Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including a body including a dielectric layer and a plurality of inner electrodes, and an outer electrode. The inner electrodes each include a main portion and a lead-out portion extending from the main portion and having a connection terminal in contact with a corresponding one of the outer electrodes. The width of the lead-out portion is gradually reduced from the main portion to the connection terminal. The main portion includes a first saddle disposed on an end portion spaced apart from the lead-out portion, and the lead-out portion includes a second saddle disposed on a side end portion. Thickness of the first saddle portion and the second saddle portion is greater than thickness of a central portion of the main portion. The lead-out portion of the one internal electrode has an overlapping region overlapping the main portion of an adjacent internal electrode of the plurality of internal electrodes.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0162516 filed in the Korean Intellectual Property Office on November 21, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a multilayer electronic component, may be a chip capacitor mounted on a printed circuit board of various electronic products, including image display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smart phones, mobile phones, etc., to charge or discharge the same. Since the multilayer ceramic capacitor may have a small size and high capacitance and may be easily mounted, such a multilayer ceramic capacitor may be used as a component of various electronic devices.

[0004] Generally, the body of a multilayer ceramic capacitor may have a structure in which dielectric layers and inner electrodes are alternately disposed. In addition, the insulation breakdown voltage (BDV) of the multilayer ceramic capacitor may be proportional to the thickness of the dielectric layer. Therefore, it may be important to reduce the thickness of the dielectric layer to improve the capacitance of the multilayer ceramic capacitor and to configure the thickness of the dielectric layer to be uniform to improve the distribution of the insulation breakdown voltage.

[0005] When the inner electrode pattern is formed by printing the conductive paste for the inner electrode, the edge of the inner electrode pattern may have a saddle shape having a thickness greater than that of other portions of the inner electrode pattern.

[0006] In this case, when the ends of the internal electrode patterns overlap each other in the stacking direction, the thickness of the dielectric layer may be locally reduced in the region, so that the distribution of the insulation breakdown voltage of the multilayer ceramic capacitor may become non-uniform.

[0007] In particular, in order to improve the moisture resistance reliability of the multilayer ceramic capacitor, when the internal electrode has a lead portion (bottleneck structure having a relatively narrow width) contacting the external electrode, ends of the internal electrode pattern may need to be prevented from overlapping each other in a stacking direction. Summary of the invention

[0008] Embodiments of the present disclosure are directed to providing a multilayer electronic component with improved reliability.

[0009] According to an embodiment of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the third direction; and external electrodes arranged on the third surface and the fourth surface, wherein each of the plurality of internal electrodes includes a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface, the lead portion having a corresponding one of the external electrodes. a connecting terminal contacted by an external electrode, the width of the lead-out portion in the third direction gradually decreases from the main portion to the connecting terminal, the main portion includes a first saddle portion, the first saddle portion is arranged on an end portion of the main portion spaced apart from the lead-out portion, and the lead-out portion includes a second saddle portion, the second saddle portion is arranged on a side end portion of the lead-out portion in the third direction, the thickness of the first saddle portion and the second saddle portion in the first direction is greater than the thickness of the central portion of the main portion in the second direction in the first direction, and the lead-out portion of an internal electrode has an overlapping area overlapping with the main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction.

[0010] According to another embodiment of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and external electrodes arranged on the third surface and the fourth surface, wherein each of the plurality of internal electrodes includes a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface, the lead portion having a connection terminal contacting a corresponding one of the external electrodes, the width of the lead portion in the third direction gradually decreases from the main portion to the connection terminal, the lead portion of one internal electrode has an overlapping region overlapping with the main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction, and when the width of the connection terminal in the third direction is defined as W1 and the width of the main portion in the third direction is defined as W2, W1 / W2 is greater than or equal to 0.4 and less than or equal to 0.75. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present disclosure; Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 3 is along Figure 1 A cross-sectional view taken along line II-II'; Figure 4A is a plan view showing a first inner electrode according to an embodiment of the present disclosure; Figure 4B is a plan view showing a second inner electrode according to an embodiment of the present disclosure; Figure 4C is a plan view showing a state in which a first internal electrode and a second internal electrode are overlapped with each other according to an embodiment of the present disclosure; Figure 5 It is shown Figure 4C A magnified view of the K1 region in Figure 2; Figure 6 is along Figure 1 A cross-sectional view taken along line III-III'; Figure 7 It is shown Figure 6 A magnified view of the K2 region in Figure 2; Figure 8 is a plan view showing a ceramic green sheet having an internal electrode pattern printed thereon for manufacturing a multilayer electronic component according to an embodiment of the present disclosure; Fig. 9 is corresponding to Figure 4C A plan view showing a state in which the first internal electrode and the second internal electrode are overlapped with each other in a comparative example; and Fig.10 is corresponding to Figure 6 A cross-sectional view showing a comparative example. DETAILED DESCRIPTION

[0012] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0013] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. It should be understood that the various embodiments of the present disclosure, although different, are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structure, shape and size described as an example in the embodiments of the present disclosure may be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments may be modified. Therefore, the following detailed description should not be regarded as having a limiting meaning, and the scope of the present disclosure is limited only by the full scope of the attached claims and the equivalent schemes given by the claims, which are properly interpreted.

[0014] In the accompanying drawings, the same elements will be represented by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the main idea of ​​the present disclosure will be omitted. In the accompanying drawings, some elements may be exaggerated, omitted or briefly shown, and the size of the elements does not necessarily reflect the actual size of these elements. The terms "comprise", "comprising", "constructed to", etc. of the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts or combinations thereof, and do not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, parts or combinations thereof.

[0015] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0016] Multilayer electronic components Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment.

[0017] Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0018] Figure 3 is along Figure 1 A cross-sectional view taken along line II-II'.

[0019] Figure 4A is a plan view showing a first internal electrode according to an embodiment.

[0020] Figure 4B is a plan view showing a second internal electrode according to an embodiment.

[0021] Figure 4C is a plan view illustrating a state in which first and second internal electrodes overlap each other according to an embodiment.

[0022] Figure 5 It is shown Figure 4CA magnified image of the K1 region in Figure 2. Figure 6 is along Figure 1 A cross-sectional view taken along line III-III'.

[0023] Figure 7 It is shown Figure 6 A magnified view of the K2 region in Figure 2.

[0024] Figure 8 is a plan view illustrating a ceramic green sheet having an internal electrode pattern printed thereon for manufacturing a multilayer electronic component according to an embodiment.

[0025] Fig. 9 is corresponding to Figure 4C 2 is a plan view showing a state in which first and second internal electrodes in a comparative example are overlapped with each other.

[0026] Fig.10 is corresponding to Figure 6 A cross-sectional view showing a comparative example.

[0027] In the following, reference will be made to Figures 1 to 10 A multilayer electronic component according to an embodiment is described in more detail. A multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but embodiments thereof are not limited thereto, and the description of the multilayer ceramic capacitor can be applied to various multilayer electronic components such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0028] Reference Figures 1 to 3 , the multilayer electronic component 100 according to the embodiment may include a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 , and external electrodes 131 and 132 .

[0029] The shape of the body 110 may not be limited to any particular shape, but Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the polishing process of the corners of the body, the body 110 may not have a precise hexahedral shape formed by straight lines, but may have a substantially hexahedral shape.

[0030] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0031] The main body 110 may include a dielectric layer 111, and a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged in a first direction, and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122. The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, making it difficult to identify the boundary between them without using a scanning electron microscope (SEM).

[0032] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO 3 as a main component. The perovskite-type compound represented by ABO 3 may include, for example, BaTiO 3 , in which Ca (calcium) and / or Zr (zirconium) are partially solid-solved in BaTiO 3 of (Ba 1- x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1- y Zr y )O 3 (0 < y < 1).

[0033] The internal electrodes 121 and 122 may include, for example, a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged, and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122. That is, the first internal electrode 121 and the second internal electrode 122 (a pair of electrodes with different polarities) may be arranged to face each other, and the dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122.

[0034] The first internal electrode 121 may be spaced apart from the fourth surface 4 and may be connected to a first external electrode 131 on the third surface 3. The second internal electrode 122 may be spaced apart from the third surface 3 and may be connected to a second external electrode 132 on the fourth surface 4.

[0035] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and may more preferably include Ni, but the embodiment is not limited thereto.

[0036] The main body 110 may include a capacitor forming portion Ac and a first covering portion 112 and a second covering portion 113. The capacitor forming portion Ac is arranged in the main body 110 and includes first internal electrodes 121 and second internal electrodes 122 that are alternately arranged and a dielectric layer 111 is interposed between the first internal electrodes 121 and the second internal electrodes 122. The first covering portion 112 and the second covering portion 113 are arranged on two surfaces of the capacitor forming portion Ac that are opposite to each other in a first direction.

[0037] The body 110 may include a first edge portion 114 and a second edge portion 115 disposed on two surfaces of the capacitance forming portion Ac that are opposite to each other in the third direction. In other words, the edge portions 114 and 115 may refer to regions between both ends of the internal electrodes 121 and 122 and the outer surface of the body 110 in a cross section of the body 110 taken along the first direction and the third direction.

[0038] The cover portions 112 and 113 and the edge portions 114 and 115 may prevent damage to the internal electrodes due to physical stress and / or chemical stress. The cover portions 112 and 113 and the edge portions 114 and 115 may have a configuration similar to that of the dielectric layer 111 except that they do not include the internal electrodes.

[0039] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. In addition, the external electrodes 131 and 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0040] The external electrodes 131 and 132 may include first electrode layers 131 a and 132 a contacting the internal electrodes 121 and 122 and second electrode layers 131 b and 132 b disposed on the first electrode layers 131 a and 132 a .

[0041] The first electrode layers 131a and 132a may include metal and glass. The first electrode layers 131a and 132a may be, for example, sintered electrodes. The metal included in the first electrode layers 131a and 132a may include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy thereof, but the embodiment is not limited thereto.

[0042] The second electrode layers 131b and 132b may improve mounting characteristics. The types of the second electrode layers 131b and 132b are not limited to any specific example, and may be a plating layer including Ni, Sn, Pd, and / or an alloy thereof, or may be formed as a multilayer. The second electrode layers 131b and 132b may be, for example, a Ni plating layer or a Sn plating layer, or may be formed by sequentially forming a Ni plating layer and a Sn plating layer. In addition, the second electrode layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0043] In the drawings, the multilayer electronic component 100 may have two external electrodes 131 and 132 , but embodiments thereof are not limited thereto, and the number of the external electrodes 131 and 132 and their shapes may vary according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0044] In the following, reference will be made to FIG. 4A to FIG. 7 The internal electrodes 121 and 122 of the multilayer electronic component 100 according to the embodiment are described in more detail.

[0045] Reference Figure 4A and Figure 4B The plurality of internal electrodes 121 and 122 may include main portions 121a and 122a and lead portions 121b and 122b extending from the main portions 121a and 122a toward the third surface 3 or the fourth surface 4 and having connection terminals E11 and E21 contacting the external electrodes 131 and 132.

[0046] That is, the first internal electrode 121 may include a first main portion 121a and a first lead portion 121b extending from the first main portion 121a toward the third surface 3 and having a connection terminal E11 in contact with the first external electrode 131. For example, an outer edge of the first internal electrode 121 may have the connection terminal E11 in contact with the first external electrode 131, an end portion E12 of the first main portion 121a spaced apart from the first lead portion 121b, a side end portion E13 of the first lead portion 121b in the third direction, and a side end portion E14 of the first main portion 121a in the third direction.

[0047] The second internal electrode 122 may include a second main portion 122a and a second lead portion 122b extending from the second main portion 122a toward the fourth surface 4 and having a connection terminal E21 in contact with the second external electrode 132. For example, an outer edge of the second internal electrode 122 may include the connection terminal E21 in contact with the second external electrode 132, an end portion E22 of the second main portion 122a spaced apart from the second lead portion 122b, a side end portion E23 of the second lead portion 122b in the third direction, and a side end portion E24 of the second main portion 122a in the third direction.

[0048] The main parts 121a and 122a may have a flat shape perpendicular to the first direction. The main parts 121a and 122a may be spaced apart from the outer surface of the body 110. The main parts 121a and 122a may have a substantially quadrilateral shape (e.g., a rectangular shape). The side ends E14 and E24 of the main parts 121a and 122a in the third direction may be substantially parallel to the fifth surface 5 and the sixth surface 6. The concept that the side ends E14 and E24 of the main parts 121a and 122a in the third direction are substantially parallel to the fifth surface 5 and the sixth surface 6 may mean that the side ends E14 and E24 of the main parts 121a and 122a in the third direction and the fifth surface 5 or the sixth surface 6 may be completely parallel to each other, or the angle formed by the extension lines of the side ends E14 and E24 of the main parts 121a and 122a in the third direction and the extension lines of the fifth surface 5 or the sixth surface 6 may be 10° or less, or 5° or less. At least a portion of the first main portion 121a may overlap the second main portion 122a in the first direction, thereby forming a capacitor of the multilayer electronic component 100. The lead portion 121b or 122b may be led out to the third surface 3 or the fourth surface 4, and may be spaced apart from the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The lead portions 121b and 122b may connect the main portions 121a and 122a to the external electrodes 131 and 132.

[0049] Reference Figure 4C , the width W1 of the connection terminal E11 in the third direction may be narrower than the width W2 of the main portion 121a in the third direction. Therefore, by reducing the exposed area of ​​the internal electrodes 121 and 122, the moisture resistance reliability of the multilayer electronic component 100 may be improved, and cracks in the body 110 may be prevented. In addition, cracks (A / C cracks) between the capacitance forming portion Ac and the covering portions 112 and 113 may be prevented.

[0050] The ratio W1 / W2 of W1 to W2 may not be limited to any specific example, and W1 / W2 may be greater than or equal to 0.4 and less than or equal to 0.75. When W1 / W2 exceeds 0.75, the effects of improving moisture resistance reliability and suppressing A / C cracks may be insufficient. In addition, when W1 / W2 is less than 0.4, the connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 may be deteriorated, which may be a side effect.

[0051] As long as W1<W2 can be satisfied, the lead portions 121b and 122b can have any shape. However, in the embodiment, the width of the lead portions 121b and 122b in the third direction can be gradually reduced from the main portions 121a and 122a to the connection terminals E11 and E21. That is, the width of the first lead portion 121b in the third direction can be gradually reduced from the first main portion 121a toward the third surface 3, and the width of the second lead portion 122b in the third direction can be gradually reduced from the second main portion 122a toward the fourth surface 4. For example, Figure 4A and Figure 4B As shown, the side ends E13 and E23 of the lead-out portions 121b and 122b in the third direction may have a curved shape. For example, the side ends E13 and E23 of the lead-out portions 121b and 122b in the third direction may have a convex shape toward the central portion of the body 110 in the third direction.

[0052] Reference Figure 4C , the body 110 may include a first corner portion C1 connecting the third surface 3 to the fifth surface 5, a second corner portion C2 connecting the third surface 3 to the sixth surface 6, a third corner portion C3 connecting the fourth surface 4 to the fifth surface 5, and a fourth corner portion C4 connecting the fourth surface 4 to the sixth surface 6. In order to prevent the corner portions C1, C2, C3, and C4 of the body 110 from being crushed (crushing defects), the body 110 may be polished after sintering. Therefore, each of the corner portions C1, C2, C3, and C4 may have a rounded shape.

[0053] In an embodiment, the connection terminals E11 and E21 may be spaced apart from the corner portions C1, C2, C3, and C4. The corner portions C1, C2, C3, and C4 of the body 110 may be susceptible to external moisture penetration. Therefore, when the connection terminals E11 and E21 contact the corner portions C1, C2, C3, and C4, the moisture resistance reliability of the multilayer electronic component 100 may deteriorate. Therefore, the connection terminals E11 and E21 may be spaced apart from the corner portions C1, C2, C3, and C4.

[0054] Reference FIG. 4A to FIG. 5In an embodiment, the radius of curvature Rc of the corner portions C1, C2, C3, and C4 may be greater than the distance Wm between the side ends E14 and E24 of the main portions 121a and 122a in the third direction and the fifth surface 5 or the sixth surface 6. That is, in an embodiment, Rc>Wm may be satisfied. Wm may refer to the width of the edge portions 114 and 115 in the third direction. Rc and Wm may satisfy Rc>Wm, thereby preventing the edge portions 114 and 115 from being separated from the side surface of the capacitance forming portion Ac.

[0055] Rc may satisfy, for example, Rc≤22 μm. When Rc exceeds 22 μm, the thickness of the external electrodes 131 and 132 on the corner portions C1, C2, C3, and C4 may be excessively reduced. The lower limit of Rc may not be limited to any specific example, and may satisfy, for example, 6 μm≤Rc. When Rc is less than 6 μm, a chipping defect may occur.

[0056] For example, Wm may satisfy Wm≤20 μm. When Wm exceeds 20 μm, it may be difficult to achieve miniaturization and high capacitance of the multilayer electronic component 100. The lower limit of Wm may not be limited to any specific example, and may satisfy, for example, 5 μm≤Wm. When Wm is less than 5 μm, the reliability of the multilayer electronic component 100 may be reduced.

[0057] Reference Figure 6 and Figure 7 In the case of the multilayer electronic component 100 according to the embodiment, the main parts 121a and 122a may include first saddles 21a and 22a disposed on ends E12 and E22 of the main parts 121a and 122a spaced apart from the lead-out parts 121b and 122b, and the lead-out parts 121b and 122b may include second saddles 21b and 22b disposed on side ends E13 and E23 of the lead-out parts 121b and 122b in the third direction. The thickness of the first saddles 21a and 22a and the second saddles 21b and 22b in the first direction may be greater than the thickness of the central portion of the main parts 121a and 122a in the second direction in the first direction, respectively. That is, the thickness of the first saddle-shaped portion 21a and the second saddle-shaped portion 21b of the first inner electrode 121 in the first direction may be greater than the thickness of the central portion of the first main portion 121a in the second direction in the first direction, and the thickness of the first saddle-shaped portion 22a and the second saddle-shaped portion 22b of the second inner electrode 122 in the first direction may be greater than the thickness of the central portion of the second main portion 122a in the second direction in the first direction.

[0058] As will be described later, when a conductive paste for an inner electrode is printed on a ceramic green sheet to form an inner electrode pattern, the thickness of the outer edge of the inner electrode pattern may be greater than the thickness of other portions. The first saddle portions 21a and 22a may be formed on ends E12 and E22 of the main portions 121a and 122a corresponding to the outer edge of the inner electrode pattern, spaced apart from the lead portions 121b and 122b, and the second saddle portions 21b and 22b may be formed on side ends E13 and E23 of the lead portions 121b and 122b in the third direction corresponding to the outer edge of the inner electrode pattern.

[0059] The thickness of the first saddle portions 21a and 22a and the second saddle portions 21b and 22b may not be limited. Figure 6 and Figure 7 As shown, when the maximum thickness of the first saddle portions 21a and 22a in the first direction is defined as t1, the maximum thickness of the second saddle portions 21b and 22b in the first direction is defined as t2, and the average thickness of the central portion of the main parts 121a and 122a in the second direction in the first direction is defined as te, the ratio t1 / te of t1 to te may be greater than or equal to 1.045 and less than or equal to 1.085. In addition, the ratio t2 / te of t2 to te may be greater than or equal to 1.045 and less than or equal to 1.085. It is not necessary to limit te to any specific example, and te may be greater than or equal to 0.1 μm and less than or equal to 0.6 μm. In addition, the length Ls1 of the first saddle portions 21a and 22a in the second direction and the length Ls2 of the second saddle portions 21b and 22b in the second direction may not be limited to any specific example, for example, Ls1 and Ls2 may be 70 μm to 85 μm, respectively.

[0060] t1, t2, Ls1, and Ls2 may be obtained by scanning a cross section in the first direction and the second direction intersecting the side ends E13 and E23 of the lead-out portion in the third direction using a scanning electron microscope (SEM). Figure 6 Each of t1, t2, Ls1, and Ls2 may refer to an average value of values ​​measured at 10 inner electrodes 121 and 122.

[0061] te can be obtained by scanning a cross section in the first direction and the second direction (eg, Figure 6More specifically, te can be obtained by measuring the thickness at a plurality of points (e.g., 30 points equally spaced in the second direction) disposed in the central portion of one of the main parts 121a and 122a in the second direction and averaging the same. te can be more generalized by averaging the thickness after performing the measurement on 10 main parts 121a and 122a.

[0062] Reference Figure 4C and Figure 5 , the lead portion of one internal electrode may have an overlapping region Ro overlapping with a main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction. For example, a portion of the first lead portion 121b may overlap with the second main portion 122a in the first direction, and a portion of the second lead portion 122b may overlap with the first main portion 121a in the first direction. For example, the maximum length of the first lead portion 121b in the second direction may be greater than the distance between an end portion E22 of the second main portion 122a spaced apart from the second lead portion 122b and the third surface 3, and the maximum length of the second lead portion 122b in the second direction may be greater than the distance between an end portion E12 of the first main portion 121a spaced apart from the first lead portion 121b and the fourth surface 4.

[0063] Therefore, if Figure 6 As shown, in the cross section of the body 110 in the first and second directions passing through the region adjacent to the side ends E14 and E24 of the main portions 121a and 122a in the third direction, the first saddle portions 21a and 22a of the inner electrodes 121 and 122 adjacent in the first direction among the plurality of inner electrodes may not overlap with the second saddle portions 22b and 21b of the inner electrodes 121 and 122 adjacent in the first direction among the plurality of inner electrodes in the first direction. For example, in the cross section of the body 110 in the first and second directions passing through the region adjacent to the side ends E14 and E24 of the main portions 121a and 122a in the third direction, the first saddle portion 21a of the first inner electrode 121 may not overlap with the second saddle portion 22b of the adjacent second inner electrode 122 in the first direction, and the first saddle portion 22a of the second inner electrode 122 may not overlap with the second saddle portion 21b of the adjacent first inner electrode 121 in the first direction.

[0064] Fig. 9 is corresponding to Figure 4C 2 is a plan view showing a state in which a first internal electrode and a second internal electrode are overlapped with each other in a comparative example. Fig.10 is corresponding to Figure 6 A cross-sectional view showing a comparative example.

[0065] Reference Fig. 9 and Fig.10 , in the comparative example, the first lead-out portion 121b' of the first inner electrode 121' may not overlap with the second main portion 122a' of the second inner electrode 122' in the first direction. In addition, the second lead-out portion 122b' of the second inner electrode 122' may not overlap with the first main portion 121a' of the first inner electrode 121' in the first direction. In this case, in the cross-section of the main body 110 in the first and second directions passing through the region adjacent to the side ends of the main portions 121a' and 122a' in the third direction, the first saddle portion 21a' provided at the end E12' of the first main portion 121a' spaced apart from the first lead-out portion 121b' and the second saddle portion 22b' provided at the side end E23' of the second lead-out portion 122b' in the third direction may overlap with each other in the first direction. In addition, in the cross-section of the main body 110 in the first and second directions passing through the region adjacent to the side ends of the main portions 121a' and 122a' in the third direction, the first saddle portion 22a' provided at the end E22' of the second main portion 122a' spaced apart from the second lead-out portion 122b' and the second saddle portion 21b' provided at the side end E13' of the first lead-out portion 121b' in the third direction may overlap with each other in the first direction.

[0066] As Fig.10 shown, in the comparative example, the region where the first saddle portions 21a' and 22a' overlap with the second saddle portions 22b' and 21b' in the first direction (i.e., the region where the thickness of the dielectric layer 111 is locally reduced) may increase, such that the insulation breakdown voltage characteristics of the multilayer electronic component may deteriorate. Compared with the comparative example, in the embodiment of the present disclosure (e.g., Figure 6 ), the region where the first saddle portions 21a and 22a overlap with the second saddle portions 22b and 21b in the first direction (i.e., the region where the thickness of the dielectric layer 111 is locally reduced) can be relatively reduced. Therefore, the deterioration of the insulation breakdown voltage characteristics of the multilayer electronic component 100 can be prevented.

[0067] The length of the overlapping region Ro may not be limited. However, referring to Figure 5 , when the maximum length of the overlapping region Ro in the second direction is defined as Lo, Lo may be 25 μm or greater. When Lo is less than 25 μm, the effect of improving the insulation breakdown voltage (BDV) characteristics in the embodiment may be insufficient. The upper limit of Lo may not be limited to any specific example and may be, for example, 75 μm or less. When Lo exceeds 75 μm, the length of the main portion in the second direction may decrease, and the area of the non-overlapping region Rn (to be described later) may increase, such that the capacitance of the multilayer electronic component 100 may deteriorate, which may be a side effect.

[0068] Referring to Figure 5 , when the region of the lead-out portion 121b other than the overlapping region Ro is defined as the edge region Rm, the maximum length Lm of the edge region Rm in the second direction may be greater than or equal to 5 μm and less than or equal to 45 μm. When Lm is less than 5 μm, the moisture penetration path of external moisture into the inner electrode may be shortened, so that the moisture resistance reliability of the multilayer electronic component 100 may be reduced. In addition, when Lm exceeds 45 μm, the overlapping region Ro may be reduced, so that the capacitance of the multilayer electronic component 100 may be reduced.

[0069] Reference FIG. 4A to FIG. 5 , the main parts 121a and 122a may include a non-overlapping region Rn that does not overlap with adjacent internal electrodes of the plurality of internal electrodes 121 and 122 in the first direction. The non-overlapping region Rn may be provided at both ends of the end portions E12 and E22 of the main parts 121a and 122a spaced apart from the lead-out portions 121b and 122b in the third direction. That is, each of the first main part 121a and the second main part 122a may have two non-overlapping regions Rn.

[0070] In an embodiment, the area ratio of the non-overlapping region Rn to the entire area of ​​the main parts 121a and 122a may be greater than or equal to 0.8% and less than or equal to 1.5%. That is, the area ratio of the two non-overlapping regions Rn included in the first main part 121a to the entire area of ​​the first main part 121a may be greater than or equal to 0.8% and less than or equal to 1.5%, and the area ratio of the two non-overlapping regions Rn included in the second main part 122a to the entire area of ​​the second main part 122a may be greater than or equal to 0.8% and less than or equal to 1.5%. When the area ratio of the non-overlapping region Rn to the entire area of ​​the main parts 121a and 122a is less than 0.8%, the effect of improving the insulation breakdown voltage characteristics in the embodiment may be insufficient. When the area ratio of the non-overlapping region Rn to the entire area of ​​the main parts 121a and 122a is greater than 1.5%, the capacitance of the multilayer electronic component 100 may deteriorate, which may be a side effect.

[0071] The area ratio of W1, W2, Rc, Wm, Lo, Lm and the non-overlapping region Rn can be measured in an image obtained by scanning a cross section of the multilayer electronic component 100 in the second direction and the third direction through the center of the body 110 in the first direction using a scanning electron microscope (SEM). Rc may refer to the average value of the measured values ​​of the radius of curvature in the first corner portion C1, the second corner portion C2, the third corner portion C3 and the fourth corner portion C4. Wm may refer to the average value of the width of the edge portions 114 and 115 in the third direction measured at five points equally spaced in the second direction. In addition, Wm may refer to the average width of the first edge portion 114 and the second edge portion 115 in the third direction.

[0072] The size of the multilayer electronic component 100 may not be particularly limited. For example, the maximum length of the multilayer electronic component 100 in the second direction may be 0.6 mm to 1.6 mm, and the maximum width of the multilayer electronic component 100 in the third direction may be 0.3 mm to 0.8 mm, but embodiments are not limited thereto.

[0073] The average thickness of the dielectric layer 111 may not be limited to any specific example. However, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the dielectric layer 111 may be greater than or equal to 0.1 μm and less than or equal to 0.6 μm. The average thickness of the dielectric layer 111 may refer to the average size of the dielectric layer 111 in the first direction. The average thickness of the dielectric layer 111 can be measured by scanning the cross section of the body 110 in the first direction and the second direction at a magnification of 10,000 times using a scanning electron microscope (SEM). More specifically, the average thickness of the dielectric layer 111 can be obtained by measuring the thickness at a plurality of points of the dielectric layer 111 (for example, 30 points equally spaced in the second direction) and averaging them. For example, 30 points may be specified in the central portion of the main parts 121a and 122a in the second direction. By performing thickness measurements on 10 dielectric layers 111 to obtain an average value, the average thickness of the dielectric layer 111 can be more generalized.

[0074] The average thickness of the covering portions 112 and 113 may not be limited to any specific example. However, in order to achieve miniaturization and high capacitance of multilayer electronic components, the average thickness of the covering portions 112 and 113 may be 20 μm or less, but embodiments thereof are not limited thereto. Here, the average thickness of the covering portions 112 and 113 may refer to the average thickness of each of the first covering portion 112 and the second covering portion 113. The average thickness of the covering portions 112 and 113 may refer to the average size of the covering portions 112 and 113 in the first direction, and may be the average value of the size of the covering portions 112 and 113 in the first direction and the second direction measured at five points equally spaced in the second direction in a cross section of the main body 110 passing through the center of the main body 110 in the third direction.

[0075] In the following, please refer to Figure 8 An example of a method of manufacturing the multilayer electronic component 100 according to the embodiment is described.

[0076] First, the green ceramic sheet 211 can be prepared in the following manner: Prepare a ceramic slurry including ceramic powder, an organic solvent, and a binder, and coat the ceramic slurry on a carrier film and dry the ceramic slurry. The green ceramic sheet 211 can form the dielectric layer 111 through sintering. The ceramic powder is not limited to any specific example as long as sufficient electrostatic capacitance can be obtained. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. Examples of the ceramic powder can include BaTiO 3 , in which Ca (calcium) and / or Zr (zirconium) are partially solid-solved in BaTiO 3 of (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1). Ethanol can be used as the organic solvent, polyvinyl butyral can be used as the binder, and commonly used materials can be used as the organic solvent and the binder.

[0077] Thereafter, the first internal electrode pattern 221 or the second internal electrode pattern 222 can be printed on the green ceramic sheet 211. The internal electrode patterns 221 and 222 can form the internal electrodes 121 and 122 through sintering. The internal electrode patterns 221 and 222 can be formed by printing a conductive paste for the internal electrode including metal powder, binder, solvent, etc. on the green ceramic sheet 211 using a screen printing method or a gravure printing method.

[0078] Specifically, a plurality of first internal electrode patterns 221 set at a predetermined distance can be formed on the first green ceramic sheet. The plurality of first internal electrode patterns 221 can have a strip shape and can be formed parallel to each other. In addition, a plurality of second internal electrode patterns 222 set at a predetermined distance can be formed on the second green ceramic sheet. The plurality of second internal electrode patterns 222 can have a strip shape and can be formed parallel to each other.

[0079] Thereafter, a plurality of hole portions 205 may be formed in the first inner electrode pattern 221, and a plurality of hole portions 206 may be formed in the second inner electrode pattern 222. The hole portions 205 and 206 may refer to areas in which the inner electrode patterns are not formed. The hole portions 205 and 206 may be divided into two parts by a first cutting line CL1 parallel to the width direction (third direction), and may be divided into two parts by a second cutting line CL2 parallel to the length direction (second direction). The shapes of the hole portions 205 and 206 may not be limited to any specific example, and the hole portions 205 and 206 may have a circular shape or an elliptical shape to prevent problems such as printing bleeding. Preferably, the maximum length of the hole portions 205 and 206 in the second direction may be longer than the distance between the inner electrode patterns 221 in the second direction and the distance between the inner electrode patterns 222 in the second direction.

[0080] Figure 8 Each of the outer edges 201 and 202 of the first inner electrode pattern 221 and the outer edges 203 and 204 of the second inner electrode pattern 222 shown in FIG. 2 may have a saddle portion having a thickness greater than that of other portions of the inner electrode patterns 221 and 222 .

[0081] Outer edges 201 and 202 of the first inner electrode pattern 221 and outer edges 203 and 204 of the second inner electrode pattern 222 may correspond to end portions E12 and E22 of the main portions 121a and 122a spaced apart from the lead-out portions 121b and 122b, respectively. Figure 6 The first saddle portions 21 a and 22 a shown in FIG. 2 may be obtained from outer edges 201 and 202 of the first inner electrode pattern 221 and outer edges 203 and 204 of the second inner electrode pattern 222 .

[0082] also, Figure 8 Each of the outer edges of the hole portions 205 and 206 shown in FIG. 2 may have a saddle portion having a thickness greater than that of other portions of the inner electrode patterns 221 and 222 .

[0083] The outer edge of the hole portion 205 of the first inner electrode pattern 221 and the outer edge of the hole portion 206 of the second inner electrode pattern 222 may correspond to the side end portions E13 and E23 of the lead-out portions 121b and 122b in the third direction. That is, Figure 6 The second saddle portions 21 b and 22 b shown in FIG. 2 may be obtained from outer edges of the hole portions 205 and 206 of the inner electrode patterns 221 and 222 .

[0084] After that, by alternating the Figure 8The ceramic laminate is formed by printing a first ceramic green sheet having a first internal electrode pattern 221 thereon and a second ceramic green sheet having a second internal electrode pattern 222 thereon as shown in FIG. A predetermined number of sheets for forming a covering portion on which the internal electrode pattern is not printed may be stacked on the upper and lower portions of the ceramic laminate. The sheets for forming the covering portion may be sintered to form the covering portions 112 and 113.

[0085] Thereafter, the ceramic laminate may be pressed, and a ceramic sheet may be obtained by cutting along cutting lines CL1 and CL2. Thereafter, a sheet for forming an edge portion may be attached to both side surfaces of the ceramic sheet in the third direction. The sheet for forming an edge portion may be formed into edge portions 114 and 115 by sintering.

[0086] Thereafter, by sintering the ceramic sheet to which the sheet for forming the edge portion is attached, a Figures 1 to 3 , a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 is shown in FIG. The sintering temperature for forming the body 110 may not be limited to any specific example, and, for example, may be greater than or equal to 1100° C. and less than or equal to 1300° C. Thereafter, a barrel polishing process may be performed so that each of the corner portions C1, C2, C3, and C4 of the body 110 has a rounded shape.

[0087] Thereafter, the external electrodes 131 and 132 may be formed. The first electrode layers 131a and 132a may be formed by dipping the body 110 in a conductive paste including metal powder and glass and performing sintering. The sintering temperature for forming the first electrode layers 131a and 132a may not be limited to any specific example and may be, for example, 700°C to 900°C.

[0088] Thereafter, the second electrode layers 131b and 132b may be formed on the first electrode layers 131a and 132a. A method of forming the second electrode layers 131b and 132b may not be limited to any specific example, and for example, electrolytic plating and / or chemical plating may be used.

[0089] However, the above-described manufacturing method is merely an example, and the method of manufacturing the multilayer electronic component 100 is not limited to the above-described manufacturing method.

[0090] (Experimental example) The sample piece was prepared by the above-mentioned manufacturing method. Specifically, a BaTiO 3 The ceramic green sheet was manufactured by using a ceramic slurry of a powder, and an internal electrode pattern was printed on the ceramic green sheet using a conductive paste for internal electrodes including Ni powder. In addition, a first metal layer of the sample sheet was formed using a conductive paste including Cu powder, and a Ni plating layer and a Sn plating layer were sequentially stacked to form a second metal layer of the sample sheet.

[0091] The sample sheet was manufactured to have a 1005 size (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm), a width W2 of the main portion was 600 μm, a distance Wm between the side end portion of the main portion in the third direction and the fifth surface or the sixth surface was approximately 14 μm, a curvature radius Rc of the corner portion was approximately 15 μm, and a maximum length Lm of the edge area was approximately 40 μm.

[0092] After that, 10 sample pieces were prepared for each sample number, and the cross-section in the second and third directions polished to the center of each sample piece in the first direction was observed by an optical microscope (OM) at a magnification of 500 times or more. After that, Lo was measured for the side end portions in the third direction of the four lead-out portions, and the average value thereof was calculated. The average value was measured for 10 sample pieces, and the final average value was listed in Table 1 below. Similarly, W1 and W2 were measured for 10 sample pieces, and the average values ​​were listed in Table 1 below. For sample numbers 1 to 3 in which Lo was 0 μm, there was no such Fig. 9 and Fig.10 The overlapping area shown in the comparative example of .

[0093] After that, for the sample piece of each sample number, the crack (A / C crack) between the capacitance forming part and the covering part was observed. 50 sample pieces were prepared for each sample number, the cross section in the first direction and the second direction passing through the center of the sample piece in the third direction was observed, and when any sample piece had 100nm or more of peeling between the capacitance forming part and the covering part, the sample piece was determined to be "bad" (NG), and when no peeling occurred, the sample piece was determined to be "normal" (OK).

[0094] In addition, for each sample number, the average value of the insulation breakdown voltage, the standard deviation of the insulation breakdown voltage (Stdv), and the coefficient of variation (CV) of the insulation breakdown voltage were measured under the conditions of a voltage boost speed of 20V / sec and a current limit of 20mA. Thereafter, when the average value of the insulation breakdown voltage was 90V or higher, the standard deviation of the insulation breakdown voltage was 12V or lower, and the coefficient of variation of the insulation breakdown voltage was 12.5% ​​or lower, the sample was determined to be "normal" (OK), and when at least one of the above three conditions was not met, the sample was determined to be "defective" (NG).

[0095] [Table 1]

[0096] Referring to Table 1, A / C cracks occurred in sample numbers 3, 6, 9, and 12 where W1 / W2 was greater than 0.75. In addition, in sample numbers 1 to 3 where the lead portion did not have an overlapped region, the dielectric breakdown voltage characteristics deteriorated.

[0097] According to the aforementioned embodiments, a multilayer electronic component having improved reliability can be provided.

[0098] The scope of the present disclosure is not limited to the specific embodiments. Rather, modifications, equivalents and alternatives included in the disclosed concepts and technical scope of the present specification may be adopted. Throughout the specification, similar reference numerals are used for similar elements.

[0099] In the embodiments, the term "embodiment" may not refer to the same embodiment, and may be provided to describe and emphasize different features of each embodiment. The proposed embodiment may be implemented without excluding the possibility of combining with features of other embodiments. For example, even if a feature described in an embodiment is not described in another embodiment, the description may be understood to be related to another embodiment unless otherwise stated.

[0100] The terms "first", "second", etc. may be used to distinguish one element from another element, and may not limit the order and / or importance or other related to the elements. In some cases, without departing from the scope of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0101] While embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and a plurality of inner electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; as well as external electrodes, disposed on the third surface and the fourth surface, wherein each of the plurality of internal electrodes comprises a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface, the lead portion having a connection terminal in contact with a corresponding one of the external electrodes, wherein the width of the lead-out portion in the third direction gradually decreases from the main portion to the connecting terminal, wherein the main portion includes a first saddle portion, which is disposed on an end of the main portion spaced apart from the lead-out portion, and the lead-out portion includes a second saddle portion, which is disposed on a side end of the lead-out portion in the third direction, wherein the thickness of the first saddle-shaped portion and the second saddle-shaped portion in the first direction is greater than the thickness of the central portion of the main portion in the second direction in the first direction, and The lead portion of one internal electrode has an overlapping region overlapping with the main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction.

2. The multilayer electronic component according to claim 1, wherein When the width of the connection terminal in the third direction is defined as W1 and the width of the main portion in the third direction is defined as W2, W1 / W2 is greater than or equal to 0.4 and less than or equal to 0.

75.

3. The multilayer electronic component according to claim 1, wherein: When the maximum length of the overlapping region in the second direction is defined as Lo, Lo is 25 μm or more.

4. The multilayer electronic component according to claim 3, wherein: Lo is 75 μm or less.

5. The multilayer electronic component according to claim 1, wherein When the maximum thickness of the first saddle portion in the first direction is defined as t1 and the average thickness of the central portion of the main portion in the second direction in the first direction is defined as te, a ratio t1 to te t1 / te is greater than or equal to 1.045 and less than or equal to 1.

085.

6. The multilayer electronic component according to claim 1, in, When a region of the lead-out portion excluding the overlapped region is defined as a margin region, a maximum length of the margin region in the second direction is greater than or equal to 5 μm and less than or equal to 45 μm.

7. The multilayer electronic component according to claim 1, wherein: The side end portion of the lead-out portion in the third direction has a bent shape.

8. The multilayer electronic component according to claim 1, in, The main portion of one inner electrode includes a non-overlapping region that does not overlap with an adjacent inner electrode of the plurality of inner electrodes in the first direction, and The ratio of the area of ​​the non-overlapping region to the entire area of ​​the main portion is greater than or equal to 0.8% and less than or equal to 1.5%.

9. The multilayer electronic component according to claim 8, wherein: The non-overlapping region is provided on both ends of an end portion of the main portion spaced apart from the lead-out portion in the third direction.

10. The multilayer electronic component according to claim 1, in, The body has a corner portion connecting the third surface to the fifth surface, connecting the third surface to the sixth surface, connecting the fourth surface to the fifth surface, and connecting the fourth surface to the sixth surface, the corner portion having a rounded shape, and Wherein, the connecting terminal is spaced apart from the corner portion.

11. The multilayer electronic component according to claim 10, wherein: When a curvature radius of the corner portion is defined as Rc, and a distance between a side end portion of the main portion in the third direction and the fifth surface or the sixth surface of the body is defined as Wm, Rc and Wm satisfy Rc>Wm.

12. The multilayer electronic component according to claim 11, wherein Rc and Wm satisfy Rc≤22μm and Wm≤20μm.

13. The multilayer electronic component according to claim 1, wherein In a cross section of the main body in the first direction and the second direction passing through an area adjacent to a side end portion of the main portion in the third direction, the first saddle portion of one inner electrode and the second saddle portion of an adjacent inner electrode among the plurality of inner electrodes do not overlap in the first direction.

14. A multilayer electronic assembly comprising: a body including a dielectric layer and a plurality of inner electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; as well as external electrodes, disposed on the third surface and the fourth surface, wherein each of the plurality of internal electrodes comprises a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface, the lead portion having a connection terminal in contact with a corresponding one of the external electrodes, wherein the width of the lead-out portion in the third direction gradually decreases from the main portion to the connecting terminal, wherein the lead portion of one internal electrode has an overlapping region overlapping with the main portion of an adjacent internal electrode among the plurality of internal electrodes in the first direction, and When the width of the connection terminal in the third direction is defined as W1 and the width of the main portion in the third direction is defined as W2, W1 / W2 is greater than or equal to 0.4 and less than or equal to 0.

75.

15. The multilayer electronic component according to claim 14, wherein When the maximum length of the overlapping region in the second direction is defined as Lo, Lo is 25 μm or more.

16. The multilayer electronic component according to claim 15, wherein Lo is 75 μm or less.

17. The multilayer electronic component according to claim 14, wherein: When a region of the lead-out portion excluding the overlapped region is defined as a margin region, a maximum length of the margin region in the second direction is greater than or equal to 5 μm and less than or equal to 45 μm.

18. The multilayer electronic component according to claim 14, in, The main portion of one inner electrode includes a non-overlapping region that does not overlap with an adjacent inner electrode of the plurality of inner electrodes in the first direction, and The ratio of the area of ​​the non-overlapping region to the entire area of ​​the main portion is greater than or equal to 0.8% and less than or equal to 1.5%.

19. The multilayer electronic component according to claim 18, wherein: The non-overlapping region is provided on both ends of an end portion of the main portion spaced apart from the lead-out portion in the third direction.

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