Full-automatic equipment for testing and sorting performance of full-size flash memory wafer

Abstract

The invention discloses full-automatic equipment for testing and sorting the performance of a full-size flash memory wafer, which comprises a rack, a high-precision alignment adsorption platform module is arranged on the rack, and the high-precision alignment adsorption platform module comprises a Y-direction alignment electric mechanism and an X-direction alignment electric mechanism. The device has the advantages that the image information of the wafer is captured through the adsorption positioning camera to determine the position of the wafer, the position of the adsorption jig platform is adjusted through the Y-direction alignment electric mechanism, the X-direction alignment electric mechanism and the Z-direction alignment electric mechanism, the wafer is made to be located at the accurate position, the test needle card installation platform is moved to the test position above the flash memory wafer, and the test needle card installation platform is moved to the test position above the flash memory wafer. And carrying out full-automatic detection and sorting on the flash memory wafers. The problems of damage, subfissure, pollution, scratch and the like of the flash memory wafer caused by L-side positioning and double-clip positioning are avoided, the capacity and function sorting efficiency of the thin flash memory wafer are also improved, the loss caused by misjudgment is reduced, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of flash memory wafer sorting, and specifically provides a fully automatic device for performance testing and sorting of full-size flash memory wafers. Background Art

[0002] During the production process, there will be some unstable, insufficient-capacity, partially damaged or completely damaged wafers on the flash memory wafers. These wafers cannot meet the production requirements and will be defined as waste products by the original factory and scrapped entirely. Those wafers that pass the inspection are encapsulated into flash memory particles, and such wafers are called original wafers.

[0003] During the production process of flash memory wafers, an inspection and sorting program is set to separate the wafers that do not meet the requirements. Currently, in automatic inspection and sorting equipment for flash memory wafers, most adopt L-shaped edge-leaning plus clamping positioning, and this positioning method has poor positioning accuracy. During the alignment process, the edge of the positioning mechanism will contact the side of the flash memory wafer, and there will be a slight impact, so it will cause the flash memory wafer to be damaged or have hidden cracks. In addition, it is difficult to sort thinner wafers with this positioning method. When sorting thinner wafers, not only is the positioning inaccurate, but it is also more likely to cause problems such as damage, hidden cracks, contamination, and scratches of the flash memory wafers. Thinner flash memory wafers can only be sorted by manual loading and unloading methods. Since there is no automatic alignment system for alignment, the problem of inaccurate edge alignment often occurs, resulting in too slow overall sorting efficiency and mis-sorting phenomena, treating some good products as defective products, as well as manual misclassification and placement, which is insufficient to meet the industry requirements. Summary of the Invention

[0004] (I) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the present invention provides a fully automatic device for performance testing and sorting of full-size flash memory wafers, which has the advantages of avoiding problems such as damage, hidden cracks, contamination, and scratches of flash memory wafers caused by using L-edge and clamping positioning, improving the efficiency of capacity and function sorting of thinner flash memory wafers, reducing losses caused by misjudgment, and reducing costs.

[0006] (II) Technical Solutions

[0007] To achieve the above object, the present invention provides the following technical solution: A fully automatic device for performance testing and sorting of full-size flash memory wafer chips, including a frame, on which a high-precision alignment and adsorption platform module is provided. The high-precision alignment and adsorption platform module includes a Y-direction alignment electric mechanism, an X-direction alignment electric mechanism, a Z-direction alignment electric mechanism, an adsorption fixture platform, and an adsorption positioning camera. A test probe card mounting platform capable of being driven by a relevant driving component to move is also provided on the frame. A loading and unloading claw transplanting module is provided on the frame, and a loading and unloading suction claw module is provided on the loading and unloading claw transplanting module. A Tary module capable of being driven by a relevant driving component to move is provided on the frame. A blanking camera positioning module is also provided on the frame.

[0008] Preferably, there are several high-precision alignment and adsorption platform modules, and several of the high-precision alignment and adsorption platform modules are evenly arranged along the length direction of the frame.

[0009] Preferably, an artificial alignment microscope module is also provided on the frame. The X-direction alignment electric mechanism is arranged on the Y-direction alignment electric mechanism, the Z-direction alignment electric mechanism is arranged on the X-direction alignment electric mechanism, the adsorption fixture platform is arranged on the Z-direction alignment electric mechanism, and the adsorption positioning camera is arranged on the adsorption fixture platform.

[0010] Adopting the above technical solution: The frame provides an installation platform for the upper structure, ensuring the stability of the upper structure. It also provides a platform for the testing and sorting work of flash memory wafer chips. The frame can be made by welding high-strength square tubes and then performing gantry milling to ensure that the strength, mechanism stability, and precision meet the requirements. A high-precision alignment and adsorption platform module is provided on the frame. The high-precision alignment and adsorption platform module is used to adsorb the flash memory wafer chips so that the test probe card on the test probe card mounting platform can perform testing work on the flash memory wafer chips. Among them, the Y-direction alignment electric mechanism, the X-direction alignment electric mechanism, and the Z-direction alignment electric mechanism are respectively used to drive the adsorption fixture platform to move in the Y, X, and Z axes to adjust the wafer chips to the correct position. The adsorption positioning camera collects the image position information of the wafer chips and controls the operation of the Y-direction alignment electric mechanism, the X-direction alignment electric mechanism, and the Z-direction alignment electric mechanism according to the image position information. Through the self-adjustment and self-calibration of the high-precision alignment and adsorption platform module, the position of the wafer chips is accurate and error-free, and then the detection and sorting work can be more accurate.

[0011] An artificial alignment microscope module is provided on the frame, which is convenient for manual operation when detecting and correcting flash memory wafer chips for the first time, enabling the test probe card of the flash memory wafer chips to accurately align with the flash memory wafer chips for testing, and ensuring the accuracy and qualification rate of subsequent automatic testing.

[0012] Preferably, a Z-direction precision adjustment slide table, a Y-direction precision adjustment slide table, an X-direction precision adjustment slide table, a test probe card mounting seat, and an X-direction precision adjustment rod are provided on the test probe card mounting platform.

[0013] Preferably, the test probe card mounting platform is driven by a test probe card mounting platform transplanting module, and a driving motor, a precision guide rail, a precision mounting platform, and a precision grinding lead screw are provided on the test probe card mounting platform transplanting module.

[0014] With the above technical solution: The test probe card mounting platform transplanting module is driven by a high-precision motor. The motor can be a servo motor. Stepper motors and linear motors are not uniquely specified here. The movement mode of the module is to move the test probe card mounting platform to the detection position above the flash memory wafer and the safe avoidance nozzle position. The repeatability accuracy can reach ±1um. The test probe card mounting platform is used to place the test probe card and can generally install test probe cards of various size specifications. Manual adjustment slide tables in the X, Y, and Z directions are designed under the mounting platform. The manual adjustment slide tables use spiral scale adjustment, and the adjustment accuracy is at the micron level. The main function is to facilitate technicians to initially adjust the correct position of the contact points between the pads of the flash memory wafer and the test probe card. The test probe card is customized according to the requirements of different types of flash memory wafers and will not be described in detail here.

[0015] Preferably, the loading and unloading claw transplanting module includes a loading and unloading claw transplanting Y-axis module and a loading and unloading claw transplanting X-axis module connected thereto. The loading and unloading claw transplanting X-axis module is arranged on the loading and unloading claw transplanting Y-axis module.

[0016] Preferably, a nozzle lifting motor, a nozzle lifting guide rail, a nozzle rotating motor, an anti-static non-marking suction claw, a positioning CCD camera, and a motor lifting adjustment slide table are provided on the loading and unloading suction claw module.

[0017] Preferably, the Tary module is driven by a Tray transplanting module. There are several Tary modules, and a single Tray transplanting module can synchronously drive multiple Tary modules to move.

[0018] With the above technical solution: The loading and unloading claw transplanting module is driven by a high-precision high-speed motor and has the advantages of fast transmission speed, short response time, and accurate transmission position. The loading and unloading claw transplanting X-axis module is installed on the loading and unloading claw transplanting Y-axis module to form an XY movement module. Similarly, it is driven by a high-precision high-speed motor and has the advantages of fast transmission speed, short response time, and accurate transmission position.

[0019] Each anti-static and traceless suction claw is equipped with a nozzle rotation motor and a nozzle lifting motor. The positioning CCD camera can position the feeding flash memory wafer, and review the detection results of the adsorption positioning camera to ensure the accuracy of the test results. The anti-static and traceless suction claw is installed with a nozzle rotation motor, which can rotate at any angle through electric control. The nozzle lifting motor of the anti-static and traceless suction claw can adjust the lifting of the anti-static and traceless suction claw and can stay at any position within the designed lifting stroke.

[0020] The blanking camera positioning module uses a high-pixel positioning camera to position the blanking flash memory wafer, ensuring that the flash memory wafer can be accurately placed into the Tray. This prevents damage to the flash memory wafer during the process of placing it into the Tray. The Tray transfer module mainly transfers the Tray to the position where the loading and unloading suction claws module picks and places the flash memory wafer and the position for manual loading and unloading of the flash memory wafer. The driving method can adopt electric control or pneumatic control. The Tray module is set according to different flash memory wafer sizes. The material can be selected from non-metallic materials such as bakelite, PEEK, POM, and fiberglass, or metal materials such as aluminum alloy, steel, and some other non-ferrous metals. There is no unique specification here.

[0021] (III) Beneficial effects

[0022] Compared with the prior art, the present invention provides a fully automatic device for performance testing and sorting of full-size flash memory wafers, having the following beneficial effects:

[0023] This fully automatic device for performance testing and sorting of full-size flash memory wafers, by setting a high-precision alignment and adsorption platform module including a Y-direction alignment electric mechanism, an X-direction alignment electric mechanism, a Z-direction alignment electric mechanism, an adsorption fixture platform, and an adsorption positioning camera, cooperating with a test probe card installation platform, a loading and unloading claw transfer module, a loading and unloading suction claw module, a Tary module, etc. When performing sorting work, the loading and unloading claw transfer module drives the loading and unloading suction claw module to adsorb the flash memory wafer on the Tary module and place it on the high-precision alignment and adsorption platform module. The position of the wafer is determined by capturing the image information of the wafer by the adsorption positioning camera. Then, the position of the adsorption fixture platform is adjusted by using the Y-direction alignment electric mechanism, the X-direction alignment electric mechanism, and the Z-direction alignment electric mechanism, so that the wafer is in an accurate position. The test probe card installation platform is moved to the test position above the flash memory wafer to perform full-automatic detection and sorting of the flash memory wafer. This avoids problems such as breakage, hidden cracks, contamination, and scratches of the flash memory wafer caused by using L-edge and clamping-type positioning, improves the efficiency of capacity and function sorting of thinner flash memory wafers, reduces the losses caused by misjudgment, and lowers the cost. Description of the drawings

[0024] Figure 1Schematic diagram of the first perspective of a fully automatic device for performance testing and sorting of full-size flash memory wafer

[0025] Figure 2 Schematic diagram of the second perspective of a fully automatic device for performance testing and sorting of full-size flash memory wafer

[0026] Figure 3 Schematic diagram of the structure of a high-precision alignment and adsorption platform module of a fully automatic device for performance testing and sorting of full-size flash memory wafer

[0027] Figure 4 Schematic diagram of the structure of a loading and unloading gripper module of a fully automatic device for performance testing and sorting of full-size flash memory wafer

[0028] Figure 5 Schematic diagram of the structure of a test probe card mounting platform transplanting module of a fully automatic device for performance testing and sorting of full-size flash memory wafer

[0029] Figure 6 Schematic diagram of the structure of a test probe card mounting platform of a fully automatic device for performance testing and sorting of full-size flash memory wafer

[0030] In the figure: 1 - frame, 2 - high-precision alignment and adsorption platform module, 21 - Y-direction alignment electric mechanism, 22 - X-direction alignment electric mechanism, 23 - Z-direction alignment electric mechanism, 24 - adsorption fixture platform, 25 - adsorption positioning camera;

[0031] 3 - test probe card mounting platform, 31 - Z-direction precision adjustment slide, 32 - Y-direction precision adjustment slide, 33 - X-direction precision adjustment slide, 34 - test probe card mounting seat, 35 - X-direction precision adjustment rod;

[0032] 4 - test probe card mounting platform transplanting module, 41 - drive motor, 42 - precision guide rail, 43 - precision mounting platform, 44 - precision grinding lead screw;

[0033] 5 - loading and unloading gripper transplanting module, 6 - loading and unloading gripper module, 61 - nozzle lifting motor, 62 - nozzle lifting guide rail, 63 - nozzle rotating motor, 64 - anti-static non-marking gripper, 65 - positioning CCD camera, 66 - motor lifting adjustment slide;

[0034] 7 - Tary module, 8 - Tray transplanting module, 9 - unloading camera positioning module, 10 - manual alignment microscope module. Detailed implementation method

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] Please refer to Figure 1-6 , a fully automatic device for performance testing and sorting of full-size flash memory wafer chips, including a frame 1, on which a high-precision alignment and adsorption platform module 2 is provided. The high-precision alignment and adsorption platform module 2 includes a Y-direction alignment electric mechanism 21, an X-direction alignment electric mechanism 22, a Z-direction alignment electric mechanism 23, an adsorption fixture platform 24, and an adsorption positioning camera 25. A test probe card mounting platform 3 that can be driven by relevant drive components to move is also provided on the frame 1. A loading and unloading claw transfer module 5 is provided on the frame 1, and a loading and unloading suction claw module 6 is provided on the loading and unloading claw transfer module 5. A Tary module 7 that can be driven by relevant drive components to move is provided on the frame 1. A blanking camera positioning module 9 is also provided on the frame 1.

[0037] Embodiment 1: There are several high-precision alignment and adsorption platform modules 2, and several high-precision alignment and adsorption platform modules 2 are evenly arranged along the length direction of the frame 1. An artificial alignment microscope module 10 is also provided on the frame 1. The X-direction alignment electric mechanism 22 is arranged on the Y-direction alignment electric mechanism 21, the Z-direction alignment electric mechanism 23 is arranged on the X-direction alignment electric mechanism 22, the adsorption fixture platform 24 is arranged on the Z-direction alignment electric mechanism 23, and the adsorption positioning camera 25 is arranged on the adsorption fixture platform 25.

[0038] The frame 1 provides an installation platform for the upper structure to ensure the stability of the upper structure. It also provides a platform for the testing and sorting work of flash memory wafer chips. The frame 1 can be made by welding high-strength square tubes and then performing gantry milling to ensure that the strength, mechanism stability, and precision meet the requirements. The high-precision alignment and adsorption platform module 2 is provided on the frame 1. The high-precision alignment and adsorption platform module 2 is used to adsorb the flash memory wafer chips so that the test probe card on the test probe card mounting platform 3 can perform testing work on the flash memory wafer chips. Among them, the Y-direction alignment electric mechanism 21, the X-direction alignment electric mechanism 22, and the Z-direction alignment electric mechanism 23 are respectively used to drive the adsorption fixture platform 24 to move in the Y, X, and Z axes to adjust the wafer chip to the correct position. The adsorption positioning camera 25 collects the image position information of the wafer chip and controls the operation of the Y-direction alignment electric mechanism 21, the X-direction alignment electric mechanism 22, and the Z-direction alignment electric mechanism 23 according to the image position information. Through the self-adjustment and self-calibration of the high-precision alignment and adsorption platform module 2, the position of the wafer chip is accurate and error-free, and then the detection and sorting work can be more accurate.

[0039] An artificial alignment microscope module 10 is set on the frame 1, which is convenient for manual alignment during the first flash memory wafer detection and correction, enabling the test probe card of the flash memory wafer to accurately align with the flash memory wafer for testing, ensuring the accuracy and qualification rate of subsequent automatic testing.

[0040] Embodiment 2: A Z-direction precision adjustment slide 31, a Y-direction precision adjustment slide 32, an X-direction precision adjustment slide 33, a test probe card mounting seat 34, and an X-direction precision adjustment rod 35 are provided on the test probe card mounting platform 3. The test probe card mounting platform 3 is driven by a test probe card mounting platform transplanting module 4. The test probe card mounting platform transplanting module 4 is provided with a driving motor 41, a precision guide rail 42, a precision mounting platform 43, and a precision grinding lead screw 44.

[0041] The test probe card mounting platform transplanting module 4 is driven by a high-precision motor. The motor can be a servo motor. Stepper motors and linear motors are not uniquely specified here. The movement mode of the module is to move the test probe card mounting platform 3 to the detection position above the flash memory wafer and the safe avoidance position of the suction nozzle. The repeatability accuracy can reach ±1um. The test probe card mounting platform 3 is used to place the test probe card and can be commonly installed with various sizes and specifications of test probe cards. Manual adjustment slides in the X, Y, and Z directions are designed under the mounting platform. The manual adjustment slides use spiral scale adjustment, and the adjustment accuracy is at the micron level. The main function is to facilitate technicians to initially adjust the correct position of the contact points between the pads of the flash memory wafer and the test probe card. The test probe card is customized according to the requirements of different types of flash memory wafers and will not be described in detail here.

[0042] Embodiment 3: The loading and unloading claw transplanting module 5 includes a loading and unloading claw transplanting Y-axis module and a loading and unloading claw transplanting X-axis module. The loading and unloading claw transplanting X-axis module is arranged on the loading and unloading claw transplanting Y-axis module. It is characterized in that: a suction nozzle lifting motor 61, a suction nozzle lifting guide rail 62, a suction nozzle rotating motor 63, an anti-static non-marking suction claw 64, a positioning CCD camera 65, and a motor lifting adjustment slide 66 are provided on the loading and unloading suction claw module 6. The Tary module 7 is driven by the Tray transplanting module 8. There are several Tary modules 7, and a single Tray transplanting module 8 can synchronously drive multiple Tary modules 7 to move.

[0043] The loading and unloading claw transplanting module 5 is driven by a high-precision high-speed motor and has the advantages of fast transmission speed, short response time, and accurate transmission position. The loading and unloading claw transplanting X-axis module is installed on the loading and unloading claw transplanting Y-axis module to form an XY movement module, which is also driven by a high-precision high-speed motor and has the advantages of fast transmission speed, short response time, and accurate transmission position.

[0044] Each anti-static and markless suction claw 64 is equipped with a nozzle rotation motor 63 and a nozzle lifting motor 61. The positioning CCD camera 65 can position the feeding flash memory wafer, and review the detection results of the adsorption positioning camera 25 to ensure the accuracy of the test results. The nozzle rotation motor 63 is installed on the anti-static and markless suction claw 64 and can be rotated at any angle through electric control. The nozzle lifting motor 61 of the anti-static and markless suction claw 64 can adjust the lifting of the anti-static and markless suction claw 64 and can stay at any position within the designed lifting stroke.

[0045] The blanking camera positioning module 9 uses a high-pixel positioning camera to position the blanking flash memory wafer, ensuring that the flash memory wafer can be accurately placed into the Tray. This prevents damage to the flash memory wafer during the process of placing it into the lower Tray. The Tray transfer module 8 mainly transfers the Tray to the position where the loading and unloading suction claw module 6 picks and places the flash memory wafer and the position for manual loading and unloading of the flash memory wafer. The driving method can be electric control or pneumatic control. The Tray module 7 is set according to different flash memory wafer sizes. The material can be selected as non-metallic materials such as bakelite, PEEK, POM, fiberglass, or metal materials such as aluminum alloy, steel, and some other non-ferrous metals. There is no unique specification here.

[0046] During use, the loading and unloading claw transfer module 5 drives the loading and unloading suction claw module 6 to adsorb the flash memory wafer on the Tary module 7 and place it on the high-precision alignment adsorption platform module 2. The adsorption positioning camera 25 captures the image information of the wafer to determine its position. Then, the Y-direction alignment electric mechanism 21, X-direction alignment electric mechanism 22, and Z-direction alignment electric mechanism 23 are used to adjust the position of the adsorption fixture platform 24 to make the wafer in an accurate position. The test probe card mounting platform 3 moves to the test position above the flash memory wafer to perform full-automatic detection and sorting on the flash memory wafer. After the test is completed, the result is fed back. The test probe card mounting platform transfer module 4 moves the test probe card mounting platform 3 of the flash memory wafer to the safe position. After the loading and unloading suction claw module 6 positions the tested and sorted flash memory wafer through the blanking camera positioning module 9, the position of the flash memory wafer is corrected by the nozzle rotation motor 63, and then it is sorted and unloaded into the corresponding Tray.

[0047] In summary, for the fully automatic equipment for performance test and sorting of full-size flash memory wafers, by setting up the high-precision alignment and adsorption platform module 2 including the Y-direction alignment electric mechanism 21, X-direction alignment electric mechanism 22, Z-direction alignment electric mechanism 23, adsorption fixture platform 24, and adsorption positioning camera 25, and cooperating with the test probe card mounting platform 3, loading and unloading claw transplanting module 5, loading and unloading suction claw module 6, Tary module 7 and other structures, when performing the sorting work, the loading and unloading claw transplanting module 5 drives the loading and unloading suction claw module 6 to adsorb the flash memory wafer on the Tary module 7 and place it on the high-precision alignment and adsorption platform module 2. The position of the wafer is determined by capturing the image information of the wafer by the adsorption positioning camera 25, and then the positions of the adsorption fixture platform 24 are adjusted by the Y-direction alignment electric mechanism 21, X-direction alignment electric mechanism 22, and Z-direction alignment electric mechanism 23 to make the wafer in an accurate position. The test probe card mounting platform 3 moves to the test position above the flash memory wafer to perform full-automatic detection and sorting of the flash memory wafer. It avoids the problems of breakage, hidden crack, contamination, scratch, etc. of the flash memory wafer caused by using L-edge and clamping positioning, improves the efficiency of capacity and function sorting of thinner flash memory wafers, reduces the losses caused by misjudgment, and reduces costs.

[0048] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one" does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0049] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic device for testing and sorting full-size flash memory wafers, characterized in that: The invention comprises a frame (1), on which a high-precision alignment adsorption platform module (2) is arranged, and the high-precision alignment adsorption platform module (2) comprises a Y-axis alignment electric mechanism (21), an X-axis alignment electric mechanism (22), a Z-axis alignment electric mechanism (23), an adsorption fixture platform (24), and an adsorption positioning camera (25); The frame (1) is also provided with a test needle card installation platform (3) that can be moved by a related driving component, the frame (1) is provided with a loading and unloading claw transplanting module (5), the loading and unloading claw transplanting module (5) is provided with a loading and unloading suction claw module (6), the frame (1) is provided with a Tary module (7) that can be moved by a related driving component, and the frame (1) is also provided with a unloading camera positioning module (9).

2. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: There are a plurality of high-precision alignment adsorption platform modules (2), and the plurality of high-precision alignment adsorption platform modules (2) are evenly arranged along the length direction of the frame (1).

3. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 2, characterized in that: The frame (1) is also provided with a manual alignment microscope module (10); the X-axis alignment electric mechanism (22) is arranged on the Y-axis alignment electric mechanism (21); the Z-axis alignment electric mechanism (23) is arranged on the X-axis alignment electric mechanism (22); the adsorption fixture platform (24) is arranged on the Z-axis alignment electric mechanism (23); and the adsorption positioning camera (25) is arranged on the adsorption fixture platform (25).

4. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 3, characterized in that: The test needle card installation platform (3) is provided with a Z-direction precision adjustment slide (31), a Y-direction precision adjustment slide (32), an X-direction precision adjustment slide (33), a test needle card installation seat (34) and an X-direction precision adjustment rod (35).

5. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 4, characterized in that: The test needle card installation platform (3) is driven by a test needle card installation platform transplanting module (4), and the test needle card installation platform transplanting module (4) is provided with a driving motor (41), a precision guide rail (42), a precision installation platform (43) and a precision grinding screw (44).

6. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 5, characterized in that: The loading and unloading claw transplanting module (5) comprises a Y-axis module connected to the loading and unloading claw transplanting module and an X-axis module connected to the loading and unloading claw transplanting module, and the X-axis module connected to the loading and unloading claw transplanting module is arranged on the Y-axis module connected to the loading and unloading claw transplanting module.

7. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 6, characterized in that: The loading and unloading suction claw module (6) is provided with a suction nozzle lifting motor (61), a suction nozzle lifting guide rail (62), a suction nozzle rotating motor (63), an anti-static traceless suction claw (64), a positioning CCD camera (65) and a motor lifting adjustment slide (66).

8. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 7, characterized in that: The Tary module (7) is driven by the Tray transplanting module (8), there are a plurality of Tary modules (7), and a single Tray transplanting module (8) can synchronously drive a plurality of Tary modules (7) to move.

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