Lifting mechanism and substrate processing apparatus

Abstract

The invention provides a lifting mechanism and a substrate processing apparatus, which can simultaneously realize reduction of raised dust and space saving. A lifting mechanism according to one embodiment of the present disclosure lifts and lowers a substrate holder that holds a plurality of substrates in a shelf shape, the lifting mechanism comprising: a support unit that supports the substrate holder; and a multi-joint arm, the front end of the multi-joint arm is connected with the supporting part, and the multi-joint arm enables the supporting part to ascend and descend.

Description

Technical Field

[0001] The present invention relates to a lifting mechanism and a substrate processing device. Background Art

[0002] There is known an apparatus that carries a substrate holder carrying a plurality of substrates into a processing container to process the plurality of substrates at once (see, for example, Patent Documents 1 and 2). The substrate holder is carried into the processing container by, for example, a ball screw or a bellows lifting mechanism.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-169367

[0006] Patent Document 2: Japanese Patent Application Publication No. 2000-286324 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] The present disclosure provides a technology capable of achieving both reduction of dust and space saving.

[0009] Solutions for solving problems

[0010] A lifting mechanism according to one embodiment of the present invention is a lifting mechanism for lifting a substrate holding device that holds a plurality of substrates in a shelf-like manner, the lifting mechanism comprising: a support portion that supports the substrate holding device; and a multi-joint arm, the front end of the multi-joint arm being connected to the support portion, the multi-joint arm lifting and lowering the support portion.

[0011] Effects of the Invention

[0012] According to the present disclosure, it is possible to simultaneously achieve reduction in dust generation and space saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 1 is a longitudinal cross-sectional view showing a substrate processing apparatus according to a first embodiment.

[0014] Figure 2 2 is a longitudinal sectional view showing the substrate processing apparatus according to the first embodiment.

[0015] Figure 3 3 is a longitudinal sectional view showing the substrate processing apparatus according to the first embodiment.

[0016] Figure 4 yes Figure 3 Cross-sectional view along line IV-IV.

[0017] Figure 5 1 is a longitudinal sectional view showing a substrate processing apparatus according to a second embodiment.

[0018] Figure 6 This is a longitudinal sectional view (2) showing a substrate processing apparatus according to a second embodiment.

[0019] Figure 7 1 is a longitudinal sectional view showing a substrate processing apparatus according to a third embodiment.

[0020] Figure 8 This is a longitudinal sectional view (2) showing a substrate processing apparatus according to a third embodiment. DETAILED DESCRIPTION

[0021] Next, refer to the attached Figure 1 In all the drawings, the same or corresponding components or parts are denoted by the same or corresponding reference numerals, and repeated descriptions are omitted.

[0022] [First embodiment]

[0023] Reference Figures 1 to 4 A substrate processing apparatus 100 according to the first embodiment will be described. The substrate processing apparatus 100 includes a processing chamber 110 , a load lock chamber 120 , a substrate transfer chamber 160 , and a control unit 190 .

[0024] The processing chamber 110 can reduce the pressure inside. The substrate holder WB can be accommodated inside the processing chamber 110. The substrate holder WB holds a plurality of substrates W in a layered manner. Figures 1 to 3 5 substrates are shown in the figure, but the number of substrates W is not limited. In the processing chamber 110, a plurality of substrates W held by the substrate holder WB are processed collectively. A loading and unloading port 110a for loading and unloading the substrate holder WB is provided at the lower portion of the processing chamber 110. A gas nozzle 111, an exhaust device 112, and a heater 113 are provided in the processing chamber 110.

[0025] The gas nozzle 111 is disposed around the substrate holder WB in the processing chamber 110. The gas nozzle 111 ejects a processing gas from a gas source GS from around the substrate holder WB in the processing chamber 110 toward the substrate holder WB and the substrate W. The processing gas is selected according to the type of processing. The gas nozzle 111 may be one or more than two.

[0026] The exhaust device 112 reduces the pressure inside the processing chamber 110 by exhausting the processing chamber 110. The exhaust device 112 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 112 controls the pressure inside the processing chamber 110 to a desired pressure by adjusting the opening of the pressure control valve while vacuuming the processing chamber 110 through the vacuum pump.

[0027] The heater 113 is provided in the processing chamber 110. The heater 113 may be provided around the substrate holder WB in the processing chamber 110. The heater 113 heats the substrate holder WB and the substrate W to a desired temperature from around the substrate holder WB in the processing chamber 110.

[0028] The load lock chamber 120 is located below the processing chamber 110. The load lock chamber 120 can reduce the pressure inside. The substrate holder WB can be accommodated inside the load lock chamber 120. A loading port 120a for loading and unloading the substrate holder WB is provided at the upper portion of the load lock chamber 120. The interior of the load lock chamber 120 is connected to the interior of the processing chamber 110 via the loading port 110a and the loading port 120a. The substrate holder WB is loaded into the processing chamber 110 from the load lock chamber 120 via the loading port 110a and the loading port 120a. The substrate holder WB is unloaded from the processing chamber 110 into the load lock chamber 120 via the loading port 110a and the loading port 120a. The substrate W is carried into and carried out from the substrate holder WB in the load lock chamber 120. A loading port 120b for carrying in and out the substrate W is provided on the side wall of the load lock chamber 120 on the negative side in the X-axis direction. The substrate W is carried into the load lock chamber 120 from the substrate transfer chamber 160 through the loading port 120b. The substrate W is carried out from the load lock chamber 120 to the substrate transfer chamber 160 through the loading port 120b. The load lock chamber 120 is provided with a lifting mechanism 121, an exhaust device 126, a cooling gas supply unit 127, and an exhaust pipe 128.

[0029] The lifting mechanism 121 lifts the substrate holder WB between the processing chamber 110 and the load lock chamber 120. The lifting mechanism 121 includes a support portion 122 and a multi-jointed arm 123.

[0030] The support part 122 supports the substrate holder WB. The support part 122 includes a cover 122a, a sealing member 122b, a rotation shaft 122c, and a support arm 122d. When the substrate holder WB is located in the processing chamber 110 ( Figure 1), the cover 122a uses a sealing member 122b to hermetically seal the loading and unloading port 110a and the loading and unloading port 120a. As a result, the processing chamber 110 is hermetically sealed. The sealing member 122b is, for example, an O-ring. A through hole that penetrates the cover 122a in the vertical direction is provided in the center of the cover 122a. The through hole is penetrated by the rotating shaft 122c. The gap between the cover 122a and the rotating shaft 122c is sealed by a magnetic fluid seal. The rotating shaft 122c supports the substrate holding device WB in a manner that it can rotate freely around the vertical axis M11. The supporting arm 122d is connected to the lower part of the rotating shaft 122c. The supporting arm 122d supports the rotating shaft 122c.

[0031] The multi-joint arm 123 can be a vertical multi-joint arm. In this case, since torque is always applied to the joint part, the backlash of the gear is eliminated and the positioning accuracy is improved. The base end of the multi-joint arm 123 is fixed to the side wall of the positive side of the Y-axis direction of the load interlock vacuum chamber 120, and the front end of the multi-joint arm 123 is connected to the support arm 122d. The multi-joint arm 123 raises and lowers the support part 122 by rotating with the base end as the rotation center C1. The multi-joint arm 123 moves the substrate holding device WB from the load interlock vacuum chamber 120 into the processing chamber 110 by raising the support part 122. The multi-joint arm 123 moves the substrate holding device WB from the processing chamber 110 into the load interlock vacuum chamber 120 by lowering the support part 122.

[0032] The rotation center C1 of the multi-joint arm 123 may be located in the middle of the stroke of the multi-joint arm 123. In this case, the length of each arm constituting the multi-joint arm 123 and the number of arms can be minimized. Figure 1 As shown, the length in the vertical direction between the rotation center C1 of the multi-joint arm 123 and the front end position P1 of the multi-joint arm 123 when the substrate holder WB is in the processing chamber 110 is defined as L1. Figure 2 As shown, the length in the vertical direction between the rotation center C1 of the multi-joint arm 123 and the front end position P1 of the multi-joint arm 123 when the substrate holder WB is in the load lock chamber 120 is set to L2. In this case, L1=L2.

[0033] A refrigerant flow path 124 for circulating a refrigerant may be included inside the multi-joint arm 123. In this case, heat of the multi-joint arm 123 can be released even in a vacuum atmosphere, so positioning accuracy can be maintained.

[0034] The multi-jointed arm 123 includes a base end portion 123 a , a first arm 123 b , and a second arm 123 c .

[0035] The base end portion 123a is fixed to the side wall on the positive side of the Y-axis direction of the load interlock vacuum chamber 120. The base end portion 123a can be located in the middle of the stroke of the multi-joint arm 123. In this case, the length of each arm constituting the multi-joint arm 123 and the number of arms can be set to a minimum. The first arm 123b is rotatable relative to the base end portion 123a about the rotation axis M12. The second arm 123c is rotatable relative to the first arm 123b about the rotation axis M13, and is rotatable relative to the support arm 122d about the rotation axis M14. The multi-joint arm 123 adjusts the position of the substrate holding device WB in the processing chamber 110 by independently rotating the first arm 123b and the second arm 123c. Figure 1 ) and the position in the load lock chamber 120 ( Figure 2 ) to lift or lower.

[0036] The multi-joint arm 123 may have an internal space that is hermetically isolated from the atmosphere in the load lock chamber 120 by a magnetic fluid seal or the like. In this case, the mechanism of the multi-joint arm 123 can be arranged in the internal space that is hermetically isolated from the atmosphere in the load lock chamber 120. Therefore, dust generated when the substrate holder WB is raised or lowered can be reduced. The internal space of the multi-joint arm 123 may contain a plurality of motors with speed reducers and cables for driving the motors. The plurality of motors with speed reducers cause each arm of the multi-joint arm 123 to rotate independently. The internal space of the multi-joint arm 123 may be set to atmospheric pressure.

[0037] The exhaust device 126 reduces the pressure inside the load lock chamber 120 by exhausting the load lock chamber 120. The exhaust device 126 includes, for example, a vacuum pump and a pressure control valve. The exhaust device 126 controls the pressure inside the load lock chamber 120 to a desired pressure by adjusting the opening of the pressure control valve while vacuuming the load lock chamber 120 with the vacuum pump.

[0038] The cooling gas supply unit 127 is provided in the load lock vacuum chamber 120. The cooling gas supply unit 127 is mounted on the side wall (second side wall) on the negative side of the Y-axis direction of the load lock vacuum chamber 120. The cooling gas supply unit 127 is provided in a manner facing the substrate holder WB in the load lock vacuum chamber 120. The cooling gas supply unit 127 sprays cooling gas toward the substrate holder WB and the substrate W in the load lock vacuum chamber 120. The cooling gas cools the substrate holder WB and the substrate W in the load lock vacuum chamber 120. The cooling gas is, for example, nitrogen, argon, or clean dry air. The cooling gas supply unit 127 can be provided in the vertical direction in an area including from the lower end to the upper end of the substrate holder WB in the load lock vacuum chamber 120. In this case, cooling gas can be efficiently sprayed to all substrates W held in the substrate holder WB. The cooling gas supply unit 127 may be provided in the region including from one end to the other end of the substrate W held by the substrate holder WB in the load lock chamber 120 in the X-axis direction. In this case, the cooling gas can be sprayed with good in-plane uniformity to each substrate W held by the substrate holder WB. The cooling gas supply unit 127 may be provided on the entire surface of the side wall on the negative side in the Y-axis direction of the load lock chamber 120.

[0039] The exhaust pipe 128 is provided in the load lock chamber 120. The exhaust pipe 128 is mounted on the side wall (first side wall) on the positive side in the Y-axis direction of the load lock chamber 120. The exhaust pipe 128 is provided in a manner facing the cooling gas supply unit 127 across the substrate holder WB in the load lock chamber 120. The exhaust pipe 128 is used to suck and exhaust the atmosphere heated to a temperature higher than that of the substrate holder WB and the substrate W in the load lock chamber 120. Thus, the substrate holder WB and the substrate W in the load lock chamber 120 are cooled. The exhaust pipe 128 can be provided in the vertical direction in an area including from the lower end to the upper end of the substrate holder WB in the load lock chamber 120. The exhaust pipe 128 can be provided in the X-axis direction in an area including from one end to the other end of the substrate W held by the substrate holder WB in the load lock chamber 120. Since only the base end portion 123a of the multi-jointed arm 123 is fixed to the side wall on the positive side in the Y-axis direction of the load lock chamber 120, the exhaust pipe 128 can be provided on the entire surface of the side wall on the positive side in the Y-axis direction of the load lock chamber 120 except for the position where the base end portion 123a is fixed. In this case, an air flow can be formed to flow from the cooling gas supply unit 127 toward the exhaust pipe 128 over the entire surface of the substrate W, thereby improving the cooling efficiency of the substrate W.

[0040] The substrate transfer chamber 160 is connected to the negative side of the load lock chamber 120 in the X-axis direction. The substrate transfer chamber 160 can reduce the pressure inside. A substrate transfer robot 161 is provided in the substrate transfer chamber 160. An exhaust device may also be provided in the substrate transfer chamber 160.

[0041] The substrate transfer robot 161 is disposed inside the substrate transfer chamber 160. The substrate transfer robot 161 transfers the substrate W into the substrate holder WB in the load lock chamber 120 through the transfer port 120b, and transfers the substrate W held by the substrate holder WB in the load lock chamber 120 out through the transfer port 120b. The substrate transfer robot 161 may include a horizontal multi-joint arm.

[0042] The control unit 190 can be applied to a computer having one or more processors 191, a memory 192, an input / output interface (not shown), and an electronic circuit. The processor 191 is a processor obtained by combining one or more of a CPU, an ASIC, an FPGA, and a circuit composed of a plurality of discrete semiconductors. The memory 192 includes a volatile memory, a non-volatile memory (such as an optical disk, a DVD, a hard disk, a flash memory, etc.), and is used to store a program for causing the substrate processing device 100 to operate, a process condition for processing, and other processes. The processor 191 controls the various structures of the substrate processing device 100 by executing the program and process stored in the memory 192 to implement various processes.

[0043] As described above, according to the first embodiment, the lifting mechanism 121 includes: a support portion 122 that supports the substrate holder WB; and a multi-joint arm 123, the front end of which is connected to the support portion 122, and the multi-joint arm 123 lifts and lowers the support portion 122. Since the lifting mechanism 121 includes the multi-joint arm 123, the mechanism portion that lifts and lowers the substrate holder WB can be arranged in an internal space that is airtightly isolated from the atmosphere in the load lock chamber 120. Therefore, dust can be reduced when the substrate holder WB is lifted and lowered. The multi-joint arm 123 is accommodated in the load lock chamber 120 and operates in the load lock chamber 120, so the working area can be reduced. Therefore, space saving can be achieved. For example, since the height of the load lock chamber 120 can be lowered, the height of the processing chamber 110 can be increased while maintaining the height of the substrate processing apparatus 100. In this case, the number of substrates W that are processed at once can be increased, so productivity is improved. In addition, the distance between adjacent substrates W can be increased, so that the uniformity of heat and processing can be improved. As described above, according to the first embodiment, it is possible to achieve both reduction in dust generation and space saving.

[0044] In this regard, when the substrate holder WB is raised and lowered by, for example, a ball screw, there is a concern that the lubricant used in the sliding portion may scatter or gas may be released from the lubricant. For example, when a shaft is provided that passes through the bottom wall of the load lock chamber 120, the substrate holder WB is connected to the upper end of the shaft, and the substrate holder WB is raised and lowered by the raising and lowering action of the shaft, a space is required below the load lock chamber 120 for the shaft to move.

[0045] In the first embodiment, the multi-joint arm 123 has two arms (the first arm 123b and the second arm 123c), but the number of arms constituting the multi-joint arm 123 is not limited thereto. The multi-joint arm 123 may have three or more arms.

[0046] [Second embodiment]

[0047] Reference Figure 5 and Figure 6 The substrate processing apparatus 200 according to the second embodiment is described. The substrate processing apparatus 200 has a multi-jointed arm 223 whose rotation center is located below the middle of the stroke, which is different from the substrate processing apparatus 100. The following description will focus on the structure different from the substrate processing apparatus 100.

[0048] The substrate processing apparatus 200 includes a processing chamber 110 , a load lock chamber 120 , a substrate transfer chamber 160 , and a control unit 190 .

[0049] The load lock chamber 120 is provided with a lifting mechanism 221 , an exhaust device 126 , a cooling gas supply unit 127 , and an exhaust pipe 128 .

[0050] The lifting mechanism 221 lifts the substrate holder WB between the processing chamber 110 and the load lock chamber 120. The lifting mechanism 221 includes a support portion 122 and a multi-jointed arm 223.

[0051] The multi-jointed arm 223 includes a base end portion 223a, a first arm 223b, a second arm 223c, a third arm 223d, and a fourth arm 223e.

[0052] The base end portion 223a is fixed to the side wall of the load lock vacuum chamber 120 on the positive side in the Y-axis direction. The base end portion 223a can be located at a position lower than the middle of the stroke of the multi-joint arm 223. In this case, since the mechanism portion of the multi-joint arm 223 is always located at a position lower than the substrate holding device WB, the mechanism portion of the multi-joint arm 223 is not easily subjected to radiant heat from the substrate W. The first arm 223b is rotatable relative to the base end portion 223a with the rotation axis M22 as the center. The second arm 223c is rotatable relative to the first arm 223b with the rotation axis M23 as the center. The third arm 223d is rotatable relative to the second arm 223c with the rotation axis M24 as the center. The fourth arm 223e is rotatable relative to the third arm 223d with the rotation axis M25 as the center, and is rotatable relative to the support arm 122d with the rotation axis M26 as the center. The multi-joint arm 223 independently rotates the first arm 223b, the second arm 223c, the third arm 223d, and the fourth arm 223e to adjust the position of the substrate holder WB in the processing chamber 110 ( Figure 5 ) and the position in the load lock chamber 120 ( Figure 6 ) to lift and lower.

[0053] The multi-joint arm 223 may have an internal space that is hermetically isolated from the atmosphere in the load lock chamber 120 by a magnetic fluid seal or the like. In this case, the mechanism of the multi-joint arm 223 can be arranged in the internal space that is hermetically isolated from the atmosphere in the load lock chamber 120. Therefore, dust can be reduced when the substrate holder WB is raised or lowered. The internal space of the multi-joint arm 223 may contain a plurality of motors with speed reducers and cables for driving the motors. The plurality of motors with speed reducers cause each arm of the multi-joint arm 223 to rotate independently. The internal space of the multi-joint arm 223 may be set to atmospheric pressure.

[0054] As described above, according to the second embodiment, the lifting mechanism 221 includes: the support portion 122 that supports the substrate holder WB; and the multi-joint arm 223, the front end of which is connected to the support portion 122, and the multi-joint arm 223 lifts and lowers the support portion 122. In this case, the same effect as the first embodiment can be obtained.

[0055] In the second embodiment, the multi-joint arm 223 has four arms (the first arm 223b, the second arm 223c, the third arm 223d, and the fourth arm 223e), but the number of arms constituting the multi-joint arm 223 is not limited thereto. The multi-joint arm 223 may have less than three arms, or may have more than five arms.

[0056] [Third embodiment]

[0057] Reference Figure 7 and Figure 8 The substrate processing apparatus 300 according to the third embodiment will be described. The substrate processing apparatus 300 has a frog-leg type multi-jointed arm 323 in which the arm is arranged in a manner perpendicularly symmetrical to the trajectory of the center of gravity of the substrate holder WB, and this structure is different from the substrate processing apparatus 100. The following description will focus on the structure different from the substrate processing apparatus 100.

[0058] The substrate processing apparatus 300 includes a processing chamber 110 , a load lock chamber 120 , a substrate transfer chamber 160 , and a control unit 190 .

[0059] The load lock chamber 120 is provided with a lifting mechanism 321 , an exhaust device 126 , a cooling gas supply unit 127 , and an exhaust pipe 128 .

[0060] The lifting mechanism 321 lifts the substrate holder WB between the processing chamber 110 and the load lock chamber 120. The lifting mechanism 321 includes a support portion 122 and a multi-jointed arm 323.

[0061] The multi-joint arm 323 is a frog-leg type vertical multi-joint arm in which the arm is arranged in a manner symmetrical about the vertical line of the trajectory of the center of gravity of the substrate holding device WB. In this case, since the load torque applied to each joint of the multi-joint arm 323 is halved, it is possible to achieve miniaturization of the arm and improvement of accuracy. The vertical line of the trajectory of the center of gravity of the substrate holding device WB can be the same as the vertical axis M11. The multi-joint arm 323 includes a base end 323a, a first arm 323b, a second arm 323c, a third arm 323d, and a fourth arm 323e.

[0062] The base end portion 323a is fixed to the side wall of the positive side of the Y-axis direction of the load interlock vacuum chamber 120. The base end portion 323a can be located in the middle of the stroke of the multi-joint arm 323. In this case, the length of each arm constituting the multi-joint arm 323 and the number of arms can be set to a minimum. The first arm 323b and the second arm 323c are respectively rotatable relative to the base end portion 323a with the rotation axis M32 as the center. The third arm 323d is rotatable relative to the first arm 323b with the rotation axis M33 as the center, and is rotatable relative to the support arm 122d with the rotation axis M35 as the center. The fourth arm 323e is rotatable relative to the second arm 323c with the rotation axis M34 as the center, and is rotatable relative to the support arm 122d with the rotation axis M35 as the center. The multi-joint arm 323 independently rotates the first arm 323b, the second arm 323c, the third arm 323d, and the fourth arm 323e to adjust the position of the substrate holder WB in the processing chamber 110 ( Figure 7 ) and the position in the load lock chamber 120 ( Figure 8 ) to lift or lower.

[0063] The multi-joint arm 323 may have an internal space that is hermetically isolated from the atmosphere in the load lock chamber 120 by a magnetic fluid seal or the like. In this case, the mechanism of the multi-joint arm 323 can be arranged in the internal space that is hermetically isolated from the atmosphere in the load lock chamber 120. Therefore, dust can be reduced when the substrate holder WB is raised or lowered. The internal space of the multi-joint arm 323 may contain a plurality of motors with speed reducers and cables for driving the motors. The plurality of motors with speed reducers cause each arm of the multi-joint arm 323 to rotate independently. The internal space of the multi-joint arm 323 may be set to atmospheric pressure.

[0064] As described above, according to the third embodiment, the lifting mechanism 321 includes: the support portion 122 that supports the substrate holder WB; and the multi-joint arm 323, the front end of which is connected to the support portion 122, and the multi-joint arm 323 lifts and lowers the support portion 122. In this case, the same effect as the first embodiment can be obtained.

[0065] In the third embodiment, the multi-joint arm 323 has four arms (first arm 323b, second arm 323c, third arm 323d, and fourth arm 323e), but the number of arms constituting the multi-joint arm 323 is not limited thereto. The multi-joint arm 323 may have six or more arms.

[0066] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, and modified in various ways without departing from the appended claims and the gist thereof.

[0067] Description of Reference Numerals

[0068] 121, 221, 321: lifting mechanism; 122: supporting part; 123, 223, 323: multi-joint arm; W: substrate; WB: substrate holding device.

Claims

1. A lifting mechanism for lifting a substrate holding device that holds a plurality of substrates in a layered manner, the lifting mechanism comprising: a support portion that supports the substrate holding device; and A multi-joint arm, the front end of which is connected to the support portion, and the multi-joint arm enables the support portion to be raised and lowered.

2. The lifting mechanism according to claim 1, wherein: The support portion includes a rotation shaft that rotates the substrate holder around a vertical axis.

3. The lifting mechanism according to claim 1 or 2, wherein: The multi-jointed arm includes a refrigerant flow path therein.

4. A substrate processing device comprising: A processing chamber for uniformly processing a plurality of substrates held by a substrate holding device; a load lock vacuum chamber located below the process chamber and communicating with the process chamber; and a lifting mechanism for lifting the substrate holding device between the processing chamber and the load lock vacuum chamber, in, The lifting mechanism has: a support portion that supports the substrate holding device; as well as A multi-joint arm, the front end of which is connected to the support portion, and the multi-joint arm enables the support portion to be raised and lowered.

5. The substrate processing apparatus according to claim 4, wherein: The support portion includes a rotation shaft that rotates the substrate holder around a vertical axis.

6. The substrate processing apparatus according to claim 4, wherein: The multi-jointed arm includes a refrigerant flow path therein.

7. The substrate processing apparatus according to claim 4, wherein: The load lock chamber is capable of depressurizing.

8. The substrate processing apparatus according to claim 4, wherein: The support portion includes a cover body, and the cover body hermetically seals the processing chamber when the substrate holder is located in the processing chamber.

9. The substrate processing apparatus according to claim 4, wherein: A base end of the multi-joint arm is fixed to a first side wall of the load lock chamber.

10. The substrate processing apparatus according to claim 9, wherein: Also available: an exhaust pipe disposed on the first side wall of the load lock chamber; and a cooling gas supply portion, which is disposed on the second side wall facing the first side wall and is used to spray cooling gas, The exhaust pipe is provided on the entire surface of the first side wall except for a position where the base end of the multi-joint arm is fixed.

11. The substrate processing apparatus according to claim 4, wherein: The rotation center of the multi-joint arm is located below the middle of the stroke of the multi-joint arm.

12. The substrate processing apparatus according to claim 4, wherein: The rotation center of the multi-joint arm is located in the middle of the stroke of the multi-joint arm.

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