102 on the remaining portion of the first ILD layer 112.

[0031] Refer together to Figure 5 and Figure 6, some parts of the inductor 100 (eg, the magnetic core 102 and / or the first segments 104a, 106a, 107a, 109a) may be in the first ILD layer 112. Any component within the first ILD layer 112. Figure 5 and Figure 6 Each depicts a cross section of the inductor 100 taken along a different two-dimensional plane and through a portion of the magnetic core 102. The vertical interconnects 108 can couple together different segments of each winding. Specifically, the vertical interconnects 108 can couple together the segments 104a, 104b of the first winding 104, other vertical interconnects 108 couple together the segments 106a, 106b of the second winding 106, other interconnects 108 couple together the segments 107a, 107b, still other interconnects 108 couple together the segments 109a, 109b of the third winding 109, and so on. The vertical interconnects 108 are shown in dashed lines to indicate that they are in the Figure 5 In order to better distribute the current through the windings 104, 106, 107, 109 of different sizes, the segments 104a, 104b, 107a, 107b or segments 109a, 109b of the windings 104, 107, 109, respectively, can be coupled together by a predetermined number of vertical interconnects 108 (e.g., a single vertical interconnect 108), while the segments 106a, 106b of the second winding 106 can be coupled by a greater number (e.g., two or more) of vertical interconnects 108. Other numbers or arrangements of vertical interconnects 108 are also possible.

[0032] An insulating liner 114 may be located on the magnetic core 102 to vertically separate the first ILD layer 112 from other layers formed thereon. The insulating liner 114 may include an insulator of a different type than the first ILD layer 112, for example, it may include a nitride in the case where the first ILD layer 112 includes an oxide insulator. During processing, the insulating liner 114 may be used as an "etch stop layer" to control where certain wiring, vias, etc. will be formed in the structure, and thus may define the upper boundary of the device layer or metal wiring layer thereon.

[0033] Portions of the inductor 100 may be formed in different wiring layers. For example, the inductor 100 may be distributed over a device layer and a metal wiring layer may be above it, or may otherwise be distributed over two different metal wiring layers. Figure 5An example of a device layer and a metal wiring layer thereon is depicted, but the description herein is equally applicable to an inductor 100 formed in two metal wiring layers, each having an ILD material and an insulating liner 114 therebetween. During fabrication, the second segments 104b, 106b, 109b of the windings 104, 106, 109 may be formed in the first ILD layer 112. The magnetic core 102 and the vertical interconnect 108 may be formed thereon, for example, by repeated instances of forming and etching the first ILD layer 112 and the insulating liner 114. When the formation of the first ILD layer 112 and the insulating liner 114 is completed, the inductor 100 may not yet be completed.

[0034] Before additional layers and / or insulating materials are formed over the insulating liner 114, the formation of the inductor 100 may include forming (e.g., by deposition) additional conductive material in the form of a first segment 104a, 106a, 109a of each winding 104, 106, 109. The first segment 104a, 106a, 109a may be located in another ILD on the upper surface of the insulating liner 114 and may be physically connected to the upper surface of the vertical interconnect 108 formed through the insulating liner 114, but may be vertically away from the magnetic core 102. After the segments 104a, 106a, 109a are formed, the inductor 100 defines a conductive path from one terminal to the other terminal and is operable to induce a magnetic field within the magnetic core 102. Further processing may include forming a second ILD layer 116 over the inductor 100 and the insulating liner 114, thereby forming an IC structure having the inductor 100 structurally integrated therein. The formation of the segments 104a, 104b, 106a, 106b, 107a, 107b, 109a, 109b may include etching the ILD layer(s) 116, 116 to define locations for conductive metal formation, depositing the metal, followed by planarization (e.g., chemical mechanical planarization (CMP)), etc. Aspects of these processes may be controlled to provide different widths and / or pitches in different segments 104a, 104b, 106a, 106b, 107a, 107b, 109a.

[0035] Figure 7 1 depicts a plan view of the inductor 100 during operation, wherein current is transmitted between opposite terminals T1, T2 of the inductor 100. The terminals T1, T2 may be coupled to a current source and / or ground (where applicable), and are provided for illustration purposes only. Figure 7The remaining components of the device are omitted. According to an example, the terminal T1 is coupled to a current source and the terminal T2 is coupled to ground so that the current flows from the terminal T1 to the terminal T2. According to the structure of the present disclosure, the inductor 100 can be subdivided into five regions: a first region R1 at a connection with the terminal T1, a second region R2 coupled to the first region R1 opposite to the terminal T, a third region R3 coupled to the second region R2, a fourth region R4 coupled to the third region R3, and a fifth region R5 coupled between the fourth region R4 and the terminal T2. The regions R1, R2 can each include a first winding 104 of the inductor 100. In addition, the region R2 can include one or more transition windings 107 discussed herein. The third region R3 including the center C of the magnetic core 102 can include the second winding 106. The region R4 can include (one or more) transition windings 107 and (one or more) third windings 109, and the region R5 can include (one or more) third windings 109 coupled to the terminal T2.

[0036] As discussed herein, the greater width of the second winding 106 can produce a smaller amount of magnetic flux (and therefore flux density) in the magnetic core 102 due to having fewer "turns" of conductive material in region R3. In conventional inductors having turns of substantially uniform size or width, the magnetic field strength (e.g., measured in amperes per meter (A / m)) may exceed 1500 A / m, or even up to 1900 A / m. These higher intensity magnetic fields may occur at or near the center of a conventional inductor structure. Magnetic fields of such intensity may reduce the saturation (i.e., maximum allowable) current through the inductor, thereby limiting its technical applications. The inductor 100 according to the present disclosure can be used for integration in an IC structure without exhibiting these unacceptably high magnetic field strengths. In embodiments of the present disclosure, the peak magnetic field strength may be in regions R2, R4, up to about 1500 A / m, and more specifically, may be between about 1300 A / m and about 1400 A / m. The higher magnetic field strength in regions R2 and R4 may be due to the greater number of turns in these regions and / or the greater distance between these regions and terminals T1 and T2. In regions R1, R3, and R5, the magnetic field strength may be lower, ranging from about 700 A / m to about 1200 A / m. Therefore, the magnetic field strength through regions R1-R5 is more evenly distributed than the possible magnetic field strength in a conventional inductor structure formed around and / or relying on a magnetic core. As discussed herein, these working benefits come from windings 104, 106, 107, and 109 of different sizes in each region, and thus can allow a higher current to pass through the inductor 100 without saturating the current at an undesirable low level. In contrast, the maximum saturation current of a conventional inductor structure is limited by the peak magnetic field strength generated by its windings. Therefore, the method according to the present disclosure includes providing an inductor 100 according to any embodiment of the present invention, and passing a current (e.g., from terminal T1 to terminal T2) through the inductor 100 to induce magnetic flux in the magnetic core 102. The flux density in a first portion of the inductor 100 (eg, region R2 or region R4 discussed herein) may be greater than the flux density in a region R3 of the inductor 100 that includes the second winding 106 and passes through the center C of the inductor 100 .

[0037] Embodiments of the present disclosure provide various technical and commercial advantages, examples of which are discussed herein. Figure 5 , Figure 6) allows the core 102 to be used in a product without limiting the maximum current in the inductor 100 before saturation. These benefits can be achieved with windings 104, 106, 107, 109 of different widths, and without the need to form slots and / or air gaps in the inductor 100 or nearby components. As discussed herein, embodiments of the present disclosure can reduce the magnetic field strength of the inductor 100 through the center C or near the center C, where the magnetic field strength would otherwise be the highest, by approximately 25%. This in turn allows the magnetic field strength through the core 102 to be more evenly distributed during operation.

[0038] The above-described structures and methods are used for the manufacture of integrated circuit chips. The resulting integrated circuit chips can be distributed by the manufacturer in raw wafer form (i.e., as a single wafer with multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case, the chip is mounted in the form of a single-chip package (e.g., a plastic carrier whose leads are fixed to a motherboard or other higher-level carrier) or a multi-chip package (e.g., a ceramic carrier with surface interconnects and / or buried interconnects). In any case, the chip is then integrated with other chips, discrete circuit elements, and / or other signal processing devices as part of (a) an intermediate product (e.g., a motherboard) or (b) a final product. The final product can be any product that includes an integrated circuit chip, from toys and other low-end applications to advanced computer products with displays, keyboards or other input devices, and central processing units.

[0039] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "one", "an" and "the" are also intended to include plural forms, unless the context clearly states otherwise. It will be further understood that when used in this specification, the terms "include" and / or "comprise" specify the presence of the features, integral bodies, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or the groups they constitute. "Optional" or "optionally" means that the event or situation described subsequently may or may not occur, and the description includes situations where the event occurs and situations where the event does not occur.

[0040] Approximate language used throughout the specification and claims can be used to modify any quantitative representation, which can be allowed to change without causing changes in its related basic functions. Therefore, the value modified by one or more terms such as "about", "approximately" and "substantially" is not limited to the specified exact value. In at least some cases, approximate language can correspond to the precision of the instrument used to measure the value. In this article and throughout the specification and claims, range limitations can be combined and / or interchanged, and such ranges are identified and include all sub-ranges contained therein, unless otherwise specified by context or language. The term "approximately" applied to a specific value of a range is applied to both values ​​of the range at the same time, and unless otherwise based on the precision of the instrument measuring the value, it represents + / -10% of the value.

[0041] The corresponding structures, materials, actions, and equivalents of all means or step-plus-function elements in the following claims are intended to include any structure, material, or action that performs a function in conjunction with other claimed elements specifically claimed. The description of the present disclosure has been given for the purpose of illustration and description, but the description is not intended to be exhaustive or to limit the present disclosure to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the present disclosure. The embodiments are selected and described in order to best explain the principles and practical applications of the present disclosure, and to enable other persons of ordinary skill in the art to understand the various embodiments of the present disclosure with various modifications suitable for the intended specific use.

Claims

1. A structure comprising: An inductor comprising a plurality of windings around a magnetic core, each winding having a first segment within a first wiring layer, the first segment coupled to a second segment within a second wiring layer, wherein the plurality of windings comprises: a first winding having a first width in the same direction as the length of the magnetic core; and A second winding has a second width along the same direction as the length of the magnetic core, wherein the second width is greater than the first width.

2. The structure according to claim 1, wherein: The second winding is closer to the center of the magnetic core than the first winding.

3. The structure according to claim 1, wherein: The plurality of windings further includes a third winding having the first width in a same direction as a length of the magnetic core, wherein the second winding is between the first winding and the third winding.

4. The structure according to claim 1, wherein: The plurality of windings further includes a transition winding between the first winding and the second winding, wherein the transition winding has a non-uniform width.

5. The structure according to claim 1, wherein: Each pair of adjacent windings within the inductor has a substantially uniform gap along the length of the magnetic core.

6. The structure according to claim 1, wherein: The plurality of windings include copper (Cu).

7. The structure according to claim 1, wherein: A single vertical interconnect couples the first segment in the first winding to the second segment, and a plurality of vertical interconnects couple the first segment in the second winding to the second segment.

8. A structure comprising: a magnetic core extending a length above the substrate and within a pair of wiring layers of the device; as well as An inductor over the substrate and comprising a plurality of windings coupled together in series around the magnetic core, each winding having a first segment within a first wiring layer, the first segment coupled to a second segment within a second wiring layer, the first segment and the second segment defining a substantially V-shape, wherein the plurality of windings comprises: a first winding having a first width in the same direction as the length of the magnetic core; as well as A second winding has a second width along the same direction as the length of the magnetic core, wherein the second width is greater than the first width.

9. The structure according to claim 8, wherein: The second winding is closer to the center of the magnetic core than the first winding.

10. The structure according to claim 8, wherein: The plurality of windings further includes a third winding having the first width in a same direction as a length of the magnetic core, wherein the second winding is between the first winding and the third winding.

11. The structure according to claim 8, wherein: The plurality of windings further includes a transition winding between the first winding and the second winding, wherein the transition winding has a non-uniform width.

12. The structure according to claim 8, wherein: Each pair of adjacent windings within the inductor has a substantially uniform gap along the length of the magnetic core.

13. The structure according to claim 8, wherein: The plurality of windings include copper (Cu).

14. The structure according to claim 8, wherein: A single vertical interconnect couples the first segment in the first winding to the second segment, and a plurality of vertical interconnects couple the first segment in the second winding to the second segment.

15. A method comprising: An inductor is provided, the inductor comprising a plurality of windings around a magnetic core, each winding having a first segment within a first wiring layer, the first segment coupled to a second segment within a second wiring layer, wherein the plurality of windings comprises: a first winding having a first width in the same direction as the length of the magnetic core; and a second winding having a second width in the same direction as the length of the magnetic core, wherein the second width is greater than the first width; and A current is passed through the inductor to induce magnetic flux within the magnetic core, wherein a flux density in a first portion of the magnetic core within the first winding is greater than a flux density in a second portion of the magnetic core within the second winding.

16. The method according to claim 15, wherein: The second portion of the magnetic core is closer to a center of the magnetic core than the first portion of the magnetic core.

17. The method according to claim 15, wherein: The inductor further includes a third winding having the first width along the same direction as the length of the magnetic core, and wherein transmitting the current through the inductor causes a flux density in a third portion of the magnetic core within the third winding to be greater than a flux density in the second portion of the magnetic core.

18. The method according to claim 15, wherein: The plurality of windings further includes a transition winding between the first winding and the second winding, wherein the transition winding has a non-uniform width.

19. The method according to claim 15, wherein: Each pair of adjacent windings within the inductor has a substantially uniform gap along the length of the magnetic core.

20. The method according to claim 15, wherein: A single vertical interconnect couples the first segment in the first winding of the inductor to the second segment, and a plurality of vertical interconnects couple the first segment within the second winding of the inductor to the second segment.

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