Embedded intelligent circuit board for automobile

Abstract

An automobile embedded intelligent circuit board disclosed by the present invention comprises a protection mechanism, a heat conduction mechanism and a circuit board mechanism, the heat conduction mechanism is integrally in central symmetry design, and a heat conduction base I, a heat dissipation fin I, a heat conduction base II and a heat dissipation fin II are respectively arranged on two end surfaces of a heat conduction plate main body. The heat conduction mechanism is arranged in the circuit board body, the circuit board mechanisms can be installed on the end faces of the two sides of the heat conduction mechanism, the receding grooves are formed in the circuit board body, the first heat dissipation fins and the second heat dissipation fins are arranged in the receding grooves, and more heat dissipation mechanisms and electronic devices can be arranged in the same space through overall structural optimization of the heat conduction mechanism and the circuit board mechanisms. The overall space utilization rate of the structure is improved, the overall structural design is more reasonable, meanwhile, the heat dissipation mechanisms are arranged on the two side walls of the protection mechanism, heat on the heat conduction mechanism can be further dissipated through the heat dissipation mechanisms, the overall device can use electronic devices with higher power, and applicability and universality are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to an embedded intelligent circuit board for automobiles. Background Art

[0002] With the rapid development of electronic information technology, the functions of PCB circuit boards are constantly increasing, and the operating speed requirements are getting faster and faster. The use of flat single-board PCB circuit boards will cause the required PCB size to be too large, the printed lines to be long, the impedance to increase, the anti-noise ability to decrease, and the cost to increase; therefore, PCB circuit boards are developing towards the direction of multi-board splicing packaging.

[0003] The Chinese patent with the existing authorization announcement number CN114684036B discloses a protective circuit board for new energy vehicles, including a box body, a circuit board body, a liquid cooling head and a cold row cover. A shock absorbing seat is movably inserted at the bottom of the box body, and sleeves are fixedly connected to the left and right end walls of the box body. A pressure rod is movably inserted in the sleeve, and a clamp is fixedly connected to the end of the pressure rod away from the sleeve. The circuit board body is fixedly connected between the two clamps, and the liquid cooling head is fixedly connected to the top of the circuit board body. The cold row cover is fixedly connected with a plurality of fixed plates, and a circulating heat dissipation pipe is fixedly connected in the fixed plate. The left and right sides of the bottom of the cold row cover are fixedly connected with a second sealing connector, and the top of the cold row cover is fixedly connected with an air-cooling protective shell, and the top of the air-cooling protective shell is fixedly connected with two air ducts, and the output end of the driving motor is fixedly connected with an exhaust fan; this protective circuit board is easy to install and disassemble, and can effectively reduce vibration damage, and can also efficiently dissipate heat for the circuit board.

[0004] The disadvantages of the above-mentioned prior art solutions are that the overall structural optimization of the circuit board is poor, the space utilization is low, and the applicability is poor in some installation environments with relatively cramped space. Summary of the invention

[0005] The purpose of the present invention is to provide an embedded intelligent circuit board for automobiles to solve the technical problems in the prior art that the overall structural optimization of the circuit board is poor, the space utilization is low, and the applicability is poor in some installation environments with relatively cramped space.

[0006] The technical problem to be solved by the present invention can be achieved by the following technical solutions:

[0007] An embedded intelligent circuit board for automobile, comprising:

[0008] The heat conduction mechanism comprises a heat conduction plate body, a heat conduction base 1 and a heat dissipation fin 1 are arranged on one end surface of the heat conduction plate body, and a heat conduction base 2 and a heat dissipation fin 2 are arranged on the other end surface of the heat conduction plate body;

[0009] The circuit board mechanism comprises a circuit board body, the circuit board body is provided with a recess corresponding to the first heat sink fin and the second heat sink fin, the circuit board body is provided with electronic components, both end surfaces of the heat conduction mechanism are provided with circuit board mechanisms, and the electronic components on the end surfaces of both sides are respectively abutted against the first heat conduction base and the second heat conduction base;

[0010] The protection mechanism, the heat conduction mechanism and the circuit board mechanism are all arranged in the protection mechanism, and the heat dissipation mechanism is fixedly connected to the protection mechanism.

[0011] As a further solution of the present invention: the first heat-conducting base and the second heat-conducting base are centrally symmetrically arranged at the two ends of the heat-conducting plate body, and the first heat-dissipating fin and the second heat-dissipating fin are centrally symmetrically arranged at the two ends of the heat-conducting plate body.

[0012] As a further solution of the present invention: two fixed convex plates 1 are symmetrically arranged at both ends of the heat conducting plate body, and the fixed convex plates 1 are fixedly connected to the side end surface of the heat conducting plate body; two fixed convex plates 2 are symmetrically arranged at both ends of the heat conducting base 2, and the fixed convex plates 2 are fixedly connected to the heat conducting plate body.

[0013] As a further solution of the present invention: a mounting through hole is formed on the circuit board body near the four corners, and two fixing seats corresponding to the fixing convex plate 1 and the fixing convex plate 2 are symmetrically distributed and fixedly connected at both ends of the electronic device.

[0014] As a further solution of the present invention: a mounting threaded hole 1 is provided on the fixing seat, positioning through holes are provided on the fixing protrusion plate 1 and the fixing protrusion plate 2, mounting bolts are provided between the fixing protrusion plate 1 and the fixing protrusion plate 2 and the fixing seat, and the mounting bolts pass through the positioning through holes on the fixing protrusion plate 1 and the fixing protrusion plate 2 and are threadedly connected with a mounting threaded hole 1 on the fixing seat.

[0015] As a further solution of the present invention: a connecting piece is arranged between the two circuit board mechanisms, the connecting piece is arranged between the mounting through holes 1 of the two circuit board mechanisms, connecting threaded holes are opened at both ends of the connecting piece, a connecting screw is arranged between the circuit board body and the connecting piece, the connecting screw passes through the mounting through hole 1 on the circuit board body and is threadedly connected with the connecting threaded hole on the connecting piece.

[0016] As a further solution of the present invention: a circuit board convex plate is fixedly connected to the circuit board body, and a second installation through hole is penetrated on the circuit board convex plate. The protective mechanism includes a mechanism shell, and an installation chamber is opened in the mechanism shell. The installation chamber is symmetrically provided with a mechanism mounting block and a mechanism fixing block. A connecting threaded hole one corresponding to the second installation through hole is opened on the mechanism mounting block, a clamping groove corresponding to the circuit board convex plate is opened on the mechanism fixing block, and a connecting threaded hole two corresponding to the second installation through hole is opened on the mechanism fixing block.

[0017] As a further solution of the present invention: the circuit board convex plate of the circuit board mechanism on one side is arranged on the mechanism mounting block, and the circuit board convex plate on the other side is sleeved in the clamping groove of the mechanism fixing block, and a positioning bolt 1 is arranged between the mechanism mounting block and the circuit board convex plate on one side, and the positioning bolt passes through the second mounting through hole on the circuit board convex plate and is threadedly connected with the first connecting threaded hole on the mechanism mounting block, and a positioning bolt 2 is arranged between the mechanism fixing block and the circuit board convex plate on the other side, and the positioning bolt 2 passes through the second connecting threaded hole on the mechanism fixing block and is clamped with the second mounting through hole on the circuit board convex plate.

[0018] As a further solution of the present invention: a mechanism installation groove is symmetrically provided on the side wall of the mechanism housing, a docking limit groove is provided on the groove walls on both sides of the mechanism installation groove, and a heat dissipation mechanism is arranged in the docking limit groove.

[0019] As a further solution of the present invention: the heat dissipation mechanism includes a mechanism body, on which a heat dissipation fan is fixedly installed, and alignment clamps are symmetrically arranged and fixedly connected at both ends of the mechanism body, and the alignment clamps are clamped in the docking limit grooves.

[0020] Beneficial effects of the present invention:

[0021] 1. In the present invention, since the heat conduction mechanism is designed as a whole in a central symmetrical style, and the heat conduction base 1, the heat dissipation fin 1, the heat conduction base 2 and the heat dissipation fin 2 are respectively arranged on the two end surfaces of the heat conduction plate body, the circuit board mechanism can be installed on both end surfaces of the heat conduction mechanism, and the circuit board body is provided with a clearance groove, and the heat dissipation fin 1 and the heat dissipation fin 2 are both arranged in the clearance groove. Through the overall structural optimization of the heat conduction mechanism and the circuit board mechanism, more heat dissipation mechanisms and electronic devices can be arranged in the same space, which is conducive to improving the space utilization rate of the overall structure, and the overall structural design is more reasonable;

[0022] 2. Heat dissipation mechanisms are provided on both side walls of the protective mechanism of the present invention. The heat dissipation mechanisms can further dissipate the heat on the heat-conducting mechanism, so that the device as a whole can use electronic devices with higher power, which is beneficial to improving the applicability and versatility of the device as a whole. Alignment clamps are fixedly connected on both sides of the mechanism body of the heat dissipation mechanism, and a mechanism mounting groove corresponding to the mechanism body is provided on the mechanism shell of the protective mechanism. Docking limit grooves corresponding to the alignment clamp are provided on both sides of the mechanism mounting groove wall, and the alignment clamp is clamped in the docking limit grooves, so that the heat dissipation mechanism as a whole can be easily removed from the mechanism shell of the protective mechanism and installed, thereby improving the convenience of device assembly and facilitating the later maintenance of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is an overall three-dimensional schematic diagram of the present invention;

[0025] Figure 2 It is a schematic structural diagram of the connection relationship between the heat conduction mechanism and the circuit board mechanism of the present invention;

[0026] Figure 3 The three-dimensional structure of the heat conduction mechanism of the present invention is shown in FIG. Figure 1 ;

[0027] Figure 4 The three-dimensional structure of the heat conduction mechanism of the present invention is shown in FIG. Figure 2 ;

[0028] Figure 5 It is a schematic diagram of the three-dimensional structure of the circuit board mechanism of the present invention;

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of the protection mechanism of the present invention;

[0030] Figure 7 It is a schematic diagram of the three-dimensional structure of the heat dissipation mechanism of the present invention.

[0031] In the figure: 1. protective mechanism; 11. mechanism housing; 12. installation chamber; 13. mechanism installation block; 14. connecting threaded hole 1; 15. mechanism fixing block; 16. clamping groove; 17. connecting threaded hole 2; 18. mechanism installation groove; 19. docking limit groove; 2. heat conduction mechanism; 21. heat conduction plate body; 22. heat conduction base 1; 23. fixing convex plate 1; 24. heat dissipation fin 1; 25. heat conduction base 2; 26. fixing convex plate 2; 27. heat dissipation fin 2; 3. circuit board mechanism; 31. circuit board body; 32. clearance groove; 33. installation through hole 1; 34. circuit board convex plate; 35. installation through hole 2; 36. electronic device; 37. fixing seat; 4. heat dissipation mechanism; 41. mechanism body; 42. heat dissipation fan; 43. alignment clamp; 5. connector; 6. connecting screw. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] like Figure 1-Figure 7As shown, an embedded intelligent circuit board for automobile includes a protective mechanism 1, a heat-conducting mechanism 2 and a circuit board mechanism 3. The heat-conducting mechanism 2 includes a heat-conducting plate body 21. A heat-conducting base 22 and a heat-dissipating fin 24 are arranged on one end surface of the heat-conducting plate body 21. A heat-conducting base 25 and a heat-dissipating fin 27 are arranged on the other end surface of the heat-conducting plate body 21. The circuit board mechanism 3 includes a circuit board body 31. A clearance groove 32 corresponding to the heat-dissipating fin 24 and the heat-dissipating fin 27 is opened on the circuit board body 31. An electronic device 36 is arranged on the circuit board body 31. The circuit board mechanism 3 is arranged on both end surfaces of the heat-conducting mechanism 2. The electronic devices 36 on the end surfaces of both sides are respectively abutted against the heat-conducting base 22 and the heat-conducting base 25. The heat-conducting mechanism 2 and the circuit board mechanism 3 are both arranged in the protective mechanism 1. The heat dissipating mechanism 4 is fixedly connected to the protective mechanism 1.

[0034] The first heat-conducting base 22 and the second heat-conducting base 25 are centrally symmetrically disposed at two ends of the heat-conducting plate body 21 , and the first heat-dissipating fin 24 and the second heat-dissipating fin 27 are centrally symmetrically disposed at two ends of the heat-conducting plate body 21 .

[0035] Two fixed protrusions 23 are symmetrically arranged at both ends of the heat conducting plate body 21, and the fixed protrusions 23 are fixedly connected to the side end surface of the heat conducting plate body 21. Two fixed protrusions 26 are symmetrically arranged at both ends of the heat conducting base 25, and the fixed protrusions 26 are fixedly connected to the heat conducting plate body 21.

[0036] The circuit board body 31 is provided with mounting through holes 33 near the four corners. Two fixing seats 37 corresponding to the fixing convex plate 1 23 and the fixing convex plate 2 26 are symmetrically distributed and fixedly connected at both ends of the electronic device 36 .

[0037] A mounting threaded hole 1 is provided on the fixing seat 37, and positioning through holes are provided on the fixing convex plate 1 23 and the fixing convex plate 26. Mounting bolts are provided between the fixing convex plate 1 23 and the fixing convex plate 26 and the fixing seat 37. The mounting bolts penetrate the positioning through holes on the fixing convex plate 1 23 and the fixing convex plate 26 and are threadedly connected with the mounting threaded hole 1 on the fixing seat 37.

[0038] A connecting member 5 is provided between the two circuit board mechanisms 3, and the connecting member 5 is provided between the mounting through holes 33 of the two circuit board mechanisms 3. Connecting threaded holes are provided at both ends of the connecting member 5. A connecting screw 6 is provided between the circuit board body 31 and the connecting member 5, and the connecting screw 6 passes through the mounting through hole 33 on the circuit board body 31 and is threadedly connected with the connecting threaded hole on the connecting member 5.

[0039] A circuit board convex plate 34 is fixedly connected to the circuit board body 31, and a second mounting through hole 35 is penetrated through the circuit board convex plate 34. The protective mechanism 1 includes a mechanism housing 11, and a mounting chamber 12 is opened in the mechanism housing 11. The mounting chamber 12 is symmetrically provided with a mechanism mounting block 13 and a mechanism fixing block 15. The mechanism mounting block 13 is provided with a connecting threaded hole 14 corresponding to the second mounting through hole 35, and the mechanism fixing block 15 is provided with a clamping groove 16 corresponding to the circuit board convex plate 34, and the mechanism fixing block 15 is provided with a second connecting threaded hole 17 corresponding to the second mounting through hole 35.

[0040] Since the circuit board mechanisms 3 on both sides are arranged symmetrically, the circuit board protrusion 34 of the circuit board mechanism 3 on one side is arranged on the mechanism mounting block 13, and the circuit board protrusion 34 on the other side is sleeved in the clamping groove 16 of the mechanism fixing block 15. A positioning bolt 1 is arranged between the mechanism mounting block 13 and the circuit board protrusion 34 on one side. The positioning bolt passes through the mounting through hole 2 35 on the circuit board protrusion 34 and is threadedly connected with the connecting threaded hole 14 on the mechanism mounting block 13. A positioning bolt 2 is arranged between the mechanism fixing block 15 and the circuit board protrusion 34 on the other side. The positioning bolt 2 passes through the connecting threaded hole 2 17 on the mechanism fixing block 15 and is clamped with the mounting through hole 2 35 on the circuit board protrusion 34.

[0041] A mechanism mounting groove 18 is symmetrically provided on the side wall of the mechanism housing 11, and docking limit grooves 19 are provided on the groove walls on both sides of the mechanism mounting groove 18. A heat dissipation mechanism 4 is arranged in the docking limit groove 19. The heat dissipation mechanism 4 includes a mechanism body 41, and a heat dissipation fan 42 is fixedly installed on the mechanism body 41. Alignment card plates 43 are symmetrically provided and fixedly connected at both ends of the mechanism body 41, and the alignment card plates 43 are clamped in the docking limit groove 19.

[0042] In order to facilitate the understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution is briefly described in combination with specific application scenarios:

[0043] When in use, since the heat-conducting mechanism 2 is designed as a whole in a central symmetrical manner, and the heat-conducting base 1 22, the heat-dissipating fin 1 24, the heat-conducting base 25 and the heat-dissipating fin 27 are respectively arranged on the two end surfaces of the heat-conducting plate body 21, the circuit board mechanism 3 can be installed on both side end surfaces of the heat-conducting mechanism 2, and a clearance groove 32 is provided on the circuit board body 31, and the heat-dissipating fin 1 24 and the heat-dissipating fin 27 are both arranged in the clearance groove 32. Through the overall structural optimization of the heat-conducting mechanism 2 and the circuit board mechanism 3, more heat-dissipating mechanisms 4 and electronic devices 36 can be arranged in the same space, which is conducive to improving the space utilization rate of the overall structure, and the overall structural design is more reasonable. At the same time, heat-dissipating mechanisms are arranged on both side walls of the protective mechanism 1. 4. The heat on the heat-conducting mechanism 2 can be further dissipated through the heat dissipation mechanism 4, so that the device as a whole can use electronic devices 36 with higher power, which is beneficial to improving the applicability and versatility of the device as a whole. Alignment clamps 43 are fixedly connected on both sides of the mechanism body 41 of the heat dissipation mechanism 4, and a mechanism installation groove 18 corresponding to the mechanism body 41 is opened on the mechanism shell 11 of the protective mechanism 1. The two sides of the groove wall of the mechanism installation groove 18 are opened with docking limit grooves 19 corresponding to the alignment clamps 43. The alignment clamps 43 are clamped in the docking limit grooves 19, so that the heat dissipation mechanism 4 as a whole can be easily removed and installed from the mechanism shell 11 of the protective mechanism 1, which improves the convenience of device assembly and facilitates the later maintenance of the device.

[0044] Several embodiments of the present invention are described in detail above, but the embodiments of the present invention are not limited thereto and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An embedded intelligent circuit board for automobile, characterized in that: include: The heat conduction mechanism (2) comprises a heat conduction plate body (21), a heat conduction base (22) and a heat dissipation fin (24) being arranged on one end surface of the heat conduction plate body (21), and a heat conduction base (25) and a heat dissipation fin (27) being arranged on the other end surface of the heat conduction plate body (21); A circuit board mechanism (3) comprises a circuit board body (31), the circuit board body (31) is provided with a clearance groove (32) corresponding to a first heat sink fin (24) and a second heat sink fin (27), an electronic device (36) is arranged on the circuit board body (31), and the circuit board mechanism (3) is arranged on both end surfaces of the heat conduction mechanism (2), and the electronic devices (36) on the two end surfaces are respectively in contact with a first heat conduction base (22) and a second heat conduction base (25); The protection mechanism (1), the heat conduction mechanism (2) and the circuit board mechanism (3) are all arranged in the protection mechanism (1), and the heat dissipation mechanism (4) is fixedly connected to the protection mechanism (1).

2. The embedded intelligent circuit board for automobile according to claim 1, characterized in that: The heat-conducting base 1 (22) and the heat-conducting base 2 (25) are centrally symmetrically arranged at the two ends of the heat-conducting plate body (21), and the heat-dissipating fin 1 (24) and the heat-dissipating fin 2 (27) are centrally symmetrically arranged at the two ends of the heat-conducting plate body (21).

3. The embedded intelligent circuit board for automobile according to claim 1, characterized in that: Two fixed convex plates (23) are symmetrically arranged at both ends of the heat conducting plate body (21), and the fixed convex plates (23) are fixedly connected to the side end surface of the heat conducting plate body (21). Two fixed convex plates (26) are symmetrically arranged at both ends of the heat conducting base (25), and the fixed convex plates (26) are fixedly connected to the heat conducting plate body (21).

4. The embedded intelligent circuit board for automobile according to claim 1, characterized in that: The circuit board body (31) is provided with mounting through holes (33) near the four corners. Two fixing seats (37) corresponding to the fixing convex plate (23) and the fixing convex plate (26) are symmetrically distributed and fixedly connected at both ends of the electronic device (36).

5. The embedded intelligent circuit board for automobile according to claim 4, characterized in that: A mounting threaded hole 1 is provided on the fixing seat (37), and positioning through holes are provided on the fixing convex plate 1 (23) and the fixing convex plate 2 (26). Mounting bolts are provided between the fixing convex plate 1 (23) and the fixing convex plate 2 (26) and the fixing seat (37), and the mounting bolts penetrate the positioning through holes on the fixing convex plate 1 (23) and the fixing convex plate 2 (26) and are threadedly connected with the mounting threaded hole 1 on the fixing seat (37).

6. The embedded intelligent circuit board for automobile according to claim 1, characterized in that: A connecting piece (5) is provided between the two circuit board mechanisms (3), the connecting piece (5) is provided between the mounting through holes (33) of the two circuit board mechanisms (3), both ends of the connecting piece (5) are provided with connecting threaded holes, a connecting screw rod (6) is provided between the circuit board body (31) and the connecting piece (5), the connecting screw rod (6) passes through the mounting through hole (33) on the circuit board body (31) and is threadedly connected to the connecting threaded hole on the connecting piece (5).

7. The embedded intelligent circuit board for automobile according to claim 1, characterized in that: A circuit board convex plate (34) is fixedly connected to the circuit board body (31), and a second mounting through hole (35) is formed through the circuit board convex plate (34). The protection mechanism (1) comprises a mechanism housing (11), and a mounting chamber (12) is formed in the mechanism housing (11). The mounting chamber (12) is symmetrically provided with a mechanism mounting block (13) and a mechanism fixing block (15). A first connecting threaded hole (14) corresponding to the second mounting through hole (35) is formed on the mechanism mounting block (13), and a clamping groove (16) corresponding to the circuit board convex plate (34) is formed on the mechanism fixing block (15). A second connecting threaded hole (17) corresponding to the second mounting through hole (35) is formed on the mechanism fixing block (15).

8. The embedded intelligent circuit board for automobile according to claim 7, characterized in that: The circuit board convex plate (34) of the circuit board mechanism (3) on one side is arranged on the mechanism mounting block (13), and the circuit board convex plate (34) on the other side is sleeved in the clamping groove (16) of the mechanism fixing block (15). A first positioning bolt is arranged between the mechanism mounting block (13) and the circuit board convex plate (34) on one side. The positioning bolt passes through a second mounting through hole (35) on the circuit board convex plate (34) and is threadedly connected to a first connecting threaded hole (14) on the mechanism mounting block (13). A second positioning bolt is arranged between the mechanism fixing block (15) and the circuit board convex plate (34) on the other side. The second positioning bolt passes through a second connecting threaded hole (17) on the mechanism fixing block (15) and is clamped to a second mounting through hole (35) on the circuit board convex plate (34).

9. The embedded intelligent circuit board for automobile according to claim 1, characterized in that: A mechanism installation groove (18) is symmetrically provided on the side wall of the mechanism housing (11), and a docking limit groove (19) is provided on the groove walls on both sides of the mechanism installation groove (18), and a heat dissipation mechanism (4) is arranged in the docking limit groove (19).

10. The embedded intelligent circuit board for automobile according to claim 9, characterized in that: The heat dissipation mechanism (4) comprises a mechanism body (41), on which a heat dissipation fan (42) is fixedly mounted, and alignment clamping plates (43) are symmetrically arranged and fixedly connected at both ends of the mechanism body (41), and the alignment clamping plates (43) are clamped in the docking limit groove (19).

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