Plug-in device for testing semiconductor element

Abstract

The invention provides a plug-in device for testing a semiconductor element, which comprises a block body with a longitudinal channel and two elastic latch groups, the two elastic latch groups are transversely arranged in two opposite side walls of the block body respectively, and latch pieces of each elastic latch group form an inclined surface corresponding to a top cutter below. The top cutter can retract into and extend out of the corresponding transverse channel along with upward jacking and downward moving of the top cutter; therefore, since the latch members are limited in the transverse channel to move transversely, when a pressure measuring head is moved upwards, the two latch members positioned above the semiconductor element can effectively separate the semiconductor element adhered to the pressure measuring head due to moisture and maintain the semiconductor element in the plug-in device.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Taiwan Patent Application No. 112145417 filed on November 23, 2023, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] The present invention relates to a test plug-in device, in particular to a test plug-in device for semiconductor components. Background Art

[0004] After the semiconductor components are packaged, they need to undergo electrical testing, such as Figure 6C As shown in FIG. 6 , a plug-in device 60 is provided for fixing a semiconductor component 71 on a test circuit board 80. Fig. 6A As shown, the plug-in device 60 includes a block 61 and two elastic buckle members 62. A channel 610 is formed through the middle of the block 61. A positioning frame seat 63 extends inward from the bottom surface 611 of the block 61. Two inner wall surfaces 612 of the channel 610 respectively form two concave chambers 613 for the two elastic buckle members 62 to be respectively arranged therein. Each of the elastic buckle members 62 includes a spring 621 and a buckle 622. The spring 621 is uprightly arranged in the corresponding concave chamber 613, and the buckle 622 is pivotally arranged in the corresponding concave chamber 613. The upper part of the buckle 622 is stopped by a push member 623 against one end of the spring 621.

[0005] For example Fig. 6A As shown, when the plug-in device 60 is in use, the plug-in device 60 is placed above a top knife seat 72. The two top knives 73 on the top knife seat 72 are first inserted upward into the two recessed chambers 613 of the plug-in device 60 to respectively push the two buckle rings 622 upward. Each buckle ring 622 is then pivoted outwardly and upwardly away from the positioning frame seat 63. At the same time, the spring 621 is compressed upwardly by the push piece 623, and a semiconductor element 71 is sucked by a vacuum suction nozzle 81. After passing through the channel 610 of the plug-in device 60 from top to bottom to a suitable distance, as shown in FIG. Figure 6B As shown, the vacuum nozzle 81 blows off the semiconductor component 71 on the positioning frame 63 and then moves upward. At this time, the top knife seat 72 moves downward, and the two top knives 73 no longer push the two buckle rings 622. Each buckle ring 622 is pivoted inward and downward by the restoring force of its corresponding compression spring 621, and returns to the top of the positioning frame 63, that is, above the semiconductor component 71. Next, as shown in FIG. Figure 6CAs shown, a pressure probe 70 is passed from top to bottom through the channel 610 of the plug-in device 60 and stops on the semiconductor component 71; the pressure probe 70 continues to press down the semiconductor component 71 so that the semiconductor component 71 contacts the test circuit board 80 for electrical testing; after the electrical test is completed, the pressure probe 70 moves upward, and at this time, the elastic force of the two springs 621 provides a forced interference tension to the two buckle rings 622, and the semiconductor component 71 will be restricted by the two buckle rings 622 above it and remain on the frame 63 of the plug-in device.

[0006] In actual operation, since the ambient temperature of the electrical test environment (about -10 degrees Celsius to -55 degrees Celsius) is lower than the room temperature, the temperature of the pressure probe 70 will drop significantly when it is inserted into the plug-in device, causing moisture to appear on the surface of the pressure probe 70 in contact with the semiconductor element 71. The moisture will cause the metal pressure probe 70 to stick to the surface of the semiconductor element 71. Fig.6D As shown, when the adhesion force is greater than the elastic force of the two springs 621 providing the two buckle rings 622 with a forced interference tension, the pressure probe 70 will be taken away from the semiconductor element 71 when it moves upward, resulting in Fig. 6E As shown, when the pressure probe 70 is to perform pressure testing on a semiconductor component 71a located in another plug-in device 60, the semiconductor component 71 adhered thereto will collide with the two buckle rings 622 buckled on the semiconductor component 71a and be damaged; therefore, in order to ensure that the semiconductor component is not damaged during electrical testing, the plug-in device must be further improved. Summary of the invention

[0007] In view of the structural shortcomings of the above-mentioned existing semiconductor device test insertion device, the main purpose of the present invention is to provide a new semiconductor device test insertion device to improve the structural shortcomings of the above-mentioned prior art.

[0008] The main technical means used to achieve the above purpose is to make the semiconductor component test plug-in device include:

[0009] A body, including:

[0010] a body;

[0011] a longitudinal passage extending through a top surface and a bottom surface of the block;

[0012] two transverse channels, respectively penetrating two opposite side walls of the block and communicating with the longitudinal channel;

[0013] Two top knife openings are formed on the bottom surface of the block corresponding to the two transverse channels and are respectively connected to the two transverse channels; and

[0014] a positioning frame seat extending inwardly from a plurality of inner wall surfaces of the longitudinal channel and close to the bottom surface of the block; and

[0015] Two elastic latch sets are respectively disposed in the two transverse channels of the base body, and each of the elastic latch sets includes:

[0016] a spring, one end of which is fixed in the corresponding transverse channel; and

[0017] A latch is slidably disposed in the corresponding transverse channel and located above the corresponding top knife opening, a rear portion of the latch is fixed to the other end of the spring, and a front portion selectively extends into the longitudinal channel; wherein the front portion forms an inclined surface corresponding to the top knife opening, the top edge of the inclined surface is close to the longitudinal channel, and the bottom edge of the inclined surface is away from the longitudinal channel.

[0018] As can be seen from the above description, the plug-in device of the present invention mainly sets the two elastic latch groups horizontally in the two opposite side walls of the block, and its latch member forms an inclined surface corresponding to the top knife opening, so that when the top knife of the bottom top knife seat pushes against the inclined surface, the latch member retracts into the corresponding transverse channel and compresses the spring; conversely, when the top knife seat moves downward, the restoring force of the compression spring will push the latch member so that the front part extends out of the longitudinal channel; in this way, after the electrical test is completed, the pressure probe is moved upward. Even if the semiconductor component is adhered to the pressure probe due to moisture, the latch member located thereon has been limited in the transverse channel and will not pivot with the upward force of the pressure probe, so that the semiconductor component adhered to the pressure probe can be effectively separated and maintained on the positioning frame.

[0019] In order to further understand the technologies, means and effects adopted by the present application to achieve the intended purpose, please refer to the following detailed description and drawings of the present application. It is believed that the purpose, characteristics and features of the present application can be deeply and specifically understood thereby. However, the drawings are only provided for reference and illustration and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 : A three-dimensional exploded view of the semiconductor component test insertion device of the present invention;

[0021] Figure 2 : A bottom perspective view of the semiconductor component test insertion device of the present invention;

[0022] Figure 3A : A side cross-sectional view of the semiconductor device test plug-in device of the present invention in a latched state;

[0023] Figure 3B : A side cross-sectional view of the semiconductor component test plug-in device of the present invention in an unlocked state;

[0024] Figure 4A: A transverse cross-sectional view of the semiconductor device test plug-in device of the present invention in a latched state;

[0025] Figure 4B : A transverse cross-sectional view of the semiconductor device test plug-in device of the present invention in an unlocked state;

[0026] FIG. 5A to FIG. 5C : A schematic diagram of the operation of the semiconductor component testing plug-in device of the present invention;

[0027] FIG. 6A to FIG. 6E : A schematic diagram of the operation of a semiconductor component test plug-in device in a latched state in the prior art;

[0028] Wherein, the reference numerals are:

[0029] 10: Plug-in device

[0030] 20: base body

[0031] 21: Block

[0032] 211: Top

[0033] 212: Bottom

[0034] 213: Side wall

[0035] 214: Locking Room

[0036] 215:Card slot

[0037] 22: Longitudinal channel

[0038] 23: Horizontal channel

[0039] 24: Top knife opening

[0040] 25: Positioning frame

[0041] 26: Maintenance channel

[0042] 30: Elastic latch set

[0043] 31: Spring

[0044] 32: Latch

[0045] 33: Front

[0046] 331: Inclined surface

[0047] 332: Side slope board

[0048] 34: Rear

[0049] 341: Groove

[0050] 342: First fixed column

[0051] 343: Rear side panel

[0052] 344: Horizontal long groove

[0053] 35:Fixed rod

[0054] 36: Clamping plate

[0055] 361: snap-fit ​​column

[0056] 362: Support plate

[0057] 363: Second fixed column

[0058] 40: Top knife seat

[0059] 41: Top knife

[0060] 50: Pressure probe

[0061] 51:Semiconductor components

[0062] 60: Plug-in device

[0063] 61: Block

[0064] 610: Channel

[0065] 611: Bottom

[0066] 612:Inner wall surface

[0067] 613: Alcove

[0068] 62: Elastic buckle

[0069] 621: Spring

[0070] 622: Buckle

[0071] 613: Alcove

[0072] 63: Positioning frame

[0073] 70: Pressure probe

[0074] 71, 71a: semiconductor components

[0075] 72: Top knife seat

[0076] 80: Test circuit board

[0077] 81: Vacuum nozzle. DETAILED DESCRIPTION

[0078] The following is a combination of drawings and embodiments of the present invention to further explain the technical means adopted by the present invention to achieve the predetermined invention purpose, wherein the drawings have been simplified for illustrative purposes only, and the structure or method invention of the present invention is explained by describing the relationship between the elements and components of the present invention. Therefore, the elements shown in the drawings are not presented in actual quantity, actual shape, actual size and actual proportion, and the size or size proportion has been enlarged or simplified to provide a better description. The actual quantity, actual shape or actual size proportion has been selectively designed and configured, and the detailed element layout may be more complicated.

[0079] The present invention relates to a semiconductor component testing plug-in device, and the technical content of the present invention is described in detail below with reference to the drawings.

[0080] First see Figure 1 As shown, the semiconductor component test insertion device 10 of the present invention comprises a base body 20 and two elastic latch sets 30 ; wherein the two elastic latch sets 30 are laterally embedded in the base body 20 .

[0081] Please refer to Figure 2 and Figure 3A As shown, the seat 20 comprises a block 21, a longitudinal channel 22, two transverse channels 23, two top knife openings 24 and a positioning frame seat 25. The longitudinal channel 22 penetrates a top surface 211 and a bottom surface 212 of the block 21 to form a hollow block, and penetrates two opposite side walls 213 of the hollow block to form two transverse channels 23; the two top knife openings 24 are formed on the bottom surface 212 of the block 21 corresponding to the two transverse channels 23, and are respectively connected to the two transverse channels 23; and the positioning frame seat 25 extends inward from multiple inner wall surfaces of the longitudinal channel 22, and is close to the bottom surface 212 of the block 21, or is flush with the bottom surface 212 of the block 21. In this embodiment, the block 21 is slightly rectangular, and the longitudinal channel 22 is a long rectangular cone with a wide top and a narrow bottom, which can be used to guide the semiconductor element. Therefore, the positioning frame seat 25 is correspondingly a long rectangle; each of the top knife openings 24 is a long rectangle to match Figure 1 The top knife 41 on the top knife seat 40 is shown in a plate shape; however, it is not limited to a long rectangle.

[0082] The two elastic latch groups 30 are respectively disposed in the two transverse channels 23 of the seat body 20, and each of the elastic latch groups 30 includes a spring 31 and a latch member 32; one end of the spring 31 is fixed in the corresponding transverse channel 23, and the latch member 32 is slidably disposed in the corresponding transverse channel 23 and located above the corresponding top knife opening 24, a rear portion 34 of the latch member 32 is fixed to the other end of the spring 31, and a front portion 33 selectively extends into the longitudinal channel 22; wherein the front portion 33 forms an inclined surface 331 corresponding to the top knife opening 24, the top edge of the inclined surface 331 is close to the longitudinal channel 22, and the bottom edge thereof is away from the longitudinal channel 22. In this embodiment, as Figure 1 As shown, the inclined surface 331 of the latch 32 is located in the middle of the front portion 33, and the front portion 33 further extends two side inclined plates 332 forward at two opposite sides of the inclined surface 331, and the inclination direction of each side inclined plate 332 is opposite to the inclination direction of the corresponding inclined surface 331.

[0083] The two opposite side walls 213 of the block 21 are further formed with a locking chamber 214, which is located above the transverse channel 23 on the same side, and two opposite inner sides thereof are respectively formed with two locking grooves 215; and the rear portion 34 of each of the latch members 32 is further recessed with a groove 341 forward to form two opposite rear side plates 343, and a first fixing column 342 is formed backward on the inner wall of the groove 341 for matching and fixing one end of the spring 31, and the two rear side plates 343 are further penetrated to form two transverse long grooves 344. Each of the elastic latching assemblies 30 further comprises a fixing rod 35 and a clamping plate 36; wherein the fixing rod 35 is inserted through the two transverse long slots 344 of the two rear side plates 343 of the rear portion 34, and the two ends of the fixing rod 35 are respectively inserted into the two opposite inner wall surfaces corresponding to the transverse channel 23, so as to restrict the latching member 32 from sliding in a transverse linear manner in the corresponding transverse channel 23. The front side of the clamping plate 36 corresponds to the two clamping grooves 215 of the clamping chamber 214 of the block 21, and two clamping columns 361 are respectively extended forward, so as to be inserted into the clamping chamber 214 and clamped in the corresponding clamping grooves 215, and cover the clamping chamber 214. A supporting plate 362 is extended from a bottom of the clamping plate 36 toward the transverse channel below, and a second fixing column 363 is formed forwardly on the front side of the supporting plate 362 corresponding to the spring 31 in the transverse channel 23, so as to be matched and sleeved and fixed on the other end of the spring 31. In this embodiment, each of the engaging plates 36 is in a T-shape, which is convenient for fingers to hold.

[0084] To facilitate replacement of the spring 31 of the elastic latch assembly 30, Figure 1 and Figure 3AAs shown, the top surface 211 of the block 21 forms two maintenance channels 26 downwardly corresponding to the two engaging chambers 214, and each maintenance channel 26 is connected to the corresponding engaging chamber 214, so that the two engaging posts 361 are exposed. Therefore, a tool is inserted from the maintenance channel 26 to release the engaging state of the two engaging posts 361 and the two engaging grooves 215, and then the engaging plate 36 is pulled out to remove the spring 31 of the elastic latch assembly 30.

[0085] See also Figure 1 , Figure 3A and Figure 4A As shown, the two elastic latch groups 30 of the plug-in device 10 are not lifted upward by the lower top knife seat 40, that is, they are not yet in use. The front portion 33 of the latch member 32 of each elastic latch group 30 extends forward from the corresponding transverse channel 23 to the longitudinal channel 22 and is spaced above the positioning frame seat 25. Figure 3B and Figure 4B As shown, when the top knife 41 of the lower top knife seat 40 penetrates into the corresponding top knife opening 24 and lifts the inclined surface 331 of the front portion 33 of the latch 32 upward, due to the design of the inclined direction of the inclined surface 331, the upward force of the top knife 41 will cause the latch 32 to retract backward into the corresponding transverse channel 23 and compress the spring 31; at this time, as shown in FIG. Figure 4A and Figure 4B As shown, the front portion 33 of the latch 32 is away from the top of the positioning frame seat 25. When the top knife seat 40 moves downward, the restoring force of the compressed spring 31 will push the latch 32 forward, so that the front portion 33 of the latch 32 returns to the top of the positioning frame seat 25.

[0086] When using, Figure 5A As shown, the plug-in device 10 is placed above the top knife seat 40, and its top knife opening 24 is aligned with the top knife 41 of the top knife seat 40, ready to be lifted upward; Figure 5B As shown, after the top knife 41 of the top knife seat 40 is lifted upward, the two latch members 32 are retracted backward to the corresponding transverse channel 23, so that they are no longer completely located above the positioning frame seat 25, so that Figure 5A A vacuum suction nozzle 81 sucks a semiconductor element 51 and aligns it with the longitudinal channel 22, and moves down to an appropriate position, such as Figure 5B As shown, the semiconductor element 51 is blown down, so that the semiconductor element 51 is placed on the positioning frame 25, the vacuum nozzle 81 is moved upward and away, and the top knife seat 40 is moved downward and away, that is, Figure 5C As shown, the two latches 32 extend forward and are positioned on the semiconductor element 51, that is, the vacuum nozzle 81 is moved upward; then, as shown Figure 5CAs shown, a pressure probe 50 is inserted into the longitudinal channel 22 and presses down the semiconductor component 51 to perform an electrical test with the test circuit board 80 below; after the test is completed, the pressure probe 50 moves up, and the semiconductor component 51 is restricted by the two latches 32 and maintained on the positioning frame 25, ensuring that when the pressure probe 50 moves up and leaves the plug-in device 10, the semiconductor component 51 will not be taken away due to moisture adhesion.

[0087] In summary, the plug-in device of the present invention mainly disposes the two elastic latch groups transversely in the two opposite side walls of the block, and the latch member forms an inclined surface corresponding to the top knife opening, so that when the top knife of the bottom top knife seat pushes against the inclined surface, the latch member retracts into the corresponding transverse channel and compresses the spring; conversely, when the top knife seat moves downward, the restoring force of the compression spring will push the latch member so that the front part extends out of the longitudinal channel; in this way, after the electrical test is completed, the pressure probe is moved upward. Even if the semiconductor component is adhered to the pressure probe due to moisture, the latch member located thereon has been limited in the transverse channel and will not pivot with the upward force of the pressure probe, so the semiconductor component adhered to the pressure probe can be effectively separated and maintained on the positioning frame.

[0088] The above description is only an embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as above by the embodiment, it is not used to limit the present invention. Any ordinary technician in the technical field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A semiconductor component testing plug-in device, characterized in that: include: A body, including: a body; a longitudinal passage extending through a top surface and a bottom surface of the block; two transverse channels, respectively penetrating two opposite side walls of the block and communicating with the longitudinal channel; Two top knife openings are formed on the bottom surface of the block corresponding to the two transverse channels and are respectively connected to the two transverse channels; and a positioning frame seat extending inwardly from a plurality of inner wall surfaces of the longitudinal channel and close to the bottom surface of the block; and Two elastic latch sets are respectively disposed in the two transverse channels of the base body, and each of the elastic latch sets includes: a spring, one end of which is fixed in the corresponding transverse channel; and A latch is slidably disposed in the corresponding transverse channel and located above the corresponding top knife opening, a rear portion of the latch is fixed to the other end of the spring, and a front portion selectively extends into the longitudinal channel; wherein the front portion forms an inclined surface corresponding to the top knife opening, the top edge of the inclined surface is close to the longitudinal channel, and the bottom edge of the inclined surface is away from the longitudinal channel.

2. The semiconductor device test insertion device according to claim 1, wherein: The front portion further extends two side inclined plates forward at two opposite sides of the inclined surface, and the inclined direction of each side inclined plate is opposite to the inclined direction of the corresponding inclined surface.

3. The semiconductor device test insertion device according to claim 1, wherein: The rear portion of each latch member is further concavely formed with a groove to form two opposite rear side plates, and the two rear side plates are further penetrated to form two transverse long grooves; and Each of the elastic latch assemblies further comprises a fixing rod, which passes through the two transverse long slots of the two rear side plates of the rear portion, and two ends of the fixing rod are respectively inserted into two opposite inner wall surfaces corresponding to the transverse channel.

4. The semiconductor device test insertion device according to claim 3, wherein: The inner wall of the groove at the rear portion of each latch member is formed with a first fixing column backwards, for one end of the spring to be matched and sleeved for fixing; and Each of the elastic latch groups further includes a snap-fit ​​plate, which is snap-fitted onto the top of the transverse channel on the same side, and a support plate extends from a bottom portion toward the transverse channel below. A front side of the support plate corresponds to the spring in the transverse channel and forms a second fixing column forward for the other end of the spring to be matched and fixed.

5. The semiconductor device test insertion device according to claim 4, wherein: The two opposite side walls of the block further form a locking chamber, the locking chamber is located above the transverse channel on the same side, and two opposite inner sides thereof are respectively formed with two locking grooves; and Each of the clamping plates further comprises two clamping posts, which extend forward from a front side of the clamping plate and correspond to the two clamping slots of the clamping chamber of the block, respectively, so as to be clamped in the corresponding clamping slots after being inserted into the clamping chamber, and cover the clamping chamber.

6. The semiconductor device test insertion device according to claim 5, wherein: The top surface of the block is respectively formed with two maintenance passages downwards corresponding to the two engaging chambers, and each maintenance passage is communicated with the corresponding engaging chamber so that the two engaging columns are exposed.

7. The semiconductor device test insertion device according to any one of claims 1 to 6, characterized in that: The longitudinal channel is in the shape of a long rectangular cone that is wide at the top and narrow at the bottom.

8. The semiconductor device test insertion device according to claim 4 or 5, characterized in that: Each of the clamping plates is in a T shape.

9. The semiconductor device test insertion device according to any one of claims 1 to 6, characterized in that: The positioning frame seat is flush with the bottom surface of the block.

10. The semiconductor device test insertion device according to any one of claims 1 to 6, characterized in that: Each of the top knife openings is in the shape of a long rectangle.

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