Substrate processing apparatus and substrate processing method

Abstract

The invention relates to a substrate processing apparatus and a substrate processing method. Provided is a technique capable of reducing a thermal history difference between substrates. A substrate processing apparatus according to one embodiment of the present disclosure is provided with: a first processing chamber for performing a first process in batches on a plurality of substrates held in a shelf shape by a substrate holder; a load interlock chamber located below the first processing chamber, the inside of the load interlock chamber communicating with the inside of the first processing chamber; and a drive mechanism that causes the substrate holder to move up and down and horizontally.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background Art

[0002] There is known an apparatus that carries a substrate holder carrying a plurality of substrates into a processing container and processes the plurality of substrates in batches (for example, see Patent Document 1). The substrate holder is carried into the processing container by, for example, a boat elevator.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 5-226267 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure provides a technology capable of reducing the difference in thermal history between substrates.

[0008] Solutions for solving problems

[0009] A substrate processing device of a technical solution disclosed in the present invention comprises: a first processing chamber, which performs a first processing in batches on a plurality of substrates held in a shelf-like state on a substrate holder; a load lock chamber, which is located below the first processing chamber and the interior of the load lock chamber is connected to the first processing chamber; and a driving mechanism, which enables the substrate holder to be lifted and moved and moved horizontally.

[0010] Effects of the Invention

[0011] According to the present disclosure, the difference in thermal history between substrates can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a longitudinal sectional view (1) showing a substrate processing apparatus according to a first embodiment.

[0013] Figure 2 This is a longitudinal sectional view (2) showing the substrate processing apparatus according to the first embodiment.

[0014] Figure 3 This is a longitudinal sectional view (3) showing the substrate processing apparatus according to the first embodiment.

[0015] Figure 4 It is a longitudinal sectional view (4) showing the substrate processing apparatus according to the first embodiment.

[0016] Figure 5 This is a longitudinal sectional view (1) showing a substrate processing apparatus according to a second embodiment.

[0017] Figure 6 This is a longitudinal sectional view (2) showing a substrate processing apparatus according to a second embodiment.

[0018] Figure 7 It is a longitudinal sectional view (3) showing the substrate processing apparatus according to the second embodiment.

[0019] Figure 8 It is a longitudinal sectional view (4) showing the substrate processing apparatus according to the second embodiment.

[0020] Fig. 9 It is a longitudinal sectional view showing a substrate processing apparatus according to a third embodiment.

[0021] Fig.10 It is a side view showing a substrate processing apparatus according to a fourth embodiment.

[0022] Fig.11 This is a longitudinal sectional view (1) showing a substrate processing apparatus according to a fourth embodiment.

[0023] Fig.12 It is a longitudinal sectional view (2) showing a substrate processing apparatus according to a fourth embodiment.

[0024] Fig.13 It is a longitudinal sectional view (3) showing a substrate processing apparatus according to a fourth embodiment.

[0025] Fig.14 This is a cross-sectional view (1) showing a substrate processing apparatus according to a fourth embodiment.

[0026] Fig.15 It is a cross-sectional view (2) showing a substrate processing apparatus according to a fourth embodiment.

[0027] Fig.16 It is a top view showing a substrate processing apparatus according to a fifth embodiment.

[0028] Fig.17 yes Fig.16 Sectional view taken along line II-II.

[0029] Fig.18 yes Fig.16 Cross-sectional view taken along line III-III.

[0030] Fig.19 yes Fig.16 Cross-sectional view taken along line IV-IV.

[0031] Description of Reference Numerals

[0032] 100, 200, 300, 400, 500, Substrate processing apparatus; 110, 410, A1, Processing chamber; 120, 420, A2, Load lock chamber; 121, 321, 421, Driving mechanism; 535, First driving mechanism; 536, Second driving mechanism; W, Substrate; WB, Substrate holder. Detailed implementation mode

[0033] Hereinafter, a non-limiting exemplary implementation mode of the present disclosure will be described with reference to the accompanying drawings. In all the drawings, the same or corresponding components or parts are denoted by the same or corresponding reference numerals, and repeated descriptions are omitted.

[0034] 〔First implementation mode〕

[0035] Refer to Figures 1 to 4 , and the substrate processing apparatus 100 of the first implementation mode will be described. The substrate processing apparatus 100 includes a processing chamber 110, a load lock chamber 120, a dedicated transfer chamber 130, a substrate transfer chamber 160, and a control unit 190.

[0036] The processing chamber 110 can decompress the inside. The processing chamber 110 can accommodate a substrate holder WB inside. The substrate holder WB holds a plurality of substrates W in a shelf shape. Five substrates are shown in Figures 1 to 4 , but the number of substrates W is not limited. Inside the processing chamber 110, a plurality of substrates W held by the substrate holder WB are processed in batches. An inlet / outlet 110a for feeding in and out the substrate holder WB is provided at the lower part of the processing chamber 110. A gas nozzle 111, an exhaust device 112, and a heater 113 are provided in the processing chamber 110.

[0037] The gas nozzle 111 is provided around the substrate holder WB located inside the processing chamber 110. The gas nozzle 111 sprays the processing gas from the gas source GS1 toward the substrate holder WB and the substrates W from around the substrate holder WB located inside the processing chamber 110. The processing gas is selected according to the type of processing. The gas nozzle 111 can be one or two or more.

[0038] The exhaust device 112 decompresses the inside of the processing chamber 110 by exhausting the inside of the processing chamber 110. The exhaust device 112 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 112 adjusts the opening degree of the pressure control valve while evacuating the inside of the processing chamber 110 with the vacuum pump, thereby controlling the internal pressure of the processing chamber 110 to a desired pressure.

[0039] The heater 113 is provided in the process chamber 110. The heater 113 may be provided around the substrate holder WB located in the process chamber 110. The heater 113 heats the substrate holder WB and the substrate W from around the substrate holder WB located in the process chamber 110 to a desired temperature.

[0040] The load lock chamber 120 is located below the processing chamber 110. The load lock chamber 120 can depressurize the interior. The load lock chamber 120 can accommodate a substrate holder WB therein. An inlet and outlet port 120a for carrying in and out the substrate holder WB is provided at the upper portion of the load lock chamber 120. The interior of the load lock chamber 120 is communicated with the interior of the processing chamber 110 via the inlet and outlet port 110a and the inlet and outlet port 120a. The substrate holder WB is carried into the processing chamber 110 from the load lock chamber 120 via the inlet and outlet port 110a and the inlet and outlet port 120a. The substrate holder WB is carried out from the processing chamber 110 into the load lock chamber 120 via the inlet and outlet port 110a and the inlet and outlet port 120a. The substrate W is carried into the substrate holder WB and the substrate W is carried out from the substrate holder WB in the load lock chamber 120. A side wall on the negative side in the X-axis direction of the load lock chamber 120 is provided with a carry-in / carry-out port 120b for carrying in and carrying out the substrate W. The substrate W is carried into the load lock chamber 120 from the substrate transfer chamber 160 through the carry-in / carry-out port 120b. The substrate W is carried out from the load lock chamber 120 to the substrate transfer chamber 160 through the carry-in / carry-out port 120b. The load lock chamber 120 is provided with a driving mechanism 121, a gate 124, and an exhaust device 126.

[0041] The drive mechanism 121 is configured to move the substrate holder WB up and down and horizontally. The drive mechanism 121 is configured to move the substrate holder WB up and down between the processing chamber 110 and the load lock chamber 120. The drive mechanism 121 is configured to move the substrate holder WB horizontally inside the load lock chamber 120. The drive mechanism 121 may also be configured to move the substrate holder WB horizontally inside the processing chamber 110. The drive mechanism 121 includes a support portion 122 and a multi-joint arm 123.

[0042] The support part 122 supports the substrate holder WB. The support part 122 includes a cover 122a, a sealing member 122b, a rotation shaft 122c, and a support arm 122d. Figure 4), the cover 122a uses a sealing member 122b to hermetically seal the feed-in and feed-out ports 110a and 120a. As a result, the processing chamber 110 is hermetically sealed. The sealing member 122b is, for example, an O-ring. A through hole that penetrates the cover 122a in the vertical direction is provided in the center of the cover 122a. The rotating shaft 122c passes through the through hole. The gap between the cover 122a and the rotating shaft 122c is sealed by a magnetic fluid seal. The rotating shaft 122c supports the substrate holder WB so that it can rotate freely around the vertical axis M11. The supporting arm 122d is connected to the lower part of the rotating shaft 122c. The supporting arm 122d supports the rotating shaft 122c.

[0043] The multi-joint arm 123 may be a vertical multi-joint arm. In this case, since torque is always applied to the joint portion, gear clearance is eliminated and positioning accuracy is improved. The base end of the multi-joint arm 123 is fixed to the side wall on the positive side of the X-axis direction of the load lock chamber 120, and the top end is connected to the support arm 122d. The multi-joint arm 123 rotates with the base end as the rotation center, so that the support portion 122 is moved up and down and horizontally.

[0044] The multi-joint arm 123 moves the substrate holder WB up and down between the processing position and the delivery position by moving the support portion 122 up and down. Figure 4 As shown, the processing position may be a position where the entire substrate holder WB is accommodated in the processing chamber 110 and the cover 122a hermetically seals the carrying-in and carrying-out ports 110a and 120a. Figure 3 As shown, the delivery position may be a position directly below the processing position, and is a position where the entire substrate holder WB is accommodated in the load lock chamber 120 (see Figure 3 The multi-joint arm 123 moves the substrate holder WB from the delivery position to the processing position by raising the support portion 122. The multi-joint arm 123 moves the substrate holder WB from the processing position to the delivery position by lowering the support portion 122. The multi-joint arm 123 can also move the substrate holder WB horizontally inside the processing chamber 110 by horizontally moving the support portion 122.

[0045] The multi-joint arm 123 horizontally moves the substrate holder WB between the delivery position and the transfer position by horizontally moving the support portion 122. The transfer position is a position different from the delivery position in horizontal position. Figure 2 and Figure 3As shown in FIG. 1 , the transfer position may be a position where a part of the substrate holder WB is opposite to the carry-in / carry-out port 120 b. The transfer position may include a plurality of positions that are different in the up and down directions. The plurality of positions include a first position and a second position. The first position is a position where most of the substrate holder WB is located in the load lock chamber 120 and the upper part of the substrate holder WB is located in the transfer dedicated chamber 130 ( Figure 2 The second position is a position where the entire substrate holder WB is located within the load lock chamber 120 (see Figure 3 The multi-jointed arm 123 may also move the substrate holder WB up and down between the first position and the second position included in the transfer position by moving the support portion 122 up and down.

[0046] The multi-joint arm 123 may include a refrigerant flow path for circulating a refrigerant therein. In this case, heat of the multi-joint arm 123 can be discharged even in a vacuum atmosphere, and thus positioning accuracy can be maintained.

[0047] The multi-jointed arm 123 includes a base end portion 123 a , a first arm 123 b , and a second arm 123 c .

[0048] The base end portion 123a is fixed to the side wall on the positive side of the load lock chamber 120 in the X-axis direction. The first arm 123b is rotatable relative to the base end portion 123a around the rotation axis M12. The second arm 123c is rotatable relative to the first arm 123b around the rotation axis M13, and is rotatable relative to the support arm 122d around the rotation axis M14. The multi-jointed arm 123 moves the substrate holder WB between a plurality of positions including a processing position, a delivery position, and a transfer position by independently rotating the first arm 123b and the second arm 123c.

[0049] The gate 124 is configured to be able to move horizontally along the Y-axis direction between a position blocking the feed-in and feed-out ports 110a and 120a and a position blocking the opening 130a. Figure 2 and Figure 3 As shown, when the substrate holder WB is located outside the processing chamber 110, the gate 124 moves to a position to block the inlet and outlet ports 110a and 120a to hermetically block the inlet and outlet ports 110a and 120a. Figure 4 As shown, when the substrate holder WB is located inside the process chamber 110 , the shutter 124 moves to a position to block the opening 130 a to hermetically block the opening 130 a .

[0050] The exhaust device 126 decompresses the interior of the load lock chamber 120 by exhausting the interior of the load lock chamber 120. The exhaust device 126 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 126 evacuates the interior of the load lock chamber 120 using the vacuum pump while adjusting the opening of the pressure control valve, thereby controlling the interior of the load lock chamber 120 to a desired pressure.

[0051] The transfer chamber 130 is located above the load lock chamber 120, and its interior is connected to the load lock chamber 120. The transfer chamber 130 is located on the side of the processing chamber 110. The transfer chamber 130 can be located on the negative side of the Y-axis direction of the processing chamber 110. An opening 130a for passing the substrate holder WB is provided at the lower part of the transfer chamber 130. The transfer chamber 130 is configured to accommodate a part of the substrate holder WB inside. For example, Figure 2 As shown, when the substrate W is carried in or out of the lower portion of the substrate holder WB located at the transfer position via the carry-in / carry-out port 120 b, the transfer chamber 130 accommodates the upper portion of the substrate holder WB. This prevents the substrate holder WB from contacting the top of the load lock chamber 120 .

[0052] The substrate transfer chamber 160 is connected to the negative side of the load lock chamber 120 in the X-axis direction. The substrate transfer chamber 160 can reduce the pressure inside. The substrate transfer chamber 160 is provided with a substrate transfer robot 161. The substrate transfer chamber 160 may also be provided with an exhaust device.

[0053] The substrate conveying robot 161 is disposed inside the substrate conveying chamber 160. The substrate conveying robot 161 conveys the substrate W to the substrate holder WB located at the transfer position through the conveying port 120b, and conveys the substrate W held by the substrate holder WB located at the transfer position through the conveying port 120b. The substrate conveying robot 161 may include a horizontal multi-joint arm.

[0054] The control unit 190 can be applied to a computer having one or more processors 191, a memory 192, an input / output interface (not shown), and an electronic circuit. The processor 191 is one or a combination of a CPU, an ASIC, an FPGA, a circuit composed of a plurality of discrete semiconductors, etc. The memory 192 includes a volatile memory, a non-volatile memory (such as an optical disk, a DVD, a hard disk, a flash memory, etc.), and stores a program for causing the substrate processing device 100 to operate, a process condition for processing, and other processes. The processor 191 controls the various structures of the substrate processing device 100 and performs various processes by executing the programs and processes stored in the memory 192.

[0055] As described above, according to the first embodiment, the substrate processing device 100 includes a processing chamber 110, a load lock chamber 120, and a drive mechanism 121. The processing chamber 110 processes a plurality of substrates W held in a shelf-like manner on a substrate holder WB in batches. The load lock chamber 120 is located below the processing chamber 110, and its interior is connected to the processing chamber 110. The drive mechanism 121 causes the substrate holder WB to move up and down and horizontally. In this case, the substrate W can be sent in and out relative to the substrate holder WB in a state where the entire substrate holder WB is sent out from the processing chamber 110. Therefore, the difference in thermal history between the substrates W held on the substrate holder WB can be reduced. In addition, by moving the substrate holder WB horizontally inside the processing chamber 110, the film thickness distribution of the film applied to the substrate W can be adjusted.

[0056] In the first embodiment, the multi-joint arm 123 has two arms (the first arm 123b and the second arm 123c), but the number of arms constituting the multi-joint arm 123 is not limited thereto. The multi-joint arm 123 may have three or more arms.

[0057] [Second embodiment]

[0058] Reference Figures 5 to 8 , a substrate processing apparatus 200 according to a second embodiment will be described. The substrate processing apparatus 200 is different from the substrate processing apparatus 100 in that it has a second processing chamber 230 instead of the transfer chamber 130. The following description will focus on the structure that is different from the substrate processing apparatus 100.

[0059] The substrate processing apparatus 200 includes a processing chamber 110 , a load lock chamber 120 , a second processing chamber 230 , a substrate transfer chamber 160 , and a control unit 190 .

[0060] The second processing chamber 230 is located above the load lock chamber 120, and its interior is connected to the load lock chamber 120. The second processing chamber 230 is located on the side of the processing chamber 110. The second processing chamber 230 can be located on the negative side of the Y-axis direction of the processing chamber 110. The second processing chamber 230 can decompress the interior. A delivery port 230a for delivering and delivering the substrate holder WB is provided at the lower part of the second processing chamber 230. The second processing chamber 230 is configured to be able to accommodate the substrate holder WB as a whole.

[0061] For example, Figure 6 As shown, when the substrate W is carried in or out of the lower portion of the substrate holder WB located at the transfer position via the carry-in / carry-out port 120 b, the upper portion of the substrate holder WB is accommodated in the second processing chamber 230 . This prevents the substrate holder WB from contacting the top of the load lock chamber 120 .

[0062] In the second processing chamber 230, a plurality of substrates W held in the substrate holder WB are processed in batches. In this case, the entire substrate holder WB is accommodated in the second processing chamber 230. The processing performed in the second processing chamber 230 may be different from the processing performed in the processing chamber 110. The processing performed in the processing chamber 110 may include a film forming process. The processing performed in the second processing chamber 230 may include an annealing process and a pre-cleaning process.

[0063] The second processing chamber 230 is provided with a heater 233. The second processing chamber 230 may also be provided with a gas nozzle, an exhaust device, and the like.

[0064] The heater 233 is provided in the second processing chamber 230. The heater 233 may be provided around the substrate holder WB in the second processing chamber 230. The heater 233 heats the substrate holder WB and the substrate W to a desired temperature from around the substrate holder WB in the second processing chamber 230.

[0065] The multi-joint arm 123 moves the substrate holder WB up and down between the processing position and the delivery position by moving the support portion 122 up and down. Figure 8 As shown, the processing position may be a position where the entire substrate holder WB is accommodated in the processing chamber 110 and the cover 122a hermetically seals the carrying-in and carrying-out ports 110a and 120a. Figure 7 As shown, the delivery position may be a position directly below the processing position, and is a position where the entire substrate holder WB is accommodated in the load lock chamber 120 (see Figure 7 The multi-joint arm 123 moves the substrate holder WB from the delivery position to the processing position by raising the support portion 122. The multi-joint arm 123 moves the substrate holder WB from the processing position to the delivery position by lowering the support portion 122. The multi-joint arm 123 can also move the substrate holder WB horizontally inside the processing chamber 110 by horizontally moving the support portion 122.

[0066] The multi-joint arm 123 horizontally moves the substrate holder WB between the delivery position and the transfer position by horizontally moving the support portion 122. The transfer position is a position different from the delivery position in horizontal position. Figure 6 and Figure 7 As shown in FIG. 1 , the transfer position may be a position where a part of the substrate holder WB is opposite to the carry-in / carry-out port 120 b. The transfer position may include a plurality of positions that are different in the up and down directions. The plurality of positions include a first position and a second position. The first position is a position where most of the substrate holder WB is located in the load lock chamber 120 and the upper part of the substrate holder WB is located in the second processing chamber 230 ( Figure 6 The second position is a position where the entire substrate holder WB is located within the load lock chamber 120 (see Figure 7 The multi-jointed arm 123 may also move the substrate holder WB up and down between the first position and the second position included in the transfer position by moving the support portion 122 up and down.

[0067] The multi-joint arm 123 moves the substrate holder WB between the transfer position and the second processing position by moving the support portion 122 up and down. The second processing position may be a position directly above the transfer position, and is a position where the entire substrate holder WB is accommodated in the second processing chamber 230. The multi-joint arm 123 moves the substrate holder WB from the transfer position to the second processing position by moving the support portion 122 up. The multi-joint arm 123 moves the substrate holder WB from the second processing position to the transfer position by moving the support portion 122 down. The multi-joint arm 123 may also move the substrate holder WB horizontally inside the second processing chamber 230 by moving the support portion 122 horizontally.

[0068] The gate 124 is configured to be able to move horizontally along the Y-axis direction between a position blocking the feed-in and feed-out ports 110a and 120a and a position blocking the feed-in and feed-out ports 230a. Figure 6 and Figure 7 As shown, when the substrate holder WB is located outside the processing chamber 110, the gate 124 moves to a position to block the inlet and outlet ports 110a and 120a, and the inlet and outlet ports 110a and 120a are sealed airtightly using the sealing member 125. Figure 8 As shown, when the substrate holder WB is located inside the processing chamber 110, the shutter 124 moves to a position to close the carrying port 230a, and the carrying port 230a is hermetically closed using the sealing member 125. The sealing member 125 is, for example, an O-ring.

[0069] As described above, according to the second embodiment, the substrate processing apparatus 200 includes a processing chamber 110, a load lock chamber 120, and a drive mechanism 121. The processing chamber 110 processes a plurality of substrates W held in a shelf-like manner on substrate holders WB in batches. The load lock chamber 120 is located below the processing chamber 110, and its interior is connected to the processing chamber 110. The drive mechanism 121 moves the substrate holder WB up and down and horizontally. In this case, the same effect as the first embodiment can be obtained.

[0070] According to the second embodiment, the substrate processing apparatus 200 includes the second processing chamber 230. In this case, different processes can be performed on each substrate W without replacing the substrate W held on the substrate holder WB.

[0071] [Third embodiment]

[0072] Reference Fig. 9 , a substrate processing apparatus 300 according to the third embodiment will be described. The substrate processing apparatus 300 is different from the substrate processing apparatus 100 in that a driving mechanism 321 having a lifting driving mechanism 323 and a horizontal driving mechanism 324 is provided instead of the driving mechanism 121 having a multi-jointed arm 123. The following description will focus on the structure that is different from the substrate processing apparatus 100.

[0073] The driving mechanism 321 includes the supporting portion 122 , a lifting driving mechanism 323 , and a horizontal driving mechanism 324 .

[0074] The lifting drive mechanism 323 includes a guide rail 323a and a support arm 323b. The lower end of the guide rail 323a is fixed to the bottom wall of the load lock chamber 120 and extends in the vertical direction. The support arm 323b moves up and down along the guide rail 323a. The lifting drive mechanism 323 may include a wafer boat elevator.

[0075] The horizontal driving mechanism 324 includes a guide rail 324a and a support portion 324b. The guide rail 324a is fixed to the support arm 323b and extends along the Y-axis direction. The support portion 324b moves horizontally along the guide rail 324a in the Y-axis direction. The support portion 324b supports the support portion 122. The horizontal driving mechanism 324 may include a ball screw.

[0076] The driving mechanism 321 moves the horizontal driving mechanism 324 up and down using the lifting driving mechanism 323 and moves the support portion 122 horizontally using the horizontal driving mechanism 324 , thereby moving the substrate holder WB between a plurality of positions including a processing position, a delivery position, and a transfer position.

[0077] As described above, according to the third embodiment, the substrate processing apparatus 300 includes a processing chamber 110, a load lock chamber 120, and a drive mechanism 321. The processing chamber 110 processes a plurality of substrates W held in a shelf-like manner on substrate holders WB in batches. The load lock chamber 120 is located below the processing chamber 110, and its interior is connected to the processing chamber 110. The drive mechanism 321 moves the substrate holder WB up and down and horizontally. In this case, the same effect as the first embodiment can be obtained.

[0078] [Fourth embodiment]

[0079] Reference Figures 10 to 15 , a substrate processing apparatus 400 according to a fourth embodiment will be described. Fig.10 It is a side view showing a substrate processing apparatus 400 according to a fourth embodiment. Figures 11 to 13 It is a longitudinal sectional view showing a substrate processing apparatus 400 according to a fourth embodiment. Fig.14 and Fig.15 It is a cross-sectional view showing a substrate processing apparatus 400 according to a fourth embodiment. Fig.10 Equivalent to Fig.14 Side view looking along line AA. Fig.11 and Fig.12 Equivalent to Fig.14 Sectional view along line BB. Fig.13 Equivalent to Fig.15 Sectional view along line CC.

[0080] The substrate processing apparatus 400 includes a processing chamber 410 and a load lock chamber 420 .

[0081] The processing chamber 410 is provided with a reaction tube 411 , a gas nozzle 412 , and an exhaust pipe 413 .

[0082] The reaction tube 411 can reduce the pressure inside. The reaction tube 411 can accommodate a substrate holder WB inside. The substrate holder WB holds a plurality of substrates W in a shelf shape. In the reaction tube 411, a plurality of substrates W held by the substrate holder WB are processed in batches. A carry-in / carry-out port 411a for carrying in and out the substrate holder WB is provided at the lower part of the reaction tube 411.

[0083] The gas nozzle 412 sprays the processing gas into the reaction tube 411. The processing gas is selected according to the type of processing. The gas nozzle 412 may be one or more.

[0084] One end of the exhaust pipe 413 is connected to the reaction tube 411, and the other end is connected to a vacuum pump (not shown). The vacuum pump exhausts the reaction tube 411 through the exhaust pipe 413, thereby reducing the pressure inside the reaction tube 411. A valve 414 is provided on the exhaust pipe 413. The valve 414 controls the exhaust conductivity by adjusting the opening degree.

[0085] The load lock chamber 420 is located below the processing chamber 410. The load lock chamber 420 can depressurize the interior. The load lock chamber 420 can accommodate the substrate holder WB inside. A carry-in / out port 420a for carrying in and carrying out the substrate holder WB is provided at the upper portion of the load lock chamber 420. The interior of the load lock chamber 420 is connected to the interior of the reaction tube 411 via the carry-in / out port 411a and the carry-in / out port 420a. The substrate holder WB is carried from the inside of the load lock chamber 420 into the reaction tube 411 via the carry-in / out port 411a and the carry-in / out port 420a. The substrate holder WB is carried out from the inside of the reaction tube 411 into the load lock chamber 420 via the carry-in / out port 411a and the carry-in / out port 420a. The substrate W is carried in and out of the substrate holder WB in the load lock chamber 420. A loading and unloading port 420b for loading and unloading a substrate W is provided on the side wall of the load lock chamber 420 on the negative side in the X-axis direction. The substrate W is loaded into the load lock chamber 420 from a substrate transfer chamber (not shown) via the loading and unloading port 420b. The substrate W is unloaded from the load lock chamber 420 to the substrate transfer chamber via the loading and unloading port 420b. A driving mechanism 421 is provided in the load lock chamber 420.

[0086] The drive mechanism 421 moves the substrate holder WB up and down and horizontally. The drive mechanism 421 is configured to move the substrate holder WB up and down between the reaction tube 411 and the load lock chamber 420. The drive mechanism 421 is configured to move the substrate holder WB horizontally inside the load lock chamber 420. The drive mechanism 421 may also be configured to move the substrate holder WB horizontally inside the reaction tube 411.

[0087] The drive mechanism 421 enables the substrate holder WB to move up and down between the processing position and the delivery position. Fig.11 As shown in FIG. 4 , the processing position may be a position where the entire substrate holder WB is accommodated in the reaction tube 411. The delivery position may be as shown in FIG. Fig.12 The position directly below the processing position shown and is as Fig.12 and Fig.14 The central axis C12 of the substrate holder WB is shown as being offset to the negative side in the Y-axis direction relative to the central axis C11 of the processing chamber 410. Fig.12 As shown, the carry-out position may be a position where the entirety of the substrate holder WB is accommodated in the load lock chamber 420 .

[0088] The drive mechanism 421 moves the substrate holder WB horizontally between the delivery position and the transfer position. The transfer position is a position that is horizontally different from the delivery position. Fig.13 As shown, the transfer position may be a position offset to the positive side in the Y-axis direction relative to the delivery position. Fig.13and Fig.15 As shown, the transfer position may be a position where the central axis C12 of the substrate holder WB coincides with the central axis C11 of the processing chamber 410 .

[0089] As described above, according to the fourth embodiment, the substrate processing device 400 includes a processing chamber 410, a load lock chamber 420, and a drive mechanism 421. The processing chamber 410 processes a plurality of substrates W held in a shelf-like manner on substrate holders WB in batches. The load lock chamber 420 is located below the processing chamber 410, and its interior is connected to the processing chamber 410. The drive mechanism 421 moves the substrate holder WB up and down and horizontally. In this case, the same effect as the first embodiment can be obtained.

[0090] According to the fourth embodiment, the central axis C12 of the reaction tube 411 can be arranged to be offset in the horizontal direction relative to the central axis C11 of the processing chamber 410. In this case, the layout freedom of the position where the gas nozzle 412 is set, the position where the exhaust pipe 413 is set, etc. is improved. In addition, the layout freedom of the installation position when the plasma generation unit is installed in the reaction tube 411 is improved. For example, if the exhaust pipe 413 is enlarged, Fig.10 As shown in FIG. 1 , in the Y-axis direction, the exhaust pipe 413 is sometimes installed at a position outside the outer end of the reaction tube 411. In this case, by offsetting the central axis C12 of the reaction tube 411 to the negative side in the Y-axis direction relative to the central axis C11 of the processing chamber 410, the reaction tube 411 and the exhaust pipe 413 can be arranged without increasing the width of the processing chamber 410 in the Y-axis direction.

[0091] [Fifth embodiment]

[0092] Reference Figures 16 to 19 , a substrate processing apparatus 500 according to a fifth embodiment will be described. Fig.16 It is a top view showing a substrate processing apparatus 500 according to the fifth embodiment. Fig.17 yes Fig.16 Sectional view taken along line II-II. Fig.18 yes Fig.16 Cross-sectional view taken along line III-III. Fig.18 (a) shows the situation where the first wafer boat 533 is located when being carried in and out of the processing module 530 . Fig.18 (b) shows the situation where the first processing container 531 is located when being carried in and out of the processing module 530 . Fig.19 yes Fig.16 Cross-sectional view taken along line IV-IV.

[0093] The substrate processing apparatus 500 includes a transfer module 520 , a processing module 530 , an exhaust unit 540 , and a gas supply unit 550 .

[0094] The transfer module 520 is disposed adjacent to the first side wall 530a of the processing module 530. The transfer module 520 transfers the substrate W to the processing module 530. The transfer module 520 includes a loading port 521, a storage unit 522, and a substrate transfer device 523.

[0095] The loading port 521 is arranged on the negative side of the conveying module 520 in the X-axis direction. There are multiple (for example, two) loading ports 521 arranged along the Y-axis direction. However, the number of loading ports 521 is not particularly limited. A box C is placed on the loading port 521. Box C accommodates multiple (for example, 25) substrates W. Box C is carried in and out of the loading port 521. Box C holds each substrate W horizontally. Box C is, for example, a FOUP (Front Opening Unified Pod: front-opening wafer transfer box).

[0096] A plurality of storage parts 522 (e.g., two) are arranged along the Z-axis direction at the negative side of the conveying module 520 in the X-axis direction. A plurality of storage parts 522 (e.g., two) are arranged along the Z-axis direction at the positive side of the conveying module 520 in the X-axis direction. A plurality of storage parts 522 may also be arranged in the Y-axis direction. However, the number of storage parts 522 is not particularly limited. The storage part 522 temporarily stores the box C.

[0097] The substrate transfer device 523 transfers the substrate W between the cassette C placed on the loading port 521 and the first wafer boat 533 and the second wafer boat 534. The substrate transfer device 523 transfers a plurality of substrates W at the same time. For example, the substrate transfer device 523 takes out the substrate W before processing from the cassette C placed on the loading port 521 and transfers it to the first wafer boat 533 and the second wafer boat 534. For example, the substrate transfer device 523 takes out the substrate W after processing from the first wafer boat 533 and the second wafer boat 534 and transfers it to the cassette C placed on the loading port 521.

[0098] The conveyor module 520 may include a cassette transfer device for transferring the cassette C between the load port 521 and the storage unit 522 . In addition to the load port 521 , the conveyor module 520 may include a loading unit for transferring a substrate to and from the substrate transfer device 523 .

[0099] The processing module 530 has a processing chamber A1 and a load lock chamber A2. The processing chamber A1 is adjacent to the load lock chamber A2 in the Z-axis direction. The load lock chamber A2 is located on the negative side of the processing chamber A1 in the Z-axis direction. The processing module 530 has a first side wall 530a and a second side wall 530b. The first side wall 530a is located on the negative side of the processing module 530 in the X-axis direction. The second side wall 530b is located on the positive side of the processing module 530 in the X-axis direction. The first side wall 530a and the second side wall 530b are separated in the X-axis direction. The first side wall 530a and the second side wall 530b extend from the end of the negative side of the processing module 530 in the Y-axis direction to the end of the positive side in the Y-axis direction. The first side wall 530a and the second side wall 530b extend from the lower end of the load lock chamber A2 to the upper end of the processing chamber A1, respectively.

[0100] The processing module 530 includes a first processing container 531 , a second processing container 532 , a first wafer boat 533 , a second wafer boat 534 , a first driving mechanism 535 , a second driving mechanism 536 , a maintenance door 537 , and a cleaning unit 538 .

[0101] The first processing container 531 and the second processing container 532 are disposed in the processing chamber A1. The first processing container 531 and the second processing container 532 are disposed between the first side wall 530a and the second side wall 530b in the X-axis direction. The first processing container 531 and the second processing container 532 are disposed adjacent to each other in the Y-axis direction.

[0102] The first processing container 531 is heated by a heater not shown. The first processing container 531 is configured to accommodate a first wafer boat 533 holding a substrate W. A processing gas is supplied from a gas supply unit 550 to the interior of the first processing container 531. The processing gas is selected according to the type of processing. The processing gas supplied to the interior of the first processing container 531 is exhausted by an exhaust unit 540. Inside the first processing container 531, the substrate W held in the first wafer boat 533 is subjected to a desired processing using the processing gas supplied from the gas supply unit 550. The second processing container 532 may also have the same structure as the first processing container 531.

[0103] The first wafer boat 533 holds a plurality of substrates W in a shelf-like manner along the Z-axis direction. Fig.17 shown), processing position, and feeding and unfeeding position ( Fig.18 The handover position is the position of the processing module 530 on the negative side of the Z-axis direction and the center of the processing module 530 in the Y-axis direction (see Fig.16The first wafer boat 533 is shown by the dotted line in FIG. 1 ). The processing position is a position contained in the first processing container 531 and is a position above the handover position. The carrying in and carrying out position is a position on the negative side of the processing module 530 in the Z-axis direction and is a position in the center of the processing module 530 in the Y-axis direction. The carrying in and carrying out position may be a position offset from the handover position to the positive side in the X-axis direction. In this case, it is easy to carry the first wafer boat 533 in and out relative to the processing module 530.

[0104] For example, the first wafer boat 533 moves to the transfer position when transferring the substrate W to the substrate transfer device 523. For example, the first wafer boat 533 moves to the processing position when performing a desired process on the substrate W. For example, the first wafer boat 533 moves to the carry-in / carry-out position when being carried out from the processing module 530 for maintenance.

[0105] The second wafer boat 534 holds a plurality of substrates W in a shelf-like manner along the Z-axis direction. Fig.18 (a) and Fig.18 The handover position is the position of the processing module 530 on the negative side of the Z-axis direction and the center of the processing module 530 in the Y-axis direction (see Fig.16 ). The handover position may be the same as the handover position of the first wafer boat 533. In this case, there is no need for a mechanism to move the substrate transfer device 523 along the Y-axis direction. Therefore, the length of the processing module 530 in the Y-axis direction can be shortened. In addition, the stroke of the substrate transfer device 523 can be shortened. Therefore, the conveying time of the substrate transfer device 523 to convey the substrate W can be shortened. The processing position is a position contained in the second processing container 532, and is a position above the handover position. The carrying in and out position is a position of the processing module 530 on the negative side in the Z-axis direction, and is a position of the center of the processing module 530 in the Y-axis direction. The carrying in and out position may be a position of the processing module 530 on the positive side in the X-axis direction. In this case, it is easy to carry the second wafer boat 534 in and out relative to the processing module 530. The carrying in and out position of the second wafer boat 534 may be the same position as the carrying in and out position of the first wafer boat 533.

[0106] For example, the second wafer boat 534 moves to the transfer position when transferring the substrate W to the substrate transfer device 523. For example, the second wafer boat 534 moves to the processing position when performing a desired process on the substrate W. For example, the second wafer boat 534 moves to the carry-in / carry-out position when being carried out from the processing module 530 for maintenance.

[0107] The first drive mechanism 535 is configured to move the first wafer boat 533 up and down and horizontally. The first drive mechanism 535 is configured to move the first wafer boat 533 at least between a handover position and a processing position. The first drive mechanism 535 may include a wafer boat elevator. The first drive mechanism 535 may also include a multi-joint arm. The first drive mechanism 535 may also include a lifting drive mechanism that moves the first wafer boat 533 up and down and a horizontal drive mechanism that moves the first wafer boat 533 horizontally. The first drive mechanism 535 may also be configured to move the first wafer boat 533 between a handover position, a processing position, and a delivery position.

[0108] The second drive mechanism 536 is configured to move the second wafer boat 534 up and down and horizontally. The second drive mechanism 536 is configured to move the second wafer boat 534 at least between the handover position and the processing position. The second drive mechanism 536 may include a wafer boat elevator. The second drive mechanism 536 may also include a multi-joint arm. The second drive mechanism 536 may also include a lifting drive mechanism that moves the second wafer boat 534 up and down and a horizontal drive mechanism that moves the second wafer boat 534 horizontally. The second drive mechanism 536 may also be configured to move the second wafer boat 534 between the handover position, the processing position, and the delivery position.

[0109] A maintenance opening 530c is provided on the second side wall 530b. The maintenance opening 530c is provided on the negative side portion of the second side wall 530b in the Z-axis direction. The maintenance opening 530c is provided at the same height position as the load lock chamber A2. The maintenance opening 530c is provided at an intermediate position including the first processing container 531 and the second processing container 532 in the Y-axis direction. The maintenance opening 530c is provided between the first exhaust box 541a and the second exhaust box 542a in the Y-axis direction. The maintenance opening 530c is an opening for maintaining the processing module 530. The maintenance opening 530c is a common opening used when the first processing container 531, the second processing container 532, the first wafer boat 533, and the second wafer boat 534 are carried in and out of the processing module 530. Therefore, the maintenance opening 530c has a size that the first processing container 531, the second processing container 532, the first wafer boat 533, and the second wafer boat 534 can pass through.

[0110] For example, the maintenance opening 530c is used when the first processing container 531 is replaced due to damage or when the first processing container 531 is cleaned and the first processing container 531 is sent out from the inside of the processing module 530. For example, the maintenance opening 530c is used when the second processing container 532 is replaced due to damage or when the second processing container 532 is cleaned and the second processing container 532 is sent out from the inside of the processing module 530. For example, the maintenance opening 530c is used when the first wafer boat 533 (second wafer boat 534) is replaced due to damage or when the first wafer boat 533 (second wafer boat 534) is sent out from the inside of the processing module 530.

[0111] The maintenance door 537 opens and closes the maintenance opening 530c by rotating horizontally. The maintenance door 537 has a hinge 537a and a door body 537b. The hinge 537a connects the second side wall 530b and the door body 537b. The hinge 537a is, for example, disposed on the negative side in the Y-axis direction. The door body 537b can rotate horizontally relative to the second side wall 530b by means of the hinge 537a. When the door body 537b is opened, the first processing container 531, the second processing container 532, the first wafer boat 533, and the second wafer boat 534 can be brought in and out through the maintenance opening 530c. Fig.16 In the figure, the solid line represents the door body 537b in the open state, the dotted line represents the door body 537b in the closed state, and the dotted line represents the trajectory of the top end of the door body 537b when the door body 537b is opened and closed.

[0112] The cleaning unit 538 is mounted on the door body 537b. The cleaning unit 538 is configured to circulate clean air in the load lock chamber A2. The clean air is, for example, an inert gas. The clean air supplied to the load lock chamber A2 is exhausted from the load lock chamber A2 by an exhaust portion (not shown) provided on the first side wall 530a opposite to the cleaning unit 538, and is supplied again from the cleaning unit 538 to the load lock chamber A2.

[0113] The exhaust unit 540 includes a first exhaust box 541 a , a first exhaust pipe 541 b , a first pressure control valve 541 c , a second exhaust box 542 a , a second exhaust pipe 542 b , and a second pressure control valve 542 c .

[0114] The first exhaust box 541a is arranged adjacent to the second side wall 530b on the positive side portion in the Y-axis direction of the processing module 530. The first exhaust pipe 541b connects the exhaust port 531a of the first processing container 531 and a vacuum pump (not shown). The portion between one end and the other end of the first exhaust pipe 541b is accommodated in the interior of the first exhaust box 541a. The first pressure control valve 541c is provided in the interior of the first exhaust box 541a. The first pressure control valve 541c is provided in the middle of the first exhaust pipe 541b. The first pressure control valve 541c controls the pressure inside the first processing container 531 to a desired pressure.

[0115] The second exhaust box 542a is arranged adjacent to the second side wall 530b on the negative side of the processing module 530 in the Y-axis direction. The second exhaust box 542a is arranged with a gap in the Y-axis direction relative to the first exhaust box 541a. The first exhaust box 541a and the second exhaust box 542a can be arranged to be line-symmetrical with respect to an imaginary line L that is equidistant from the center of the first processing container 531 and the center of the second processing container 532. The area between the first exhaust box 541a and the second exhaust box 542a becomes a maintenance area exposed by the maintenance opening 530c. The second exhaust pipe 542b connects the exhaust port 532a of the second processing container 532 and a vacuum pump (not shown). The portion between one end and the other end of the second exhaust pipe 542b is accommodated in the interior of the second exhaust box 542a. The second pressure control valve 542c is provided in the interior of the second exhaust box 542a. The second pressure control valve 542c is provided in the middle of the second exhaust pipe 542b. The second pressure control valve 542c controls the pressure inside the second processing container 532 to a desired pressure.

[0116] The gas supply unit 550 includes a first supply tank 551 a , a first supply unit 551 b , first supply pipes 551 c and 551 d , and first supply valves 551 e and 551 f .

[0117] The first supply box 551a is arranged adjacent to the first exhaust box 541a on the positive side of the first exhaust box 541a in the X-axis direction. The first supply unit 551b is accommodated inside the first supply box 551a. The first supply pipes 551c and 551d respectively connect the first supply unit 551b and a nozzle (not shown) that supplies a processing gas to the inside of the first processing container 531. The first supply valve 551e is provided on the first supply pipe 551c. The first supply valve 551f is provided on the first supply pipe 551d. A mass flow controller (not shown) may also be provided on the first supply pipe 551c and the first supply pipe 551d. The first supply unit 551b supplies a processing gas to the inside of the first processing container 531 via the first supply pipes 551c and 551d.

[0118] The gas supply unit 550 includes a second supply tank 552a, a second supply unit (not shown), a second supply pipe (not shown), and a second supply valve (not shown).

[0119] The second supply box 552a is arranged adjacent to the second exhaust box 542a on the positive side of the second exhaust box 542a in the X-axis direction. The second supply unit, the second supply pipe, and the second supply valve may be the same structure as the first supply unit 551b, the first supply pipes 551c, 551d, and the first supply valves 551e, 551f.

[0120] As described above, according to the fifth embodiment, the substrate processing apparatus 500 includes a processing chamber A1, a load lock chamber A2, a first drive mechanism 535, and a second drive mechanism 536. The processing chamber A1 is provided with a first processing container 531 and a second processing container 532. In the first processing container 531, a plurality of substrates W held in a shelf-like manner on a first wafer boat 533 are processed in batches. In the second processing container 532, a plurality of substrates W held in a shelf-like manner on a second wafer boat 534 are processed in batches. The load lock chamber A2 is located below the processing chamber A1, and its interior is connected to the processing chamber A1. The first drive mechanism 535 moves the first wafer boat 533 up and down and horizontally. The second drive mechanism 536 moves the second wafer boat 534 up and down and horizontally. In this case, the same effect as that of the first embodiment can be obtained.

[0121] According to the fifth embodiment, the first wafer boat 533 and the second wafer boat 534 can be moved to the same handover position by using the first driving mechanism 535 and the second driving mechanism 536. In this case, a mechanism for moving the substrate transfer device 523 along the Y-axis direction is not required. Therefore, the length of the processing module 530 in the Y-axis direction can be shortened. In addition, the stroke of the substrate transfer device 523 can be shortened. Therefore, the conveying time of the substrate W by the substrate transfer device 523 can be shortened.

[0122] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the appended claims and the gist thereof.

Claims

1. A substrate processing device, wherein: The substrate processing device comprises: a first processing chamber for performing a first processing in batches on a plurality of substrates held in a shelf-like manner on a substrate holder; a load lock chamber located below the first processing chamber, the interior of the load lock chamber being communicated with the first processing chamber; and A driving mechanism enables the substrate holder to move up and down and horizontally.

2. The substrate processing apparatus according to claim 1, wherein: The driving mechanism is configured to move the substrate holder upward and downward between the first processing chamber and the load lock chamber.

3. The substrate processing apparatus according to claim 1, wherein: The driving mechanism is configured to horizontally move the substrate holder within the load lock chamber.

4. The substrate processing apparatus according to claim 1, wherein: The driving mechanism is configured to horizontally move the substrate holder within the first processing chamber.

5. The substrate processing apparatus according to claim 1, wherein: The load lock chamber is capable of being depressurized.

6. The substrate processing apparatus according to claim 1, wherein: The driving mechanism is configured to move the substrate holder between a processing position for performing the first processing and a transfer position for carrying the substrate in or out of the substrate holder. The horizontal position of the processing position is different from the horizontal position of the transfer position.

7. The substrate processing apparatus according to claim 1, wherein: The driving mechanism includes a multi-jointed arm that enables the substrate holder to perform the lifting movement and the horizontal movement.

8. The substrate processing apparatus according to claim 1, wherein: The driving mechanism comprises: A lifting drive mechanism that causes the substrate holder to move upward and downward; and The horizontal driving mechanism enables the substrate holding member to move horizontally.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein: The substrate processing apparatus includes a second processing chamber, the second processing chamber is located above the load lock chamber and to the side of the first processing chamber, the interior of the second processing chamber is communicated with the load lock chamber, The second processing chamber is configured to accommodate at least a portion of the substrate holder.

10. The substrate processing apparatus according to claim 9, wherein: The second processing chamber is configured to accommodate a portion of the substrate holder.

11. The substrate processing apparatus according to claim 9, wherein: The second processing chamber is configured to accommodate the entire substrate holder.

12. A substrate processing method, wherein: The substrate processing method comprises the following steps: moving a substrate holder that holds a plurality of substrates in a shelf-like shape to a processing position; processing the plurality of substrates held on the substrate holder in batches at the processing position; moving the substrate holder to a carry-out position directly below the processing position after the processing; moving the substrate holder located at the delivery position to a transfer position horizontally offset from the delivery position; as well as The plurality of substrates held on the substrate holder are removed from the substrate holder at the transfer position.

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