Substrate bearing device and substrate processing equipment

Abstract

The invention discloses a substrate bearing device and substrate processing equipment, and relates to the field of semiconductor equipment. A substrate bearing device comprises a connecting piece which comprises a connecting body extending in the vertical direction; the bearing piece is connected to the connecting piece, the bearing piece extends in the horizontal direction and bears the multiple substrates in the mode that the multiple substrates are parallel to the vertical direction, and the multiple substrates comprise the first substrate adjacent to the main face of the connecting piece; the connecting piece further comprises a rectifying part, the main face of the rectifying part is flush with the main face of the connecting body, and the rectifying part is configured in the mode that when the bearing piece bears the substrates, the orthographic projection of the first substrate on the rectifying part is located in the rectifying part. The flow field of the face, close to the rectifying part, of the first substrate is greatly improved, so that the cleaning effect of the first substrate is improved, the rectifying part is flush with the main face of the connecting piece, and the flow field is more stable in the cleaning process.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a substrate carrying device and substrate processing equipment. Background Art

[0002] Semiconductor cleaning is an important process throughout the entire wafer manufacturing process, and the quality of the cleaning process is the key to improving the yield. Tank cleaning equipment is used for batch wafer wet cleaning and has high production efficiency. During the cleaning process, the fluid distribution in the process tank has a great influence on the cleaning effect, and the fluid distribution is closely related to the structure in the tank.

[0003] In the tank cleaning process, the wafer group is carried by the parallel and equidistant array of slots on the substrate carrier and placed in the processing tank, and cleaned by the processing liquid. In actual applications, it is usually found that the first wafer close to the vertical side of the substrate carrier has a poorer cleaning effect than the same group of wafers. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the problem of poor cleaning effect of the first wafer close to the vertical surface side in the substrate supporting device in the prior art, and to provide a substrate supporting device and a substrate processing equipment.

[0005] The present invention solves the above technical problems through the following technical solutions.

[0006] A substrate carrying device, comprising:

[0007] A connecting member, comprising a connecting body extending in a vertical direction;

[0008] A carrier connected to the connecting member, the carrier extending in a horizontal direction and carrying the plurality of substrates in a manner that the plurality of substrates are parallel to the vertical direction, wherein the plurality of substrates include a first substrate adjacent to a main surface of the connecting member;

[0009] Wherein, the connecting member further comprises a rectifying portion, a main surface of the rectifying portion is flush with a main surface of the connecting body, and the rectifying portion is configured such that when a substrate is carried on the supporting member, an orthographic projection of the first substrate on the rectifying portion is located within the rectifying portion.

[0010] A substrate processing device, comprising:

[0011] a treatment tank, the treatment tank being used to contain a treatment liquid;

[0012] The substrate carrying device as described above, wherein the substrate carrying device is arranged in the processing tank;

[0013] The bubbler is arranged in the processing tank and located below the supporting member, and is used for providing bubbles into the processing liquid.

[0014] The positive and progressive effects of the present invention are:

[0015] 1. In the present invention, a rectifier corresponding to the first substrate is added to the connector, and the orthographic projection of the first substrate on the rectifier is located inside the rectifier, so that the flow field on the side of the first substrate close to the rectifier is greatly improved and can be similar to the flow field between the remaining substrates, thereby improving the cleaning effect of the first substrate. The rectifier is flush with the main surface of the connecting body. On the one hand, the rectifier does not occupy additional space in the horizontal direction; on the other hand, the main surface of the connector has no protrusions or depressions. During the cleaning process, the flow field is more stable, which is conducive to further improving the cleaning effect. In addition, the addition of the rectifier also helps to improve the strength of the connector, and the connector is not easily deformed.

[0016] 2. The bubbler is arranged in the treatment tank and is located below the carrier to provide bubbles to the treatment liquid. Under the action of the bubbler, the treatment liquid in the treatment tank will flow rapidly. With the substrate carrier device described above, the flow field at the first substrate is substantially consistent with the flow field between adjacent substrates, and the cleaning effect of the first substrate is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the axial structure of the substrate supporting device of Example 1 of the present invention;

[0018] Figure 2 This is a schematic structural diagram of a substrate carrying device in a state of carrying a substrate according to Embodiment 1 of the present invention;

[0019] Figure 3 It is a front structural schematic diagram of a substrate supporting device according to Embodiment 1 of the present invention;

[0020] Figure 4 This is a schematic diagram of the front structure of the connecting piece of Example 1 of the present invention;

[0021] Figure 5 Schematic diagram of the internal structure of a substrate processing device according to Embodiment 2 of the present invention;

[0022] Figure 6 This is a schematic diagram of the axial structure of a substrate processing device according to Embodiment 2 of the present invention;

[0023] Figure 7 It is a schematic diagram of the top view of the structure of the substrate processing equipment according to the second embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the structure of the bubbler of Example 2 of the present invention;

[0025] Fig. 9Schematic diagram of the structure of the bubbler and substrate of Example 2 of the present invention;

[0026] Fig.10 Schematic diagram of the structure of the bubbler of Example 3 of the present invention. DETAILED DESCRIPTION

[0027] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0028] Example 1

[0029] like Figure 1 and Figure 2 As shown, in Embodiment 1 of the present invention, a substrate carrying device is provided, comprising: a connecting member 100 and a carrying member 200. The connecting member 100 comprises a connecting body 120 extending along a vertical direction Z. The carrying member 200 is connected to the lower portion of the connecting member 100, and carries a plurality of substrates 300 in a manner that the plurality of substrates 300 are parallel to the vertical direction Z. Among them, the plurality of substrates 300 comprises a first substrate 310 adjacent to a main surface of the connecting member 100. Among them, the connecting member 100 further comprises a rectifying portion 110, and a main surface of the rectifying portion 110 is flush with a main surface of the connecting body 120. The rectifying portion 110 is configured such that when a substrate is carried on the carrying member 200, an orthographic projection of the first substrate 310 on the rectifying portion 110 is located within the rectifying portion 110.

[0030] Since the existing connector is not provided with a rectifier, the flow field where the first substrate is located is relatively unevenly distributed relative to the flow fields of the remaining substrates, resulting in a poor cleaning effect of the first substrate. In the present invention, by adding a rectifier 110 corresponding to the first substrate 310 to the connector 100, and the positive projection of the first substrate 310 on the rectifier 110 is located in the rectifier 110, so that the flow field of the first substrate 310 close to the rectifier 110 is greatly improved, and can be similar to the flow field between the remaining substrates 300, thereby improving the cleaning effect of the first substrate 310. The main surface of the rectifier 110 is flush with the main surface of the connecting body 120. On the one hand, the rectifier 110 does not occupy additional space in the horizontal direction Y; on the other hand, the main surface of the connector 100 has no protrusions or depressions, and during the cleaning process, the flow field is more stable, which is conducive to further improving the cleaning effect. In addition, the addition of the rectifier 110 also helps to improve the strength of the connector 100, and the connector 100 is not easily deformed.

[0031] Here, the main surface of the rectifying portion, the main surface of the connecting member, and the main surface of the connecting body refer to the surfaces facing the first substrate.

[0032] In the embodiment of the present invention, in order to ensure that the flow field between the first substrate 310 and the connector 100 is as similar as possible to the flow field between the adjacent substrates 300, the spacing distance between the rectifying portion 110 and the first substrate 310 is set to 1 times the spacing distance between the adjacent substrates 300, and the shape of the rectifying portion 110 is the same as the shape of the first substrate 310. The plurality of substrates 300 include a second substrate adjacent to the first substrate 310, and the rectifying portion 110 and the second substrate can be symmetrical about the first substrate 310, thereby ensuring that the flow field where the first substrate 310 is located is as similar as possible to the flow field where the remaining substrates 300 are located, thereby improving the cleaning effect of the first substrate 310. It should be noted that the symmetry here means that the distance between the rectifying portion 110 and the first substrate 310 is equal to the distance between the second substrate and the first substrate 310, and the shape and size of the rectifying portion 110 and the second substrate are equal.

[0033] Specifically, in this embodiment, the shape of the first substrate is circular, and the shape of the rectifying portion corresponds thereto, and is also circular. In other embodiments, the shape of the first substrate can also be flexibly set as required, and the shape of the rectifying portion can correspond thereto.

[0034] In other embodiments, in order to facilitate the removal of the substrate 300 from the substrate supporting device, the spacing distance between the rectifying portion 110 and the first substrate 310 can be appropriately increased. Setting the spacing distance to [1,2) times the spacing distance between adjacent substrates 300 can also improve the flow field.

[0035] In other embodiments, in order to adapt to a wafer taking device that requires a larger space, the spacing distance between the rectifying portion 110 and the first substrate 310 can be further increased, and the spacing distance can be set to [2, 3] times the spacing distance between adjacent substrates 300.

[0036] In the embodiment of the present invention, the structure of the carrier 200 is as follows: Figure 1 As shown, the carrier 200 includes two first card slots 210 located on the outside and a second card slot 220 located in the middle. The first card slot 210 and the second card slot 220 are both provided with bearing grooves at equal intervals. Through the first card slot 210 and the second card slot 220, multiple substrates 300 can be arranged on the carrier 200 at equal intervals. The first card slot 210 and the second card slot 220 are hollowed out to facilitate the circulation of the treatment liquid.

[0037] Furthermore, if Figure 3 and Figure 4As shown, the connector 100 further includes a reinforcing portion 130, which is located below the rectifying portion 110, and the carrier 200 is connected to the reinforcing portion 130. By providing the reinforcing portion 130, the reliability of the connection between the connector 100 and the carrier 200 can be enhanced, and the substrate carrier device as a whole is more stable.

[0038] In other embodiments, in order to further improve the consistency of the flow field between the first substrate 310 and the connecting member 100 and the flow field between the adjacent substrates 300, the reinforcing portion 130 can be removed, and the supporting member 200 can be directly connected to the lower end of the rectifying portion 110. The supporting member 200 and the rectifying portion 110 can be connected by welding. In addition, the supporting member 200 can also be connected to the rectifying portion 110 and the reinforcing portion 130 at the same time.

[0039] Because both the carrier 200 and the rectifying portion 110 will inevitably produce processing errors, in order to prevent the orthographic projection of the first substrate 310 on the rectifying portion 110 from deviating from the rectifying portion 110, the area of ​​the main surface of the rectifying portion 110 can be appropriately increased, and the area of ​​the main surface of the rectifying portion 110 can be controlled to be between 1-1.01 times the area of ​​the main surface of the first substrate 310, and the rectifying portion 110 is concentric with the orthographic projection of the first substrate 310 on the rectifying portion 110.

[0040] Example 2

[0041] In this embodiment, a substrate processing device is provided, such as Figure 5 and Figure 6 As shown, it includes a processing tank 600, a bubbler 420 and the substrate carrier device in Example 1. The processing tank 600 is used to accommodate a treatment liquid for treating a plurality of substrates 300. The substrate carrier device can be lifted and lowered in the processing tank 600, and the substrate carrier device can be connected to the lifting mechanism through the adapter 140 to achieve the lifting function. The bubbler 420 is configured in the processing tank 600 and is located below the carrier 200 to provide bubbles in the treatment liquid. Under the action of the bubbler 420, the treatment liquid in the processing tank 600 will flow rapidly, and the substrate carrier device in Example 1 is used. The flow field at the first substrate 310 is substantially consistent with the flow field between the adjacent substrates 300, and the cleaning effect of the first substrate 310 is improved.

[0042] In the embodiment of the present invention, Figure 5 As shown, the rectifying portion 110 is configured to be formed on the connecting body 120 of the connecting member 100 by additive processing. Specifically, the rectifying portion 110 is formed by welding a corresponding plate-like structure on the edge of the connecting body 120. This method can upgrade and transform the existing substrate carrying device, which is conducive to reducing manufacturing costs.

[0043] In other embodiments, the rectifying portion 110 and the connecting body 120 of the connecting member 100 may also be manufactured by an integrated molding process, which has a higher processing accuracy.

[0044] refer to Figure 5 and Figure 7 The treatment liquid in the treatment tank 600 is supplied through the liquid inlet pipeline 510 and the treatment liquid discharge part 520. The liquid inlet pipeline 510 is used to supply the treatment liquid to the treatment liquid discharge part 520. The liquid inlet pipeline 510 has a branch pipeline (not shown in the figure), and the branch pipeline is connected to the outer tank body 610 so that the treatment liquid circulates between the inner tank body 620 and the outer tank body 610. The treatment liquid discharge part 520 is located between the bubbler 420 and the plurality of substrates 300. The treatment liquid discharge part 520 extends along the Y direction. The treatment liquid discharge part 520 has a plurality of treatment liquid discharge holes for improving the fluidity of the treatment liquid in the treatment tank 600.

[0045] like Figure 6 and Figure 7 As shown, the processing tank 600 includes an inner tank body 620 and an outer tank body 610. The inner tank body 620 is used to accommodate a substrate carrying device and store a processing liquid for immersing multiple substrates 300. The arrangement direction of the substrates 300 is defined as the Y direction, and the horizontal direction parallel to the main surface of the substrate 300 is defined as the X direction. The X direction and the Y direction are perpendicular to each other. The inner tank body 620 includes two first side walls 623 arranged opposite to each other along the X direction, and two second side walls 622 arranged opposite to each other along the Y direction. A plurality of overflow ports 621 are spaced apart on the two first side walls 623, and the lowest point of the overflow port 621 is the overflow position. The overflow positions of the two first side walls 623 are lower than the top surfaces of the two second side walls 622. The overflow position is used to allow the processing liquid to overflow from the overflow positions of the two first side walls 623 into the outer tank body 610.

[0046] Since the overflow position of the two first side walls 623 is lower than the top surface of the two second side walls 622, the processing liquid in the inner tank body 620 can only overflow into the outer tank body 610 through the two first side walls 623. The overflow direction of the processing liquid is parallel to the direction of the substrate 300, which has a certain flushing effect on the substrate 300 and is beneficial to improving the cleaning effect of the substrate 300.

[0047] For the specific structure of the bubbler 420, refer to Figure 5 and Figure 8The bubbler 420 includes: a bubble plate 422 and a bubble chamber 421. The bubble plate 422 faces the carrier 200. The bubble plate 422 has a plurality of openings 423. The bubble chamber 421 is flat and is used to provide gas to the plurality of openings 423. The interior of the bubble chamber 421 includes four independent gas channels, and the gas supply flow rates of the four gas channels are independently controlled. The bubble chamber 421 can be supplied with gas through the air inlet line 410. In other embodiments, the internal division of the bubble chamber 421 is not limited thereto, and at least two independent gas channels can be provided as needed, and each gas channel can control the gas supply flow rate independently of each other.

[0048] by Fig. 9 The division method of the bubbling chamber 421 is shown to illustrate the independent control of the gas supply flow rate of each gas channel. The bubbling chamber 421 is divided into gas channels L1 to L4 along the X direction. Similarly, the substrate 300 is divided into processing areas M1 to M4 corresponding to the gas channels L1 to L4 along the X direction. In this embodiment, the bubbling behavior of the corresponding processing area is controlled by adjusting the gas supply flow rate of the gas channel, such as the number of bubbles, so that the processing rate in each processing area on the substrate 300 is the same, thereby improving the in-plane uniformity of the substrate 300 processing. For example, the substrate 300 is processed under the same supply gas volume of the gas channels L1 to L4 to obtain the average processing rates V1 to V4 of the processing areas M1 to M4 of the substrate 300. When the experimental results show that: V1 = V4 < V2 = V3, the gas supply flow of the gas channels L1 and L4 can be increased to increase the number of bubbles in the processing areas M1 and M4, improve the stirring effect and mass transfer efficiency of the processing areas M1 and M4, thereby improving the processing rates of the processing areas M1 and M4, so that V1 = V2 = V3 = V4, thereby achieving the purpose of improving the in-plane uniformity of the processing of the substrate 300. In addition, with the substrate supporting device in Example 1, the processing uniformity between different substrates 300 can also be improved.

[0049] Example 3

[0050] The substrate processing equipment in this embodiment is basically the same as that in Embodiment 2, except that: Fig.10 As shown, in this embodiment, the bubbler 720 includes: four independently arranged bubbling units 7201, each bubbling unit 7201 is connected to the air inlet pipeline 710, and can independently supply gas, the top surface of each bubbling unit 7201 includes a plurality of openings, and a bubbling cavity is formed inside each bubbling unit 7201 for providing gas to the plurality of openings, wherein the bubbling cavity includes a gas channel.

[0051] The bubbler 420 in Example 2 is processed as a whole, while the bubbler 720 in this embodiment is divided into a plurality of independent bubble units 7201, and the processing difficulty of a single bubble unit 7201 is low. When processing the bubbler 720, each bubble unit 7201 can be processed separately. When used, multiple bubble units 7201 are combined together, which is conducive to reducing the processing difficulty of the bubbler 720 and improving the yield rate of the bubbler 720. In addition, each bubble unit 7201 is independent of each other. When damaged, the bubble unit 7201 can be replaced separately without replacing the entire bubbler 720, which is conducive to reducing the replacement cost.

[0052] In other embodiments, the number of bubbling units 7201 is not limited thereto, and at least two bubbling units 7201 may be provided as required. Furthermore, the bubbling cavity formed inside each bubbling unit 7201 may also be provided with more than two gas channels, and the gas supply of each gas channel may be independently controlled.

[0053] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A substrate carrying device, It is characterized in that include: A connecting member, comprising a connecting body extending in a vertical direction; A carrier connected to the connecting member, the carrier extending in a horizontal direction and carrying the plurality of substrates in a manner that the plurality of substrates are parallel to the vertical direction, wherein the plurality of substrates include a first substrate adjacent to a main surface of the connecting member; Wherein, the connecting member further comprises a rectifying portion, a main surface of the rectifying portion is flush with a main surface of the connecting body, and the rectifying portion is configured such that when a substrate is carried on the supporting member, an orthographic projection of the first substrate on the rectifying portion is located within the rectifying portion.

2. The substrate carrying device according to claim 1, It is characterized in that The spacing distance between the rectifying portion and the first substrate is [1, 3] times the spacing distance between adjacent substrates.

3. The substrate carrying device according to claim 2, It is characterized in that The spacing distance between the rectifying portion and the first substrate is [1, 2) times the spacing distance between adjacent substrates.

4. The substrate carrying device according to claim 3, It is characterized in that The plurality of substrates include a second substrate adjacent to the first substrate, and the rectifying portion and the second substrate are symmetrical with respect to the first substrate.

5. The substrate carrying device according to claim 1, It is characterized in that The rectifying portion has the same shape as that of the first substrate.

6. The substrate carrying device according to claim 5, It is characterized in that The rectifying portion is concentric with an orthographic projection of the first substrate on the rectifying portion, and an area of ​​a main surface of the rectifying portion is 1-1.01 times an area of ​​the first substrate.

7. The substrate carrying device according to claim 1, It is characterized in that The connecting member further includes a reinforcing portion, the reinforcing portion is located below the rectifying portion, and the bearing member is connected to the rectifying portion and / or the reinforcing portion.

8. The substrate carrying device according to claim 1, It is characterized in that The rectifying portion is integrally formed with the connecting body, or the rectifying portion is configured to be formed on the connecting body by additive processing.

9. A substrate processing device, It is characterized in that include: a treatment tank for containing a treatment liquid; The substrate carrying device according to any one of claims 1 to 8, arranged in the processing tank; The bubbler is arranged in the processing tank and located below the supporting member, and is used for providing bubbles into the processing liquid.

10. The substrate processing apparatus according to claim 9, It is characterized in that The processing tank includes an inner tank body and an outer tank body, the inner tank body is used to accommodate the substrate carrying device and store the processing liquid for immersing the multiple substrates, the inner tank body includes two oppositely arranged first side walls and two oppositely arranged second side walls, the second side walls are parallel to the substrates, the overflow position of the first side wall is lower than the top surface of the second side wall, and the overflow position is used to make the processing liquid overflow from the overflow positions of the two first side walls to the outer tank body.

11. The substrate processing apparatus according to claim 9, It is characterized in that The bubbler comprises: A bubbling plate, the bubbling plate faces the supporting member and has a plurality of openings; a bubbling chamber for providing gas to the plurality of openings; The interior of the bubbling chamber includes at least two gas channels which are independent of each other, and the gas supply flow rates of the at least two gas channels are independently controlled.

12. The substrate processing apparatus according to claim 9, It is characterized in that The bubbler comprises: at least two bubbling units, the top surface of each bubbling unit comprises a plurality of openings, a bubbling cavity is formed inside each bubbling unit for providing gas to the plurality of openings, and the bubbling cavity comprises at least one independently controllable gas channel.

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