High-power high-integration ceramic tube shell

Abstract

The invention relates to the technical field of microelectronic packaging ceramics, in particular to a high-power and high-integration ceramic tube shell which comprises a ceramic outer shell, a plurality of cavities are formed in the ceramic outer shell, metal cover plates are arranged at the tops of the cavities, and heat sinks are arranged at the bottoms of the cavities; the temperature detection assembly is used for detecting the temperature in each chamber; the air cooling assembly comprises cooling fins, a rotating mechanism and an airflow mechanism; the liquid cooling assembly comprises a cooling liquid storage box, a main cooling pipe, a butt joint mechanism and a pumping mechanism; the switching assembly comprises a communicating mechanism and a heat dissipation pipe; according to the invention, the ceramic tube shell is cooled at different temperatures through the air cooling assembly and the liquid cooling assembly, and when the temperature continues to rise, the ceramic tube shell is cooled through the air cooling assembly and the cooling liquid of the liquid cooling assembly is additionally cooled through the air cooling assembly, so that the temperature of the cooling liquid can be further reduced; therefore, the heat dissipation efficiency of the whole system is improved.

Description

Technical Field

[0001] The invention relates to the technical field of microelectronic packaging ceramics, in particular to a high-power and highly integrated ceramic tube shell. Background Art

[0002] With the rapid development of wireless communication technology, the demand for RF front-end modules is increasing, which also poses higher challenges to the miniaturization and high integration of front-end modules. In order to integrate more functions within limited weight and space, multiple single-function or multi-function devices are usually packaged together to form a RF system-in-package (SIP). As power continues to increase, high-integration SIP also means a greater heat dissipation risk, especially when multiple high-power devices are working at the same time, the heat dissipation problem will become more prominent, and may even cause the RF SIP to fail to work properly. Summary of the invention

[0003] The object of the present invention is to provide a high-power and highly integrated ceramic tube package to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions: A high-power, highly integrated ceramic tube shell, comprising: A ceramic housing, wherein the ceramic housing is provided with a plurality of chambers, a metal cover is provided on the top of the chamber, and a heat sink is provided on the bottom of the chamber; A temperature detection component, wherein the temperature detection component is used to detect the temperature in each chamber; An air cooling component, the air cooling component includes a heat sink, a rotating mechanism and an air flow mechanism, an air duct is opened inside the heat sink, the heat sink is arranged on the heat sink, the rotating mechanism is used to drive the heat sink to rotate so as to adjust the opening and closing of the heat sink, and the air flow mechanism is used to perform air cooling and heat dissipation in the air duct; A liquid cooling assembly, the liquid cooling assembly comprising a cooling liquid storage box, a main cooling pipe, a docking mechanism and a pumping mechanism, the cooling liquid storage box is arranged on the ceramic shell, the main cooling pipe is arranged on the heat sink, the docking mechanism is used to dock the cooling liquid storage box and the main cooling pipe when the heat sink and the ceramic shell are mutually engaged, and the pumping mechanism is arranged on the cooling liquid storage box and is used to pump cooling liquid into the main cooling pipe; The switching component includes a connecting mechanism and a heat dissipation pipe, the heat dissipation pipe is arranged on the heat sink, and the connecting mechanism is used to connect the main cooling pipe and the heat dissipation pipe to dissipate the heat of the coolant through air cooling.

[0005] Preferably, the temperature detection component includes thermistors, the number of the thermistors corresponds to the number of the chambers, and a thermistor is correspondingly arranged in each of the chambers.

[0006] Preferably, a plurality of heat sinks are provided, and the plurality of heat sinks are connected to each other via a connecting rod, and the rotating mechanism drives the heat sink to rotate by driving the connecting rod to rotate.

[0007] Preferably, the rotating mechanism includes a driving push rod, a transmission rack and a transmission gear. The driving push rod is arranged on the heat sink and is used to drive the transmission rack to move. The transmission rack and the transmission gear are meshed with each other. The transmission gear is coaxially connected to the connecting rod. Therefore, when the driving push rod drives the transmission rack to move, the heat sink will be driven to move through the transmission of the transmission gear.

[0008] Preferably, the airflow mechanism comprises a DC fan, which is disposed in the ceramic housing, an air outlet of the DC fan and the air duct correspond to each other, and the DC fan is used for air cooling and heat dissipation in the air duct.

[0009] Preferably, the docking mechanism includes a docking push rod, a telescopic tube, a docking magnetic block 1, a docking magnetic block 2 and an opening valve, the docking push rod is connected to the coolant storage box, the telescopic tube is arranged inside the docking push rod, and when the docking push rod is extended or retracted, the telescopic tube will be driven to extend or retract, the docking magnetic block 1 is fixedly connected to the telescopic end of the docking push rod, the opening valve is connected to the telescopic tube, the docking magnetic block 1 and the opening valve are connected to each other, the docking magnetic block 2 is connected to the main cooling pipe, and when the docking push rod drives the docking magnetic block 1 and the docking magnetic block 2 to adsorb each other, the opening valve will open and thereby connect the telescopic tube and the main cooling pipe to each other.

[0010] Preferably, the pumping mechanism comprises a circulation pump, which is disposed in the coolant storage box, wherein an output end of the circulation pump is connected to the telescopic tube, and the circulation pump is used to pump the coolant into the main cooling tube.

[0011] Preferably, the connecting mechanism includes a three-way valve, a connecting hose, an electromagnetic sealing ring, a magnetic sealing ring and a connecting valve, the main cooling pipe is provided with two three-way valves corresponding to each heat sink, the liquid inlet and liquid outlet of the heat pipe in each heat sink are connected to the corresponding three-way valve, the connecting hose is connected to the three-way valve, the connecting hose is provided with an electromagnetic sealing ring, the magnetic sealing ring is provided on the heat sink, the connecting valve is connected to the liquid inlet and liquid outlet of the heat pipe, the magnetic sealing ring and the connecting valve are connected to each other, and when the electromagnetic sealing ring and the magnetic sealing ring are attracted to each other, the coolant in the main cooling pipe is input into the heat pipe by adjusting the three-way valve.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: when the present invention is in use, the ceramic tube shell is cooled at different temperatures by the air cooling component and the liquid cooling component, and as the temperature continues to rise, the ceramic tube shell is cooled by the air cooling component while the coolant of the liquid cooling component is additionally cooled by the air cooling component, so that the temperature of the coolant can be further reduced, thereby improving the heat dissipation efficiency of the entire system, and the stability and reliability of the system can be effectively maintained by the combination of air cooling and liquid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the axial structure of the present invention; Figure 2 It is a front view cross-sectional structural schematic diagram of the present invention; Figure 3 for Figure 2 A schematic diagram of the partial enlarged structure of the middle A area; Figure 4 for Figure 2 A schematic diagram of the partial enlarged structure of the middle B area; Figure 5 It is a schematic diagram of the connection structure between the ceramic housing and the heat sink of the present invention; Figure 6 This is a schematic diagram of the structure of the ceramic housing of the present invention; Figure 7 This is a schematic diagram of the heat sink of the present invention in an unopened state; Figure 8 This is a schematic diagram of the heat sink of the present invention in an open state; Fig. 9 It is a schematic diagram of the connection structure of the heat sink and the heat sink of the present invention; Fig.10 It is a schematic diagram of the connecting structure of the connecting rod and the heat sink of the present invention; Fig.11 This is a schematic diagram of the connection structure of the driving push rod, the transmission rack and the transmission gear of the present invention; Fig.12 It is a schematic diagram of the connection structure of the connecting mechanism of the present invention.

[0014] In the figure: 1 ceramic shell, 2 metal cover, 3 heat sink, 4 heat sink, 5 coolant storage box, 6 main cooling pipe, 7 heat pipe, 8 thermistor, 9 connecting rod, 10 driving push rod, 11 transmission rack, 12 transmission gear, 13 DC fan, 14 docking push rod, 15 telescopic tube, 16 docking magnetic block 1, 17 docking magnetic block 2, 18 opening valve, 19 circulating pump, 20 three-way valve, 21 connecting hose, 22 electromagnetic sealing ring, 23 magnetic sealing ring, 24 connecting valve, 101 chamber, 301 air duct. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] See also Figure 1-12 , the present invention provides a technical solution: A high-power, highly integrated ceramic tube shell, as shown in the attached manual Figure 1 As shown, including: A ceramic housing 1, wherein the lower surface of the ceramic housing 1 is provided with metallized pads for external connection (in this embodiment, the metallized pads are LGA pads or BGA pad arrays), and the metallized pads are arranged at equal or unequal intervals around or at the bottom of the lower surface of the ceramic housing 1. When the lower surface of the ceramic housing 1 is an LGA pad, the lower surface of the heat sink 3 is flush with the lower surface of the metallized pad; when the lower surface of the ceramic housing 1 is a BGA pad array, the lower surface of the heat sink 3 is flush with the plane of the BGA solder ball, and the BGA solder ball is a high-lead solder ball or a copper column. The ceramic housing 1 is provided with a plurality of chambers 101, a metal cover plate 2 is provided on the top of the chamber 101, and a heat sink 3 is provided on the bottom of the chamber 101, and a heat sink 3 is provided through the metal cover plate 2 and the heat sink 3. Used to seal the chamber 101. In this embodiment, the ceramic housing 1 is a multilayer ceramic structure, each layer is provided with a circuit pattern, and vias are provided between the layers to achieve circuit connection of the devices in each chamber 101. The ceramic housing 1 is made of Al2O3, AlN or Si3N4 material. When in use, it is necessary to ensure that the thermal expansion coefficient of the ceramic housing 1 material is close to the thermal expansion coefficient of semiconductor materials such as GaAs, GaN, Si, etc. The material of the heat sink 3 is MoCU or CuW. As shown in the accompanying drawings of the specification, in this embodiment, the ceramic housing 1 is provided with five chambers 101, the four surrounding chambers 101 are used to place high-power devices, and the middle chamber 101 is used to place low-power or passive devices; A temperature detection component, which is used to detect the temperature in each chamber 101; The air cooling component includes a heat sink 4, a rotating mechanism and an air flow mechanism. An air duct 301 is provided inside the heat sink 3. The heat sink 4 is arranged on the heat sink 3. The rotating mechanism is used to drive the heat sink 4 to rotate so as to adjust the opening and closing of the heat sink 4. The air flow mechanism is used to perform air cooling and heat dissipation in the air duct 301. Liquid cooling assembly, the liquid cooling assembly includes a coolant storage box 5, a main cooling pipe 6, a docking mechanism and a pumping mechanism. The coolant storage box 5 is used to store coolant. In this embodiment, the coolant is pure water or ethylene glycol. The coolant storage box 5 is arranged on the ceramic housing 1, and the main cooling pipe 6 is arranged on the heat sink 3. The docking mechanism is used to dock the coolant storage box 5 and the main cooling pipe 6 when the heat sink 3 and the ceramic housing 1 are mutually engaged. The pumping mechanism is arranged on the coolant storage box 5 and is used to pump the coolant into the main cooling pipe 6; The switching component includes a connecting mechanism and a heat dissipation pipe 7. The heat dissipation pipe 7 is used to transport the coolant. The heat dissipation pipe 7 is arranged on the heat sink 4. The connecting mechanism is used to connect the main cooling pipe 6 and the heat dissipation pipe 7 so as to dissipate the heat of the coolant through air cooling.

[0017] The temperature detection component includes a thermistor 8 , which is used to detect the temperature in the chamber 101 . The number of thermistors 8 corresponds to the number of chambers 101 , and a thermistor 8 is correspondingly arranged in each chamber 101 .

[0018] A plurality of heat sinks 4 are provided, and the plurality of heat sinks 4 are connected to each other through a connecting rod 9 . The heat sink 4 and the connecting rod 9 are fixedly connected, and the rotating mechanism drives the heat sink 4 to rotate by driving the connecting rod 9 to rotate.

[0019] The rotating mechanism includes a driving push rod 10, a transmission rack 11 and a transmission gear 12. The driving push rod 10 is a pneumatic push rod. The driving push rod 10 is arranged inside the heat sink 3 and is used to drive the transmission rack 11 to move. The transmission rack 11 and the transmission gear 12 are meshed with each other. The transmission gear 12 is coaxially connected to the connecting rod 9. Therefore, when the driving push rod 10 drives the transmission rack 11 to move, the transmission through the transmission gear 12 will drive the heat sink 4 to move.

[0020] The airflow mechanism includes a DC fan 13, which is a prior art and can be purchased according to actual conditions when in use. The DC fan 13 is arranged in the ceramic housing 1, and the air outlet of the DC fan 13 and the air duct 301 correspond to each other. The DC fan 13 is used for air cooling and heat dissipation in the air duct 301.

[0021] The docking mechanism includes a docking push rod 14, a telescopic tube 15, a docking magnetic block 16, a docking magnetic block 2 17 and an opening valve 18. One end of the docking push rod 14 is fixedly connected to the coolant storage box 5, and the telescopic tube 15 is arranged inside the docking push rod 14. In the present embodiment, the telescopic tube 15 has a plurality of telescopic joints, and when the docking push rod 14 is telescoped, the telescopic tube 15 is driven to be telescoped. In the present embodiment, the docking magnetic block 16 and the docking magnetic block 2 17 are both annular permanent magnets. The docking magnetic block 16 is fixedly connected to the telescopic end of the docking push rod 14. The opening valve 18 can be actively opened or magnetically opened by electromagnetic control. The opening valve 18 is fixedly connected to one end of the telescopic tube 15. The docking magnetic block 16 and the opening valve 18 are connected to each other. The docking magnetic block 2 17 is connected to the main cooling pipe 6. When the docking push rod 14 drives the docking magnetic block 16 and the docking magnetic block 2 17 to adsorb each other, the opening valve 18 will open and connect the telescopic pipe 15 and the main cooling pipe 6 to each other.

[0022] The pumping mechanism includes a circulating pump 19, which is used to drive the coolant to circulate between the coolant storage box 5 and the main cooling pipe 6. The circulating pump 19 is arranged in the coolant storage box 5, and the output end of the circulating pump 19 is connected to the telescopic tube 15. The circulating pump 19 is used to pump the coolant into the main cooling pipe 6.

[0023] The connecting mechanism includes a three-way valve 20, a connecting hose 21, an electromagnetic sealing ring 22, a magnetic sealing ring 23 and a connecting valve 24. The main cooling pipe 6 is provided with two three-way valves 20 corresponding to each heat sink 4. The three-way valve 20 is an electromagnetic three-way valve 20. When in use, the opening of different passages of the three-way valve 20 is controlled according to the temperature measured by the thermistor 8. The liquid inlet and outlet ends of the heat dissipation pipe 7 in each heat sink 4 are connected to the corresponding three-way valve 20. The connecting hose 21 is connected to the three-way valve 20. The connecting hose 21 is provided with an electromagnetic sealing ring. Ring 22, the electromagnetic sealing ring 22 is provided with an electromagnet. When in use, the electromagnetic sealing ring 22 is energized to make it magnetic, so that the electromagnetic sealing ring 22 and the magnetic sealing ring 23 are connected to each other, the magnetic sealing ring 23 is arranged on one side of the heat sink 4, and the connecting valve 24 is connected to the liquid inlet and outlet ends of the heat dissipation pipe 7. The magnetic sealing ring 23 and the connecting valve 24 are connected to each other. When the electromagnetic sealing ring 22 and the magnetic sealing ring 23 are attracted to each other, the three-way valve 20 is adjusted to input the coolant in the main cooling pipe 6 into the heat dissipation pipe 7.

[0024] Working principle: When in use, the heat sink 3 and the ceramic shell 1 are bonded, and then the components are electrically connected inside the chamber 101, and then the metal cover plate 2 is bonded to the ceramic shell 1, and the temperature in each chamber 101 is detected by the thermistor 8. When the thermistor 8 detects that the temperature in the chamber 101 is higher than the set working temperature, the DC fan 13 will start to cool the heat sink 3; As the temperature rises, the driving push rod 10 drives the transmission rack 11 to move, and the transmission between the transmission rack 11 and the transmission gear 12 drives the transmission gear 12 to move and then drives the heat sink 4 to rotate, thereby enhancing the heat dissipation effect. At this time, the heat sink 3 is cooled only by air cooling; If the temperature continues to rise, the docking push rod 14 will extend and then attract the docking magnetic block 16 and the docking magnetic block 2 17 to each other. After the adsorption is completed, the opening valve 18 will be opened, and the circulation pump 19 will be started to pump the coolant into the main cooling pipe 6 for liquid cooling. At this time, the heat sink 3 is cooled by air cooling and liquid cooling at the same time; If the temperature rises, the driving push rod 10 will drive the heat sink 4 to rotate ninety degrees. At this time, the electromagnetic sealing ring 22 on the connecting hose 21 is energized, so that the electromagnetic sealing ring 22 and the magnetic sealing ring 23 are connected to each other. At this time, the three-way valve 20 is controlled to allow the coolant to be cooled through the heat pipe 7 and then flow back to the coolant storage box 5. At this time, the heat sink 3 is cooled by air cooling and liquid cooling at the same time, and the coolant is cooled by air cooling at the same time, thereby further improving the heat dissipation efficiency.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-power, highly integrated ceramic tube shell, characterized in that: include: A ceramic housing, wherein the ceramic housing is provided with a plurality of chambers, a metal cover is provided on the top of the chamber, and a heat sink is provided on the bottom of the chamber; A temperature detection component, wherein the temperature detection component is used to detect the temperature in each chamber; An air cooling component, the air cooling component includes a heat sink, a rotating mechanism and an air flow mechanism, an air duct is opened inside the heat sink, the heat sink is arranged on the heat sink, the rotating mechanism is used to drive the heat sink to rotate so as to adjust the opening and closing of the heat sink, and the air flow mechanism is used to perform air cooling and heat dissipation in the air duct; A liquid cooling assembly, the liquid cooling assembly comprising a cooling liquid storage box, a main cooling pipe, a docking mechanism and a pumping mechanism, the cooling liquid storage box is arranged on the ceramic shell, the main cooling pipe is arranged on the heat sink, the docking mechanism is used to dock the cooling liquid storage box and the main cooling pipe when the heat sink and the ceramic shell are mutually engaged, and the pumping mechanism is arranged on the cooling liquid storage box and is used to pump cooling liquid into the main cooling pipe; The switching component includes a connecting mechanism and a heat dissipation pipe, the heat dissipation pipe is arranged on the heat sink, and the connecting mechanism is used to connect the main cooling pipe and the heat dissipation pipe to dissipate the heat of the coolant through air cooling.

2. The high-power, highly integrated ceramic tube shell according to claim 1, characterized in that: The temperature detection component includes thermistors, the number of the thermistors corresponds to the number of the chambers, and a thermistor is correspondingly arranged in each chamber.

3. The high-power, highly integrated ceramic tube shell according to claim 2, characterized in that: A plurality of heat sinks are provided, and the plurality of heat sinks are connected to each other through a connecting rod. The rotating mechanism drives the heat sink to rotate by driving the connecting rod to rotate.

4. The high-power, highly integrated ceramic tube shell according to claim 3, characterized in that: The rotating mechanism includes a driving push rod, a transmission rack and a transmission gear. The driving push rod is arranged on the heat sink and is used to drive the transmission rack to move. The transmission rack and the transmission gear are meshed with each other. The transmission gear is coaxially connected to the connecting rod. Therefore, when the driving push rod drives the transmission rack to move, the heat sink will be driven to move through the transmission of the transmission gear.

5. The high-power, highly integrated ceramic tube shell according to claim 1, characterized in that: The airflow mechanism comprises a DC fan, which is arranged in the ceramic housing, an air outlet of the DC fan and the air duct correspond to each other, and the DC fan is used for air cooling and heat dissipation in the air duct.

6. The high-power, highly integrated ceramic tube shell according to claim 1, characterized in that: The docking mechanism includes a docking push rod, a telescopic tube, a docking magnetic block 1, a docking magnetic block 2 and an opening valve, the docking push rod is connected to the coolant storage box, the telescopic tube is arranged inside the docking push rod, and when the docking push rod is extended or retracted, the telescopic tube will be driven to extend or retract, the docking magnetic block 1 is fixedly connected to the telescopic end of the docking push rod, the opening valve is connected to the telescopic tube, the docking magnetic block 1 and the opening valve are connected to each other, the docking magnetic block 2 is connected to the main cooling pipe, and when the docking push rod drives the docking magnetic block 1 and the docking magnetic block 2 to adsorb each other, the opening valve will open and connect the telescopic tube and the main cooling pipe to each other.

7. The high-power, highly integrated ceramic tube shell according to claim 6, characterized in that: The pumping mechanism comprises a circulation pump, which is arranged in the coolant storage box. The output end of the circulation pump is connected to the telescopic tube, and the circulation pump is used to pump the coolant into the main cooling tube.

8. The high-power, highly integrated ceramic tube shell according to claim 1, characterized in that: The connecting mechanism includes a three-way valve, a connecting hose, an electromagnetic sealing ring, a magnetic sealing ring and a connecting valve. The main cooling pipe is provided with two three-way valves corresponding to each heat sink. The liquid inlet and liquid outlet of the heat sink in each heat sink are connected to the corresponding three-way valve. The connecting hose is connected to the three-way valve. The connecting hose is provided with an electromagnetic sealing ring. The magnetic sealing ring is provided on the heat sink. The connecting valve is connected to the liquid inlet and liquid outlet of the heat sink. The magnetic sealing ring and the connecting valve are connected to each other. When the electromagnetic sealing ring and the magnetic sealing ring are attracted to each other, the coolant in the main cooling pipe is input into the heat sink by adjusting the three-way valve.

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