Circuit board assembly and electronic equipment

Abstract

The embodiment of the invention provides a circuit board assembly and electronic equipment. The circuit board assembly and the electronic equipment are used for solving the problem that the heat dissipation efficiency of a chip structure is low. The circuit board assembly comprises a first circuit board, a chip structure and a heat conduction structure. The first circuit board comprises a first surface and a second surface which are opposite. The chip structure is mounted on the first surface of the first circuit board. The heat conduction structure is located on the side where the second surface of the first circuit board is located. The heat conduction structure comprises a heat removal end close to the first circuit board. Wherein the orthographic projection of at least one chip in the chip structure on the first circuit board is at least partially overlapped with the orthographic projection of the heat removal end part on the first circuit board. Through the arrangement, the at least one chip can conduct heat to the first circuit board, the first circuit board can conduct the heat to the heat taking end part, and the heat is conducted to the external environment through the heat conduction structure, so that the heat of the chip structure can be dissipated in the direction close to the first circuit board, and the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] The embodiments of the present application relate to a circuit board assembly and electronic equipment, belonging to the field of electronic equipment. Background Art

[0002] The chip structure is usually soldered on the circuit board. As the core component of the circuit board, the chip structure directly affects the working performance of the circuit board. Temperature is one of the main factors affecting the performance stability and working life of the chip structure. In order to reduce the junction temperature of the chip structure (Junction Temperature, which refers to the actual working temperature of devices such as MOS tubes in the chip structure), the chip structure usually needs to be cooled. However, the heat dissipation efficiency of the chip structure is low. Summary of the invention

[0003] The embodiments of the present application provide a circuit board assembly and an electronic device for improving the problem of low heat dissipation efficiency of a chip structure.

[0004] To achieve the above purpose, the present application provides the following solutions:

[0005] On the one hand, a circuit board assembly is provided, comprising a first circuit board, a chip structure and a heat-conducting structure. The first circuit board comprises a first surface and a second surface opposite to each other. The chip structure is mounted on the first surface of the first circuit board. The heat-conducting structure is located on the side where the second surface of the first circuit board is located, and the heat-conducting structure comprises a heat-extracting end portion close to the first circuit board. The chip structure comprises a plurality of chips, and the orthographic projection of at least one chip on the first circuit board at least partially overlaps with the orthographic projection of the heat-extracting end portion on the first circuit board.

[0006] Through the above arrangement, at least one chip can conduct heat to the first circuit board, and the first circuit board can conduct heat to the heat extraction end, and the heat is conducted to the external environment through the heat-conducting structure, so that the heat of the chip structure can be dissipated in the direction close to the first circuit board, which is beneficial to avoid the temperature of the chip structure being too high. Among them, "at least partially overlapping" can be understood as: the orthographic projection of at least one chip on the first circuit board and the orthographic projection of the heat extraction end on the first circuit board overlap, or the orthographic projection of at least one chip on the first circuit board is located inside the orthographic projection of the heat extraction end on the first circuit board, or the orthographic projection of the heat extraction end on the first circuit board is located inside the orthographic projection of at least one chip on the first circuit board, or the orthographic projection of at least one chip on the first circuit board and the orthographic projection of the heat extraction end on the first circuit board overlap. The orthographic projection of at least one chip on the first circuit board at least partially overlaps with the orthographic projection of the heat extraction end on the first circuit board, which is beneficial to improve the heat conduction efficiency between the heat source and the heat extraction end, and is beneficial to improve the heat dissipation efficiency of the heat-conducting structure.

[0007] Meanwhile, in an embodiment where the chip structure includes a first chip layer and a second chip layer arranged in a stacked manner, the first chip layer is located between the first circuit board and the second chip layer. Since a heat dissipation device is provided on the side of the chip structure facing away from the first circuit board, when the first chip layer conducts heat to the heat dissipation device, the second chip layer acts as an obstacle, resulting in low heat dissipation efficiency. By providing a heat conduction structure in the embodiment of the present application, it is also beneficial for the first chip layer to dissipate heat to the side where the second surface of the first circuit board is located, increasing the heat dissipation path and further improving the heat dissipation efficiency.

[0008] In some embodiments, the circuit board assembly further includes a cover body located on the side where the second surface of the first circuit board is located. The cover body is connected to the first circuit board and jointly encloses an accommodation space, and the heat extraction end is located in the accommodation space. The circuit board assembly further includes a heat conduction material filled in the accommodation space. By filling the accommodation space with the heat conduction material, it is beneficial to reduce the heat transfer contact resistance between the heat extraction end and the cover body, avoid the heat conducted from the chip structure being concentrated at the heat extraction end, and facilitate the heat to be dispersed through the cover body, thereby further improving the heat dissipation efficiency.

[0009] In some embodiments, the cover body includes a second circuit board and a frame board. The frame board is connected between the second circuit board and the first circuit board, and the second circuit board has a through hole penetrating it. The heat conduction structure includes a first part and a second part. The first part and the second part are connected. The first part is located on the side of the second circuit board facing away from the first circuit board, and the second part extends into the accommodation space through the through hole. The second part includes a heat extraction end. Through the above arrangement, the second circuit board, the frame board, and the first circuit board are stacked in sequence to achieve a PCB sandwich structure. By stacking the first circuit board and the second circuit board, it is beneficial to reduce the occupied area of the circuit board assembly in the plane parallel to the first circuit board and improve the space utilization rate in the electronic device.

[0010] Through the above arrangement, a part of the heat of the chip structure can be conducted to the heat extraction end of the heat conduction structure through the first circuit board and the heat conduction material, and then conducted from the heat extraction end to the first part of the heat conduction structure through the second part of the heat conduction structure. Further, since the first part is located on the side of the second circuit board where the first circuit board is located, that is, the first part of the heat conduction structure is in contact with the external environment, it is beneficial for the first part of the heat conduction structure to conduct the heat to the external environment. At the same time, a part of the heat of the chip structure can also be conducted to the second circuit board through the first circuit board and the heat conduction material, and then conducted to the external environment by the second circuit board.

[0011] In some embodiments, in a plane parallel to the first circuit board, the cross-sectional area of ​​the second part is smaller than the cross-sectional area of ​​the first part. Here, "a plane parallel to the first circuit board" can be understood as the plane located on the side of the second circuit board close to the first circuit board, and the plane intersects with the second part; "another plane parallel to the first circuit board" can be understood as the plane located on the side of the second circuit board away from the first circuit board, and the plane intersects with the first part. The above arrangement is conducive to increasing the surface of the second part in contact with the external environment, thereby increasing the heat dissipation efficiency of the heat-conducting structure.

[0012] In some embodiments, the cover body includes a second circuit board and a frame board, the frame board is connected between the second circuit board and the first circuit board; the heat-conducting structure is located in the accommodating space, the heat-conducting structure includes a connecting end close to the second circuit board, and the connecting end is connected to the second circuit board.

[0013] Through the above arrangement, part of the heat of the chip structure can be conducted to the heat extraction end of the heat-conducting structure through the first circuit board and the heat-conducting material, and then conducted to the second circuit board by the heat-conducting structure, so as to conduct the heat to the external environment. At the same time, part of the heat of the chip structure can also be directly conducted to the second circuit board through the first circuit board and the heat-conducting material, and then conducted to the external environment by the second circuit board. Furthermore, since the heat-conducting structure is located inside the accommodating space, the heat-conducting structure does not occupy the space on the side of the second circuit board away from the first circuit board, which is conducive to reducing the thickness of the circuit board assembly along the first direction, and is convenient for realizing the lightness and thinness of the electronic device.

[0014] In some embodiments, in a plane parallel to the first circuit board, the cross-sectional area of ​​the heat extraction end is smaller than the cross-sectional area of ​​the connection end. Here, "a plane parallel to the first circuit board" can be understood as the plane located on the side of the second circuit board close to the first circuit board, and the plane intersects with the connection end; "another plane parallel to the first circuit board" can be understood as the plane located on the side of the second circuit board away from the first circuit board, and the plane intersects with the heat extraction end. The above arrangement is conducive to increasing the surface of the connection end in contact with the second circuit board, thereby increasing the connection reliability between the connection end and the second circuit board.

[0015] In some embodiments, the cover body and the heat-conducting structure are an integrated structure, and the heat-conducting structure is located in the accommodating space. Through the above arrangement, the heat of the chip structure can be conducted to the heat-conducting structure and the cover body through the first circuit board and the heat-conducting material, and then conducted to the external environment by the heat-conducting structure and the cover body. At the same time, the cover body can also play a shielding effect. By setting the cover body and the heat-conducting structure as an integrated structure, it is helpful to reduce the parts of the circuit board assembly and improve reliability.

[0016] In some embodiments, the cover is an integrated structure, the heat-conducting structure is located in the accommodating space, the heat-conducting structure is connected to the cover, or the heat-conducting structure is connected to the first circuit board. For example, the heat-conducting structure can be welded or bonded to the cover, and there is a gap between the heat-conducting structure and the first circuit board, and the heat-conducting material can fill the gap between the heat-conducting structure and the first circuit board to reduce the heat transfer contact resistance between the heat-conducting structure and the first circuit board, and improve the heat transfer efficiency between the heat-conducting structure and the first circuit board. Through the above arrangement, the heat of the chip structure can be conducted to the heat-conducting structure and the cover through the first circuit board and the heat-conducting material, and then conducted to the external environment by the heat-conducting structure and the cover. For example, the heat-conducting structure can be welded or bonded to the first circuit board, and there is a gap between the heat-conducting structure and the second circuit board, and the heat-conducting material can fill the gap between the heat-conducting structure and the second circuit board to reduce the heat transfer contact resistance between the heat-conducting structure and the second circuit board, and improve the heat transfer efficiency between the heat-conducting structure and the second circuit board. Through the above arrangement, the heat of the chip structure can be conducted to the heat-conducting material and the cover through the first circuit board and the heat-conducting structure, and then conducted to the external environment through the cover.

[0017] In some embodiments, the first circuit board includes a plurality of first conductive vias, one of which is connected to a solder ball of the chip structure, and one of which is directly opposite to a pin of the chip in the chip structure, and the pin is used for grounding. Through the above arrangement, heat from the chip can be conducted to the second side of the first circuit board through the first conductive vias, thereby achieving heat dissipation.

[0018] In some embodiments, the first circuit board further includes a second conductive through hole, and at least one second conductive through hole is located between two adjacent first conductive through holes. Through the above arrangement, the heat from the chip can be conducted to the second side of the first circuit board through the second conductive through hole, thereby achieving heat dissipation, which is conducive to further improving the heat dissipation efficiency.

[0019] In some embodiments, the first circuit board includes a conductive column, the conductive column runs through the first circuit board, the conductive column is connected to at least one solder ball of the chip structure, and the conductive column is directly opposite to at least one pin of the chip in the chip structure, and the pin is used for grounding. Through the above arrangement, the heat from the chip can be conducted to the second side of the first circuit board through the conductive column, thereby achieving heat dissipation, which is conducive to further improving the heat dissipation efficiency.

[0020] In some embodiments, the chip structure includes a first chip layer and a second chip layer stacked together, the first chip layer is located between the first circuit board and the second chip layer, and the orthographic projection of at least one chip in the first chip layer on the first circuit board overlaps at least partially with the orthographic projection of the heat extraction end on the first circuit board; the circuit board assembly also includes a heat sink, which is located on the side of the chip structure away from the first circuit board and connected to the second chip layer. Through the above arrangement, the heat sink can efficiently conduct the heat of the chip structure to the external environment, thereby preventing the temperature of the chip structure from being too high.

[0021] On the other hand, an electronic device is provided, comprising any circuit board assembly as described above. The electronic device provided by the embodiment of the present application comprises the circuit board assembly as described above, and thus has all the above-mentioned beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A cross-sectional view of a circuit board assembly provided in an embodiment of the present application;

[0023] Figure 2 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0024] Figure 3 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0025] Figure 4 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0026] Figure 5 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0027] Figure 6 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0028] Figure 7 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0029] Figure 8 for Figure 7 A partial enlarged view of a circuit board component at N1;

[0030] Fig. 9 A top view of a first chip layer after solder balls are removed provided in an embodiment of the present application;

[0031] Fig.10 for Figure 7 A partial enlarged view of another circuit board component at N1;

[0032] Fig.11A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0033] Fig.12 for Fig.11 A partial enlarged view of a circuit board component at N2. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0035] In the following, the terms "first", "second", etc. are used only for convenience of description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0036] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0037] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, etc., used to explain the structure and movement of different components in the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component position changes, then these directional indications will also change accordingly.

[0038] When describing some embodiments, the expression "connection" and its derivatives may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0039] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0040] As used herein, "about" or "approximately" includes the stated value and the average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0041] The embodiment of the present application provides an electronic device. The electronic device may be a mobile phone, a tablet computer (pad), a television, a smart wearable product (e.g., a smart watch, a smart bracelet), a virtual reality (VR) device, an augmented reality (AR) device, or other terminal products. The electronic device may include a circuit board assembly in any of the following embodiments. By setting the circuit board assembly, the working performance of the electronic device is ensured and the working efficiency of the electronic device is extended.

[0042] Figure 1 This is a cross-sectional view of a circuit board assembly 1 provided in an embodiment of the present application. Figure 1 As shown, the circuit board assembly 1 may include a first circuit board 11 and a chip structure 20. The first circuit board 11 is also a printed circuit board (PCB). The first circuit board 11 may include a first surface 1101 and a second surface 1102 relative to each other. The chip structure 20 may be mounted on the first surface 1101 of the first circuit board 11. Exemplarily, the first circuit board 11 and the chip structure 20 may be stacked. For ease of description, the stacking direction of the first circuit board 11 and the chip structure 20 is defined as a first direction X, the first surface 1101 and the second surface 1102 are relatively arranged along the first direction X, the side where the first surface 1101 of the first circuit board 11 is located is defined as a first side A of the first circuit board 11, and the side where the second surface 1102 of the first circuit board 11 is located is defined as a second side B of the second circuit board 121.

[0043] It is understandable that when the electronic device is working, the temperature of the housing of the electronic device rises slowly, while the temperature of the chip structure 20 rises quickly, which causes the junction temperature to exceed the standard and the working frequency is limited. In view of this, in some embodiments, the circuit board assembly 1 may also include a heat sink 30, and the heat sink 30 may be located on the side of the chip structure 20 away from the first circuit board 11, and connected to the chip structure 20. Exemplarily, the heat sink 30 is located on the first side A of the first circuit board 11, and the chip structure 20 is located between the first circuit board 11 and the heat sink 30. Among them, the heat sink 30 can be, for example, a VC (Vapor-Chamber, vacuum chamber heat sink heat dissipation technology) radiator. Through the above arrangement, the heat sink 30 can efficiently conduct the heat of the chip structure 20 to the external environment, thereby avoiding the temperature of the chip structure 20 from being too high.

[0044] Based on the above structure, the circuit board assembly 1 may further include a shielding structure 70, which is disposed outside the chip structure 20. Exemplarily, the shielding structure 70 may be connected to the first circuit board 11, and the chip structure 20 may be located in a space enclosed by the shielding structure 70 and the first circuit board 11. By providing the shielding structure 70, a shielding effect may be achieved on the chip structure 20, thereby preventing other devices in the electronic device from electromagnetically interfering with the chip structure 20.

[0045] In some embodiments, the circuit board assembly 1 may further include a thermal interface material (TIM) layer 40, and the thermal interface material layer 40 may be located between the heat dissipation device 30 and the chip structure 20. Exemplarily, the thermal interface material layer 40 may include thermally conductive adhesive, thermally conductive gel, thermally conductive silicone grease, and thermally conductive gaskets. Among them, the thermal interface material layer 40 may be located between the shielding structure 70 and the chip structure 20, and at the same time, the thermal interface material layer 40 may also be located between the shielding structure 70 and the heat dissipation device 30. Through the above-mentioned settings, the thermal interface material layer 40 can fill the gaps between the heat transfer surfaces, reduce the heat transfer contact thermal resistance, and improve the heat transfer efficiency between the chip structure 20 and the heat dissipation device 30.

[0046] In some embodiments, the chip structure 20 may include a first chip layer 21 and a second chip layer 22 that are stacked, and the first chip layer 21 is located between the first circuit board 11 and the second chip layer 22. Based on the above structure, the heat dissipation device 30 may be connected to the second chip layer 22. For example, in an embodiment where the circuit board assembly 1 includes a thermal interface material layer 40 and a shielding structure 70, the second chip layer 22 may be connected to the heat dissipation device 30 through the thermal interface material layer 40 and the shielding structure 70.

[0047] The first chip layer 21 may include multiple chips 201. It is understandable that each chip 201 can be used as a heat source in the first chip layer 21 when working. In the first chip layer 21, at least one chip 201 may be a CPU (central processing unit) chip 201. As the computing speed and computing requirements of the processor gradually increase, the power consumption of the CPU chip 201 continues to increase, which in turn leads to an increase in the heat dissipation demand of the CPU chip 201.

[0048] As described in the above embodiment, since the second chip layer 22 is located between the first chip layer 21 and the heat dissipation device 30, when the first chip layer 21 conducts heat to the heat dissipation device 30, the second chip layer 22 acts as an obstacle, resulting in reduced heat dissipation efficiency of the first chip layer 21.

[0049] Continue to refer to Figure 1 In view of this, the circuit board assembly 1 in the embodiment of the present application further includes a heat-conducting structure 50. The heat-conducting structure 50 is located on the side where the second surface 1102 of the first circuit board 11 is located, and the heat-conducting structure 50 includes a heat-extracting end portion 501 close to the first circuit board 11. Exemplarily, the heat-conducting structure 50 is located on the second side B of the first circuit board 11. Through the above arrangement, at least one chip 201 can conduct heat to the first circuit board 11, and the first circuit board 11 can conduct heat to the heat-extracting end portion 501, and the heat is conducted to the external environment through the heat-conducting structure 50, so that the heat of the chip structure 20 can be dissipated in the direction close to the first circuit board 11 (that is, the heat of the chip structure 20 can be dissipated to the second side B of the first circuit board 11), which is conducive to avoiding excessive temperature of the chip structure 20.

[0050] In some embodiments, the material of the heat-conducting structure 50 may include metal, for example, may include at least one of copper, silver, aluminum, tungsten, zinc, gold, copper alloy or aluminum alloy. Alternatively, in some embodiments, the material of the heat-conducting structure 50 may also include ceramic materials (such as boron nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), etc.), carbon materials (such as diamond, carbon nanotubes, carbon fibers and graphene, etc.) and other heat-conducting materials 13.

[0051] The chip structure 20 may include a plurality of chips 201, and the orthographic projection of at least one chip 201 on the first circuit board 11 at least partially overlaps with the orthographic projection of the heat extraction end 501 on the first circuit board 11. As described in the above embodiment, at least one chip 201 may serve as a heat source for the chip structure 20. Exemplarily, the orthographic projection of a chip 201 on the first circuit board 11 may be in the shape of a rectangle, and accordingly, the heat extraction end 501 may be a hexahedral structure, and the orthographic projection shape on the first circuit board 11 may also be in the shape of a rectangle. Here, "at least partially overlapped" can be understood as: the orthographic projection of at least one chip 201 on the first circuit board 11 overlaps with the orthographic projection of the heat extraction end 501 on the first circuit board 11, or the orthographic projection of at least one chip 201 on the first circuit board 11 is located inside the orthographic projection of the heat extraction end 501 on the first circuit board 11, or the orthographic projection of the heat extraction end 501 on the first circuit board 11 is located inside the orthographic projection of at least one chip 201 on the first circuit board 11, or the orthographic projection of at least one chip 201 on the first circuit board 11 and the orthographic projection of the heat extraction end 501 on the first circuit board 11 overlap. The above configuration is conducive to improving the heat conduction efficiency between the heat source and the heat extraction end 501, and is conducive to further improving the heat dissipation efficiency of the heat-conducting structure 50.

[0052] Furthermore, while disposing the heat dissipation device 30 on the first side A of the first circuit board 11, disposing the heat conduction structure 50 on the second side B of the first circuit board 11 is beneficial to increase the heat conduction path of the chip structure 20, improve the heat dissipation efficiency, and further avoid the chip structure 20 from being overheated.

[0053] Meanwhile, in the embodiment where the chip structure 20 includes the first chip layer 21 and the second chip layer 22, the heat dissipation efficiency is not high because the second chip layer 22 acts as an obstacle when the first chip layer 21 conducts heat to the heat dissipation device 30. Providing the heat conducting structure 50 on the second side B of the first circuit board 11 is also beneficial to the heat dissipation from the first chip layer 21 to the second side B of the first circuit board 11, increasing the heat dissipation path and further improving the heat dissipation efficiency.

[0054] The orthographic projection of at least one chip 201 in the first chip layer 21 on the first circuit board 11 may at least partially overlap with the orthographic projection of the heat extraction end 501 on the first circuit board 11. The above arrangement is helpful to improve the heat conduction efficiency between the heat source in the first chip layer 21 and the heat extraction end 501, and is helpful to further improve the heat dissipation efficiency of the heat-conducting structure 50.

[0055] Continue to refer to Figure 1The circuit board assembly 1 may further include a cover 12, which may be located on the side where the second surface 1102 of the first circuit board 11 is located, and the cover 12 is connected to the first circuit board 11, and together they enclose an accommodation space M. Exemplarily, the shape of the cover 12 may be set accordingly according to the shape of the first circuit board 11, and the embodiment of the present application does not specifically limit this. For example, the accommodation space M enclosed by the cover 12 and the first circuit board 11 may be roughly a hexahedral structure.

[0056] The heat extraction end 501 may be located in the accommodation space M. Accordingly, continue to refer to Figure 1 The circuit board assembly 1 may further include a heat-conducting material 13, which is filled in the accommodation space M. The heat-conducting material 13 may include a thermal interface material, which may include, for example, a thermally conductive adhesive, a thermally conductive gel, and a thermally conductive silicone grease. By filling the accommodation space M with the heat-conducting material 13, it is helpful to reduce the heat transfer contact resistance between the heat-extracting end 501 and the cover 12, avoid the heat conducted from the chip structure 20 from being concentrated on the heat-extracting end 501, facilitate the heat to be dispersed through the cover 12, and further improve the heat dissipation efficiency.

[0057] For example, continue to refer to Figure 1 , the circuit board assembly 1 may further include a capacitor 113, the capacitor 113 is mounted on the second surface 1102 of the first circuit board 11, and the capacitor 113 is located in the accommodating space M. Exemplarily, the capacitor 113 may be located on the second side B of the first circuit board 11, and the capacitor 113 may be mounted on the first circuit board 11 by surface mount technology (SMT). The capacitor 113 mounted on the first circuit board 11 is also a back-mounted capacitor 113. By providing the back-mounted capacitor 113, the circuit board assembly 1 may meet better electrical requirements and achieve corresponding functionality. The embodiment of the present application does not limit the number of capacitors 113, for example Figure 1 A plurality of capacitors 113 may be mounted on the first circuit board 11. Since the capacitors 113 are located in the accommodation space M, the cover 12 can shield the capacitors 113 to prevent electromagnetic interference.

[0058] In some embodiments, continue to refer to Figure 1, the cover body 12 may include a second circuit board 121 and a frame board 122, and the frame board 122 is connected between the second circuit board 121 and the first circuit board 11. Exemplarily, the second circuit board 121 may also be a printed circuit board. The functions of the first circuit board 11 and the second circuit board 121 may be different. For example, the first circuit board 11 may be used as a main board, and the second circuit board 121 may be used as a radio frequency board. The frame board 122 may be used as a transfer board to achieve electrical connection between the first circuit board 11 and the second circuit board 121. The cross-sectional shape of the frame board 122 parallel to the first circuit board 11 may be roughly annular, so that the second circuit board 121, the frame board 122 and the first circuit board 11 can jointly enclose a housing space M.

[0059] Through the above arrangement, the second circuit board 121, the frame board 122 and the first circuit board 11 are stacked together in sequence to realize a PCB sandwich structure. By stacking the first circuit board 11 and the second circuit board 121, it is beneficial to reduce the occupied area of ​​the circuit board assembly 1 in a plane parallel to the first circuit board 11, which is beneficial to improve the space utilization rate in the electronic device.

[0060] Based on the above structure, in some embodiments, continue to refer to Figure 1 , the second circuit board 121 may have a through hole running through it. Accordingly, the heat-conducting structure 50 may include a first portion 51 and a second portion 52, the first portion 51 and the second portion 52 are connected, the first portion 51 may be located on the side of the second circuit board 121 away from the first circuit board 11, the second portion 52 may extend into the accommodating space M through the through hole, and the second portion 52 includes a heat-extracting end portion 501. Through the above arrangement, a portion of the heat of the chip structure 20 may be conducted to the heat-extracting end portion 501 of the heat-conducting structure 50 through the first circuit board 11 and the heat-conducting material 13, and then conducted from the heat-extracting end portion 501 to the first portion 51 of the heat-conducting structure 50 through the second portion 52 of the heat-conducting structure 50. Furthermore, since the first portion 51 is located on the side of the second circuit board 121 located on the first circuit board 11, that is, the first portion 51 of the heat-conducting structure 50 is in contact with the external environment, it is beneficial for the first portion 51 of the heat-conducting structure 50 to conduct heat to the external environment. At the same time, part of the heat of the chip structure 20 can also be conducted to the second circuit board 121 through the first circuit board 11 and the heat-conducting material 13 , and then conducted to the external environment by the second circuit board 121 .

[0061] Exemplarily, the shape of the through hole can be set accordingly according to the shape of the second part 52. For example, the through hole can be a circular through hole, and accordingly, the second part 52 can be a substantially cylindrical structure. The material of the heat-conducting structure 50 can be a metal material, and the first part 51 can be welded or bonded to the surface of the second circuit board 121 away from the first circuit board 11, and the second part 52 can be welded or bonded in the through hole of the second circuit board 121, so that the heat-conducting structure 50 can be sealed and connected with the second circuit board 121, thereby ensuring the shielding effect of the cover body 12.

[0062] Since the second portion 52 can extend into the accommodating space M through the through hole, accordingly, in some embodiments, the orthographic projection of the capacitor 113 on the first circuit board 11 is located outside the orthographic projection of at least one chip 201 in the chip structure 20 on the first circuit board 11. Through the above arrangement, interference between the heat extraction end 501 and the capacitor 113 is avoided.

[0063] Figure 2 This is a cross-sectional view of a circuit board assembly 1 provided in an embodiment of the present application. Figure 2 As shown, in some embodiments, the second portion 52 may also be inserted into the through hole and not extend into the accommodating space M. Accordingly, in some embodiments, the orthographic projection of the capacitor 113 on the first circuit board 11 and the orthographic projection of at least one chip 201 in the chip structure 20 on the first circuit board 11 may at least partially overlap. The above arrangement is conducive to increasing the density of the capacitor 113 on the first circuit board 11 and improving the integration of the first circuit board 11.

[0064] Continue to refer to Figure 1 and Figure 2 , in a plane parallel to the first circuit board 11, the cross-sectional area of ​​the second part 52 is smaller than the cross-sectional area of ​​the first part 51. Exemplarily, in a plane parallel to the first circuit board 11, the cross-sectional area of ​​the first part 51 may be a first area value; in another plane parallel to the first circuit board 11, the cross-sectional area of ​​the second part 52 may be a second area value, and the second area value is smaller than the first area value. Here, "a plane parallel to the first circuit board 11" can be understood as that the plane is located on the side of the second circuit board 121 close to the first circuit board 11, and the plane intersects with the second part 52; "another plane parallel to the first circuit board 11" can be understood as that the plane is located on the side of the second circuit board 121 away from the first circuit board 11, and the plane intersects with the first part 51. Through the above arrangement, it is beneficial to increase the surface of the second part 52 in contact with the external environment, thereby increasing the heat dissipation efficiency of the heat-conducting structure 50.

[0065] In some embodiments, the central axis of the first part 51 and the central axis of the second part 52 may coincide. For example, the second part 52 may be substantially in a columnar structure, and the first part 51 may be substantially in a plate-like structure. The above arrangement is conducive to improving the regularity of the heat-conducting structure 50, shortening the heat-conducting path between the first part 51 and the second part 52, and further improving the heat dissipation efficiency of the heat-conducting structure 50. Figure 3 A cross-sectional view of another circuit board assembly 1 provided in an embodiment of the present application.

[0066] Based on the above structure, Figure 3 As shown, in some embodiments, the heat-conducting structure 50 may be located in the accommodating space M, and the heat-conducting structure 50 may include a connecting end 502 close to the second circuit board 121, and the connecting end 502 is connected to the second circuit board 121. In the embodiment where the circuit board assembly 1 includes a capacitor 113, the heat-conducting structure 50 may be arranged accordingly according to the shape of the accommodating space M to avoid the capacitor 113. Among them, the connecting end 502 may be welded or bonded to the surface of the second circuit board 121 close to the first circuit board 11. Through the above arrangement, a part of the heat of the chip structure 20 can be conducted to the heat-extracting end 501 of the heat-conducting structure 50 through the first circuit board 11 and the heat-conducting material 13, and then conducted to the second circuit board 121 by the heat-conducting structure 50, so as to conduct the heat to the external environment. At the same time, a part of the heat of the chip structure 20 can also be directly conducted to the second circuit board 121 through the first circuit board 11 and the heat-conducting material 13, and then conducted to the external environment by the second circuit board 121.

[0067] In some embodiments, since the heat conductive structure 50 is located inside the accommodating space M, the heat conductive structure 50 does not occupy the space on the side of the second circuit board 121 away from the first circuit board 11, which is beneficial to reducing the thickness of the circuit board assembly 1 along the first direction X, thereby facilitating the realization of lightweight electronic equipment.

[0068] Continue to refer to Figure 3, in a plane parallel to the first circuit board 11, the cross-sectional area of ​​the heat extraction end 501 is smaller than the cross-sectional area of ​​the connection end 502. Exemplarily, in a plane parallel to the first circuit board 11, the cross-sectional area of ​​the connection end 502 may be a third area value; in another plane parallel to the first circuit board 11, the cross-sectional area of ​​the heat extraction end 501 may be a fourth area value, and the fourth area value is smaller than the third area value. Here, "a plane parallel to the first circuit board 11" can be understood as that the plane is located on the side of the second circuit board 121 close to the first circuit board 11, and the plane intersects with the connection end 502; "another plane parallel to the first circuit board 11" can be understood as that the plane is located on the side of the second circuit board 121 away from the first circuit board 11, and the plane intersects with the heat extraction end 501. Through the above arrangement, it is beneficial to increase the contact surface of the connection end 502 with the second circuit board 121, thereby increasing the connection reliability of the connection end 502 and the second circuit board 121.

[0069] In some embodiments, the central axis of the connecting end 502 and the central axis of the heat extraction end 501 may coincide. For example, the heat extraction end 501 may be roughly columnar, and the connecting end 502 may be roughly plate-like. The above arrangement is conducive to improving the regularity of the heat-conducting structure 50, shortening the heat-conducting path between the connecting end 502 and the heat extraction end 501, and further improving the heat dissipation efficiency of the heat-conducting structure 50.

[0070] exist Figure 1 and Figure 3 In the two embodiments shown, during the preparation of the circuit board assembly 1, the heat-conducting structure 50 can be welded or bonded to the second circuit board 121, and then the second circuit board 121 and the frame board 122 can be mounted on the first circuit board 11 using the surface mounting technology. Due to the limitation of the process, there is a gap between the heat-extracting end 501 of the heat-conducting structure 50 and the second surface 1102 of the first circuit board 11. By filling the accommodating space M with the heat-conducting material 13, the heat-conducting material 13 can fill the gap between the heat-extracting end 501 and the second surface 1102, so as to reduce the heat transfer contact thermal resistance between the heat-extracting end 501 and the first circuit board 11, and improve the heat transfer efficiency between the heat-extracting end 501 and the first circuit board 11.

[0071] Figure 4 This is a cross-sectional view of another circuit board assembly 1 provided in an embodiment of the present application. Figure 4As shown, in some embodiments, the cover body 12 and the heat-conducting structure 50 can be an integral structure, and the heat-conducting structure 50 is located in the accommodating space M. Exemplarily, the materials of the cover body 12 and the heat-conducting structure 50 can be the same, that is, the cover body 12 can also have a good heat-conducting effect. Through the above arrangement, the heat of the chip structure 20 can be conducted to the heat-conducting structure 50 and the cover body 12 through the first circuit board 11 and the heat-conducting material 13, and then conducted to the external environment by the heat-conducting structure 50 and the cover body 12. At the same time, the cover body 12 can also play a shielding effect. By setting the cover body 12 and the heat-conducting structure 50 as an integral structure, it is helpful to reduce the parts of the circuit board assembly 1 and improve reliability.

[0072] The cover body 12 may include a bottom plate 123 and a side plate 124 arranged around the edge of the bottom plate 123, the side plate 124 is located between the bottom plate 123 and the first circuit board 11, and the bottom plate 123, the side plate 124 and the first circuit board 11 jointly enclose an accommodation space M. The bottom plate 123 protrudes toward a side close to the first circuit board 11 to form a heat-conducting structure 50, so that the heat-conducting structure 50 is located in the accommodation space M. Through the above arrangement, the heat-conducting structure 50 is located in the accommodation space M, which is conducive to reducing the thickness of the circuit board assembly 1 along the first direction X, and is convenient for realizing the thinness of the electronic device.

[0073] Of course, in some examples, part of the heat-conducting structure 50 may also be located outside the accommodation space M, and this embodiment of the present application specifically defines this. Moreover, this embodiment of the present application does not define the specific shape of the heat-conducting structure 50, such as Figure 4 As shown, the heat-conducting structure 50 may be, for example, substantially a columnar structure, and a portion of the columnar structure close to the first circuit board 11 is a heat-extracting end portion 501 .

[0074] exist Figure 4 In the illustrated embodiment, during the preparation of the circuit board assembly 1, the integrated structure of the heat-conducting structure 50 and the cover body 12 can be mounted on the first circuit board 11 using surface mounting technology. Due to the limitation of the process, there may be a gap between the heat-extracting end 501 of the heat-conducting structure 50 and the second surface 1102 of the first circuit board 11. By filling the accommodating space M with the heat-conducting material 13, the heat-conducting material 13 can fill the gap between the heat-extracting end 501 and the second surface 1102, so as to reduce the heat transfer contact thermal resistance between the heat-extracting end 501 and the first circuit board 11, and improve the heat transfer efficiency between the heat-extracting end 501 and the first circuit board 11.

[0075] Figure 5 A cross-sectional view of another circuit board assembly 1 provided in an embodiment of the present application; Figure 6 This is a cross-sectional view of another circuit board assembly 1 provided in an embodiment of the present application. Figure 5 and Figure 6In some embodiments, the cover 12 may be an integrated structure. The cover 12 may include a bottom plate 123 and a side plate 124 disposed around the edge of the bottom plate 123, the side plate 124 being located between the bottom plate 123 and the first circuit board 11, and the bottom plate 123, the side plate 124 and the first circuit board 11 jointly enclose an accommodation space M. The material of the cover 12 may include, for example, nickel silver, stainless steel, tinplate, etc., so that the cover 12 has a good shielding effect.

[0076] Continue to refer Figure 5 and Figure 6 The heat-conducting structure 50 can be located in the accommodation space M, which is beneficial to reducing the thickness of the circuit board assembly 1 along the first direction X, and is convenient for realizing the thinness of the electronic device. In addition, the embodiment of the present application does not limit the specific shape of the heat-conducting structure 50. Figure 5 and Figure 6 As shown, the heat-conducting structure 50 may be, for example, substantially a columnar structure, and a portion of the columnar structure close to the first circuit board 11 is a heat-extracting end portion 501 .

[0077] In some embodiments, Figure 5 As shown, the heat-conducting structure 50 can be connected to the cover 12. For example, the heat-conducting structure 50 can be welded or bonded to the cover 12, and there is a gap between the heat-conducting structure 50 and the first circuit board 11. The heat-conducting material 13 can fill the gap between the heat-conducting structure 50 and the first circuit board 11 to reduce the heat transfer contact resistance between the heat-conducting structure 50 and the first circuit board 11, and improve the heat transfer efficiency between the heat-conducting structure 50 and the first circuit board 11. Through the above arrangement, the heat of the chip structure 20 can be transferred to the heat-conducting structure 50 and the cover 12 through the first circuit board 11 and the heat-conducting material 13, and then transferred to the external environment by the heat-conducting structure 50 and the cover 12.

[0078] Or, in some embodiments, Figure 6 As shown, the heat-conducting structure 50 is connected to the first circuit board 11. For example, the heat-extracting end 501 of the heat-conducting structure 50 can be welded or bonded to the first circuit board 11, and there is a gap between the heat-conducting structure 50 and the second circuit board 121. The heat-conducting material 13 can fill the gap between the heat-conducting structure 50 and the second circuit board 121 to reduce the heat transfer contact resistance between the heat-conducting structure 50 and the second circuit board 121, and improve the heat transfer efficiency between the heat-conducting structure 50 and the second circuit board 121. Through the above arrangement, the heat of the chip structure 20 can be transferred to the heat-conducting material 13 and the cover 12 through the first circuit board 11 and the heat-conducting structure 50, and then transferred to the external environment by the cover 12.

[0079] Figure 7 A cross-sectional view of another circuit board assembly 1 provided in an embodiment of the present application; Figure 8 for Figure 7A partial enlarged view of a circuit board assembly 1 at position N1; Fig. 9 FIG. 2 is a top view of a first chip layer 21 after the solder balls 202 are removed provided in an embodiment of the present application. Figure 7 , Figure 8 as well as Fig. 9 As shown, in some embodiments, the first circuit board 11 may include a plurality of first conductive vias 115 , one first conductive via 115 is connected to a solder ball 202 of the chip structure 20 , and one first conductive via 115 is directly opposite to a ground pin 2013 of the chip 201 in the chip structure 20 .

[0080] Exemplarily, the chip structure 20 may be mounted on the first circuit board 11 via a ball grid array (BGA) structure, and the ball grid array structure may include a plurality of solder balls 202 .

[0081] Reference Fig. 9 The chip 201 in the chip structure 20 has a plurality of pins, some of which are used for grounding (i.e., grounding pins 2013), and the other pins are used for connecting to a power source (i.e., connecting to a power source pin 2015). Since a grounding pin 2013 of the chip 201 is connected to a solder ball 202 of the chip structure 20, the heat of the chip 201 can be conducted to the first circuit board 11 through the grounding pin 2013 and the solder ball 202.

[0082] In some embodiments, the first conductive via 115 may be, for example, a through silicon via (TSV), which may be filled with a metal conductive material such as copper or tungsten, so that the first conductive via 115 has a good thermal conductivity. Through the above arrangement, the heat from the chip 201 may be conducted to the second side B of the first circuit board 11 through the first conductive via 115, thereby achieving heat dissipation.

[0083] Fig.10 for Figure 7 A partial enlarged view of another circuit board assembly 1 at N1 in FIG. Based on the above structure, as Fig.10 As shown, the first circuit board 11 may further include a second conductive through hole 117, and at least one second conductive through hole 117 is located between two adjacent first conductive through holes 115. The second conductive through hole 117 may also be, for example, a through silicon via, and the through silicon via may be filled with a metal conductive material such as copper or tungsten, so that the second conductive through hole 117 can have a good thermal conductivity. Through the above arrangement, the heat from the chip 201 can be conducted to the second side B of the first circuit board 11 through the second conductive through hole 117, thereby achieving heat dissipation, which is conducive to further improving the heat dissipation efficiency.

[0084] Based on the above structure, the embodiment of the present application does not limit the arrangement of the ground pins 2013 and the power pins 2015 in the chip 201. For example, multiple ground pins 2013 can be arranged in a row, and the chip 201 can include multiple adjacent rows of ground pins 2013. Through the above arrangement, the positions of the ground pins 2013 are relatively compact, which can avoid short circuits between the ground pins 2013 and the power pins 2015 when multiple second conductive through holes 117 are arranged.

[0085] In some embodiments, the first conductive via 115 and the second conductive via 117 can be manufactured simultaneously, and the conductive material filled in the first conductive via 115 and the second conductive via 117 is the same, which is beneficial to improving the manufacturing efficiency of the first circuit board 11 .

[0086] In the embodiments of the present application, Figure 7 As shown, the first circuit board 11 includes the first conductive via 115 and the second conductive via 117. Figure 1 Of course, in some embodiments, the embodiment in which the first circuit board 11 includes the first conductive via 115 and the second conductive via 117 can also be combined with Figure 3 , Figure 4 , Figure 5 or Figure 6 Combined with the embodiments in .

[0087] Fig.11 A cross-sectional view of another circuit board assembly 1 provided in an embodiment of the present application; Fig.12 for Fig.11 A partial enlarged view of a circuit board assembly 1 at N2 in FIG. Fig.11 and Fig.12 In some embodiments, the first circuit board 11 may include a conductive column 119 , which may penetrate the first circuit board 11 , and the conductive column 119 is connected to at least one solder ball 202 of the chip structure 20 , and the conductive column 119 is directly opposite to at least one ground pin 2013 of the chip 201 in the chip structure 20 .

[0088] In some examples, the conductive pillar 119 may be formed by connecting a plurality of first conductive vias 115 and a plurality of second conductive vias 117 together. Fig.10As shown, it can be understood that as the number of second conductive through holes 117 between two adjacent first conductive through holes 115 increases, the distance between the conductive through holes decreases until the conductive through holes contact each other, so that the plurality of first conductive through holes 115 and the plurality of second conductive through holes 117 together constitute the conductive column 119. Alternatively, in some other examples, the conductive column 119 can also be directly prepared on the first circuit board 11. For example, a through hole can be provided in the first circuit board 11, and a metal conductive material can be filled in the through hole to directly form the conductive column 119. Accordingly, the material of the conductive column 119 can include metal conductive materials such as copper and tungsten, so that the conductive column 119 can have a good thermal conductivity.

[0089] Through the above arrangement, the heat from the chip 201 can be conducted to the second side B of the first circuit board 11 through the conductive pillars 119, thereby achieving heat dissipation, which is beneficial to further improve the heat dissipation efficiency.

[0090] In the embodiments of the present application, Fig.11 As shown, the first circuit board 11 includes the conductive column 119 in the embodiment of Figure 1 Of course, in some embodiments, the first circuit board 11 includes the conductive column 119, which can also be combined with Figure 3 , Figure 4 , Figure 5 or Figure 6 Combined with the embodiments in .

[0091] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly, It is characterized in that include: A first circuit board including a first surface and a second surface opposite to each other; A chip structure, wherein the chip structure is mounted on the first surface of the first circuit board; A heat-conducting structure, located on the side where the second surface of the first circuit board is located, and the heat-conducting structure includes a heat-extracting end portion close to the first circuit board; The chip structure includes a plurality of chips, and an orthographic projection of at least one of the chips on the first circuit board at least partially overlaps with an orthographic projection of the heat extraction end on the first circuit board.

2. The circuit board assembly according to claim 1, It is characterized in that The circuit board assembly further includes a cover body, the cover body is located on the side where the second surface of the first circuit board is located, the cover body is connected to the first circuit board, and together they enclose an accommodation space, and the heat extraction end is located in the accommodation space; The circuit board assembly further comprises a heat conductive material, and the heat conductive material is filled in the accommodating space.

3. The circuit board assembly according to claim 2, It is characterized in that The housing includes a second circuit board and a frame board, the frame board is connected between the second circuit board and the first circuit board, and the second circuit board has a through hole passing therethrough; The heat-conducting structure includes a first part and a second part, the first part and the second part are connected, the first part is located on a side of the second circuit board away from the first circuit board, the second part extends into the accommodating space through the through hole, and the second part includes the heat extraction end.

4. The circuit board assembly according to claim 3, It is characterized in that In a plane parallel to the first circuit board, a cross-sectional area of ​​the second portion is smaller than a cross-sectional area of ​​the first portion.

5. The circuit board assembly according to claim 2, It is characterized in that The cover body includes a second circuit board and a frame board, and the frame board is connected between the second circuit board and the first circuit board; the heat-conducting structure is located in the accommodating space, and the heat-conducting structure includes a connecting end close to the second circuit board, and the connecting end is connected to the second circuit board.

6. The circuit board assembly according to claim 5, It is characterized in that In a plane parallel to the first circuit board, the cross-sectional area of ​​the heat extraction end is smaller than the cross-sectional area of ​​the connection end.

7. The circuit board assembly according to claim 2, It is characterized in that The cover body and the heat-conducting structure are an integrated structure, and the heat-conducting structure is located in the accommodating space.

8. The circuit board assembly according to claim 2, It is characterized in that The cover body is an integrated structure, the heat-conducting structure is located in the accommodating space, the heat-conducting structure is connected to the cover body, or the heat-conducting structure is connected to the first circuit board.

9. The circuit board assembly according to any one of claims 3 to 8, It is characterized in that The first circuit board includes a plurality of first conductive through holes, one of the first conductive through holes is connected to a solder ball of the chip structure, and one of the first conductive through holes is directly opposite to a ground pin of the chip in the chip structure.

10. The circuit board assembly according to claim 9, wherein, the first circuit board further includes a second conductive through hole, and at least one of the second conductive through holes is located between two adjacent first conductive through holes.

11. The circuit board assembly according to any one of claims 3-8, wherein, the first circuit board includes conductive posts, the conductive posts penetrate through the first circuit board, the conductive posts are connected to at least one solder ball of the chip structure, and the conductive posts are aligned with at least one ground pin of the chip within the chip structure.

12. The circuit board assembly according to any one of claims 1-11, wherein, the chip structure includes a first chip layer and a second chip layer stacked, the first chip layer is located between the first circuit board and the second chip layer, and at least a part of the orthographic projection of at least one of the chips in the first chip layer on the first circuit board overlaps with the orthographic projection of the heat extraction end on the first circuit board; the circuit board assembly further includes a heat dissipation device, the heat dissipation device is located on a side of the chip structure away from the first circuit board and is connected to the second chip layer.

13. An electronic device, wherein, it includes the circuit board assembly according to any one of claims 1-12 above.

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