Chemical supply apparatus and chemical exchange method

Abstract

The invention discloses chemical supply equipment and a chemical exchange method. Specifically disclosed is a chemical exchange method in a liquid treatment apparatus, the liquid treatment apparatus comprising a first tank, a second tank and a third tank, the method includes: a flushing operation of discharging chemicals in a first tank, a second tank, and a third tank, injecting a flushing chemical into each tank and then circulating the flushing chemical, and then discharging the flushing chemical; and supplying a new chemical to at least one of the first tank, the second tank, and the third tank to perform a liquid exchange operation of liquid exchange.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0165711 filed in the Korean Intellectual Property Office on November 24, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The invention relates to a chemical supply device and a chemical exchange method. Background Art

[0004] The contaminants (such as particles, organic contaminants, and metal contaminants) remaining on the surface of the substrate greatly affect the characteristics and production yield of semiconductor devices. Therefore, in the semiconductor manufacturing process, a cleaning process for removing various contaminants attached to the surface of the substrate is very important, and a process for cleaning the substrate is performed before and after each unit process for manufacturing semiconductors. The process for removing these foreign substances includes a cleaning process using deionized water or chemicals.

[0005] Chemicals used in the substrate cleaning process can be recycled and reused. Chemicals recycled from the substrate processing unit are directly supplied to the chemical storage tank, or recycled to a separate recycling tank and then supplied to the chemical storage tank. Chemicals recycled in the chemical storage tank are supplied to the substrate processing unit and reused.

[0006] However, as the number of times the chemical is reused increases, problems arise in which the chemical concentration deviates from the standard concentration and fine particles remain in the chemical. Therefore, when the life of the chemical is reached or the concentration of the chemical changes, liquid exchange is performed to discharge all remaining chemicals and replace the chemical with new chemicals.

[0007] However, when the concentration of the new chemical filled in the tank is mixed with the remaining chemical remaining in the tank and pipeline (circulation line), the concentration of the new chemical will change, resulting in changes in process performance.

[0008] For example, in the process of etching the TiN film of the substrate, when the chemical is repeatedly used, Ti ions will dissolve in the chemical. When the chemical with high Ti ions is simply liquid exchanged, there is not only the disadvantage of causing defects due to the lifetime, but also the problem of reduced stability of the chemical when the chemical with high Ti ions encounters new chemicals and is diluted (Ti ions are formed by decomposing H 2 O 2 Factors that affect TiN etching rate). Summary of the invention

[0009] The present invention is directed to providing a chemical supplying apparatus and a chemical exchanging method capable of preventing concentration fluctuation in a chemical during a process of replacing a chemical whose life has expired with a new chemical.

[0010] The present invention also aims to provide a chemical supply device and a chemical exchanging method capable of preventing concentration fluctuation in the chemical during liquid exchange between tanks.

[0011] The present invention also aims to provide a chemical supplying apparatus and a chemical exchanging method capable of minimizing chemicals remaining in tanks and circulation lines connected to the tanks during liquid exchange between tanks.

[0012] Problems to be solved by the present invention are not limited to the above-mentioned problems, and unmentioned problems will be clearly understood by those skilled in the art from the following description.

[0013] An exemplary embodiment of the present invention provides a chemical exchange method in a liquid treatment device, the liquid treatment device including a first tank, a second tank and a third tank, the method including: a flushing operation of discharging chemicals received in the first tank, the second tank and the third tank, injecting a flushing chemical into each tank and then circulating the flushing chemical, and then discharging the flushing chemical; and a liquid exchange operation of supplying a new chemical to at least one of the first tank, the second tank and the third tank to perform liquid exchange.

[0014] Further, the flushing operation may include setting the draining time of each tank and the injection and circulation operations of the flushing chemical to be different, and draining the flushing chemical when the flushing chemical injected into each tank reaches the end of its service life.

[0015] Further, chemicals used in the processing unit may be recovered and stored in the first tank, chemicals provided from the first tank may be stored in the second tank, and chemicals to be supplied to the processing unit may be provided from the second tank and stored in the third tank.

[0016] Further, in the flushing operation, the flushing time of the third tank may be set to be relatively longer than the flushing time of the first tank and the flushing time of the second tank.

[0017] Further, in the flushing operation, the amount of the flushing chemical injected into the third tank may be set to be relatively larger than the amount of the flushing chemical injected into the first tank and the amount of the flushing chemical injected into the second tank.

[0018] Further, this flushing operation may be repeated several times.

[0019] Further, the flushing operation may be performed before the useful life of the chemical is reached.

[0020] Further, the flushing operation may include: discharging the chemicals from the first tank and the third tank; first injecting the flushing chemicals into the third tank, circulating the flushing chemicals through the inside of a circulation line connected to the third tank and discharging the chemicals from the second tank; circulating the flushing chemicals injected into the third tank through a supply circulation line connected to a supply line of the processing unit, and injecting the flushing chemicals into the second tank; injecting the flushing chemicals into the first tank, and circulating the flushing chemicals injected into the second tank through the inside of the circulation line; circulating the flushing chemicals injected into the first tank through the inside of the circulation line; and discharging the chemicals when the flushing time of each of the first tank, the second tank and the third tank is reached.

[0021] Further, the internal circulation of the flushing chemical in the second tank and the internal circulation of the flushing chemical in the third tank may use the same pump.

[0022] Further, in the flushing operation, the time of injecting the flushing chemical into the first tank may be the same as the time of injecting the flushing chemical into the second tank.

[0023] Further, the flushing chemical may be the same chemical as the new chemical.

[0024] Further, the new chemical may be supplied only to the second tank and the third tank, excluding the first tank.

[0025] According to another exemplary embodiment of the present invention, there is provided a processing solution supply device for supplying chemicals to a substrate processing device, the processing solution supply device comprising: a first tank in which chemicals used in the substrate processing device are recovered; a second tank for receiving chemicals from the first tank; a third tank for receiving chemicals from the second tank and connected to a main circulation pipeline for supplying chemicals to the substrate processing device; a chemical supply source for supplying chemicals to each of the first tank, the second tank and the third tank; and a controller for controlling the tanks and the chemical supply sources to perform a flushing mode and a liquid exchange mode in which chemicals received in the first tank, the second tank and the third tank are discharged, flushing chemicals are injected into each tank and then circulated, and then the flushing chemicals are discharged, and in the liquid exchange mode, new chemicals are supplied to at least one of the first tank, the second tank and the third tank to perform liquid exchange.

[0026] Further, the controller may set the draining time of each tank and the injection and circulation operations of the flushing chemical to be different, and drain the flushing chemical when the flushing chemical injected into each tank reaches the end of its service life in the flushing mode.

[0027] Further, the controller may set the flushing time of the third tank to be relatively longer than the flushing time of the first tank and the second tank, and set the amount of flushing chemicals injected into the third tank in the flushing mode to be relatively larger than the amount of flushing chemicals injected into the first tank and the second tank, and the injection, circulation operation and discharge of the flushing chemicals of each tank are repeated at least once.

[0028] Further, the controller may control the tanks and the chemical supply sources so that injection and circulation operations and discharge of the flushing chemical of the third tank are performed in priority to the first tank and the second tank.

[0029] Another exemplary embodiment of the present invention provides a chemical exchange method in a liquid treatment device, the liquid treatment device including: a first tank for recovering chemicals used in a processing unit; a second tank for receiving chemicals from the first tank; and a third tank for receiving chemicals to be supplied to the processing unit from the second tank, the chemical exchange method including: a flushing operation for discharging chemicals received in the first tank, the second tank, and the third tank before reaching the service life of the chemicals, injecting flushing chemicals into each tank and then circulating the flushing chemicals, and then discharging the flushing chemicals; and a liquid exchange operation for supplying new chemicals to at least one of the first tank, the second tank, and the third tank to perform liquid exchange, wherein the flushing operation includes setting the discharge time of each tank and the injection and circulation operations of the flushing chemicals to be different, and discharging the flushing chemicals when the flushing chemicals injected into each tank reach the service life, and recovering and storing the chemicals used in the processing unit in the first tank, storing the chemicals supplied from the first tank in the second tank, and the chemicals to be supplied to the processing unit are supplied from the second tank and stored in the third tank.

[0030] Further, in the flushing operation, the flushing time of the third tank may be set to be relatively longer than the flushing time of the first tank and the flushing time of the second tank.

[0031] Further, in the flushing operation, the amount of the flushing chemical injected into the third tank may be set to be relatively larger than the amount of the flushing chemical injected into the first tank and the amount of the flushing chemical injected into the second tank.

[0032] The flushing operation includes: discharging the chemicals in the first tank and the third tank; first injecting the flushing chemical into the third tank, circulating the flushing chemical internally through a circulation line connected to the third tank, and discharging the chemical in the second tank; circulating the flushing chemical injected into the third tank through a main circulation line connected to a supply line of a processing unit and injecting the flushing chemical into the second tank; injecting the flushing chemical into the first tank and circulating the flushing chemical injected into the second tank internally through a circulation line; circulating the flushing chemical injected into the first tank internally through the circulation line; and discharging the chemical when the flushing time of each of the first tank, the second tank and the third tank is reached, the internal circulation of the flushing chemical in the second tank and the internal circulation of the flushing chemical in the third tank use the same pump, the flushing chemical is the same chemical as the new chemical, and in the liquid exchange operation, the new chemical is supplied only to the second tank and the third tank, excluding the first tank.

[0033] According to an exemplary embodiment of the present invention, process stability can be ensured by preventing fluctuations in chemical concentration during a process of replacing chemicals that have reached the end of their useful life with new drug solutions.

[0034] According to the exemplary embodiment of the present invention, it is possible to prevent the concentration of chemicals from changing when the tank is subjected to liquid exchange.

[0035] According to an exemplary embodiment of the present invention, residual chemicals in a tank and a circulation line connected to the tank may be minimized during liquid exchange of the tank.

[0036] The effects of the present inventive concept are not limited to the above-mentioned effects, and those skilled in the art will clearly understand unmentioned effects from the specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a schematic diagram illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0038] Figure 2 is a schematic diagram showing a Figure 1 Schematic diagram of the liquid processing chamber.

[0039] Figure 3 is a schematic diagram showing a chemical supply connected to a liquid processing chamber.

[0040] Figure 4 is a flow chart showing a process solution exchanging method in a chemical supply device.

[0041] Figures 5 to 11 is a schematic diagram sequentially showing a method of processing liquid exchange. DETAILED DESCRIPTION

[0042] Hereinafter, exemplary embodiments of the present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention may be implemented differently and is not limited to the following exemplary embodiments. In the following description of the present invention, detailed descriptions of known functions and configurations incorporated herein are omitted to avoid making the subject matter of the present invention unclear. In addition, throughout the accompanying drawings, the same reference numerals are used for components with similar functions and effects.

[0043] Unless explicitly described to the contrary, the word "include" will be understood to imply the inclusion of the elements described but not the exclusion of any other elements. It should be understood that the terms "include" and "have" are intended to indicate the presence of the features, numbers, operations, operations, constituent elements and parts, or combinations thereof described in the specification, and do not exclude the pre-existence or addition of one or more other features, numbers, operations, operations, constituent elements and parts, or combinations thereof.

[0044] Singular expressions used herein include plural expressions unless they have clearly opposite meanings in the context. Therefore, the shapes, sizes, etc. of elements in the drawings may be exaggerated for clearer description.

[0045] Terms such as first and second can be used to describe different components, but the components should not be limited by the terms. These terms are only used to distinguish one component from another component. For example, without departing from the scope of the present invention, the first component can be named as the second component, and similarly, the second component can be named as the first component.

[0046] It should be understood that when a component element is referred to as being “coupled to another component element” or “connected to another component element”, the component element may be directly connected to another component element or coupled to another component element, but other intervening components may also exist. Conversely, when a component element is “directly coupled to another component element” or “directly connected to another component element”, it should be understood that there are no intervening elements. Other expressions describing the relationship between component elements, such as “between… and…”, “just between… and…” or “adjacent to…” and “directly adjacent to…”, should be similarly interpreted.

[0047] All terms (including technical terms or scientific terms) used herein have the same meaning as those generally understood by those skilled in the art, unless these terms are defined differently. Terms defined in general dictionaries will be interpreted as having meanings that match their meanings in the relevant technical context, and unless these terms are clearly defined in this application, they should not be interpreted as ideal meanings or overly formal meanings.

[0048] In the following, reference will be made to Figures 1 to 11 Exemplary embodiments of the present invention are described.

[0049] Figure 1 is a schematic diagram illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0050] Reference Figure 1 , the substrate processing device includes an index module 10, a processing module 20 and a controller. When viewed from above, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction X, and when viewed from above, a direction perpendicular to the first direction X is referred to as a second direction Y, and a direction perpendicular to both the first direction X and the second direction Y is referred to as a third direction Z.

[0051] The index module 10 transfers the substrate W from the container C containing the substrate W therein to the process module 20, and contains the substrate processed in the process module 20 into the container C. The longitudinal direction of the index module 10 is arranged along the second direction Y. The index module 10 includes a loading port 12 and an index frame 14. The loading port 12 is located at an opposite side of the process module 20 based on the index frame 14. The container C containing the substrate W therein is placed in the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be placed along the second direction Y.

[0052] A sealed container such as a Front Open Unified Pod (FOUP) may be used as the container C. The container C may be placed on the load port 12 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0053] The index robot 120 is provided to the index frame 14. A guide rail 124 whose longitudinal direction is provided in the second direction Y is provided in the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 124. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable in the forward and backward directions, rotatable around the third direction Z, and movable along the third direction Z. A plurality of hands 122 may be provided at intervals in the vertical direction, and the hands 122 may be moved forward and backward independently of each other.

[0054] The controller 30 can control the substrate processing device. The controller 30 may include: a process controller, which is composed of a microprocessor (computer) that performs control of the substrate processing device; a user interface, which is composed of a keyboard in which the operator performs command input operations, etc. to manage the substrate processing device; a display, which is used to visualize and display the operating status of the substrate processing device, etc.; and a storage unit, which stores a control program for executing a process performed in the substrate processing device under the control of the process controller, or stores a program for executing a process in each component according to various data and processing conditions (i.e., a processing scheme). Further, the user interface and the storage unit may be connected to the process controller. The processing scheme may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or a DVD), or a semiconductor memory (such as a flash memory).

[0055] The process module 20 includes a buffer unit 200, a transfer chamber 300, a liquid treatment chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which the substrate W loaded into the process module 20 and the substrate W unloaded from the process module 20 temporarily stay. The liquid treatment chamber 400 performs a liquid treatment process of treating the substrate W with liquid by supplying liquid onto the substrate W. The drying chamber 500 performs a drying process of removing liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid treatment chamber 400, and the drying chamber 500.

[0056] The longitudinal direction of the transfer chamber 300 may be arranged along the first direction X. The buffer unit 200 may be arranged between the index module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 may be arranged on the side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the second direction Y. The drying chamber 500 and the transfer chamber 300 may be arranged along the second direction Y. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0057] According to an example, the liquid processing chamber 400 is disposed on both sides of the transfer chamber 300, and the drying chamber 500 is disposed on both sides of the transfer chamber 300, and the liquid processing chamber 400 may be disposed closer to the buffer unit 200 than the drying chamber 500. At one side of the transfer chamber 300, the liquid processing chamber 400 may be disposed in an arrangement of A×B (each of A and B is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. Further, at one side of the transfer chamber 300, the drying chamber 500 may be disposed in the number of C×D (each of C and D is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. Different from the above, only the liquid processing chamber 400 may be disposed on one side of the transfer chamber 300, and only the drying chamber 500 may be disposed on the other side of the transfer chamber 300.

[0058] The transfer chamber 300 includes a transfer robot 320. A guide rail 324 whose longitudinal direction is provided in the first direction X may be provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 324. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 may be provided to be movable in the forward and backward directions, rotatable around the third direction Z, and movable along the third direction Z. A plurality of hands 322 may be provided to be spaced apart in the vertical direction, and the plurality of hands 322 may be moved forward and backward independently of each other.

[0059] The buffer unit 200 includes a plurality of buffer zones 220 on which the substrate W is placed. The buffer zones 220 may be arranged to be spaced apart from each other along the third direction Z. The front and rear of the buffer unit 200 are open. The front is a surface facing the index module 10, and the rear is a surface facing the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

[0060] Figure 2 is a schematic diagram showing a Figure 1 Schematic diagram of the liquid processing chamber.

[0061] Reference Figure 2 The liquid processing chamber 400 includes a housing 410 , a cup 420 , a support unit 440 , a liquid spraying unit 460 , and a lifting unit 480 .

[0062] The housing 410 may have an inner space for processing the substrate W. The housing 410 may have a substantially parallelepiped shape. For example, the housing 410 may have a cubic shape. In addition, the housing 410 may have an opening (not shown) through which the substrate W is loaded or unloaded. In addition, the housing 410 may be equipped with a door (not shown) that selectively opens and closes the opening.

[0063] The cup 420 may have a barrel shape with an open top. The cup 420 has a processing space, and the substrate W may be liquid-processed in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid to the substrate W supported on the support unit 440. Various types of processing solutions may be provided, and the various types of processing solutions may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0064] According to an example, the cup 420 includes a plurality of recovery containers 422, 424, and 426. Each of the recovery containers 422, 424, and 426 has a recovery space for recovering liquid used to process the substrate. Each of the recovery containers 422, 424, and 426 is arranged in an annular shape around the support unit 440. When the liquid treatment process is performed, the treatment solution sputtered by the rotation of the substrate W enters the recovery space through the inlets 422a, 424a, and 426a of the recovery containers 422, 424, and 426, respectively. According to an example, the cup 420 includes a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is arranged to surround the support unit 440, the second recovery container 424 is arranged to surround the first recovery container 422, and the third recovery container 426 is arranged to surround the second recovery container 424. The second inlet 424a introducing liquid into the second recovery container 424 may be located above the first inlet 422a introducing liquid into the first recovery container 422, and the third inlet 426a introducing liquid into the third recovery container 426 may be located above the second inlet 424a.

[0065] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 may be set to a substantially circular shape and may have a diameter larger than the diameter of the substrate W. A support pin 442a is provided in the central portion of the support plate 442 to support the rear surface of the substrate W, and the support pin 442a is provided with an upper end protruding from the support plate 442 so that the substrate W is spaced a certain distance from the support plate 442. A chuck pin 442b is provided to the edge of the support plate 442. The chuck pin 442b is provided to protrude upward from the support plate 442 and support the lateral portion of the substrate W so that when the substrate W rotates, the substrate W will not be separated from the support unit 440. The drive shaft 444 driven by the driver 446 is connected to the center of the bottom surface of the substrate W and rotates the support plate 442 relative to the central axis of the support plate.

[0066] In one example, the liquid spraying unit 460 may include a nozzle 462. The nozzle 462 may discharge a treatment solution onto the substrate W. The treatment solution may be a chemical, a rinse solution, or an organic solvent. The chemical may be a chemical having a strong acid or strong base property. In addition, the liquid spraying unit 460 may include a plurality of nozzles 462, each of which may supply a different type of treatment liquid. For example, one of the nozzles 462 may supply a chemical, another of the nozzles 462 may supply a rinse solution, and another of the nozzles 462 may supply an organic solvent. The liquid spraying unit 460 receives the treatment liquid (chemical) from the chemical supply device 600.

[0067] The present invention can be applied to a wet etching process or a cleaning process for removing a film on a substrate surface, and various processing solutions can be used in these processes. The processing solution that can be used in the present invention may include at least one or more substances selected from the following: hydrofluoric acid (HF), sulfuric acid (H 2 SO 4 ), hydrogen peroxide (H 2 O 2 ), nitric acid (HNO 3 ), phosphoric acid (H 3 PO 4 ), ozone water, SC-1 solution (ammonium hydroxide (NH 4 OH), hydrogen peroxide (H 2 O 2 ) and water (H 2 O) mixture), and further, the processing solution may include processing solutions of various substances that can be used in substrate processing processes.

[0068] The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate W is changed by the vertical movement of the cup 420. Accordingly, since the recovery containers 422, 424, and 426 for recovering the processing solution are changed according to the type of liquid supplied to the substrate W, the liquid can be separated and collected. Different from the description, the cup 420 may be fixedly installed, and the lifting unit 480 may move the supporting unit 440 in the vertical direction.

[0069] Figure 3 is a schematic diagram showing a chemical supply apparatus connected to a liquid processing chamber.

[0070] Reference Figure 3 , the chemical supply device 600 supplies chemicals for processing the substrate to the liquid processing chamber 400. Figure 3 In the embodiment of the present invention, a chemical supply device 600 may be provided to supply chemicals to a plurality of liquid processing chambers 400. In the liquid processing chamber 400, a process of etching a TiN film of a substrate may be performed. When chemicals are continuously and repeatedly used in the process of etching a TiN film, the Ti ion concentration in the chemicals increases. When chemicals with a high Ti ion concentration are mixed with new chemicals, the stability of the chemicals may deteriorate. Therefore, before supplying new chemicals, a flushing process for removing the residual chemicals in the circulation line of each tank and the chemical supply device is very important.

[0071] The chemical supplying apparatus 600 may include a first tank 610, a second tank 620, a third tank 630, a chemical supply source 640, and a controller 30. The controller 30 may control the first tank 610, the second tank 620, the third tank 630, and the chemical supply source 640.

[0072] The first tank 610 is a recovery tank that receives and regenerates chemicals used in the liquid processing chamber 400, the second tank 620 is a sub-tank that performs fine temperature control on the chemicals received from the first tank 610, and the third tank 630 is a main tank of a chemical supply device that receives chemicals from the second tank 620 and supplies the chemicals to the liquid processing chamber 400.

[0073] In the first tank 610, a recovery line 618 is connected to the liquid processing chamber 400. Chemicals used in the liquid processing chamber 400 are recovered to the first tank 610 through the recovery line 618. A filter F and a pump P may be installed on the recovery line 618.

[0074] The first tank 610 may be replenished with new chemicals so that the chemicals recovered through the recovery line 618 may be reused, thereby allowing chemical concentration correction to be performed. New chemicals for chemical concentration correction may be supplied through the chemical supply source 640.

[0075] The first tank 610 may include a first circulation line 612 and a reuse supply line 614. The first circulation line 612 circulates the chemicals stored in the first tank 610. A pump P, a filter F, and a heater H may be installed on the first circulation line 612. The chemicals completing the regeneration process in the first tank 610 are supplied to the second tank 620 through the reuse supply line 618. The first tank 610 is provided with a first discharge line 619 at the bottom.

[0076] The second tank 620 stores chemicals supplied from the first tank 610. The second tank performs fine temperature correction of the chemicals. The second tank 620 may include a second circulation line 622 and a first supply line 624. The second circulation line 622 circulates the chemicals stored in the second tank 620. A pump P, a filter F, and a heater H may be installed on the second circulation line 622. The chemicals that have completed temperature correction in the second tank 620 are supplied to the third tank 630 through the first supply line 624. The second tank 620 is provided with a second discharge line 629 at the bottom.

[0077] The third tank 630 stores chemicals supplied from the second tank 620. The third tank 630 may include a third circulation line 632 and a supply circulation line 634. The third circulation line 632 circulates the chemicals stored in the third tank 630. The third circulation line 632 is connected to the second circulation line, and may use a pump P, a filter F, and a heater H installed in the second circulation line 622. The pump P, the filter F, and the heater H installed in the second circulation line may be used to circulate the chemicals inside the third tank 630. The third circulation line 632 may include a portion of the second circulation line 622 in which the pump P, the filter F, and the heater H are installed, and the first supply line 624. The third tank 630 is provided with a third exhaust line 639 at the bottom. The pump P, the filter F, and the heater H may be installed in the supply circulation line 634. The supply line 409 of the liquid processing chamber 400 is connected to the supply circulation line 634. The supply line 409 may be connected to Figure 2 The nozzle 462 of the liquid spraying unit 460 is shown in FIG.

[0078] The valves installed in the first tank 610 , the second tank 620 , and the third tank 630 may be controlled by the controller 30 .

[0079] The processing solution supply source 640 may supply a rinse chemical for rinsing the first tank 610, the second tank 620, and the third tank 630 in the rinse mode. The rinse chemical may be the same chemical as the chemical used in the process. After the rinse mode is completed, the chemical supply source 640 may supply new chemicals to the second tank 620 and the third tank 630, excluding the first tank 610.

[0080] The controller 30 can control the tanks 610, 620 and 630 and the chemical supply source 640 to perform a flushing mode and a liquid exchange mode, in which the chemicals (existing chemicals) received in the first tank 610, the second tank 620 and the third tank 630 are discharged, the flushing chemicals are injected into each of the tanks 610, 620 and 630 and the flushing chemicals are circulated and then discharged, and in the liquid exchange mode, new chemicals are supplied to the second tank 620 and the third tank 630 for liquid exchange.

[0081] The controller 30 may set the draining time of each tank 610, 620 and 630 and the injection and circulation operation of the flushing chemical differently in the flushing mode. In addition, when the flushing chemical injected into each tank 610, 620 and 630 reaches its service life, the controller 30 may control the valve installed in each drain line 619, 629 and 639 to drain the flushing chemical.

[0082] In the flushing mode, the controller 30 may set the flushing time of the third tank 630 to be relatively longer than the flushing time of the first tank 610 and the second tank 620, and may set the flushing chemical injected into the third tank 630 to be relatively more than the flushing chemical injected into the first tank 610 and the second tank 620. It is desirable that the flushing mode consisting of flushing chemical injection, circulation operation, and discharge of each tank 610, 620, and 630 is repeated at least once.

[0083] The controller 30 may control the tanks 610 , 620 , and 630 and the processing solution supply source 640 so that the injection and circulation operations of the rinse chemical performed in the third tank 630 and the discharge are performed in priority to the first tank 610 and the second tank 620 .

[0084] Since the third tank 630 has a relatively longer circulation line than the first tank 610 and the second tank 620, the amount of chemicals remaining in the circulation line during liquid exchange is also greater than the chemicals of the first tank 610 and the second tank 620. Therefore, the chemical supplying device 600 preferentially performs the flushing mode of the third tank 630 and injects a relatively large amount of flushing chemicals for rapid flushing, thereby enabling rapid liquid exchange and supplying high-quality chemicals immediately after flushing.

[0085] Figure 4 is a flow chart showing a process solution exchange method in a chemical supply device, and Figures 5 to 11 is a schematic diagram sequentially showing a process liquid exchange method.

[0086] Reference Figures 4 to 11 , the processing solution exchanging method may include a rinsing operation S100 and a liquid exchanging operation S200.

[0087] The process solution is exchanged before the service life of the chemical of the liquid supply device is reached. For example, when the service life of the chemical is 24 hours, the chemical exchange can be performed when the service life of the chemical is 1 hour remaining. The flushing chemical supplied to each tank in the flushing operation uses the same chemical as the chemical used in the process. Therefore, when new chemicals are supplied to each tank after flushing, the phenomenon of chemical concentration fluctuation can be prevented.

[0088] The flushing operation S100 is a process of discharging the chemicals received in the first tank 610, the second tank 620, and the third tank 630, injecting the flushing chemicals into each tank, circulating the flushing chemicals, and then discharging the flushing chemicals. Specifically, first, the chemicals in the first tank 610 and the third tank 630 are discharged (see Figure 5 ). When the discharge of the chemicals in the first tank 610 and the third tank 630 is completed, the flushing chemical is first injected into the third tank 630 and the flushing chemical is circulated inside through the third circulation line 632 connected to the third tank 630. In this case, the chemicals in the second tank 620 are discharged (see Figure 6 ). When the discharge of the chemicals in the second tank 620 is completed, the flushing chemicals injected into the third tank 630 are circulated through the supply circulation pipeline 634 (main circulation). Then, the flushing chemicals are injected into the emptied second tank 620 (see Figure 7 ). When the flushing chemical is completely injected into the second tank 620, the flushing chemical is injected into the first tank 610, and the flushing chemical in the second tank 620 is internally circulated through the second circulation line 622 (internal circulation) (see Figure 8 ). For example, the time of injecting the flushing chemical into the first tank 610 may be the same as the time of injecting the flushing chemical into the second tank 620. However, since the supply capacity of the chemical supply source 640 is limited, it is preferred that the flushing chemical is supplied sequentially to each tank.

[0089] When the flushing chemical is injected into the first tank 610, the flushing chemical of the first tank 610 is internally circulated to the first circulation line 612 (internal circulation) (see Fig. 9When the flushing time of each of the first tank 610, the second tank 620, and the third tank 630 is reached, the flushing chemical is discharged from each tank (see Fig.10 ).

[0090] In the flushing operation, the flushing time of the third tank 630 is set to be relatively longer than the flushing time of the first tank 610 and the second tank 620. For example, the flushing time of the third tank 630 may be set to 10 minutes, the flushing time of the second tank 620 may be set to 7 minutes, and the flushing time of the first tank 610 may be set to 5 minutes. In addition, in the flushing operation, the amount of flushing chemicals injected into the third tank 630 may be set to be relatively larger than the amount of flushing chemicals injected into the first tank 610 and the second tank 620. For example, when it is assumed that the storage capacity of the first tank, the second tank, and the third tank is 70L, the flushing chemicals injected into the third tank 630 may be set to 20L, the flushing chemicals injected into the second tank 620 may be set to 10L, and the flushing chemicals injected into the first tank 610 may be set to 7L. That is, since the third tank 630 includes a relatively longer circulation line than the first tank 610 and the second tank 620, the amount of flushing chemicals injected and the flushing time are assigned to be relatively longer, and the injection of the flushing chemicals is also assigned the highest priority.

[0091] At the same time, the flushing operation can be repeated 2 to 5 times to remove the residual chemicals in the circulation line as much as possible. Specifically, the number of flushing operations can be set differently for each tank. For example, the number of flushing operations of the third tank 630 can be set to 4 times, the number of flushing operations of the second tank 620 can be set to 3 times, and the number of flushing operations of the first tank 610 can be set to 2 times. As described above, the process margin can be ensured by removing the residual chemicals in the circulation line of each tank, and fresh chemicals can be prepared by diluting the discharge of Ti in the circulation line. During the flushing operation, the heater installed in each circulation line does not work.

[0092] After the flushing operation is completed, the liquid exchange operation S200 supplies new chemicals to the second tank 620 and the third tank 630, excluding the first tank 610 (see Fig.11 ). New chemicals are supplied from the chemical supply source 640. When the new chemicals are supplied to the third tank 630, internal circulation (heater operation) is performed through the third circulation line 632, and when the supply of the chemicals to the third tank 630 is completed, the new chemicals are circulated (main circulation) through the supply circulation line 634. When the flushing operation of the second tank 620 is completed, new chemicals are also supplied to the second tank 620, and when the supply of the new chemicals to the second tank 620 is completed, internal circulation (heater operation) is performed through the second circulation line 622.

[0093] As described above, the processing solution exchanging method in the chemical supplying device sets different draining times and injection and circulation operations of flushing chemicals for each tank, and when the flushing chemicals injected into each tank reach their service life, the flushing chemicals are drained and then replaced with new chemicals.

[0094] The foregoing detailed description illustrates the present invention. In addition, the above content shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, within the scope of the inventive concept disclosed in this specification, the scope equivalent to the content of the present invention and / or the technology or knowledge in the art, the foregoing content can be modified or amended. The foregoing exemplary embodiments describe the best state of the technical spirit of the implementation of the present invention, and various changes required in the specific application fields and uses of the present invention are possible. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the attached claims should be interpreted as also including other exemplary embodiments.

Claims

1. A method for exchanging chemicals in a liquid treatment device, the liquid treatment device comprising a first tank, a second tank and a third tank, the method comprising: a flushing operation of discharging the chemicals received in the first tank, the second tank, and the third tank, injecting a flushing chemical into each tank and then circulating the flushing chemical, and then discharging the flushing chemical; as well as A liquid exchange operation of supplying new chemicals to at least one of the first tank, the second tank, and the third tank to perform liquid exchange.

2. The chemical exchange method according to claim 1, wherein: The flushing operation includes setting the draining time of each tank and the injection and circulation operations of the flushing chemical to be different, and when the flushing chemical injected into each tank reaches the end of its service life, the flushing chemical is drained.

3. The chemical exchange method according to claim 1, wherein: The chemicals used in the processing unit are recovered and stored in the first tank, the chemicals supplied from the first tank are stored in the second tank, and the chemicals to be supplied to the processing unit are supplied from the second tank and stored in the third tank.

4. The chemical exchange method according to claim 1, wherein: In the flushing operation, the flushing time of the third tank is set to be relatively longer than the flushing time of the first tank and the flushing time of the second tank.

5. The chemical exchange method according to claim 1, wherein: In the flushing operation, an amount of the flushing chemical injected into the third tank is set to be relatively larger than an amount of the flushing chemical injected into the first tank and an amount of the flushing chemical injected into the second tank.

6. The chemical exchange method according to claim 1, wherein: The washing operation was repeated several times.

7. The chemical exchange method according to claim 1, wherein: The flushing operation is performed before the useful life of the chemical is reached.

8. The chemical exchange method according to claim 1, wherein: The flushing operation includes: discharging the chemicals from the first tank and the third tank; first injecting the flushing chemical into the third tank, internally circulating the flushing chemical through a circulation line connected to the third tank, and discharging the chemical of the second tank; circulate the flushing chemical injected into the third tank through a supply circulation line connected to a supply line of a processing unit, and inject the flushing chemical into the second tank; injecting the flushing chemical into the first tank, and internally circulating the flushing chemical injected into the second tank through a circulation line; internally circulating the flushing chemical injected into the first tank through a circulation line; and When a flush time of each of the first tank, the second tank, and the third tank is reached, the chemical is discharged.

9. The chemical exchange method according to claim 8, wherein: The internal circulation of the flushing chemical in the second tank and the internal circulation of the flushing chemical in the third tank use the same pump.

10. The chemical exchange method according to claim 8, wherein: In the flushing operation, a time at which the flushing chemical is injected into the first tank is the same as a time at which the flushing chemical is injected into the second tank.

11. The chemical exchange method according to claim 1, wherein: The flushing chemical is the same chemical as the new chemical.

12. The chemical exchange method according to claim 1, wherein: The new chemical is supplied only to the second tank and the third tank, excluding the first tank.

13. A processing solution supply device for supplying chemicals to a substrate processing device, the processing solution supply device comprising: a first tank in which chemicals used in the substrate processing apparatus are recovered; a second tank for receiving the chemical from the first tank; a third tank that receives the chemical from the second tank and is connected to a main circulation line for supplying the chemical to the substrate processing device; a chemical supply source for supplying the chemical to each of the first tank, the second tank, and the third tank; as well as A controller for controlling the tanks and the chemical supply source to perform a flushing mode in which the chemicals received in the first tank, the second tank, and the third tank are discharged, a flushing chemical is injected into each tank and then circulated, and then the flushing chemical is discharged, and a liquid exchange mode in which new chemicals are supplied to at least one of the first tank, the second tank, and the third tank to perform liquid exchange.

14. The processing solution supply device according to claim 13, wherein: The controller sets the draining time of each tank and the injection and circulation operations of the flushing chemical to be different, and when the flushing chemical injected into each tank reaches the end of its service life in the flushing mode, the flushing chemical is drained.

15. The processing solution supply device according to claim 13, wherein: The controller sets a flushing time of the third tank to be relatively longer than flushing times of the first tank and the second tank, and sets an amount of flushing chemical injected into the third tank to be relatively larger than amounts of flushing chemical injected into the first tank and the second tank in the flushing mode, and The injection, circulation operation and discharge of the flushing chemical are repeated at least once for each tank.

16. The processing solution supply device according to claim 13, wherein: The controller controls the tanks and the chemical supply source so that the injection and circulation operations of the flushing chemical of the third tank and the discharge are performed in priority to the first tank and the second tank.

17. A method for exchanging chemicals in a liquid treatment device, the liquid treatment device comprising: a first tank for recovering the chemical used in the processing unit; and a second tank for receiving the chemical from the first tank; and a third tank for receiving the chemical supplied to the processing unit from the second tank, the chemical exchange method comprising: a flushing operation of discharging the chemicals received in the first tank, the second tank, and the third tank before reaching the useful life of the chemicals, injecting a flushing chemical into each tank and then circulating the flushing chemical, and then discharging the flushing chemical; and a liquid exchange operation of supplying a new chemical to at least one of the first tank, the second tank, and the third tank to perform liquid exchange, wherein the flushing operation includes setting the draining time of each tank and the injection and circulation operations of the flushing chemical to be different, and discharging the flushing chemical when the flushing chemical injected into each tank reaches the end of its service life, and The chemicals used in the processing unit are recovered and stored in the first tank, the chemicals supplied from the first tank are stored in the second tank, and the chemicals to be supplied to the processing unit are supplied from the second tank and stored in the third tank.

18. The chemical exchange method according to claim 17, wherein: In the flushing operation, the flushing time of the third tank is set to be relatively longer than the flushing times of the first tank and the second tank.

19. The chemical exchange method according to claim 17, wherein: In the flushing operation, an amount of the flushing chemical injected into the third tank is set to be relatively larger than an amount of the flushing chemical injected into the first tank and an amount of the flushing chemical injected into the second tank.

20. The chemical exchange method according to claim 17, wherein: The flushing operation includes: discharging the chemicals from the first tank and the third tank; first injecting the flushing chemical into the third tank, internally circulating the flushing chemical through a circulation line connected to the third tank, and discharging the chemical of the second tank; circulate the flushing chemical injected into the third tank through a main circulation line connected to a supply line of the processing unit, and inject the flushing chemical into the second tank; injecting the flushing chemical into the first tank and internally circulating the flushing chemical injected into the second tank through a circulation line; internally circulating the flushing chemical injected into the first tank through a circulation line; and discharging the chemical when a flush time of each of the first tank, the second tank, and the third tank is reached, The internal circulation of the flushing chemical in the second tank and the internal circulation of the flushing chemical in the third tank use the same pump, The flushing chemical is the same chemical as the new chemical, and In the liquid exchange operation, the new chemical is supplied only to the second tank and the third tank, excluding the first tank.

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