Processing method for wafer abnormal exit and chip dislocation

Abstract

The invention provides a processing method for wafer abnormal exit and chip dislocation. According to the processing method for wafer abnormal exit and chip dislocation, a circle of the adhesive film close to the edge is torn off from the film breaking ring and is pasted on the film breaking ring again. Or applying pressure to the annular area, between the film-breaking ring and the wafer, of the adhesive film from the non-adhesive surface of the adhesive film. According to the processing method for wafer abnormal exit and chip dislocation provided by the invention, the problem of serious waste during secondary cutting of the wafer is solved.

Description

Technical Field

[0001] The invention relates to the field of wafer cutting, and in particular to a method for processing abnormal wafer exit and chip misalignment. Background Art

[0002] When the wafer is placed in the cutting machine for cutting, since the location of the film collapse ring is slightly lower than the workbench, the downward pressure of the clamping claw will produce a certain expansion pressure on the film, so that the film is in a collapsed state. During the wafer cutting process, if there are special circumstances such as sudden shutdown or operational errors, the wafer assembly needs to be removed from the cutting machine. Then when the wafer is put back into the cutting machine for cutting, due to the above expansion pressure, the film will collapse and deform, causing the edge of the wafer to be dislocated between 20 and 40um, with the middle lower and the sides higher. This will cause the cutting path to be not in a straight line during the re-cutting operation, resulting in the functional area of ​​the circuit part being cut. Eventually, the wafer is scrapped and the wafer is wasted. The current solutions are: retain more chips in the middle area, and do not retain and scrap the chips on both sides; use special cutting procedures and breakpoint cutting. However, the above cutting procedures are complicated, require multiple calibrations and alignments, and the operation is complicated and time-consuming, and the yield of all wafers cannot be guaranteed. And both solutions will inevitably lead to wafer waste. Summary of the invention

[0003] In order to solve the problem of serious waste during secondary cutting of wafers, the present invention provides a method for processing abnormal wafer exit and chip misalignment to solve the above problem.

[0004] A method for processing abnormal wafer exit and chip misalignment, wherein the wafer assembly comprises a film collapse ring, a wafer located inside the film collapse ring, and an adhesive film laid on both the film collapse ring and the wafer. The edge circle of the adhesive film is peeled off from the film collapse ring and re-adhered to the film collapse ring, and during the peeling process, the middle circle of the adhesive film is kept adhered to the inner circle of the film collapse ring.

[0005] In a preferred embodiment of the method for processing abnormal wafer exit and chip misalignment provided by the present invention, a first fixture is placed on the film collapse ring from the non-adhesive surface of the adhesive film; The first fixture comprises a first pressing ring and a first limiting hook. The outer diameter of the first pressing ring is smaller than the diameter of the film and larger than the inner diameter of the film collapse ring. The inner diameter of the first pressing ring is smaller than the inner diameter of the film collapse ring. The first pressing ring presses the middle circle of the film tightly against the inner circle of the film collapse ring. The first limiting hook is arranged at the outer edge of the first pressing ring, and the first limiting hook is connected with the outer edge of the film collapse ring. Manually peel off the adhesive film at the position not covered by the first jig from the membrane collapse ring and re-stick it to the membrane collapse ring; rotate the first jig, and manually peel off and re-stick the position covered by the first limiting hook before the rotation.

[0006] In a preferred embodiment of the method for processing abnormal wafer exit and chip misalignment provided by the present invention, a second fixture is placed on the film collapse ring from the non-adhesive surface of the adhesive film; The second fixture comprises a second pressing ring, a connecting frame, a limiting frame and a scraper. The outer diameter of the second pressing ring is smaller than the diameter of the film and larger than the inner diameter of the film collapse ring. The inner diameter of the second pressing ring is smaller than the inner diameter of the film collapse ring. The second pressing ring presses the middle circle of the film onto the inner circle of the film collapse ring. The connecting frame, the limiting frame and the scraper are arranged on the surface of the second pressing ring in sequence. The center of the limiting frame is movably connected to the connecting frame. The edge of the limiting frame passes over the second pressing ring and is connected to the outer edge of the film collapse ring. The scraper is installed on the limiting frame through a slide rail, and the slide rail is arranged radially along the limiting frame. The scraper is controlled to lift the adhesive film from the film collapse ring at a position not covered by the second pressing ring, and the adhesive film is manually re-attached to the film collapse ring.

[0007] A method for processing abnormal wafer exit and chip misalignment, the wafer assembly includes a film collapse ring, a wafer located inside the film collapse ring, and an adhesive film laid on both the film collapse ring and the wafer, pressure is applied from the adhesive-free surface of the adhesive film to the annular area of ​​the adhesive film between the film collapse ring and the wafer, and the adhesive film is kept adhered to the film collapse ring during the pressure application process.

[0008] From the non-adhesive side of the adhesive film, pressure is applied to the annular area of ​​the adhesive film between the collapse film ring and the wafer. At the same time, vibration is applied to the collapse film ring from the side of the collapse film ring away from the adhesive film. The adhesive film and the collapse film ring are kept adhered during the pressure and vibration process.

[0009] In a preferred embodiment of the method for processing abnormal wafer exit and chip misalignment provided by the present invention, a third fixture is placed on the adhesive film from the adhesive-free side of the adhesive film; The third fixture comprises a third pressing ring and a third limiting hook, wherein the outer diameter of the third pressing ring is smaller than the inner diameter of the film collapse ring, the inner diameter is larger than the wafer diameter, and the thickness is larger than the thickness of the film collapse ring. The third limiting hook is arranged on the surface of the third pressing ring, the third pressing ring is pressed on the adhesive film, and the third limiting hook is connected with the outer edge of the film collapse ring; The third pressure ring applies pressure to the annular area of ​​the adhesive film between the collapse film ring and the wafer until the third limiting hook contacts the adhesive film.

[0010] In a preferred embodiment of the method for processing abnormal wafer exit and chip misalignment provided by the present invention, a clamp is placed under the film collapse ring from the adhesive surface of the adhesive film; The clamp is annular, and its inner and outer dimensions are consistent with those of the membrane collapse ring. A plurality of limiting plates are provided on the edge, and the limiting plates are connected to the outer edge of the membrane collapse ring. A circle of multiple through holes is provided along the clamp; The vibration is caused by the contact of the membrane collapse ring in the through hole, which applies vibration to the membrane collapse ring.

[0011] Compared with the prior art, the method for processing abnormal wafer exit and chip misalignment provided by the present invention has the following beneficial effects: 1. The basic principle of the solution provided by the present invention is to make the film in a relaxed state and reserve the margin required for the film expansion in advance. Specifically, there are two directions: operating the film near the edge to make it relaxed, and operating the film near the middle to make it relaxed.

[0012] Operation in either direction will prevent the film from expanding when the clamp puts the wafer assembly back into the cutting device, thus preventing the wafer from being dislocated due to the expansion and deformation of the film when the clamp presses down. This ensures that the wafer can stay close to its original position (with an error of 2-5um) after returning to the cutting machine workbench. This effectively avoids cutting errors and achieves zero loss in wafer cutting yield.

[0013] 2. The solution provided by the present invention can be completed by manual operation or by manual or automatic operation of a fixture, which is easy to operate and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of a wafer assembly; Figure 2 It is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Example 1; Figure 3 is a structural diagram of a method for processing abnormal wafer exit and chip misalignment in Example 2; Figure 4 is a schematic structural diagram of the second fixture in Example 2; Figure 5 It is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Example 3; Figure 6 It is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Example 4.

[0015] Numbers in the figure: film collapse ring 1, film 2, wafer 3, first pressure ring 41, first limiting hook 42, second pressure ring 51, connecting frame 52, bearing 53, limiting frame 54, slide rail 55, scraper 56, third pressure ring 61, third limiting hook 62, clamp 7, limiting plate 71. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0017] Example 1: Please also refer to Figure 1 and Figure 2, are respectively a structural schematic diagram of a wafer assembly and a structural diagram of a method for processing abnormal wafer exit and chip misalignment in this embodiment.

[0018] The wafer assembly includes a collapse film ring 1, a wafer 3 located inside the collapse film ring, and an adhesive film 2 laid on both the collapse film ring 1 and the wafer 3. The edge of the adhesive film 2 is located on the collapse film ring 1.

[0019] The processing method for abnormal wafer exit and chip misalignment is: After the wafer assembly is taken out from the cutting device, it is turned over so that the adhesive film 2 faces upward. The film collapse ring 1 is supported and the first fixture is placed.

[0020] The first fixture includes a first pressing ring 41 and a first limiting hook 42. The outer diameter of the first pressing ring 41 is smaller than the diameter of the film 2 and larger than the inner diameter of the membrane collapse ring 1, and the inner diameter is smaller than the inner diameter of the membrane collapse ring 1. Under this size, the first pressing ring 41 can press the inner circle of the part of the film 2 located on the membrane collapse ring 1, and the outermost circle is open, which is convenient for subsequent operations.

[0021] Two first limiting hooks 42 are symmetrically arranged on the outer edge of the first pressing ring 41. The first limiting hook 42 is a flat plate integrated with the first pressing ring 41, with its end bent downward and connected with the flat edge of the membrane collapse ring 1 to position the first pressing ring 41 and make it concentric with the membrane collapse ring 1.

[0022] Manually lift up the outermost circle of the adhesive film 2 not covered by the first pressing ring 41 and re-stick it on the film collapse ring 1. Replace the position of the first fixture in time to clear the area previously covered by the first limiting hook 42, and perform the same lifting and sticking operations.

[0023] During the operation, due to the presence of the first pressure ring 41, the middle circle of the adhesive film 2 is always kept adhered to the inner circle of the film collapse ring 1, and the adhesive film 2 will not completely separate from the film collapse ring 1. After the operation is completed, the wafer assembly is put back into the cutting equipment for secondary cutting.

[0024] Example 2: Please also refer to Figure 3 and Figure 4 , respectively, are a structural diagram of the method for processing abnormal wafer exit and chip misalignment in this embodiment and a structural schematic diagram of the second fixture. Among them, Figure 4 This is a schematic diagram of the structure after the upper and lower parts of the second fixture are separated. Figure 4 -a is the bottom view of the upper part, Figure 4 -b is a top view of the lower half.

[0025] The processing methods for abnormal wafer exit and chip misalignment include: After the wafer assembly is taken out from the cutting device, it is turned over so that the adhesive film 2 faces upward. The film collapse ring 1 is supported and the second fixture is placed.

[0026] The second fixture includes a second pressing ring 51, a connecting frame 52, a bearing 53, a limiting frame 54, a slide rail 55 and a scraper 56. The second pressing ring 51 is consistent with the first pressing ring 41 in the first embodiment.

[0027] A radial connecting frame 52 is fixed on the surface of the second pressing ring 51, and the edges of the two are aligned and concentric in the middle. The center of the connecting frame 52 is a circular flat plate for mounting a bearing 53. The shape of the limiting frame 54 is similar to that of the connecting frame 52, including a circular center and a radial outer side. The center position is connected to the connecting frame 52 through a bearing 53, and the outer side extends outward and crosses the second pressing ring 51. The end is bent downward to form an arc-shaped edge, which is connected to the arc edge position of the membrane collapse ring 1, so as to realize the positioning of the second pressing ring 51 and make it concentric with the membrane collapse ring 1.

[0028] A slide rail 55 is provided along the radial direction of the limiting frame 54, and a scraper 56 is provided at the end of the slide rail 55 close to the outside and close to the side of the second pressing ring 51. The scraper 56 is a blunt blade.

[0029] Manually press the scraper 56 down to press against the film collapse ring 1, and then move it inward along the slide rail 55 until it contacts the second pressure ring 51, thereby lifting the outermost side of the film 2. Then move the limit frame 54, the slide rail 55 and the scraper 56 together, circle more than one circle, so that the scraper 56 lifts the outermost circle of the film 2, and manually re-attaches it to the film collapse ring 1. After the operation is completed, put the wafer assembly back into the cutting equipment for secondary cutting.

[0030] Example 3: Please refer to Figure 5 , is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in this embodiment.

[0031] The processing methods for abnormal wafer exit and chip misalignment include: After the wafer assembly is taken out from the cutting device, it is turned over so that the adhesive film 2 faces upward. The film collapse ring 1 is supported and the third fixture is placed.

[0032] The third fixture includes a third pressing ring 61 and a third limiting hook 62. The third pressing ring 61 has an outer diameter smaller than the inner diameter of the collapse film ring 1, an inner diameter larger than the diameter of the wafer 3, and a thickness larger than the thickness of the collapse film ring 1.

[0033] Four third limiting hooks 62 are symmetrically arranged on the upper surface of the third pressing ring 61, and the ends are bent downward to connect with the flat edge of the membrane collapse ring 1 to achieve the positioning of the third pressing ring 61 so that it is concentric with the membrane collapse ring 1. After placing the third jig, manual pressure is applied to squeeze the film 2 downward using the thickness of the third pressing ring 61 itself until the third limiting hooks 62 also contact the film 2.

[0034] After the operation is completed, the wafer assembly is placed back into the cutting equipment for secondary cutting.

[0035] Example 4: Please refer to Figure 6 , is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in this embodiment.

[0036] The processing methods for abnormal wafer exit and chip misalignment include: First, clamp the fixture 7. After taking the wafer assembly out of the cutting device, turn it over so that the film 2 faces upward and place it on the fixture 7, and then place the third fixture. The vibration source extends from each through hole of the fixture 7 to lift the film collapse ring 1 and transmit vibration.

[0037] The shape of the clamp 7 is consistent with that of the membrane collapse ring 1, with a circle of multiple through holes along the ring, and multiple limit plates 71 on the edge, which are used to connect with the flat edge of the membrane collapse ring 1. Each limit plate 71 is disconnected in the middle to allow the third limit hook 62 of the third fixture to pass through. The structure of the third fixture is similar to that of Example 3, and multiple counterweights are provided on the top of the third pressure ring 61 to replace manual pressure, and the width of the third limit hook 62 is reduced to adapt to the structure of the limit plate 71.

[0038] Under the combined effect of vibration and counterweight, the targeted relaxation operation of the adhesive film 2 is achieved. After the operation is completed, the wafer assembly is put back into the cutting device for secondary cutting.

[0039] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for processing abnormal wafer exit and chip misalignment, wherein the wafer assembly includes a film collapse ring, a wafer located inside the film collapse ring, and an adhesive film laid on both the film collapse ring and the wafer, characterized in that: The edge circle of the adhesive film is peeled off from the membrane collapse ring and re-adhered to the membrane collapse ring. During the peeling process, the middle circle of the adhesive film is kept adhered to the inner circle of the membrane collapse ring.

2. The method for processing abnormal wafer exit and chip misalignment according to claim 1, characterized in that: From the non-adhesive side of the film, place the first jig on the film collapse ring; The first fixture comprises a first pressing ring and a first limiting hook. The outer diameter of the first pressing ring is smaller than the diameter of the film and larger than the inner diameter of the film collapse ring. The inner diameter of the first pressing ring is smaller than the inner diameter of the film collapse ring. The first pressing ring presses the middle circle of the film tightly against the inner circle of the film collapse ring. The first limiting hook is arranged at the outer edge of the first pressing ring, and the first limiting hook is connected with the outer edge of the film collapse ring. Manually peel off the adhesive film at the position not covered by the first jig from the membrane collapse ring and re-stick it to the membrane collapse ring; rotate the first jig, and manually peel off and re-stick the position covered by the first limiting hook before the rotation.

3. The method for processing abnormal wafer exit and chip misalignment according to claim 1, characterized in that: From the non-adhesive side of the film, place the second jig on the disintegration ring; The second fixture comprises a second pressing ring, a connecting frame, a limiting frame and a scraper. The outer diameter of the second pressing ring is smaller than the diameter of the film and larger than the inner diameter of the film collapse ring. The inner diameter of the second pressing ring is smaller than the inner diameter of the film collapse ring. The second pressing ring presses the middle circle of the film onto the inner circle of the film collapse ring. The connecting frame, the limiting frame and the scraper are arranged on the surface of the second pressing ring in sequence. The center of the limiting frame is movably connected to the connecting frame. The edge of the limiting frame passes over the second pressing ring and is connected to the outer edge of the film collapse ring. The scraper is installed on the limiting frame through a slide rail, and the slide rail is arranged radially along the limiting frame. The scraper is controlled to lift the adhesive film from the film collapse ring at a position not covered by the second pressing ring, and the adhesive film is manually re-attached to the film collapse ring.

4. A method for processing abnormal wafer exit and chip misalignment, wherein the wafer assembly includes a film collapse ring, a wafer located inside the film collapse ring, and an adhesive film laid on both the film collapse ring and the wafer, characterized in that: From the adhesive-free side of the adhesive film, pressure is applied to the annular area of ​​the adhesive film between the collapse film ring and the wafer, and the adhesive film and the collapse film ring are kept adhered during the pressure application process.

5. The method for processing abnormal wafer exit and chip misalignment according to claim 4, characterized in that: From the non-adhesive side of the adhesive film, pressure is applied to the annular area of ​​the adhesive film between the collapse film ring and the wafer. At the same time, vibration is applied to the collapse film ring from the side of the collapse film ring away from the adhesive film. The adhesive film and the collapse film ring are kept adhered during the pressure and vibration process.

6. The method for processing abnormal wafer exit and chip misalignment according to claim 4 or 5, characterized in that: From the non-adhesive side of the film, place the third jig on the film; The third fixture comprises a third pressing ring and a third limiting hook, wherein the outer diameter of the third pressing ring is smaller than the inner diameter of the film collapse ring, the inner diameter is larger than the wafer diameter, and the thickness is larger than the thickness of the film collapse ring. The third limiting hook is arranged on the surface of the third pressing ring, the third pressing ring is pressed on the adhesive film, and the third limiting hook is connected with the outer edge of the film collapse ring; The third pressure ring applies pressure to the annular area of ​​the adhesive film between the collapse film ring and the wafer until the third limiting hook contacts the adhesive film.

7. The method for processing abnormal wafer exit and chip misalignment according to claim 5, characterized in that: From the adhesive side of the film, place the clamp under the film collapse ring; The clamp is annular, and its inner and outer dimensions are consistent with those of the membrane collapse ring. A plurality of limiting plates are provided on the edge, and the limiting plates are connected to the outer edge of the membrane collapse ring. A circle of multiple through holes is provided along the clamp; The vibration is caused by the contact of the membrane collapse ring in the through hole, which applies vibration to the membrane collapse ring.

Images