Fingerprint identification chip and module, preparation method and electronic equipment

Abstract

The invention relates to a fingerprint identification chip, a fingerprint identification module, a preparation method and electronic equipment. The fingerprint identification chip comprises a chip substrate and a conductive connection part, the chip base body comprises a stacked multi-layer structure, the multi-layer structure comprises a substrate, a circuit layer and a protective layer, the circuit layer is located above the substrate, and the protective layer is located above the circuit layer; the protective layer is provided with an opening to expose the circuit layer, the conductive connecting part is electrically connected with the circuit layer, and at least part of the conductive connecting part protrudes out of the protective layer and is used for being connected with and electrically conducted with a circuit board. According to the fingerprint identification chip, at least part of the conductive connecting part protrudes out of the protective layer, so that the circuit board and the conductive connecting part can be in direct contact connection, gold threads and protective glue structures do not need to be arranged, a convex local tip structure cannot be formed, the screen cannot be damaged when the screen is pressed or falls off, and the fingerprint identification chip is convenient to use. The screen can be protected.

Description

Technical Field

[0001] The present disclosure relates to the field of fingerprint recognition technology, and in particular, to a fingerprint recognition chip and module, a preparation method, and an electronic device. Background Art

[0002] In the related art, the electrical connection between the fingerprint recognition chip and the circuit board is made through gold wire. In order to protect the gold wire, a protective glue is covered on the gold wire, thereby forming a locally raised tip structure. However, when the fingerprint recognition chip is located under the screen, the gold wire and the protective glue are raised structures and are close to the screen. When the screen is pressed, the gold wire and the protective glue may damage the screen. Summary of the invention

[0003] The purpose of the present disclosure is to provide a fingerprint recognition chip and module, a preparation method, and an electronic device to solve the problems in the above-mentioned related technologies.

[0004] In order to achieve the above-mentioned object, the present disclosure provides a fingerprint recognition chip, including a chip substrate and a conductive connection part;

[0005] The chip substrate comprises a stacked multi-layer structure, wherein the multi-layer structure comprises a substrate, a circuit layer and a protective layer, wherein the circuit layer is located above the substrate, and the protective layer is located above the circuit layer;

[0006] The protective layer is provided with an opening to expose the circuit layer, the conductive connection portion is electrically connected to the circuit layer, and at least a portion of the conductive connection portion protrudes from the protective layer and is used to be connected to the circuit board and electrically conductive.

[0007] Optionally, the conductive connection part includes a first connection part and a second connection part connected to each other, a mounting groove is opened on the circuit layer, the mounting groove is connected to the opening, the first connection part is connected to the mounting groove, at least part of the second connection part protrudes from the protective layer, and the part of the second connection part protruding from the protective layer is used to connect to the circuit board and be electrically conductive.

[0008] Optionally, the second connecting portion includes a first part and a second part, the first part is connected to the opening and connected to the first connecting portion, one end of the first part facing away from the bottom of the mounting groove protrudes from the opening and is connected to the second part, and the second part is located outside the opening and covers a portion of the surface of the protective layer.

[0009] Optionally, the first part is configured as a block structure, the second part is configured as a plate structure, and the second part covers the opening.

[0010] Optionally, in the first direction, the thickness of the second part is smaller than the thickness of the first part, and in the second direction, the length of the second part is larger than the length of the first part, the length of the opening, and the length of the first connecting portion;

[0011] The first direction is set as the thickness direction of the chip substrate, and the second direction is set as the length direction or the width direction of the chip substrate.

[0012] Optionally, in the first direction, a thickness of the second portion is less than or equal to 10 μm.

[0013] Optionally, the conductive connection portion further includes a conductive layer, and the conductive layer is sandwiched between the first connection portion and the second connection portion.

[0014] Optionally, a portion of the second connecting portion protruding from the opening covers a portion of the surface of the protective layer, and the conductive layer is arranged between the second connecting portion and the protective layer.

[0015] The second aspect of the present disclosure further provides a fingerprint recognition module, comprising a circuit board and the above-mentioned fingerprint recognition chip, wherein the circuit board is bonded to a portion of the conductive connection portion of the fingerprint recognition chip protruding from the protective layer of the chip substrate.

[0016] Optionally, the circuit board is located above the chip substrate, and in a first direction, a projection of the circuit board at least partially overlaps with a projection of the chip substrate.

[0017] Optionally, the fingerprint recognition module further includes a conductive adhesive, and the conductive adhesive is clamped between the circuit board and a portion of the conductive connecting portion protruding from the protective layer.

[0018] Optionally, the fingerprint recognition module further includes a sealing portion, and the sealing portion is coated on a connection between the circuit board and the conductive connecting portion.

[0019] Optionally, the circuit layer of the chip substrate includes a light collection layer; or,

[0020] The circuit layer of the chip substrate includes an ultrasonic transmitting and receiving layer.

[0021] Optionally, the fingerprint recognition module is configured as an optical fingerprint recognition module or an ultrasonic fingerprint recognition module.

[0022] The third aspect of the present disclosure further provides a method for preparing a fingerprint recognition module, the method comprising:

[0023] Overlaying at least a portion of the circuit board on the protective layer of the chip substrate of the fingerprint recognition chip;

[0024] A portion of the circuit board is attached to a portion of the conductive connection portion on the chip substrate protruding from the protective layer and electrically connected.

[0025] Optionally, the step of attaching a portion of the circuit board to a portion of the conductive connection portion on the chip substrate protruding from the protective layer and electrically connecting the portion includes:

[0026] Covering the conductive connection portion protruding from the protective layer with conductive glue;

[0027] Part of the circuit board is attached to the conductive adhesive and hot pressed.

[0028] Optionally, the conductive adhesive is anisotropic conductive adhesive.

[0029] A fourth aspect of the present disclosure further provides a method for preparing a fingerprint recognition chip, the method comprising:

[0030] The substrate, the circuit layer and the protective layer are stacked in sequence;

[0031] Opening the protective layer to expose the circuit layer;

[0032] The opening is covered with a conductive material, and the conductive material protrudes from the opening to form a conductive connection portion, thereby obtaining the fingerprint recognition chip.

[0033] Optionally, the covering the opening with a conductive material, wherein the conductive material protrudes from the opening to form a conductive connection portion, comprises:

[0034] Covering the opening with a first conductive material to form a first connecting portion;

[0035] forming a conductive layer on a portion of the surface of the protective layer and a surface of the first connecting portion;

[0036] A second conductive material is covered on the conductive layer to form the second connecting portion.

[0037] Optionally, the covering the conductive layer with a second conductive material to form the second connecting portion includes:

[0038] Coating a photoresist on a portion of the surface of the protective layer and the conductive layer to form a covering layer;

[0039] Peeling off a portion of the cover layer to expose the conductive layer, so as to form a processing opening;

[0040] Covering the processing opening with a second conductive material to form a metal layer;

[0041] The covering layer and the conductive layer located outside the processing opening are peeled off to form the second connecting portion.

[0042] Optionally, covering the processing opening with a second conductive material to form a metal layer comprises:

[0043] Electroplating a second conductive material at the processing opening to fill the processing opening and protrude from the processing opening;

[0044] The second conductive material and the cover layer are polished to form the metal layer.

[0045] The fifth aspect of the present disclosure also provides an electronic device, comprising the above-mentioned fingerprint recognition chip, or the above-mentioned fingerprint recognition module, or a fingerprint recognition module prepared by the above-mentioned fingerprint recognition module preparation method, or a fingerprint recognition chip prepared by the above-mentioned fingerprint recognition chip preparation method.

[0046] The above technical solution makes at least part of the conductive connection part protrude from the protective layer, so that the circuit board and the conductive connection part can be directly contacted and connected. Therefore, the conductive connection part of the fingerprint recognition chip achieves two functions, which is used to achieve structural connection and electrical connection with the circuit board, and can simplify the overall structure of the fingerprint recognition module and reduce the thickness of the fingerprint recognition module.

[0047] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0049] Figure 1 is a schematic structural diagram of a fingerprint recognition chip according to an embodiment of the present disclosure;

[0050] Figure 2 is a schematic structural diagram of a fingerprint recognition module according to an embodiment of the present disclosure;

[0051] Figure 3 It is a schematic diagram of a process for preparing a fingerprint recognition module according to an embodiment of the present disclosure;

[0052] Figure 4 When it is a step of a method for preparing a fingerprint recognition module according to an embodiment of the present disclosure, a schematic diagram of the structure of the fingerprint recognition module;

[0053] Figure 5 When it is another step of the method for preparing a fingerprint recognition module according to an embodiment of the present disclosure, a schematic structural diagram of the fingerprint recognition module;

[0054] Figure 6 It is a schematic flow chart of a method for preparing a fingerprint recognition chip according to an embodiment of the present disclosure;

[0055] Figure 7 A schematic diagram of the structure of a fingerprint recognition chip when it is a step of a method for preparing a fingerprint recognition chip according to an embodiment of the present disclosure;

[0056] Figure 8 It is a structural schematic diagram of a fingerprint recognition chip when the first connection portion of the method for preparing a fingerprint recognition chip according to an embodiment of the present disclosure is formed;

[0057] Fig. 9 It is a structural schematic diagram of a fingerprint recognition chip when a conductive layer is formed in a method for preparing a fingerprint recognition chip according to an embodiment of the present disclosure;

[0058] Fig.10 It is a structural schematic diagram of a fingerprint recognition chip when a processing opening is provided on a cover layer of a method for preparing a fingerprint recognition chip according to an embodiment of the present disclosure;

[0059] Fig.11 It is a structural schematic diagram of a fingerprint recognition chip when the second conductive material is covered in a method for preparing a fingerprint recognition chip according to an embodiment of the present disclosure;

[0060] Fig.12 It is a schematic structural diagram of a fingerprint recognition chip when the method for preparing the fingerprint recognition chip according to an embodiment of the present disclosure is completed.

[0061] Description of Reference Numerals

[0062] 1. Chip substrate, 2. Conductive connecting part, 21. First connecting part, 22. Second connecting part, 221. First part, 222. Second part, 3. Mounting groove, 4. Circuit board, 5. Conductive layer, 6. Conductive adhesive, 7. Sealing part, 8. Covering layer. DETAILED DESCRIPTION

[0063] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0064] In the present disclosure, unless otherwise stated, directional words such as "upper, lower, left, right" are usually defined by the direction of the drawing, and "inner" and "outer" refer to the inside and outside of the relevant parts. In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance.

[0065] In the description of the present disclosure, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0066] With the development of full-screen electronic devices, especially the mobile phone industry, under-screen fingerprint recognition has become the mainstream of the industry.

[0067] In the related art, the electrical connection between the fingerprint recognition chip and the circuit board is made through gold wire. In order to protect the gold wire, a protective glue is covered on the gold wire, thereby forming a locally raised tip structure. However, when the fingerprint recognition chip is located under the screen, the gold wire and the protective glue are raised structures and are close to the screen. When the screen is pressed, the screen will deform slightly, which may come into contact with the gold wire and the protective glue, causing the gold wire and the protective glue to damage the screen.

[0068] For this reason, Figure 1 As shown, one aspect of the present disclosure provides a fingerprint recognition chip, including a chip substrate 1 and a conductive connection part 2.

[0069] The chip substrate 1 includes a stacked multi-layer structure, which includes a substrate, a circuit layer and a protection layer. The circuit layer is located above the substrate, and the protection layer is located above the circuit layer.

[0070] The protective layer is provided with an opening to expose the circuit layer. The conductive connection portion 2 is electrically connected to the circuit layer. At least a portion of the conductive connection portion 2 protrudes from the protective layer and is used to connect to the circuit board 4 and be electrically conductive.

[0071] The conductive connection part 2 may be partially located in the opening and achieve electrical conduction with the circuit layer, so that the conductive connection part 2 can achieve electrical conduction with the circuit board 4 and the circuit layer of the chip substrate 1 .

[0072] Among them, the circuit board 4 and the conductive connecting part 2 can be directly contacted and connected, so that the side of the fingerprint recognition module close to the screen is a flat surface. Since there is no need to set up a gold wire and a protective glue structure, no raised local tip structure will be formed, and the screen will not be damaged when the screen is pressed or dropped, thereby protecting the screen.

[0073] In the above technical solution, by protruding at least part of the conductive connecting part 2 out of the protective layer, the conductive connecting part 2 of the fingerprint recognition chip achieves two functions, which are used to achieve structural connection and electrical connection with the circuit board 4, and can simplify the overall structure of the fingerprint recognition module and reduce the thickness of the fingerprint recognition module.

[0074] Optionally, in some embodiments, the conductive connection portion 2 is located on the side of the chip substrate 1 facing the screen, and the conductive connection portion 2 is directly connected to the circuit board 4, so that the circuit board 4 is at least partially located between the conductive connection portion 2 and the screen, and there is no protruding local structure. Optionally, in other examples, the conductive connection portion 2 may also be located on other surfaces of the chip substrate 1.

[0075] Optionally, in one embodiment of the present disclosure, the conductive connection part 2 includes a first connection part 21 and a second connection part 22 connected to each other, a mounting groove 3 is provided on the circuit layer, the mounting groove 3 is connected to the opening, the first connection part 21 is connected to the mounting groove 3, at least part of the second connection part 22 protrudes from the protective layer, and the part of the second connection part 22 protruding from the protective layer is used to connect to the circuit board 4 and be electrically conductive. By splitting the conductive connection part 2 into two parts, it is convenient to process and manufacture, and the connection strength with the circuit layer of the chip substrate 1 and the connection strength with the circuit board 4 can be guaranteed. At the same time, the mounting groove 3 is provided on the circuit layer, which can facilitate the accommodation of the first connection part 21.

[0076] Among them, the first connection part 21 can be connected to the circuit layer in the installation groove 3 to maintain the connection strength and realize electrical connection at the same time, and the second connection part 22 is connected to the first connection part 21, and then connected to the circuit board 4 through the second connection part 22 to realize electrical conduction.

[0077] In some examples, a portion of the second connection portion 22 may protrude from the protective layer, that is, only a portion of the second connection portion 22 may be located outside the protective layer, so that connection with the circuit board 4 can be achieved.

[0078] Optionally, in one embodiment of the present disclosure, the second connection portion 22 includes a first portion 221 and a second portion 222, the first portion 221 is connected to the opening and connected to the first connection portion 21, the end of the first portion 221 away from the bottom of the mounting groove 3 protrudes from the opening and is connected to the second portion 222, and the second portion 222 is located outside the opening and covers a portion of the surface of the protective layer. By arranging the first portion 221 in the opening, the connection strength between the second connection portion 22 and the protective layer can be increased, and the second portion 222 is located entirely outside the opening, which can be conveniently connected to the circuit board, and at the same time, the second portion 222 covers a portion of the surface of the protective layer, so that the second portion 222 is also connected to the protective layer, thereby improving the connection strength between the second connection portion 22 and the protective layer, and ensuring the connection strength and electrical conductivity with the circuit board 4.

[0079] In some examples, one end of the first portion 221 that is away from the bottom of the mounting groove 3 slightly protrudes out of the opening, thereby reducing the thickness of the entire fingerprint recognition module as much as possible.

[0080] Optionally, in one embodiment of the present disclosure, the first part 221 is configured as a block structure, the second part 222 is configured as a plate structure, and the second part 222 covers the opening. By such a configuration, the connection strength between the first part 221 and the opening is high, and the thickness of the second part 222 is reduced as much as possible, while the connection area between the second part 222 and the circuit board 4 is increased to ensure the connection strength.

[0081] Optionally, in one embodiment of the present disclosure, in the first direction, the thickness dimension of the second part 222 is smaller than the thickness dimension of the first part 221, and in the second direction, the length dimension of the second part 222 is greater than the length dimension of the first part 221, the length dimension of the opening, and the length dimension of the first connecting portion 21.

[0082] The first direction is set as the thickness direction of the chip substrate 1, or it may be a direction perpendicular to the screen, and the second direction is set as the length direction or width direction of the chip substrate 1, or it may be a direction parallel to the screen.

[0083] In the first direction, the thickness of the second part 222 is smaller than that of the first part 221. By setting the thickness of the second part 222 to be smaller, the thickness of the entire fingerprint recognition module can be minimized, thereby reducing the thickness of the electronic device and bringing it closer to the screen, thereby improving the recognition success rate.

[0084] In the second direction, that is, the length and width of the second portion 222 are greater than the length and width of the first portion 221, and also greater than the length and width of the opening, and therefore also greater than the length and width of the first connection portion 21. By setting the length and width of the second portion 222 larger, the area of ​​the second portion 222 can be increased, the connection strength with the circuit board 4 can be improved, and at the same time, the high reliability of the conductive particles can be achieved, the electrical connection can be achieved, and the transmission of the electrical signal can be guaranteed.

[0085] Optionally, in an embodiment of the present disclosure, in the first direction, the thickness of the second portion 222 is less than or equal to 10 μm. By setting in this way, the electrical connection effect and the structural connection effect can be ensured while reducing the thickness as much as possible.

[0086] Optionally, in another embodiment of the present disclosure, the second connection portion 22 may be located entirely outside the opening, that is, the first connection portion 21 may fill the mounting groove 3 and the opening, the first connection portion 21 may be flush with the opening or slightly protrude from the opening, and connected to the second connection portion 22. In some examples, the second connection portion 22 may constitute an entire plate-like structure.

[0087] Optionally, in one embodiment of the present disclosure, the conductive connection part 2 further includes a conductive layer 5, and the conductive layer 5 is clamped between the first connection part 21 and the second connection part 22. The conductive layer 5 provided can facilitate the electrical connection between the first connection part 21 and the second connection part 22, thereby ensuring the transmission of the electrical signal, and the conductive layer 5 also plays a role in connecting the first connection part 21 and the second connection part 22. In other words, the first connection part 21 and the second connection part 22 of the conductive connection part 2 are designed in a split type and manufactured in two times, which can be easily processed, and the structural form of the second connection part 22 is controlled, so as to facilitate the connection with the circuit board 4.

[0088] Optionally, in another embodiment of the present disclosure, the conductive connection part 2 is an integrated structure, a part of the conductive connection part 2 is located in the installation groove 3 and the opening, and another part is located outside the opening, so there is no need to provide a conductive layer 5.

[0089] Optionally, in an embodiment of the present disclosure, a portion of the second connection portion 22 protruding from the protective layer covers a portion of the surface of the protective layer, and a conductive layer 5 is provided between the second connection portion 22 and the protective layer.

[0090] Among them, the first part 221 of the second connecting part 22 is located in the opening, the second part 222 of the second connecting part 22 covers part of the surface of the protective layer, and a conductive layer 5 is arranged between the second part 222 and the surface of the protective layer, so that the second part 222 can be electrically connected to the first connecting part 21 through the conductive layer 5, thereby improving the electrical conductivity performance.

[0091] like Figure 2 As shown, the second aspect of the present disclosure further provides a fingerprint recognition module, including a circuit board 4 and the above-mentioned fingerprint recognition chip, and the circuit board 4 is bonded to the part of the conductive connection part 2 of the fingerprint recognition chip protruding from the protective layer.

[0092] Optionally, in one embodiment of the present disclosure, the circuit board 4 is located above the chip substrate 1, and in the first direction, the projection of the circuit board 4 at least partially overlaps with the projection of the chip substrate 1. By such an arrangement, the circuit board 4 and the chip substrate 1 are in a stacked arrangement, and there is no need to set up structures such as gold wires for connection, which can reduce the thickness of the fingerprint recognition module and avoid the formation of a raised structure to damage the screen.

[0093] Optionally, in one embodiment of the present disclosure, the fingerprint recognition module further includes a conductive adhesive 6, which is clamped between the circuit board 4 and the portion of the conductive connection portion 2 protruding from the protective layer. The conductive adhesive 6 is evenly distributed between the circuit board 4 and the conductive connection portion 2 to ensure the connection stability between the two, and the conductive adhesive 6 can achieve electrical conduction.

[0094] In some examples, the conductive adhesive 6 may be anisotropic conductive adhesive 6, which is fixed by hot pressing.

[0095] Optionally, in one embodiment of the present disclosure, the fingerprint recognition module further includes a sealing portion 7, and the sealing portion 7 is coated on the connection between the circuit board 4 and the conductive connection portion 2. The sealing portion 7 can seal the connection between the circuit board 4 and the conductive connection portion 2, and can also provide a protective effect to improve the connection between the circuit board 4 and the conductive connection portion 2.

[0096] In some examples, the sealing portion 7 is connected to a portion of the circuit board 4 , a portion of the second connection portion 22 of the conductive connection portion 2 , and a circumferential side edge of the conductive adhesive 6 to form a covering effect.

[0097] Optionally, in one embodiment of the present disclosure, the circuit layer of the chip substrate 1 includes a light collection layer. That is, the chip substrate 1 is an optical fingerprint chip substrate 1. The optical fingerprint chip substrate 1 refers to the use of optical principles for fingerprint recognition, and the circuit board 4 is still connected to the conductive connection part 2.

[0098] Optionally, in another embodiment of the present disclosure, the circuit layer of the chip substrate 1 includes an ultrasonic transmitting and receiving layer. That is, the chip substrate 1 is an ultrasonic fingerprint chip substrate 1. The ultrasonic fingerprint chip substrate 1 refers to the use of ultrasonic principles for fingerprint recognition, and the circuit board 4 is still connected to the conductive connection part 2.

[0099] Therefore, the fingerprint recognition module can be an optical fingerprint recognition module or an ultrasonic fingerprint recognition module. It should be noted that the ultrasonic fingerprint recognition module and the optical fingerprint recognition module mainly have different recognition principles, and the connection form of the circuit board 4 and the chip substrate 1 through the conductive connection part 2 is the same.

[0100] like Figure 3-Figure 5 As shown, the third aspect of the present disclosure further provides a method for preparing a fingerprint recognition module, the preparation method comprising:

[0101] At least a portion of the circuit board 4 is stacked on the protective layer of the chip substrate 1 of the fingerprint identification chip.

[0102] Part of the circuit board 4 is attached to the part of the conductive connection part 2 on the chip substrate 1 protruding from the protective layer and electrically connected.

[0103] The circuit board 4 and the chip substrate 1 are stacked, so that the side of the fingerprint recognition module close to the screen is a flat surface, and there is no need to set the structure of gold wire and protective glue, so that no raised local tip structure is formed, and the screen will not be damaged when pressing the screen or falling, which can protect the screen and reduce the thickness of the fingerprint recognition module. In some examples, the circuit board 4 and the chip substrate 1 are stacked in the first direction, and the circuit board 4 is closer to the screen than the chip substrate 1.

[0104] Optionally, in one embodiment of the present disclosure, attaching a portion of the circuit board 4 to a portion of the conductive connection portion 2 on the chip substrate 1 protruding from the protective layer and electrically connecting the portions includes:

[0105] The conductive connecting portion 2 protruding from the protective layer is covered with a conductive adhesive 6;

[0106] Part of the circuit board 4 is attached to the conductive adhesive 6 and hot pressed.

[0107] Among them, the conductive glue 6 covers the conductive connecting part 2, and after the circuit board 4 is bonded, the conductive glue 6 is squeezed by hot pressing to form an adhesive layer structure. Such a setting can facilitate the connection and fixation between the circuit board 4 and the conductive connecting part 2 and the electrical connection, while further reducing the thickness of the fingerprint recognition module.

[0108] Optionally, in one embodiment of the present disclosure, the conductive adhesive 6 is an anisotropic conductive adhesive. The anisotropic conductive adhesive can achieve high-reliability electrical connection through the conductive particles therein.

[0109] like Figure 6-Figure 12 As shown, the fourth aspect of the present disclosure further provides a method for preparing a fingerprint recognition chip, the preparation method comprising:

[0110] The substrate, the circuit layer and the protective layer are stacked in sequence;

[0111] Opening the protective layer to expose the circuit layer;

[0112] The opening is covered with a conductive material, and the conductive material protrudes from the opening to form a conductive connecting portion 2, thereby obtaining a fingerprint recognition chip.

[0113] When the conductive material covers the opening, the conductive material will partially protrude from the opening, so that the entire conductive material constitutes a conductive connecting portion 2 for connection with the circuit board.

[0114] Optionally, in one embodiment of the present disclosure, the opening is covered with a conductive material, and the conductive material protrudes from the opening to form a conductive connection portion 2, which includes:

[0115] Covering the opening with a first conductive material to form a first connecting portion 21;

[0116] A conductive layer 5 is formed on a portion of the surface of the protective layer and the surface of the first connecting portion 21;

[0117] The second conductive material is coated on the conductive layer 5 to form the second connecting portion 22 .

[0118] Among them, the circuit layer is provided with a mounting groove connected to the opening, and the first conductive material can be formed in the mounting groove of the circuit layer by electroplating, and can be manufactured in a general conventional manner, without too much restriction here. Optionally, the conductive layer 5 can be formed on part of the surface of the protective layer, the side wall of the opening, and the surface of the first connecting portion 21 by sputtering or evaporation.

[0119] Optionally, in an embodiment of the present disclosure, a second conductive material is covered on the conductive layer 5 to form a second connecting portion 22, including:

[0120] Photoresist is coated on a portion of the surface of the protective layer and the conductive layer 5 to form a cover layer 8. In some examples, the photoresist can be coated on a portion of the surface of the protective layer and the conductive layer 5 by spin coating, and other methods can also be used.

[0121] Part of the covering layer 8 is peeled off to expose the conductive layer 5 to form a processed opening. It should be noted that the exposed conductive layer 5 refers to the conductive layer 5 located at the opening and the surface of the protective layer near the opening, and the peeled covering layer 8 is the covering layer 8 near the opening. In the second direction, the length and width of the formed processed opening are larger than the length and width of the opening, so that more conductive material can be covered to increase the area of ​​the second connecting portion 22.

[0122] The processing opening is covered with a second conductive material to form a metal layer.

[0123] The covering layer 8 and the conductive layer 5 outside the processing opening are peeled off to form the second connecting portion 22. After the metal layer is formed, the covering layer 8 outside the processing opening is removed, that is, the covering layer 8 is completely peeled off, and the conductive layer 5 outside the processing opening can also be removed by etching, wherein the conductive layer 5 outside the processing opening refers to the conductive layer 5 not sandwiched between the metal layer and the protective layer.

[0124] Optionally, in one embodiment of the present disclosure, covering the processing opening with a second conductive material to form a metal layer includes:

[0125] The second conductive material is electroplated at the processing opening to fill the processing opening and protrude from the processing opening, wherein the electroplated second conductive material fills the processing opening and protrudes from the processing opening to ensure filling tightness.

[0126] The second conductive material and the cover layer 8 are ground to form a metal layer. It should be noted that the grinding is for grinding the second conductive material and the cover layer 8 at the same time, so as to reduce the thickness and flatness of the second conductive material and the cover layer 8.

[0127] The fifth aspect of the present disclosure also provides an electronic device, including the fingerprint recognition chip as described above, or the fingerprint recognition module as described above, or a fingerprint recognition module prepared by the method for preparing the fingerprint recognition module as described above, or a fingerprint recognition chip prepared by the method for preparing the fingerprint recognition chip as described above. In some examples, the fingerprint recognition chip or the fingerprint recognition module is located between the screen and the middle frame.

[0128] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0129] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0130] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A fingerprint recognition chip, It is characterized in that comprising a chip substrate and a conductive connection portion; The chip substrate comprises a stacked multi-layer structure, wherein the multi-layer structure comprises a substrate, a circuit layer and a protective layer, wherein the circuit layer is located above the substrate, and the protective layer is located above the circuit layer; The protective layer is provided with an opening to expose the circuit layer, the conductive connection portion is electrically connected to the circuit layer, and at least a portion of the conductive connection portion protrudes from the protective layer and is used to be connected to the circuit board and electrically conductive.

2. The fingerprint recognition chip according to claim 1, It is characterized in that The conductive connection part includes a first connection part and a second connection part connected to each other, a mounting groove is opened on the circuit layer, the mounting groove is connected to the opening, the first connection part is connected to the mounting groove, at least part of the second connection part protrudes from the protective layer, and the part of the second connection part protruding from the protective layer is used to connect to the circuit board and be electrically conductive.

3. The fingerprint recognition chip according to claim 2, It is characterized in that The second connecting portion includes a first part and a second part, the first part is connected to the opening and connected to the first connecting portion, one end of the first part facing away from the bottom of the mounting groove protrudes from the opening and is connected to the second part, and the second part is located outside the opening and covers a portion of the surface of the protective layer.

4. The fingerprint recognition chip according to claim 3, It is characterized in that The first part is configured as a block structure, the second part is configured as a plate structure, and the second part covers the opening.

5. The fingerprint recognition chip according to claim 4, It is characterized in that In the first direction, the thickness of the second part is smaller than the thickness of the first part, and in the second direction, the length of the second part is larger than the length of the first part, the length of the opening, and the length of the first connecting portion; The first direction is set as the thickness direction of the chip substrate, and the second direction is set as the length direction or the width direction of the chip substrate.

6. The fingerprint recognition chip according to claim 5, It is characterized in that In the first direction, a thickness of the second portion is less than or equal to 10 μm.

7. The fingerprint recognition chip according to any one of claims 2 to 6, It is characterized in that The conductive connection portion further includes a conductive layer, and the conductive layer is sandwiched between the first connection portion and the second connection portion.

8. The fingerprint recognition chip according to claim 7, It is characterized in that The portion of the second connection portion protruding from the opening covers a portion of the surface of the protection layer, and the conductive layer is arranged between the second connection portion and the protection layer.

9. A fingerprint recognition module, It is characterized in that It comprises a circuit board and a fingerprint recognition chip as claimed in any one of claims 1 to 8, wherein the circuit board is bonded to a portion of the conductive connection portion of the fingerprint recognition chip protruding from a protective layer of a chip substrate.

10. The fingerprint recognition module according to claim 9, It is characterized in that The circuit board is located above the chip substrate, and in a first direction, a projection of the circuit board at least partially overlaps with a projection of the chip substrate.

11. The fingerprint recognition module according to claim 9, It is characterized in that The fingerprint recognition module further includes a conductive adhesive, which is clamped between the circuit board and the portion of the conductive connection portion protruding from the protective layer.

12. The fingerprint recognition module according to claim 9, It is characterized in that The fingerprint recognition module further includes a sealing portion, which is coated at a connection between the circuit board and the conductive connecting portion.

13. The fingerprint recognition module according to claim 9, It is characterized in that The circuit layer of the chip substrate includes a light collection layer; or, The circuit layer of the chip substrate includes an ultrasonic transmitting and receiving layer.

14. The fingerprint recognition module according to any one of claims 9 to 13, It is characterized in that The fingerprint recognition module is configured as an optical fingerprint recognition module or an ultrasonic fingerprint recognition module.

15. A method for preparing a fingerprint recognition module, It is characterized in that The preparation method comprises: Overlaying at least a portion of the circuit board on the protective layer of the chip substrate of the fingerprint recognition chip; A portion of the circuit board is attached to a portion of the conductive connection portion on the chip substrate protruding from the protective layer and electrically connected.

16. The method for preparing the fingerprint recognition module according to claim 15, It is characterized in that The step of attaching a portion of the circuit board to a portion of the conductive connection portion on the chip substrate protruding from the protective layer and electrically connecting the portion includes: Covering the conductive connection portion protruding from the protective layer with conductive glue; Part of the circuit board is attached to the conductive adhesive and hot pressed.

17. The method for preparing the fingerprint recognition module according to claim 16, It is characterized in that The conductive adhesive is anisotropic conductive adhesive.

18. A method for preparing a fingerprint recognition chip, It is characterized in that The preparation method comprises: The substrate, the circuit layer and the protective layer are stacked in sequence; Opening the protective layer to expose the circuit layer; The opening is covered with a conductive material, and the conductive material protrudes from the opening to form a conductive connection portion, thereby obtaining the fingerprint recognition chip.

19. The method for preparing the fingerprint recognition chip according to claim 18, It is characterized in that The step of covering the opening with a conductive material, wherein the conductive material protrudes from the opening to form a conductive connection portion, comprises: Covering the opening with a first conductive material to form a first connecting portion; forming a conductive layer on a portion of the surface of the protective layer and a surface of the first connecting portion; A second conductive material is covered on the conductive layer to form the second connecting portion.

20. The method for preparing the fingerprint recognition chip according to claim 19, It is characterized in that The step of covering the conductive layer with a second conductive material to form the second connecting portion comprises: Coating a photoresist on a portion of the surface of the protective layer and the conductive layer to form a covering layer; Peeling off a portion of the cover layer to expose the conductive layer, so as to form a processing opening; Covering the processing opening with a second conductive material to form a metal layer; The covering layer and the conductive layer located outside the processing opening are peeled off to form the second connecting portion.

21. The method for preparing the fingerprint recognition chip according to claim 20, It is characterized in that The method of covering the processing opening with a second conductive material to form a metal layer comprises: Electroplating a second conductive material at the processing opening to fill the processing opening and protrude from the processing opening; The second conductive material and the cover layer are polished to form the metal layer.

22. An electronic device, It is characterized in that It includes a fingerprint recognition chip as described in any one of claims 1 to 8, or a fingerprint recognition module as described in any one of claims 9 to 14, or a fingerprint recognition module prepared by the preparation method of the fingerprint recognition module as described in any one of claims 15 to 17, or a fingerprint recognition chip prepared by the preparation method of the fingerprint recognition chip as described in any one of claims 18 to 21.

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