Loading method, system and device and computer readable storage medium
By judging the type of wafer batch and allocating machine chambers, the problem of excessive consumption of high-priority wafer batches is solved, the effective utilization of low-priority batches is achieved, the production capacity is improved, and the priority of wafer batches is reflected.
Patent Information
- Application Number
- CN202311565371.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-22
- Publication Date
- 2025-05-23
AI Technical Summary
In the prior art, high-priority wafer batches occupy too many machine chambers, resulting in the machine chambers used in low-priority wafer batches that continue to idle, resulting in waste of production capacity, and the priority of wafer batches is not truly reflected.
By determining whether the type of the current batch wafer is an emergency batch, if it is not an emergency batch, the machine chamber is allocated as the loading chamber, and the available machine chambers are screened according to the process formula, and the idle machine chambers are preferred.
It effectively avoids the continuous idleness of some machine chambers, improves production capacity, and truly reflects the priority of wafer batches.
Smart Images
Figure CN120033126A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor process technology, and in particular to a loading method, system, device and computer-readable storage medium. Background Art
[0002] Currently, wafers are generally allocated to machine chambers according to the priority and urgency of wafer batches. This can easily cause high-priority wafer batches to occupy too many machine chambers, while the machine chambers used by low-priority wafer batches remain idle, resulting in a serious waste of production capacity. The priority of wafer batches is not truly reflected.
[0003] Therefore, it is necessary to provide a new method, system, device and computer-readable storage medium for loading goods to solve the above-mentioned problems existing in the prior art. Summary of the invention
[0004] The object of the present invention is to provide a method, system, device and computer-readable storage medium for loading goods, so as to avoid some machine chambers being idle for a long time and improve production capacity.
[0005] To achieve the above object, the cargo loading method of the present invention comprises:
[0006] Determine whether the type of the current batch of wafers is an emergency batch;
[0007] If it is determined that the type of the current batch of wafers is not an emergency batch, the machine chamber is allocated as a loading chamber for the current batch of wafers;
[0008] The current batch of wafers is assigned to the loading chamber.
[0009] Optionally, allocating a machine chamber as a loading chamber for the current batch of wafers includes:
[0010] The available machine chambers are selected as loading chambers according to the process recipe of the current batch of wafers.
[0011] Optionally, the method of selecting an available machine chamber as a loading chamber according to a process recipe of a current batch of wafers includes:
[0012] According to the process recipe of the current batch of wafers, an idle tool chamber among the available tool chambers is selected as a loading chamber.
[0013] Optionally, the loading method further comprises:
[0014] Available tool chambers are selected by discarding part of the process recipe of the current batch of wafers based on the constraints.
[0015] Optionally, before allocating the current batch of wafers to the loading chamber, the method further includes:
[0016] Determining whether the total number of processing batches of the loading chamber is greater than a processing batch number threshold;
[0017] If it is determined that the total number of processing batches of the loading chamber is less than or equal to the processing batch number threshold, the current batch of wafers is assigned to the loading chamber.
[0018] Optionally, the loading method further comprises:
[0019] If it is determined that the total number of processing batches in the loading chamber is greater than the processing batch number threshold, then determining whether the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold;
[0020] If it is determined that the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold, the current batch of wafers is assigned to the loading chamber.
[0021] Optionally, the loading method further comprises:
[0022] If it is determined that the number of unprocessed wafers remaining in the loading chamber is greater than or equal to the wafer number threshold, a machine chamber is reassigned as a loading chamber for the current batch of wafers.
[0023] Optionally, if it is determined that the type of the current batch of wafers is an urgent batch, an available machine chamber is selected as a loading chamber according to the process recipe of the current batch of wafers.
[0024] The present invention also provides a loading system, including a judgment unit, an allocation unit and a loading unit, wherein the judgment unit is used to judge whether the type of the current batch of wafers is an emergency batch; the allocation unit is used to allocate a machine chamber as a loading chamber for the current batch of wafers if the judgment unit judges that the type of the current batch of wafers is not an emergency batch; the loading unit is used to dispatch the current batch of wafers to the loading chamber.
[0025] The present invention also provides a device, comprising:
[0026] processor;
[0027] a memory for storing processor-executable instructions;
[0028] Wherein, when the processor is configured to execute instructions in the memory, the loading method is implemented.
[0029] The present invention also provides a computer-readable storage medium, comprising computer instructions, and when the computer instructions are executed by a processor, the loading method is implemented.
[0030] The beneficial effects of the present invention are: machine chambers are allocated to non-urgent batches of wafers, and the same machine chamber is loaded with the next batch of wafers when the process of the previous batch of wafers is about to be completed or has been completed, and idle machine chambers are used first to avoid some machine chambers being continuously idle, thereby improving production capacity. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 A flowchart of a method for loading goods in some embodiments of the present invention;
[0032] Figure 2 The figure is a schematic diagram of a specific flow chart of a method for loading goods in some embodiments of the present invention. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
[0034] In view of the problems existing in the prior art, an embodiment of the present invention provides a method for loading goods. Figure 1 , the loading method comprises the following steps:
[0035] S1: Determine whether the type of the current batch of wafers is an emergency batch; wherein, it is determined that the remaining process time of the current batch of wafers is less than or equal to the threshold time, that is, the Qtime of the current batch of wafers is insufficient, or a pre-defined batch or batches are emergency batches. Qtime is the time required to complete certain steps in the entire process of production. For example, the processing time required from step 3 to step 8 is 12 hours, and the processing time required from step 15 to step 20 is 3 hours. 12 hours and 3 hours are Qtime.
[0036] S2: If it is determined that the type of the current batch of wafers is not an emergency batch, a machine chamber is allocated as a loading chamber for the current batch of wafers;
[0037] S3: Dispatching the current batch of wafers to the loading chamber.
[0038] In some embodiments, if the type of the current batch of wafers is determined to be an urgent batch, available machine chambers are selected as loading chambers according to the process recipe of the current batch of wafers. Preferably, an idle machine chamber among the available machine chambers is selected as the loading chamber for the urgent batch of wafers.
[0039] In some embodiments, the allocating a machine chamber as a loading chamber for the current batch of wafers includes: selecting available machine chambers as loading chambers according to the process recipe of the current batch of wafers. Specifically, the process recipe of the current batch of wafers specifies the tasks that the current batch of wafers needs to do, each task determines the machine chambers that can be used for the current batch of wafers, and any machine chamber that can be used for a task with the largest number of available machine chambers is selected as the loading chamber. For example, the process recipe of the current batch of wafers stipulates that the tasks that need to be performed on the current batch of wafers include the first task, the second task or the third task, the first task stipulates that the machine chambers that can be used for the corresponding process include the first machine chamber A, the second task stipulates that the machine chambers that can be used for the corresponding process include the first machine chamber A and the second machine chamber B, the third task stipulates that the machine chambers that can be used for the corresponding process include the first machine chamber A, the second machine chamber B and the third machine chamber C, wherein the third task stipulates that the number of machine chambers that can be used for the corresponding process is the largest, therefore, the available machine chambers for the current batch of wafers include the first machine chamber A, the second machine chamber B and the third machine chamber C.
[0040] In some embodiments, the screening of available machine chambers as loading chambers according to the process recipe of the current batch of wafers includes: screening an idle machine chamber among the available machine chambers as loading chambers according to the process recipe of the current batch of wafers. For example, the available machine chambers of the current batch of wafers include the first machine chamber A, the second machine chamber B, and the third machine chamber C, wherein the first machine chamber A has been used, and the second machine chamber B and the third machine chamber C are idle, then the second machine chamber B or the third machine chamber C is screened as the loading chamber.
[0041] In some embodiments, the loading method further includes: discarding some available machine chambers selected from the process recipes of the current batch of wafers according to the constraint conditions. For example, the available machine chambers of the current batch of wafers include the first machine chamber A, the second machine chamber B, and the third machine chamber C, and the constraint conditions stipulate that the third chamber C cannot be used. Therefore, the available machine chambers of the current batch of wafers discard the third machine chamber and only retain the first machine chamber A and the second machine chamber B.
[0042] In some embodiments, before allocating the current batch of wafers to the loading chamber, the method further includes:
[0043] Determine whether the total number of processing batches of the loading chamber is greater than a processing batch number threshold, the total number of processing batches of the loading chamber being the number of batches being processed in the loading chamber or the sum of the number of batches being processed in the loading chamber and the number of batches to be processed;
[0044] If it is determined that the total number of processing batches of the loading chamber is less than or equal to the processing batch number threshold, the current batch of wafers is assigned to the loading chamber.
[0045] In some embodiments, the method for loading goods further comprises:
[0046] If it is determined that the total number of processing batches in the loading chamber is greater than the processing batch number threshold, then determining whether the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold;
[0047] If it is determined that the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold, the current batch of wafers is assigned to the loading chamber.
[0048] In some embodiments, the loading method further includes: if it is determined that the number of unprocessed wafers remaining in the loading chamber is greater than or equal to a wafer number threshold, then re-assigning a machine chamber as a loading chamber for the current batch of wafers.
[0049] For example, the current batch of wafers includes wafers from the first batch, wafers from the second batch, wafers from the third batch, wafers from the fourth batch and wafers from the fifth batch. The available tool chambers of the first batch of wafers include the first machine chamber A and the third machine chamber C, the available tool chambers of the second batch of wafers include the first machine chamber A and the third machine chamber C, the available tool chambers of the third batch of wafers include the first machine chamber A and the third machine chamber C, the available tool chambers of the fourth batch of wafers include the second machine chamber B, and the available tool chambers of the fifth batch of wafers include the second machine chamber B. The first machine chamber A, the second machine chamber B and the third machine chamber C are all idle, and the first batch of wafers are assigned to the first machine chamber A; the second batch of wafers are assigned to the third machine chamber C; and the third batch of wafers are assigned to the third machine chamber C. Since the third machine chamber C has already assigned the second batch of wafers, and the total number of processing batches of the third machine chamber C is 3, and the processing batch number threshold of the third machine chamber C is 2, it is judged that the total number of processing batches of the third machine chamber C is greater than the processing batch number threshold, and then it is further judged whether the number of remaining unprocessed wafers in the third machine chamber C is greater than the wafer number threshold. The number of remaining unprocessed wafers in the third machine chamber C is 30, and the wafer number threshold of the third machine chamber C is 25. It is judged that the number of remaining unprocessed wafers in the third machine chamber C is greater than If the wafer number threshold is reached, the loading chamber for the third batch of wafers is re-assigned; the wafers of the fourth batch are assigned to the second machine chamber B; and the wafers of the fifth batch are assigned to the second machine chamber B. Since the second machine chamber B has already assigned the fourth batch of wafers, and the total number of processing batches of the second machine chamber B is 2, the processing batch number threshold of the second machine chamber B is 1. It is judged that the total number of processing batches of the second machine chamber B is greater than the processing batch number threshold, and then it is further judged whether the number of remaining unprocessed wafers in the second machine chamber B is greater than the wafer number threshold. The number of remaining unprocessed wafers in the second machine chamber B is 20, and the wafer number threshold of the second machine chamber B is 25. It is judged that the number of remaining unprocessed wafers in the second machine chamber B is less than the wafer number threshold, and then the wafers of the fifth batch are assigned to the second machine chamber B.
[0050] Figure 2 It is a schematic diagram of a specific flow chart of a method for loading goods in some embodiments of the present invention.
[0051] Reference Figure 2 , after the current batch of wafers arrives at the station, determine whether the type of the current batch of wafers is an emergency batch;
[0052] If the type of the current batch of wafers is determined to be an urgent batch, the current batch of wafers is directly assigned to the current machine chamber for corresponding processes;
[0053] If it is determined that the type of the current batch of wafers is not an emergency batch, the machine chamber is allocated as a loading chamber for the current batch of wafers, and then it is determined whether the total processing batch of the loading chamber is greater than the processing batch threshold;
[0054] If it is determined that the total processing batch of the loading chamber is less than or equal to the processing batch threshold, the current batch of wafers is assigned to the loading chamber;
[0055] If it is determined that the total processing batches of the loading chamber are greater than the processing batch threshold, then determining whether the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold;
[0056] If it is determined that the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold, the current batch of wafers is assigned to the loading chamber;
[0057] If it is determined that the number of unprocessed wafers remaining in the loading chamber is greater than or equal to the wafer number threshold, a machine chamber is reassigned as a loading chamber for the current batch of wafers.
[0058] The present invention also provides a loading system for implementing the loading method, the loading system comprising a judgment unit, an allocation unit and a loading unit, the judgment unit being used to judge whether the type of the current batch of wafers is an emergency batch; the allocation unit being used to allocate a machine chamber as a loading chamber for the current batch of wafers if the judgment unit judges that the type of the current batch of wafers is not an emergency batch; the loading unit being used to assign the current batch of wafers to the loading chamber.
[0059] In some embodiments, the allocation unit is used to select available tool chambers as loading chambers according to the process recipe of the current batch of wafers. Preferably, an idle tool chamber among the available tool chambers is selected as the loading chamber.
[0060] In some embodiments, the loading system further includes a screening unit, a first judgment module and a second judgment module, wherein the screening unit is used to filter out available machine chambers by discarding part of the process recipes of the current batch of wafers according to the constraint conditions, and the first judgment module is used to judge whether the total number of processing batches of the loading chamber is greater than a processing batch number threshold; if the first judgment module judges that the total number of processing batches of the loading chamber is less than or equal to the processing batch number threshold, the loading unit assigns the current batch of wafers to the loading chamber; the second judgment module is used to judge whether the total number of processing batches of the loading chamber is greater than a processing batch number threshold when the first judgment module judges that the total number of processing batches of the loading chamber is less than or equal to the processing batch number threshold. After the total number of batches is greater than the processing batch number threshold, it is determined whether the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold. If the second judgment module determines that the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold, the loading unit assigns the current batch of wafers to the loading chamber; if the first judgment module determines that the total number of processing batches of the loading chamber is greater than the processing batch number threshold, and the second judgment module determines that the number of unprocessed wafers remaining in the loading chamber is greater than or equal to the wafer number threshold, the allocation unit re-assigns the machine chamber for the current batch of wafers as the loading chamber.
[0061] The present invention also provides a device, comprising:
[0062] processor;
[0063] a memory for storing processor-executable instructions;
[0064] Wherein, when the processor is configured to execute instructions in the memory, the loading method is implemented.
[0065] The present invention also provides a computer-readable storage medium, comprising computer instructions, and when the computer instructions are executed by a processor, the loading method is implemented.
[0066] Computer readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or components, or any combination thereof. More specific examples of computer readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read only memory (ROM), an erasable programmable read only memory (EPROM) or flash memory, an optical fiber, a portable compact disk read only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device, or device.
[0067] The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to wireless, wire, optical cable, or any suitable combination of the foregoing.
[0068] Computer program code for performing the operations of the present specification may be written in one or more programming languages or a combination thereof, such as Java, Smalltalk, C++, C, etc. The program code may execute entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server.
[0069] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.
Claims
1. A method of loading goods. It is characterized in that include: Determine whether the type of the current batch of wafers is an emergency batch; If it is determined that the type of the current batch of wafers is not an emergency batch, the machine chamber is allocated as a loading chamber for the current batch of wafers; The current batch of wafers is assigned to the loading chamber.
2. The method for loading goods according to claim 1, It is characterized in that The method of allocating a tool chamber as a loading chamber for the current batch of wafers includes: The available machine chambers are selected as loading chambers according to the process recipe of the current batch of wafers.
3. The method for loading goods according to claim 2, It is characterized in that The method of selecting an available machine chamber as a loading chamber according to the process recipe of the current batch of wafers includes: According to the process recipe of the current batch of wafers, an idle tool chamber among the available tool chambers is selected as a loading chamber.
4. The method for loading goods according to claim 2 or 3, It is characterized in that Also includes: Available tool chambers are selected by discarding part of the process recipe of the current batch of wafers based on the constraints.
5. The method for loading goods according to claim 1 or 2, It is characterized in that Before allocating the current batch of wafers to the loading chamber, the method further includes: Determining whether the total number of processing batches of the loading chamber is greater than a processing batch number threshold; If it is determined that the total number of processing batches of the loading chamber is less than or equal to the processing batch number threshold, the current batch of wafers is assigned to the loading chamber.
6. The method for loading goods according to claim 5, It is characterized in that Also includes: If it is determined that the total number of processing batches in the loading chamber is greater than the processing batch number threshold, then determining whether the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold; If it is determined that the number of unprocessed wafers remaining in the loading chamber is less than the wafer number threshold, the current batch of wafers is assigned to the loading chamber.
7. The method for loading goods according to claim 6, It is characterized in that Also includes: If it is determined that the number of unprocessed wafers remaining in the loading chamber is greater than or equal to the wafer number threshold, a machine chamber is reassigned as a loading chamber for the current batch of wafers.
8. The method for loading goods according to claim 1, It is characterized in that If it is determined that the type of the current batch of wafers is an urgent batch, an available machine chamber is selected as a loading chamber according to the process recipe of the current batch of wafers.
9. The method for loading goods according to claim 8, It is characterized in that The method of selecting an available machine chamber as a loading chamber according to the process recipe of the current batch of wafers includes: According to the process recipe of the current batch of wafers, an idle tool chamber among the available tool chambers is selected as a loading chamber.
10. A loading system, It is characterized in that It includes a judgment unit, an allocation unit and a loading unit. The judgment unit is used to judge whether the type of the current batch of wafers is an emergency batch; the allocation unit is used to allocate a machine chamber as a loading chamber for the current batch of wafers if the judgment unit judges that the type of the current batch of wafers is not an emergency batch; the loading unit is used to dispatch the current batch of wafers to the loading chamber.
11. A device, It is characterized in that include: processor; a memory for storing processor-executable instructions; Wherein, when the processor is configured to execute the instructions of the memory, the loading method according to any one of claims 1 to 9 is implemented.
12. A computer-readable storage medium, It is characterized in that The method comprises computer instructions, which, when executed by a processor, implement the loading method described in any one of claims 1 to 9.