Chip packaging device and packaging method thereof

Abstract

The invention relates to the technical field of semiconductor chip packaging, and discloses a chip packaging device and a packaging method.The chip packaging device is used for packaging a chip shell, a glue injection hole and an air exhaust hole are formed in the chip shell, the chip packaging device comprises a rack and a conveying structure, and a packaging bearing platform is installed on the conveying structure; the packaging bearing platform is used for placing a to-be-packaged chip, when a chip shell moves to a specific position on the packaging bearing platform, the telescopic push rod drives the positioning block to position the chip shell, and when the positioning block moves to a proper position, the connecting seat drives the glue injection pipe and the air exhaust pipe to arrive at a specific position to start simultaneous operation of glue injection and air exhaust. And the chip shell is completely filled with the glue solution. Through mechanical positioning, elastic triggering and multi-point cooperation technologies, high precision, high uniformity and full-automatic control of chip packaging are realized, the problems of positioning deviation, non-uniform filling and glue overflow in a traditional process are effectively solved, and complex packaging requirements are met.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and in particular to a chip packaging device and a packaging method thereof. Background Art

[0002] The chip packaging process includes the gate packaging method, which is to first form a dam around the chip with a packaging glue, and then fill the dam with packaging glue to complete the packaging of the semiconductor. Although this packaging method improves the yield rate of semiconductor devices, during packaging, especially during the dam formation operation, the supply of glue is unstable and partial collapse occurs, thus affecting the packaging effect and causing the packaging appearance to be incomplete.

[0003] The prior art provides a chip packaging device and a chip packaging method, with application number CN202410631642.5, which is a method or equipment specifically suitable for manufacturing semiconductor devices. The chip packaging device includes a base plate, a positioning mechanism is provided at one end of the base plate, a placement table is provided at the other end of the base plate, a transfer mechanism is provided between the positioning mechanism and the placement table, a packaging mechanism is provided on the base plate, and the positioning mechanism can position the packaging substrate. The chip packaging method uses a chip packaging device to package the chip, and the packaging operation is efficiently completed through the device and method. At the same time, the connection effect between the packaging shell and the packaging substrate can be ensured after packaging. However, the prior art, especially this scheme, still has the following problems: when the device actually performs glue injection and docking on the chip, positioning deviation and positioning deviation, uneven filling and overflow of glue are prone to occur. For this reason, we provide a chip packaging device and a packaging method thereof. Summary of the invention

[0004] The purpose of the present invention is to provide a technical solution to achieve high-precision, high-uniformity and fully automated control of chip packaging through mechanical positioning, elastic triggering and multi-point collaborative technology, so as to solve the problems in the prior art raised in the above background technology.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip packaging device is used to package a chip shell, and the chip shell is provided with a glue injection hole and an air extraction hole, comprising:

[0007] The frame and the conveying structure are provided with a packaging platform, the packaging platform is used to place the chip to be packaged, the frame is provided with a connecting seat which can move in three dimensions, and the connecting seat is provided with several groups of injection tubes and exhaust tubes; the conveying structure is provided with a conveying track for chip transmission movement, the packaging platform is provided with telescopic push rods on both sides of the conveying track, the telescopic end of the telescopic push rod is provided with a positioning block for clamping the chip shell, and the positioning block is provided with an exhaust nozzle;

[0008] When the chip shell moves to a specific position on the packaging platform, the telescopic push rod drives the positioning block to position the chip shell. When the positioning block moves to a suitable position, the connecting seat drives the glue injection tube and the vacuum tube to the specified position, and starts the simultaneous operation of glue injection and vacuum extraction until the glue completely fills the chip shell.

[0009] Preferably, grooves are provided on both sides of the chip shell, and thermal pads are provided on both sides and the bottom of the chip shell; a glue injection hole is provided on the top of the chip shell, and a plurality of air extraction holes are provided on the top and sides of the chip shell.

[0010] Preferably, the positioning block is configured to match the shape of the groove on the chip housing, and a positioning groove for matching the thermal pad is provided on the positioning block. The end of the positioning block close to the chip housing is configured as a protruding structure, and both sides of the protruding structure are configured as arc-shaped portions. When the telescopic push rod pushes the positioning block to move, the arc-shaped portion contacts the groove of the chip housing to cause the chip to move horizontally, thereby achieving precise positioning.

[0011] Preferably, a movable column is connected to the bottom of the connecting seat, the mounting plate is movably sleeved on the movable column, and the elastic member is sleeved on the movable column and supported between the connecting seat and the mounting plate.

[0012] Preferably, a pressure sensor is provided at the coaxial end of the elastic member, and a controller connected to the pressure sensor is further included. The pressure threshold is set by the pressure sensor, and the injection structure and the air extraction structure are controlled by real-time feedback from the pressure sensor.

[0013] Preferably, the exhaust holes include a first exhaust hole and a second exhaust hole, two groups of glue injection holes and the first exhaust hole are arranged on the top of the chip shell, and the second exhaust hole is arranged on the side of the chip shell; two groups of glue injection tubes and two groups of exhaust tubes are arranged on the mounting plate, the two groups of exhaust tubes are distributed on both sides of the glue injection tube, and two groups of exhaust nozzles are also arranged on the positioning block.

[0014] Preferably, the mounting plate is movably mounted on the connecting seat, and an elastic member is provided between the connecting seat and the mounting plate. When the elastic member is compressed to a specified pressure threshold, the glue injection tube, the air extraction tube and the air extraction nozzle start to work.

[0015] Preferably, an XY-axis transfer structure and a Z-axis transfer structure are installed on the top of the frame, and the XY-axis transfer structure and the Z-axis transfer structure are arranged at the bottom of the packaging platform. A connecting seat is installed on the aforementioned frame so as to be able to move in three dimensions, and the connecting seat realizes three-dimensional movement through the XY-axis transfer structure and the Z-axis transfer structure.

[0016] Preferably, a driver three is installed at the bottom of the Z-axis transfer structure, a rotation adjustment plate is installed at the rotating end of the driver three, a connecting column is rotatably installed on the rotation adjustment plate through the driver one, and the connecting seat is installed on the driver three through the connecting column and the rotation adjustment plate. Under the coordinated adjustment of the driver three and the rotation adjustment plate, the connecting seat can be rotated radially along the axis of the connecting column; a motor seat for installing the driver one is provided on the rotation adjustment plate, and the driver one can drive the connecting column to rotate on the motor seat.

[0017] The present application also provides a packaging method for a chip packaging device, comprising the following steps: S1: chip positioning and conveying; S2: precise positioning and clamping; S3: alignment of the glue injection and vacuum structure; S4: downward movement triggering operation; S5: glue filling monitoring and control; S6: residual glue cleaning and resetting.

[0018] Technical effects and advantages of the present invention: Compared with the prior art, the chip packaging device and packaging method proposed by the present invention have the following advantages:

[0019] The present invention realizes high-precision, high-uniformity and fully automated control of chip packaging through mechanical positioning, elastic triggering and multi-point coordination technology, effectively solves the problems of positioning deviation, uneven filling and overflow of glue in traditional processes, and adapts to complex packaging requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the chip packaging device of the present invention;

[0021] Figure 2 This is one of the partial structural schematic diagrams of the chip packaging device of the present invention;

[0022] Figure 3 The second schematic diagram of the partial structure of the chip packaging device of the present invention;

[0023] Figure 4 It is a schematic diagram of a three-axis transfer structure in a chip packaging device of the present invention;

[0024] Figure 5 It is a schematic diagram of the structures such as the connecting seat and the rotating adjustment plate in the present invention;

[0025] Figure 6 It is a schematic diagram of the packaging support, positioning block and connecting seat structures in the present invention;

[0026] Figure 7 For the present invention Figure 6 A schematic diagram of the enlarged structure at A in the middle;

[0027] Figure 8 It is a schematic diagram of the structure in which the positioning block in the present invention clamps the packaging shell.

[0028] In the figure:

[0029] 11. Frame; 12. Conveying structure; 13. Packaging platform; 14. Giving way groove; 15. Telescopic member; 16. Positioning block; 17. Vacuum driving member; 18. Second vacuum nozzle;

[0030] 21. XY axis transfer structure; 22. Z axis moving structure; 23. Connecting seat; 24. Rotating adjustment plate; 25. Glue supply pipe; 26. Glue injection pipe; 27. Air extraction pipe; 28. Driver 1; 29. ​​Driver 2; 210. Driver 3; 211. Connecting column; 212. Elastic member; 213. Mounting plate; 214. Movable column;

[0031] 31. Packaging shell; 32. Groove; 33. Glue injection hole; 34. First exhaust hole; 35. Second exhaust hole; 36. Thermal pad. DETAILED DESCRIPTION

[0032] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that the discussion of these implementations is only to enable those skilled in the art to better understand and implement the subject matter described herein, and the functions and arrangements of the elements discussed may be changed without departing from the scope of protection of the contents of this specification. Various examples may omit, replace, or add various processes or components as needed. In addition, the features described in some examples may also be combined in other examples.

[0033] Embodiment 1: The invention provides Figures 1 to 8 As shown, a chip packaging device is used to package a chip housing 31, and the chip housing 31 is provided with a glue injection hole 33 and an air extraction hole, comprising:

[0034] The frame 11 and the conveying structure 12 are provided with a packaging platform 13, the packaging platform 13 is used to place the chip to be packaged, the frame 11 is provided with a connecting seat 23 which can be moved in three dimensions, the connecting seat 23 is provided with a plurality of groups of glue injection tubes 26 and air extraction tubes 27; the conveying structure 12 is provided with a conveying track for chip transmission movement, the packaging platform 13 is provided with telescopic push rods 15 on both sides of the conveying track, the telescopic end of the telescopic push rod 15 is provided with a positioning block 16 for clamping the chip housing 31, and the positioning block 16 is provided with an air extraction nozzle 18;

[0035] When the chip housing 31 moves to a specific position on the packaging platform 13, the telescopic push rod 15 drives the positioning block 16 to position the chip housing 31. When the positioning block 16 moves to a suitable position, the connecting seat 23 drives the glue injection tube 26 and the exhaust pipe 27 to the specified position, and starts the simultaneous operation of glue injection and exhaust until the glue completely fills the chip housing 31.

[0036] Working principle: the telescopic push rod 15 drives the arc surface 110 of the positioning block 16 to embed into the groove 32 of the chip shell 31. After horizontal fine-tuning and alignment, the positioning groove 19 engages with the thermal pad 36 to complete the fixation and realize positioning and clamping; three-dimensional dynamic alignment, the connecting seat 23 moves three-dimensionally through the frame 11, driving the glue injection tube 26 and the exhaust pipe 27 to accurately dock the glue injection hole 33 and the exhaust hole; synchronous glue injection and exhaust, the glue injection tube 26 and the exhaust pipe 27 and the exhaust nozzle 18 are started synchronously, and the glue liquid evenly fills the chip shell 31 under the action of negative pressure. High-precision positioning, the arc surface 110 combines with the positioning groove 19 to achieve horizontal and vertical dual positioning, eliminate deviation, and ensure accurate docking of the glue injection and exhaust holes; filling is uniform and efficient, and the glue injection and exhaust are operated synchronously, using negative pressure to drive the glue liquid to flow, avoiding bubble residue, and improving the packaging density; automatic adaptation, the three-dimensional mobile connecting seat 23 flexibly adjusts the position of the glue injection / exhaust assembly to adapt to the layout of the glue injection holes 33 and exhaust holes of different chip shells 31. The process is integrated, and positioning, glue injection, and air extraction are completed in one, which reduces manual intervention and significantly improves packaging efficiency and yield.

[0037] like Figure 7 and Figure 8 As shown, since the chip packaging device of the present application is not intended for all types of chips, the corresponding chip shell 31 is introduced here. Grooves 32 are provided on both sides of the chip shell 31, and thermal pads 36 are provided on both sides and the bottom of the chip shell 31; a glue injection hole 33 is provided on the top of the chip shell 31, and a plurality of exhaust holes are provided on the top and sides of the chip shell 31.

[0038] like Figure 7 and Figure 8 As shown, the positioning block 16 is configured to match the shape of the groove 32 on the chip housing 31, and a positioning groove 19 for matching the thermal pad 36 is provided on the positioning block 16. In actual use, the positioning groove 19 clamps the thermal pad 36 of the chip to strictly position the chip.

[0039] like Figure 7 and Figure 8 As shown, one end of the positioning block 16 close to the chip housing 31 is set as a protruding structure, and the two sides of the protruding structure are set as arc surface parts 110. When the telescopic push rod 15 pushes the positioning block 16 to move, the arc surface part 110 contacts the groove 32 of the chip housing 31 to make the chip move horizontally, so as to achieve precise positioning and ensure the docking of the subsequent glue injection structure and the vacuum structure.

[0040] like Figure 6 As shown, the packaging support 13 is provided with a clearance groove 14 for installing the conveying track. The conveying track is configured as a belt conveyor with a positioning structure. The clearance groove 14 is a reserved installation position for the conveying track. Since the conveying track can be configured in various forms in actual use, the specific implementation of the conveying track is not shown in the drawings.

[0041] Specifically, Figure 7 As shown, the exhaust holes include a first exhaust hole 34 and a second exhaust hole 35. The top of the chip housing 31 is provided with two groups of glue injection holes 33 and a first exhaust hole 34. The side of the chip housing 31 is provided with a second exhaust hole 35. For the chip in the figure, the packaging glue is injected from the top of the chip housing 31, and the top exhaust pipe 27 and the side exhaust nozzle 18 are used to exhaust air so that the glue fully fills the interior of the chip housing 31.

[0042] like Figure 6 and Figure 7 As shown, specifically, regarding the setting method of the glue injection tube 26 and the exhaust tube 27 and the corresponding glue injection holes 33 and the exhaust holes in actual work, two groups of glue injection tubes 26 and two groups of exhaust tubes 27 are arranged on the mounting plate 213, and the two groups of exhaust tubes 27 are distributed on both sides of the glue injection tube 26. There are also two groups of exhaust nozzles 18 on the positioning block 16. The specific glue injection and exhaust form is multi-point glue injection on the top and multi-point exhaust on the top and sides, so that the encapsulation glue can evenly and fully fill the interior of the chip shell 31.

[0043] like Figure 6 and Figure 7 As shown, regarding the aforementioned when the chip housing 31 moves to a specific position on the packaging platform 13, the specific position here is set by the operator. In one embodiment, the specific position refers to when the glue injection tube 26 on the connecting seat 23 is in full contact with the glue injection hole 33 of the chip housing 31.

[0044] Specifically, in order to ensure complete contact between the glue injection tube 26 and the glue injection hole 33 and complete contact between the air extraction tube 27 and the air extraction hole, the mounting plate 213 is movably mounted on the connecting seat 23, and an elastic member 212 is arranged between the connecting seat 23 and the mounting plate 213. When the elastic member 212 is compressed to a specified pressure threshold, the glue injection tube 26, the air extraction tube 27 and the air extraction nozzle 18 start working. Starting work here means that the glue injection tube 26 starts injecting glue, and the air extraction tube 27 and the air extraction nozzle 18 start exhausting air.

[0045] like Figure 6 As shown, the mounting plate 213 is movably mounted on the connecting seat 23, the bottom of the connecting seat 23 is connected with a movable column 214, the mounting plate 213 is movably mounted on the movable column 214, and the elastic member 212 is mounted on the movable column 214 and supported between the connecting seat 23 and the mounting plate 213, and these structures realize the aforementioned functions. More specifically, a pressure sensor is provided at the coaxial end of the elastic member 212, and a controller connected to the pressure sensor is also provided, the pressure threshold is set by the pressure sensor, and the injection structure and the air extraction structure are controlled by the real-time feedback of the pressure sensor.

[0046] Specifically, regarding the driving of the vacuum nozzle 18 and the vacuum pipe 27, the positioning block 16 is provided with a vacuum driving member 17 for driving the vacuum nozzle 18 to draw air, and the mounting plate 213 is also provided with a similar vacuum assembly, which is actually a vacuum pump or the like. More specifically, an anti-blocking structure and a contact identification structure are provided at the entrance of the vacuum nozzle 18 and the vacuum pipe 27. The anti-blocking structure is used to prevent the filled glue from blocking the vacuum nozzle 18 and the vacuum pipe 27, and the contact identification structure is used to contact and identify the glue overflowing after the chip housing 31 is filled. After the overflow, the glue contacts the vacuum nozzle 18 and the vacuum pipe 27, and feedback is obtained to stop the glue injection and vacuum operation. The contact identification structure is specifically implemented by a contact sensor, which will not be described here. In addition, when the vacuum driving member 17 and the vacuum assembly are in an intermittent state, the vacuum operation can continue to be performed to discharge the excess glue blocked in the vacuum nozzle 18 and the vacuum pipe 27, thereby avoiding affecting the vacuum operation of the chip in the next cycle process.

[0047] like Figures 1 to 4 As shown, an XY-axis transfer structure 21 and a Z-axis transfer structure 22 are installed on the top of the frame 11, and the XY-axis transfer structure 21 and the Z-axis transfer structure 22 are arranged on the bottom of the packaging platform 13. A connecting seat 23 is installed on the aforementioned frame 11 so as to be able to move in three dimensions, and the connecting seat 23 realizes three-dimensional movement through the XY-axis transfer structure 21 and the Z-axis transfer structure 22.

[0048] like Figure 2 , Figure 4 and Figure 5 As shown, further, a driver 3 210 is installed at the bottom of the Z-axis transfer structure 22, and a rotating adjustment plate 24 is installed at the rotating end of the driver 3 210. A connecting column 211 is rotatably installed on the rotating adjustment plate 24 through a driver 1 28. The connecting seat 23 is installed on the driver 3 210 through the connecting column 211 and the rotating adjustment plate 24. Under the coordinated adjustment of the driver 3 210 and the rotating adjustment plate 24, the connecting seat 23 can be rotated and adjusted radially along the axis of the connecting column 211. The driver 3 210 is actually set as a driving machine with a rotation drive and a self-locking function, so that the rotating adjustment plate 24 can be rotated and adjusted at the rotating end of the driver 3 210, but after the adjustment is completed, it is self-locked to maintain a certain angle, thereby facilitating the subsequent docking work of the glue injection structure and the exhaust structure. Specifically, a glue supply pipe 25 for supplying glue to the glue injection tube 26 is provided on the connecting column 211. The specific glue supply method is technical common sense and will not be repeated.

[0049] like Figure 4As shown, the rotation adjustment plate 24 is provided with a motor seat for installing a driver 28, and the driver 28 can drive the connecting column 211 to rotate on the motor seat, that is, drive the connecting seat 23 and the mounting plate 213 at the bottom of the connecting column 211 to rotate and adjust. Specifically, the XY-axis transfer structure 21 and the Z-axis transfer structure 22 are both provided with a driver 29 for their own driving, and the aforementioned drivers are all configured as servo drivers to achieve high-precision drive adjustment.

[0050] Embodiment 2: A packaging method for a chip packaging device is also provided, comprising the following steps:

[0051] S1: Chip positioning and conveying: placing the chip to be packaged on the packaging platform 13 of the conveying structure 12, and moving the chip housing 31 to a set position through the conveying track;

[0052] S2: Precise positioning and clamping, start the telescopic push rod 15 to push the positioning block 16, and make the arc surface 110 contact the groove 32 to fine-tune the chip level until the positioning groove 19 engages with the thermal pad 36 to complete the chip fixation;

[0053] S3: Aligning the glue injection and air extraction structures, driving the connection seat 23 to move three-dimensionally through the XY axis transfer structure 21 and the Z axis transfer structure 22, so that the glue injection tube 26 and the air extraction tube 27 correspond to the glue injection hole 33 and the air extraction hole respectively;

[0054] S4: Downward movement triggers the operation. When the elastic member 212 is pressurized to a set threshold, the pressure sensor feedback signal starts the glue injection tube 26 to inject glue and the exhaust pipe 27 and the exhaust nozzle 18 to exhaust air synchronously;

[0055] S5: Glue filling monitoring control, detecting the glue overflow signal at the suction port through the contact sensor, triggering the stop of glue injection and closing the suction component;

[0056] S6: Residual glue cleaning and resetting, the vacuum drive 17 runs intermittently to discharge the residual glue, then the connecting seat 23 is reset to the initial position, and the telescopic push rod 15 releases the chip to complete the packaging.

[0057] In summary, the present invention also has the following comprehensive effects: positioning and clamping mechanism, through the telescopic push rod 15, the arc surface 110 of the positioning block 16 is driven to contact the groove 32 of the chip housing 31 to achieve horizontal fine-tuning, and the positioning groove 19 is combined with the thermal pad 36 to complete the precise positioning of the chip, ensuring that the glue injection tube 26 and the air extraction tube 27 are accurately connected with the glue injection hole 33 and the air extraction hole. Elastic pressure triggers synchronous operation, the connecting seat 23 drives the glue injection tube 26 and the air extraction tube 27 to move downward, and the pressure sensor signal is triggered by the elastic part 212 under pressure to control the synchronous start of glue injection and air extraction, ensuring contact reliability and process synchronization. Multi-point glue injection and air extraction are coordinated, the two top glue injection tubes 26 and the two groups of air extraction tubes 27 on the top / side, and the air extraction nozzle 18 form a multi-point glue injection-air extraction network, which cooperates with the air extraction drive 17 and the air extraction pump to make the glue liquid evenly fill the inside of the chip housing 31 under negative pressure. Sensor linkage control, after the contact sensor detects the signal of glue overflow at the suction port, the glue injection is automatically stopped and the suction is turned off; the suction drive 17 runs intermittently to remove the remaining glue to avoid blockage and realize closed-loop control. Three-dimensional dynamic adjustment adaptation, the three-axis transfer structure and the driver 210 adjust the three-dimensional position and angle of the connection seat 23 to adapt to the packaging requirements of different types of chips and ensure flexible alignment of the glue injection structure.

[0058] High-precision positioning and filling uniformity, through the synergy of the arc surface 110 and the positioning groove 19, the chip position deviation is eliminated, and the multi-point injection-exhaust network is combined to make the glue liquid fill evenly, avoid bubbles or gaps, and improve the reliability of packaging. Elastic pressure triggering and automatic control, the elastic part 212 is linked with the pressure sensor to ensure that the injection / exhaust assembly and the chip are started after the contact pressure reaches the standard to avoid poor contact; the contact sensor automatically terminates the operation, reducing manual intervention and reducing the risk of glue overflow. Anti-blocking and long-term maintenance of equipment, the anti-blocking structure and intermittent exhaust design remove residual glue, prevent the exhaust port from being blocked, and ensure continuous production stability; the servo drive ensures movement accuracy and extends the service life of the equipment. The adaptability of multi-dimensional adjustment is enhanced, and the three-axis transfer structure and the rotating adjustment plate 24 support the three-dimensional movement and angle adjustment of the connecting seat 23, adapting to chip shells 31 of different sizes or hole distributions, and expanding the application range of the device. Efficiency and process quality are both improved, synchronous injection and exhaust shorten the filling time, sensor closed-loop control reduces process fluctuations, and combined with servo drive high-precision positioning, the packaging efficiency and yield rate are significantly improved. Through mechanical positioning, elastic triggering, multi-point coordination and intelligent sensing technology, high-precision, high-uniformity and fully automated control of chip packaging are achieved, effectively solving positioning deviation, uneven filling and overflow problems in traditional processes, and adapting to complex packaging needs.

[0059] The embodiments of the present invention are described above, but the present invention is not limited to the above-mentioned specific implementation modes. The above-mentioned specific implementation modes are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms, all of which are within the protection of the present invention.

Claims

1. A chip packaging device, characterized in that: A chip housing (31) is used for packaging, and a glue injection hole (33) and an air extraction hole are provided on the chip housing (31), comprising: A frame (11) and a conveying structure (12), wherein a packaging platform (13) is installed on the conveying structure (12), and the packaging platform (13) is used to place the chip to be packaged. A connecting seat (23) is installed on the frame (11) so as to be movable in three dimensions, and a plurality of groups of glue injection tubes (26) and air extraction tubes (27) are installed on the connecting seat (23); a conveying track for chip transmission movement is provided on the conveying structure (12), and telescopic push rods (15) are installed on both sides of the packaging platform (13), and a positioning block (16) for clamping the chip housing (31) is installed at the telescopic end of the telescopic push rod (15), and an air extraction nozzle (18) is provided on the positioning block (16); When the chip housing (31) moves to a specific position on the packaging support (13), the telescopic push rod (15) drives the positioning block (16) to position the chip housing (31). When the positioning block (16) moves to a suitable position, the connecting seat (23) drives the glue injection tube (26) and the air extraction tube (27) to the specified position, and starts the glue injection and air extraction operations simultaneously until the glue completely fills the chip housing (31).

2. The chip packaging device according to claim 1, characterized in that: Grooves (32) are provided on both sides of the chip housing (31), and thermal pads (36) are provided on both sides and the bottom of the chip housing (31); a glue injection hole (33) is provided on the top of the chip housing (31), and a plurality of air extraction holes are provided on the top and sides of the chip housing (31).

3. The chip packaging device according to claim 2, characterized in that: The positioning block (16) is configured to match the shape of the groove (32) on the chip housing (31), and a positioning groove (19) for matching the thermal pad (36) is provided on the positioning block (16). One end of the positioning block (16) close to the chip housing (31) is configured as a protruding structure, and both sides of the protruding structure are configured as arc surface portions (110). When the telescopic push rod (15) pushes the positioning block (16) to move, the arc surface portion (110) contacts the groove (32) of the chip housing (31), causing the chip to move horizontally, thereby achieving precise positioning.

4. The chip packaging device according to claim 1, characterized in that: The bottom of the connecting seat (23) is connected to a movable column (214), the mounting plate (213) is movably mounted on the movable column (214), and the elastic member (212) is mounted on the movable column (214) and supported between the connecting seat (23) and the mounting plate (213).

5. The chip packaging device according to claim 4, characterized in that: The coaxial end of the elastic member (212) is provided with a pressure sensor, and also includes a controller connected to the pressure sensor, the pressure threshold is set by the pressure sensor, and the glue injection structure and the air extraction structure are controlled by real-time feedback of the pressure sensor.

6. The chip packaging device according to claim 5, characterized in that: The exhaust holes include a first exhaust hole (34) and a second exhaust hole (35); two groups of glue injection holes (33) and the first exhaust hole (34) are arranged on the top of the chip housing (31); and the second exhaust hole (35) is arranged on the side of the chip housing (31); two groups of glue injection tubes (26) and two groups of exhaust tubes (27) are arranged on the mounting plate (213); the two groups of exhaust tubes (27) are distributed on both sides of the glue injection tube (26); and two groups of exhaust nozzles (18) are also arranged on the positioning block (16).

7. The chip packaging device according to claim 6, characterized in that: The mounting plate (213) is movably mounted on the connecting seat (23); an elastic member (212) is provided between the connecting seat (23) and the mounting plate (213); when the elastic member (212) is compressed to a specified pressure threshold, the glue injection tube (26), the air extraction tube (27) and the air extraction nozzle (18) start to work.

8. A chip packaging device according to any one of claims 1 to 7, characterized in that: An XY-axis transfer structure (21) and a Z-axis transfer structure (22) are installed on the top of the frame (11); the XY-axis transfer structure (21) and the Z-axis transfer structure (22) are arranged on the bottom of the packaging support platform (13); and the connecting seat (23) realizes three-dimensional movement through the XY-axis transfer structure (21) and the Z-axis transfer structure (22).

9. The chip packaging device according to claim 8, characterized in that: A driver three (210) is installed at the bottom of the Z-axis transfer structure (22), and a rotation adjustment plate (24) is installed at the rotating end of the driver three (210). A connecting column (211) is rotatably installed on the rotation adjustment plate (24) through the driver one (28). The connecting seat (23) is installed on the driver three (210) through the connecting column (211) and the rotation adjustment plate (24). Under the coordinated adjustment of the driver three (210) and the rotation adjustment plate (24), the connecting seat (23) can be rotated and adjusted radially along the axis of the connecting column (211); a motor seat for installing the driver one (28) is provided on the rotation adjustment plate (24), and the driver one (28) can drive the connecting column (211) to rotate on the motor seat.

10. The chip packaging method according to claim 1, characterized in that: The method comprises the following steps: S1: chip positioning and conveying; S2: precise positioning and clamping; S3: alignment of the glue injection and air extraction structure; S4: downward movement triggering operation; S5: glue filling monitoring and control; S6: residual glue cleaning and resetting.

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