Automatic sorting device for wafer thickness detection

Abstract

The invention discloses a wafer thickness detection automatic sorting device which comprises a first conveying belt, the two sides of one end of the first conveying belt are in transmission connection with a second conveying belt and a third conveying belt respectively, and a sorting device is arranged between the second conveying belt and the third conveying belt close to one end of the first conveying belt. A thickness scanning device is arranged at one end of the first conveying belt, the first conveying belt comprises two driving rollers which are symmetrically arranged, the outer rings of the two ends of each driving roller are in transmission connection with a driving belt respectively, and the two ends of one driving roller are in transmission connection with a second conveying belt and a third conveying belt respectively; the automatic detection and sorting device has the advantages that the automatic detection and sorting device is automatically matched with the conveying device to carry out comprehensive detection and sorting, fragile silicon wafers are prevented from being damaged, the detection efficiency is improved, the labor cost is reduced, the silicon wafers of different sizes can be clustered, and the fault tolerance of the whole equipment is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafers, in particular to an automatic wafer thickness detection and sorting device. Background Art

[0002] Patent No. CN116659441A discloses a detection device for detecting the thickness of semiconductor wafers. The present invention relates to the field of semiconductor wafer technology, including a workbench, the bottom of the workbench is provided with a hollow support foot, the lower end of the support foot is provided with a hollow base, the four side walls above the support foot are connected to an L-shaped channel plate that communicates with the inside thereof, and the end of each L-shaped channel plate away from the support foot is connected to the lower part of the workbench, and the upper part of the workbench is provided with four limit shells corresponding to the position of each L-shaped channel plate, and the limit shell is communicated with the inside of the L-shaped channel plate. The detection device for detecting the thickness of semiconductor wafers can simultaneously clamp and position the semiconductor wafer in four directions by means of compressed gas, has a fast positioning speed, and can also prevent the semiconductor wafer from being offset, thereby ensuring the accuracy of the semiconductor wafer thickness detection.

[0003] In the above-mentioned patented technology, the semiconductor wafer can be clamped and positioned in four directions at the same time by means of compressed gas, but it is impossible to align and focus according to the scanning position of the scanning equipment. At the same time, silicon wafers can now be mass-produced. The material of silicon wafers themselves is relatively fragile. During the manufacturing and transportation process, special care must be taken to avoid damage. Therefore, they are basically placed manually for inspection and sorting, and cannot be coordinated with conveying devices for automated inspection and sorting.

[0004] Therefore, a wafer thickness detection and automatic sorting device is needed to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a wafer thickness detection and automatic sorting device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a wafer thickness detection automatic sorting device, comprising a first conveyor belt, characterized in that: the two sides of one end of the first conveyor belt are respectively connected to the second conveyor belt and the third conveyor belt, a sorting device is arranged between the second conveyor belt and the third conveyor belt near one end of the first conveyor belt, and a thickness scanning device is arranged at one end of the first conveyor belt; The first conveyor includes two symmetrically arranged transmission rollers, the outer rings at both ends of the transmission rollers are respectively connected to a transmission belt, and the two ends of one of the transmission rollers are respectively connected to the second conveyor belt and the third conveyor belt, and a centering device is arranged between the two transmission belts.

[0007] Furthermore, the sorting device includes a sorting seat, the sorting seat is provided with a hollow slide, the hollow slide is slidably connected to the sorting rod, the lower end of the sorting rod is connected to the first tooth block, the first tooth block is engaged with the first private service motor, the output end of the first private service motor is engaged with the second tooth block, the second tooth block is connected to the middle position of the extrusion rod, the two ends of the extrusion rod are in contact with the bottom of the U-shaped support block, the U-shaped support block is slidably connected to the top of the support rod, and the support rod is connected to the thickness scanning device.

[0008] Furthermore, two ends of the inner wall of the U-shaped support block are rotatably connected to a first rotating roller, and the first rotating roller is in contact with a transmission belt of the first conveyor belt.

[0009] Furthermore, the thickness scanning device includes a reciprocating screw structure, which is connected to the visual detector, one end of the reciprocating screw structure is connected to the second private service motor, the other end of the reciprocating screw structure is connected to the first pulley, the first pulley is connected to the differential belt, the differential belt is connected to the second pulley, the second pulley is connected to one end of the gear rod, the other end of the gear rod is connected to the first bevel gear, the first bevel gear is connected to the second bevel gear, the inner ring of the second bevel gear is connected to the outer ring of the rotating column, the lower end of the rotating column is connected to the connecting column, and the connecting column is connected to the centering device.

[0010] Furthermore, a suction cup is arranged at the upper end of the rotating column, a vacuum pump is arranged inside the suction cup, and the outer circle of the top of the suction cup is a horizontal inclined surface with a downward angle of degrees.

[0011] Furthermore, the centering device includes a base, the base is connected to the cylinder at the middle position of the top, the output end of the cylinder is connected to the lifting plate, the lifting plate is connected to the symmetrically arranged lifting rods, the lifting rods are connected to the top ring plate, the top ring plate is connected to one end of four connecting rods, the other ends of the four connecting rods are rotatably connected to the slider, the slider is slidably connected to the upper end of the right-angle rod, and the lower end of the right-angle rod is connected to the base.

[0012] Furthermore, the top of the slider is rotatably connected to a rotating rod, and the rotating rod is in contact with an outer ring of the silicon wafer.

[0013] Furthermore, the top of the vacuum pump is higher than the top of the first conveyor belt, the lower end of the horizontally inclined surface of the vacuum suction cup at a downward angle of 10 degrees is lower than the first conveyor belt, and the upper end of the horizontally inclined surface of the vacuum suction cup at a downward angle of 10 degrees is higher than the top of the vacuum pump.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the wafer thickness detection and automatic sorting device is reasonable and has the following advantages: (1) The silicon wafer is sent to the thickness detection and sorting device through the first conveyor belt and stopped, and then the centering device centers the silicon wafer in the middle position of the thickness scanning device. The thickness scanning device absorbs and rotates the silicon wafer, and at the same time, the centerline position of the silicon wafer is horizontally scanned on the surface of the silicon wafer. After detecting qualified and unqualified silicon wafers, the silicon wafer is offset by the sorting device and is transported by the first conveyor belt again. The silicon wafer and the sorting device are offset and moved, so that the silicon wafer is transferred to the second conveyor belt and the third conveyor belt for qualified and unqualified distinction, and the first conveyor belt, the second conveyor belt and the third conveyor belt are automatically coordinated to perform comprehensive detection and sorting of silicon wafers, ensuring that fragile silicon wafers will not be damaged, improving detection efficiency, reducing labor costs, and being able to center silicon wafers of different sizes, thereby improving the overall fault tolerance of the equipment; (2) The reciprocating screw structure is driven by the second private motor, and the reciprocating screw structure drives the visual inspection instrument to move to scan the silicon wafer. At the same time, the reciprocating screw structure drives the first pulley, the second pulley, the differential belt, the gear rod, and the rotating column, so that the reciprocating screw structure drives the visual inspection instrument to move while also driving the silicon wafer to rotate, thereby more comprehensively scanning the thickness and surface defects of the silicon wafer. The first pulley, the second pulley, and the differential belt form a differential speed, so that the silicon wafer rotates more and the upper visual inspection instrument moves slower, thereby further improving the comprehensiveness of the scan; (3) By lifting and lowering the output end of the cylinder, the lifting plate, the lifting rod and one end of the connecting rod can be driven to lift and lower, and the other end of the connecting rod will drive the slider to slide along the right-angle rod, thereby clamping the silicon wafer inward or outward for centering, making it easier for the visual inspection instrument to move horizontally along the center line of the silicon wafer for scanning the side thickness more comprehensively. At the same time, it can be centered according to silicon wafers of different sizes, thereby improving the equipment's fault tolerance for centering silicon wafers of different sizes.

[0015] (4) Since the silicon wafer is scanned more comprehensively by its self-rotation, the contact of the slider will cause wear of the silicon wafer. Therefore, the top of the slider is rotatably connected to the rotating rod, and the outer ring of the silicon wafer contacts the rotating rod, thereby avoiding the occurrence of wear on the outer ring of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the sorting device in the present invention; Figure 3 It is a partial structural schematic diagram of the sorting device in the present invention; Figure 4 for Figure 2 Enlarged view of point A in the middle; Figure 5 It is a structural schematic diagram of the centering device in the present invention; Figure 6 It is a schematic diagram of the structure of the thickness scanning device in the present invention; Figure 7 It is a schematic diagram of the cross-sectional structure of the present invention; Figure 8 It is a partial structural schematic diagram of the focusing device in the present invention.

[0017] In the figure: 1-first conveyor belt, 2-second conveyor belt, 3-third conveyor belt, 4-sorting device, 41-sorting seat, 42-sorting rod, 43-first tooth block, 44-first private service motor, 45-second tooth block, 46-squeezing rod, 47-U-shaped support block, 48-support rod, 471-first rotating roller, 5-centering device, 51-base, 52-cylinder, 53-lifting plate, 54-lifting rod, 55-top ring plate, 56- Connecting rod, 57-slider, 571-rotating rod, 58-right-angle rod, 6-thickness scanning device, 611-reciprocating screw rod structure, 612-second private service motor, 613-first pulley, 614-differential belt, 615-second pulley, 616-gear rod, 617-first bevel gear, 618-second bevel gear, 619-rotating column, 620-connecting column, 62-visual inspection instrument, 63-suction cup, 64-vacuum pump. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-8The present invention provides a technical solution: an automatic wafer thickness detection and sorting device, comprising a first conveyor belt 1, both sides of one end of the first conveyor belt 1 are respectively connected to the second conveyor belt 2 and the third conveyor belt 3, a sorting device 4 is arranged between the second conveyor belt 2 and the third conveyor belt 3 near one end of the first conveyor belt 1, a thickness scanning device 6 is arranged at one end of the first conveyor belt 1, the first conveyor comprises two symmetrically arranged transmission rollers, the outer rings at both ends of the transmission rollers are respectively connected to a transmission belt, the two ends of one of the transmission rollers are respectively connected to the second conveyor belt 2 and the third conveyor belt 3, a centering device 5 is arranged between the two transmission belts, the silicon wafer is sent into the thickness detection and sorting device 4 by the first conveyor belt 1 and stopped, and then the centering device 5 sends the silicon wafer to the thickness detection and sorting device 4. The wafers are centered at the middle position of the thickness scanning device 6. The thickness scanning device 6 absorbs and rotates the silicon wafers, and at the same time, the centerline position of the silicon wafer is horizontally scanned on the surface of the silicon wafer. After detecting qualified and unqualified silicon wafers, the silicon wafers are offset through the sorting device 4, and the silicon wafers are conveyed by the first conveyor belt 1 again. The silicon wafers contact and shift with the sorting device 4 and move, so that the silicon wafers are transferred to the second conveyor belt 2 and the third conveyor belt 3 for qualified and unqualified distinction, and automatic coordination of the first conveyor belt 1, the second conveyor belt 2 and the third conveyor belt 3 is achieved to perform comprehensive detection and sorting of silicon wafers, ensuring that fragile silicon wafers will not be damaged, improving detection efficiency, reducing labor costs, and being able to center silicon wafers of different sizes to improve the overall fault tolerance of the equipment.

[0020] The sorting device 4 includes a sorting seat 41, the sorting seat 41 is provided with a hollow chute, the hollow chute is slidably connected to the sorting rod 42, the lower end of the sorting rod 42 is connected to the first tooth block 43, the first tooth block 43 is meshed with the first private service motor 44, the output end of the first private service motor 44 is meshed with the second tooth block 45, the second tooth block 45 is connected to the middle position of the extrusion rod 46, the two ends of the extrusion rod 46 are in contact with the bottom of the U-shaped support block 47, the U-shaped support block 47 is slidably connected to the top of the support rod 48, and the support rod 48 is connected to the thick The thickness scanning device 6 is connected to the silicon wafer, and the qualified and unqualified ones are detected by the thickness scanning device 6. Then the first private service motor 44 rotates forward or reversely, thereby moving the sorting rod 42. At the same time, the second tooth block 45 drives the squeezing rod 46 to support the support block 47, so that the first rotating roller 471 lifts the transmission belt of the first conveyor belt 1, and the transmission belt lifts the silicon wafer and moves it to the sorting rod 42. The silicon wafer moves to the second conveyor belt 2 or the third conveyor belt 3 while deviating from the contact with the sorting rod 42 for sorting.

[0021] The two ends of the inner wall of the U-shaped support block 47 are rotatably connected to the first rotating roller 471, and the first rotating roller 471 contacts the transmission belt of the first conveyor belt 1. The first rotating roller 471 can avoid wear caused by contact between the U-shaped support block 47 and the transmission belt of the first conveyor belt 1, thereby increasing the service life of the transmission belt.

[0022] The thickness scanning device 6 includes a reciprocating screw rod structure 611, which is connected to the visual detector 62, one end of the reciprocating screw rod structure 611 is connected to the second private motor 612, the other end of the reciprocating screw rod structure 611 is connected to the first pulley 613, the first pulley 613 is connected to the differential belt 614, the differential belt 614 is connected to the second pulley 615, the second pulley 615 is connected to one end of the gear rod 616, the other end of the gear rod 616 is connected to the first bevel gear 617, the first bevel gear 617 is connected to the second bevel gear 618, the inner ring of the second bevel gear 618 is connected to the outer ring of the rotating column 619, the lower end of the rotating column 619 is connected to the connecting column 620, and the connecting column 620 is connected to The focusing device 5 is connected, and the reciprocating screw structure 611 is driven by the second private service motor 612. The reciprocating screw structure 611 drives the visual inspection instrument 62 to move to scan the silicon wafer. At the same time, the reciprocating screw structure 611 transmits the first pulley 613, the second pulley 615, the differential belt 614, the gear rod 616, and the rotating column 619, so that the reciprocating screw structure drives the visual inspection instrument 62 to move while also driving the silicon wafer to rotate, thereby more comprehensively scanning the thickness of the silicon wafer and the surface defects. The first pulley 613, the second pulley 615, and the differential belt 614 form a differential, so that the silicon wafer rotates more circles, and the upper visual inspection instrument 62 moves slower, thereby further improving the comprehensiveness of the scan.

[0023] A suction cup 63 is arranged at the upper end of the rotating column 619, and a vacuum pump 64 is arranged inside the suction cup 63. The outer circle of the top of the suction cup 63 is a horizontally inclined surface inclined downward at 10 degrees. The horizontally inclined surface of the outer circle of the top of the suction cup 63 inclined downward at 10 degrees facilitates the movement of the silicon wafer to the upper end of the suction cup 63, and then the vacuum pump 64 is started to fix it to the upper end of the vacuum pump 64, so as to ensure stability when the silicon wafer rotates.

[0024] The centering device 5 includes a base 51, which is connected to a cylinder 52 at the middle position of the top, and an output end of the cylinder 52 is connected to a lifting plate 53, which is connected to a symmetrically arranged lifting rod 54, which is connected to a top ring plate 55, which is connected to one end of four connecting rods 56, and the other end of the four connecting rods 56 is rotatably connected to a slider 57, which is slidably connected to the upper end of a right-angle rod 58, and the lower end of the right-angle rod 58 is connected to the base 51. The lifting and lowering of the output end of the cylinder 52 can drive the lifting and lowering of the lifting plate 53, the lifting rod 54 and one end of the connecting rod 56, and the other end of the connecting rod 56 will drive the slider 57 to slide along the right-angle rod 58, so as to clamp the silicon wafer inward or outward for centering, so as to facilitate the visual inspection instrument 62 to move horizontally and scan along the center line of the silicon wafer, so as to more comprehensively scan the side thickness, and at the same time, it can be centered according to silicon wafers of different sizes, thereby improving the fault tolerance of the equipment for centering silicon wafers of different sizes.

[0025] Since the silicon wafer is scanned more comprehensively by its rotation, the contact of the slider 5757 will cause wear of the silicon wafer, so the top of the slider 57 is rotatably connected to the rotating rod 571, and the outer ring of the silicon wafer contacts the rotating rod 571, thereby avoiding the occurrence of wear of the outer ring of the silicon wafer.

[0026] The top of the vacuum pump 64 is higher than the top of the first conveyor belt 1, the lower end of the horizontal 10-degree downward slope of the vacuum suction cup 63 is lower than the first conveyor belt 1, and the upper end of the horizontal 10-degree downward slope of the vacuum suction cup 63 is higher than the top of the vacuum pump 64. Through these three high-bottom settings, the bottom of the silicon wafer can be prevented from contacting the surface of the first conveyor belt 1 when rotating, thereby preventing the occurrence of wear on the bottom of the silicon wafer.

[0027] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A wafer thickness detection and automatic sorting device, comprising a first conveyor belt (1), characterized in that: The two sides of one end of the first conveyor belt (1) are respectively connected to the second conveyor belt (2) and the third conveyor belt (3) in transmission connection, a sorting device (4) is arranged between the second conveyor belt (2) and the third conveyor belt (3) near one end of the first conveyor belt (1), and a thickness scanning device (6) is arranged at one end of the first conveyor belt (1); The first conveyor comprises two symmetrically arranged transmission rollers, the outer rings at both ends of the transmission rollers are respectively connected to a transmission belt, the two ends of one of the transmission rollers are respectively connected to the second conveyor belt (2) and the third conveyor belt (3), and a centering device (5) is arranged between the two transmission belts.

2. The wafer thickness detection and automatic sorting device according to claim 1 is characterized in that: The sorting device (4) comprises a sorting seat (41), the sorting seat (41) is provided with a hollow slide groove, the hollow slide groove is slidably connected to the sorting rod (42), the lower end of the sorting rod (42) is connected to the first tooth block (43), the first tooth block (43) is meshed with the first private service motor (44), the output end of the first private service motor (44) is meshed with the second tooth block (45), the second tooth block (45) is connected to the middle position of the extrusion rod (46), the two ends of the extrusion rod (46) are in contact with the bottom of the U-shaped support block (47), the U-shaped support block (47) is slidably connected to the top of the support rod (48), and the support rod (48) is connected to the thickness scanning device (6).

3. The wafer thickness detection and automatic sorting device according to claim 2 is characterized in that: The two ends of the inner wall of the U-shaped support block (47) are rotatably connected to the first rotating roller (471), and the first rotating roller (471) is in contact with the transmission belt of the first conveyor belt (1).

4. The wafer thickness detection and automatic sorting device according to claim 2 is characterized in that: The thickness scanning device (6) comprises a reciprocating screw rod structure (611), the reciprocating screw rod structure (611) is connected to the visual detector (62), one end of the reciprocating screw rod structure (611) is connected to the second servo motor (612), the other end of the reciprocating screw rod structure (611) is connected to the first pulley (613), the first pulley (613) is connected to the differential belt (614), the differential belt (614) is connected to the second pulley (615), and the second pulley (616) is connected to the second pulley (617). ) is connected in transmission, the second pulley (615) is connected in transmission with one end of the gear rod (616), the other end of the gear rod (616) is connected in transmission with the first bevel gear (617), the first bevel gear (617) is connected in transmission with the second bevel gear (618), the inner ring of the second bevel gear (618) is connected to the outer ring of the rotating column (619), the lower end of the rotating column (619) is connected to the connecting column (620), and the connecting column (620) is connected to the centering device (5).

5. The wafer thickness detection and automatic sorting device according to claim 4 is characterized in that: A suction cup (63) is arranged at the upper end of the rotating column (619), a vacuum pump (64) is arranged inside the suction cup (63), and the outer circle of the top of the suction cup (63) is a horizontal inclined surface with a downward angle of 10 degrees.

6. The wafer thickness detection and automatic sorting device according to claim 4 is characterized in that: The centering device (5) comprises a base (51), wherein the base (51) is connected to a cylinder (52) at the middle position of the top, the output end of the cylinder (52) is connected to a lifting plate (53), the lifting plate (53) is connected to symmetrically arranged lifting rods (54), the lifting rods (54) are connected to a top ring plate (55), the top ring plate (55) is connected to one end of four connecting rods (56), the other ends of the four connecting rods (56) are rotatably connected to a slider (57), the slider (57) is slidably connected to the upper end of a right-angle rod (58), and the lower end of the right-angle rod (58) is connected to the base (51).

7. The wafer thickness detection and automatic sorting device according to claim 6, characterized in that: The top of the slider (57) is rotatably connected to a rotating rod (571), and the rotating rod (571) is in contact with the outer ring of the silicon wafer.

8. The wafer thickness detection and automatic sorting device according to claim 5, characterized in that: The top of the vacuum pump (64) is higher than the top of the first conveyor belt (1), the lower end of the horizontally inclined surface of the vacuum suction cup (63) which is inclined downward at 10 degrees is lower than the first conveyor belt (1), and the upper end of the horizontally inclined surface of the vacuum suction cup (63) which is inclined downward at 10 degrees is higher than the top of the vacuum pump (64).

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