UMSB packaging rectifier bridge frame and packaging structure

Abstract

The invention provides a UMSB packaging rectifier bridge frame and a packaging structure, and relates to the technical field of rectifier frames, the UMSB packaging rectifier bridge frame comprises a rectifier bridge packaging bottom plate, a packaging resin limiting frame is integrally arranged at the upper end of the rectifier bridge packaging bottom plate, two limiting frame reserved grooves are formed in the two ends of the packaging resin limiting frame, and the limiting frame reserved grooves are formed in the upper end of the rectifier bridge packaging bottom plate. A packaging upper cover group is arranged above the rectifier bridge packaging bottom plate; the inner wall of the welding piece heat conduction groove makes contact with the upper substrate chip welding piece, heat generated when a circuit works is conducted upwards, the resin heat conduction rod can make better contact with packaged resin, meanwhile, heat absorbed by the resin is conducted, the heat is conducted to the first heat dissipation line and the second heat dissipation line above through the heat conduction line above, and the heat dissipation efficiency is improved. And heat is dissipated in the respective first ventilation opening and the second ventilation opening, so that heat generated inside can be dissipated more directly during packaging.

Description

Technical Field

[0001] The invention relates to the technical field of rectifier frames, in particular to a UMSB packaged rectifier bridge frame and a packaging structure. Background Art

[0002] A bridge rectifier is a bridge structure composed of four rectifier diodes. It uses the unidirectional conductivity of the diode to rectify the alternating current. Since the bridge rectifier's utilization efficiency of the input sine wave is twice as high as that of the half-wave rectification, it is a significant improvement on the diode half-wave rectification. Therefore, it is widely used in circuits that convert alternating current into direct current.

[0003] In the packaging structure of the rectifier, since the internal structure is usually packaged by resin solidification, the internal structure can only be exposed to the external packaging resin, and the resin has poor heat dissipation performance, so the heat dissipation treatment of the internal structure is not enough to meet the heat dissipation requirements of the existing circuit when working. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a UMSB packaged rectifier bridge frame and a packaging structure, which solves the problems raised in the background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a UMSB packaged rectifier bridge frame and packaging structure, including a rectifier bridge packaging base plate, a packaging resin limit frame is integrated on the upper end of the rectifier bridge packaging base plate, two limit frame grooves are provided at both ends of the packaging resin limit frame, and a packaging upper cover group is provided above the rectifier bridge packaging base plate.

[0006] Preferably, a first lower substrate main copper bar and a second lower substrate main copper bar are arranged in each of the limit frame grooves, a pin folding strip is arranged at the outer end of each of the first lower substrate main copper bar and the second lower substrate main copper bar, and a rectifier bridge pin is integrated at the outer end of each of the pin folding strips.

[0007] Preferably, a first lower substrate welding piece is integrally provided at the inner end of the first lower substrate main copper bar, and a second lower substrate welding piece is integrally provided at the inner end of the second lower substrate main copper bar; Each of the first lower substrate welding piece and the second lower substrate welding piece is provided with a lower substrate welding point.

[0008] Preferably, a rectifier chip is arranged above the welding point of the lower substrate, and four chip welding points are arranged on the rectifier chip.

[0009] Preferably, two upper substrate sinking copper bars are arranged in the packaging resin limiting frame, and upper substrate chip welding plates are integrated at both ends of the two upper substrate sinking copper bars, wherein the first upper substrate welding point and the second upper substrate welding point are respectively arranged on the upper substrate chip welding plates at both ends of the upper substrate sinking copper bars.

[0010] Preferably, the outer end of the sinking copper bar on the upper substrate is integrated with a rectifier copper bar upper substrate for fixing before packaging, and the outer end of each rectifier bridge pin is integrated with a rectifier copper bar lower substrate for fixing before packaging.

[0011] Preferably, each of the upper substrate sinking copper strips and the connection between the rectifier copper strip upper substrate and the rectifier bridge pins and the rectifier copper strip lower substrate is provided with a substrate cutting positioning groove.

[0012] Preferably, the package upper cover assembly comprises: an upper cover shell, a first vent, a second vent, an upper cover pin notch, a first vent pipe, a second vent pipe, a first heat dissipation line, and a second heat dissipation line; The upper cover shell has a plurality of first vents on both sides thereof, each of which has a first vent pipe disposed therein, and a plurality of second vents on the other two sides thereof, each of which has a second vent pipe disposed therein; A first heat dissipation line is disposed in each of the first vents, and a second heat dissipation line is disposed in each of the second vents.

[0013] Preferably, the first heat dissipation lines and the second heat dissipation lines are interlaced and integrated with each other, and heat conducting lines are integrated at four intersections.

[0014] Preferably, the lower ends of every two of the heat conducting wires are connected to an upper heat conducting plate, the lower end of each of the upper heat conducting plates is provided with a plurality of resin heat conducting rods, the lower ends of the resin heat conducting rods are provided with an insulating heat conducting plate, and the lower end of each of the insulating heat conducting plates is provided with two welding plate heat conducting grooves.

[0015] The present invention provides a UMSB packaged rectifier bridge frame and packaging structure, which has the following beneficial effects: (1) The present invention firstly welds each rectifier chip to the corresponding first upper substrate welding point, second upper substrate welding point and lower substrate welding point through the rectifier copper bar lower substrate and the rectifier copper bar upper substrate, and first performs preliminary packaging, fixing and curing, and then performs cutting, and then places the rectifier bridge packaging bottom plate accordingly, and then encapsulates the resin in the packaging resin limit frame, and then covers the packaging upper cover assembly and encapsulates the resin again for curing; (2) The present invention connects the upper substrate with the rectifier copper bar upper substrate through the upper substrate sinking copper bar, connects the rectifier bridge pins with the rectifier copper bar lower substrate, and positions the rectifier bridge frame through the substrate cutting positioning groove at the connection between the rectifier copper bar lower substrate and the rectifier copper bar upper substrate; (3) The present invention contacts the upper substrate chip welding plate through the inner wall of the welding plate heat conduction groove, and conducts the heat generated when the circuit is working upward, while the resin heat conduction rod can better contact the encapsulated resin, and at the same time conduct the heat absorbed by the resin, and then conduct the heat from the upper heat conduction wire to the upper first heat dissipation wire and the second heat dissipation wire, and dissipate the heat in the respective first vents and the second vents. While encapsulating, the heat generated inside can be dissipated more directly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of another viewing angle in the present invention; Figure 3 It is a structural schematic diagram of the rectifier bridge frame in the present invention; Figure 4 It is a structural schematic diagram of the rectifier bridge frame in another perspective of the present invention; Figure 5 It is a schematic structural diagram of the lower substrate and the upper substrate of the rectifying copper bar in the present invention; Figure 6 It is a schematic diagram of the enlarged structure of point A in the present invention; Figure 7 It is a structural schematic diagram of the packaging upper cover group in the present invention; Figure 8 It is a structural schematic diagram of another perspective of the packaging upper cover assembly in the present invention; Fig. 9 It is a schematic diagram of the side view structure of the packaging upper cover assembly in the present invention; Fig.10 For the present invention Fig. 9 Schematic diagram of the cross-sectional structure along line aa.

[0017] Among them, 1. Rectifier bridge packaging bottom plate; 2. Packaging resin limit frame; 3. Limit frame groove; 4. Packaging upper cover group; 401. Upper cover shell; 402. First vent; 403. Second vent; 404. Upper cover pin notch; 405. First ventilation pipe; 406. Second ventilation pipe; 407. First heat dissipation line; 408. Second heat dissipation line; 409. Heat conduction line; 410. Upper heat conduction plate; 411. Resin heat conduction rod; 412. Insulation heat conduction plate; 413. Welding sheet heat conduction Groove; 5. The first lower substrate main copper strip; 6. The second lower substrate main copper strip; 7. The pin folding strip; 8. The upper substrate sinking copper strip; 9. The upper substrate chip welding piece; 10. The first upper substrate welding point; 11. The second upper substrate welding point; 12. The first lower substrate welding piece; 13. The second lower substrate welding piece; 14. The rectifier chip; 15. The chip welding point; 16. The lower substrate welding point; 17. The rectifier bridge pin; 18. The rectifier copper strip lower substrate; 19. The rectifier copper strip upper substrate; 20. The substrate cutting positioning groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] like Figure 1 to Figure 2As shown, the embodiment of the present invention provides a UMSB packaged rectifier bridge frame and packaging structure, including a rectifier bridge packaging base plate 1, the upper end of the rectifier bridge packaging base plate 1 is integrally provided with a packaging resin limit frame 2, and two limit frame grooves 3 are provided at both ends of the packaging resin limit frame 2, and a packaging upper cover group 4 is arranged above the rectifier bridge packaging base plate 1, each of the limit frame grooves 3 is provided with a first lower substrate main copper bar 5 and a second lower substrate main copper bar 6, each of the first lower substrate main copper bar 5 and the second lower substrate main copper bar 6 is provided with a pin folding strip 7 at the outer end, and each of the pin folding strips 7 is integrally provided with a rectifier bridge pin 17 at the outer end, and the inner end of the first lower substrate main copper bar 5 is integrally provided with There is a first lower substrate welding piece 12, and a second lower substrate welding piece 13 is integrated at the inner end of the second lower substrate main copper strip 6; each of the first lower substrate welding piece 12 and the second lower substrate welding piece 13 is provided with a lower substrate welding point 16, and a rectifier chip 14 is provided above the lower substrate welding point 16, and four chip welding points 15 are provided on the rectifier chip 14, and two upper substrate sinking copper strips 8 are provided in the packaging resin limit frame 2, and upper substrate chip welding pieces 9 are integrated at both ends of the two upper substrate sinking copper strips 8, wherein the upper substrate chip welding pieces 9 at both ends of the upper substrate sinking copper strips 8 are respectively provided with a first upper substrate welding point 10 and a second upper substrate welding point 11.

[0020] like Figure 3 to Figure 4 As shown, the outer end of the upper substrate sinking copper bar 8 is integrated with a rectifier copper bar upper substrate 19 for fixing before packaging, and the outer end of each rectifier bridge pin 17 is integrated with a rectifier copper bar lower substrate 18 for fixing before packaging, and each connection between the upper substrate sinking copper bar 8 and the rectifier copper bar upper substrate 19 and the rectifier bridge pin 17 and the rectifier copper bar lower substrate 18 is provided with a substrate cutting positioning groove 20.

[0021] In the above technical solution, each rectifier chip 14 is welded to the corresponding first upper substrate welding point 10, second upper substrate welding point 11 and lower substrate welding point 16 through the rectifier copper bar lower substrate 18 and the rectifier copper bar upper substrate 19, and is firstly packaged, fixed and cured, and then cut, and then the rectifier bridge package bottom plate 1 is placed accordingly, and the resin is packaged in the package resin limit frame 2, and the package upper cover group 4 is covered and the resin is packaged and cured again; Among them, the upper substrate sinking copper bar 8 is connected to the rectifier copper bar upper substrate 19, the rectifier bridge pin 17 is connected to the rectifier copper bar lower substrate 18, and is positioned through the substrate cutting positioning groove 20 at the connection between the rectifier copper bar lower substrate 18 and the rectifier copper bar upper substrate 19, so that the rectifier bridge frame can be cut out to form a rectifier bridge frame.

[0022] like Figure 1 , Figures 7 to 10As shown, the packaging upper cover group 4 includes: an upper cover shell 401, a first vent 402, a second vent 403, an upper cover pin notch 404, a first ventilation pipe 405, a second ventilation pipe 406, a first heat dissipation line 407, and a second heat dissipation line 408; the upper cover shell 401 has a plurality of first vents 402 on both sides, and each of the first vents 402 has a first ventilation pipe 405 disposed therein; the upper cover shell 401 has a plurality of second vents 403 on the other two sides, and each of the second vents 403 has a second ventilation pipe 406 disposed therein; each of the first vents A first heat dissipation wire 407 is arranged in each of the second vents 402, and a second heat dissipation wire 408 is arranged in each of the second vents 403. The first heat dissipation wires 407 and the second heat dissipation wires 408 are staggered and integrated with each other, and heat conductive wires 409 are integrated at four intersections. The lower ends of every two of the heat conductive wires 409 are connected to an upper heat conductive plate 410, and a plurality of resin heat conductive rods 411 are arranged at the lower end of each of the upper heat conductive plates 410. An insulating heat conductive plate 412 is arranged at the lower end of the resin heat conductive rods 411, and two welding plate heat conductive grooves 413 are provided at the lower end of each of the insulating heat conductive plates 412.

[0023] In the above technical solution, the inner wall of the welding plate heat conduction groove 413 is in contact with the upper substrate chip welding plate 9, and the heat generated during circuit operation is conducted upward, while the resin heat conduction rod 411 can better contact the packaged resin, and at the same time conduct the heat absorbed by the resin, and then conduct the heat from the upper heat conduction wire 409 to the upper first heat dissipation wire 407 and the second heat dissipation wire 408, and dissipate the heat in the respective first vents 402 and the second vents 403, so that the heat generated inside can be dissipated more directly while being packaged.

[0024] Working principle: The present invention firstly welds each rectifier chip 14 to the corresponding first upper substrate welding point 10, second upper substrate welding point 11 and lower substrate welding point 16 through the rectifier copper bar lower substrate 18 and the rectifier copper bar upper substrate 19, and first performs preliminary packaging, fixing and curing, and then performs cutting, and then places the rectifier bridge packaging bottom plate 1 accordingly, and resin-packages it in the packaging resin limit frame 2, and then covers the packaging upper cover group 4 and resin-packages and cures it again; Among them, the upper substrate sinking copper strip 8 is connected to the rectifier copper strip upper substrate 19, the rectifier bridge pin 17 is connected to the rectifier copper strip lower substrate 18, and the substrate cutting positioning groove 20 at the connection between the rectifier copper strip lower substrate 18 and the rectifier copper strip upper substrate 19 is positioned, so that the rectifier bridge frame can be cut out; Among them, the inner wall of the welding plate heat conduction groove 413 is in contact with the upper substrate chip welding plate 9, and the heat generated when the circuit is working is conducted upward, and the resin heat conduction rod 411 can better contact with the packaged resin, and at the same time conduct the heat absorbed by the resin, and then conduct it from the upper heat conduction wire 409 to the upper first heat dissipation wire 407 and the second heat dissipation wire 408, and dissipate heat in the respective first vents 402 and the second vents 403. While packaging, the heat generated inside can be dissipated more directly.

[0025] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A UMSB packaged rectifier bridge frame and packaging structure, comprising a rectifier bridge packaging base plate (1), characterized in that: The upper end of the rectifier bridge packaging base plate (1) is integrally provided with a packaging resin limiting frame (2), two limiting frame retaining grooves (3) are provided at both ends of the packaging resin limiting frame (2), and a packaging upper cover group (4) is provided above the rectifier bridge packaging base plate (1).

2. A UMSB packaged rectifier bridge frame and packaging structure according to claim 1, characterized in that: A first lower base plate main copper bar (5) and a second lower base plate main copper bar (6) are arranged in each of the limit frame grooves (3); a pin folding bar (7) is arranged at the outer end of each of the first lower base plate main copper bar (5) and the second lower base plate main copper bar (6); and a rectifier bridge pin (17) is integrally arranged at the outer end of each of the pin folding bars (7).

3. A UMSB packaged rectifier bridge frame and packaging structure according to claim 2, characterized in that: A first lower substrate welding piece (12) is integrally provided at the inner end of the first lower substrate main copper bar (5), and a second lower substrate welding piece (13) is integrally provided at the inner end of the second lower substrate main copper bar (6); A lower substrate welding point (16) is provided on each of the first lower substrate welding piece (12) and the second lower substrate welding piece (13).

4. A UMSB packaged rectifier bridge frame and packaging structure according to claim 3, characterized in that: A rectifier chip (14) is arranged above the lower substrate welding point (16), and four chip welding points (15) are arranged on each of the rectifier chips (14).

5. A UMSB packaged rectifier bridge frame and packaging structure according to claim 4, characterized in that: Two upper substrate sinking copper bars (8) are arranged in the packaging resin limiting frame (2), and upper substrate chip welding pieces (9) are integrally arranged at both ends of the two upper substrate sinking copper bars (8), wherein a first upper substrate welding point (10) and a second upper substrate welding point (11) are respectively arranged on the upper substrate chip welding pieces (9) at both ends of the upper substrate sinking copper bars (8).

6. A UMSB packaged rectifier bridge frame and packaging structure according to claim 5, characterized in that: The outer end of the upper substrate sinking copper bar (8) is integrally provided with a rectifying copper bar upper substrate (19) for fixing before packaging, and the outer end of each rectifying bridge pin (17) is integrally provided with a rectifying copper bar lower substrate (18) for fixing before packaging.

7. A UMSB packaged rectifier bridge frame and packaging structure according to claim 6, characterized in that: A substrate cutting positioning groove (20) is provided at each connection point between the upper substrate sinking copper strip (8) and the rectifying copper strip upper substrate (19) and between the rectifying bridge pin (17) and the rectifying copper strip lower substrate (18).

8. A UMSB packaged rectifier bridge frame and packaging structure according to claim 7, characterized in that: The packaging upper cover assembly (4) comprises: an upper cover shell (401), a first ventilation port (402), a second ventilation port (403), an upper cover pin notch (404), a first ventilation pipe (405), a second ventilation pipe (406), a first heat dissipation line (407), and a second heat dissipation line (408); The upper cover shell (401) is provided with a plurality of first ventilation openings (402) on both sides thereof, each of the first ventilation openings (402) being provided with a first ventilation pipe (405) therein, and the upper cover shell (401) is provided with a plurality of second ventilation openings (403) on the other two sides thereof, each of the second ventilation openings (403) being provided with a second ventilation pipe (406) therein; A first heat dissipation line (407) is arranged in each of the first ventilation openings (402), and a second heat dissipation line (408) is arranged in each of the second ventilation openings (403).

9. A UMSB packaged rectifier bridge frame and packaging structure according to claim 8, characterized in that: The first heat dissipation lines (407) and the second heat dissipation lines (408) are arranged in an interlaced and integrated manner, and heat conducting lines (409) are arranged in an integrated manner at four intersections.

10. A UMSB packaged rectifier bridge frame and packaging structure according to claim 9, characterized in that: The lower ends of each two heat-conducting wires (409) are connected to an upper heat-conducting plate (410), the lower end of each upper heat-conducting plate (410) is provided with a plurality of resin heat-conducting rods (411), the lower ends of the resin heat-conducting rods (411) are provided with an insulating heat-conducting plate (412), and the lower end of each insulating heat-conducting plate (412) is provided with two welding plate heat-conducting grooves (413).

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