Panel manufacturing method and panel

Abstract

The invention discloses a panel manufacturing method and a panel. A manufacturing method of a panel comprises the following steps: providing a base material; providing a seed mold with wiredrawing textures on the surface, wherein one surface, with the wiredrawing textures, in the seed mold is defined as a transfer printing surface; curing glue is formed on the transfer printing face of the seed mold; pressing and bonding the transfer printing surface on which the curing adhesive is formed with one surface of the base material, and irradiating the curing adhesive with ultraviolet rays to perform primary curing treatment; and after the primary curing treatment, the base material is separated from the seed mold, and the curing glue is reserved on the surface of the base material to form a wiredrawing texture layer. According to the invention, the production cost can be reduced while the texture effect of the panel is improved.

Description

Technical Field

[0001] This application relates to the technical field of panel manufacturing, and particularly to a method for manufacturing a panel and a panel. Background Art

[0002] In current panels, especially decorative panels in the category of decorative parts, the main application scenarios include laser-structured appearance, front lower shell decoration of televisions, and single-leg base panels, etc. The main material processes include: IMD (In-Mold Decoration), PVD (Physical Vapor Deposition), tempered glass, aluminum mesh covers, and aluminum plate oxidation, etc. However, the panels manufactured by the above methods have a single form and cannot produce a high-quality texture effect.

[0003] In related technologies, in order to improve the overall appearance effect of the panel, the in-mold injection process is often used for the panel. First, printing is performed on the film, and after the film is formed and trimmed, it is placed in an injection molding machine for injection molding to obtain the product. The product obtained by this process has a smooth surface and a strong plastic feeling. It has neither a metallic texture and luster nor a delicate texture effect. At the same time, the processing procedure is complex, the injection mold is expensive, and the cost is high. Summary of the Invention

[0004] This application provides a method for manufacturing a panel and a panel, which can improve the texture effect of the panel while reducing the production cost.

[0005] In the first aspect of this application, a method for manufacturing a panel is provided, including the following steps:

[0006] Provide a substrate;

[0007] Provide a master mold with a brushed texture on its surface, and the surface of the master mold with the brushed texture is defined as the transfer surface;

[0008] Form a curable glue on the transfer surface of the master mold. The curable glue, by weight, includes 80 - 90 parts of prepolymer, 10 - 20 parts of reactive diluent, and 2 - 10 parts of photoinitiator;

[0009] Press and fit the transfer surface with the curable glue formed thereon against one side of the substrate, and irradiate the curable glue with ultraviolet light for primary curing treatment;

[0010] After the primary curing treatment, separate the substrate from the master mold, and retain the curable glue on the surface of the substrate to form a brushed texture layer.

[0011] In an exemplary embodiment of the present disclosure,

[0012] Providing a master mold with a brushed texture on its surface includes the following steps:

[0013] Obtain a metal plate and form a wire-drawing texture on the surface of the metal plate through a mechanical wire-drawing technique;

[0014] Obtain a resin plate, press one side of the resin plate against the side of the metal plate with the wire-drawing texture formed thereon, so that the wire-drawing texture is formed on the surface of the resin plate, and then separate the resin plate and the metal plate. After separation, the resin plate forms the seed mold.

[0015] In an exemplary embodiment of the present disclosure,

[0016] After separating the resin plate and the metal plate, the following steps are further included:

[0017] Set positioning marks on the resin plate outside the wire-drawing texture, and the orientation of the area where the wire-drawing texture is located on the resin plate can be confirmed through the positioning marks;

[0018] The positioning marks are correspondingly formed outside the wire-drawing texture layer of the substrate.

[0019] In an exemplary embodiment of the present disclosure,

[0020] After forming the wire-drawing texture layer on the substrate, the following steps are further included:

[0021] Coat the wire-drawing texture layer of the substrate to form a coating layer of a specific color, specifically including the following steps:

[0022] Place the substrate in a coating device and clean the surface where the wire-drawing texture layer of the substrate is located;

[0023] Perform magnetron sputtering on the wire-drawing texture layer of the substrate with a silicon target and a niobium target in sequence, and form a coating layer of a specific color by adjusting the coating thickness.

[0024] In an exemplary embodiment of the present disclosure,

[0025] After forming the coating layer, the following steps are further included:

[0026] Print light-blocking ink for preventing light from passing through on the coating layer and form a protective layer.

[0027] In an exemplary embodiment of the present disclosure,

[0028] After forming the protective layer on the substrate, the following steps are further included:

[0029] Locate the orientation of the wire-drawing texture layer on the substrate by using the positioning marks, and cut the substrate by a numerical control machine tool to form a panel with the wire-drawing texture layer.

[0030] In an exemplary embodiment of the present disclosure,

[0031] The position of the positioning mark on the substrate is identified by an image recognition device. After that, a positioning hole is formed by drilling at this position, and the numerical control machine tool positions the substrate according to the positioning hole to cut and form the panel with a corresponding shape.

[0032] In an exemplary embodiment of the present disclosure,

[0033] The positioning mark is formed on the resin plate by using an exposure and development process. Multiple sub-molds are replicated from the resin plate with the positioning mark, and the sub-molds constitute the seed mold.

[0034] In an exemplary embodiment of the present disclosure,

[0035] After separating the substrate and the seed mold, the following steps are further included:

[0036] The curing glue on the substrate is secondarily cured, and the secondary curing strength is greater than the primary curing strength, so that the curing glue hardens on the surface of the substrate.

[0037] The second aspect of the present application further provides a panel, which is made by using the manufacturing method described above. The panel includes a substrate and a wire drawing texture layer, a coating layer, and a protective layer formed on the substrate in sequence.

[0038] Beneficial effects:

[0039] In the present application, by directly transferring the wire drawing texture formed on the seed mold to the substrate, a wire drawing texture layer is formed on the substrate, so that the panel has a high-class texture effect, and there is no need to develop an injection mold for in-mold injection, saving the cost of the injection mold and reducing the production cost. Description of the drawings

[0040] Figure 1 Shows the flow chart of the manufacturing method of the panel according to some embodiments Figure 1 ;

[0041] Figure 2 Shows the flow chart of the manufacturing method of the panel according to some embodiments Figure 2 ;

[0042] Figure 3 Shows the flow chart of manufacturing the seed mold according to some embodiments;

[0043] Figure 4 Shows the structural schematic diagram of the panel according to some embodiments.

[0044] Description of the reference numerals:

[0045] Base material 11, wire drawing texture layer 12, coating layer 13, protective layer 14, primer layer 141, base color layer 142, and adhesion layer 143. Detailed implementation

[0046] To make the purpose and implementation of this application clearer, the following will clearly and completely describe the exemplary implementation of this application in combination with the drawings in the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only a part of the embodiments of this application, rather than all the embodiments.

[0047] It should be noted that the brief description of the terms in this application is only for the convenience of understanding the following described implementation, rather than intending to limit the implementation of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meanings.

[0048] In this application, terms such as "first", "second", "third", etc. in the specification, claims, and the above-mentioned drawings are used to distinguish similar or the same kind of objects or entities, and do not necessarily mean to limit a specific order or sequence, unless otherwise noted. It should be understood that such terms can be interchanged under appropriate circumstances.

[0049] The terms "include" and "have" and any of their variations are intended to cover but not exclude inclusion. For example, a product or device that includes a series of components does not necessarily have to be limited to all the components clearly listed, but may include other components that are not clearly listed or are inherent to these products or devices.

[0050] In the related art, in order to improve the overall appearance effect of the panel, the in-mold injection process is often used for the panel. First, printing is performed on the film, and after the film is formed and trimmed, it is placed in an injection molding machine for injection molding to obtain a product. The product obtained by this process has a smooth surface and a strong plastic feeling. It has neither a metallic texture and luster, nor a delicate texture effect. At the same time, the processing process is complex, the injection molding mold is expensive, and the cost is high. To solve the above problems, this application specifically proposes a method for manufacturing a panel.

[0051] See Figures 1 to 3 , the first aspect of this application provides a method for manufacturing a panel, and this manufacturing method includes the following steps:

[0052] Step S11: Provide the base material 11.

[0053] Among them, as for the panel, the base material 11 can be selected from one of PET (polyester resin), PC (polycarbonate), PMMA (polymethyl methacrylate), etc. In this embodiment, the base material 11 is preferably a PMMA sheet with a thickness of 2 mm, and its surface pencil hardness reaches 5H. The PMMA sheet has good transparency, chemical stability, weather resistance, is easy to dye and process, and is suitable for making decorative panels.

[0054] Step S12: Provide a master mold with a brushed texture on its surface, and the surface with the brushed texture in the master mold is defined as the transfer surface.

[0055] By providing the master mold, the provided master mold is formed with a brushed texture, which facilitates the subsequent transfer of the brushed texture onto the base material 11, so that one side of the base material 11 has a brushed texture, realizing a special effect of the panel appearance with an imitation metal brushed texture and enhancing the texture of the panel. Among them, the brushed texture in this embodiment can be an annular brushed texture, that is, a multi-loop concentric annular structure is formed. Of course, the brushed texture can also form other shapes, such as a strip brushed texture, a rectangular brushed texture, etc.

[0056] Step S13: Form a curing adhesive on the transfer surface of the master mold. The curing adhesive, by weight, includes 80-90 parts of a prepolymer, 10-20 parts of an active diluent, and 2-10 parts of a photoinitiator.

[0057] Specifically, the curing adhesive can be dispensed onto the transfer surface of the master mold by a dispensing machine or directly coated on the transfer surface of the master mold, so that the curing adhesive fills the concave parts in the brushed texture, and the curing adhesive levels on the transfer surface. Among them, the curing adhesive can be a UV adhesive. The UV adhesive is a one-component resin cured by light, which can be cured and formed by ultraviolet light (UV light), and the formed hardened layer has the characteristics of high transparency and high hardness.

[0058] The curing adhesive prepared by the weight ratio of 80-90 parts of a prepolymer, 10-20 parts of an active diluent, and 2-10 parts of a photoinitiator makes the prepolymer as the main material account for a larger proportion. In this ratio range, the poor intermolecular binding force caused by excessive reaction is avoided, thereby improving the hardness and toughness of the formed brushed texture layer after curing and the bonding force with the base material. The prepolymer can be one of epoxy acrylate, polyurethane acrylate, and polyester acrylate. The active diluent is used to dilute the curing adhesive, adjust its viscosity, and enhance the adhesion to the base material, while the photoinitiator generates active components under ultraviolet irradiation, initiates a chain reaction, and cures and forms the curing adhesive. Among them, the curing adhesive, by weight, can include 80 parts of a prepolymer, 10 parts of an active diluent, and 2 parts of a photoinitiator, or 90 parts of a prepolymer, 20 parts of an active diluent, and 10 parts of a photoinitiator.

[0059] Step S14: Press and bond the transfer surface with the cured glue to one side of the substrate 11, and irradiate the cured glue with ultraviolet light for primary curing treatment.

[0060] Combined with the above content, by pressing and bonding the transfer surface to the substrate 11, the cured glue forms a concave-convex structure corresponding to the concave-convex structure of the wire drawing texture, so that the wire drawing texture is transferred to the cured glue, and then the cured glue is subjected to primary curing treatment, which can make the transferred cured glue harden to form a preliminary shape.

[0061] Among them, by rolling the side of the substrate 11 facing away from the cured glue, part of the cured glue on the transfer surface of the seed mold is bonded to the substrate 11 and defoamed, and the cured glue is irradiated with UV light by a curing lamp for curing treatment. The irradiation energy of the curing lamp is 50 mJ / cm2 to 60 mJ / cm2.

[0062] Step S15: After the primary curing treatment, separate the substrate 11 from the seed mold, and retain the cured glue on the surface of the substrate 11 to form a wire drawing texture layer 12.

[0063] Combined with the above content, after the primary curing treatment, the cured glue is partially hardened, so that the cured glue can be separated from the seed mold along with the substrate 11, the cured glue is transferred to the substrate 11, and the formed wire drawing texture is also transferred to the substrate 11.

[0064] After separating the substrate 11 from the seed mold, it also includes the step of secondary curing the cured glue on the substrate 11. The secondary curing strength is greater than the primary curing strength. Through secondary curing, the cured glue hardens on the surface of the substrate 11 to form a wire drawing texture layer 12 retained on the surface of the substrate 11.

[0065] Among them, during secondary curing, by placing the substrate 11 in a curing furnace and irradiating it with UV light by a curing lamp, the number of curing lamps during secondary curing is more than that during primary curing, and the irradiation energy is 800 mJ / cm2 to 900 mJ / cm2. Under this irradiation condition, the cured glue is completely hardened and adhered to the substrate, and hardly falls off, so that the cured glue is completely cured on the substrate 11 to form a wire drawing texture layer 12, and the thickness of the wire drawing texture layer 12 is 8 μm to 12 μm.

[0066] Through steps S11 to S15, the wire drawing texture formed on the seed mold is directly transferred to the substrate 11, so that a wire drawing texture layer 12 is formed on the substrate 11, thereby making the panel have a high-grade texture effect, so that there is no need to develop an injection mold for in-mold injection, reducing the processing procedures and development cycle, saving the injection mold cost, and reducing the production cost.

[0067] In this embodiment, the panel manufacturing method further includes the following steps:

[0068] Step S21: Coat the wire-drawing texture layer 12 of the substrate 11 to form a coating layer 13 of a specific color.

[0069] By setting the coating layer 13, the panel is brightened, and the front of the panel shows a specific color as required, improving the aesthetics of the panel.

[0070] In this embodiment, when coating the wire-drawing texture layer 12 of the substrate 11, the following steps are specifically included:

[0071] Clean the surface of the substrate wire-drawing texture layer.

[0072] By cleaning the wire-drawing texture layer 12 of the substrate 11, impurities on the wire-drawing texture layer can be removed to avoid affecting the coating effect.

[0073] Among them, during cleaning, the substrate 11 is placed in a coating device, and the surface of the wire-drawing texture layer 12 of the substrate 11 is subjected to plasma cleaning. Plasma cleaning can clean each depression in the wire-drawing texture layer 12, with better cleaning effect, and no chemical solvents are involved, which can avoid damaging the substrate 11.

[0074] During plasma cleaning, the inside of the continuous coating device can be first evacuated to an internal air pressure of 1*10-3 Pa to 5*10-3 Pa, then argon is introduced and the air pressure rises to 1*10-1 Pa to 3*10-1 Pa, and the discharge voltage is set to 1200 V to 1500 V. Thereby, a high-voltage alternating electric field is generated between the internal electrodes of the continuous coating device, enabling the acceleration of the free electron energy to excite the process gas molecules to form plasma. The plasma with high reactivity or high energy will react with organic pollutants and particulate pollutants and collide to form various volatile substances. These volatile substances are extracted by the vacuum pump along with the process gas flow, thereby achieving the purposes of cleaning and activating the surface of the object to be processed.

[0075] Magnetron coat the wire-drawing texture layer 12 of the substrate 11 with a silicon target and a niobium target in sequence, and adjust the thickness of the coating layer to form a coating layer 13 of a specific color.

[0076] Specifically, a silicon layer and a niobium pentoxide layer are magnetron sputtered on the surface of the wire-drawing texture layer 12 of the substrate 11 in sequence. Among them, the magnetron sputtering conditions for forming the silicon layer are: evacuate the inside of the coating device to a vacuum degree of 1*10-3 Pa to 3*10-3 Pa, introduce an inert gas and a silicon target with a purity of 99.99%, the flow rate of the inert gas is 700 to 900 sccm, and the sputtering power is 10 to 18 KW. Using a silicon layer as the base, the adhesion and boiling water resistance of the product are better.

[0077] After obtaining the silicon layer, magnetron sputtering is carried out using a niobium target in an atmosphere of inert gas and oxygen. The inert gas forms a plasma to excite the niobium target, which reacts with oxygen to form niobium pentoxide deposited on the surface of the silicon layer. The thickness of the coating layer 13 is controlled by controlling the oxygen flow rate and the coating time to obtain the coating layer 13 with a specific color required. Among them, the conditions for magnetron sputtering of the niobium pentoxide layer are as follows: the inside of the coating equipment is evacuated to a vacuum degree of 1*10-3pa to 3*10-3pa, and an inert gas and a niobium target with a purity of 99.99% are introduced. The flow rate of the inert gas is 700 to 900 sccm, the oxygen flow rate is 120 to 140 sccm, and the sputtering power is 10 to 18 KW. In this embodiment, the inert gas can be argon, and of course, it can also be others.

[0078] The coating layer 13 includes a silicon layer and a niobium pentoxide layer deposited thereon. The thickness of the coating layer 13 is 50nm to 80nm, the thickness of the silicon layer is 10nm to 20nm, and the thickness of the niobium pentoxide layer is 35nm to 70nm. The thickness of the coating layer 13 is controlled by controlling the thickness of the niobium pentoxide layer, so that the coating layer 13 with a specific color can be obtained. For example, the thickness of the coating layer 13 in the patina color system is 50nm to 80nm. When the thickness of the niobium pentoxide layer is controlled to increase so that the thickness of the coating layer 13 increases, the color of the coating layer 13 becomes more and more yellow.

[0079] Step S22: Print a light-blocking ink for preventing light from passing through on the coating layer 13 to form a protective layer 14.

[0080] Among them, by printing the light-blocking ink, it is ensured that the panel is opaque to avoid affecting the front effect of the panel. The formed protective layer 14 can protect the wire drawing texture layer 12 and the coating layer 13 from being damaged.

[0081] Specifically, when forming the protective layer 14, a primer layer 141, a base color layer 142 and an attachment layer 143 are sequentially printed on the coating layer 13, and the primer layer 141, the base color layer and the attachment layer 143 are stacked to form the protective layer 14.

[0082] Combined with the above content, when printing the primer layer 141, the first bright black base ink is printed on the coating layer 13, and pre-baked at a temperature of 68°C to 72°C for 27 minutes to 33 minutes;

[0083] When printing the base color layer 142, the second bright black base ink is printed on the primer layer 141, and pre-baked at a temperature of 68°C to 72°C for 27 minutes to 33 minutes;

[0084] When printing the attachment layer 143, the third dull black high-dyne value ink is printed on the color layer as the base color, and pre-baked at a temperature of 78°C to 82°C for 57 minutes to 63 minutes.

[0085] The film thicknesses of the primer layer 141, the base color agent, and the adhesion layer 143 are all between 6 μm and 8 μm, so that the film layer of the protective layer 14 is between 18 μm and 24 μm. By printing the protective layer 14, firstly, it can ensure that the panel will not transmit light and affect the front view; secondly, it can improve the bonding force between it and the coating layer 13 to meet the requirements of the reliability test; thirdly, it can protect the wire drawing texture layer 12 and the coating layer 13 from being directly damaged.

[0086] In this embodiment, when providing the master mold with a wire drawing texture on the surface in step S12, the following steps are further included:

[0087] S121: Obtain a metal plate, and form a wire drawing texture on the surface of the metal plate by mechanical wire drawing technology.

[0088] Among them, the metal plate can be a copper plate or an aluminum plate, etc. In this embodiment, the metal plate is preferably a copper plate. The wire drawing texture formed by mechanical wire drawing technology not only has natural and fine lines, but also can achieve a special appearance effect of imitating the metal wire drawing texture, improving the metallic texture of the panel. Among them, the mechanical wire drawing technology can include flat-pressing sand belt wire drawing, non-woven fabric roller brush wire drawing, wide sand belt wire drawing, centerless grinding wire drawing, etc. In this embodiment, the copper plate is fixed by a fixture, and the surface of the copper plate is subjected to circular mechanical wire drawing by attaching sandpaper to the copper plate with a lathe, and the wire drawing depth is 8 μm to 12 μm.

[0089] S122: Obtain a resin plate, press one side of the resin plate against the side of the metal plate with the wire drawing texture, so that a wire drawing texture is formed on the surface of the resin plate, then separate the resin plate and the metal plate, and the separated resin plate forms a master mold.

[0090] Combining the above content, after the wire drawing texture is formed on the surface of the metal plate, by pressing the resin plate against the side of the metal plate with the wire drawing texture, using the characteristics of the high surface hardness and arbitrary shaping of the resin plate, through pressing, a wire drawing texture corresponding to the wire drawing texture of the metal plate is formed on one side of the resin plate. Among them, the die pressing process can be used between the metal plate and the resin plate to copy the wire drawing texture on the metal plate to the resin plate.

[0091] Positioning marks are arranged on the resin plate outside the wire drawing texture. Through the positioning marks, the orientation of the area where the wire drawing texture is located on the resin plate can be confirmed, and the positioning marks are correspondingly formed outside the wire drawing texture layer 12 of the substrate 11.

[0092] Combining the above content, by setting positioning marks outside the wire drawing texture and corresponding transferring the positioning marks to the substrate 11, it is convenient to position the wire drawing texture area subsequently, so as to cut out the part with the wire drawing texture on the substrate 11 to form a specific panel shape. For example, in this embodiment, four positioning marks can be set around the center of the annular wire drawing texture, and the center point of the rectangle formed by the continuous four positioning marks is the center of the annular wire drawing texture, so that the center of the annular wire drawing texture can be positioned through the four positioning marks subsequently.

[0093] Among them, in this embodiment, the above-mentioned positioning marks are formed on the resin plate by using the exposure and development process. Specifically, positioning points are pre-set on the resin plate outside the wire drawing texture area, curing glue is coated at the positioning points, the area excluding the marking points is covered by black ink, and then through the exposure process, the curing glue at the positioning points is cured, while the area excluding the marking points is washed away by the developer, leaving the cured glue at the marking points, thereby forming the positioning marks. The positioning marks can be formed with a matte touch to facilitate subsequent capturing and identifying the positioning marks.

[0094] The resin plate with positioning marks is used as a master mold to reproduce multiple sub-molds, and the sub-molds form a seed mold. Thus, in the production process, multiple sub-molds are used for mass production of products. The sub-molds and the master mold have the same wire drawing texture. The master mold serves as a mold embryo. After the sub-molds are consumed, the sub-molds are continuously reproduced from the master mold.

[0095] In this embodiment, after forming the protective layer 14, the following steps are further included:

[0096] S23. Use the positioning marks to position the orientation of the wire drawing texture layer 12 on the substrate 11, and cut the substrate 11 by a numerical control machine tool to form a panel with the wire drawing texture layer 12.

[0097] Combining the above content, after identifying the orientation of the area where the wire drawing texture layer 12 is located through the positioning marks, the position area of the wire drawing texture layer 12 can be positioned, and a panel only containing the wire drawing texture layer 12 can be cut from the substrate 11 to obtain a panel with a specific shape.

[0098] Specifically, an image recognition device is used to identify the position of the positioning marks on the substrate 11. After that, a positioning hole is drilled at this position, and the numerical control machine tool positions the substrate 11 according to the positioning hole to cut and form a panel with a corresponding shape.

[0099] Combining the above content, a positioning identifier is recognized by an image recognition device such as a CCD (Charge Coupled Device) camera, and drilling is performed on the recognized position to provide support for subsequent cutting of the panel by a numerical control machine tool. For example, in this embodiment, the side where the base material 11 and the protective layer 14 are located is fixed by vacuum adsorption. The numerical control machine tool cuts the edge of the wire drawing texture on the base material 11 to obtain a panel with a wire drawing texture.

[0100] See Figure 4 , in the second aspect of the present application, a panel is further provided. The panel is made by the above manufacturing method and includes a base material 11 and a wire drawing texture layer 12 formed on the base material 11.

[0101] Furthermore, a coating layer 13 and a protective layer 14 are sequentially formed on the wire drawing texture layer 12 of the base material 11. The coating layer 13 can brighten the panel and make the front of the panel show a specific color as required, improving the aesthetics of the panel. The coating layer 13 includes a silicon layer and a niobium pentoxide layer deposited thereon. The thickness of the coating layer 13 is 50 nm to 80 nm, the thickness of the silicon layer is 10 nm to 20 nm, and the thickness of the niobium pentoxide layer is 35 nm to 70 nm. The protective layer 14 can ensure that the panel is light-tight, avoid affecting the front effect of the panel, and can protect the wire drawing texture layer 12 and the coating layer 13 from being damaged. The protective layer includes a primer layer 141, a base color layer 142, and an attachment layer 143 sequentially printed on the coating layer. This panel can be used as a decorative part, such as a decorative panel.

[0102] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0103] In this application, unless otherwise clearly specified and defined, terms such as "assembly" and "connection" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. In the description of this specification, the description with reference to terms such as "some embodiments" and "exemplarily" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0104] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and the description of this application shall fall within the scope covered by the patent of this application.

Claims

1. A manufacturing method of a panel, characterized in that, it includes the following steps: Providing a substrate; Providing a master mold with a brushed texture on its surface, and the surface of the master mold with the brushed texture is defined as the transfer surface; Forming a curable glue on the transfer surface of the master mold, and the curable glue, by weight, includes 80-90 parts of prepolymer, 10-20 parts of active diluent and 2-10 parts of photoinitiator; Pressing and fitting the transfer surface with the curable glue formed thereon against one side of the substrate, and irradiating the curable glue with ultraviolet light for primary curing treatment; After the primary curing treatment, separating the substrate from the master mold, and retaining the curable glue on the surface of the substrate to form a brushed texture layer.

2. The manufacturing method of the panel according to claim 1, characterized in that, providing a master mold with a brushed texture on its surface includes the following steps: Obtaining a metal plate, and forming a brushed texture on the surface of the metal plate by mechanical brushing technology; Obtaining a resin plate, pressing one side of the resin plate against the side of the metal plate with the brushed texture formed thereon, so that the brushed texture is formed on the surface of the resin plate, and then separating the resin plate and the metal plate, and the separated resin plate forms the master mold.

3. The manufacturing method of the panel according to claim 2, characterized in that, after separating the resin plate and the metal plate, it further includes the following steps: Setting positioning marks on the resin plate outside the brushed texture, and the orientation of the area where the brushed texture is located on the resin plate can be confirmed through the positioning marks; The positioning marks are correspondingly formed outside the brushed texture layer of the substrate.

4. The manufacturing method of the panel according to claim 1, characterized in that, after forming the brushed texture layer on the substrate, it further includes the following steps: Coating the brushed texture layer of the substrate to form a coating layer of a specific color, specifically including the following steps: Cleaning the surface of the substrate where the brushed texture layer is located; Successively performing magnetron sputtering on the brushed texture layer of the substrate using a silicon target and a niobium target, and forming a coating layer of a specific color by adjusting the coating thickness.

5. The manufacturing method of the panel according to claim 4, characterized in that, after forming the coating layer, it further includes the following steps: Printing light-blocking ink for preventing light from passing through on the coating layer, and forming a protective layer.

6. The manufacturing method of the panel according to claim 5, characterized in that, after forming the protective layer on the substrate, it further includes the following steps: Using the positioning marks to position the orientation of the brushed texture layer on the substrate, and cutting the substrate by a numerical control machine tool to form a panel with a brushed texture layer.

7. The manufacturing method of the panel according to claim 6, characterized in that, Using an image recognition device to identify the position of the positioning marks on the substrate, and then, drilling a positioning hole at this position, and the numerical control machine tool positions the substrate according to the positioning hole to cut and form a panel with a corresponding shape.

8. The manufacturing method of the panel according to claim 3, characterized in that, The positioning marks are formed on the resin plate by using an exposure and development process. Multiple sub-molds are replicated from the resin plate with the positioning marks as a master mold, and the sub-molds constitute the seed mold.

9. The method for manufacturing a panel according to claim 1, wherein, after separating the substrate and the seed mold, the following steps are further included: performing secondary curing on the cured glue on the substrate, and the strength of the secondary curing is greater than that of the primary curing, so that the cured glue hardens on the surface of the substrate.

10. A panel, wherein, it is manufactured by using the manufacturing method according to any one of claims 1 to 9, and the panel includes a substrate and a wire drawing texture layer, a coating layer and a protective layer sequentially formed on the substrate.

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